Electronic device

Abstract

An electronic device includes a flexible substrate, a plurality of semiconductor elements, and a plurality of support elements. The flexible substrate has a first surface and a second surface opposite to each other. The plurality of semiconductor elements is disposed on the first surface. The plurality of support elements is disposed on the second surface. The support elements include an arc-shaped structure.

Description

Technical Field

[0001] This disclosure relates to an electronic device. Background Technology

[0002] With the technological advancements in modern electronic products, electronic devices on the market now possess foldable and / or rollable functions. To achieve these functions, electronic devices are typically thin; however, under internal or external stress, these devices can deform, potentially damaging their electronic components. Summary of the Invention

[0003] This disclosure provides an electronic device that can improve the situation of deformation after stress.

[0004] According to one embodiment of this disclosure, an electronic device includes a flexible substrate, a plurality of semiconductor elements, and a plurality of support elements. The flexible substrate has a first surface and a second surface opposite to each other. The plurality of semiconductor elements are disposed on the first surface. The plurality of support elements are disposed on the second surface. The support elements include arcuate structures.

[0005] According to another embodiment of this disclosure, an electronic device includes a flexible substrate, a plurality of semiconductor elements, and a plurality of support elements. The flexible substrate has a first surface and a second surface opposite to each other. The plurality of semiconductor elements and the plurality of support elements are disposed on the first surface. The support elements include arcuate structures. At least one of the plurality of support elements disposed on the first surface is located between adjacent semiconductor elements.

[0006] To make the above-mentioned features and advantages disclosed herein more apparent and understandable, specific embodiments are described below in conjunction with the accompanying drawings. Attached Figure Description

[0007] The accompanying drawings are included to further illustrate the present disclosure, and are incorporated in and form a part of this specification. The drawings illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the disclosure.

[0008] Figure 1 This is a partial cross-sectional schematic diagram of the electronic device according to the first embodiment of this disclosure;

[0009] Figure 2 This is a partial cross-sectional schematic diagram of the electronic device according to the second embodiment of this disclosure;

[0010] Figure 3 This is a partial cross-sectional schematic diagram of the electronic device according to the third embodiment of this disclosure;

[0011] Figure 4 This is a partial cross-sectional schematic diagram of the electronic device according to the fourth embodiment of this disclosure;

[0012] Figure 5A This is a partial cross-sectional schematic diagram of the electronic device according to the fifth embodiment of this disclosure;

[0013] Figure 5B This is a partial cross-sectional schematic diagram of the electronic device according to the sixth embodiment of this disclosure;

[0014] Figure 6 This is a partial cross-sectional schematic diagram of the electronic device according to the seventh embodiment of this disclosure;

[0015] Figure 7A This is a partial cross-sectional schematic diagram of the electronic device according to the eighth embodiment of this disclosure;

[0016] Figure 7B This is a partial cross-sectional schematic diagram of the electronic device according to the ninth embodiment of this disclosure;

[0017] Figure 8 This is a perspective view of a support element in an electronic device according to an embodiment of the present disclosure;

[0018] Figures 9A to 9L This is a top view schematic diagram of the support element in the electronic device of each embodiment of the present disclosure;

[0019] Figure 10 This is a top view schematic diagram of an electronic device that discloses some embodiments. Detailed Implementation

[0020] This disclosure can be understood by referring to the following detailed description and accompanying drawings. It should be noted that, for ease of understanding and for the sake of brevity, many of the drawings in this disclosure depict only a portion of the electronic device, and certain components in the drawings are not drawn to scale. Furthermore, the number and size of the components in the drawings are for illustrative purposes only and are not intended to limit the scope of this disclosure.

[0021] Throughout this disclosure and in the appended claims, certain terms are used to refer to specific elements. Those skilled in the art will understand that electronic device manufacturers may use different names to refer to the same element. This document is not intended to distinguish between elements that have the same function but different names. In the following description and claims, words such as “comprising,” “containing,” and “having” are open-ended terms and should therefore be interpreted as “containing but not limited to…”. Thus, when the terms “comprising,” “containing,” and / or “having” are used in the description of this disclosure, they specify the presence of the corresponding feature, area, step, operation, and / or component, but do not exclude the presence of one or more of the corresponding feature, area, step, operation, and / or component.

