Display device and method for manufacturing the same

Abstract

Disclosed is a display device and a method for manufacturing the same, the display device including: a substrate including a display area and a non-display area; a light emitting element layer in the display area and the non-display area; a color conversion layer including a bank, a cap layer, a plurality of color filters, and an overcoat layer, the bank being in the display area and the non-display area, the cap layer being in the display area and the non-display area and covering the bank, the plurality of color filters being in the display area and the non-display area, and the plurality of color filters in the non-display area being stacked on each other, the overcoat layer being in the display area and the non-display area and covering the plurality of color filters. Each of the substrate, the cap layer, the plurality of color filters, and the overcoat layer has a lateral side farthest from the display area, and the lateral sides of each of the substrate, the cap layer, the plurality of color filters, and the overcoat layer are aligned with each other.

Description

Technical Field

[0001] This disclosure relates to a display device and a method for manufacturing the same. Background Technology

[0002] Display devices are becoming increasingly important in the development of multimedia. In response to this trend, various types of display devices, such as organic light-emitting diode (OLED) displays and liquid crystal displays (LCDs), have been adopted.

[0003] The display device for displaying images has a display panel such as an organic light-emitting display panel or a liquid crystal display panel. The light-emitting display panel may include light-emitting elements. For example, a light-emitting diode (LED) as a light-emitting element may include an organic light-emitting diode (OLED) that uses organic materials as light-emitting materials or an inorganic light-emitting diode that uses inorganic materials as light-emitting materials. Summary of the Invention

[0004] Embodiments of this disclosure provide a display device and a method for manufacturing the display device, which reduces or effectively prevents light leakage at the edges of the display device and peeling defects of the embankment and optical functional layers.

[0005] The effects of this disclosure are not limited to those mentioned above. Other features and advantages of this disclosure not mentioned may be understood based on the following description and may be more clearly understood based on embodiments of this disclosure. Furthermore, it will be readily understood that the effects and advantages of this disclosure can be achieved using the means and combinations thereof shown in the claims.

[0006] According to an embodiment, a display device includes: a substrate including a display area and a non-display area; a light-emitting element layer on the substrate and in the display area; a dam on the light-emitting element layer and in the display area, wherein the dam extends from the display area to the non-display area; a cover layer on the dam and in both the display area and the non-display area to cover the dam; a first outer cover layer on the cover layer and in both the display area and the non-display area to cover the cover layer; a plurality of color filters on the first outer cover layer in both the display area and the non-display area, wherein the plurality of color filters are vertically stacked in the non-display area; a second outer cover layer on the plurality of color filters in both the display area and the non-display area to cover the plurality of color filters; and an optical functional layer on the second outer cover layer in both the display area and the non-display area, wherein the lateral sides of the substrate, the lateral sides of the cover layer, the lateral sides of the first outer cover layer, the lateral sides of each of the plurality of color filters, and the lateral sides of the second outer cover layer are aligned with each other.

[0007] In one embodiment, the lateral side of the embankment may be spaced apart from the lateral side of the base, such that the lateral side of the embankment is closer to the display area than the lateral side of the base.

[0008] In an embodiment, the display device may further include: a first insulating layer between the substrate and the light-emitting element layer, wherein a portion of the capping layer in the non-display area may contact the first insulating layer and extend parallel to the substrate.

[0009] In one embodiment, the portion of the cover layer may be located between the lateral side of the base and the lateral side of the embankment.

[0010] In one embodiment, the lateral side of the first insulating layer may be aligned with the lateral side of the substrate.

[0011] In an embodiment, a plurality of color filters may include a first color filter and a second color filter that allow light of different first and second colors to be transmitted through them, wherein, in a non-display area, the second color filter may be on a first outer cover layer and the first color filter may be on the second color filter.

[0012] In an embodiment, the display device may further include a third color filter, wherein the third color filter may be on the first color filter and in a non-display area, wherein the third color filter allows light of a third color, different from the first color and the second color, to be transmitted through it.

[0013] In an embodiment, the light-emitting element layer may include: a plurality of light-emitting elements in the display area and on a substrate; and a thin-film encapsulation layer on the plurality of light-emitting elements, wherein the thin-film encapsulation layer may include a first encapsulation inorganic layer on the plurality of light-emitting elements, an encapsulation organic layer on the first encapsulation inorganic layer, and a second encapsulation inorganic layer on the encapsulation organic layer.

[0014] In an embodiment, each of the plurality of light-emitting elements may include an organic light-emitting diode or an inorganic light-emitting diode.

[0015] In one embodiment, the lateral side of the optical functional layer may be aligned with the lateral side of the substrate.

[0016] In an embodiment, the lateral side of the optical functional layer can be positioned as extending outward beyond the lateral side of the substrate, or it can be positioned inside the lateral side of the substrate.

[0017] In an embodiment, the display device may further include a plurality of partition walls and support structures in a non-display area of ​​the substrate, wherein the plurality of partition walls and support structures may be covered by a dam and stacked with a plurality of color filters.

[0018] In one embodiment, the display device may further include a first trench in a non-display area of ​​the substrate and in a dam, wherein the first trench may surround the display area.

[0019] In one embodiment, the first trench may have a closed-loop shape.

[0020] According to an embodiment, a method for providing or manufacturing a display device includes: providing a substrate including a display area and a non-display area; providing a light-emitting element layer on the substrate and in the display area; providing a dam on the light-emitting element layer and providing a first trench in the dam; providing a cover layer on the dam and the first trench to cover the dam and the first trench; providing a first outer cover layer on the cover layer to cover the cover layer; vertically stacking a plurality of color filters on the first outer cover layer and in the non-display area; providing a second outer cover layer on the stack of the plurality of color filters to cover the stack of the plurality of color filters; scribing a line on the substrate along a scribing line corresponding to the first trench; and providing an optical functional layer on the second outer cover layer.

[0021] In an embodiment, the method may further include polishing the substrate, wherein the polishing occurs between the step of scribing the substrate and the step of setting the optical functional layer.

[0022] In an embodiment, the method may further include polishing the substrate after the step of setting the optical functional layer.

[0023] In one embodiment, a step of polishing the substrate may be performed such that the lateral sides of the substrate, the lateral sides of the capping layer, the lateral sides of the first outer cover layer, and the lateral sides of each of the plurality of color filters are aligned with each other.

[0024] According to an embodiment, a display device includes: a substrate including a display area and a non-display area; a light-emitting element layer on the substrate and in the display area; a dam on the light-emitting element layer and in the display area, wherein the dam extends from the display area to the non-display area; a cover layer on the dam and in both the display area and the non-display area to cover the dam; a first outer cover layer on the cover layer and in both the display area and the non-display area to cover the cover layer; a plurality of color filters on the first outer cover layer in both the display area and the non-display area, wherein the plurality of color filters are vertically stacked in the non-display area; a second outer cover layer on the plurality of color filters in both the display area and the non-display area to cover the plurality of color filters; and an optical functional layer on the second outer cover layer in both the display area and the non-display area, wherein the lateral sides of the substrate, the lateral sides of the cover layer, the lateral sides of the first outer cover layer, the lateral sides of each of the plurality of color filters, and the lateral sides of the second outer cover layer are aligned with each other, wherein the vertical level of the top surface of the second outer cover layer in the non-display area is equal to the vertical level of the top surface of the second outer cover layer in the display area.

[0025] In an embodiment, the vertical horizontality of the top surface of the first outer cover in the display area may be greater than the vertical horizontality of the top surface of the first outer cover in the non-display area.

[0026] In an embodiment, the vertical horizontality of the top surface of the dike in the display area can be greater than the vertical horizontality of the top surface of the dike in the non-display area.

[0027] According to the display device based on the embodiment, the lateral side of the dike can be located inside the lateral side of the base, so that peeling defects of the dike caused by external moisture or oxygen can be reduced or effectively prevented.

[0028] Furthermore, placing multiple color filters in non-display areas can reduce or effectively prevent light leakage in these areas. Planarization of the top surface of the second outer coating can reduce or effectively prevent peeling defects in the optical functional layers.

[0029] The effects of this disclosure are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the following description. Attached Figure Description

[0030] The above and other features of this disclosure will become more apparent from the detailed description of embodiments thereof with reference to the accompanying drawings, wherein: Figure 1A This is a schematic plan view of an embodiment of the display device; Figure 1B yes Figure 1A An enlarged plan view of region B; Figure 2 yes Figure 1A An enlarged plan view of region A; Figure 3 It is along Figure 2 A sectional view taken by line A-A' in the middle; Figure 4 It is along Figure 2 A sectional view taken by line B-B' in the middle; Figure 5 This is a plan view schematically illustrating an embodiment of the display device; Figures 6 to 13 This is a diagram illustrating an embodiment of a process for providing or manufacturing a display device; Figure 14 This is a diagram illustrating an embodiment of a process for providing or manufacturing a display device; Figure 15 This is a cross-sectional view showing an embodiment of the display area of ​​the display device; Figure 16 This is a cross-sectional view showing an embodiment of the display area and non-display area of ​​the display device; Figure 17 This is a perspective view schematically illustrating an embodiment of a light-emitting diode; Figures 18 to 24 These are views illustrating embodiments of the display device; Figure 25 It is a planar image of an embodiment of the display device; and Figure 26 This is a cross-sectional view of an embodiment of the display device. Detailed Implementation

[0031] The invention will now be described more fully below with reference to the accompanying drawings, in which embodiments of the invention are illustrated. However, the invention may be embodied in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0032] It will also be understood that when a layer is referred to in relation to another element, such as "on" another layer or substrate, the element may be directly on that other layer or substrate, or there may be an intermediate layer. Conversely, when a layer is referred to in relation to another element, such as "directly on" another layer or substrate, there is no other layer, substrate, or intermediate layer. Throughout the specification, the same reference numerals denote the same components. As used herein, reference numerals may denote a single element or multiple elements. For example, reference numerals that mark elements in the singular form in the figures may be used to denote multiple elements in the text of the specification.

[0033] It will be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, the first element discussed below may be referred to as the second element without departing from the teachings of the invention. Similarly, the second element may also be referred to as the first element.

[0034] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, unless the context clearly indicates otherwise, “a,” “the,” and “at least one” do not indicate a limitation of quantity and are intended to include both the singular and the plural. For example, unless the context clearly indicates otherwise, “element” has the same meaning as “at least one element.” “At least one” will not be construed as limited to “a.” “Or” means “and / or.” As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. It will also be understood that when the terms “comprising,” “including,” and / or variations thereof are used in this specification, they indicate the presence of the stated features, regions, integrals, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, regions, integrals, steps, operations, elements, components, and / or groups thereof.

[0035] Furthermore, relative terms such as “below” or “bottom” and “above” or “top” may be used herein to describe the relationship between one element and another as shown in the accompanying drawings. It will be understood that relative terms are intended to include different orientations of the device other than those depicted in the drawings. For example, if the device in one of the drawings is flipped, an element described as being “below” the other element will subsequently be positioned “above” the other element. Thus, depending on the specific orientation of the drawing, the term “below” can include both “below” and “above” orientations. Similarly, if the device in one of the drawings is flipped, an element described as being “below” or “under” the other element will be positioned “above” the other element. Thus, the terms “below” or “under” can include both “above” and “below” orientations.

[0036] Given the measurement being discussed and the errors associated with the measurement of a specific quantity (i.e., the limitations of the measurement system), the terms “about” or “approximately” as used herein include the stated value and indicate an acceptable deviation from the specific value as determined by one of ordinary skill in the art. For example, “about” may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0037] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms (such as those defined in a general dictionary) shall be interpreted as having the same meaning as they have in the relevant field and in the context of this disclosure, and shall not be interpreted in an idealized or overly formal sense, unless expressly defined herein.

[0038] Here, embodiments are described with reference to schematic cross-sectional views as idealized embodiments. Thus, variations in the illustrated shapes, for example, due to manufacturing techniques and / or tolerances, will be expected. Therefore, the embodiments described herein should not be construed as limited to the specific shapes of the areas shown herein, but will include variations in shape, for example, due to manufacturing processes. For example, areas shown or described as flat may generally have rough and / or non-linear characteristics. Furthermore, the sharp corners shown may be rounded. Therefore, the areas shown in the figures are schematic in nature, and their shapes are not intended to show the precise shapes of the areas, nor are they intended to limit the scope of the claims.

[0039] Each of the features in the various embodiments of this disclosure may be combined in part or in whole, or in part or in whole with each other, and may be technically interlocked and driven in various ways. Each embodiment may be implemented independently of each other, or may be implemented together in association.

[0040] In the following description, embodiments will be illustrated with reference to the accompanying drawings.

[0041] Figure 1A This is a schematic plan view of an embodiment of the display device 10. Figure 1B yes Figure 1A A magnified plan view of region B.

[0042] Reference Figure 1A and Figure 1B The display device 10 displays video (e.g., moving images) or still images. The display device 10 can refer to any electronic device that provides a display screen. In embodiments, for example, the display device 10 may include a television, laptop computer, monitor, billboard, Internet of Things device, mobile phone, smartphone, tablet PC (personal computer), electronic watch, smartwatch, watch phone, head-mounted display (HMD), mobile communication terminal, electronic notebook, e-book, PMP (portable multimedia player), navigation device, gaming device, digital camera, camcorder, etc.

[0043] Display device 10 may include a display panel that provides a display screen. Examples of display panels may include inorganic light-emitting diode (LED) display panels, organic light-emitting diode (OLED) display panels, quantum dot (QD) light-emitting diode (LED) display panels, plasma display panels, and field emission display panels. Examples in which an OLED display panel or an inorganic LED display panel is implemented as a display panel will be described below. However, this disclosure is not limited thereto. This disclosure may also be applied to other display panels where the same technical concept can be applied.

