Method for manufacturing patterned organic film, apparatus for manufacturing patterned organic film, organic semiconductor device manufactured using the same, and integrated circuit including the same

By forming a hydrophobic organic film on a hydrophilic, water-insoluble substrate and using a mold transfer method, the problems of high cost and substrate damage in organic semiconductor film patterning are solved, realizing low-cost and high-efficiency organic film patterning, which is applicable to a variety of organic materials.

CN115244667BActive Publication Date: 2026-07-10THE UNIV OF TOKYO
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
THE UNIV OF TOKYO
Filing Date
2021-03-10
Publication Date
2026-07-10

AI Technical Summary

Technical Problem

Existing technologies for patterning organic semiconductor films suffer from high costs, substrate damage, limited material selection, and poor versatility, making it difficult to achieve low-cost, non-destructive patterning.

Method used

A hydrophobic organic film is formed on a hydrophilic, water-insoluble substrate using a coating method. The organic film is then transferred to the target substrate using a mold with a raised or recessed pattern. Patterning is achieved through water or aqueous solution interface treatment.

Benefits of technology

It enables low-cost, non-destructive patterning of organic films, applicable to a wide range of organic materials, especially organic semiconductor materials, while maintaining high-performance electrical properties, simplifying the process and reducing costs.

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Abstract

The present disclosure provides a patterning method which can be applied to a wide variety of organic materials, particularly organic semiconductor materials, without causing damage to an organic semiconductor film, a substrate, an insulating film, or the like, and at a low cost. The present disclosure relates to a method for manufacturing a patterned organic film, which includes: forming a hydrophobic organic film on a first substrate which is hydrophilic and non-water-soluble, using a coating method; pressing the organic film formed on the first substrate against a protrusion of a stamp having a protrusion and a recess; applying water or an aqueous solution to an interface between the first substrate and the organic film to transfer the organic film to the protrusion; and pressing the organic film transferred to the protrusion against a second substrate to transfer the organic film to the second substrate to obtain a patterned organic film, at least one of the organic film and the second substrate being an organic semiconductor.
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