[0022] The directional terms used herein, such as "up," "down," "front," "back," "left," and "right," are for reference only when referring to the accompanying drawings. Therefore, the directional terms used are illustrative and not intended to limit this disclosure. In the accompanying drawings, each figure illustrates general features of the methods, structures, and / or materials used in specific embodiments. However, these figures should not be construed as defining or limiting the scope or nature covered by these embodiments. For example, for clarity, the relative dimensions, thicknesses, and locations of various films, regions, and / or structures may be reduced or enlarged.

[0023] When a component (e.g., a membrane or region) is referred to as "on another component," it can be directly on that component, or there may be other components between them. Conversely, when a component is referred to as "directly on another component," there are no components between them. Furthermore, when a component is referred to as "on another component," the two components have a vertical relationship in the planar view, and this component can be above or below the other component, depending on the orientation of the device.

[0024] The terms “approximately,” “equal to,” “same,” “substantially,” or “roughly” are generally interpreted as being within 20% of a given value or range, or as being within 10%, 5%, 3%, 2%, 1%, or 0.5% of a given value or range.

[0025] The ordinal numbers used in the specification and claims, such as "first," "second," etc., to modify elements, do not in themselves imply or represent any prior ordinal number of that element (or those elements), nor do they represent the order of one element with another, or the order of manufacturing processes. The use of these ordinal numbers is solely to clearly distinguish one named element from another element with the same name. The claims and specification may not use the same terminology; therefore, a first element in the specification may be a second element in the claims.

[0026] It should be understood that the features in the following embodiments can be replaced, recombined, or mixed to complete other embodiments without departing from the spirit of this disclosure. Features between embodiments can be arbitrarily mixed and combined as long as they do not violate the spirit of the invention or conflict with it.

[0027] The electrical connections or couplings described in this disclosure can refer to direct or indirect connections. In the case of a direct connection, the endpoints of the components in two circuits are directly connected or connected to each other by a conductor segment. In the case of an indirect connection, there is a switch, diode, capacitor, inductor, other suitable component, or combination of the above components between the endpoints of the components in two circuits, but not limited to these.

[0028] In this disclosure, the thickness, length, width, and area can be measured using an optical microscope, and the thickness can be measured from a cross-sectional image in an electron microscope, but these methods are not limited to these. Furthermore, any two values ​​or directions used for comparison may have a certain degree of error. If the first value equals the second value, it implies an error of approximately 10% between the two values; if the first direction is perpendicular to the second direction, the angle between the first and second directions may be between 80 and 100 degrees; if the first direction is parallel to the second direction, the angle between the first and second directions may be between 0 and 10 degrees.

[0029] The electronic devices disclosed herein may include, but are not limited to, displays, antennas, light-emitting devices, sensors, touchscreens, splicing devices, other suitable functions, or combinations thereof. Electronic devices include, but are not limited to, rollable or flexible electronic devices. Electronic devices may include, for example, diodes, liquid crystals, light-emitting diodes (LEDs), quantum dots (QDs), fluorescence, phosphorescence, other suitable materials, or combinations thereof. Light-emitting diodes may include, for example, organic light-emitting diodes (OLEDs), micro-LEDs, mini-LEDs, or quantum dot LEDs (QLEDs, QDLEDs), but are not limited to these. The following description uses display devices or splicing devices as examples of electronic devices, but this disclosure is not limited thereto.

[0030] Figure 1 This is a partial cross-sectional schematic diagram of the electronic device according to the first embodiment of this disclosure.

[0031] Please refer to Figure 1 The electronic device 10a of this embodiment includes a flexible substrate 100, a plurality of semiconductor elements 200 and a plurality of support elements 300.