[0044] In the following figures, which describe an embodiment of the display device 10, a first direction DR1, a second direction DR2, and a third direction DR3 are defined. The first direction DR1 and the second direction DR2 may intersect each other or be perpendicular to each other and together define a plane. The third direction DR3 may be orthogonal to the plane defined by the intersecting first direction DR1 and the intersecting second direction DR2. The third direction DR3 intersects or is perpendicular to each of the first direction DR1 and the second direction DR2. In the embodiment describing the display device 10, the third direction DR3 represents the thickness direction of the display device 10 and its various components or layers.

[0045] In the plan view, the display device 10 may have a rectangular shape including a long side and a short side, wherein the long side extends in or along a first direction DR1, and the short side extends in or along a second direction DR2. In the plan view, the corner portion where the long side and the short side of the display device 10 intersect may form a right angle. However, the disclosure is not limited thereto. The corner portion may have a rounded shape. The planar shape of the display device 10 is not limited to the shape shown, and may have other shapes such as a square, a rectangular shape with rounded corners, other polygons, and circles.

[0046] The display surface of the display device 10 can be defined as the side furthest from the third direction DR3, which is the thickness direction. In embodiments describing the display device 10, unless otherwise stated, "upward direction" refers to the display direction toward the side of the third direction DR3, and "top surface" refers to the surface facing the side of the third direction DR3 (e.g., the surface furthest along the third direction DR3). Furthermore, in embodiments describing the display device 10, unless otherwise stated, "downward direction" refers to the direction toward the opposite side of the third direction DR3, thus indicating a direction opposite to the display direction, and "bottom surface" refers to the surface facing the opposite side of the third direction DR3, for example, the surface furthest in the direction opposite to the third direction DR3. Additionally, "left," "right," "top," and "bottom" indicate the orientation of the display device 10 in a plan view. In embodiments, for example, "right" refers to the direction toward the side of the first direction DR1, "left" refers to the direction toward the opposite side of the first direction DR1, "top" refers to the direction toward the side of the second direction DR2, and "bottom" refers to the direction toward the opposite side of the second direction DR2.

[0047] The display device 10 may include a display area DPA and a non-display area NDA adjacent to the display area DPA. The display area DPA refers to the planar area that can define a display screen, while the non-display area NDA refers to the planar area that does not define a display screen. The display area DPA may be referred to as the effective area, and the non-display area NDA may be referred to as the ineffective area.

[0048] The shape of the display area DPA can be conformal to the overall shape of the display device 10. In an embodiment, for example, the shape of the display area DPA can be a rectangle that resembles the overall shape of the display device 10 in a plan view. The display area DPA can generally occupy the interior area of ​​the display device 10.

[0049] The display area DPA may include a plurality of pixels PX arranged in a plurality of configurations. The plurality of pixels PX may be arranged in a matrix. In a planar diagram, the planar shape of each pixel PX may be rectangular or square. However, the disclosure is not limited thereto. Its shape may be a rhombus in which each side is inclined relative to a direction. Pixel PX may be arranged in strips or pen tiles. ® Furthermore, each of the pixels PX may include one or more light-emitting elements ED that emit light within a wavelength band to display a color corresponding to that wavelength band.

[0050] A non-display area NDA can be disposed adjacent to a display area DPA, such as surrounding the display area DPA. The non-display area NDA can completely or partially surround the display area DPA. The display area DPA can have a rectangular shape, and each portion of the non-display area NDA can be disposed adjacent to each of the four sides of the display area DPA. The non-display area NDA can form the frame of the display device 10. Lines (e.g., conductive lines, signal lines, etc.) or circuit drivers included in the display device 10 can be disposed in each non-display area NDA. External devices can be installed in the non-display area NDA.

[0051] Figure 2 yes Figure 1A An enlarged plan view of an embodiment of region A. Figure 3 It is along Figure 2 The sectional view taken by line A-A' in the middle. Figure 4 It is along Figure 2 The sectional view taken by line B-B' in the figure. Figure 5 This is a plan view schematically showing an embodiment of the display device 10.

[0052] Reference Figure 2 Multiple light-emitting regions LA1, LA2, and LA3, and a non-light-emitting region NLA, can be defined within a display area DPA. Each of the light-emitting regions LA1, LA2, and LA3 can refer to the area where light generated from the light-emitting element ED is emitted to the outside of the display device 10, and the non-light-emitting region NLA can refer to the area where light generated from the light-emitting element ED is not emitted to the outside of the display device 10. In an embodiment, the first light-emitting region LA1, the second light-emitting region LA2, and the third light-emitting region LA3 can be arranged sequentially and repeatedly along a first direction DR1 within the display area DPA. The first light-emitting region LA1, the second light-emitting region LA2, and the third light-emitting region LA3 can have the same width or different widths measured along the first direction DR1.

[0053] The emitting regions LA1, LA2, and LA3 can emit light beams of different colors. In an embodiment, the first emitting region LA1 can emit light of a first color, the second emitting region LA2 can emit light of a second color, and the third emitting region LA3 can emit light of a third color. In an embodiment, the first color light can be blue light having a peak wavelength in the range of about 440 nanometers (nm) to about 480 nm, and the second color light can be red light having a peak wavelength in the range of about 610 nm to about 650 nm. Furthermore, the third color light can be green light having a peak wavelength in the range of about 510 nm to about 550 nm. However, this disclosure is not limited thereto. The second color light can be green light, and the third color light can be red light.

[0054] The structure of the display area DPA of the display device 10 will be described in more detail below.

[0055] Combination Figure 2 Reference Figure 3 The display device 10 may include a substrate SUB, a light-emitting element layer EML disposed on the substrate SUB, a color conversion layer CCL disposed on the light-emitting element layer EML, and an optical functional layer LFL disposed on the color conversion layer CCL.

[0056] The substrate SUB can be an insulating substrate. The substrate SUB can include a transparent material. In embodiments, for example, the substrate SUB can include a transparent insulating material such as glass or quartz. The substrate SUB can be a rigid substrate. However, the substrate SUB is not limited to this and can include plastics such as polyimide, and can be flexible, i.e., it can be bent, folded, or rolled (e.g., bendable, foldable, or rollable). Multiple luminescent regions LA1, LA2, and LA3, as well as a non-luminescent region NLA, can be defined as planar regions within the substrate SUB.

[0057] Switching elements T1, T2, and T3 can be disposed on the substrate SUB. In one embodiment, the first switching element T1 can be located in the first light-emitting region LA1 of the substrate SUB, the second switching element T2 can be located in the second light-emitting region LA2, and the third switching element T3 can be located in the third light-emitting region LA3. However, this disclosure is not limited thereto. In another embodiment, at least one of the first switching element T1, the second switching element T2, and the third switching element T3 can be located in the non-light-emitting region NLA.

[0058] In an embodiment, each of the first switching element T1, the second switching element T2, and the third switching element T3 may be implemented as a thin-film transistor comprising amorphous silicon, polycrystalline silicon, or oxide semiconductor. Although not shown in the figures, multiple signal lines (e.g., gate lines, data lines, power lines, etc.) that transmit signals (e.g., electrical signals) to each of the switching elements T1, T2, and T3 may further be located on the substrate SUB. Furthermore, each of the switching elements T1, T2, and T3 may include a first insulating layer 120. In an embodiment, for example, the first insulating layer 120 may serve as a gate insulating film or interlayer insulating film of the thin-film transistor. The gate insulating film or interlayer insulating film may be made of silicon oxide (SiO2). x ), silicon oxynitride (SiO) x N y ) and silicon nitride (SiN) x It may consist of a single layer or multiple layers of one of the following: . However, the embodiments are not limited thereto. The first insulating layer 120 may be an insulating layer between the substrate SUB and the light-emitting element layer EML, such as a planarization layer or a buffer layer.

[0059] The second insulating layer 130 may be disposed on the first switching element T1, the second switching element T2, and the third switching element T3. In an embodiment, the second insulating layer 130 may act as a planarization film. In an embodiment, the second insulating layer 130 may be composed of an organic film. In an embodiment, for example, the second insulating layer 130 may include acrylic resin, epoxy resin, imide resin, or ester resin. In an embodiment, the second insulating layer 130 may include a positive photosensitive material or a negative photosensitive material.

[0060] The first anode AE1, the second anode AE2, and the third anode AE3 may be located on the second insulating layer 130. The first anode AE1 may be located in the first light-emitting region LA1, with at least a portion extending into the non-light-emitting region NLA. The second anode AE2 may be located in the second light-emitting region LA2, with at least a portion extending into the non-light-emitting region NLA. The third anode AE3 may be located in the third light-emitting region LA3, with at least a portion extending into the non-light-emitting region NLA. The first anode AE1 may extend through the second insulating layer 130 and may be connected to the first switching element T1. The second anode AE2 may extend through the second insulating layer 130 and may be connected to the second switching element T2. The third anode AE3 may extend through the second insulating layer 130 and may be connected to the third switching element T3.

[0061] In embodiments, the widths or planar areas of the first anode AE1, the second anode AE2, and the third anode AE3 may differ from each other. The widths or planar areas may be truncated along one or more directions of the plane (such as along the substrate SUB, in the first direction DR1, in the second direction DR2, etc.). In embodiments, for example, the width of the first anode AE1 may be smaller than the width of the second anode AE2, while the width of the third anode AE3 may be smaller than the width of the second anode AE2 and larger than the width of the first anode AE1. Optionally, the area of ​​the first anode AE1 may be smaller than the area of ​​the second anode AE2, while the area of ​​the third anode AE3 may be smaller than the area of ​​the second anode AE2 and larger than the area of ​​the first anode AE1. Optionally, the area of ​​the first anode AE1 may be smaller than the area of ​​the second anode AE2, while the area of ​​the third anode AE3 may be larger than each of the areas of the second anode AE2 and the first anode AE1. However, the disclosure is not limited to the embodiments described above. In another embodiment, the widths or areas of the first anode AE1, the second anode AE2, and the third anode AE3 may be substantially the same as each other.

[0062] Each of the first anode AE1, the second anode AE2, and the third anode AE3 can be implemented as a reflective electrode. Each of the first anode AE1, the second anode AE2, and the third anode AE3 can have a film stack structure in which a first film and a second film are stacked, the first film being made of a material with a high work function (such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), and indium oxide (In2O3)), and the second film being made of a reflective material (such as silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), lead (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), or combinations thereof). The first film made of the material with a high work function can be disposed on the top surface of the second film made of the reflective material, such that the first film can be closer to the light-emitting layer OL than the second film. Each of the first anode AE1, the second anode AE2, and the third anode AE3 may have a multilayer structure such as ITO / Mg, ITO / MgF2, ITO / Ag, or ITO / Ag / ITO. This disclosure is not limited thereto.

[0063] A pixel defining film 150 can be disposed on a first anode AE1, a second anode AE2, and a third anode AE3. The pixel defining film 150 may include or define pixel openings exposing the first anode AE1, the second anode AE2, and the third anode AE3. The pixel defining film 150 can define a first light-emitting region LA1, a second light-emitting region LA2, a third light-emitting region LA3, and a non-light-emitting region NLA. That is, a portion of the area of ​​the first anode AE1 that is not covered by the pixel defining film 150 but can be exposed through the corresponding pixel opening can serve as the first light-emitting region LA1. A portion of the area of ​​the second anode AE2 that is not covered by the pixel defining film 150 but can be exposed through the pixel opening can serve as the second light-emitting region LA2. A portion of the area of ​​the third anode AE3 that is not covered by the pixel defining film 150 but can be exposed through the pixel opening can serve as the third light-emitting region LA3. The remaining portion of the pixel defining film 150 can serve as the non-light-emitting region NLA.

[0064] The pixel-defining film 150 may include at least one organic insulating material selected from polyacrylate resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenylene sulfide resin, and benzocyclobutene (BCB).

[0065] In an embodiment, the pixel defining film 150 may be stacked with the dam 180 of the color conversion layer CCL, which will be described later. The light-emitting layer OL may be disposed on the first anode AE1, the second anode AE2, and the third anode AE3. In an embodiment where the display device 10 is implemented as an organic light-emitting display device, the light-emitting layer OL may include an organic layer comprising organic material. The organic layer may include an organic light-emitting layer. In some cases, the organic layer may also include an auxiliary layer for supporting light emission. The auxiliary layer may include at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer. In an embodiment, the light-emitting layer OL may have a series structure comprising a plurality of organic light-emitting layers stacked in the thickness direction and a charge-generating layer disposed between adjacent organic light-emitting layers. The plurality of organic light-emitting layers stacked in the thickness direction may emit light of the same wavelength or may emit light beams of different wavelengths.

[0066] In an embodiment, the light-emitting layer OL may have the shape of a continuous film disposed or formed over multiple light-emitting regions LA1, LA2, and LA3 and a non-light-emitting region NLA. In this case, the wavelengths of the light beams emitted from the light-emitting layer OL may be the same. In an embodiment, for example, the light-emitting layer OL may emit blue light or ultraviolet light in the multiple light-emitting regions LA1, LA2, and LA3.

[0067] The cathode CE can be disposed on the light-emitting layer OL. In embodiments, the cathode CE can be semi-transmissive or transmissive. When the cathode CE is semi-transmissive, it can comprise Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, or combinations thereof (e.g., a combination of Ag and Mg) or a material having a multilayer structure such as LiF / Ca or LiF / Al. Furthermore, when the thickness of the cathode CE is in the range of tens to hundreds of angstroms, the cathode CE can have semi-transmissive properties.

[0068] When the cathode CE is transmissive, the cathode CE may include a transparent conductive oxide (TCO). In embodiments, for example, the cathode CE may include W x O y Tungsten oxide, TiO2 (titanium oxide), ITO (indium tin oxide), IZO (indium zinc oxide), ZnO (zinc oxide), ITZO (indium tin zinc oxide), MgO (magnesium oxide), etc.

