A bone-voiceprint sensor and electronic device

Abstract

The bone voiceprint sensor and the electronic device are provided, the bone voiceprint sensor comprises a base, an outer shell, a vibration assembly and a microphone assembly, the material of the outer shell is metal, the outer shell is fixedly arranged on the base, the outer shell and the base surround to form a containing cavity, the vibration assembly and the microphone assembly are arranged in the containing cavity, in the case that the vibration assembly picks up external vibration information and generates vibration, the microphone assembly forms an electric signal, a grounding layer is arranged on the base, the grounding layer is electrically connected with the outer shell, the grounding layer and the outer shell surround to form a shielding space, and the vibration assembly and the microphone assembly are located in the shielding space.

Description

Technical Field

[0001] This disclosure belongs to the field of sensor technology, and specifically relates to a bone conduction sensor and electronic device. Background Technology

[0002] A bone conduction sensor is a type of sensor that uses the vibration of a diaphragm to drive airflow and detect flow signals. A bone conduction sensor typically includes a housing, a vibrating component, and a sound-to-electrical conversion component. The housing forms a sealed cavity, making the bone conduction sensor less susceptible to external environmental influences. The vibrating component senses external vibrations and drives airflow. The sound-to-electrical conversion component converts the airflow changes generated by the vibration of the component into electrical signals, thus representing the vibration information.

[0003] However, existing bone conduction sensors are susceptible to external power frequency interference, which significantly affects their performance. Summary of the Invention

[0004] This disclosure aims to provide a bone voiceprint sensor and electronic device that helps to solve the problem that existing bone voiceprint sensors are susceptible to external power frequency interference.

[0005] In a first aspect, this disclosure provides a bone conduction sensor, including a base, a housing, a vibration component, and a microphone component. The housing is made of metal and is fixedly mounted on the base. The housing and the base enclose a receiving cavity. The vibration component and the microphone component are disposed within the receiving cavity. When the vibration component picks up external vibration information and generates vibration, the microphone component generates an electrical signal.

[0006] A grounding layer is provided on the base, and the grounding layer is electrically connected to the outer shell. The grounding layer and the outer shell enclose a shielding space, and the vibration component and the microphone component are located within the shielding space.

[0007] Optionally, the grounding layer includes a first layer and a second layer, the base includes a substrate and a retaining wall, the substrate and the retaining wall surround to form a mounting groove, the mounting groove and the outer shell surround to form the receiving cavity; the first layer is disposed on the substrate, the second layer is disposed on the retaining wall, and the first layer and the second layer are electrically connected.

[0008] Optionally, the side of the substrate closest to the barrier wall is designated as the first side, and the first layer is disposed on the first side; the side of the barrier wall closest to the substrate is designated as the second side, the inner side of the barrier wall is designated as the third side, and the side of the barrier wall away from the substrate is designated as the fourth side; the second layer is disposed on the second side, the third side, and the fourth side, and the first layer and the second layer disposed on the second side are welded together.

[0009] Optionally, the second layer on the fourth side and the edge of the outer casing are welded together.

[0010] Optionally, the grounding layer further includes a third layer, the microphone assembly is disposed on the substrate, the substrate has a cavity, the microphone assembly has a back cavity, the cavity communicates with the back cavity, the third layer is disposed on the side of the substrate away from the microphone assembly, and the third layer is electrically connected to the second layer.

[0011] Optionally, the vibration assembly is fixedly mounted on the housing.

[0012] Optionally, the housing has a mounting step along its circumferential direction, and the edge of the vibration assembly is fixedly disposed on the mounting step.

[0013] Optionally, the housing includes a top plate, and along the circumference of the top plate, the edge of the top plate extends toward the base to form a bent sidewall, a portion of the bent sidewall forming the mounting step.

[0014] Optionally, the vibration assembly includes:

[0015] The support portion is a closed ring structure;

[0016] A diaphragm, the edge of which is disposed on the outer surface of the support portion on the side having an opening;

[0017] A mass block, wherein the mass block is disposed in the middle of the diaphragm;

[0018] The support portion is fixedly connected to the outer shell; or, the edge of the diaphragm is fixedly connected to the outer shell.

[0019] Secondly, this disclosure provides an electronic device including the bone conduction sensor described above.