[0032] The flexible substrate 100 may be made of materials such as polymethyl methacrylate (PMMA), polycarbonate (PC), polyimide (PI), polyethylene terephthalate (PET), or other suitable materials or combinations thereof, but this disclosure is not limited thereto. In some embodiments, the flexible substrate 100 has a first surface 100s1 and a second surface 100s2 opposite to each other. The first surface 100s1 of the flexible substrate 100 may be used, for example, to provide a component layer AC including components such as circuit structures (not shown), while the second surface 100s2 of the flexible substrate 100 may be used, for example, to provide a functional layer including a support layer and / or a heat dissipation layer, and this disclosure is not limited thereto. In this embodiment, a plurality of semiconductor elements 200 are disposed on the first surface 100s1 of the flexible substrate 100, and a plurality of support elements 300 are disposed on the second surface 100s2 of the flexible substrate 100.

[0033] Multiple semiconductor elements 200 are disposed, for example, on a first surface 100s1 of a flexible substrate 100, and are disposed on the first surface 100s1 of the flexible substrate 100 in an array arrangement, an interleaved arrangement (e.g., a pentile arrangement), or other manner, as disclosed herein. In some embodiments, adjacent semiconductor elements among the multiple semiconductor elements 200 have substantially equal pitches P1, as disclosed herein. The aforementioned pitch P1 may be the distance between the centers of adjacent semiconductor elements 200; or it may be, for example, the distance between corresponding edges of adjacent semiconductor elements 200, as disclosed herein. In some embodiments, the multiple semiconductor elements 200 may be disposed, for example, on the aforementioned element layer AC. The element layer AC may include circuit structures (not shown) to drive the multiple semiconductor elements 200. For example, the element layer AC may include multiple scan lines, multiple data lines, an insulating layer, capacitors, multiple transistors, and / or multiple electrodes, etc., but this disclosure is not limited thereto. In some embodiments, the element layer AC may include multiple lines but not transistors. In some embodiments, multiple semiconductor elements 200 may be electrically connected to the element layer AC via conductive pads (not shown), but this disclosure is not limited thereto. In this embodiment, the multiple semiconductor elements 200 include multiple light-emitting elements that can emit various suitable colors of light (e.g., red, green, blue, white, etc.) or UV light, but this disclosure is not limited thereto. In some embodiments, the multiple semiconductor elements 200 may include self-emissive materials. For example, the multiple semiconductor elements 200 may include diodes, organic light-emitting diodes (OLEDs), inorganic light-emitting diodes (LEDs), such as mini LEDs or micro LEDs, quantum dots (QDs), quantum dot light-emitting diodes (QLEDs, QDLEDs), fluorescence, phosphorescence, other suitable materials, or combinations of the above materials, but this disclosure is not limited thereto, and the size of the multiple semiconductor elements 200 may be adjusted as needed. In some embodiments, the plurality of semiconductor elements 200 may include non-self-emissive materials, such as liquid crystal molecules, electrophoretic display media, or other suitable media. The liquid crystal molecules may be liquid crystal molecules that can be rotated or switched by a vertical electric field or liquid crystal molecules that can be rotated or switched by a lateral electric field, but this disclosure is not limited thereto. In some embodiments, the electronic device 10a further includes a filling layer F. The filling layer F is, for example, disposed on the first surface 100s1 of the flexible substrate 100 and covers the plurality of semiconductor elements 200.For example, the filling layer F is disposed not only above the plurality of semiconductor elements 200, but also adjacent to or surrounding the plurality of semiconductor elements 200. Therefore, the filling layer F can, for example, be used to fix or protect the plurality of semiconductor elements 200. In some embodiments, the filling layer F includes a transparent material and a non-transparent material. For example, the material of the filling layer F may include epoxy resin, acrylic, other suitable materials, or combinations thereof. In some embodiments, the filling layer F may include a single-layer structure or a composite layer structure, and this disclosure is not limited thereto. It is worth noting here that although this embodiment uses the example of multiple semiconductor elements 200 including multiple light-emitting elements, it does not mean that this application is only applicable to electronic devices 10a including multiple light-emitting elements; that is, the electronic device 10a of this application may also be an antenna device, a sensing device, or a splicing device, etc.

