A high voltage testing device for semiconductor devices

Abstract

The application relates to a high-voltage testing device for semiconductor devices, which comprises a rack and a high-voltage clamping testing assembly arranged on the rack. The high-voltage clamping testing assembly comprises a supporting table for supporting a semiconductor device to be tested and two groups of high-voltage clamping testing assemblies for testing the high-voltage resistance of the semiconductor device. Each group of the high-voltage clamping testing assemblies comprises a plurality of testing pieces for testing the high-voltage resistance of the semiconductor device, and the supporting table is located between the testing pieces of the two groups of high-voltage clamping testing assemblies. The two groups of high-voltage clamping testing assemblies are slidingly arranged on the rack, and can slide towards each other or away from each other so that the testing pieces of the two groups of high-voltage clamping testing assemblies can clamp or move away from the pins on both sides of the semiconductor device to be tested. The application has the effect of improving the testing accuracy of the semiconductor device during the high-voltage resistance test.

Description

Technical Field

[0001] This application relates to the field of semiconductor device testing technology, and in particular to a high-voltage testing device for semiconductor devices. Background Technology

[0002] Semiconductor devices are electronic devices whose conductivity lies between that of good conductors and insulators. They utilize the unique electrical properties of semiconductor materials to perform specific functions, such as generating, controlling, receiving, converting, and amplifying signals, and performing energy conversion. The manufacturing process of semiconductor devices involves a series of complex and meticulous tests requiring high precision, including high-voltage withstand tests.

[0003] In related technologies, high-voltage test probes are generally used to test semiconductor devices. However, traditional high-voltage testing is prone to problems when testing semiconductor devices. Due to the small size of semiconductor devices, the pins of the semiconductor devices are prone to poor contact with the test probe, which greatly reduces the accuracy of the test, affects the test data, and increases production costs.

[0004] Regarding the aforementioned technologies, semiconductor devices suffer from low testing accuracy during high-voltage testing. Summary of the Invention

[0005] To improve the testing accuracy of semiconductor devices during high-voltage testing, this application provides a high-voltage testing device for semiconductor devices.

[0006] The high-voltage testing device for semiconductor devices provided in this application adopts the following technical solution: A high-voltage testing apparatus for semiconductor devices, comprising: frame; A high-voltage clamping test mechanism is provided on the frame. The high-voltage clamping test mechanism includes a support platform for supporting the semiconductor device to be tested and two sets of high-voltage clamping test components for performing high-voltage withstand tests on the semiconductor device. Each set of high-voltage clamping test components includes several test pieces for performing high-voltage withstand tests on the semiconductor device. The support platform is located between the test pieces of the two sets of high-voltage clamping test components. The two sets of high-voltage clamping test assemblies are slidably disposed on the frame, and the two sets of high-voltage clamping test assemblies can slide toward each other or away from each other so that the test pieces of the two sets of high-voltage clamping test assemblies clamp or move away from the pins on both sides of the semiconductor device under test.

[0007] By adopting the above technical solution, during testing, the semiconductor device is placed on the support platform. The test pieces of the two sets of high-voltage clamping components can stably clamp the semiconductor device, and the test pieces can contact the pins of the semiconductor device to perform high-voltage testing. When the two sets of high-voltage clamping components slide towards each other, the test pieces can clamp the semiconductor device, facilitating stable placement and ensuring stable contact between the semiconductor device's pins and the test pieces, thereby improving the accuracy of the test. When the two sets of high-voltage clamping components slide away from each other, the test pieces move away from the semiconductor device, making it easier to remove the semiconductor device from the support platform.

[0008] Optionally, the support platform has a detection groove, the length direction of which is perpendicular to the sliding direction of the high-voltage clamping assembly, and one side wall of the detection groove along its length direction is provided with an air blowing hole for blowing air into the semiconductor device in the detection groove, the air blowing hole being connected to an air inlet pipe.

[0009] By adopting the above technical solution, the air inlet pipe blows air into the air blowing hole, and the airflow flows along the length of the detection groove. The airflow can blow the semiconductor device in the detection groove toward the side of the detection groove opposite to the air blowing hole, so that the semiconductor device is pressed against the inner wall of the side of the detection groove opposite to the air blowing hole, thereby restricting the movement of the semiconductor device in the length of the detection groove, thereby further improving the stability of the semiconductor device during detection.

