Wafer dicing device

Abstract

The wafer cutting device disclosed by the application comprises a rotary cutting component and a film pasting platform, the rotary cutting component comprises a rotary cutting seat fixed on a multifunctional manipulator, a rotary driving motor is fixed on the rotary cutting seat, a rotary arm is connected at an output shaft of the rotary driving motor, and a ring cutter assembly is arranged at one end of the rotary arm; a ring cutting groove corresponding to the ring cutter in the ring cutter assembly is arranged on the film pasting platform, the ring cutter can enter the ring cutting groove when cutting, the film pasting platform will not hinder the ring cutter, the BG film is cut in a hot cutting mode, and wrinkles of the BG film can be avoided due to rotation of the cutter.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer film pasting, in particular to a wafer cutting device. BACKGROUND

[0002] With the progress of science and technology, intelligent wear, smart phones and tablet computers develop towards high speed and large capacity in storage, and develop towards thinness in volume. The development direction of science and technology requires flash memory and memory controller to be thin and continuously improved. The wafer area tends to be larger and the thickness tends to be thinner, so that the cracking problem in processing and cutting of very thin wafers in the conventional process is more challenging.

[0003] To adapt to the light weight requirement of the chip, a cutting and then thinning processing method is used in the processing process. The specific operation is as follows: first, the wafer is forwardly and invisibly cut to a suitable depth, and then the wafer is pasted with a BG film on the front surface. The BG film can effectively protect the chips on the wafer surface from damage and prevent the chips from being affected by impurities during the thinning process.

[0004] The silicon carbide wafer has high hardness and cannot be cracked by expanding the film. The wafer needs to be broken along the wafer cutting path one by one by a suitable device. The chip surface is sensitive to debris, and a layer of BG film is pasted on the wafer surface during the wafer breaking process to prevent the splitting knife of the wafer breaking mechanism from directly contacting the wafer surface and to prevent the debris generated during the splitting process from polluting the chip. After the BG film is pasted on the wafer, the BG film needs to be cut to the size of the wafer. During the ring cutting, the rotation of the cutter will cause wrinkles on the surface of the BG film. SUMMARY

[0005] To solve the problem of wrinkles on the BG film caused by the rotation of the cutter during the cutting of the wafer protective film, the present application provides a wafer cutting device.

[0006] The specific scheme is as follows:

[0007] A wafer cutting device, comprising a rotary cutting component and a film pasting platform, the rotary cutting component comprising a rotary cutting seat fixed on a multifunctional mechanical hand, a rotary driving motor fixed on the rotary cutting seat, a rotary arm connected to the output shaft of the rotary driving motor, and a ring cutting knife assembly arranged at one end of the rotary arm; the film pasting platform is provided with a ring cutting groove corresponding to the ring cutting knife in the ring cutting knife assembly.

[0008] The ring cutting knife assembly comprises a U-shaped cutting knife seat arranged at the end of the rotary arm, a knife seat arranged at the U-shaped opening, and a heating device arranged on the knife seat to heat the ring cutting knife fixed on the knife seat.

[0009] Along the length direction of the rotating arm, the heating device comprises a heat insulation plate fixed on the cutter holder, an electric heating plate and a PTC heater, and the ring cutter is fixed between the heat conducting plate and the PTC heater; the electric heating plate is heated by an electric wire.

[0010] The electric wire is provided with a resistance in series.

[0011] The resistance is Pt100.

[0012] The PTC heater is fixed on the heat conducting plate by a fixing bolt and clamps the ring cutter.

[0013] The width of the ring cutting groove is 5mm.

[0014] The depth of the ring cutting groove is 0.2mm.

[0015] The material of the film sticking platform is ceramic.

[0016] The inner diameter of the ring cutting groove is 2mm smaller than the outer diameter of the wafer.

