Package structure and method of forming the same

Abstract

The application discloses a packaging structure and a forming method thereof. The packaging structure comprises a first substrate and a second substrate which are arranged in a stack; an electronic component which is located between the first substrate and the second substrate; and a shielding groove which is arranged around the electronic component. The above technical scheme of the application can solve the problems of low substrate utilization and low shielding performance in the prior art.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more specifically, to a packaging structure and a method for forming the same. Background Technology

[0002] Traditionally, shielding walls are formed by first creating trenches using lasers and then filling them with conductive material. However, in 3D stacked structures, the components in the interlayer between the upper and lower substrates are molded after the upper and lower substrates are stacked. Therefore, electromagnetic shielding between components in the interlayer cannot be formed using traditional methods. Consequently, the internal shielding components in the interlayer are typically formed by creating a metal lid using SMT (Surface Mount Technology) before the upper and lower substrates are stacked, followed by the molding process. However, since the metal lid occupies a certain volume, and the SMT metal lid must also comply with SMT design rules to avoid collisions, this approach reduces substrate utilization.

[0003] In addition, to improve substrate utilization, another solution is to use a fence wire to cover it. However, the fence wire is not a complete shield and the shielding effect is poor (especially for high-frequency electromagnetic waves). Summary of the Invention

[0004] To address the aforementioned problems in related technologies, this invention proposes a packaging structure and its formation method.

[0005] The technical solution of this invention is implemented as follows:

[0006] According to one aspect of the present invention, a packaging structure is provided, comprising: a first substrate and a second substrate stacked thereon; an electronic component located between the first substrate and the second substrate; and a shielding trench disposed around the electronic component.

[0007] In some embodiments, the shielding trench contacts only one of the first substrate and the second substrate.

[0008] In some embodiments, the shielding trench is a closed shape surrounding the electronic component.

[0009] In some embodiments, the shielding trench contains shielding material.

[0010] In some embodiments, the first substrate or the second substrate has a through hole communicating with the shielding trench. The shielding trench contains a shielding material, and the shielding material also fills the through hole.

[0011] In some embodiments, the through hole is a pre-set through hole in the first substrate or the second substrate.

[0012] In some embodiments, the sidewalls of the through hole are discontinuous with the sidewalls of the shielding trench.

[0013] In some embodiments, the width of the through hole is smaller than the width of the shielding trench.

[0014] In some embodiments, the electronic component includes a first electronic component and a second electronic component, with at least a partial shielding trench located between the first electronic component and the second electronic component.

[0015] In some embodiments, a grounding trace is provided in the first substrate or the second substrate, and a shielding material is connected to the grounding trace for grounding.

[0016] According to another aspect of the present invention, a method for forming an encapsulation structure is provided, comprising: providing a mask around an electronic component on a first substrate; forming a molded article encapsulating the electronic component and the mask sidewalls; and removing the mask to form a trench in the molded article.

[0017] In some embodiments, the method further includes curing the mask prior to forming the molded object.

[0018] In some embodiments, after forming the trench, the method further includes filling the trench with a shielding material.

[0019] In some embodiments, after providing the mask, the method further includes: forming a second substrate over the mask; and after forming the second substrate, forming a molded article between the first substrate and the second substrate, wherein the molded article encapsulates electronic components on the first substrate and electronic components on the second substrate.

[0020] In some embodiments, after forming the molded material, the method further includes forming an opening in the second substrate communicating with the trench to remove the mask from the trench.

[0021] In some embodiments, shielding material is also filled into the opening.

[0022] In some embodiments, the width of the through hole is different from the width of the shielding trench.

[0023] In some embodiments, the trench is formed to reach the first substrate.

[0024] In some embodiments, the electronic component includes two electronic components, with at least a partial shielding trench located between the two second electronic components. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1A This is a side view of the packaging structure according to an embodiment of the present invention.

[0027] Figure 1B This is a top view of the packaging structure according to an embodiment of the present invention.

[0028] Figures 2A to 2G A schematic diagram of multiple stages of a method for forming a package structure is shown.

[0029] Figure 3 This is a side view schematic diagram of the packaging structure according to other embodiments of the present invention.

[0030] Figure 4 This is an enlarged view of the through-hole in the packaging structure according to other embodiments of the present invention.

[0031] Figure 5A and Figure 5B This is a top view of a packaging structure according to another embodiment of the present invention. Detailed Implementation

[0032] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention are within the scope of protection of the present invention.