[0010] Optionally, the frame is provided with a first linear guide rail, and each set of high-pressure clamping test components further includes a support for mounting the test piece and a sliding member that slides with the first linear guide rail. The support is disposed on the sliding member, and the two sliding members of the two sets of high-pressure clamping test components are connected by a return spring. The return spring has an elastic force for driving the two sliding members to move closer to each other.

[0011] By adopting the above technical solution, the sliding members slide along the first linear guide rail, so that the test pieces set on the support can move closer to each other to clamp the semiconductor device; when the test pieces slide away from each other, the reset spring extends, thereby generating a spring force in the contraction direction. This spring force can push the two sliding members closer to each other, thereby facilitating the clamping of the test piece after replacing the semiconductor device to be tested, and also improving the stability of the semiconductor device placement when the high voltage clamping assembly is subjected to vibration.

[0012] Optionally, the high-voltage testing apparatus for semiconductor devices further includes a separation mechanism for driving the two sliding members to separate. The separation mechanism is disposed on the frame and includes a push block and a cylinder for driving the push block to slide. Limiting members are respectively provided on the side of the two sliding members that are close to each other. The push block has an expansion portion for pushing the two limiting members to slide in a direction away from each other. The expansion portion can slide between the two limiting members to move the test piece away from the semiconductor device.

[0013] By adopting the above technical solution, the cylinder can push the expansion part of the push block to slide between the two limiting members, so that the expansion part drives the two limiting members to move away from each other, and the test piece moves away from the semiconductor device so that the semiconductor device can be taken out from the detection slot. At the same time, the reset spring is stretched by the traction of the sliding member. When the expansion part slides out between the two limiting members, the two sliding members move towards each other under the action of the reset spring, so that the test pieces on both sides of the detection slot move closer to each other again to clamp the semiconductor device to be tested.

[0014] Optionally, the two sides of the expansion portion near the two limiting members are limiting surfaces, and the two limiting surfaces gradually narrow in the direction away from the cylinder, and the limiting surfaces can slide and cooperate with the limiting members.

[0015] By adopting the above technical solution, the limiting surface gradually narrows, making it easier for the expansion part to enter between the two limiting members; in addition, as the expansion part gradually enters between the two limiting members, the two limiting members also gradually move away, so that the sliding member also gradually moves away, and the test piece set on the two different support members also gradually moves away, and the reset spring gradually extends, thereby improving the sliding stability of the support members in the two sets of high-voltage clamping test assemblies; when the expansion part moves away from the limiting members, the reset spring gradually contracts, so that the test piece clamps the semiconductor device again.

[0016] Optionally, the limiting member includes a bearing fixed shaft disposed on the sliding member and a rolling bearing sleeved on the bearing fixed shaft. The axes of the two bearing fixed shafts are parallel to each other, and the limiting surface is in rolling sliding cooperation with the outer peripheral surface of the rolling bearing.

[0017] By adopting the above technical solution, the limiting surface and the outer peripheral surface of the rolling bearing roll and slide together, which can reduce the friction between the limiting component and the limiting surface, and facilitate the expansion part of the pushing block to enter between the outer peripheral surfaces of the two rolling bearings to push the two sliding components away from or towards each other.

[0018] Optionally, the test pieces of the two sets of high-voltage clamping test assemblies are symmetrically distributed on both sides of the center line of the support platform and correspond one to one. Each test piece includes a first test piece and a second test piece. The first test piece is disposed above the second test piece. Each set of high-voltage clamping test assemblies has multiple test pieces, and the number of test pieces in the two sets of high-voltage clamping test assemblies is the same.

[0019] By adopting the above technical solution, during testing, two corresponding test pieces are placed on either side of the support platform for the semiconductor device. In each test piece, the corresponding first test piece and second test piece contact the two ends of the same pin of the semiconductor device, respectively, thus completing the high-voltage test. If only the first test piece or the second test piece contacts the same pin of the semiconductor device, the high-voltage test is temporarily suspended. This reduces the possibility of sparks caused by poor conductivity between the test piece and the semiconductor device during the high-voltage test, thereby improving the detection accuracy of the semiconductor device and enhancing the safety during the test. On the other hand, multiple test pieces can simultaneously test multiple semiconductor devices, thereby improving the detection efficiency.

[0020] Optionally, both the first test piece and the second test piece include two test terminals for contacting the pins of a semiconductor device and performing high-voltage withstand tests.