[0017] The wafer cutting device disclosed in the present application can make the ring cutter enter the ring cutting groove when cutting, the film sticking platform does not hinder the ring cutter, the BG film is cut by the hot cutting method, and the wrinkles of the BG film caused by the rotation of the cutter can be avoided. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of a full-automatic wafer film coating machine;

[0019] Figure 2 It is a structural schematic diagram of a mold assembly;

[0020] Figure 3 It is a structural schematic diagram of an angle fixing assembly Figure 1 ;

[0021] Figure 4 It is a structural schematic diagram of an angle fixing assembly Figure 1 ;

[0022] Figure 5 It is a structural schematic diagram of a wafer transfer device;

[0023] Figure 6 It is a structural schematic diagram of a wafer receiving mechanism;

[0024] Figure 7 It is a working state schematic diagram of a rotary cutting part;

[0025] Figure 8 It is a structural schematic diagram of a rotary cutting part Figure 1 ;

[0026] Figure 9Structure diagram of rotary cutting component Figure 2 ;

[0027] Figure 10 Structure diagram of rotary cutting component Figure 1 ;

[0028] Figure 11 Structure diagram of rotary cutting component Figure 2 ;

[0029] Figure 12 Structure diagram of rotary cutting component

[0030] Figure 13 Process diagram of rotary cutting component

[0031] In the figure: machine frame 1, vertical plate 11, film pasting platform 2, rotary cutting groove 21, mold assembly 3, mold servo moving assembly 31, mold bracket 32, mold roller 33, mold cylinder 34, mold carrier 35, fixed angle assembly 4, fixed angle linear motor 41, fixed angle roller 42, rotary cutting component 5, rotary cutting knife assembly 51, cutting knife seat 511, heating device 512, knife seat 5121, heat insulation plate 5122, electric heating plate 5123, PTC heater 5124, tension spring 513, angle adjusting bolt 514, rotary cutting knife 515, balance assembly 52, balance support 521, balance spring 522, roller support 523, roller 524, long bolt 525, rotary cutting seat 53, rotary drive motor 54, rotary arm 55, wafer receiving mechanism 6, lifting column 61, lifting plate 62, lifting cylinder 63, multifunctional manipulator 7, transfer manipulator 71, suction part 711, material bin 8, wafer 9, BG film 10. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0033] As Figures 1-13As shown, a full-automatic wafer film laminating machine is disclosed, comprising a machine rack 1 with a longitudinal plate 11 arranged on the upper surface, a wafer film laminating system, a multifunctional robot system with a multifunctional mechanical hand 7 and a stock bin 8, the wafer film laminating system comprising a film laminating platform 2 arranged on the machine rack 1, a mold assembly 3 located above the film laminating platform 2 and a fixed angle assembly 4 arranged on the longitudinal plate 11, the fixed angle assembly 4 ensures that the angle between the BG film 10 between the film laminating roller 33 and the fixed angle roller 42 and the horizontal plane of the film laminating platform 2 does not change when the film laminating is performed; the multifunctional mechanical hand 7 is provided with a ring cutter assembly 51 for hot cutting the BG film 10. Through the cooperation between the mold assembly 3 and the fixed angle assembly 4, the BG film 10 is controlled to be in a flat state before film laminating, and the angle between the BG film 10 between the film laminating roller 33 and the fixed angle roller 42 and the film laminating platform 2 is kept unchanged, the film laminating roller 33 can exhaust the air below the BG film 10 to avoid wrinkles; the ring cutter assembly 51 for hot cutting is used when cutting the BG film 10, which can cut the BG film 10 by using the heated ring cutter 515 to avoid wrinkles caused by the blade during the cutting process.

[0034] The mold assembly 3 comprises a mold servo moving module 31, the mold servo moving module 41 is slidably connected with a mold support 32, the mold support 32 is rotatably provided with a height-adjustable film laminating roller 33, when the film laminating roller 33 moves downward and contacts the BG film 10, the mold support 32 is controlled to move in the direction of the BG film 10 running by the mold servo moving module 31 for film laminating, the film laminating roller 33 can keep synchronous movement between the fixed angle roller 42 and the film laminating roller 33 during film laminating to keep the angle between the BG film 10 between the film laminating roller 33 and the fixed angle roller 42 and the film laminating platform 2 unchanged, the film laminating roller 33 can move back and forth by the fixed angle linear motor control, and the film laminating roller 33 is rotatably arranged on the outer extension plate provided on the mold support 32, the length direction of the outer extension plate is consistent with the running direction of the film strip, and the film laminating roller 33 is rotatably arranged on the outer extension plate.