[0020] One technical advantage of this disclosure is that by setting a grounding layer on the base and then electrically connecting the grounding layer to the outer casing, a shielding space is formed between the grounding layer and the outer casing. The vibration component and microphone component of the bone voiceprint sensor are set in the shielding space, which can prevent the bone voiceprint sensor from being interfered with by external power frequency and ensure the performance of the bone voiceprint sensor.

[0021] Other features and advantages of this disclosure will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0022] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments of the present disclosure and, together with their description, serve to explain the principles of the present disclosure.

[0023] Figure 1 This is a cross-sectional view of a first embodiment of a bone voiceprint sensor provided in this disclosure;

[0024] Figure 2 This is a cross-sectional view of a second embodiment of a bone voiceprint sensor provided in this disclosure.

[0025] Figure label:

[0026] 1. Base; 101. Substrate; 102. Retaining wall; 2. Mounting groove; 3. Grounding layer; 301. First layer; 302. Second layer; 303. Third layer; 4. Outer shell; 401. Top plate; 402. Bending side wall; 5. Microphone assembly; 6. Vibration assembly; 601. Support; 602. Diaphragm; 603. Mass block; 7. Mounting step; 8. Cavity; 9. Back cavity. Detailed Implementation

[0027] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present disclosure.

[0028] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit this disclosure or its application or use.

[0029] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0030] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0031] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0032] Firstly, this disclosure provides a bone voiceprint sensor, such as Figure 1 and Figure 2As shown, the device includes a base 1, a housing 4, a vibration component 6, and a microphone component 5. The housing 4 is made of metal and is fixedly mounted on the base 1. The housing 4 and the base 1 together form a receiving cavity. The vibration component 6 and the microphone component 5 are disposed within the receiving cavity. When the vibration component 6 picks up external vibration information and vibrates, the microphone component 5 generates an electrical signal. A grounding layer 3 is provided on the base 1 and is electrically connected to the housing 4. The grounding layer 3 and the housing 4 together form a shielding space, within which the vibration component 6 and the microphone component 5 are located.

[0033] The outer shell 4 and the base 1 surround and form a receiving cavity. Alternatively, the outer shell 4 may have a groove, and the outer shell 4 may be fastened to the base 1 to form the receiving cavity; alternatively, the base 1 may have a groove, and the outer shell 4 may cover the opening of the groove on the base 1 to form the receiving cavity; furthermore, both the base 1 and the outer shell 4 may have grooves, and the groove on the outer shell 4 and the groove on the base 1 may communicate to jointly form the receiving cavity. The substrate 101 may be a circuit board.

[0034] The vibration component 6 and the microphone component 5 are disposed within the sealed receiving cavity. The vibration component 6 is used to pick up external vibration information and drive airflow based on this information. For example, a bone conduction sensor is attached to the user's body near the vocal cords. When the user speaks, the vibration generated by the vocal cords is transmitted to the bone conduction sensor, causing the vibration component 6 on the bone conduction sensor to vibrate. Simultaneously, the vibration component 6 vibrates, driving airflow around it. This airflow acts on the microphone component 5. The microphone component 5 converts the changes in airflow generated by the vibration component 6 into electrical signals, realizing the sound-to-electricity conversion of the bone conduction sensor.

[0035] A grounding layer 3 is provided on the base 1. The grounding layer 3 is connected to the ground and can form an electromagnetic shield, blocking interference from external electromagnetic waves. The grounding layer 3 can be located inside the base 1, for example, the grounding layer 3 can be sandwiched in the base 1. The grounding layer 3 can also be located on the surface of the base 1. The grounding layer 3 is electrically connected to the outer shell 4. When the grounding layer 3 is grounded, the outer shell 4 is also grounded, thereby enabling the outer shell 4 to also form an electromagnetic shield.

[0036] The grounding layer 3 and the outer shell 4 form a shielding space, within which the vibration component 6 and the microphone component 5 are located. For example, the base 1 has a first surface, on which a grounding layer 3 is disposed. The outer shell 4 forms a mounting cavity, and the outer shell 4 is fastened to the grounding layer 3 on the base 1. The edges of the outer shell 4 are then soldered to the grounding layer 3 using solder paste. The mounting cavity of the substrate 101 and the outer shell 4 forms the shielding space. The vibration component 6 and the microphone component 5 are disposed within this shielding space.