[0021] By adopting the above technical solution, when testing a semiconductor device with four pins, each pin is in contact with the corresponding first and second test pieces, so that the pins of the semiconductor chip and the test pieces form a Kelvin connection, thereby reducing the impact of the voltage drop across the pins on the test results and improving the accuracy of the test.

[0022] Optionally, the support member includes a test support plate disposed on the sliding member, and the second test piece includes a detection section, a first support section, and a second support section. The first support section is located between the second support section and the detection section. The first support section is horizontally disposed on the upper surface of the test support plate, and the detection section is disposed at one end of the first support section near the support platform. The second support section is vertically disposed at the other end of the first support section. A first horizontal pressure plate for clamping the first support section to the upper surface of the test support plate is disposed on the upper surface of the first support section, and a first vertical pressure plate for pressing the second support section to the side of the test support plate is disposed on the side of the test support plate away from the support platform.

[0023] By adopting the above technical solution, the first vertical pressure plate and the first horizontal pressure plate can press the first support section and the second support section of the second test piece against the test support plate, so that the second test piece is not easy to shake when it slides with the sliding member, which can improve the stability of the second test piece when testing semiconductor devices.

[0024] Optionally, the first test piece includes a fixed section and a test section. The test section is horizontally disposed on the upper surface of the first horizontal pressure plate and the upper end surface of the first vertical pressure plate. A second vertical pressure plate is also disposed on the side of the first vertical pressure plate away from the support plate. The fixed section is clamped between the second vertical pressure plate and the first vertical pressure plate. A second horizontal pressure plate is also disposed above the test section for pressing the test section against the first horizontal pressure plate.

[0025] By adopting the above technical solution, the second vertical pressure plate and the second horizontal pressure plate can press the fixing section and the detection section of the first test piece against the first vertical pressure plate and the first horizontal pressure plate, thereby improving the installation stability of the first test piece and improving the testing accuracy of semiconductor devices.

[0026] In summary, this application includes at least one of the following beneficial technical effects: 1. The test pieces of the two sets of high-voltage clamping components can stably clamp the semiconductor device, and the test pieces can contact the pins of the semiconductor device to perform high-voltage testing. When the two sets of high-voltage clamping components slide towards the phase support, the test pieces can clamp the semiconductor device to ensure stable placement and stable contact between the semiconductor device's pins and the test pieces, thereby improving the accuracy of the test; when the two sets of high-voltage clamping components slide towards the phase support, the test pieces move away from the semiconductor device, making it easier to remove the semiconductor device from the support. 2. The air inlet pipe blows air into the air blowing hole. The airflow flows along the length of the detection groove. The airflow can blow the semiconductor device in the detection groove toward the side of the detection groove opposite to the air blowing hole, so that the semiconductor device is pressed against the inner wall of the side of the detection groove opposite to the air blowing hole, thereby restricting the movement of the semiconductor device in the length of the detection groove, thereby further improving the stability of the semiconductor device during detection. 3. When the test pieces slide away from each other, the reset spring extends, thereby generating a spring force in the contraction direction. This spring force can push the two sliding parts closer to each other, which facilitates the clamping of the test piece after replacing the semiconductor device under test. It can also improve the stability of the semiconductor device placement when the high-voltage clamping assembly is subjected to vibration. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the overall structure of a high-voltage testing device for semiconductor devices according to an embodiment of this application; Figure 2 This is a schematic diagram illustrating the separation mechanism of a high-voltage testing device for semiconductor devices according to an embodiment of this application. Figure 3 This is a schematic diagram of the structure of a high-voltage testing device for semiconductor devices as a display support platform according to an embodiment of this application; Figure 4This is a schematic diagram illustrating the structure of a high-voltage testing device for semiconductor devices according to an embodiment of this application, specifically a high-voltage clamping assembly.

[0028] Explanation of reference numerals in the attached figures: 1. Frame; 11. Air blowing support plate; 12. Test tray; 13. First linear guide rail; 14. Second linear guide rail; 2. High-pressure clamping test mechanism; 21. Support platform; 211. Detection slot; 212. Air blowing hole; 213. Air distribution slot; 22. High-pressure clamping test assembly; 221. Support component; 2211. Test support plate; 2212. Test mounting plate; 2213. First horizontal pressure plate; 2214. First vertical pressure plate; 2215. Second vertical pressure plate; 2216. Second horizontal pressure plate; 222. Sliding component; 2221. First slider; 2222 1. Slider mounting plate; 223. Test piece; 2231. First test piece; 22311. Fixed section; 22312. Test section; 2232. Second test piece; 22321. Detection section; 22322. First support section; 22323. Second support section; 23. Return spring; 24. Limiting component; 241. Bearing fixing shaft; 242. Rolling bearing; 3. Separation mechanism; 31. Push block; 311. Mounting part; 312. Expansion part; 3121. Limiting surface; 32. Cylinder; 33. Second slider; 34. Slider pad; 35. Floating joint. Detailed Implementation

[0029] The following is in conjunction with the appendix Figure 1-4 This application will be described in further detail.