[0069] The first anode AE1, the emitting layer OL, and the cathode CE can constitute the first light-emitting element ED1. The second anode AE2, the emitting layer OL, and the cathode CE can constitute the second light-emitting element ED2. The third anode AE3, the emitting layer OL, and the cathode CE can constitute the third light-emitting element ED3. Each of the first light-emitting element ED1, the second light-emitting element ED2, and the third light-emitting element ED3 can emit its own source light, which can be incident on the color conversion layer CCL. Each of the first light-emitting element ED1, the second light-emitting element ED2, and the third light-emitting element ED3 can function as an organic light-emitting diode (OLED).

[0070] A thin-film encapsulation layer 170 may be disposed on the cathode CE. The thin-film encapsulation layer 170 may be commonly located within the first light-emitting region LA1, the second light-emitting region LA2, the third light-emitting region LA3, and the non-light-emitting region NLA. In an embodiment, the thin-film encapsulation layer 170 may directly cover the cathode CE. Elements that are directly related to or in direct contact with each other (e.g., directly covering each other) may form interfaces or boundaries therebetween, but are not limited thereto.

[0071] In an embodiment, the thin-film encapsulation layer 170 may include a first encapsulation inorganic layer 171, an encapsulation organic layer 173, and a second encapsulation inorganic layer 175 sequentially stacked on the cathode CE (e.g., from a plurality of light-emitting elements ED in sequence).

[0072] Each of the first encapsulation inorganic layer 171 and the second encapsulation inorganic layer 175 may include at least one selected from silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide, cerium oxide, silicon oxynitride, and lithium fluoride. The encapsulation organic layer 173 may include at least one selected from acrylic resin, methacrylate resin, polyisoprene, vinyl resin, epoxy resin, polyurethane resin, cellulose resin, and perylene resin.

[0073] However, the structure of the thin-film encapsulation layer 170 is not limited to the example described above. The stacking structure of the thin-film encapsulation layer 170 can be modified in various ways.

[0074] In this example, the color conversion layer CCL can be disposed on the light-emitting element layer EML, which includes the thin-film encapsulation layer 170. That is, the color conversion layer CCL can face the substrate SUB, and the light-emitting element layer EML is located between the color conversion layer CCL and the substrate SUB.

[0075] The color conversion layer (CCL) may include a dam 180, a light-transmitting pattern 230, a first wavelength conversion pattern 240, a second wavelength conversion pattern 250, and a color filter layer 210.

[0076] A barrier 180 may be disposed on the thin-film encapsulation layer 170. The barrier 180 may be superimposed on the non-light-emitting region NLA to block light transmission. More specifically, the barrier 180 may be located between the light-transmitting pattern 230 and the first wavelength conversion pattern 240 and between the first wavelength conversion pattern 240 and the second wavelength conversion pattern 250, and may reduce or effectively prevent color mixing between adjacent light-emitting regions.

[0077] Dam 180 may include an organic light-blocking material and may be formed via a coating and exposure process of the organic light-blocking material or via an inkjet process of the organic light-blocking material. In embodiments, for example, dam 180 may include an organic material and a dye or pigment having light-blocking properties and combined with the organic material. The organic material may include at least one selected from acrylic resins, methacrylate resins, polyisoprene, vinyl resins, epoxy resins, polyurethane resins, cellulose resins, and perylene resins. The dye or pigment may include carbon black, etc.

[0078] The light-transmitting pattern 230 can be disposed on the thin-film encapsulation layer 170. In an embodiment, the light-transmitting pattern 230 can be formed by applying, exposing, and developing a photosensitive material. However, this disclosure is not limited thereto. Each of the light-transmitting pattern 230, the first wavelength conversion pattern 240, and the second wavelength conversion pattern 250 can be formed using an inkjet printing method.

[0079] The light-transmitting pattern 230 can be superimposed on the first light-emitting region LA1. The light-transmitting pattern 230 allows incident light to pass through without color or wavelength conversion. As described above, the source light provided from the first light-emitting element ED1 can be blue light. The blue light source can pass through the light-transmitting pattern 230.

[0080] In an embodiment, the light-transmitting pattern 230 may include a first matrix resin 231, and may also include a first scattering material 233 dispersed in the first matrix resin 231 (e.g., a plurality of first scattering materials 233).

[0081] The first matrix resin 231 may include a material with high transmittance. In an embodiment, the first matrix resin 231 may include an organic material. In an embodiment, for example, the first matrix resin 231 may include an organic material such as an epoxy resin, an acrylic resin, a calorie resin, or an imide resin.

[0082] The first scattering material 233 may have a refractive index different from that of the first matrix resin 231. An optical interface may be formed between the first scattering material 233 and the first matrix resin 231. In an embodiment, for example, the first scattering material 233 may be implemented as light-scattering particles. There are no specific limitations on the first scattering material 233, as long as it can scatter at least a portion of the transmitted light. The first scattering material 233 may be, for example, metal oxide particles or organic particles. Examples of metal oxides may include titanium oxide (TiO2), zirconium oxide (ZrO2), aluminum oxide (Al2O3), indium oxide (In2O3), zinc oxide (ZnO), or tin oxide (SnO2). The material of the organic particles may include acrylic resin or polyurethane resin. Regardless of the incident direction of the incident light, the first scattering material 233 may scatter light in random directions, and the first scattering material 233 may substantially not change the wavelength of the light passing through the light-transmitting pattern 230.

[0083] The first wavelength conversion pattern 240 and the second wavelength conversion pattern 250 can be disposed on the thin film encapsulation layer 170.

[0084] The first wavelength conversion pattern 240 can be disposed on the thin-film encapsulation layer 170 and can be superimposed or correspond to the second light-emitting region LA2. The first wavelength conversion pattern 240 can convert or transform the peak wavelength of the incident light into different peak wavelengths and can output light with different peak wavelengths. In an embodiment, the first wavelength conversion pattern 240 can convert the source light provided from the second light-emitting element ED2 into red light with a peak wavelength in the range of about 610 nm to about 650 nm.

[0085] The first wavelength conversion pattern 240 may include a second matrix resin 241 and a first wavelength converter 245 dispersed in the second matrix resin 241, and may also include a second scattering material 243 dispersed in the second matrix resin 241.

[0086] The second matrix resin 241 may include a material having high transmittance. In an embodiment, the second matrix resin 241 may include an organic material. The second matrix resin 241 may include the same material as the first matrix resin 231, or may include at least one of the materials exemplified above as constituent materials of the first matrix resin 231.

[0087] The first wavelength converter 245 can convert or transform the peak wavelength of light incident on the first wavelength converter 245 into different peak wavelengths. In an embodiment, the first wavelength converter 245 can convert light of the first color, blue light, provided from the second light-emitting element ED2 into red light having a single peak wavelength in the range of about 610 nm to about 650 nm and emit red light.

[0088] Examples of the first wavelength converter 245 may include quantum dots, quantum rods, or phosphors. In embodiments, for example, a quantum dot may be a particulate material that emits light when an electron transitions from the conduction band to the valence band.

[0089] Quantum dots can be made from semiconductor nanocrystal materials. Quantum dots can have a band gap based on their composition and size to absorb light and then emit light with a unique wavelength. Examples of semiconductor nanocrystal materials for quantum dots can include group IV nanocrystals, group II-VI compound nanocrystals, group III-V compound nanocrystals, group IV-VI compound nanocrystals, or combinations thereof.

[0090] Group II-VI compounds may be selected from: binary compounds selected from CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnO, HgS, HgSe, HgTe, MgSe, MgS and combinations thereof; and compounds selected from InZnP, AgInS, CuInS, CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, CdZnSe. Ternary compounds consisting of CdZnTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, MgZnSe, MgZnS and combinations thereof; and quaternary compounds selected from HgZnTeS, CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSeS, HgZnSeTe, HgZnSTe and combinations thereof.

[0091] III-V group compounds may be selected from: binary compounds selected from GaN, GaP, GaAs, GaSb, AlN, AlP, AlAs, AlSb, InN, InP, InAs, InSb and combinations thereof; ternary compounds selected from GaNP, GaNAs, GaNSb, GaPAs, GaPSb, AlNP, AlNAs, AlNSb, AlPAs, AlPSb, InGaP, InNP, InAlP, InNAs, InNSb, InPAs, InPSb and combinations thereof; and quaternary compounds selected from GaAlNP, GaAlNAs, GaAlNSb, GaAlPAs, GaAlPSb, GaInNP, GaInNAs, GaInNSb, GaInPAs, GaInPSb, InAlNP, InAlNAs, InAlNSb, InAlPAs, InAlPSb and combinations thereof.

[0092] Group IV-VI compounds may be selected from: binary compounds selected from SnS, SnSe, SnTe, PbS, PbSe, PbTe and combinations thereof; ternary compounds selected from SnSeS, SnSeTe, SnSTe, PbSeS, PbSeTe, PbSTe, SnPbS, SnPbSe, SnPbTe and combinations thereof; and quaternary compounds selected from SnPbSSe, SnPbSeTe, SnPbSTe and combinations thereof. Group IV elements may be selected from Si, Ge and combinations thereof. Group IV compounds may be binary compounds selected from SiC, SiGe and combinations thereof.

[0093] In this respect, binary, ternary, or quaternary compounds can be contained in the particles at a uniform concentration. Optionally, binary, ternary, and quaternary compounds can be contained in the particles at the same concentration. Optionally, binary, ternary, or quaternary compounds can be contained in the particles in a concentration gradient manner. Optionally, binary, ternary, and quaternary compounds can be contained in the same particles at the same concentration.

[0094] Furthermore, the first wavelength converter 245 may have a core / shell structure in which one quantum dot surrounds another quantum dot. The interface between the core and the shell may have a concentration gradient in which the concentration of the element present in the shell decreases in the direction toward the center.

[0095] In embodiments, quantum dots may have a core-shell structure comprising a core containing the aforementioned nanocrystals and a shell surrounding the core. The shell of the quantum dot may serve as a protective layer to reduce or effectively prevent chemical degradation of the core to maintain its semiconductor properties and / or as a charging layer to impart electrophoretic capability to the quantum dot. The shell may consist of a single layer or multiple layers. Examples of shells for quantum dots may include oxides of metals or nonmetals, semiconductor compounds, or combinations thereof.

[0096] In embodiments, for example, oxides of metals or oxides of nonmetals may include binary compounds such as SiO2, Al2O3, TiO2, ZnO, MnO, Mn2O3, Mn3O4, CuO, FeO, Fe2O3, Fe3O4, CoO, Co3O4, and NiO, or ternary compounds such as MgAl2O4, CoFe2O4, NiFe2O4, and CoMn2O4. This disclosure is not limited thereto.

[0097] In addition, the semiconductor compounds may include CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnSeS, ZnTeS, GaAs, GaP, GaSb, HgS, HgSe, HgTe, InAs, InP, InGaP, InSb, AlAs, AlP, AlSb, etc. This disclosure is not limited thereto.

[0098] The light emitted from the first wavelength converter 245 can have a full width at half maximum (FWHM) of a wavelength spectrum equal to or less than about 45 nm, or equal to or less than about 40 nm, or equal to or less than about 30 nm. Therefore, the color gamut and reproducibility of the colors displayed from the display device 10 can be further improved. Furthermore, regardless of the incident direction of the incident light, the light emitted from the first wavelength converter 245 can be emitted in several directions. Therefore, the lateral visibility of the second color displayed from the second light-emitting region LA2 can be improved.

[0099] A portion of the source light supplied from the second light-emitting element ED2 may not have been converted to red light by the first wavelength converter 245. However, a color filter disposed thereon can be used to block the portion of the source light that has not been converted to red light. Instead, the red light converted by the first wavelength conversion pattern 240 can pass through the color filter and be emitted outside the color filter layer 210.

[0100] The second scattering material 243 may have a refractive index different from that of the second matrix resin 241. An optical interface may be formed between the second scattering material 243 and the second matrix resin 241. In an embodiment, for example, the second scattering material 243 may be implemented as light-scattering particles. Further specific descriptions of the second scattering material 243 may be substantially the same as or similar to further specific descriptions of the first scattering material 233, and therefore may be omitted.

[0101] The second wavelength conversion pattern 250 can be disposed on the thin-film encapsulation layer 170 and can be superimposed on the third light-emitting region LA3. The second wavelength conversion pattern 250 can convert or transform the peak wavelength of the light incident on the second wavelength conversion pattern 250 into different peak wavelengths, and can output light with different peak wavelengths. In an embodiment, the second wavelength conversion pattern 250 can convert the source light provided from the third light-emitting element ED3 into green light with a peak wavelength in the range of about 510 nm to about 550 nm.

[0102] The second wavelength conversion pattern 250 may include a third matrix resin 251 and a second wavelength converter 255 dispersed in the third matrix resin 251, and may also include a third scattering material 253 dispersed in the third matrix resin 251. The third matrix resin 251 may include a material with high transmittance. In embodiments, the third matrix resin 251 may include an organic material. The third matrix resin 251 may include the same material as the first matrix resin 231, or may include at least one of the materials exemplified above as constituting materials of the first matrix resin 231.

[0103] The second wavelength converter 255 can convert or transform the peak wavelength of light incident on the second wavelength converter 255 into different peak wavelengths and output light with different peak wavelengths. In an embodiment, the second wavelength converter 255 can convert blue light with a peak wavelength in the range of 440nm to 480nm into green light with a peak wavelength in the range of 510nm to 550nm.

[0104] Examples of the second wavelength converter 255 may include quantum dots, quantum rods, or phosphors. A more specific description of the second wavelength converter 255 may be substantially the same as or similar to the above description of the first wavelength converter 245, and therefore may be omitted. In an embodiment, each of the first wavelength converter 245 and the second wavelength converter 255 may be composed of quantum dots. In this case, the particle size of the quantum dots constituting the first wavelength converter 245 may be larger than the particle size of the quantum dots constituting the second wavelength converter 255.

