Method for cutting a mother substrate for display panels

Abstract

In a method of cutting a mother substrate for a display panel, the mother substrate for the display panel includes display panel regions, dummy regions disposed adjacent to side portions of the respective display panel regions, and edge regions disposed adjacent to corner portions of the respective display panel regions, and first and second cutting lines overlapping the dummy regions and the edge regions are defined, and the method of cutting the mother substrate for the display panel can include: a step of irradiating laser light to the mother substrate for the display panel at a first interval along the first cutting line overlapping the dummy regions; and a step of irradiating laser light to the mother substrate for the display panel at a second interval different from the first interval along the first cutting line overlapping the edge regions.

Description

Technical Field

[0001] This invention relates to a method for cutting a mother substrate for a display panel. More specifically, this invention relates to a method for cutting a mother substrate for a display panel using a laser. Background Technology

[0002] Typically, display panels may not be manufactured individually. To improve productivity, a mother panel may be formed that is several to hundreds of times larger than the final product display panel, and the mother panel may be separated into individual display panel units to manufacture a complete display panel.

[0003] On the other hand, a laser can be used to separate the display panel from the mother panel. However, irradiating the substrate with the laser may not result in a smooth cut at the cut surface. Summary of the Invention

[0004] The purpose of this invention is to provide a method for cutting a mother substrate for a display panel using a laser.

[0005] However, the purpose of this invention is not limited to the above-described purpose, and various extensions can be made without departing from the spirit and scope of this invention.

[0006] To achieve the aforementioned objective of the present invention, in a cutting method for a mother substrate for a display panel according to an embodiment of the present invention, the mother substrate for the display panel includes a display panel area, a virtual area disposed adjacent to the sides of each of the display panel areas, and an edge area disposed adjacent to the corners of each of the display panel areas, and defines a first cutting line and a second cutting line overlapping the virtual area and the edge area. The cutting method for the mother substrate for the display panel includes the steps of: irradiating the mother substrate for the display panel with a laser along the first cutting line overlapping the virtual area at a first interval; and irradiating the mother substrate for the display panel with the laser along the first cutting line overlapping the edge area at a second interval different from the first interval.

[0007] In one embodiment, the size of each of the second intervals is smaller than the size of each of the first intervals.

[0008] In one embodiment, the method for cutting the mother substrate for the display panel may further include: irradiating the mother substrate for the display panel with the laser along the second cutting line overlapping the virtual region at the first interval; and irradiating the mother substrate for the display panel with the laser along the second cutting line overlapping the edge region at the second interval.

[0009] In one embodiment, the virtual region and the edge region may be arranged alternately to each other.

[0010] In one embodiment, the first cutting line may extend in a first direction, and the second cutting line may extend in a second direction intersecting the first direction.

[0011] In one embodiment, as the laser is irradiated onto the first cutting line and the second cutting line, the size of each of the first intervals can be constant, and the size of each of the second intervals can be gradually reduced.

[0012] In one embodiment, the rate at which the size of each of the second intervals decreases as the laser is irradiated onto the second cutting line can be the same as the rate at which the size of each of the second intervals decreases as the laser is irradiated onto the first cutting line.

[0013] In one embodiment, the rate at which the size of each of the second intervals decreases as the laser is irradiated onto the second cutting line may differ from the rate at which the size of each of the second intervals decreases as the laser is irradiated onto the first cutting line.

[0014] In one embodiment, the output energy of the laser in the edge region may be less than the output energy of the laser in the virtual region.

[0015] In one embodiment, as the laser is irradiated onto the first and second cutting lines, the output energy of the laser can be constant in the virtual region, and the output energy of the laser can be gradually reduced in the edge region.

[0016] In one embodiment, the mother substrate for the display panel may include a glass substrate or a plastic substrate.

[0017] In one embodiment, a display panel including driving elements and light-emitting elements may be configured in each of the said display panel areas.

[0018] In one embodiment, the laser may be a pulsed laser.

[0019] In one embodiment, the laser may be a picosecond laser or a femtosecond laser.

[0020] In one embodiment, the method for cutting the mother substrate for the display panel may further include: irradiating the mother substrate for the display panel with the laser along the second cutting line overlapping the virtual region at the first interval; and irradiating the mother substrate for the display panel with the laser along the second cutting line overlapping the edge region at the same interval as the first interval.

