Electronic device

Abstract

An electronic device is provided. The electronic device includes a support plate, a plurality of circuit boards, gaps, and a molding material layer. The plurality of circuit boards are disposed on the support plate. Each of the circuit boards includes a substrate and a plurality of semiconductor elements. The plurality of semiconductor elements are disposed on the substrate. The gaps are disposed between adjacent two of the circuit boards. The molding material layer is disposed on the support plate and covers the plurality of circuit boards and the gaps. The electronic device of the embodiments of the present disclosure can improve the uniformity of the product appearance or the uniformity of the display picture.

Description

Technical Field

[0001] This disclosure relates to an electronic device, and more particularly to an electronic device that can improve the uniformity of the appearance of a product. Background Technology

[0002] Electronic devices, or spliced ​​electronic devices, are widely used in mobile phones, televisions, monitors, tablets, automotive displays, wearable devices, and desktop computers. With the rapid development of electronic devices, the quality requirements for them are becoming increasingly stringent. Summary of the Invention

[0003] This disclosure provides an electronic device that can improve the uniformity of a product's appearance.

[0004] According to some embodiments disclosed herein, an electronic device includes a support plate, a plurality of circuit boards, gaps, and a molding material layer. The plurality of circuit boards are disposed on the support plate. Each circuit board includes a substrate and a plurality of semiconductor elements. The plurality of semiconductor elements are disposed on the substrate. Gaps are disposed between two adjacent circuit boards. A molding material layer is disposed on the support plate and covers the plurality of circuit boards and the gaps. Attached Figure Description

[0005] The accompanying drawings are included to further illustrate the present disclosure, and are incorporated in and form a part of this specification. The drawings illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the disclosure.

[0006] Figure 1 This is a partial cross-sectional schematic diagram of an electronic device that discloses some embodiments;

[0007] Figure 2 This is a partial cross-sectional schematic diagram of an electronic device that discloses some embodiments;

[0008] Figure 3A This is a partial cross-sectional schematic diagram of an electronic device that discloses some embodiments;

[0009] Figure 3B for Figure 3A A partial top view of the electronic device.

[0010] Explanation of icon numbers

[0011] 100, 100a, 100b: Electronic devices;

[0012] 110: Support plate;

[0013] 112: Surrounding area;

[0014] 114: Non-surrounding area;

[0015] 120: Circuit board;

[0016] 122: Substrate;

[0017] 122a: First surface;

[0018] 122b: Second surface;

[0019] 124: Semiconductor components;

[0020] 130, 131: Gap;

[0021] 140: Molding material layer;

[0022] 142: Molded thin film layer;

[0023] 144: Molded sheet;

[0024] 146: Filler;

[0025] 148: Support layer;

[0026] H1, H2, H3: Height;

[0027] T1: Thickness;

[0028] Y: Normal direction. Detailed Implementation

[0029] This disclosure can be understood by referring to the following detailed description in conjunction with the accompanying drawings. It should be noted that, for ease of understanding and for the sake of brevity, many of the drawings in this disclosure depict only a portion of the electronic device, and certain components in the drawings are not drawn to scale. Furthermore, the number and dimensions of the components in the drawings are for illustrative purposes only and are not intended to limit the scope of this disclosure.

[0030] In the following description and claims, the words "containing" and "including" are open-ended terms, and therefore should be interpreted as "containing but not limited to...".

[0031] It should be understood that when an element or membrane is referred to as being "on" or "connected" to another element or membrane, it can be directly on or directly connected to that other element or membrane, or there may be an inserted element or membrane between them (indirect cases). Conversely, when an element is referred to as being "directly" on or "directly connected" to another element or membrane, there may be no inserted element or membrane between them.

[0032] Although the terms "first," "second," "third," etc., can be used to describe multiple components, the components are not limited to these terms. These terms are used only to distinguish a single component from other components in the specification. The same terms may not be used in the claims, but rather replaced by "first," "second," "third," etc., according to the order of the elements declared in the claims. Therefore, in the following description, a first component may be a second component in the claims.

