A method for packaging and repairing MiniLEDs

Abstract

The application relates to a Mini LED packaging disassembly method, and belongs to the technical field of Mini LED packaging disassembly; a visual acquisition system collects and calculates the coordinates of a bad point, a height measuring system calculates the thickness of a glue layer that needs to be milled, a millimeter-level milling cutter mills away the glue layer, a ceramic cutter head mills away 2 / 3 of a chip, a heating wire heats and melts the bottom solder of the remaining chip, a vacuum suction pipe sucks away the residual chip and the melted solder paste, tin paste or conductive silver glue is subsequently applied to the chip for solidification, after solidification, a lighting test is carried out, after the test is completed, liquid resin is applied for sealing, and finally, the unit board is placed into an oven for complete solidification; the problems that the current disassembly method is not universal and the traces after maintenance are obvious are solved.

Images