[0034] Multiple support elements 300 may be selectively disposed on, for example, a first surface 100s1 or a second surface 100s2 of the flexible substrate 100; or, multiple support elements 300 may be disposed on both the first surface 100s1 and the second surface 100s2 of the flexible substrate 100, and this disclosure is not limited thereto. In this embodiment, multiple support elements 300 are disposed on the second surface 100s2 of the flexible substrate 100; however, this disclosure is not limited thereto. In some embodiments, multiple support elements 300 are disposed on the first surface 100s1 of the flexible substrate 100. In some embodiments, multiple support elements 300 may be disposed on both the first surface 100s1 and the second surface 100s2 of the flexible substrate 100. In this embodiment, at least one of the multiple support elements 300 at least partially overlaps with one of the multiple semiconductor elements 200 in the normal direction N of the flexible substrate 100, but this disclosure is not limited thereto. In some embodiments, at least one of the plurality of support elements 300 may not overlap with one of the plurality of semiconductor elements 200 in the normal direction N of the flexible substrate 100. In this embodiment, the plurality of support elements 300 comprises a single-layer structure, but this disclosure is not limited thereto. In some embodiments, the plurality of support elements 300 may comprise a multi-layer structure. In some embodiments, adjacent support elements among the plurality of support elements 300 have an equal pitch P2. The aforementioned pitch P2 may be the distance between the centers of adjacent support elements 300; or it may be the distance between corresponding edges of adjacent support elements 300, and this disclosure is not limited thereto. For example, such as Figure 1As shown, the pitches P21 between support elements 300a and 300b, P22 between support elements 300b and 300c, and P23 between support elements 300c and 300d are substantially equal to each other, but this disclosure is not limited thereto. In some embodiments, adjacent support elements among the plurality of support elements 300 may have unequal pitches P2. In this embodiment, the pitch P2 between adjacent support elements among the plurality of support elements 300 may be an integer multiple of the pitch P1 between adjacent semiconductor elements among the plurality of semiconductor elements 200. Specifically, the pitch P2 between adjacent support elements 300 and the pitch P1 between adjacent semiconductor elements 200 may have the following relationship: P2:P1 = n:1, where n is a positive integer. For example, in Figure 1 In the illustrated embodiment, adjacent support elements 200 have an equal pitch P2, and the pitch P2 can be 1 times the pitch P1 between adjacent semiconductor elements 200 (n=1), where n is a fixed positive integer. It is worth noting that although n=1 is used as an example, this does not mean that the relationship between pitch P2 and pitch P1 disclosed herein only applies to the case of n=1; that is, n in the relationship between pitch P2 and pitch P1 disclosed herein can also be a positive integer other than 1. Furthermore, the size of the support element 300 disclosed herein is not particularly limited. In some embodiments, the size of the support element 300 is determined by the size of the semiconductor element 200, but this disclosure is not limited thereto.

[0035] In some embodiments, a plurality of support elements 300 may be formed on the second surface 100s2 of the flexible substrate 100 by suitable processes such as dispensing, coating, or printing, and this disclosure is not limited thereto. The materials of the plurality of support elements 300 may be, for example, organic or inorganic materials, and this disclosure is not limited thereto. For example, the materials of the plurality of support elements 300 may be, for example, adhesives. However, the materials of the plurality of support elements 300 may also be, for example, photosensitive materials, thermally sensitive materials, other suitable materials, or combinations thereof, and this disclosure is not limited thereto.

[0036] In some embodiments, the electronic device 10a may further include a cover plate CP, an antistatic layer, etc. The cover plate CP is disposed on the fill layer F and at least partially covers a plurality of semiconductor elements 200, which can reduce the influence of the external environment on the components inside the electronic device 10a. The antistatic layer may be disposed on the fill layer F, which can reduce the influence of static electricity (ESD) on the components inside the electronic device 10a.