[0033] In this disclosure, the measurement of length, width, thickness, height, or area, or the distance or spacing between elements, can be obtained using an optical microscopy (OM), a scanning electron microscope (SEM), an alpha-step thickness gauge, an ellipsometry, or other suitable methods. Specifically, according to some embodiments, a scanning electron microscope can be used to obtain a cross-sectional image of the element to be measured, and the width, thickness, height, or area of ​​each element, or the distance or spacing between elements, can be measured, but this is not a limitation. Furthermore, any two values ​​or directions used for comparison may have a certain degree of error.

[0034] In this text, the terms "about," "approximately," "substantially," and "roughly" typically indicate that a given value or range is within 10%, 5%, 3%, 2%, 1%, or 0.5%. The given quantity is an approximate quantity; that is, even without specific mention of "about," "approximately," "substantially," or "roughly," the meaning of "about," "approximately," "substantially," or "roughly" can still be implied.

[0035] In some embodiments disclosed herein, terms such as "connection" and "interconnection," unless specifically defined, may refer to two structures being in direct contact, or to two structures not being in direct contact, with other structures disposed between them. Furthermore, these terms regarding engagement and connection may also include situations where both structures are movable or both structures are fixed. Additionally, the term "coupled" encompasses any direct and indirect electrical connection means.

[0036] The electronic devices disclosed herein may include, but are not limited to, display devices, backlight devices, antenna devices, sensing devices, or splicing devices. The electronic devices may be bendable or flexible. Display devices may be non-emissive or emissive. Antenna devices may be liquid crystal type or non-liquid crystal type antenna devices; sensing devices may be sensing capacitance, light, heat, or ultrasound, but are not limited to these. Electronic components may include passive and active components, such as capacitors, resistors, inductors, diodes, transistors, etc. Diodes may include light-emitting diodes (LEDs) or photodiodes. Light-emitting diodes may include, for example, organic light-emitting diodes (OLEDs), mini LEDs, micro LEDs, or quantum dot LEDs, but are not limited to these. Splicing devices may be, for example, display splicing devices or antenna splicing devices, but are not limited to these. It should be noted that the electronic devices may be any combination of the foregoing, but are not limited to these. The following description will use display devices as electronic devices or splicing devices to illustrate the contents of this disclosure, but this disclosure is not limited thereto.

[0037] It should be understood that the features in the following embodiments can be replaced, recombined, or mixed to complete other embodiments without departing from the spirit of this disclosure. Features between embodiments can be arbitrarily mixed and combined as long as they do not violate the spirit of the invention or conflict with it.

[0038] Reference will now be made in detail to the exemplary embodiments disclosed herein, examples of which are illustrated in the accompanying drawings. Wherever possible, the same element symbols are used in the drawings and description to denote the same or similar parts.

[0039] Figure 1 This is a partial cross-sectional schematic diagram of an electronic device that discloses some embodiments.

[0040] Please refer to Figure 1The electronic device 100 of this embodiment includes a support plate 110, a plurality of circuit boards 120, gaps 130, and a molding material layer 140. The plurality of circuit boards 120, gaps 130, and molding material layer 140 are all disposed on the support plate 110. The support plate 110 can be a rigid substrate, a flexible substrate, or a combination thereof. For example, the material of the support plate 110 may include glass, quartz, sapphire, ceramic, polycarbonate (PC), polyimide (PI), polyethylene terephthalate (PET), other suitable substrate materials, or combinations thereof, but is not limited thereto. In some embodiments, the material of the support plate 110 may also be a flexible material.

