反应性环氧羧酸酯化合物、含不饱和基的多元羧酸化合物、感光性树脂组合物及硬化物
A photosensitive resin composition was prepared by reacting reactive epoxy carboxylic acid ester compounds with polyacid anhydrides, which solved the problems of low curing properties and low through-hole formation efficiency of solder resist, and achieved high insulation, heat resistance and fine pattern formation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- NIPPON KAYAKU CO LTD
- Filing Date
- 2022-04-12
- Publication Date
- 2026-07-17
AI Technical Summary
In the existing technology, solder resist has low hardening properties and poor developability, and its through-hole formation efficiency is low in the manufacturing of high-density printed circuit boards, making it difficult to meet the requirements of high precision and high density.
A reactive epoxy carboxylic acid ester compound is reacted with a polycarboxylic acid anhydride to form a polycarboxylic acid compound containing unsaturated groups. This compound is then combined with a photopolymerization initiator and a crosslinking agent to prepare a photosensitive resin composition. The composition is then developed using a dilute alkaline aqueous solution to form a film with high insulation and heat resistance.
It achieves high photosensitivity to active energy lines, enabling the formation of fine patterns, and improves the insulation, heat resistance, and adhesion of the film, thereby enhancing the efficiency and quality of through-hole formation.
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