[0030] This application discloses a high-voltage testing apparatus for semiconductor devices. (Refer to...) Figure 1 A high-voltage testing apparatus for semiconductor devices includes a frame 1, a high-voltage clamping testing mechanism 2, and a separation mechanism 3. The high-voltage clamping testing mechanism 2 is disposed on the frame 1 and includes a support platform 21 for supporting the semiconductor device under test and two sets of high-voltage clamping test assemblies 22 for performing high-voltage withstand tests on the semiconductor device. The two sets of high-voltage clamping test assemblies 22 are symmetrically distributed on both sides of the support platform 21. The separation mechanism 3 is disposed on the frame 1 and can drive the two sets of high-voltage clamping test assemblies 22 to separate from each other. During testing, the semiconductor device is placed on the support platform 21, and the two sets of high-voltage clamping test assemblies 22 can clamp the semiconductor device stably and perform high-voltage withstand tests on the semiconductor device. After testing, the separation mechanism 3 drives the two sets of high-voltage clamping test assemblies 22 to move away from each other so that the tested semiconductor device can be removed from the support platform 21.

[0031] Reference Figure 1The frame 1 has a vertically arranged air-blowing support plate 11. One end of a support platform 21 is fixedly connected to the upper end of the air-blowing support plate 11. The support platform 21 is horizontally arranged between the test pieces 223 of the two sets of high-pressure clamping test assemblies 22. The frame 1 also has a horizontally arranged test tray 12. The air-blowing support plate 11 is located at one end of the test tray 12. A first linear guide rail 13 is arranged on the upper surface of the test tray 12 near the air-blowing support plate 11. Each set of high-pressure clamping test assemblies 22 includes a support member 221 and a sliding member 222 that slides with the first linear guide rail 13. The support member 221 is arranged above the corresponding sliding member 222. The sliding member 222 includes a first slider 2221 and a slider mounting plate 2222 fixedly arranged above the first slider 2221. The support member 221 is mounted above the slider mounting plate 2222.

[0032] Reference Figure 1 Two sliding members 222 of the two sets of high-voltage clamping test assemblies 22 are connected by a return spring 23. The two ends of the return spring 23 are respectively fixed to the sides of the two slider mounting plates 2222 by bolts. Two return springs 23 are provided, located on opposite sides of the slider mounting plates 2222 in the sliding direction. When the slider mounting plates 2222 move away from each other, the return spring 23 extends, providing a spring force to drive the two sliding members 222 closer together. The sliding members 222 slide along the first linear guide rail 13, allowing the test pieces 223 mounted on the support member 221 to move closer together to clamp the semiconductor device. When the test pieces 223 slide away from each other, the return spring 23 extends, generating a spring force in the contraction direction. This spring force drives the two sliding members 222 closer together, facilitating the clamping of the test piece after replacing the semiconductor device under test, and also improving the stability of the semiconductor device placement when the high-voltage clamping test assembly 22 is subjected to vibration.

[0033] Reference Figure 1 and Figure 2 The separation mechanism 3 is disposed on the test tray 12 and located on the side away from the air blowing support plate 11. The separation mechanism 3 includes a push block 31 and a cylinder 32 for driving the push block 31 to slide. Limiting members 24 are respectively provided on the side of the upper surface of the two slider mounting plates 2222 that are close to each other. The push block 31 has a mounting part 311 and an expansion part 312 for pushing the two limiting members 24 to slide in a direction away from each other. The mounting part 311 is located at the end of the push block 31 near the cylinder 32. The expansion part 312 can slide between the two limiting members 24 to move the test piece 223 away from the semiconductor device.