[0041] In this embodiment, multiple circuit boards 120 are disposed on a support plate 110. The multiple circuit boards 120 may be arranged in an array on the support plate 110, but this is not a limitation. Each circuit board 120 may include a substrate 122 and multiple semiconductor elements 124. Specifically, the substrate 122 has a first surface 122a and a second surface 122b opposite to the first surface 122a. Multiple semiconductor elements 124 are respectively disposed on the first surface 122a of the substrate 122. The support plate 110 is disposed on the second surface 122b of the substrate 122. The semiconductor elements 124 and the support plate 110 are located on opposite sides of the substrate 122. The support plate 110 may contact the second surface 122b of the substrate 122, but this is not a limitation. In this embodiment, the substrate 122 can be considered as a driving substrate including driving circuits (not shown) such as transistors, scan lines, and data lines, and the substrate 122 may be electrically connected to the semiconductor elements 124 to drive the semiconductor elements 124. The substrate 122 has a height H1, which is, for example, the maximum height of the substrate 122 measured along the normal direction Y of the support plate 110. The material of the substrate 122 may be the same as or different from the material of the support plate 110, and will not be described again here. In some embodiments, the material of the substrate 122 may also be a soft material.

[0042] In this embodiment, the semiconductor element 124 may include passive and active elements, such as light-emitting elements and diodes, but is not limited thereto. The light-emitting element may include inorganic light-emitting diodes, organic light-emitting diodes, sub-millimeter light-emitting diodes, micro light-emitting diodes, quantum dot light-emitting diodes, other suitable light-emitting elements or combinations thereof, such as red, green, or blue light-emitting diodes, but is not limited thereto. The semiconductor element 124 has a height H2, and the height H2 is, for example, the maximum height of the semiconductor element 124 measured along the normal direction Y of the support plate 110.

[0043] In this embodiment, the gap 130 is disposed between two adjacent circuit boards 120. The gap 130 may be a splicing seam between multiple circuit boards 120 when splicing multiple circuit boards 120, but is not limited thereto.

[0044] In this embodiment, a molding material layer 140 is disposed on the support plate 110. The molding material layer 140 can cover the plurality of circuit boards 120 and the gap 130 to protect the plurality of circuit boards 120. The molding material layer 140 can contact the plurality of circuit boards 120. The molding material layer 140 can be further located in the gap 130, or even further fill and seal the gap 130. In this embodiment, the molding material layer 140 can fill and seal the gap 130, thereby reducing defects in the product appearance or optical performance caused by air bubbles forming in the gap 130, which is further one of the advantages of this disclosure.

[0045] In this embodiment, the thickness T1 of the molding material layer 140 may, for example, be greater than or equal to the height H2 of one of the plurality of semiconductor elements 124, so that the molding material layer 140 can surround and protect the semiconductor element 124, but is not limited thereto. The thickness T1 may, for example, be the minimum thickness of the molding material layer 140 measured along the normal direction Y of the support plate 110, and the thickness T1 may also be, for example, the distance between the surface of the molding material layer 140 away from the substrate 122 and the first surface 122a of the substrate 122 measured along the normal direction Y of the support plate 110.

[0046] In this embodiment, the method for forming the molding material layer 140 may include, for example, inkjetting, dispensing, printing, or other suitable processes, but is not limited thereto. In this embodiment, the molding material layer 140 may have a molding film layer 142. The molding film layer 142 may be a single-layer structure or a multi-layer structure. The material of the molding film layer 142 may include acrylate, epoxy, epoxy acrylate, cyanoacrylate, polyurethane acrylate, but is not limited thereto. In some embodiments, the material of the molding material layer 140 may also be a soft material.

[0047] In this embodiment, the electronic device 100 may be a splicing device, and may be a flexible device, such as a rollable display, but is not limited thereto.

[0048] Other embodiments will be listed below for illustration. It must be noted that the following embodiments use the component reference numerals and some content from the foregoing embodiments, with the same reference numerals representing the same or similar components, and descriptions of identical technical content omitted. For explanations of the omitted parts, please refer to the foregoing embodiments; these will not be repeated in the following embodiments.