[0037] Figure 2 This is a partial cross-sectional schematic diagram of the electronic device according to the second embodiment of this disclosure. It should be noted that... Figure 2 The embodiments can be used Figure 1 The component references and partial contents of the embodiments are as follows, wherein the same or similar references are used to represent the same or similar components, and the description of the same technical content is omitted.

[0038] Figure 2 The electronic device 10b differs from one of the aforementioned electronic devices 10a in that adjacent support elements 300 may have unequal pitch P2. Specifically, in Figure 2 In the illustrated electronic device 10b, adjacent support elements 300a and 300b have a pitch P21, and adjacent support elements 300b and 300c have a pitch P22, where pitch P21 is smaller than pitch P22. Although the pitches P21 and P22 shown in this embodiment are not equal, both pitches P21 and P22 are n times the pitch P1 between adjacent semiconductor elements 200. Specifically, Figure 2 The pitch P21 shown is 1 times the pitch P1 between adjacent semiconductor elements 200 (n=1), and Figure 2 The pitch P22 shown is twice the pitch P1 between adjacent semiconductor elements 200 (n=2). Additionally, Figure 2 The relationship between pitch P2 and pitch P1 shown can also be a positive integer other than 1 or 2, which will not be elaborated here.

[0039] Figure 3 This is a partial cross-sectional schematic diagram of the electronic device according to the third embodiment of this disclosure. It should be noted that... Figure 3 The embodiments can be used Figure 1 The component references and partial contents of the embodiments are as follows, wherein the same or similar references are used to represent the same or similar components, and the description of the same technical content is omitted.

[0040] Figure 3 The electronic device 10c differs from one of the aforementioned electronic devices 10a in that the density of the plurality of support elements 300 on the flexible substrate 100 increases with increasing distance from the circuit board (not shown) to the region 100R. In some embodiments, the flexible substrate 100 may include a region 100R on which the circuit board is disposed, wherein the circuit board is located on one side of the flexible substrate 100. The circuit board may, for example, include a rigid circuit board or a flexible circuit board. For example, the circuit board may be a flexible printed circuit board (FPC), but this disclosure is not limited thereto. In addition, the circuit board may, for example, further include a driver chip (not shown) and a connector (not illustrated), but this disclosure is not limited thereto. Figure 3As shown, there is a pitch P21 between support element 300a and support element 300b and between support element 300b and support element 300c, a pitch P22 between support element 300c and support element 300d and between support element 300d and support element 300e, and a pitch P23 between support element 300e and support element 300f and between support element 300f and support element 300g. Support elements 300g, 300f, 300e, 300d, 300c, 300b and support element 300a are arranged in this order away from the area 100R where the circuit board (not shown) is provided. In this embodiment, pitch P21 can be 1 times the pitch P1 between adjacent semiconductor elements 200 (n=1), pitch P22 can be 2 times the pitch P1 between adjacent semiconductor elements 200 (n=2), and pitch P23 can be 3 times the pitch P1 between adjacent semiconductor elements 200 (n=3). Based on the arrangement relationship between the support elements 300a to 300g described in this embodiment, the stress on the electronic device 10c can be reduced, thereby avoiding the problem of warping of the electronic device 10c in this embodiment. It is worth noting that although the example given here is that pitch P2 increases by 1 time (e.g., the relationship between pitch P21 and pitch P22), this disclosure is not limited to this. That is, the case where pitch P2 increases by more than 2 times each time or the case where pitch P2 increases by different multiples each time also applies to the electronic device 10c disclosed in this disclosure. In some embodiments, the aforementioned region 100R may also be provided with a region for fixing the flexible substrate 100 mechanism (not shown), wherein the region for fixing the flexible substrate 100 mechanism may be located on one side of the flexible substrate 100. In some embodiments, the aforementioned support elements 300a to 300g may also be provided as follows: Figure 6 On the first surface 100s1 on the same side as multiple semiconductor elements 200.

[0041] Figure 4 This is a partial cross-sectional schematic diagram of the electronic device according to the fourth embodiment of this disclosure. It should be noted that... Figure 4 The embodiments can be used Figure 1 The component references and partial contents of the embodiments are as follows, wherein the same or similar references are used to represent the same or similar components, and the description of the same technical content is omitted.