[0037] This disclosure provides a grounding layer 3 on the base 1 and then electrically connects the grounding layer 3 to the outer shell 4, forming a shielding space between the grounding layer 3 and the outer shell 4. The vibration component 6 and microphone component 5 of the bone voiceprint sensor are placed in the shielding space, which can prevent the bone voiceprint sensor from being interfered with by external power frequency and ensure the performance of the bone voiceprint sensor.

[0038] Optionally, the grounding layer 3 includes a first layer 301 and a second layer 302. The base 1 includes a substrate 101 and a retaining wall 102. The substrate 101 and the retaining wall 102 form a mounting groove 2, and the mounting groove 2 and the outer shell 4 form the receiving cavity. The first layer 301 is disposed on the substrate 101, and the second layer 302 is disposed on the retaining wall 102. The first layer 301 and the second layer 302 are electrically connected. This facilitates the placement of the grounding layer 3 on the base 1, allowing the grounding layer 3 to be formed in conjunction with the outer shell 4, which helps to form complete electromagnetic shielding for the bone conduction sensor.

[0039] The first layer 301 can be disposed within the substrate 101 or on the surface of the substrate 101. Similarly, the second layer 302 can be disposed within the barrier 102 or on the surface of the barrier 102. Of course, through holes or other holes can also be formed on the first layer 301 or the second layer 302, which is also included in the meaning of the shielding space formed by the grounding layer 3 and the outer shell 4.

[0040] Furthermore, when the first layer 301 is disposed on the surface of the substrate 101, other layers may also be disposed on the side of the first layer 301 facing away from the substrate 101 to assist the bone conduction sensor in working properly. For example, a solder resist layer or a gold layer may be disposed on the side of the first layer 301 facing away from the substrate 101. Similarly, when the second layer 302 is disposed on the surface of the barrier 102, other layers may also be disposed on the side of the second layer 302 facing away from the barrier 102. For example, a solder resist layer or a gold layer may be disposed on the side of the second layer 302 facing away from the substrate 101.

[0041] In one specific embodiment, the substrate 101 has a flat plate structure, and a first layer 301 is disposed on one outer surface of the substrate 101. The baffle 102 has a through column structure, and the second layer 302 is disposed on the inner surface of the baffle 102. Then, the side of the baffle 102 with the opening is fixedly disposed on the first layer 301 on the substrate 101, and the first layer 301 and the second layer 302 are electrically connected.

[0042] Optionally, the side of the substrate 101 closest to the baffle 102 is designated as the first side, and the first layer 301 is disposed on the first side; the side of the baffle 102 closest to the substrate 101 is designated as the second side, the inner side of the baffle 102 is designated as the third side, and the side of the baffle 102 opposite to the substrate 101 is designated as the fourth side. The second layer 302 is disposed on the second side, the third side, and the fourth side, and the first layer 301 and the second layer 302 disposed on the second side are soldered together. This design allows for a more reliable connection between the first layer 301 and the second layer 302, ensuring the reliability of the shielding space.

[0043] In one specific embodiment, the substrate 101 has a flat plate structure, and a first layer 301 is disposed on one outer surface of the substrate 101. The baffle 102 has a through columnar structure, and the second layer 302 is continuously disposed on the side of the baffle 102 near the substrate 101, the inner side of the baffle 102, and the side of the baffle 102 away from the substrate 101. That is, the second layer 302 is disposed on all three consecutive surfaces of the baffle 102. The second layer 302 on the side of the baffle 102 near the substrate 101 is soldered to the first layer 301 on the substrate 101 using solder paste, so that the baffle 102 is fixed to the substrate 101. Since the soldered first layer 301 and second layer 302 are parallel to each other, soldering them together ensures a more reliable connection between them and helps to form a complete shielding space, thus improving the shielding effect of the bone conduction sensor.

[0044] Optionally, the second layer 302 on the fourth side and the edge of the outer casing 4 are welded together. This further ensures the integrity of the shielding space and improves the shielding effect of the bone conduction sensor.