[0105] The third scattering material 253 may have a refractive index different from that of the third matrix resin 251, allowing an optical interface to be formed between the third scattering material 253 and the third matrix resin 251. In embodiments, for example, the third scattering material 253 may be implemented as light-scattering particles. Further specific descriptions of the third scattering material 253 may be substantially the same as or similar to those of the second scattering material 243, and therefore may be omitted.

[0106] The second wavelength conversion pattern 250 can receive source light emitted from the third light-emitting element ED3. The second wavelength converter 255 can convert the source light provided from the third light-emitting element ED3 into green light having a peak wavelength in the range of about 510 nm to about 550 nm, and can output green light.

[0107] A portion of the source light, which is blue light supplied from the third light-emitting element ED3, may not be converted to green light by the second wavelength converter 255. However, the portion of the source light that is not converted to green light can be blocked by a color filter disposed on the second wavelength converter 255. Instead, the green light converted by the first wavelength conversion pattern 240 can pass through the color filter and be emitted to the outside of the color filter layer 210.

[0108] The color conversion layer (CCL) may also include a cover layer 190. The cover layer 190 may be disposed on the dam 180, the light-transmitting pattern 230, the first wavelength conversion pattern 240, and the second wavelength conversion pattern 250, and may cover the dam 180, the light-transmitting pattern 230, the first wavelength conversion pattern 240, and the second wavelength conversion pattern 250. Therefore, damage or contamination of the dam 180, the light-transmitting pattern 230, the first wavelength conversion pattern 240, and the second wavelength conversion pattern 250, which would otherwise be damaged or contaminated due to the intrusion of impurities such as moisture or air from the outside, can be reduced or effectively prevented.

[0109] The capping layer 190 may be made of or comprise inorganic materials. In embodiments, for example, the capping layer 190 may comprise at least one of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide, and silicon oxynitride.

[0110] The color conversion layer CCL may also include an overcoat layer such as a first overcoat layer 200. The first overcoat layer 200 may be disposed on the capping layer 190. Regardless of any steps formed on the bottom surface of the first overcoat layer 200 opposite to its top surface, the top surface of the first overcoat layer 200 can be flattened. Therefore, a color filter layer 210, as described later, can be easily formed on the top surface of the first overcoat layer 200.

[0111] The first outer coating 200 may be made of an organic material. In embodiments, for example, the first outer coating 200 may include acrylic resin, methacrylate resin, polyisoprene, imide resin, vinyl resin, epoxy resin, polyurethane resin, cellulose resin, or perylene resin.

[0112] A color filter layer 210 may be disposed on the first outer cover layer 200. The color filter layer 210 may include a first color filter 211, a second color filter 213, and a third color filter 215. Each of the first color filter 211, the second color filter 213, and the third color filter 215 may be disposed in multiples along the direction of the substrate SUB. The plurality of first color filters 211, the plurality of second color filters 213, and the plurality of third color filters 215 may respectively define the first color filter layer, the second color filter layer, and the third color filter layer.

[0113] The first color filter 211 can be disposed on one surface of the first outer cover layer 200 and superimposed on the first light-emitting area LA1. In addition, the first color filter 211 can be superimposed on the first light-emitting element ED1 and the light-transmitting pattern 230.

[0114] The first color filter 211 allows light of a first color (e.g., blue light) to selectively pass through it, and can block or absorb light of a second color (e.g., red light) and a third color (e.g., green light). In an embodiment, the first color filter 211 may be implemented as a blue color filter and may include a blue colorant such as a blue dye or blue pigment. According to this disclosure, the colorant may include both dyes and pigments.

[0115] The second color filter 213 can be stacked with the second light-emitting region LA2, and can also be stacked with the second light-emitting element ED2 and the first wavelength conversion pattern 240. In an embodiment, one side of the second color filter 213 can be stacked with the non-light-emitting region NLA, and can be spaced apart from the first color filter 211 adjacent to the second color filter 213. The opposite side of the second color filter 213 can be stacked with the non-light-emitting region NLA and can be spaced apart from the third color filter 215.

[0116] The second color filter 213 can block or absorb light of the first color, such as blue light. That is, the second color filter 213 can function as a blue light blocking filter. The second color filter 213 can selectively transmit light of the second color (e.g., red light) through it, and can block or absorb light of the first color and light of the third color (e.g., green light). In embodiments, for example, the second color filter 213 can be implemented as a red color filter and can include a red colorant such as a red dye or red pigment.

[0117] The third color filter 215 can be stacked with the third light-emitting region LA3, and can also be stacked with the third light-emitting element ED3 and the second wavelength conversion pattern 250. In an embodiment, one side of the third color filter 215 can be stacked with the non-light-emitting region NLA, and can be spaced apart from the second color filter 213 adjacent to the third color filter 215. Furthermore, the opposite side of the third color filter 215 can be stacked with the non-light-emitting region NLA, and can be spaced apart from the first color filter 211 adjacent to the third color filter 215.

[0118] The third color filter 215 can block or absorb light of the first color. That is, the third color filter 215 can be used as a blue light blocking filter. The third color filter 215 allows light of the third color to selectively pass through it, and can block or absorb light of the first color and the second color. In an embodiment, for example, the third color filter 215 can be implemented as a green color filter and can include a green colorant such as a green dye or green pigment.

[0119] In the accompanying drawings, the first color filter 211, the second color filter 213, and the third color filter 215 are shown spaced apart from each other. This disclosure is not limited thereto. A light-blocking pattern (not shown), such as a black matrix, may be disposed between the first color filter 211, the second color filter 213, and the third color filter 215.

[0120] Furthermore, the accompanying drawings show a light-transmitting pattern 230 and a first color filter 211 disposed in a first light-emitting region LA1, a first wavelength conversion pattern 240 and a second color filter 213 disposed in a second light-emitting region LA2, and a second wavelength conversion pattern 250 and a third color filter 215 disposed in a third light-emitting region LA3. However, this disclosure is not limited thereto. In another example, the first wavelength conversion pattern 240 and the second color filter 213 may be disposed in the first light-emitting region LA1. In yet another example, the second wavelength conversion pattern 250 and the third color filter 215 may be disposed in the first light-emitting region LA1.

[0121] The color conversion layer CCL may further include a second overcoat 220. The second overcoat 220 may be disposed on the first color filter 211, the second color filter 213, and the third color filter 215. Regardless of any steps formed on the bottom surface of the second overcoat 220, the top surface of the second overcoat 220 may be planarized, and a planarization layer may be defined. Therefore, as described later, the second overcoat 220 can improve the adhesion reliability of the optical functional layer LFL to the color conversion layer CCL.

[0122] The second outer coating 220 may be made of an organic material. The second outer coating 220 may be the same organic material as the first outer coating 200 as described above. However, the disclosure is not limited thereto. The first outer coating 200 and the second outer coating 220 may be made of different organic materials.

[0123] An optical functional layer (LFL) can be disposed on the color conversion layer (CCL). The LFL can be implemented as an anti-reflective layer to reduce or prevent reflection of external light from outside the display device 10. The LFL can be attached as a film or formed by coating. However, this disclosure is not limited thereto. The LFL can also be implemented as an anti-fingerprint layer.

[0124] In the example, when the light-blocking member is not disposed on the outside of the non-display area NDA surrounding the display area DPA of the display device 10, light leakage from the display area DPA may occur. Furthermore, when the top surface of the second outer cover layer 220 in the non-display area NDA is tilted, the optical functional layer LFL attached to the top surface of the second outer cover layer 220 may detach from it due to film stress. Additionally, when the dam 180 of the color conversion layer CCL is exposed to the outside to define the outside of the non-display area NDA, external moisture or oxygen can penetrate the dam 180, potentially causing film peeling defects. In the embodiment, the color filter layer 210 may be disposed at the edge of the non-display area NDA to prevent light leakage and detachment of the optical functional layer LFL. Furthermore, preventing the dam 180 from being exposed to the outside of the non-display area NDA can reduce or effectively prevent peeling defects of the dam 180.

[0125] The structure of the non-display area NDA of the display device 10 will be described in detail below. As described above, the arrangement of the light-transmitting pattern 230, the first wavelength conversion pattern 240, and the second wavelength conversion pattern 250 can be varied; therefore, the arrangement of the first color filter 211, the second color filter 213, and the third color filter 215 can also be varied. In the following text, the arrangement of the first color filter 211, the second color filter 213, and the third color filter 215 will be varied in relation to the above-described... Figure 2 and Figure 3 The order will vary, and an example in which the first wavelength conversion pattern 240 and the second color filter 213 are superimposed on the first emitting region LA1 will be described. However, the disclosure is not limited thereto.

[0126] Combination Figure 2 and Figure 3 Reference Figure 4 and Figure 5 Not only can multiple layers extend from the display area DPA to the non-display area NDA, but multiple partition walls BR1 and BR2 and support structure 135 (e.g., multiple protruding portions) can also be provided in the non-display area NDA of the display device 10.

[0127] Specifically, a first insulating layer 120 extending from the display area DPA can be disposed on the substrate SUB and in the non-display area NDA. The first insulating layer 120 can be configured to extend to the lateral side of the substrate SUB. The lateral side of the substrate SUB and the lateral side of the first insulating layer 120 can be aligned with each other (e.g., coplanar). In this disclosure, "lateral side," "lateral lateral surface," and "lateral lateral surface" are interchangeable terms.

[0128] Multiple partition walls BR1 and BR2 may be disposed on the first insulating layer 120. The multiple partition walls BR1 and BR2 may prevent the encapsulation organic layer 173 of the thin film encapsulation layer 170 from extending from the display area DPA.

[0129] The plurality of partition walls BR1 and BR2 may include a first partition wall BR1 adjacent to the display area DPA and a second partition wall BR2 spaced apart from the first partition wall BR1 in a direction toward the lateral side of the substrate SUB (e.g., away from the display area DPA). That is, the first partition wall BR1 is closer to the display area DPA than the second partition wall BR2.

[0130] The first partition wall BR1 may have a multilayer structure in which a first lower layer 131 and a first upper layer 151 are stacked. The first lower layer 131 may include the same material as the second insulating layer 130 of the display area DPA. The first lower layer 131 and the second insulating layer 130 may be formed using the same mask process. The first lower layer 131 may be directly disposed on the first insulating layer 120. The first upper layer 151 may be disposed on the first lower layer 131 and may include the same material as the pixel defining film 150. The first upper layer 151 and the pixel defining film 150 may be formed using the same mask process.

[0131] The second partition wall BR2 may have a multilayer structure in which a second lower layer 132 and a second upper layer 152 are stacked. The second lower layer 132 may include the same material as each of the second insulating layer 130 and the first lower layer 131 of the display area DPA. The second lower layer 132, the second insulating layer 130, and the first lower layer 131 may be formed using the same mask process. The second lower layer 132 may be disposed directly on the first insulating layer 120. The second lower layer 132, as well as the second insulating layer 130 and the first lower layer 131, may be corresponding patterns of the same material layers on the substrate SUB (e.g., in the same layers among the material layers on the substrate SUB).

[0132] The second upper layer 152 may be disposed on the second lower layer 132 and may include the same material as each of the pixel defining film 150 and the first upper layer 151. The second upper layer 152, the pixel defining film 150, and the first upper layer 151 may be formed using the same masking process. The second upper layer 152, as well as the pixel defining film 150 and the first upper layer 151, may be corresponding patterns of the same material layer on the substrate SUB.

[0133] A support structure 135 may be disposed on the first insulating layer 120. The support structure 135 may be disposed between the lateral side of the substrate SUB and the second partition wall BR2. The support structure 135 may be used to support the mask for forming the first encapsulation inorganic layer 171 and the second encapsulation inorganic layer 175 of the thin-film encapsulation layer 170, such that the mask can be supported on the substrate SUB. The support structure 135 may include the same material as the material of the second insulating layer 130 of the display area DPA. The support structure 135 and the second insulating layer 130 may be formed using the same masking process and may be corresponding patterns of the same material layer on the substrate SUB.

[0134] Multiple partition walls BR1 and BR2 and support structure 135 can be covered by embankment 180 in non-display area NDA and can be configured to overlap with extensions of multiple color filters 211 and 213.

[0135] In the example, the thin-film encapsulation layer 170 in the display area DPA can extend into the non-display area NDA, and thus can be partially disposed in the non-display area NDA to define an extended portion of the thin-film encapsulation layer 170. A first encapsulation inorganic layer 171 of the thin-film encapsulation layer 170 can extend into the non-display area NDA and is disposed on the first partition wall BR1 and the second partition wall BR2. The first encapsulation inorganic layer 171 can cover the first partition wall BR1 and the second partition wall BR2. The first encapsulation inorganic layer 171 can extend to the lateral side of the support structure 135. However, the disclosure is not limited thereto. The first encapsulation inorganic layer 171 can cover the support structure 135.

[0136] Furthermore, the encapsulation organic layer 173 of the thin-film encapsulation layer 170 may extend into the non-display area NDA and be disposed adjacent to the first partition wall BR1 (e.g., it may terminate at the first partition wall BR1). The encapsulation organic layer 173 may be disposed on the first encapsulation inorganic layer 171, while being spaced apart from the first partition wall BR1.

[0137] The second encapsulation inorganic layer 175 of the thin-film encapsulation layer 170 may extend into the non-display area NDA and may be partially disposed on the first partition wall BR1 and the second partition wall BR2. The second encapsulation inorganic layer 175 may cover the first partition wall BR1 and the second partition wall BR2. The second encapsulation inorganic layer 175 may extend to the lateral side of the support structure 135. However, the disclosure is not limited thereto. The second encapsulation inorganic layer 175 may cover the support structure 135.

