Repairing member with micro led chip, method for manufacturing the same, repairing method, method for manufacturing light emitting device, and light emitting device

CN115244718BActive Publication Date: 2026-06-23DEXERIALS CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
DEXERIALS CORP
Filing Date
2021-02-26
Publication Date
2026-06-23

AI Technical Summary

Technical Problem

In the prior art, the use of anisotropic conductive adhesives for electrical connections of micro LED chips makes the repair of defective chips less than ideal, and the use of adhesives between closely spaced chips may lead to short circuit risks.

Method used

A repair component employs a micro LED chip with an electrode surface and an anisotropic conductive layer connected to the electrode. The conductive layer around the defective chip is removed by laser, and a polyethylene terephthalate or glass substrate is used to replace the defective chip through anisotropic conductive connection.

Benefits of technology

It enables convenient replacement of faulty micro LED chips, avoids short circuit risks, and ensures the reliability of electrical connections and the normal operation of the display device.

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    Figure CN115244718B_ABST
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Abstract

A repair member includes a micro LED chip having an electrode surface on which an electrode is disposed, and an anisotropic conductive layer having an area corresponding to that of the electrode surface, disposed in contact with the electrode of the micro LED chip disposed on the electrode surface.
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