[0033] Figure 1A This is a side view of the packaging structure according to an embodiment of the present invention. Figure 1AAs shown, the packaging structure includes a first substrate 210 and a second substrate 220 stacked together. In this embodiment, the second substrate 220 is above the first substrate 210. In some embodiments, the first substrate 210 and the second substrate 220 are interchangeable. At least one electronic component 130 is disposed between the first substrate 210 and the second substrate 220. A molding 150 is formed between the first substrate 210 and the second substrate 220 and encapsulates each electronic component 130. A shielding trench 160 is formed in the molding 150 and is disposed around the electronic component 130. The packaging structure of the present invention, by forming a shielding trench 160 for the electronic component 130 in the molding 150, can solve the problems of low substrate utilization and low shielding performance in the prior art.

[0034] Figure 1B This is a top view schematic diagram of the packaging structure according to an embodiment of the present invention. In some embodiments, the shielding trench 160 is a closed shape, and the closed shape may surround the electronic component 130 ( Figure 1A It should be understood that in other embodiments, the shielding trench 160 may employ other arrangements located around the electronic components.

[0035] Continue to refer to Figure 1A The shielding trench 160 can be filled with shielding material 165. In the illustrated embodiment, the second substrate 220 has a through hole 115 communicating with the shielding trench 160. In other embodiments, the through hole 115 communicating with the shielding trench 160 can be formed in the first substrate 210. The shielding material 165 is also filled into the through hole 115.

[0036] Furthermore, an interposer 116 is provided between the first substrate 210 and the second substrate 220. Additional electronic components 135 can also be formed on the upper surface of the first substrate 210. The additional electronic components 135 on the upper surface of the first substrate 210 may include sensors, microelectromechanical devices (MEMS), or optical devices. An additional shielding structure 190 covers the outer side of the package structure. The shielding structure 190 does not interfere with the function of the electronic components 135; for example, the shielding structure 190 may not cover the external sensing area of ​​the sensor, MEMS, or optical device. The lower surface of the second substrate 220 can be connected to the additional substrate 105 via the interposer 116, and additional electronic components 135 can be provided between the additional substrate 105 and the second substrate 220. A shielding trench 160 can also be configured between the second substrate 220 and the substrate 105, and the shielding trench 160 can be filled with shielding material.

[0037] Embodiments of the present invention also provide a method for forming an encapsulation structure. Figures 2A to 2G A schematic diagram illustrating multiple stages of a method for forming a package structure is shown. First, as... Figure 2AAs shown, an electronic component 130 is formed on a first substrate 210, and a mask 161 is formed around the electronic component 130. A process for curing the mask 161 can be performed. The mask 161 is a removable material and will be removed in a subsequent step; therefore, the mask 161 can also be referred to as a temporary material. In some embodiments, the material of the mask 161 can be, for example, a water-washable adhesive. In some embodiments, an adapter 116 can also be formed on the first substrate 210. Furthermore, additional electronic components 135 can also be formed on the lower surface of the first substrate 210. The additional electronic components 135 can include, but are not limited to, active devices, passive devices, or dies. In embodiments where the electronic component 135 is an active device, the active device can have a shielding layer 139, and the shielding layer 139 can be connected to the first substrate 210 by wire bonding to achieve a grounding effect.

[0038] Then, as Figure 2B As shown, the second substrate 220 is placed above the first substrate 210 and the mask 161. Electronic components 130 may also be disposed on the surface of the second substrate 220 opposite to the first substrate 210.

[0039] like Figure 2C A molding 150 is formed between the first substrate 210 and the second substrate 220. The molding 150 encapsulates the electronic components 130 on the surfaces of the first substrate 210 and the second substrate 220 and the sidewalls of the mask 161.

[0040] exist Figure 2D In the second substrate 220, an opening 115 communicating with the mask 161 is formed (corresponding to...). Figure 1A (Through hole 115 in the middle). Opening 115 is used to remove mask 161 in a subsequent step.

[0041] Then, as Figure 2E As shown, the mask 161 is removed via an opening in the second substrate 220. For example, the trench 160 (corresponding to) can be formed by removing the mask 161, which is a temporary material, through water washing. Figure 1A (The shielding trench 160 in the example). The sidewall of the opening 115 is discontinuous with the sidewall of the trench 160. In some embodiments, the width of the opening 115 may be smaller than the width of the trench 160.

[0042] exist Figure 2F In this process, shielding material 165 is filled into the trench 160 through the opening 115 in the second substrate 220. Simultaneously, shielding material 165 can also be filled into the opening 115. Then, as... Figure 2GAs shown, the resulting structure is flipped, and additional electronic components 135 can be formed on the lower surface of the second substrate 220. The lower surface of the second substrate 220 can be connected to the additional substrate 105 via an adapter 116, and the additional electronic components 135 can be disposed between the additional substrate 105 and the second substrate 220. An additional shielding structure 190 covers the outer side of the package structure.