[0045] In one specific embodiment, the outer casing 4 is a box-shaped structure with an opening on one side. The circumferential edge of the opening of the outer casing 4 is soldered to the second layer 302 disposed on the side of the barrier 102 opposite to the substrate 101 using solder paste. This ensures that the shielding space is a closed space (not considering openings such as vias in the grounding layer 3), further guaranteeing the shielding effect of the bone conduction sensor.

[0046] Optionally, the grounding layer 3 further includes a third layer 303, the microphone assembly 5 is disposed on the substrate 101, the substrate 101 has a cavity 8, the microphone assembly 5 has a back cavity 9, the cavity 8 is connected to the back cavity 9, the third layer 303 is disposed on the side of the substrate 101 away from the microphone assembly 5, and the third layer 303 is electrically connected to the second layer 302.

[0047] The substrate 101 has a cavity 8, and the microphone assembly 5 disposed on the substrate 101 has a back cavity 9, with the cavity 8 communicating with the back cavity 9, which improves the conversion performance of the bone conduction sensor. Furthermore, the volume of the cavity 8 in the substrate 101 is larger than the volume of the back cavity 9 of the microphone assembly 5, which further improves the conversion performance of the bone conduction sensor. A third layer 303 is disposed on the side of the substrate 101 facing away from the microphone assembly 5, which prevents external power frequency from entering the bone conduction sensor through the communication between the cavity 8 and the back cavity 9, further improving the performance of the bone conduction sensor. The third layer 303 and the second layer 302 can be electrically connected through vias formed in the substrate 101. Other layers can also be disposed on the side of the third layer 303 facing away from the substrate 101 to facilitate better cooperation or operation of the bone conduction sensor with other components; for example, a solder mask layer can be disposed on the side of the third layer 303 facing away from the substrate 101.

[0048] In one specific embodiment, a cavity 8 is formed within the substrate 101. The microphone assembly 5 includes a MEMS chip, which is fixedly mounted on the substrate 101. A back cavity 9 is formed in the direction of the MEMS chip facing the substrate 101. A connecting hole is formed in the cavity 8 facing the microphone assembly 5, and the connecting hole connects the cavity 8 and the back cavity 9. A third layer 303 is provided on the side of the substrate 101 away from the microphone assembly 5, and the cavity 8 is located between the third layer 303 and the microphone assembly 5.

[0049] Optionally, the vibration component 6 is fixedly mounted on the housing 4. This allows the vibration component 6 to contact the housing 4, facilitating electrical connection between the vibration component 6 and the housing 4, grounding the vibration component 6, and further improving the performance of the bone conduction sensor.

[0050] Optionally, the housing 4 has a mounting step 7 along its circumferential direction, and the edge of the vibration component 6 is fixedly disposed on the mounting step 7. This increases the contact area between the vibration component 6 and the housing 4, which is beneficial for grounding the vibration component 6 and improving the performance of the bone conduction sensor. Furthermore, due to the increased contact area between the vibration component 6 and the housing 4, the vibration component 6 can be reliably fixed to the housing 4, preventing it from falling off and ensuring the performance of the bone conduction sensor.

[0051] In one specific embodiment, the mounting step 7 fixes one side of the outer surface of the vibration component 6 as a closed annular outer surface, such as a circular ring or a square ring. The edge of the vibration component 6 is continuously connected to the closed annular outer surface of the mounting step 7.

[0052] Optionally, the mounting step 7 is fixed so that one side of the vibration component 6 faces the base 1. This facilitates the installation of the vibration component 6. For example, when the outer casing 4 is a box-shaped structure with an opening, the vibration component 6 is inserted into the casing through the opening of the outer casing 4, and then the vibration component 6 is attached to the mounting step 7, making the installation process convenient and quick.

[0053] Optionally, the outer casing 4 includes a top plate 401. Along the circumference of the top plate 401, the edge of the top plate 401 extends towards the base 1 to form a bent sidewall 402, a portion of which forms the mounting step 7. That is, the bent sidewall 402 and the top plate 401 enclose a mounting cavity. The bent sidewall 402 itself forms the mounting step 7 due to bending, avoiding the need for additional components for mounting the vibration assembly 6 within the outer casing 4. The overall structure is simple and reliable. Furthermore, the outer casing 4 structure of this embodiment can be formed in one piece by stamping or other methods, facilitating manufacturing. Simultaneously, placing the vibration assembly 6 within the outer casing 4 effectively reduces the external dimensions of the bone conduction sensor of this embodiment.