[0021] In one embodiment, as the laser is irradiated onto the first cutting line, the output energy of the laser may gradually decrease in the edge region, and as the laser is irradiated onto the second cutting line, the output energy of the laser may remain constant in the virtual region and the edge region.

[0022] In one embodiment, as the laser is irradiated onto the first cutting line and the second cutting line, the size of each of the first intervals can be constant, and the size of each of the second intervals can be gradually reduced.

[0023] (Invention Effects)

[0024] An embodiment of the present invention relates to a method for cutting a mother substrate for a display panel, which can irradiate the mother substrate with a laser along a first cutting line and a second cutting line overlapping a virtual region at a first interval, and can also irradiate the mother substrate with a laser along a first cutting line and a second cutting line overlapping an edge region at a second interval different from the first interval. Thus, the mother substrate overlapping the edge region can be smoothly cut using a laser.

[0025] However, the effects of the present invention are not limited to those described above, and various extensions can be made without departing from the spirit and scope of the present invention. Attached Figure Description

[0026] Figure 1 This is a plan view showing a mother panel for a display panel used in manufacturing a display panel according to an embodiment of the present invention.

[0027] Figure 2 It is shown Figure 1 A sequence diagram illustrating an example of a method for cutting the mother substrate for a display panel.

[0028] Figure 3 It is shown in magnification Figure 1 A floor plan of area "A".

[0029] Figure 4 It is shown Figure 1 Sequence diagram of other examples of cutting methods for the mother substrate of the display panel.

[0030] Figure 5 This is a plan view illustrating a mother panel for manufacturing a display panel according to other embodiments of the present invention.

[0031] Figure 6 This demonstrates the use of lasers to cut Figure 3 A plan view of a portion of the mother substrate used for the display panel.

[0032] Figure 7 It is along Figure 6A sectional view taken from line II′.

[0033] Symbol explanation:

[0034] 1000: Mother panel for display panel; SUB: Mother substrate for display panel; DA: Display area; NDA: Non-display area; DPA: Display panel area; DMA: Virtual area; DMA1: First virtual area; DMA2: Second virtual area; EA: Edge area; CL1: First cut line; CL2: Second cut line; LP1: First gap; LP2: Second gap; LS1: First focal point; LS2: Second focal point. Detailed Implementation

[0035] Hereinafter, with reference to the accompanying drawings, a detailed description will be provided of exemplary embodiments of the cutting method of the mother substrate according to the present invention. In the drawings, the same or similar reference numerals are used for the same or similar constituent elements.

[0036] Figure 1 This is a plan view showing a mother panel for a display panel used in manufacturing a display panel according to an embodiment of the present invention.

[0037] Reference Figure 1 The mother panel 1000 for the display panel may include a mother substrate SUB for the display panel. Hereinafter, the mother substrate SUB for the display panel will be referred to as the mother substrate SUB.

[0038] The mother substrate SUB may include a display panel area (DPA), a virtual area (DMA), and an edge area (EA). In one embodiment, the virtual area (DMA) may be configured to be adjacent to the side of each display panel area (DPA), and the edge area (EA) may be configured to be adjacent to the corner of each display panel area (DPA).

[0039] The virtual region DMA may include a first virtual region DMA1 configured to be adjacent to a first side of each display panel region DPA and a second virtual region DMA2 configured to be adjacent to a second side of each display panel region DPA. For example, two first virtual regions DMA1, two second virtual regions DMA2, and four edge regions EA may be configured adjacent to each display panel region DPA. In one embodiment, the virtual regions DMA and edge regions EA may be arranged alternately.

[0040] The display panel area (DPA), virtual area (DMA), and edge area (EA) can be separated using lasers. For example, the display panel area (DPA) may include a first display panel area to a fourth display panel area. However, the invention is not limited to this, and the display panel area (DPA) may also include several to hundreds of display panel areas.

[0041] Each display panel area (DPA) can have a quadrilateral shape. However, the shape of each display panel area (DPA) is not limited to this. For example, each display panel area (DPA) can also have a quadrilateral shape with rounded corners.