[0042] Figure 4The electronic device 10d differs from one of the aforementioned electronic devices 10a in that at least one of the plurality of support elements 300 does not overlap with one of the plurality of semiconductor elements 200 in the normal direction N of the flexible substrate 100. Furthermore, although adjacent support elements among the plurality of support elements 300 in this embodiment may have equal pitches P2 (e.g., the pitch P21 between adjacent support elements 300a and support element 300b is equal to the pitch P22 between adjacent support elements 300b and support element 300c), and the pitch P2 may be 1 times the pitch P1 between adjacent semiconductor elements 200 (n=1), this disclosure is not limited thereto. In some embodiments, adjacent support elements among the plurality of support elements 300 may also have unequal pitches P2; or n in the relationship between pitch P2 and pitch P1 may be a positive integer other than 1, which will not be elaborated here. In some embodiments, each of the plurality of support elements 300 may not overlap with one of the plurality of semiconductor elements 200 in the normal direction N of the flexible substrate 100.

[0043] Figure 5A This is a partial cross-sectional schematic diagram of the electronic device according to the fifth embodiment of this disclosure, and Figure 5B This is a partial cross-sectional schematic diagram of the electronic device according to the sixth embodiment of this disclosure. It should be noted that... Figure 5A as well as Figure 5B The embodiments can be used Figure 4 The component references and partial contents of the embodiments are as follows, wherein the same or similar references are used to represent the same or similar components, and the description of the same technical content is omitted.

[0044] Figure 5A Electronic devices 10e and Figure 5B The electronic device 10f differs from one of the aforementioned electronic devices 10d in that the plurality of support elements 300 include a multi-layer structure. For example... Figure 5A The electronic device 10e includes a plurality of support elements 300, including a first support element 302 and a second support element 304. The width of the first support element 302 is greater than the width of the second support element 304, and the first support element 302 may be located between the second support element 304 and the flexible substrate 100. The first support element 302 and the second support element 304 in the electronic device 10e may be sequentially disposed on the second surface 100s2 of the flexible substrate 100. For example, the second support element 304 may contact the first support element 302 but not the second surface 100s2 of the flexible substrate 100, but this disclosure is not limited thereto. Figure 5BThe plurality of support elements 300 in the electronic device 10f may include a first support element 302 and a second support element 304, wherein the width of the first support element 302 is smaller than the width of the second support element 304, and the second support element 304 covers the first support element 302. The first support element 302 and the second support element 304 in the electronic device 10f may be sequentially disposed on the second surface 100s2 of the flexible substrate 100, and since the width of the second support element 304 is larger than the width of the first support element 302, the second support element 304 may, for example, cover the first support element 302 and may contact the second surface 100s2 of the flexible substrate 100, but this disclosure is not limited thereto.

[0045] Furthermore, although adjacent support elements among the plurality of support elements 300 in this embodiment have an equal pitch P2, and the pitch P2 is 1 times the pitch P1 between adjacent semiconductor elements 200 (n=1), this disclosure is not limited thereto. In some embodiments, adjacent support elements among the plurality of support elements 300 may also have unequal pitches P2; or n in the relationship between pitch P2 and pitch P1 may also be a positive integer other than 1, which will not be elaborated here.

[0046] Figure 6 This is a partial cross-sectional schematic diagram of the electronic device according to the seventh embodiment of this disclosure. It should be noted that... Figure 6 The embodiments can be used Figure 4 The component references and partial contents of the embodiments are as follows, wherein the same or similar references are used to represent the same or similar components, and the description of the same technical content is omitted.