[0034] Continue to refer to Figure 1 and Figure 2Specifically, the limiting member 24 includes a bearing fixing shaft 241 vertically disposed on the upper surface of the sliding mounting plate and a rolling bearing 242 sleeved on the bearing fixing shaft 241, the axes of the two bearing fixing shafts 241 being parallel to each other; the two sides of the expansion portion 312 near the two rolling bearings 242 are limiting surfaces 3121, the two limiting surfaces 3121 gradually narrowing away from the cylinder 32, and the limiting surfaces 3121 being able to roll and slide with the rolling bearings 242. A limiting part is also provided at the gradually narrowing end of the expansion portion 312, the width of the limiting part being the same as the width of the narrowest part of the expansion portion 312.

[0035] Reference Figure 1 and Figure 2 The cylinder 32 is positioned on the side of the test tray 12 away from the high-pressure clamping assembly 22, and the output shaft of the cylinder 32 is located on the side of the cylinder 32 closer to the high-pressure clamping assembly 22. A second linear guide rail 14 is also provided on the upper surface of the test tray 12. The second linear guide rail 14 is located between the high-pressure clamping assembly 22 and the cylinder 32, and is perpendicular to the first linear guide rail 13. The separation mechanism 3 also includes a second slider 33 that slides along the second linear guide rail 14, and the second slider 33 can move along the second linear guide rail 14 towards or away from the high-pressure clamping assembly 22. A slider pad 34 is mounted on the lower surface of the mounting part 311 of the push block 31, and the slider pad 34 is mounted on the upper surface of the second slider 33. The output shaft of cylinder 32 is connected to slider pad 34 through floating joint 35. Floating joint 35 can reduce the eccentricity of cylinder 32 and make cylinder 32 and push block 31 driven by cylinder 32 work stably within the allowable eccentricity range. At the same time, it solves the problem of insufficient balance accuracy and maintains the smoothness of cylinder 32's operation.

[0036] When the limiting part is clamped between the two rolling bearings 242, the distance between the two sets of high-voltage clamping components 22 is at its minimum. That is, at this time, the test pieces 223 on both sides of the support platform 21 clamp the semiconductor device and can perform testing on the semiconductor device. When the output shaft of the cylinder 32 extends to push the expansion part 312 of the push block 31 to gradually enter between the two rolling bearings 242, the expansion surface gradually widens in the direction closer to the cylinder 32, so that the distance between the two rolling bearings 242 gradually increases. That is, the distance between the two sets of high-voltage clamping components 22 gradually increases, and the test pieces 223 on both sides of the support platform 21 move away from each other, so that the tested semiconductor device can be removed from the support platform 21. When testing is required, the output shaft of the cylinder 32 retracts, the expansion part 312 slides in the direction closer to the cylinder 32, and the two sets of high-voltage clamping components 22 come together to clamp the semiconductor device to be tested.

[0037] Reference Figure 1 and Figure 3Furthermore, a detection groove 211 is formed on the upper surface of the support platform 21, and the length direction of the detection groove 211 is perpendicular to the sliding direction of the high-voltage clamping assembly 22. The two sides of the detection groove 211 in the width direction are open structures so that the semiconductor device placed in the detection groove 211 can contact the high-voltage clamping assembly 22 on both sides of the detection groove 211. An air blowing hole 212 for blowing air into the semiconductor device in the detection groove 211 is formed on the side wall away from the air blowing support plate 11 in the length direction of the detection groove 211. The air blowing hole 212 is connected to an air inlet pipe (not shown in the figure), and the air inlet pipe can be connected to an air pump. Air is blown into the air inlet 212 through the air inlet pipe. The airflow flows along the length of the detection groove 211. The airflow can blow the semiconductor device in the detection groove 211 toward the side of the detection groove 211 near the air blowing support plate 11, so that the semiconductor device is pressed against the inner wall of the side of the detection groove 211 near the air blowing support plate 11, thereby restricting the movement of the semiconductor device in the length of the detection groove 211, thereby further improving the stability of the semiconductor device during detection.

[0038] Reference Figure 3 Furthermore, a gas distribution groove 213 is provided at the bottom of the detection groove 211. The length direction of the gas distribution groove 213 is consistent with the length direction of the detection groove 211, and the centerline of the gas distribution groove 213 coincides with the centerline of the detection groove 211. The gas distribution groove 213 is connected to the air blowing hole 212. During detection, the semiconductor device is located above the gas distribution groove 213. When air is blown from the air blowing hole 212, part of the airflow passes through the gas distribution groove 213, and part of the airflow passes over the semiconductor device, thereby improving the force balance of the semiconductor device. In this embodiment, when the semiconductor device is being detected, it is subjected to the pressure of the airflow in the length direction of the detection groove 211 and is clamped by the high-voltage clamping assembly 22 in the width direction of the detection groove 211, thereby improving the stability of the semiconductor device and improving the accuracy of high-voltage detection.