[0138] A dam 180 may extend from the display area DPA into the non-display area NDA to define an extended portion of the dam 180. The dam 180 may extend to a position adjacent to the lateral side of the substrate SUB. The dam 180 may define a distal end or end surface closest to the lateral side of the substrate SUB. The dam 180 may cover the support structure 135, the first partition wall BR1, and the second partition wall BR2, such that the entire topmost surface of the underlying structure on the substrate SUB can be planarized. The top surface of the dam 180 may be planarized throughout the display area DPA and the entire non-display area NDA. However, the structure below the dam 180 and in the display area DPA may differ from the structure below the dam 180 in the non-display area NDA. Therefore, with respect to the distance or height relative to the substrate SUB, the vertical level of the top surface of the dam 180 in the non-display area NDA may be relatively lower than the vertical level of the top surface of the dam 180 in the display area DPA (e.g., closer to the substrate SUB than the vertical level of the top surface of the dam 180 in the display area DPA). In an embodiment, the vertical level of the top surface of the embankment 180 relative to the substrate SUB in the display area DPA may be higher or greater than the vertical level of the top surface of the embankment 180 relative to the substrate SUB in the non-display area NDA. However, this disclosure is not limited thereto. The vertical levels of the top surface of the embankment 180 relative to the substrate SUB in the display area DPA and the non-display area NDA may be the same as each other.

[0139] like Figure 5 As shown, in this embodiment, the distance between the lateral side (e.g., end surface) of the dam 180 and the display area DPA can be smaller than the distance between the lateral side (e.g., end surface) of the substrate SUB and the display area DPA. That is, the lateral side of the dam 180 can be positioned inside the lateral side of the substrate SUB (e.g., further away from the lateral side of the substrate SUB). As described above, when the dam 180 is exposed to the outside of the display device 10 on the lateral side of the substrate SUB, peeling defects of the dam 180 may occur due to external moisture or oxygen. Therefore, when the lateral side of the dam 180 is positioned inside the lateral side of the substrate SUB (e.g., spaced apart from the lateral side of the substrate SUB), that is, when the distance between the lateral side of the dam 180 and the display area DPA is smaller than the distance between the lateral side of the substrate SUB and the display area DPA, the exposure of the dam 180 to external moisture or oxygen can be reduced or effectively prevented.

[0140] The capping layer 190 can extend from the display area DPA into the non-display area NDA to define an extended portion of the capping layer 190. The capping layer 190 can extend from the display area DPA into the lateral side of the substrate SUB. The capping layer 190 can be disposed on the dam 180 to cover the dam 180 and protect the dam 180 from moisture or oxygen that may originate from outside the dam 180. The lateral side of the capping layer 190 can be aligned with the lateral side of the substrate SUB. Specifically, at the end surface of the dam 180, the capping layer 190 can have at least a portion in the non-display area NDA that contacts the first insulating layer 120 and extends parallel to the top surface of the substrate SUB.

[0141] The capping layer 190 can be made of inorganic materials. Therefore, during the scribing process of the substrate SUB, physical damage such as cracks may occur in the capping layer 190. Therefore, in order to remove cracks that may occur in the capping layer 190 during the scribing process, the capping layer 190 may have at least a portion in the non-display area NDA that can contact the first insulating layer 120 and extend parallel to the top surface of the substrate SUB. The portion of the capping layer 190 extending parallel to the top surface of the substrate SUB may be disposed between the lateral side of the substrate SUB and the lateral side of the embankment 180.

[0142] The first outer cover layer 200 can extend from the display area DPA into the non-display area NDA to define an extended portion of the first outer cover layer 200. The first outer cover layer 200 can extend from the display area DPA to the lateral side of the substrate SUB. The top surface of the first outer cover layer 200 can be planarized such that the entire topmost surface of the resulting structure on the substrate SUB can be planarized. The top surface of the first outer cover layer 200 can be planarized throughout the display area DPA and the entire non-display area NDA. However, the structure below the first outer cover layer 200 and in the display area DPA can differ from the structure below the first outer cover layer 200 in the non-display area NDA. Therefore, relative to the substrate SUB, the vertical level of the top surface of the first outer cover layer 200 in the non-display area NDA can be relatively lower than the vertical level of the top surface of the first outer cover layer 200 in the display area DPA. In an embodiment, the vertical horizontal plane of the top surface of the first outer cover 200 relative to the substrate SUB in the display area DPA may be higher than the vertical horizontal plane of the top surface of the first outer cover 200 relative to the substrate SUB in the non-display area NDA. However, this disclosure is not limited thereto. The vertical horizontal planes of the top surface of the first outer cover 200 relative to the substrate SUB in the display area DPA and the non-display area NDA may be the same as each other.

[0143] In an embodiment, the lateral side of the first outer cover 200 may be aligned with the lateral side of the substrate SUB. In the non-display area NDA, the first outer cover 200 may have a first portion vertically superimposed on the embankment 180 and a second portion not vertically superimposed on the embankment 180. The vertical dimension (i.e., thickness) of the second portion may be greater than the vertical dimension of the first portion. That is, the first outer cover 200 may fill the space between the lateral side of the embankment 180 and the lateral side of the substrate SUB, such that the entire top surface of the resulting structure on the substrate SUB can be planarized.

[0144] Multiple color filters 211 and 213 can define corresponding extensions, which are above the substrate SUB and within the non-display area NDA. The multiple color filters 211 and 213 can include a first color filter 211 and a second color filter 213. The second color filter 213 can be directly disposed on the first outer cover layer 200 and can extend from the display area DPA into the non-display area NDA. The lateral side of the second color filter 213 can be aligned with the lateral side of the substrate SUB. The first color filter 211 can be directly disposed on the second color filter 213 and can extend from the display area DPA into the non-display area NDA. The lateral side of the first color filter 211 can be aligned with the lateral side of the substrate SUB.

[0145] As described above, the first color filter 211 can be implemented as a blue color filter, and the second color filter 213 can be implemented as a red color filter. When beams of different colors are transmitted through the two color filters stacked vertically, light will not pass through the stack, and the stack can serve as a light-blocking pattern. In an embodiment, for example, when a red beam, a blue beam, and a green beam are incident on the stack of the first color filter 211 and the second color filter 213, only the red beam can pass through the second color filter 213, while the blue and green beams can be blocked by the second color filter 213. However, the red beam that has already passed through the second color filter 213 can be blocked by the first color filter 211, which allows the blue beam to pass through. Therefore, light can not pass through the stack and can be blocked by the stack.

[0146] In this embodiment, stacking two color filters 211 and 213 that transmit different colors respectively (i.e., stacking the first color filter 211 and the second color filter 213 in the non-display area NDA) can reduce or effectively prevent light leakage through the non-display area NDA. Therefore, light leakage can be suppressed.

[0147] In the example, the second cover layer 220 can be disposed on the substrate SUB and in the non-display area NDA. The second cover layer 220 can extend from the display area DPA into the non-display area NDA to define an extension of the second cover layer 220. The second cover layer 220 can cover the color filter layer 210 such that the top surface of the second cover layer 220 can be planarized, regardless of any steps formed on the bottom surface of the second cover layer 220. That is, the top surface of the second cover layer 220 can be planarized such that the entire top surface of the resulting structure on the substrate SUB can be planarized. The top surface of the second cover layer 220 can be planarized throughout the display area DPA and the entire non-display area NDA. Regardless of the color filter layer 210, the vertical level of the top surface of the second cover layer 220 in the non-display area NDA can be equal to the vertical level of the top surface of the second cover layer 220 in the display area DPA. Furthermore, the second outer cover 220 may extend to the lateral side of the base SUB, such that the lateral side of the second outer cover 220 may be aligned with the lateral side of the base SUB.

[0148] The optical functional layer LFL can be disposed on the substrate SUB and within the non-display area NDA. The optical functional layer LFL can extend from the display area DPA into the non-display area NDA, defining an extended portion of the optical functional layer LFL. In the non-display area NDA, due to the planarized top surface of the second outer cover layer 220, the optical functional layer LFL can be attached to or formed on the second outer cover layer 220 in a planarized manner. Therefore, peeling defects of the optical functional layer LFL that might otherwise occur when the bottom surface of the optical functional layer LFL is not planarized can be reduced or effectively prevented. Furthermore, the lateral sides of the optical functional layer LFL can be aligned with the lateral sides of the substrate SUB.

[0149] As described above, in one or more embodiments of the display device 10, the lateral side of the dam 180 may be disposed inside the lateral side of the substrate SUB and spaced apart from the lateral side of the substrate SUB. Therefore, peeling defects of the dam 180 caused by external moisture or oxygen can be suppressed. Furthermore, providing multiple different color filters in the non-display area NDA can provide light-blocking functionality and reduce or effectively prevent light leakage. Additionally, the top surface of the second outer cover layer 220 can be planarized, thereby reducing or effectively preventing peeling defects of the optical functional layer LFL that might otherwise occur if the bottom surface of the optical functional layer LFL is not planarized.

[0150] In the following, embodiments of methods for providing or manufacturing the display device 10 will be described.

[0151] Figures 6 to 13 This is a diagram illustrating the structure in an embodiment of a process for providing or manufacturing the display device 10. Figure 14This is a diagram illustrating an embodiment of a process for providing or manufacturing the display device 10. Figures 6 to 14 The focus will be on the processes used to manufacture a portion of the display area DPA of the display device 10 and the non-display area NDA of the display device 10. Therefore, Figures 6 to 14 It can correspond to Figure 4 A cross-sectional view. Since the processes used to manufacture each layer employ common methods such as photolithography or inkjet printing, their descriptions will be omitted.

[0152] Reference Figure 6 A first insulating layer 120, a first switching element T1, a second insulating layer 130, a first anode AE1, a pixel defining film 150, a light-emitting layer OL, a cathode CE, a first partition wall BR1, a second partition wall BR2, and a support structure 135 are formed on a substrate SUB. The first partition wall BR1, the second partition wall BR2, and the support structure 135 can be formed in the non-display area NDA, while the first switching element T1, the first anode AE1, the pixel defining film 150, the light-emitting layer OL, and the cathode CE can be formed in the display area DPA. The first insulating layer 120 can be formed throughout the display area DPA and the entire non-display area NDA. Each of the layers can be formed by performing a photolithographic patterning process using metal, organic, or inorganic materials, or a solution process such as an inkjet process using metal, organic, or inorganic materials.

[0153] A thin-film encapsulation layer 170 is formed by sequentially forming a first encapsulation inorganic layer 171, an encapsulation organic layer 173, and a second encapsulation inorganic layer 175 on a substrate SUB. The first encapsulation inorganic layer 171 and the second encapsulation inorganic layer 175 can be stacked across the display area DPA and the non-display area NDA using an aperture mask. The encapsulation organic layer 173 can be formed across the display area DPA and the non-display area NDA using a solution process such as an inkjet printing scheme.

[0154] Reference Figure 7 A dam material layer 181 is formed by applying a dam material over the entire surface of the substrate SUB. The dam material layer 181 may extend across the display area (DPA) and non-display area (NDA) of the substrate SUB. The dam material layer 181 may include an organic material and may be applied using a solution process such as inkjet printing or spin coating.

[0155] A photoresist pattern PR1 is formed on the embankment material layer 181. The photoresist pattern PR1 can expose at least a portion of the first luminescent area LA1 of the display area DPA and the non-display area NDA to the outside of the photoresist pattern PR1.

[0156] Reference Figure 8The dam 180 is formed by patterning the dam material layer 181 using a photoresist pattern PR1 as a mask. Specifically, an opening OP is formed by removing a portion of the dam material layer 181 corresponding to the first light-emitting region LA1 of the display region DPA. The opening OP partially exposes the thin-film encapsulation layer 170 to the outside of the dam 180. Furthermore, in the non-display region NDA, a portion of the dam material layer 181 is removed to form trenches such as the first trench TRE1.

[0157] like Figure 9 As shown, a first trench TRE1 can be formed in the dam 180. The first trench TRE1 can correspond to, but is not limited to, the lateral surface of the display device 10. The first trench TRE1 can extend to surround the display area DPA. The first trench TRE1 partially exposes the first insulating layer 120 formed on the substrate SUB to the outside of the dam 180. A portion of the dam 180 can be disconnected by the first trench TRE1. As the dam 180 extends from the display area DPA to the non-display area NDA, the dam 180 has a predetermined inclination. Therefore, the vertical level of the top surface of the dam 180 in the display area DPA can be higher than the vertical level of the top surface of the dam 180 in the non-display area NDA.

[0158] Then, refer to Figure 10 A first wavelength conversion pattern 240 is formed in the opening OP of the display area DPA. Although not shown, multiple opening OPs can be formed in other parts of the display area DPA. Therefore, a light-transmitting pattern 230 and a second wavelength conversion pattern 250 can be formed in the opening OPs respectively. The first wavelength conversion pattern 240 can be applied to the opening OPs using an inkjet printing method. Furthermore, a capping layer 190 is formed on the substrate SUB. The capping layer 190 can be formed in the entire display area DPA and the entire non-display area NDA of the substrate SUB.

[0159] A first outer cover layer 200, a second color filter 213, a first color filter 211, and a second outer cover layer 220 are formed on the cover layer 190.

[0160] The first outer cover layer 200 can be made of an organic material and can be applied to the substrate SUB using a solution process. The first outer cover layer 200 can be formed on the capping layer 190 while filling the first trench TRE1. The first outer cover layer 200 can be formed with a predetermined slope along the underlying embankment 180, but can have a slope less than that of the embankment 180. Therefore, the vertical level of the top surface of the first outer cover layer 200 in the display area DPA can be higher than the vertical level of the top surface of the first outer cover layer 200 in the non-display area NDA. Although the figures show the first outer cover layer 200 not formed over the entire surface of the substrate SUB, but only over the top surface of the embankment 180, this disclosure is not limited thereto. The first outer cover layer 200 can be formed over the entire surface of the substrate SUB.

[0161] A second color filter 213 may be formed on the first outer cover layer 200. The second color filter 213 may extend from the display area DPA into the non-display area NDA and cover the first outer cover layer 200. In the non-display area NDA, a first color filter 211 may be formed on the second color filter 213. The first color filter 211 may be formed in the non-display area NDA to cover the second color filter 213. The first color filter 211 and the second color filter 213 may be formed by first performing a solution process and then performing patterning. Furthermore, the top surface of each of the first color filter 211 and the second color filter 213 may be formed with a slope that is inclined along the underlying layer, but may have a slope less than that of the underlying layer. However, this disclosure is not limited thereto. The top surface of each of the first color filter 211 and the second color filter 213 may be formed in a substantially planarized manner.