[0047] Figure 6The difference between the electronic device 10g and one of the aforementioned electronic devices 10d is that the plurality of support elements in the electronic device 10g can be disposed on the first surface 100s1 of the flexible substrate 100, that is, the plurality of semiconductor elements 200 and the plurality of support elements 300' are both disposed on the first surface 100s1 of the flexible substrate 100, and at least one of the plurality of support elements 300' is located between adjacent semiconductor elements 200. In some embodiments, the filling layer F covers the plurality of semiconductor elements 200 and the plurality of support elements 300', but this disclosure is not limited thereto. In addition, although adjacent support elements among the plurality of support elements 300' in this embodiment have equal pitches P2' (e.g., pitch P21' is equal to pitch P22'), and pitch P2' is 1 times the pitch P1 between adjacent semiconductor elements 200 (n=1), this disclosure is not limited thereto. In other embodiments, adjacent support elements among the plurality of support elements 300' may also have unequal pitches P2'; or n in the relationship between pitch P2' and pitch P1 may also be a positive integer other than 1, which will not be elaborated here. In some embodiments, each of the plurality of support elements 300' may be located between adjacent semiconductor elements 200.

[0048] Figure 7A This is a partial cross-sectional schematic diagram of the electronic device according to the eighth embodiment of this disclosure, and Figure 7B This is a partial cross-sectional schematic diagram of the electronic device according to the ninth embodiment of this disclosure. It should be noted that... Figure 7A as well as Figure 7B The embodiments can be used Figure 6 The component references and partial contents of the embodiments are as follows, wherein the same or similar references are used to represent the same or similar components, and the description of the same technical content is omitted.

[0049] Figure 7A Electronic devices 10h and Figure 7B The difference between electronic device 10i and the aforementioned electronic device 10g is that both electronic device 10h and electronic device 10i further include a plurality of support elements 300 disposed on the second surface 100s2 of the flexible substrate 100. For example... Figure 7A As shown, the electronic device 10h includes a support element 300' disposed on a first surface 100s1 of the flexible substrate 100 and a support element 300 disposed on a second surface 100s2 of the flexible substrate 100, and the support element 300 and the support element 300' are disposed corresponding to each other, for example. Figure 7BAs shown, the electronic device 10i also includes a support element 300 disposed on a second surface 100s2 of the flexible substrate 100 and a support element 300' disposed on a first surface 100s1 of the flexible substrate 100. The support elements 300 and 300' are disposed, for example, alternately arranged with each other. The support elements 300 in the electronic device 10i may be disposed, for example, corresponding to the semiconductor element 200. In some embodiments, the plurality of support elements 300 disposed on the second surface 100s2 also have equal pitches P2 (for example, pitch P21 is equal to pitch P22).

[0050] In some embodiments, adjacent support elements among the plurality of support elements 300 and adjacent support elements among the plurality of support elements 300' each have equal pitches P2 and P2', and both pitches P2 and P2' are 1 times the pitch P1 between adjacent semiconductor elements 200 (n=1), but this disclosure is not limited thereto. In some embodiments, adjacent support elements among the plurality of support elements 300 and adjacent support elements among the plurality of support elements 300' may also have unequal pitches P2 and P2'; or n in the relationship between pitches P2 and P1 and between pitches P2' and P1 may be a positive integer other than 1, which will not be elaborated here.

[0051] Figure 8 This is a perspective view of a support element in an electronic device according to some embodiments disclosed herein, and Figures 9A to 9L This is a top view schematic diagram of the support element in the electronic device of the various embodiments disclosed herein.