[0039] Reference Figure 1 and Figure 4 Each high-voltage clamping assembly 22 includes several test pieces 223 for high-voltage withstand testing of semiconductor devices. The test pieces 223 of the two sets of high-voltage clamping assemblies 22 can slide towards or away from each other in cooperation with the first slider 2221 and the guide rail, so that the test pieces 223 of the two sets of high-voltage clamping assemblies 22 clamp or move away from the pins on both sides of the semiconductor device under test. The test pieces 223 can contact the pins of the semiconductor device and perform high-voltage testing on the semiconductor device. When the two sets of high-voltage clamping assemblies 22 slide towards each other, the test pieces 223 can clamp the semiconductor device, making the semiconductor device stable and ensuring stable contact between the semiconductor device's pins and the test pieces 223, thereby improving the accuracy of the test; when the two sets of high-voltage clamping assemblies 22 slide towards each other, the test pieces 223 move away from the semiconductor device, making it easier to remove the semiconductor device from the support platform 21.

[0040] Reference Figure 1 and Figure 4 The test pieces 223 of the two sets of high-voltage clamp test components 22 are symmetrically distributed on both sides of the center line of the support platform 21 and correspond one to one. Each test piece 223 includes a first test piece 2231 and a second test piece 2232. The first test piece 2231 and the second test piece 2232 correspond one to one. The first test piece 2231 is set above the corresponding second test piece 2232.

[0041] Reference Figure 1 and Figure 4 Both the first test piece 2231 and the second test piece 2232 are mounted on the support member 221. The support member 221 includes a test support plate 2211 vertically disposed on the upper surface of the slider mounting plate 2222. The test support plate 2211 is located above the rolling bearing 242, and the lower surface of the test support plate 2211 has a clearance space for avoiding the rolling bearing 242. To improve the installation stability of the test support plate 2211, a test mounting plate 2212 is also provided on the side of the test support plate 2211 away from the support platform 21. The test mounting plate 2212 is fixedly installed on the upper surface of the sliding mounting plate, and the side of the bottom of the test support plate 2211 is bolted to the side of the test mounting plate 2212, thereby making the test support plate 2211 less prone to shaking.

[0042] Reference Figure 1 and Figure 4 The second test piece 2232 includes a detection section 22321, a first support section 22322, and a second support section 22323. The first support section 22322 is located between the second support section 22323 and the detection section 22321. The first support section 22322 is horizontally disposed on the upper surface of the test support plate 2211. The detection section 22321 is vertically disposed at one end of the first support section 22322 near the support platform 21 and is located above the first support section 22322. The second support section 22323 is vertically disposed at the other end of the first support section 22322 and is located below the first support section 22322. The second test piece 2232 is an integrally formed structure, and the detection section 22321 includes two test terminals arranged side by side. During testing, the two test terminals are respectively connected to one end of two pins on the same side of the semiconductor device.

[0043] Reference Figure 1 and Figure 4A first horizontal pressure plate 2213 is provided on the upper surface of the first support segment 22322, so that the first support segment 22322 is clamped between the lower surface of the first horizontal pressure plate 2213 and the upper end face of the test support plate 2211. A first vertical pressure plate 2214 is also provided on the side of the test support plate 2211 away from the support platform 21. The upper end face of the first vertical pressure plate 2214 is flush with the upper surface of the first horizontal pressure plate 2213. The second support segment 22323 is clamped between the test support plate 2211 and the first vertical pressure plate 2214.

[0044] Reference Figure 1 and reference Figure 4 The first test piece 2231 is L-shaped and includes a fixed section 22311 and a test section 22312. The test section 22312 is horizontally positioned on the upper surface of the first horizontal pressure plate 2213 and the upper end surface of the first vertical pressure plate 2214. The test section 22312 also includes two test terminals arranged side by side. The two test terminals of the test section 22312 are respectively connected to the other end of two pins on the same side of the semiconductor device, thereby enabling conduction in conjunction with the two test terminals of the detection section 22321. When testing a semiconductor device with four pins, each pin contacts the corresponding first test piece 2231 and second test piece 2232, so that the pins of the semiconductor chip and the test pieces form a Kelvin connection for high-voltage withstand testing of the semiconductor device. If only one of the first test piece 2231 or the second test piece 2232 contacts the same pin of the semiconductor device, the high-voltage test is temporarily suspended, reducing the possibility of sparks caused by poor conduction between the test piece and the semiconductor device during high-voltage testing.