[0042] On the mother substrate SUB, a plurality of first severing lines CL1 and a plurality of second severing lines CL2 may be defined to irradiate the laser. In one embodiment, the plurality of first severing lines CL1 may extend in a first direction D1, and the plurality of second severing lines CL2 may extend in a second direction D2 intersecting the first direction D1. For example, a portion of the plurality of first severing lines CL1 may overlap with a first virtual region DMA1, and a portion of the plurality of first severing lines CL1 may overlap with the boundary between the display panel region DPA and the first virtual region DMA1. Furthermore, the plurality of second severing lines CL2 may overlap with a second virtual region DMA2. In the edge region EA, the first severing lines CL1 and the second severing lines CL2 may intersect each other.

[0043] The final productized display device may include a display panel and external devices for driving the display panel. Each display panel area (DPA) may correspond to the display panel. For example, the display panel may include driving elements for driving the display device and light-emitting elements for emitting light. Each display panel area (DPA) may include a display area (DA) for displaying images and a non-display area (NDA) for mounting the external devices. Virtual areas (DMA) and edge areas (EA) may be substantially non-productized portions.

[0044] In one embodiment, the mother substrate SUB may include a glass substrate, a quartz substrate, a plastic substrate, etc. When the mother substrate SUB includes a plastic substrate, it may include various materials having properties such as flexible, foldable, bendable, rollable, or stretchable. That is, the mother substrate SUB may include organic materials. For example, the mother substrate SUB may include at least one organic material selected from polyimide (PI), polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyarylate (PAR), polycarbonate (PC), and cellulose acetate propionate (CAP).

[0045] The mother substrate SUB may have a multilayer structure comprising two organic layers containing the aforementioned organic material and two barrier layers disposed between the organic layers and containing inorganic material. Therefore, the mother substrate SUB may have a single-layer structure or a multilayer structure.

[0046] Figure 2 It is shown Figure 1 A sequence diagram of the cutting method for the mother substrate used in the display panel. Figure 3 It is shown in magnification Figure 1 A floor plan of area "A". For example, Figure 3 In order to explain Figure 2 The display panel is magnified and shown using a cutting method of the mother substrate. Figure 1 The display panel is a plan view of a portion of the mother panel 1000.

[0047] Reference Figure 2The method for cutting the mother substrate for the display panel may include: step S100, irradiating the mother substrate SUB with a laser along a first cutting line CL1 at a first interval LP1 in the virtual region DMA; step S200, irradiating the mother substrate SUB with a laser along the first cutting line CL1 at a second interval LP2 in the edge region EA; step S300, irradiating the mother substrate SUB with a laser along a second cutting line CL2 at a first interval LP1 in the virtual region DMA; and step S400, irradiating the mother substrate SUB with a laser along a second cutting line CL2 at a second interval LP2 in the edge region EA. The method for cutting the mother substrate for the display panel will be described in detail below.

[0048] First, refer to Figures 1 to 3 The laser can be irradiated onto the mother substrate SUB along a first cut line CL1 that overlaps with the first virtual region DMA1 at a first interval LP1. Then, the laser can be irradiated onto the mother substrate SUB along a first cut line CL1 that overlaps with the edge region EA at a second interval LP2 different from the first interval LP1. The process described above is repeated so that the laser can be irradiated onto the mother substrate SUB along four first cut lines CL1 that overlap with the first virtual region DMA1 and the edge region EA.

[0049] Subsequently, the laser can be irradiated onto the mother substrate SUB along the second cut line CL2 overlapping the second virtual region DMA2 at a first interval LP1. Then, the laser can be irradiated onto the mother substrate SUB along the second cut line CL2 overlapping the edge region EA at a second interval LP2 different from the first interval LP1. The process described above is repeated so that the laser can be irradiated onto the mother substrate SUB along four second cut lines CL2 overlapping the second virtual region DMA2 and the edge region EA.

[0050] In one embodiment, the size of each second interval LP2 may be smaller than the size of each first interval LP1. For example, the size of each first interval LP1 may be approximately 5 μm, and the size of each second interval LP2 may be approximately 3 μm.

