Grinding method

By adjusting the relative tilt of the chuck table and the grinding wheel, the wafer is ground in stages, which solves the problem of large surface roughness differences between the central and outer peripheral parts, and improves the uniformity and mechanical strength of the wafer.

CN115194581BActive Publication Date: 2026-08-04DISCO CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
DISCO CORP
Filing Date
2022-03-24
Publication Date
2026-08-04

AI Technical Summary

Technical Problem

In existing grinding methods, the surface roughness difference between the central part and the outer periphery of the wafer is large, which affects the mechanical strength of the device chip.

Method used

The plunge grinding method is adopted. By adjusting the relative inclination of the chuck table and the grinding wheel, the workpiece is ground in steps. First, the central part is thinned, and then the outer periphery is ground in different states to reduce the surface roughness difference.

Benefits of technology

It effectively reduces the surface roughness difference between the central and peripheral parts of the wafer, thereby improving the mechanical strength of the device chip.

✦ Generated by Eureka AI based on patent content.

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Abstract

Provided is a grinding method capable of reducing the difference between the surface roughness of the central portion and the surface roughness of the peripheral portion of a plate-shaped workpiece, as compared with conventional grinding methods. The grinding method includes a first grinding step of bringing a grinding tool into contact with a workpiece to grind the workpiece after adjusting the inclination of the relative positions of a chuck table and a grinding wheel to a first state, and a second grinding step of bringing the grinding tool into contact with the workpiece to grind the workpiece after adjusting the inclination of the relative positions of the chuck table and the grinding wheel to a second state different from the first state. In the second grinding step, the workpiece is ground under conditions capable of reducing the surface roughness, as compared with the first grinding step.
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