[0045] A second vertical pressure plate 2215 is also provided on the side of the first vertical pressure plate 2214 away from the support plate, and the fixing section 22311 is clamped between the second vertical pressure plate 2215 and the first vertical pressure plate 2214. A second horizontal pressure plate 2216 is also provided above the test section 22312, and the second horizontal pressure plate 2216 is fixed above the first vertical pressure plate 2214 and the first horizontal pressure plate 2213 by bolts.

[0046] The first horizontal pressure plate 2213, the second horizontal pressure plate 2216, the first vertical pressure plate 2214, and the second vertical pressure plate 2215 can fix the first test piece 2231 and the second test piece 2232 on the test support plate 2211, thereby improving the stability of the first test piece 2231 and the second test piece 2232.

[0047] During testing, current is applied to the test piece 223. The test terminals of the first test piece 2231 and the second test piece 2232, which are corresponding to each other, simultaneously contact the two ends of the same pin of the semiconductor device. The same semiconductor corresponds to two test pieces 223 in the two sets of high-voltage clamp test assemblies 22. To improve testing efficiency, each set of high-voltage clamp test assemblies 22 has multiple test pieces 223, and the number of test pieces 223 in the two sets of high-voltage clamp test assemblies 22 is the same, so that multiple semiconductor devices can be tested simultaneously.

[0048] The implementation principle of the high-voltage testing device for semiconductor devices in this application embodiment is as follows: the cylinder 32 pushes the expansion part 312 of the push block 31 to slide towards the rolling bearing 242, and the two sets of high-voltage clamping test components 22 move away from each other along the first linear guide rail 13, so that the test pieces 223 on both sides of the support platform 21 move away from each other, so as to facilitate the picking and placing of semiconductor devices; when the cylinder 32 pushes the expansion part 312 to move away from the rolling bearing 242, the two rolling bearings 242 gradually approach each other under the action of the return spring 23, so that the test piece 223 clamps the semiconductor device and tests the semiconductor device; at the same time, the air blowing hole 212 blows airflow towards the semiconductor device, and the semiconductor device is subjected to the pressure of the airflow in the length direction of the detection groove 211, which further improves the stability of the semiconductor device and improves the accuracy of the detection.

[0049] The above are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Identical components are represented by the same reference numerals. It should be noted that the terms "upper" and "lower" used in the above description refer to directions in the accompanying drawings, and the terms "inner" and "outer" refer to directions toward or away from the geometric center of a specific component, respectively. Therefore, all equivalent changes made to the structure, shape, and principle of this application should be covered within the scope of protection of this application.