[0162] The second outer cover 220 may be made of an organic material and may be applied to the substrate SUB using a solution process. The second outer cover 220 may be formed over the entire surface of the substrate SUB and may cover the underlying steps while forming its top surface in a substantially planar manner. The second outer cover 220 may cover the first color filter 211 and the second color filter 213 and may cover up to the capping layer 190.

[0163] Reference Figure 11 The method may include scribing the substrate SUB. The process described above can be performed on the substrate SUB and / or the substrate. Thereafter, a scribing process can be performed to divide the substrate SUB into multiple units (e.g., display units corresponding to the display device 10 or the display panel of the display device 10, respectively).

[0164] The scribing process can be implemented as a physical scribing process using a blade or the like. The substrate SUB can be scribed along the scribing line SCL. The scribing line SCL can correspond in position to the first trench TRE1. The scribing line SCL can correspond to the side surface of the display device 10, but is not limited thereto. When the scribing line SCL is superimposed on the dam 180, the scribing process may not be reliably performed because the dam 180 is made of an organic material. Furthermore, when the scribing line SCL is superimposed on the cover layer 190 formed on the lateral side of the dam 180, damage such as cracks may occur in the cover layer 190 due to the scribing process. Therefore, the scribing line SCL can be formed in the area excluding the dam 180 and where the cover layer 190 and the first insulating layer 120 are in contact with each other, in the area of ​​the first trench TRE1.

[0165] Reference Figure 12 In the marked display device 10, the lateral sides of the substrate SUB, the first insulating layer 120, the cover layer 190, the first outer cover layer 200, the first color filter 211, the second color filter 213, and the second outer cover layer 220 can be aligned with each other. The side surfaces of the display device 10 may include the aligned side surfaces of the aforementioned layers. The lateral side of the dam 180 furthest from the display area DPA can be spaced apart from the lateral side of the substrate SUB furthest from the display area DPA, so that the former can be closer to the display area DPA than the latter. Therefore, the exposure of the dam 180 to external moisture or oxygen can be reduced or effectively prevented.

[0166] Furthermore, the scribed display device 10 may have rough lateral sides (e.g., the intermediate lateral side surface) that are easily damaged. In an embodiment, the intermediate lateral side surface of the display device 10 may be polished via a polishing process to define a less rough lateral side surface. The polishing process can be performed using a polishing apparatus SPO. The polishing apparatus SPO can physically rotate to polish the intermediate lateral side surface of the display device 10. The polishing apparatus SPO can polish the lateral sides of the display device 10, that is, the lateral sides of each of the substrate SUB, the first insulating layer 120, the cover layer 190, the first outer cover layer 200, the first color filter 211, the second color filter 213, and the second outer cover layer 220.

[0167] Then, refer to Figure 13An optical functional layer LFL is formed in the display device 10 having polished lateral sides. The optical functional layer LFL can be formed over the entire area of ​​the second outer cover layer 220. The optical functional layer LFL can be deposited in the form of a film on the second outer cover layer 220. However, this disclosure is not limited thereto. The optical functional layer LFL can be formed on the second outer cover layer 220 using a solution process. The scribing and polishing processes can align the lateral sides of the optical functional layer LFL, the substrate SUB, the first insulating layer 120, the capping layer 190, the first outer cover layer 200, the first color filter 211, the second color filter 213, and the second outer cover layer 220 with each other.

[0168] Multiple color filters can be stacked in the display device 10 configured as described above and in the non-display area NDA. Therefore, light leakage can be suppressed. The top surface of the second outer cover layer 220 can be formed in a planarized manner, thereby suppressing peeling defects of the optical functional layer LFL.

[0169] In the example, refer to Figure 14 After forming the optical functional layer (LFL), a polishing process can be performed. In such cases... Figure 11 After the optical functional layer LFL is formed in the display device 10 shown in the diagram, the optical functional layer LFL can be polished using a polishing apparatus SPO. The polishing apparatus SPO can polish the lateral sides of the display device 10, that is, the lateral sides of each of the substrate SUB, the first insulating layer 120, the capping layer 190, the first outer cover layer 200, the first color filter 211, the second color filter 213, the second outer cover layer 220, and the optical functional layer LFL.

[0170] In the following description, embodiments of the display device 10 will be described with reference to the other accompanying drawings.

[0171] Figure 15 The display device 10 and as described above Figures 3 to 4 The difference in the embodiment of the display device 10 is that the light-emitting element layer EML includes inorganic light-emitting diodes. In the following, descriptions of their identical constructions will be omitted, and their differences will be described in detail.

[0172] Figure 15 This is a cross-sectional view showing an embodiment of the display area DPA of the display device 10. Figure 16 This is a cross-sectional view showing an embodiment of the display area DPA and the non-display area NDA of the display device 10. Figure 17 This is a perspective cross-sectional view schematically illustrating an embodiment of a light-emitting diode.

[0173] Reference Figure 15 The display device 10 may include a substrate SUB, a light-emitting element layer EML, a color conversion layer CCL, and an optical functional layer LFL.

[0174] Multiple light-emitting regions LA1, LA2, LA3 and non-light-emitting regions NLA can be defined within the display area DPA of the substrate SUB. Furthermore, within the display area DPA of the substrate SUB, a first switching element T1 can be located in the first light-emitting region LA1, a second switching element T2 can be located in the second light-emitting region LA2, and a third switching element T3 can be located in the third light-emitting region LA3. Additionally, each of the switching elements T1, T2, and T3 may include a first insulating layer 120. A second insulating layer 130 may be disposed on the first switching element T1, the second switching element T2, and the third switching element T3.

[0175] Multiple sub-dikes 410 and 420, multiple electrodes 430 and 440, multiple light-emitting elements ED, dike 180, third insulating layer 450, and multiple connecting electrodes 460 and 470 may be disposed on the second insulating layer 130.

[0176] Multiple sub-dams 410 and 420 may be disposed on the second insulating layer 130. The multiple sub-dams 410 and 420 may include a first sub-dam 410 and a second sub-dam 420 spaced apart from each other. Each of the first sub-dam 410 and the second sub-dam 420 may have a shape extending in the second direction DR2. Multiple light-emitting elements ED may be disposed between the first sub-dam 410 and the second sub-dam 420 in a direction along the substrate SUB. The multiple sub-dams 410 and 420 may be disposed in each of the light-emitting regions LA1, LA2, and LA3.

[0177] Each of the plurality of sub-dams 410 and 420 may have a structure in which at least a portion of it protrudes upward from the top surface of the second insulating layer 130. The protruding portion of each of the plurality of sub-dams 410 and 420 may have sloping sides. Light emitted from the light-emitting element ED may be reflected from electrodes 430 and 440 respectively disposed on the plurality of sub-dams 410 and 420, and may be emitted upward from the second insulating layer 130. This disclosure is not limited thereto. Each of the plurality of sub-dams 410 and 420 may have a semi-circular or semi-elliptical shape with a curved outer surface. Each of the plurality of sub-dams 410 and 420 may comprise an organic insulating material such as polyimide (PI). However, the disclosure is not limited thereto.

[0178] Multiple electrodes 430 and 440 may extend along the second direction DR2 and be disposed in each of the light-emitting regions LA1, LA2, and LA3. The multiple electrodes 430 and 440 may be spaced apart from each other along the first direction DR1. The multiple electrodes 430 and 440 may be electrically connected to the light-emitting element ED. The multiple electrodes 430 and 440 may be connected to the light-emitting element ED via connection electrodes 460 and 470, which will be described later, and may transmit electrical signals applied from the switching elements T1, T2, and T3 below to the light-emitting element ED.

[0179] The plurality of electrodes 430 and 440 may include a first electrode 430 and a second electrode 440. The first electrode 430 may be disposed on the left side near the center of each of the light-emitting regions LA1, LA2, and LA3. The second electrode 440 may be spaced apart from the first electrode 430 in a first direction DR1 and may be disposed on the right side near the center of each of the light-emitting regions LA1, LA2, and LA3. The first electrode 430 may be disposed on a first sub-embankment 410, and the second electrode 440 may be disposed on a second sub-embankment 420. The first electrode 430 and the second electrode 440 may be disposed on at least one inclined side of the sub-embankments 410 and 420, respectively. In an embodiment, the width of each of the plurality of electrodes 430 and 440 measured in the first direction DR1 may be greater than the width of each of the sub-embankments 410 and 420 measured in the first direction DR1. Each of the first electrode 430 and the second electrode 440 may cover at least one side of each of the sub-embankments 410 and 420 and reflect light emitted from the light-emitting element ED therefrom. The light emitted from the light-emitting element ED can be reflected by electrodes 430 and 440 respectively disposed on sub-dikes 410 and 420, and emitted in the upward direction.

[0180] Each of electrodes 430 and 440 may include a highly reflective conductive material to reflect light emitted from the light-emitting element ED. Each of electrodes 430 and 440 may include a material having high reflectivity and conductivity. In embodiments, for example, each of electrodes 430 and 440 may include aluminum (Al) or an alloy comprising aluminum (Al), nickel (Ni), lanthanum (La), copper (Cu), etc. Furthermore, each of electrodes 430 and 440 may also include materials such as ITO, IZO, and ITZO, or have a structure in which at least two layers made thereof are stacked.

[0181] Each of electrodes 430 and 440 can be electrically connected to the light-emitting element ED via each of the connection electrodes 460 and 470, which will be described later. Each of electrodes 430 and 440 can be in direct contact with each of the connection electrodes 460 and 470. The first electrode 430 can be connected to each of the switching elements T1, T2, and T3 via contact holes formed in the second insulating layer 130. Although not shown, the second electrode 440 can be connected to the power line via contact holes formed in the second insulating layer 130. The first electrode 430 can be electrically connected to each of the switching elements T1, T2, and T3 and can receive a first power voltage. The second electrode 440 can be connected to the power line and can receive a second power voltage.

[0182] A third insulating layer 450 may be disposed on a plurality of electrodes 430 and 440. The third insulating layer 450 may be disposed on a plurality of electrodes 430 and 440, while exposing at least a portion of each of the electrodes 430 and 440 to the outside of the third insulating layer 450. The exposed portions of the electrodes 430 and 440 may be connected to connection electrodes 460 and 470, which will be described later, respectively. The third insulating layer 450 may be made of an inorganic material and may be made of the same material as the first insulating layer 120 as described above.

[0183] A dam 180 may be disposed on the third insulating layer 450. In a plan view, the dam 180 may include portions extending in the first direction DR1 and portions extending in the second direction DR2, and may surround each of the light-emitting regions LA1, LA2, and LA3. The dam 180 may be configured to overlap with the non-light-emitting region NLA. When the light-emitting element ED, which will be described later, is applied using an inkjet process, the dam 180 can prevent ink material from spilling into adjacent light-emitting regions. Furthermore, when the light-transmitting pattern 230, the first wavelength conversion pattern 240, and the second wavelength conversion pattern 250, which will be described later, are applied using an inkjet process, the dam 180 can reduce or effectively prevent ink material from spilling into adjacent light-emitting regions.

[0184] Multiple light-emitting elements (EDs) can be disposed on the third insulating layer 450. The EDs can have a shape extending in a direction parallel to the top surface of the substrate SUB. The EDs can include multiple semiconductor layers arranged in a direction parallel to the top surface of the substrate SUB. The multiple semiconductor layers can be arranged sequentially in a direction parallel to the top surface of the substrate SUB. However, this disclosure is not limited thereto. When the EDs have different structures, the multiple semiconductor layers can be arranged in a direction perpendicular to the top surface of the substrate SUB.

[0185] Multiple light-emitting elements (EDs) can be disposed on electrodes 430 and 440 spaced apart from each other along a first direction DR1 and between sub-dikes 410 and 420. Each ED can be configured such that at least one end is disposed on one of electrodes 430 and 440, or its two opposite ends are disposed on electrodes 430 and 440 respectively. Each ED can be configured such that its two opposite ends are disposed on electrodes 430 and 440 respectively. The direction along which each extension of electrodes 430 and 440 extends and the direction along which the ED extends can be substantially perpendicular to each other. The EDs can be spaced apart from each other along a second direction DR2 along which each extension of electrodes 430 and 440 extends, and can be substantially parallel to each other and aligned with each other. However, this disclosure is not limited thereto. The EDs can extend obliquely along the direction along which each extension of electrodes 430 and 440 extends.

[0186] The light-emitting element ED disposed in each of the light-emitting regions LA1, LA2, and LA3 can emit light beams of different wavelengths based on the type of material of the semiconductor layer of the light-emitting element ED. This disclosure is not limited thereto. The light-emitting element ED disposed in each of the light-emitting regions LA1, LA2, and LA3 can each comprise a semiconductor layer made of the same material, and therefore emit light of the same color. The light-emitting element ED can be in contact with connecting electrodes 460 and 470, and emit light of one wavelength using an electrical signal applied to the light-emitting element ED through electrodes 430 and 440.

[0187] Multiple connecting electrodes 460 and 470 can be respectively disposed on and in contact with multiple electrodes 430 and 440. Multiple connecting electrodes 460 and 470 can be disposed on and in contact with the light-emitting element ED. Each of the connecting electrodes 460 and 470 can contact each of the two opposite ends of the light-emitting element ED and each of the electrodes 430 and 440.