[0051] A laser with a first focal point LS1 can be irradiated onto the mother substrate SUB along a first cutting line CL1 that overlaps with the first virtual region DMA1 and the edge region EA. Furthermore, a laser with a second focal point LS2 can be irradiated onto the mother substrate SUB along a second cutting line CL2 that overlaps with the second virtual region DMA2 and the edge region EA. Here, in the virtual region DMA, the first focal point LS1 and the second focal point LS2 are spaced apart from each other by a first interval LP1, and in the edge region EA, the first focal point LS1 and the second focal point LS2 are spaced apart from each other by a second interval LP2.

[0052] In one embodiment, as the laser is irradiated onto the first cutting line CL1 and the second cutting line CL2, the size of each first interval LP1 can be constant, and the size of each second interval LP2 can be gradually reduced. Furthermore, the rate at which the size of each second interval LP2 decreases as the laser is irradiated onto the second cutting line CL2 can be the same as the rate at which the size of each second interval LP2 decreases as the laser is irradiated onto the first cutting line CL1. For example, as the laser is irradiated onto the first cutting line CL1 and the second cutting line CL2, the size of each first interval LP1 can be constant at approximately 5 μm, and the size of each second interval LP2 can be gradually reduced to approximately 3 μm or less. That is, the size of each second interval LP2 can be adjusted by adjusting the movement speed of the worktable (not shown) supporting the mother substrate SUB or the laser irradiation device (not shown) outputting the laser.

[0053] In one embodiment, the rate at which the size of each second interval LP2 decreases as the laser is irradiated onto the second cutting line CL2 may differ from the rate at which the size of each second interval LP2 decreases as the laser is irradiated onto the first cutting line CL1. For example, the rate at which the size of each second interval LP2 decreases as the laser is irradiated onto the second cutting line CL2 may be greater than the rate at which the size of each second interval LP2 decreases as the laser is irradiated onto the first cutting line CL1.

[0054] In one embodiment, the laser may be a pulsed laser. When the laser is a pulsed laser, it may be a picosecond laser. Alternatively, the laser may also be a femtosecond laser.

[0055] The smaller the irradiation interval of the laser, the greater the thermal impact exerted on the mother substrate SUB by the laser. That is, the thermal impact exerted on the mother substrate SUB by the laser can be increased in the edge region EA. In other words, the thermal energy of the mother substrate SUB caused by the laser in the edge region EA may be greater than the thermal energy of the mother substrate SUB caused by the laser in the virtual region DMA. In this case, it may not be possible to smoothly cut the mother substrate SUB in the edge region EA.

[0056] The output energy of the laser in the edge region EA can be less than the output energy of the laser in the virtual region DMA. In one embodiment, the output energy of the laser can be constant in the virtual region DMA, and the output energy of the laser can be gradually reduced in the edge region EA. That is, in the edge region EA, the output energy of the laser can gradually decrease as the laser is irradiated onto the first cutting line CL1 and the second cutting line CL2. Therefore, the thermal impact exerted on the mother substrate SUB by the laser in the edge region EA can be reduced, allowing for smooth cutting of the mother substrate SUB.

[0057] In the prior art, in order to manufacture a display panel using a mother panel, a laser is irradiated onto the mother substrate at constant intervals. However, if the laser is irradiated onto the mother substrate at constant intervals, it is impossible to smoothly cut the mother substrate adjacent to the corner portion of the display panel.

[0058] An embodiment of the present invention relates to a method for cutting a mother substrate for a display panel. The mother substrate SUB can be irradiated with a laser along a first cutting line CL1 and a second cutting line CL2 overlapping with a virtual region DMA at a first interval LP1. Furthermore, the mother substrate SUB can be irradiated with the laser along the first cutting line CL1 and the second cutting line CL2 overlapping with an edge region EA at a second interval LP2 different from the first interval LP1. Thus, the mother substrate SUB overlapping with the edge region EA can be smoothly cut using the laser.

[0059] Figure 4 It is shown Figure 1 Sequence diagram of other examples of cutting methods for the mother substrate of the display panel.

[0060] Figure 5 This is a plan view illustrating a mother panel for manufacturing a display panel according to other embodiments of the present invention. For example, Figure 5 In order to explain Figure 4 The display panel is magnified and shown using a cutting method of the mother substrate. Figure 1 The display panel uses a plan view of a portion of the mother panel 1000. For example, Figure 5 It is shown in magnification Figure 1 A floor plan of area "A".