[0054] Optionally, the outer surface of the mounting step 7 on the side where the vibration assembly 6 is mounted is parallel to the top plate 401. This facilitates the mounting of the vibration assembly 6 on the housing 4.

[0055] In one specific implementation, such as Figure 1As shown, the edge of the top plate 401 bends and extends to form an inclined first sidewall. Then, the edge of the first sidewall bends and extends away from the top plate 401 to form a second sidewall parallel to the top plate 401. Finally, the second sidewall bends and extends towards the base 1 to form a third sidewall perpendicular to the second sidewall. The edge of the third sidewall is fixedly mounted on the base 1. The second sidewall parallel to the top plate 401 is the mounting step 7, and the vibration assembly 6 is fixedly mounted on the inner surface of the second sidewall. The distance between the second sidewall and the top plate 401 is the space for the vibration assembly 6 to vibrate.

[0056] In another specific implementation, such as Figure 2 As shown, the edge of the top plate 401 bends and extends towards the base 1 to form a fourth sidewall perpendicular to the top plate 401. Then, the edge of the fourth sidewall bends and extends away from the top plate 401 to form a fifth sidewall parallel to the top plate 401. Finally, the fifth sidewall bends and extends towards the base 1 to form a sixth sidewall perpendicular to the fifth sidewall. The edge of the sixth sidewall is fixedly mounted on the base 1. The fifth sidewall parallel to the top plate 401 is the mounting step 7, and the vibration assembly 6 is fixedly mounted on the inner surface of the fifth sidewall. The distance between the fifth sidewall and the top plate 401 is the space for the vibration assembly 6 to vibrate.

[0057] Optionally, such as Figure 1 As shown, the vibration assembly 6 includes a support portion 601, a diaphragm 602, and a mass block 603. The support portion 601 is a closed annular structure. The edge of the diaphragm 602 is disposed on the outer surface of the support portion 601 on the side with the opening. The mass block 603 is disposed in the middle of the diaphragm 602. The support portion 601 is fixedly connected to the outer shell 4; or, the edge of the diaphragm 602 is fixedly connected to the outer shell 4.

[0058] In other words, a support portion 601 and a mass block 603 are provided on the diaphragm 602. The support portion 601 supports the diaphragm 602, keeping it taut. The mass block 603 detects external vibration information; when the bone conduction sensor vibrates, the mass block 603, due to its own inertia, drives the diaphragm 602 to vibrate, causing the diaphragm 602 to agitate the surrounding airflow. The support portion 601 is located at the edge of the diaphragm 602, and the suspended diaphragm 602 located in the middle of the support portion 601 can vibrate under the influence of the mass block 603.

[0059] The support portion 601 is fixedly connected to the outer shell 4. That is, the side of the support portion 601 facing away from the diaphragm 602 is connected to the outer shell 4, reducing contact between the diaphragm 602 and other components, preventing the diaphragm 602 from being affected by other components and thus ensuring the reliability of the diaphragm 602. Furthermore, the support portion 601 is made of a conductive material; connecting the support portion 601 to the outer shell 4 facilitates grounding of the vibration assembly 6, ensuring the performance of the bone conduction sensor.

[0060] The edge of the diaphragm 602 is fixedly connected to the outer shell 4. That is, at least one support portion 601 is spaced between the diaphragm 602 and the base 1 to ensure that the vibration assembly 6 has sufficient space to generate vibration. Furthermore, the support portion 601 is made of metal and contacts the outer shell 4, which facilitates grounding of the vibration assembly 6 and ensures the performance of the bone conduction sensor.

[0061] Optionally, such as Figure 1 or Figure 2 As shown, the housing 4 includes a top plate 401, the diaphragm 602 is disposed opposite to the top plate 401, and the mass block 603 is disposed on the side of the diaphragm 602 near the top plate 401. This avoids the mass block 603 colliding with the microphone assembly 5 when the vibration assembly 6 vibrates, thus preventing the bone conduction sensor of this embodiment from malfunctioning.