[0035] In order to keep the angle between the BG film 10 between the film laminating roller 33 and the fixed angle roller 42 and the film laminating platform 2 unchanged, the running direction of the fixed angle roller 42 can be perpendicular to the direction of the film laminating platform 2, and the fixed angle roller 42 is rotatably arranged on the fixed angle linear motor 41.

[0036] In order to ensure that the BG film 10 is uniformly stressed when the film laminating roller 33 performs film laminating on the BG film 10, the mold support 32 is provided as a door frame, and the film laminating platform 2 is located inside the door frame; the mold support 32 is provided with a mold cylinder 34 on both sides of the top of the door frame, the telescopic rod of the mold cylinder 34 penetrates through the top of the door frame, and a mold bracket 35 is connected to the end of the telescopic rod of the mold cylinder 34, and the film laminating roller 33 is rotatably connected to the mold bracket 35.

[0037] The multifunctional manipulator 7 is provided with a rotary cutting component 5, which comprises a rotary cutting seat 53 fixed on the multifunctional manipulator 7, a rotary driving motor 54 fixed on the rotary cutting seat 53, a rotary arm 55 connected to an output shaft of the rotary driving motor 54, a ring cutting knife assembly 51 provided at one end of the rotary arm 55, and a balancing assembly 52 provided at the other end of the rotary arm 55. When the ring cutting knife assembly 51 is used for cutting, a ring cutting groove 21 is arranged on a corresponding work surface. The work surface refers to the film pasting platform 2. The film pasting platform 2 is provided with an adsorption area, a negative pressure cavity is arranged in the adsorption area, a negative pressure source is arranged in the negative pressure cavity, and the negative pressure source generates negative pressure to adsorb the wafer 9 through the negative pressure hole of the adsorption area. The wafer 9 to be pasted is placed in the ring cutting groove 21, and the negative pressure source can adsorb the wafer 9 through the negative pressure hole, so as to avoid the position deviation of the wafer 9 during cutting. The width of the ring cutting groove 21 is 5 mm, the depth of the ring cutting groove 21 is 0.2 mm, the material of the film pasting platform 2 is ceramic, and the inner diameter of the ring cutting groove 21 is 2 mm smaller than the outer diameter of the wafer 9.

[0038] The ring cutting knife assembly 51 comprises a U-shaped cutting knife seat 511 arranged at the end of the rotary arm 55, a ring cutting knife 515 arranged at the U-shaped opening, and a heating device 512 arranged adjacent to the ring cutting knife 515 and used for heating the ring cutting knife 515. The heating device 512 comprises a knife seat 5121 arranged at the U-shaped opening, a heat insulation plate 5122, an electric heating plate 5123, and a PTC heater 5124 fixed in sequence outside the knife seat 5121 along the length direction of the rotary arm 55, and the ring cutting knife 515 is fixed between the electric heating plate 5123 and the PTC heater 5124. The electric heating plate 5123 is heated by an electric wire.

[0039] In order to protect the circuit, a resistance is connected in series on the electric wire, and the type of the resistance used is Pt1000. The heating device 512 can heat the ring cutting knife 515, and the heated ring cutting knife 515 is used for cutting the BG film 10, so as to avoid the wrinkles of the BG film 10 caused by the blade during cutting.

[0040] The knife seat 5121 is rotationally connected to the cutting knife seat 511. The ring cutting knife assembly 51 further comprises an angle adjusting mechanism and a reset mechanism. The angle adjusting mechanism enables the rotation of the ring cutting knife assembly 51 relative to the rotary arm 55, and the reset mechanism enables the fixation of the ring cutting knife assembly 51 after rotation. The angle adjusting mechanism comprises a protrusion arranged at the bottom of the cutting knife seat 511 and an angle adjusting bolt 514 threadedly connected in the protrusion. The movement of the end of the angle adjusting bolt 514 adjusts the angle of the ring cutting knife 515.