Claims

1. A high-voltage testing device for semiconductor devices, characterized in that, include: Rack (1); A high-voltage clamping test mechanism (2) is disposed on the frame (1). The high-voltage clamping test mechanism (2) includes a support platform (21) for supporting the semiconductor device to be tested and two sets of high-voltage clamping test assemblies (22) for performing high-voltage withstand tests on the semiconductor device. Each set of high-voltage clamping test assemblies (22) includes several test pieces (223) for performing high-voltage withstand tests on the semiconductor device. The support platform (21) is located between the test pieces (223) of the two sets of high-voltage clamping test assemblies (22). The two sets of high voltage clamping test assemblies (22) are slidably disposed on the frame (1), and the two sets of high voltage clamping test assemblies (22) can slide toward each other or away from each other so that the test pieces (223) of the two sets of high voltage clamping test assemblies (22) clamp or move away from the pins on both sides of the semiconductor device to be tested; The frame (1) is provided with a first linear guide rail (13). Each set of high-voltage clamping test components (22) also includes a support (221) for mounting the test piece (223) and a sliding member (222) that slides with the first linear guide rail (13). The support (221) is disposed on the sliding member (222). The two sliding members (222) of the two sets of high-voltage clamping test components (22) are connected by a return spring (23). The return spring (23) has an elastic force for driving the two sliding members (222) to move closer to each other. The high voltage testing device for semiconductor devices also includes a separation mechanism (3) for driving two sliding members (222) to separate. The separation mechanism (3) is disposed on the frame (1). The separation mechanism (3) includes a push block (31) and a cylinder (32) for driving the push block (31) to slide. Limiting members (24) are respectively provided on the side of the two sliding members (222) that are close to each other. The push block (31) has an expansion portion (312) for pushing the two limiting members (24) to slide in a direction away from each other. The expansion portion (312) can slide between the two limiting members (24) to move the test piece (223) away from the semiconductor device. The output shaft of the cylinder (32) is connected to the slider pad (34) through a floating joint (35). The floating joint (35) is used to reduce the eccentricity of the cylinder (32) and make the cylinder (32) and the push block (31) work stably. The support platform (21) has a detection groove (211), the length direction of the detection groove (211) is perpendicular to the sliding direction of the high-voltage clamping assembly (22), the bottom of the detection groove (211) is provided with a gas distribution groove (213), the length direction of the gas distribution groove (213) is consistent with the length direction of the detection groove (211), and the center line of the gas distribution groove (213) coincides with the center line of the detection groove (211). One side wall of the detection groove (211) along the length direction is provided with a blowing hole (212) for blowing air into the semiconductor device in the detection groove (211), the blowing hole (212) is connected to the gas distribution groove (213), and the blowing hole (212) is connected to an air inlet pipe. The test pieces (223) of the two sets of high-voltage clamp test assemblies (22) are symmetrically distributed on both sides of the center line of the support platform (21) and correspond one to one. Each test piece (223) includes a first test piece (2231) and a second test piece (2232). The first test piece (2231) is disposed above the second test piece (2232). Both the first test piece (2231) and the second test piece (2232) include two test terminals for contacting the pins of the semiconductor device and performing high-voltage withstand tests. When testing a semiconductor device with four pins, each pin contacts the corresponding first test piece (2231) and second test piece (2232).

2. The high-voltage testing device for semiconductor devices according to claim 1, characterized in that, The expansion portion (312) has two sides near the two limiting members (24) forming limiting surfaces (3121). The two limiting surfaces (3121) gradually narrow in the direction away from the cylinder (32), and the limiting surfaces (3121) can slide and cooperate with the limiting members (24).

3. The high-voltage testing device for semiconductor devices according to claim 2, characterized in that, The limiting member (24) includes a bearing fixing shaft (241) disposed on the sliding member (222) and a rolling bearing (242) sleeved on the bearing fixing shaft (241). The axes of the two bearing fixing shafts (241) are parallel to each other, and the limiting surface (3121) is in rolling sliding cooperation with the outer peripheral surface of the rolling bearing (242).

4. The high-voltage testing device for semiconductor devices according to claim 1, characterized in that, Each high-voltage clamp test assembly (22) has multiple test pieces (223), and the number of test pieces (223) in the two high-voltage clamp test assemblies (22) is the same.

5. A high-voltage testing device for semiconductor devices according to claim 4, characterized in that, The support member (221) includes a test support plate (2211) disposed on the sliding member (222). The second test piece (2232) includes a detection section (22321), a first support section (22322), and a second support section (22323). The first support section (22322) is located between the second support section (22323) and the detection section (22321). The first support section (22322) is horizontally disposed on the upper surface of the test support plate (2211). The detection section (22321) is disposed on the first support section (22322). 2322) is located near one end of the support platform (21); the second support section (22323) is vertically disposed at the other end of the first support section (22322); the upper surface of the first support section (22322) is provided with a first horizontal pressure plate (2213) for clamping the first support section (22322) to the upper surface of the test support plate (2211), and the side of the test support plate (2211) away from the support platform (21) is also provided with a first vertical pressure plate (2214) for pressing the second support section (22323) to the side of the test support plate (2211).

6. The high-voltage testing device for semiconductor devices according to claim 5, characterized in that, The first test piece (2231) includes a fixing section (22311) and a test section (22312). The test section (22312) is horizontally disposed on the upper surface of the first horizontal pressure plate (2213) and the upper end surface of the first vertical pressure plate (2214). A second vertical pressure plate (2215) is also disposed on the side of the first vertical pressure plate (2214) away from the support plate. The fixing section (22311) is clamped between the second vertical pressure plate (2215) and the first vertical pressure plate (2214). A second horizontal pressure plate (2216) is also disposed above the test section (22312) for pressing the test section (22312) against the first horizontal pressure plate (2213).

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