[0188] The plurality of connecting electrodes 460 and 470 may include a first connecting electrode 460 and a second connecting electrode 470. The first connecting electrode 460 may have a shape extending in the second direction DR2 and may be disposed on the first electrode 430. A portion of the first connecting electrode 460 disposed on the first sub-dike 410 may overlap with the first electrode 430. The first connecting electrode 460 may extend from this portion in the second direction DR2. The first connecting electrode 460 may be connected to the first electrode 430 and may contact one end of the light-emitting element ED. Therefore, an electrical signal applied from each of the switching elements T1, T2, and T3 can be transmitted to the light-emitting element ED via the first connecting electrode 460.

[0189] The second connecting electrode 470 may have a shape extending in the second direction DR2 and may be disposed on the second electrode 440. A portion of the second connecting electrode 470 disposed on the second sub-dike 420 may overlap with the second electrode 440. The second connecting electrode 470 may extend from this portion in the second direction DR2. The second connecting electrode 470 may be connected to the second electrode 440 and may contact the opposite end of the light-emitting element ED. Therefore, an electrical signal applied from the power line can be transmitted to the light-emitting element ED via the second connecting electrode 470.

[0190] In the example, the color conversion layer CCL can be disposed on the light-emitting element layer EML. The color conversion layer CCL may include a light-transmitting pattern 230, a first wavelength conversion pattern 240, a second wavelength conversion pattern 250, a capping layer 190, a first outer cover layer 200, a color filter layer 210, and a second outer cover layer 220.

[0191] This embodiment and Figure 3 The embodiments are essentially the same, but because each of the light-transmitting pattern 230, the first wavelength conversion pattern 240, and the second wavelength conversion pattern 250 is disposed between adjacent embankments 180 and in contact with the light-emitting element ED, it is similar to... Figure 3 The embodiments described herein differ. Therefore, a detailed description thereof will be omitted. The optical functional layer LFL may be disposed on the color conversion layer CCL.

[0192] In the following text, refer to Figure 16 The structure of the non-display area NDA of the display device 10 will be described in detail below. As described above, the arrangement of the light-transmitting pattern 230, the first wavelength conversion pattern 240, and the second wavelength conversion pattern 250 can be varied. Therefore, the arrangement of the first color filter 211, the second color filter 213, and the third color filter 215 can be varied. In the following, an example in which the first wavelength conversion pattern 240 and the second color filter 213 are disposed in the first light-emitting area LA1 will be described.

[0193] Combination Figure 15 Reference Figure 16 Multiple layers extending from the display area DPA can be disposed in the non-display area NDA of the display device 10.

[0194] Specifically, the first insulating layer 120 extends from the display area DPA of the substrate SUB and into the non-display area NDA of the substrate SUB. Furthermore, a retaining wall 180 extends from the display area DPA of the substrate SUB and into the non-display area NDA of the substrate SUB. The retaining wall 180 extends to a position adjacent to the lateral side of the substrate SUB. The lateral side of the retaining wall 180 is spaced apart from the lateral side of the substrate SUB, such that the lateral side of the retaining wall 180 is closer to the display area DPA than the lateral side of the substrate SUB. That is, the lateral side of the retaining wall 180 can be positioned inside the lateral side of the substrate SUB. As described above, when the retaining wall 180 is exposed to the lateral side of the substrate SUB, peeling defects of the retaining wall 180 may occur due to external moisture or oxygen. Therefore, when the lateral side of the retaining wall 180 is spaced apart from the lateral side of the substrate SUB, such that the lateral side of the retaining wall 180 is closer to the display area DPA than the lateral side of the substrate SUB, exposure of the retaining wall 180 to external moisture or oxygen can be reduced or effectively prevented. Therefore, peeling defects of the retaining wall 180 can be suppressed.

[0195] The capping layer 190, the first outer cover layer 200, the second color filter 213, the first color filter 211, and the second outer cover layer 220 can be disposed in the non-display area NDA of the substrate SUB. Furthermore, the optical functional layer LFL can be disposed on the second outer cover layer 220. This configuration is consistent with... Figure 4 The structure is the same. Therefore, its detailed description is omitted.

[0196] In this embodiment, when the lateral side of the dam 180 is spaced apart from the lateral side of the substrate SUB such that the lateral side of the dam 180 is closer to the display area DPA than the lateral side of the substrate SUB, the exposure of the dam 180 to external moisture or oxygen can be reduced or effectively prevented. Therefore, peeling defects of the dam 180 can be suppressed. Furthermore, the stack of multiple color filters disposed in the non-display area NDA provides a light-blocking function and reduces or effectively prevents light leakage at the non-display area NDA. When the top surface of the second outer cover layer 220 is formed in a planarized manner, peeling defects of the optical functional layer LFL can be suppressed.

[0197] Reference Figure 17 The aforementioned light-emitting element ED can be implemented as a light-emitting diode. Specifically, the light-emitting element ED can be implemented as an inorganic light-emitting diode made of inorganic materials and having a nanometer to micrometer size. The light-emitting element ED can be arranged between two electrodes facing each other. When an electric field in one direction is generated between the two electrodes, the light-emitting elements ED can be aligned with the same orientation.

[0198] Embodiments of the light-emitting element (ED) can have a shape extending in one direction. The main dimension of the shape can extend in one direction. The ED can have a shape such as a cylinder, rod, wire, or tube. However, the shape of the ED according to this disclosure is not limited to these. The ED can have various shapes. In embodiments, the ED can have a polygonal prism shape such as a cube, cuboid, or hexagonal prism. In embodiments, the ED can extend in one direction and have a partially sloping exterior.

[0199] A light-emitting element (ED) may include a semiconductor layer doped with impurities of any conductivity type (e.g., p-type or n-type). The semiconductor layer may receive electrical signals applied from an external power source and may emit light in a specific wavelength range. The ED may include a first semiconductor layer 31, a second semiconductor layer 32, a light-emitting layer 36, an electrode layer 37, and an insulating film 38.

[0200] The first semiconductor layer 31 may be an n-type semiconductor. The first semiconductor layer 31 may include semiconductors having the chemical formula Al. x Ga y In 1-x-y A semiconductor material of type N (0≤x≤1, 0≤y≤1, 0≤x+y≤1). In an embodiment, for example, the first semiconductor layer 31 may be made of at least one of AlGaInN, GaN, AlGaN, InGaN, AlN, and InN, and may be doped with an n-type dopant. The n-type dopant doped into the first semiconductor layer 31 may be Si, Ge, Sn, Se, etc.

[0201] The second semiconductor layer 32 can be disposed on the first semiconductor layer 31, and the light-emitting layer 36 is disposed between the second semiconductor layer 32 and the first semiconductor layer 31. The second semiconductor layer 32 can be a p-type semiconductor. The second semiconductor layer 32 may include materials having the chemical formula Al. x Ga y In 1-x-y A semiconductor material of type N (0≤x≤1, 0≤y≤1, 0≤x+y≤1). In an embodiment, for example, the second semiconductor layer 32 may be made of at least one of AlGaInN, GaN, AlGaN, InGaN, AlN, and InN, and may be doped with a p-type dopant. The p-type dopant doped into the second semiconductor layer 32 may be Mg, Zn, Ca, Sr, Ba, etc.

[0202] In the example, the accompanying drawings show that each of the first semiconductor layer 31 and the second semiconductor layer 32 consists of a single layer. However, this disclosure is not limited thereto. Depending on the material of the light-emitting layer 36, each of the first semiconductor layer 31 and the second semiconductor layer 32 may also include a greater number of layers, such as a cladding layer or a TSBR (tensile strain barrier reduction) layer.

[0203] A light-emitting layer 36 may be disposed between a first semiconductor layer 31 and a second semiconductor layer 32. The light-emitting layer 36 may comprise a single-quantum-well structure or a multi-quantum-well structure. When the light-emitting layer 36 comprises a multi-quantum-well structure, it may have a structure in which multiple quantum layers and multiple well layers are alternately stacked. The light-emitting layer 36 emits light via the binding of electrons and holes according to an electrical signal applied through the first semiconductor layer 31 and the second semiconductor layer 32. The light-emitting layer 36 may comprise materials such as AlGaN and AlGaInN. Specifically, when the light-emitting layer 36 has a structure in which multiple quantum layers and multiple well layers are alternately stacked, the quantum layers may comprise materials such as AlGaN or AlGaInN, and the well layers may comprise materials such as GaN or AlInN.

[0204] The light-emitting layer 36 may have a structure in which multiple first layers made of semiconductor materials with large band gaps and multiple second layers made of semiconductor materials with smaller band gaps are stacked alternately. Depending on the wavelength of the emitted light, the light-emitting layer 36 may comprise group III to group V semiconductor materials. The light emitted from the light-emitting layer 36 is not limited to light corresponding to the blue wavelength band. In some cases, the light emitted from the light-emitting layer 36 may be light corresponding to the red or green wavelength bands.

[0205] Light emitted from the light-emitting layer 36 can be emitted in the longitudinal direction of the light-emitting element ED, for example, towards the two opposite ends of the light-emitting element ED. Furthermore, light emitted from the light-emitting layer 36 can be emitted in a direction perpendicular to the length direction (e.g., the main dimension) of the light-emitting element ED. The directionality of light emitted from the light-emitting layer 36 is not limited to one direction.

[0206] The light-emitting element (ED) may include an electrode layer 37. The electrode layer 37 may be implemented as an ohmic connection electrode. This disclosure is not limited thereto. The electrode layer 37 may be implemented as a Schottky connection electrode. The light-emitting element (ED) may include at least one electrode layer 37. This disclosure is not limited thereto. The electrode layer 37 may be omitted.

[0207] Electrode layer 37 can serve as one end of the light-emitting element ED. Electrode layer 37 can be configured such that light emitted from light-emitting layer 36 can pass through it via a transparent conductive layer. When the light-emitting element ED is electrically connected to an electrode or connecting electrode in display device 10, electrode layer 37 can reduce the resistance between the light-emitting element ED and the electrode or connecting electrode. Electrode layer 37 can include a conductive metal. In embodiments, for example, electrode layer 37 can include at least one of aluminum (Al), titanium (Ti), indium (In), gold (Au), silver (Ag), ITO, IZO, and ITZO.

[0208] As described above, the insulating film 38 may be configured to surround the outside of each of the plurality of semiconductor layers 31 and 32, the light-emitting layer 36, and the electrode layer 37. In an embodiment, for example, the insulating film 38 may be configured to at least surround the outside of the light-emitting layer 36, such that two opposite ends of the light-emitting element ED in the longitudinal direction are exposed. Furthermore, the insulating film 38 may be formed in a region adjacent to at least one end of the light-emitting element ED to have a rounded top surface in a cross-sectional view.

[0209] The insulating film 38 may include a material with insulating properties, such as silicon oxide (SiO2). x Silicon nitride (SiN) x ), silicon oxynitride (SiO) x N y Aluminum nitride (AlN) x ), aluminum oxide (AlO) x The accompanying drawings show the insulating film 38 formed as a single layer. However, the disclosure is not limited thereto. In some embodiments, the insulating film 38 may be implemented as a multilayer structure in which multiple layers are stacked.

[0210] Furthermore, the insulating film 38 can function as a component protecting the light-emitting element ED. The insulating film 38 can prevent electrical short circuits in the light-emitting layer 36 that might otherwise occur when the light-emitting element ED comes into direct contact with the electrodes to which electrical signals are transmitted. In addition, the insulating film 38 can reduce or effectively prevent the degradation of the luminous efficiency of the light-emitting element ED.

[0211] Furthermore, the outer surface of the insulating film 38 can be surface-treated. The light-emitting elements (EDs) can be sprayed onto the electrodes while dispersed in a predetermined ink, and then aligned with each other. In this regard, to reduce or effectively prevent adjacent light-emitting elements (EDs) from agglomerating with each other, and conversely, to maintain the light-emitting elements (EDs) in a dispersed state in the ink, the surface of the insulating film 38 can be treated to be hydrophobic or hydrophilic.

[0212] In the following text, an organic light-emitting diode (OLED) is formed as a light-emitting element in the display area DPA of the display device 10 by way of example. Figure 4 The structure is described. However, the disclosure is not limited thereto. The following description may also be applied to situations where the light-emitting element ED is implemented as follows: Figure 16 An embodiment of the inorganic light-emitting diode shown.

[0213] Figures 18 to 24 These are cross-sectional views illustrating an embodiment of the display device 10. In the following text, the details of the cross-sectional views will be omitted. Figure 4The descriptions of the same structures are as described above, and the following descriptions will address the differences between them. The height or vertical level of a feature can be measured from a reference plane such as the plane of the substrate SUB, the plane of the insulating layer, etc. The top surface, upper surface, etc., of a feature can be furthest from the substrate SUB, but are not limited thereto.

[0214] Reference Figure 18 In the display device 10, the first outer cover layer 200, the second color filter 213 and the first color filter 211 can be disposed in the non-display area NDA.

[0215] The top surface of the first outer cover 200 can be formed in a planarized manner throughout the entire display area DPA and the entire non-display area NDA. Relative to a reference plane, the vertical level of the top surface of the first outer cover 200 in the non-display area NDA can vary depending on the presence or absence of the underlying embankment 180. In the non-display area NDA, the first vertical level H1 of the top surface of the portion of the first outer cover 200 overlapping with the embankment 180 can be higher than the second vertical level H2 of the top surface of the portion of the first outer cover 200 not overlapping with the embankment 180.

[0216] Similarly, the vertical level of the top surface of the second color filter 213, which is disposed on the first outer cover layer 200 and in the non-display area NDA, can vary based on the presence or absence of the underlying dam 180. In the non-display area NDA, the third vertical level H3 of the top surface of the portion of the second color filter 213 overlapping with the dam 180 can be higher than the fourth vertical level H4 of the top surface of the portion of the second color filter 213 not overlapping with the dam 180. Furthermore, like the second color filter 213, the first color filter 211 can have different vertical levels in the non-display area NDA. In the non-display area NDA, the fifth vertical level H5 of the top surface of the portion of the first color filter 211 overlapping with the dam 180 can be higher than the sixth vertical level H6 of the top surface of the portion of the first color filter 211 not overlapping with the dam 180.