[0062] Optionally, the base 1 has a mounting groove 2, and the outer shell 4 surrounds and forms a mounting cavity. The mounting groove 2 of the base 1 and the mounting cavity of the outer shell 4 form the receiving cavity. The vibration component 6 is disposed within the mounting cavity of the outer shell 4, and the microphone component 5 is disposed within the mounting groove 2 of the base 1. This arrangement helps to reduce the distance between the vibration component 6 and the microphone component 5, thereby reducing the cavity size between them and improving the performance of the bone conduction sensor.

[0063] In one specific implementation, such as Figure 1 and Figure 2 As shown, the microphone assembly 5 includes a MEMS chip and an ASIC chip. A mounting slot 2 is provided on the base 1, and the MEMS chip and the ASIC chip are fixedly disposed at the bottom of the mounting slot 2, and are electrically connected. A housing 4 is fixedly disposed on the base 1, and the vibration assembly 6 is fixedly disposed within the housing 4. The vibration assembly 6 and the microphone assembly 5 are arranged opposite to each other.

[0064] Furthermore, the height of both sides of the mounting groove 2 of the base 1 can be reduced, and the vibration component 6 fixed on the housing 4 can be positioned close to the base 1. While ensuring that the vibration component 6 can vibrate normally, the cavity between the vibration component 6 and the microphone component 5 can be further reduced to improve the performance of the bone conduction sensor.

[0065] Secondly, this disclosure provides an electronic device including the bone conduction sensor described above.

[0066] While specific embodiments of this disclosure have been described in detail by way of example, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of this disclosure. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of this disclosure. The scope of this disclosure is defined by the appended claims.

Claims

1. A bone conduction sensor, characterized in that, The device includes a base, a housing, a vibration component, and a microphone component. The housing is made of metal and is fixedly mounted on the base. The housing and the base together form a receiving cavity. The vibration component and the microphone component are disposed within the receiving cavity. When the vibration component picks up external vibration information and generates vibration, the microphone component generates an electrical signal. A grounding layer is provided on the base, the grounding layer is electrically connected to the outer shell, and the grounding layer and the outer shell enclose a shielding space, in which the vibration component and the microphone component are located; The grounding layer includes a first layer and a second layer. The base includes a substrate and a retaining wall. The substrate and the retaining wall form a mounting groove, and the mounting groove and the outer shell form the receiving cavity. The first layer is disposed on the substrate, and the microphone assembly is disposed on the first layer. The second layer is disposed on the retaining wall. The first layer and the second layer are electrically connected, and the first layer is welded to the second layer. The second layer is welded to the edge of the outer shell. The side of the substrate closest to the baffle wall is the first side, and the first layer is disposed on the first side; the side of the baffle wall closest to the substrate is the second side, the inner side of the baffle wall is the third side, and the side of the baffle wall away from the substrate is the fourth side; the second layer is disposed on the second side, the third side, and the fourth side, and the first layer and the second layer disposed on the second side are welded together. The substrate has a cavity, the microphone assembly has a back cavity, the cavity is connected to the back cavity, and the volume of the cavity is larger than the volume of the back cavity; The vibration assembly is fixedly mounted on the housing, and the vibration assembly fixed on the housing is positioned close to the base.

2. The bone conduction sensor according to claim 1, characterized in that, The second layer is welded to the edge of the outer shell on the fourth side.

3. The bone conduction sensor according to claim 1, characterized in that, The grounding layer further includes a third layer. The microphone assembly is disposed on the substrate. The third layer is disposed on the side of the substrate opposite to the microphone assembly. The third layer is electrically connected to the second layer.

4. The bone conduction sensor according to claim 3, characterized in that, Along the circumferential direction of the housing, the housing has a mounting step, and the edge of the vibration assembly is fixedly disposed on the mounting step.

5. The bone conduction sensor according to claim 4, characterized in that, The housing includes a top plate, and along the circumference of the top plate, the edge of the top plate extends toward the base to form a bent sidewall, a portion of the bent sidewall forming the mounting step.

6. The bone conduction sensor according to claim 3, characterized in that, The vibration assembly includes: The support portion is a closed ring structure; A diaphragm, the edge of which is disposed on the outer surface of the support portion on the side having an opening; A mass block, wherein the mass block is disposed in the middle of the diaphragm; The support portion is fixedly connected to the outer shell; or, the edge of the diaphragm is fixedly connected to the outer shell.

7. An electronic device, characterized in that, Includes the bone voiceprint sensor as described in any one of claims 1-6.

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