[0041] The reset mechanism is a tension spring 513, and the two ends of the tension spring 513 are connected with the bottom of the cutting knife seat 511 and the knife seat 5121 respectively. The two ends of the tension spring are connected with the bottom of the cutting knife seat and the knife seat respectively, and the connecting point of the tension spring and the knife seat 5121 is located on the same side of the hinge point between the ring cutting knife assembly 51 and the cutting knife seat 511.

[0042] The reset mechanism is a compression spring, and the two ends of the compression spring are connected with the bottom of the cutting knife seat 511 and the knife seat 5121 respectively. The connecting point of the compression spring and the knife seat 5121 is located on the different side of the hinge point between the ring cutting knife assembly 51 and the cutting knife seat 511.

[0043] The end of the angle adjusting bolt 514 is provided with a spherical nut, which can protect the knife seat 5121. The angle adjusting mechanism and the reset mechanism can adjust the angle of the ring cutting knife 515 and protect the cutting head of the ring cutting knife 515.

[0044] The rotating arm 55 is provided with an oblong hole, and the length direction of the oblong hole is consistent with the length direction of the rotating arm 55. The balancing assembly 52 is fixed in the oblong hole through positioning bolts and ensures the balance during ring cutting by adjusting the distance between the positioning bolts and the rotating center line. The balancing assembly 52 includes a balancing support 521, the balancing support 521 is connected with a roller support 523 through a balancing spring 522, and the roller support 523 is provided with a roller 524 which rotates thereon. The balancing support 523 is provided with a long bolt, and the end of the long bolt abuts against the roller support 523. The maximum distance of the upward movement of the roller support 523 can be limited, so as to avoid damaging the overall balance of the rotating cutting part 5.

[0045] The multifunctional manipulator 7 is provided with a transfer manipulator 71, and the wafer receiving mechanism 6 is arranged on the film pasting platform 2 and used for receiving the wafer 9 transported by the multifunctional manipulator 7. The wafer receiving mechanism 6 includes at least three lifting columns 61 and the film pasting platform 2,

[0046] The film pasting platform 2 is entirely an adsorption area, and a negative pressure cavity is arranged in the adsorption area. A negative pressure source is arranged in the negative pressure cavity, and the negative pressure source generates negative pressure to adsorb the wafer 9 through the negative pressure holes arranged in the adsorption area. The lifting column 61 and the film pasting platform 2 are in sealing sliding connection.

[0047] The middle region of the adsorption area where the lifting column 61 is located does not have an adsorption function, and the lifting column 61 and the film pasting platform 2 are not in sliding connection. The lifting column 61 is preferably four in number.

[0048] The bottom of the lifting column 2 is connected with a lifting plate 62, and the lifting plate 62 is lifted by a lifting cylinder 63. The suction part 711 of the transfer manipulator 71 is in a U shape, and the lifting column 61 will not limit the suction part. The transfer manipulator 71, the lifting column 61 and the film pasting platform 2 constitute a wafer transfer device. The transfer manipulator 71 is provided with a negative pressure adsorption mechanism for adsorbing the wafer 9. The negative pressure adsorption mechanism comprises a suction part with a cavity inside. The negative pressure is generated by a negative pressure source inside the suction part, and the wafer 9 is adsorbed through the small holes on the surface of the suction part. The suction part 711 can be in a U shape, and the lifting column 61 will not limit the suction part. The suction part 711 can also be a suction cup.

[0049] The wafer 9 is sucked from the stock bin by the suction part 711 under the action of negative pressure, and is transported to above the lifting column 62 under the action of the multifunctional manipulator. After the lifting column 62 is lifted, the wafer 9 is placed on the lifting column 62. Then, under the action of the lifting cylinder 63, the wafer 9 is placed on the film pasting platform 2, and the wafer 9 is adsorbed by negative pressure. After the film pasting is completed, the lifting column 62 is lifted under the action of the lifting cylinder 63, the wafer 9 is picked up by the transfer manipulator 71, and is placed back into the stock bin. The wafer transfer device can avoid damaging the wafer 9 during the transfer process.

[0050] A wafer film pasting method, comprising the following steps:

[0051] Step one: the wafer 9 in the stock bin 8 is taken out by the transfer manipulator 71 in the multifunctional manipulator 7, and the wafer 9 is placed on the film pasting platform 2 under the action of the wafer receiving mechanism 6. The film pasting platform 2 adsorbs the wafer 9.