[0049] Figure 2 This is a partial cross-sectional schematic diagram of an electronic device that discloses some embodiments thereof. Please also refer to... Figure 1 and Figure 2 The electronic device 100a in this embodiment is generally similar to Figure 1 The electronic device 100 is the same as that in the two embodiments, so the same and similar components will not be repeated here. One difference between the electronic device 100a and the electronic device 100 in this embodiment is that, in the electronic device 100a of this embodiment, the molding material layer 140 may have a molding sheet layer 144 and a filler 146.

[0050] Please refer to Figure 2 In this embodiment, the molded sheet layer 144 is disposed on the surface of the molded thin film layer 142 away from the substrate 122. The molded sheet layer 144 and the substrate 122 are located on opposite sides of the molded thin film layer 142.

[0051] The molded sheet 144 can be a single-layer or multi-layer structure. The material of the molded sheet 144 may include polyethylene terephthalate, polycarbonate, polyurethane (PU), polyimide, triacetylcellulose (TAC), cycloolefin polymer (COP), poly(methyl methacrylate) (PMMA), and metallic materials (e.g., steel SUS), but is not limited thereto. In this embodiment, the Young's modulus of the molded film layer 142 is, for example, less than or equal to the Young's modulus of the molded sheet 144, thereby providing a stress-buffering effect, but is not limited thereto.

[0052] A filler 146 is disposed in the gap 130 to support the molded thin film layer 142. The filler 146 has a height H3, which is, for example, the maximum height of the filler 146 measured along the normal direction Y of the support plate 110. In this embodiment, the height H3 of the filler 146 may be, for example, greater than or equal to the height H1 of the substrate 122. In this embodiment, the filler 146 can further fill and seal the gap 130, which can reduce defects in the product appearance or optical performance caused by air bubbles forming in the gap 130, and is further one of the advantages of this disclosure.

[0053] In this embodiment, the material of the filler 146 may include a transparent material or a light-blocking material, but is not limited thereto. Furthermore, the material of the filler 146 may be the same as or different from the material of the molded film layer 142.

[0054] In some embodiments of the electronic device disclosed herein, the difference from one of the electronic devices 100a is that the molding material layer 140 may further have a molding sheet layer 144, while the filler 146 may be omitted. The molding sheet layer 144 may be disposed on the surface of the molding film layer 142 away from the substrate 122. The molding sheet layer 144 and the substrate 122 are respectively located on opposite sides of the molding film layer 142.

[0055] In some embodiments of the electronic device disclosed herein, the difference from one of the electronic devices 100a is that the molding material layer 140 may further have a filler 146, while the molding sheet layer 144 may be omitted. The filler 146 is disposed in the gap 130 to further support the molding film layer 142.

[0056] Figure 3A This is a partial cross-sectional schematic diagram of an electronic device according to some embodiments disclosed herein, and Figure 3A for Figure 3BA cross-sectional schematic diagram of the electronic device along section line I-I'. Figure 3B for Figure 3A A partial top view of an electronic device. For clarity and ease of explanation, the accompanying drawings are provided. Figure 3B Several components in the electronic device are not shown, including semiconductor element 124, molded thin film layer 142, and molded wafer layer 144. Please also refer to... Figure 2 as well as Figures 3A to 3B The electronic device 100b in this embodiment is generally similar to Figure 2 The electronic device 100a is the same as that in the two embodiments, so the same and similar components will not be repeated here. One difference between the electronic device 100b and the electronic device 100a is that in the electronic device 100b of this embodiment, the molding material layer 140 may have a support layer (spacer) 148, wherein the support layer (spacer) 148 may have the effect of helping to fix the product shape and support the product strength.

