A superconducting quantum chip connection structure and connection method
By using a combined connection structure of aluminum coaxial cable and current conversion part, the problems of channel loss and bonded connection interface energy loss in superconducting quantum chip connection are solved, and efficient quantum state transmission is achieved.
CN115204402BActive Publication Date: 2025-04-11SHENZHEN INT QUANTUM ACAD
Patent Information
- Application Number
- CN202210723073.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-06-24
- Publication Date
- 2025-04-11
- Estimated Expiration
- 2042-06-24
Smart Images
Figure CN115204402B_ABST
Abstract
The present invention relates to a superconducting quantum chip connection structure, which is used for connecting superconducting quantum chips, wherein the superconducting quantum chip includes a quantum substrate and a quantum circuit, and the connection structure includes: a connection part, which is used to connect the superconducting quantum chip; a current conversion part, which is arranged on the quantum substrate, and is used to bond the quantum circuit and the connection part, so that the standing wave current of the standing wave mode used for communication at the bonding interface is close to zero. The present invention can not only greatly reduce the channel loss and realize a relatively strong coupling, but also significantly reduce the energy loss at the bonding connection interface, thereby reducing the impact on the quantum state transmission efficiency.
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Citation Information
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