Substrate processing apparatus and substrate processing method
By using light-suppressing and light-shielding components in the substrate processing apparatus to optimize the light intensity and irradiation area of vacuum ultraviolet light, the problem of uneven photosensitivity of EUV lithography resist materials is solved, thereby improving the exposure effect and the surface quality of the resist pattern.
CN115202154BActive Publication Date: 2026-05-26TOKYO ELECTRON LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- TOKYO ELECTRON LTD
- Filing Date
- 2022-03-25
- Publication Date
- 2026-05-26
AI Technical Summary
Technical Problem
In existing technologies, the resist material in EUV lithography has insufficient in-plane uniformity of photosensitivity on the substrate, which affects the exposure effect.
Method used
The amount of vacuum ultraviolet light is adjusted by using a light suppression component, so that it is suppressed into a weak light on the substrate surface as a whole. The irradiation area of the light is optimized by rotating support and light shielding component to form a light intensity gradient and ensure uniform light distribution.
Benefits of technology
This method achieves in-plane photosensitivity uniformity of EUV lithography resist material on the substrate, improves exposure effect and surface roughness of resist pattern, and enhances pattern formation quality.
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Smart Images
Figure CN115202154B_ABST
Abstract
This disclosure relates to a substrate processing apparatus and a substrate processing method that makes the photosensitivity of a substrate using a resist material suitable for EUV lithography uniform in its surface during exposure. The substrate processing apparatus (1) includes: a light source (42) that irradiates a substrate having a resist film formed using an EUV lithography resist material onto the substrate before exposure processing; and a perforated plate (52) as a light intensity suppression member, which is disposed in the light path of the light from the light source for suppressing the light intensity reaching the substrate surface to a weak light intensity in the irradiation area as a whole, wherein the light including the vacuum ultraviolet light includes continuous spectral components of at least a portion of the wavelength bands contained in the wavelength range of 10 nm to 200 nm.
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