[0057] Please refer to Figure 3A and Figure 3B In this embodiment, the support layer 148 is disposed along the periphery of the support plate 110. Specifically, the support plate 110 has a peripheral area 112 and a non-peripheral area 114. The peripheral area 112 is disposed along the periphery of the support plate 110. The peripheral area 112 is adjacent to the non-peripheral area 114, and the peripheral area 112 may surround the non-peripheral area 114. The support layer 148 may be continuously disposed on the peripheral area 112 of the support plate 110, but is not limited thereto. In some embodiments, the support layer 148 may also be discontinuously disposed on the peripheral area 112 of the support plate 110. For example, please refer to... Figure 3B In a partial top view of the electronic device, a support plate 110 has four edges, and a support layer 148 may be disposed on one, two, or three edges of the support plate 110 (not shown). In this embodiment, a plurality of circuit boards 120 are disposed on a non-peripheral area 114 of the support plate 110. The support layer 148 may substantially surround the plurality of circuit boards 120, and the support layer 148 does not contact the circuit boards 120. The material of the support layer 148 may be, for example, an insulating material or other suitable material. In some embodiments, the material of the support layer 148 may be the same as or different from the material of the molded thin film layer 142.

[0058] In this embodiment, there are multiple gaps 130 and 131. Gap 130 is located between two adjacent circuit boards 120, and gap 131 is located between the support layer 148 and the circuit board 120 adjacent to the support layer 148. The size of gap 130 (e.g., the distance between two adjacent circuit boards 120) may be substantially the same as or similar to the size of gap 131 (e.g., the distance between adjacent support layer 148 and circuit board 120), but is not limited thereto. In some embodiments, the size of gap 130 may be different from the size of gap 131 (not shown).

[0059] The filler 146 is disposed in the gaps 130 and 131, and can fill and seal the gaps 130 and 131. In this embodiment, the filler 146 can further fill and seal the gaps 130 and 131, which can reduce defects in the appearance or optical performance of the product caused by air bubbles forming in the gaps 130 and 131, and is further one of the advantages of this disclosure.

[0060] In summary, in the electronic devices of the various embodiments disclosed herein, the uniformity of the product appearance can be improved because the molding material layer can cover the gaps. This disclosure further offers several advantages, such as improving the uniformity of the product appearance or the uniformity of the displayed image: First, in one embodiment, the thickness of the molding material layer can be greater than or equal to the height of one of the multiple semiconductor elements, allowing the molding material layer to surround and protect the semiconductor element. Second, in one embodiment, the height of the filler can be greater than or equal to the height of the substrate, allowing the filler to fill and seal the gaps, thereby reducing defects in the product appearance or optical performance caused by air bubbles forming in the gaps, and improving the uniformity of the product appearance or the uniformity of the displayed image.

[0061] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions disclosed herein, and are not intended to limit them. Although the present disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments disclosed herein.

Claims

1. An electronic device, characterized in that, include: Support plate; Multiple circuit boards are disposed on the support plate, and each of the multiple circuit boards includes: Substrate; and Multiple semiconductor elements are disposed on the substrate; A gap is provided between two adjacent circuit boards; and A molding material layer is disposed on the support plate and within the gap, and covers the plurality of circuit boards and the gap. The molding material layer has: A filler is disposed within the gap, wherein the height of the filler is greater than the height of the substrate; A molded film layer is disposed on the filler, wherein the material of the molded film layer is different from the material of the filler; and A molded sheet layer is disposed on the molded film layer.

2. The electronic device according to claim 1, characterized in that, The Young's modulus of the molded thin film layer is less than or equal to the Young's modulus of the molded sheet layer.

3. The electronic device according to claim 1, characterized in that, The molded sheet and the substrate are located on opposite sides of the molded thin film layer.

4. The electronic device according to claim 1, characterized in that, The molding material layer has a support layer, and the support layer is disposed along the periphery of the support plate.

5. The electronic device according to claim 4, characterized in that, The support layer is provided in a discontinuous manner.

6. The electronic device according to claim 1, characterized in that, The substrate has a first surface and a second surface, the plurality of semiconductor elements are disposed on the first surface of the substrate, and the support plate is in contact with and disposed on the second surface of the substrate.

7. The electronic device according to claim 1, characterized in that, The thickness of the molding material layer is greater than or equal to the height of one of the plurality of semiconductor elements.

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