[0052] exist Figure 8 and Figures 9A to 9L In the process, multiple support elements 300 include arcuate structures, wherein the arcuate structure design reduces stress in the electronic device. The arcuate structures included in the multiple support elements 300 are, for example, as shown below. Figure 8 The arcuate structure shown is not limited to this disclosure. The arcuate structures included in the plurality of support elements 300 may, for example, have a point-like, line-like, wavy, or combination thereof orthogonal projection in the normal direction N of the flexible substrate 100, and this disclosure is not limited to this. For example, Figures 9A to 9D The support element 300 is shown to have a linear orthographic projection in the normal direction N of the flexible substrate 100. Figure 9F The support element 300 is shown to have a wavy orthographic projection in the normal direction N of the flexible substrate 100. Figure 9G The image shows a dashed orthographic projection of the support element 300 onto the normal direction N of the flexible substrate 100. Figures 9H to 9J The diagram shows the orthographic projection of the support element 300 in the normal direction N of the flexible substrate 100, which is a combination of straight and dashed lines. Figure 9KThe support element 300 is shown to have a point-chain-like orthographic projection in the normal direction N of the flexible substrate 100, and Figure 9L The diagram shows the support element 300 having a two-point chain-like orthographic projection in the normal direction N of the flexible substrate 100. Furthermore, although the foregoing embodiments all show multiple support elements 300 disposed in the display area of ​​the electronic device, multiple support elements 300 can also be disposed in the non-display area of ​​the electronic device 10a. That is, multiple support elements 300 can, for example, be formed as a line spanning both the display area and the non-display area in the normal direction N of the flexible substrate 100, but this disclosure is not limited thereto. Moreover, although... Figures 9A to 9L The plurality of support elements 300 are shown to be disposed on one surface of the flexible substrate 100, but it should be noted that the plurality of support elements 300 may be selectively disposed on two surfaces of the flexible substrate 100, as shown in the foregoing embodiments, and will not be described again here.

[0053] Figure 10 This is a top view schematic diagram of an electronic device that discloses some embodiments.

[0054] Figure 10 The diagram shows at least one of the plurality of support elements 300 having a linear orthographic projection in the normal direction N of the flexible substrate 100, and at least one of the plurality of support elements 300 does not overlap with one of the plurality of semiconductor elements 200 in the normal direction N of the flexible substrate 100, but it should be noted that this disclosure is not limited thereto. Furthermore, although adjacent support elements among the plurality of support elements 300 in this embodiment have equal pitches P2, and pitch P2 is 1 times the pitch P1 between adjacent semiconductor elements 200 (n=1), this disclosure is not limited thereto. In some embodiments, adjacent support elements among the plurality of support elements 300 may also have unequal pitches P2; or n in the relationship between pitch P2 and pitch P1 may be a positive integer other than 1, which will not be elaborated here. In some embodiments,

[0055] Based on the above, the disclosed embodiment provides multiple support elements in the electronic device, which can reduce the impact of internal or external stress on the electronic device and reduce damage to the electronic components therein.

[0056] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions disclosed herein, and are not intended to limit them. Although the present disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments disclosed herein. Features between the embodiments can be arbitrarily mixed and matched as long as they do not violate the spirit of the invention or conflict with it.

Claims

1. An electronic device, characterized in that, include: A flexible substrate having a first surface and a second surface opposite to each other; Multiple semiconductor elements are disposed on the first surface; as well as Multiple support elements are disposed on the second surface. The support element includes an arc-shaped structure. The adjacent support elements among the plurality of support elements have unequal pitches. The flexible substrate includes a region where a circuit board is disposed, and the density of the plurality of support elements on the flexible substrate increases with the distance from the circuit board.

2. The electronic device according to claim 1, characterized in that, The pitch between adjacent support elements in the plurality of support elements is an integer multiple of the pitch between adjacent semiconductor elements in the plurality of semiconductor elements.

3. The electronic device according to claim 1, characterized in that, The plurality of support elements have a point-like, line-like, or combination thereof shape when projected onto the normal direction of the flexible substrate.

4. The electronic device according to claim 1, characterized in that, The multiple support elements include single-layer or multi-layer structures.

5. An electronic device, characterized in that, include: A flexible substrate having a first surface and a second surface opposite to each other; as well as Multiple semiconductor elements and multiple support elements are disposed on the first surface; as well as The support element includes an arc-shaped structure. At least one of the plurality of support elements disposed on the first surface is located between adjacent semiconductor elements. The adjacent support elements among the plurality of support elements have unequal pitches. The flexible substrate includes a region where a circuit board is disposed, and the density of the plurality of support elements on the flexible substrate increases with the distance from the circuit board.

6. The electronic device according to claim 5, characterized in that, The pitch between adjacent support elements in the plurality of support elements is an integer multiple of the pitch between adjacent semiconductor elements in the plurality of semiconductor elements.

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