[0061] Reference Figure 4 and Figure 5 The method for cutting the mother substrate for the display panel may include: step S100, irradiating the mother substrate SUB with laser along a first cutting line CL1 at a first interval LP1 in the virtual region DMA; step S200, irradiating the mother substrate SUB with laser along the first cutting line CL1 at a second interval LP2 in the edge region EA; step S300, irradiating the mother substrate SUB with laser along the second cutting line CL2 at a first interval LP1 in the virtual region DMA; and step S401, irradiating the mother substrate SUB with laser along the second cutting line CL2 at the same interval as the first interval LP1 in the edge region EA. Wherein, refer to... Figure 4 and Figure 5 The described method for cutting the mother substrate for the display panel, except for step S401, which involves irradiating the mother substrate SUB with laser light along the second cutting line CL2 at intervals equal to the first interval LP1 in the edge region EA, can be described with reference to [reference]. Figure 2 and Figure 3 The cutting method for the mother substrate used in the display panel described herein is substantially the same or similar. Repeated descriptions will be omitted hereafter.

[0062] In one embodiment, the laser can be irradiated onto the mother substrate SUB along a second cut line CL2 overlapping the second virtual region DMA2 at a first interval LP1. Then, the laser can be irradiated onto the mother substrate SUB along a second cut line CL2 overlapping the edge region EA at the same interval as the first interval LP1. For example, by repeating the process described above, the laser can be irradiated onto the mother substrate SUB along four second cut lines CL2 overlapping the second virtual region DMA2 and the edge region EA at a first interval LP1.

[0063] In the virtual region DMA, the first focus LS1 and the second focus LS2 can be spaced apart from each other by a first interval LP1. Furthermore, in the edge region EA, the first focus LS1 can be spaced apart from each other by a second interval LP2, and the second focus LS2 can be spaced apart from each other by a first interval LP1.

[0064] As described above, as the laser is irradiated onto the first cutting line CL1, the output energy of the laser can be constant in the virtual region DMA, and the output energy of the laser can gradually decrease in the edge region EA. In one embodiment, as the laser is irradiated onto the second cutting line CL2, the output energy of the laser can be constant in the virtual region DMA, and the output energy of the laser can be constant in the edge region EA.

[0065] Figure 6 This demonstrates the use of lasers to cut Figure 3 A plan view of a portion of the mother substrate used for the display panel. Figure 7 It is along Figure 6 A sectional view taken from line II′.

[0066] Reference Figure 6 ,For example, Figure 6 It shows through Figure 2 and Figure 3 The plan view shows the case where the display panel is cut along the first cutting line CL1 and the second cutting line CL2 using the laser to cut the mother substrate SUB. Furthermore, although not shown in... Figure 6As shown in detail, after a portion of the mother substrate SUB overlapping the virtual region DMA and edge region EA is cut off along the first cutting line CL1 and the second cutting line CL2 using the laser, the remaining portion of the mother substrate SUB overlapping the virtual region DMA and edge region EA can be cut off along the boundary of the virtual region DMA and the display panel region DPA using the laser. Furthermore, the groove formed by the first focal point LS1 and the second focal point LS2 of the laser can be removed by subsequent processes. As a result, no portion of the mother substrate SUB overlapping the virtual region DMA and edge region EA may remain.

[0067] Reference Figure 7 , Figure 7 This is a cross-sectional view showing the cut surface of the mother substrate SUB after the laser is irradiated along the first cut line CL1 and the second cut line CL2, which overlap with the virtual region DMA and the edge region EA, to cut the mother substrate SUB. For example, in the cross-sectional view, each of the first focal points LS1 may have a rectangular shape. Similarly, in the cross-sectional view, each of the second focal points LS2 may have a rectangular shape.

[0068] As described above, the invention has been illustrated with reference to exemplary embodiments thereof. However, those skilled in the art should understand that various modifications and alterations may be made to the invention without departing from the spirit and scope of the invention as set forth in the claims.

[0069] This invention is applicable to manufacturing methods for display panels by cutting a mother panel for the display panel. For example, this invention is applicable to manufacturing methods for display panels used in high-resolution smartphones, mobile phones, smart tablets, smartwatches, tablet PCs, vehicle navigation systems, televisions, computer monitors, laptops, and the like.