[0052] Step two: the BG film 10 is transported to above the wafer 9 by the composite film pasting system, and the BG film 10 is pasted on the surface of the wafer 9 under the action of the mold assembly 31.

[0053] Step three: the position of the wafer 9 is positioned by the visual positioning device in the multifunctional manipulator 7, and the BG film 10 is cut by the rotary cutting part 5.

[0054] Step four: after the BG film 10 is cut, the wafer 9 after film pasting is transferred to the transfer manipulator 71 by the wafer receiving mechanism 6, and then the wafer 9 after film pasting is transferred to the stock bin 8.

[0055] Step five: the cut BG film 10 is recycled by the excess material recycling system.

[0056] In step one, the wafer receiving mechanism 6 receives the wafer 9, which comprises receiving the wafer 9 by the lifting column 61 capable of lifting. After receiving the wafer 9, the lifting column 61 can be lowered below the film pasting platform, and the wafer 9 is adsorbed by the negative pressure generated on the film pasting platform 2.

[0057] In step two, the composite film placing system transports the composite film from the film placing driven roller system to the film placing platform through the film placing air expansion shaft. Before entering the film placing platform 2, the composite film is divided into a protective film and a BG film 10. The protective film is recycled through the protective film collecting system. The BG film 10 is transported to above the film placing platform.

[0058] The end of the film placing air expansion shaft is fixed with a film placing electromagnetic brake. The film placing electromagnetic brake is electrically connected with the tension control roller. The tension control roller detects the tension of the film strip and feeds back to the film placing electromagnetic brake to keep the composite film always tensioned. The film placing buffer roller is arranged between the film placing driven roller system. The film placing buffer roller contacts the composite film through its own gravity.

[0059] In step two, the mold pressing assembly 3 cooperates with the fixed angle assembly 4 when the BG film 10 is attached to the wafer 9. The mold pressing roller 33 in the mold pressing assembly 3 can move along the running direction of the mold under the action of the mold pressing moving servo module 31 when the BG film 10 is close to the film placing platform 2. The position of the fixed angle roller 42 in the fixed angle assembly 4 also changes. The angle between the BG film 10 between the mold pressing roller 33 and the fixed angle roller 42 and the horizontal plane of the film placing platform 2 does not change.

[0060] In step three, the rotary cutting part 5 includes a rotary cutting seat 53 fixed on the multifunctional manipulator 7. A rotary drive motor 54 is fixed on the rotary cutting seat 3. The output shaft of the rotary drive motor 54 is connected with a rotary arm 55. The rotary arm 55 is provided with a ring cutting knife assembly 51 at one end and a balance assembly 52 at the other end. The ring cutting knife assembly 51 needs to be provided with a ring cutting groove on the corresponding working surface when cutting.

[0061] The excess material collecting system includes an excess material collecting air expansion shaft, an excess material collecting drive roller, an excess material collecting roller system, and an excess material collecting buffer roller. The cut BG film 10 is transported to the excess material collecting buffer roller by the material collecting roller system,

[0062] The end of the excess material collecting air expansion shaft is fixed with an excess material collecting electromagnetic brake. The excess material collecting electromagnetic brake is electrically connected with the excess material collecting tension control roller. The excess material collecting tension control roller detects the tension of the film strip and feeds back to the excess material collecting electromagnetic brake to keep the cut BG film 10 always tensioned. The excess material collecting buffer roller is arranged between the excess material collecting driven roller system. The excess material collecting buffer roller contacts the cut BG film 10 through its own gravity.

[0063] In step five, the cut BG film 10 passes through the gap between the two lock plates of the locking device, and then is recycled by the excess material system. The cut BG film 10 is fixed by controlling the opening and closing of the two lock plates. Specifically, the lower lock plate is fixed on the vertical plate 11. The upper lock plate controls the lifting of the upper lock plate through the locking cylinder, thereby controlling the closing of the two lock plates.