[0217] The top surface of the second outer cover 220 disposed on the first color filter 211 and the second color filter 213 can be formed in a substantially flat manner. The first outer cover 200, the second color filter 213, and the first color filter 211 disposed below the second outer cover 220 can minimize the size of the underlying step, so that the top surface of the second outer cover 220 can be substantially flat. That is, the vertical level of the top surface of the second outer cover 220 in the display area DPA can be substantially the same as the vertical level of the top surface of the second outer cover 220 in the non-display area NDA.

[0218] In the example, refer to Figure 19In the display device 10, the encapsulation organic layer 173 and the second encapsulation inorganic layer 175 can be omitted from the thin-film encapsulation layer 170. That is, the thin-film encapsulation layer 170 may only include the first encapsulation inorganic layer 171. In this case, the first wavelength conversion pattern 240 and the dam 180 can be directly disposed on the first encapsulation inorganic layer 171. Although not shown, the light-transmitting pattern 230 and the second wavelength conversion pattern 250 can be directly disposed on the first encapsulation inorganic layer 171.

[0219] Reference Figure 20 In the display device 10, the lateral side of the optical functional layer LFL can be positioned to extend outward beyond the lateral side of the substrate SUB. That is, the optical functional layer LFL can extend further than the lateral side surface of the substrate SUB. In this case, the optical functional layer LFL can be attached to the second outer cover layer 220 after the substrate SUB has been polished. The planar dimensions of the optical functional layer LFL can be larger than the planar dimensions of the substrate SUB.

[0220] Reference Figure 21 In the display device 10, the lateral side of the optical functional layer LFL can be positioned inside the lateral side of the substrate SUB. That is, the lateral side of the optical functional layer LFL can be closer to the display area DPA than the lateral side of the substrate SUB. In this case, the optical functional layer LFL can be attached to the second outer cover layer 220 after the substrate SUB has been polished. The planar dimensions of the optical functional layer LFL can be smaller than the planar dimensions of the substrate SUB.

[0221] Reference Figure 22 and Figure 23 The display device 10 may also include a first trench TRE1 and a dam pattern 185 in the non-display area NDA of the substrate SUB.

[0222] A first trench TRE1 can be formed in the embankment 180. The first trench TRE1 can extend to surround the display area DPA and the first partition wall BR1, the second partition wall BR2, and the support structure 135 disposed in the non-display area NDA. Figure 23 As shown, the first trench TRE1 can have a closed loop or a donut shape.

[0223] A dam pattern 185 may be spaced apart from a dam 180 to define a first trench TRE1. Within the non-display area NDA, the first trench TRE1 is defined within the dam 180, and the dam pattern 185 is spaced apart from the remainder of the dam 180 by the first trench TRE1 and is closer to the lateral side of the substrate SUB than the remainder of the dam 180. The dam pattern 185 may be disposed between the lateral side of the substrate SUB and the lateral side of the dam 180, and may extend to surround the display area DPA and the first trench TRE1. Figure 23As shown, the embankment pattern 185 can be formed in a closed loop or a donut shape, similar to the first trench TRE1.

[0224] In an embodiment, the inclusion of a first trench TRE1 and a dike pattern 185 further reduces or effectively prevents moisture or oxygen from entering the dike 180 from the outside.

[0225] Reference Figure 24 The display device 10 may also include a third color filter 215 in the non-display area NDA of the substrate SUB. In the non-display area NDA, the second color filter 213, the first color filter 211, the third color filter 215 and the outer cover (e.g., the second outer cover 220) are arranged sequentially from the substrate SUB.

[0226] Therefore, a stack of multiple color filters 211, 213, and 215 can be disposed in the non-display area NDA of the substrate SUB. The multiple color filters 211, 213, and 215 may include a first color filter 211, a second color filter 213, and a third color filter 215. The second color filter 213 can be directly disposed on the first outer cover layer 200, extending from the display area DPA and into the non-display area NDA. The lateral side of the second color filter 213 can be aligned with the lateral side of the substrate SUB. The first color filter 211 can be directly disposed on the second color filter 213. As a corresponding pattern of the first color filter layer, the portion of the first color filter 211 disposed in the non-display area NDA can be spaced apart from the portion of the first color filter 211 disposed in the display area DPA. The lateral side of the first color filter 211 can be aligned with the lateral side of the substrate SUB. The third color filter 215 can be directly disposed on the first color filter 211. As a corresponding pattern for the third color filter layer, the portion of the third color filter 215 disposed in the non-display area NDA can be spaced apart from the portion of the third color filter 215 disposed in the display area DPA. The lateral side of the third color filter 215 can be aligned with the lateral side of the substrate SUB.

[0227] As described above, the first color filter 211 can be a blue color filter, the second color filter 213 can be a red color filter, and the third color filter 215 can be a green color filter. When beams of different colors are transmitted through the three color filters stacked vertically, the light will not pass through the stack. In an embodiment, for example, when a red beam, a blue beam, and a green beam are incident on the stack of the first color filter 211, the second color filter 213, and the third color filter 215, only the red beam can pass through the second color filter 213; the blue and green beams will be blocked by the second color filter 213. The red beam that has already passed through the second color filter 213 will be blocked by the first color filter 211. Therefore, the light cannot pass through but will be blocked by the stack. Furthermore, beams other than the green beam that are incident on the third color filter 215 and are not blocked by the first and second color filters 211 and 213 will be blocked by the third color filter 215.

[0228] In this embodiment, three color filters 211, 213, and 215, which transmit light beams of different colors respectively, are vertically stacked in the non-display area NDA. That is, vertically stacking the first color filter 211, the second color filter 213, and the third color filter 215 in the non-display area NDA can reduce or effectively prevent light beams from leaking from the display area DPA through the non-display area NDA, and provide a light-blocking function in the non-display area NDA.

[0229] Figure 25 This is a planar image of an embodiment of the display device 10. Figure 26 These are cross-sectional images of an embodiment of the display device 10. In this respect, each of the images is a scanning electron microscope (SEM) image.

[0230] Reference Figure 25 and Figure 26 This illustrates that the first trench TRE1 is formed in the non-display area NDA while surrounding the display area DPA. For example... Figure 26 As shown, it can be determined that the first trench TRE1 formed in the embankment 180 is filled with the first outer covering layer 200, and the top surface of the structure is formed in a substantially flattened manner.

[0231] As described above, in one or more embodiments of the display device 10, the lateral side surface of the dam 180 may be spaced apart from and inside the lateral side surface of the substrate SUB, thereby reducing or effectively preventing peeling defects of the dam 180 that might otherwise be caused by external moisture or oxygen. Furthermore, placing a stack of multiple color filters in the non-display area NDA can reduce or effectively prevent light leakage and provide a light-blocking function at the non-display area NDA. Additionally, forming the top surface of the second outer cover layer 220 in a planarized manner can reduce or effectively prevent peeling defects of the optical functional layer LFL.

[0232] In summarizing the detailed description, those skilled in the art will understand that many variations and modifications can be made to the embodiments without substantially departing from the principles of the invention. Therefore, the disclosed embodiments of the invention are used only in a general and descriptive sense and not for purposes of limitation.

Claims

1. A display device, the display device comprising: The substrate includes both the display area and the non-display area; A light-emitting element layer in the display area of ​​the substrate; A color conversion layer, facing the light-emitting element layer, includes: a dam extending from and into the non-display area of ​​the substrate in the display area; a capping layer covering the dam in both the display and non-display areas of the substrate; a plurality of color filters in both the display and non-display areas of the substrate, wherein the plurality of color filters in the non-display area are stacked on top of each other; and an outer cover layer covering both the display and non-display areas of the substrate and respectively covering the plurality of color filters; and An optical functional layer is located in the display area and the non-display area of ​​the substrate and faces the outer cover layer. In the non-display area: The substrate, the cover layer, each of the plurality of color filters, and each of the outer cover layer have a lateral side furthest from the display area, and The lateral sides of the substrate, the lateral sides of the capping layer, the lateral sides of each of the plurality of color filters, and the lateral sides of the outer cover are aligned with each other.

2. The display device according to claim 1, wherein, The embankment has a lateral side furthest from the display area, and The lateral side of the embankment is spaced apart from the lateral side of the base and is closer to the display area than the lateral side of the base.

3. The display device according to claim 1, further comprising an insulating layer, the insulating layer being located between the substrate and the light-emitting element layer. in, In the non-display area, a portion of the cover layer contacts the insulating layer and extends parallel to the substrate.

4. The display device according to claim 3, wherein, In the non-display area, The embankment has a lateral side furthest from the display area, and The portion of the cover layer is between the lateral side of the base and the lateral side of the embankment.

5. The display device according to claim 3, wherein, The insulating layer has a lateral side furthest from the display area, and The lateral side of the insulating layer is aligned with the lateral side of the substrate.

6. The display device according to claim 1, wherein, The plurality of color filters includes a first color filter that transmits light of a first color and a second color filter that transmits light of a second color different from the first color, and Within the non-display area, the second color filter, the first color filter, and the outer coating are arranged sequentially from the substrate.

7. The display device according to claim 6, wherein, The plurality of color filters also includes a third color filter that transmits light of a third color that is different from the first color and the second color, and Within the non-display area, the second color filter, the first color filter, the third color filter, and the outer cover are arranged sequentially from the substrate.

8. The display device according to claim 1, wherein, The light-emitting element layer includes: Multiple light-emitting elements; and Thin-film encapsulation layer on the plurality of light-emitting elements, The thin-film encapsulation layer comprises, in sequence from the plurality of light-emitting elements, the following: First encapsulation inorganic layer; Encapsulation organic layer; and The second encapsulation inorganic layer.

9. The display device according to claim 8, wherein, Each of the plurality of light-emitting elements includes an organic light-emitting diode or an inorganic light-emitting diode.

10. The display device according to claim 1, wherein, The optical functional layer has a lateral side furthest from the display area, and The lateral side of the optical functional layer is aligned with the lateral side of the substrate.

11. The display device according to claim 1, wherein, The optical functional layer has a lateral side furthest from the display area, and Along the direction of the substrate, the lateral side of the optical functional layer is spaced apart from the lateral side of the substrate.

12. The display device according to claim 1, wherein the display device further comprises, in the non-display area of ​​the substrate: Multiple protruding portions project from the base toward the embankment, and Each of the plurality of protruding portions is located between the embankment and the base and corresponds to the plurality of color filters superimposed on each other in the non-display area.

13. The display device according to claim 1, wherein the display device further comprises, within the non-display area: The trench is confined within the dike; as well as The embankment pattern is spaced apart from the remainder of the embankment by the groove and is closer to the lateral side of the base than the remainder of the embankment.

14. The display device according to claim 13, wherein, The groove has a closed-loop shape surrounding the display area.

15. A method for manufacturing a display device, the method comprising: The display includes a display area, a non-display area, and a base with scribbled lines corresponding to the lateral side of the display device, wherein the lateral side of the display device is located in the non-display area and is furthest from the display area. A light-emitting element layer is disposed on the substrate and in the display area; A dike is provided on the light-emitting element layer in the display area and extends into the non-display area; A groove corresponding to the marked line on the base is provided in the embankment; A capping layer is provided on the embankment and extends into the ditch to cover the embankment and the ditch; Multiple color filters are provided in the display area and in the non-display area, with the multiple color filters in the non-display area stacked on top of each other; An outer cover layer is provided on the plurality of color filters to cover the plurality of color filters stacked on top of each other in the non-display area; Draw lines along the scribe line to define the lateral side of the display device; as well as An optical functional layer is provided on the outer coating.

16. The method according to claim 15, wherein, The lateral side of the display device includes the lateral side of the substrate, the cover layer, each of the plurality of color filters, and each of the outer cover layers. The method further includes polishing the lateral side of the display device.

17. The method according to claim 15, wherein, The lateral side of the display device includes the lateral side of the substrate, the cover layer, each of the plurality of color filters, the outer cover layer, and each of the optical functional layers. The method further includes polishing the lateral side of the display device.

18. The method according to claim 16, wherein, The step of polishing the lateral sides of the display device provides lateral sides of the substrate, lateral sides of the cover layer, lateral sides of each of the plurality of color filters, and lateral sides of the outer cover layer that are aligned with each other.

19. A display device, the display device comprising: The substrate includes both the display area and the non-display area; A light-emitting element layer in the display area of ​​the substrate; A color conversion layer, facing the light-emitting element layer, includes: a dam extending from and into the non-display area of ​​the substrate in the display area; a capping layer covering the dam in both the display and non-display areas of the substrate; a plurality of color filters in both the display and non-display areas of the substrate, wherein the plurality of color filters in the non-display area are stacked on top of each other; and a first outer cover layer covering both the display and non-display areas of the substrate, respectively covering the plurality of color filters; and An optical functional layer is located in the display area and the non-display area of ​​the substrate and faces the first outer cover layer. Within the non-display area: The substrate, the cover layer, each of the plurality of color filters, and each of the first outer cover layer have a lateral side furthest from the display area. The lateral sides of the substrate, the lateral sides of the capping layer, the lateral sides of each of the plurality of color filters, and the lateral sides of the first outer cover are aligned with each other. The first outer covering layer has a top surface furthest from the substrate, and The top surface of the first outer cover in the non-display area is coplanar with the top surface of the first outer cover in the display area.

20. The display device according to claim 19, further comprising: A second outer cover layer is located in the display area and the non-display area of ​​the substrate and faces the first outer cover layer. The plurality of color filters are located between the second outer cover layer and the first outer cover layer. in, The second outer cover is closer to the substrate than the first outer cover and has the top surface furthest from the substrate. The top surface of the second outer cover in the display area is higher than the top surface of the second outer cover in the non-display area.

21. The display device according to claim 19, wherein, The embankment has a top surface that is furthest from the base and at a vertical level relative to the base, and The top surface of the dike in the display area is higher than the top surface of the dike in the non-display area.

Images