Claims

1. A method for cutting a mother substrate for a display panel, wherein, The mother substrate for the display panel includes display panel areas, virtual areas configured to be adjacent to the sides of each of the display panel areas, and edge areas configured to be adjacent to the corners of each of the display panel areas. A first cutting line and a second cutting line overlapping the virtual areas and the edge areas are defined. The cutting method for the mother substrate for the display panel includes: The steps of irradiating the display panel with laser light along the first cut line overlapping the virtual area at a first interval; and The step of irradiating the display panel with laser light along the first cutting line overlapping the edge region at a second interval different from the first interval onto the mother substrate. As the laser is irradiated onto the first cutting line, the size of each of the first intervals remains constant, while the size of each of the second intervals gradually decreases. As the laser is irradiated onto the first cutting line, the output energy of the laser remains constant in the virtual region, and gradually decreases in the edge region.

2. The method for cutting the mother substrate for a display panel according to claim 1, characterized in that, The size of each second interval is smaller than the size of each first interval.

3. The method for cutting the mother substrate for a display panel according to claim 1, characterized in that, Also includes: The step of irradiating the display panel with the laser along the second cutting line overlapping the virtual area at the first interval; as well as The step of irradiating the display panel with the laser along the second cutting line overlapping the edge region at the second interval.

4. The method for cutting the mother substrate for a display panel according to claim 3, characterized in that, The virtual region and the edge region are arranged alternately.

5. The method for cutting the mother substrate for a display panel according to claim 3, characterized in that, The first cutting line extends in a first direction, and the second cutting line extends in a second direction that intersects the first direction.

6. The method for cutting the mother substrate for a display panel according to claim 3, characterized in that, As the laser is irradiated onto the second cutting line, the size of each of the first intervals remains constant, and the size of each of the second intervals gradually decreases.

7. The method for cutting the mother substrate for a display panel according to claim 6, characterized in that, The rate at which the size of each of the second intervals decreases as the laser is irradiated onto the second cutting line is the same as the rate at which the size of each of the second intervals decreases as the laser is irradiated onto the first cutting line.

8. The method for cutting the mother substrate for a display panel according to claim 6, characterized in that, The rate at which the size of each of the second intervals decreases as the laser is irradiated onto the second cutting line differs from the rate at which the size of each of the second intervals decreases as the laser is irradiated onto the first cutting line.

9. The method for cutting the mother substrate for a display panel according to claim 3, characterized in that, The output energy of the laser in the edge region is less than the output energy of the laser in the virtual region.

10. The method for cutting a mother substrate for a display panel according to claim 9, characterized in that, As the laser is irradiated onto the second cutting line, the output energy of the laser remains constant in the virtual region, and gradually decreases in the edge region.

11. The method for cutting the mother substrate for a display panel according to claim 1, characterized in that, The mother substrate for the display panel includes a glass substrate or a plastic substrate.

12. The method for cutting the mother substrate for a display panel according to claim 1, characterized in that, Each of the aforementioned display panel areas is configured with a display panel including driving elements and light-emitting elements.

13. The method for cutting the mother substrate for a display panel according to claim 1, characterized in that, The laser is a pulsed laser.

14. The method for cutting a mother substrate for a display panel according to claim 13, characterized in that, The laser is a picosecond laser or a femtosecond laser.

15. The method for cutting the mother substrate for a display panel according to claim 1, characterized in that, Also includes: The step of irradiating the display panel with the laser along the second cutting line overlapping the virtual area at the first interval; as well as The step of irradiating the display panel with the laser along the second cutting line overlapping the edge region at the first interval.

16. The method for cutting a mother substrate for a display panel according to claim 15, characterized in that, As the laser is irradiated onto the first cutting line, the output energy of the laser gradually decreases in the edge region, and as the laser is irradiated onto the second cutting line, the output energy of the laser remains constant in both the virtual region and the edge region.

17. The method for cutting a mother substrate for a display panel according to claim 15, characterized in that, As the laser is irradiated onto the first and second cutting lines, the size of each of the first intervals remains constant, and the size of each of the second intervals gradually decreases.

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