[0064] Through the cooperation between the pressing die assembly 3 and the fixed angle assembly 4, the BG film 10 is controlled to be in a flat state before being pasted, and the angle between the BG film 10 and the pasting platform between the pressing die roller 33 and the fixed angle roller 42 is kept unchanged, the pressing die roller 33 can exhaust the air below the BG film 10 to avoid wrinkles; the hot cutting ring cutter assembly 51 is used when cutting the BG film 10, the heated blade can be used to cut the BG film 10 to avoid wrinkles caused by the ring cutter 515 in the cutting process. The cooperation between the lifting column 61 and the transfer manipulator 71 can avoid damage to the wafer 9 during transfer. The cooperation between the ring cutter assembly 51 and the balancing assembly 52 can make the ring cutter 515 in a balanced position during the cutting process. The cooperation between the tension spring 513 and the angle adjusting bolt 514 can adjust the angle of the ring cutter 515, which can avoid damage to the cutting head of the ring cutter 515 during cutting.

[0065] The technical means disclosed in the scheme of the present application is not limited to the technical means disclosed in the above-mentioned embodiments, but also includes the technical solutions composed of any combination of the above technical features. It should be pointed out that for ordinary skilled in the art, without departing from the principles of the present application, a number of improvements and refinements can be made, which are also considered to be within the protection scope of the present application.

Claims

1. A wafer dicing apparatus characterized by comprising: The application relates to a rotary cutting component and a film pasting platform, wherein the rotary cutting component comprises a rotary cutting seat fixed on a multifunctional manipulator, a rotary driving motor fixed on the rotary cutting seat, a rotary arm connected with the output shaft of the rotary driving motor, and a ring cutting knife assembly arranged at one end of the rotary arm; the film pasting platform is provided with a ring cutting groove corresponding to the ring cutting knife in the ring cutting knife assembly; the ring cutting knife assembly further comprises an angle adjusting mechanism and a reset mechanism; the angle adjusting mechanism enables the ring cutting knife assembly to rotate relative to the rotary arm, and the reset mechanism fixes the ring cutting knife assembly after rotation; the angle adjusting mechanism comprises a protrusion arranged at the bottom of the cutting knife seat and an angle adjusting screw threadedly connected in the protrusion; the end of the angle adjusting screw is connected with a movement adjusting ring for adjusting the angle of the ring cutting knife; the reset mechanism is a tension spring, the two ends of the tension spring are respectively connected with the bottom of the cutting knife seat and the knife seat, and the connecting point of the tension spring and the knife seat is located on the same side of the hinge joint point between the ring cutting knife assembly and the cutting knife seat; or the reset mechanism is a compression spring, the two ends of the compression spring are respectively connected with the bottom of the cutting knife seat and the knife seat, and the connecting point of the compression spring and the knife seat is located on the different side of the hinge joint point between the ring cutting knife assembly and the cutting knife seat; a balance assembly is arranged at the other end of the rotary arm; a long circular hole is arranged on the rotary arm, the length direction of the long circular hole is consistent with the length direction of the rotary arm, the balance assembly is fixed in the long circular hole through positioning screws, and the distance between the positioning screws and the rotary center line is adjusted to ensure the balance during ring cutting. The ring cutting knife assembly comprises a U-shaped cutting knife seat arranged at the end of the rotary arm, a knife seat arranged at the U-shaped opening, and a heating device arranged on the knife seat, wherein the heating device heats the ring cutting knife fixed on the knife seat. In the length direction of the rotary arm, the heating device comprises a heat insulation plate fixed on the knife seat, an electric heating plate and a PTC heater, and the ring cutting knife is fixed between the heat insulation plate and the PTC heater; the electric heating plate is heated through an electric wire; the PTC heater is fixed on the heat insulation plate through a fixing screw and clamps the ring cutting knife; the width of the ring cutting groove is 5 mm; and the depth of the ring cutting groove is 0.2 mm.

2. The wafer dicing apparatus according to claim 1, wherein The electric wire is provided with a resistance in series.

3. The wafer dicing apparatus according to claim 2, wherein The model of the resistance is Pt100.

4. The wafer dicing apparatus according to claim 1, wherein The material of the film pasting platform is ceramic.

5. The wafer dicing apparatus according to claim 1, wherein The inner diameter of the ring cutting groove is 2 mm smaller than the outer diameter of the wafer.

Images