[0043] This invention addresses the problems of low substrate utilization and low shielding performance in the prior art by providing a mask 161 for temporary material in the interlayer between the first substrate 210 and the second substrate 220 before forming the molded object 150, exposing the temporary material by forming an opening in one of the first substrate 210 and the second substrate 220 after forming the molded object 150, further removing the temporary material to form a trench 160, and filling the trench 160 with a shielding material 165 to form a shielding structure in the interlayer.

[0044] Figure 3 This is a side view schematic diagram of a packaging structure according to other embodiments of the present invention. Figure 3 In this configuration, the shielding trench 160 can contact only the second substrate 120 and not the first substrate 110. Meanwhile... Figure 1A In this embodiment, the shielding trench 160 contacts the first substrate 210 and the second substrate 220. In other embodiments, the shielding trench 160 may also contact only the first substrate 110 without contacting the second substrate 120. Figure 3 Other aspects can be compared with Figure 1A similar.

[0045] Figure 4 This is an enlarged view of the through-hole in the packaging structure according to other embodiments of the present invention. Figure 4 As shown, the first substrate 110 may have a grounding trace 118, and the shielding material 165 in the through hole 115 is connected to the grounding trace for grounding.

[0046] Figure 5A and Figure 5B This is a top view schematic diagram of a packaging structure according to another embodiment of the present invention. The electronic component 130 includes a first electronic component 131 and a second electronic component 132. At least a partial shielding trench 160 is located between the first electronic component 131 and the second electronic component 132. For example, in... Figure 5A In the middle, the shielding trench 160 extends vertically between the first electronic component 131 and the second electronic component 132 to space the first electronic component 131 and the second electronic component 132. Figure 5B In this embodiment, the shielding trench 160 also extends laterally above the second electronic component 132. It should be understood that other arrangements of the shielding trench 160 are also within the scope of this invention.

[0047] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for forming an encapsulation structure, characterized in that, include: A mask is provided around electronic components on a first substrate. After the mask is provided, a second substrate is placed above the first substrate and the mask. A molding is formed between the first substrate and the second substrate, the molding encapsulating electronic components on the surfaces of the first substrate and the second substrate and the sidewalls of the mask. After the molded object is formed, a through hole is formed in one of the second substrate and the first substrate to expose the mask. The mask is removed through the through hole to form a trench. Shielding material is filled into the trench through the through hole and simultaneously filled into the through hole. The mask has two ends located on one side of the first substrate and one side of the second substrate. The through hole exposes the wider end of the two ends. The sidewall of the through hole is discontinuous with the sidewall of the trench. The width of the through hole is smaller than the width of the trench.

2. The method according to claim 1, characterized in that, Also includes: The mask is cured before the molded object is formed.

3. The method according to claim 1, characterized in that, The trench is formed to reach the first substrate.

4. The method according to claim 1, characterized in that, The electronic component includes two electronic components, and at least a portion of the trench is located between the two electronic components.

5. A packaging structure, characterized in that, Formed using the method as described in any one of claims 1 to 4, comprising: A first substrate and a second substrate stacked together; An electronic component is located between the first substrate and the second substrate; Shielding trenches are provided around the electronic components.

6. The packaging structure according to claim 5, characterized in that, The shielding trench contacts only one of the first substrate and the second substrate.

7. The packaging structure according to claim 5, characterized in that, The shielding trench is a closed shape surrounding the electronic component.

8. The packaging structure according to claim 5, characterized in that, The shielding trench contains shielding material.

9. The packaging structure according to claim 5, characterized in that, The first substrate or the second substrate has a through hole communicating with the shielding trench.

10. The packaging structure according to claim 9, characterized in that, The shielding trench contains shielding material, which is also filled into the through hole.

11. The packaging structure according to claim 9, characterized in that, The through hole is a pre-set through hole in the first substrate or the second substrate.

12. The packaging structure according to claim 9, characterized in that, The sidewall of the through hole is discontinuous with the sidewall of the shielding trench.

13. The packaging structure according to claim 9, characterized in that, The width of the through hole is smaller than the width of the shielding trench.

14. The packaging structure according to claim 5, characterized in that, The electronic component includes a first electronic component and a second electronic component, and at least a portion of the shielding trench is located between the first electronic component and the second electronic component.

15. The packaging structure according to claim 8, characterized in that, The first substrate or the second substrate has a grounding trace, and the shielding material is connected to the grounding trace for grounding.

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