Photosensitive resin composition, photosensitive element, and method for manufacturing wiring substrate

Abstract

The present application provides a photosensitive resin composition containing a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and an anthracene-based sensitizer, the binder polymer including a polymer (a) having a hydroxyalkyl (meth) acrylate unit and a styrene or styrene derivative unit, and the content of the styrene or styrene derivative unit being 40 mass% or more.

Description

Technical Field

[0001] This invention relates to a photosensitive resin composition, a photosensitive element, and a method for manufacturing a wiring substrate. Background Technology

[0002] In the manufacture of wiring boards, resist patterns are formed to obtain the desired wiring. Photosensitive resin compositions are widely used for forming resist patterns. In recent years, with the miniaturization and high density of electronic devices, there is a demand for forming finer wiring on wiring boards than ever before. As manufacturing methods to achieve this requirement, MSAP (Modified Semi-Additive Process) and SAP (Semi-Additive Process) have attracted attention. In these methods, to form fine wiring, it is necessary to form resist patterns with a tightness of less than 7 μm and a resolution of less than 12 μm.

[0003] To date, photosensitive resin compositions have improved the resolution and adhesion of the formed resist pattern by adding photosensitizers. Anthracene derivatives such as 9,10-dibutoxyanthracene (DBA) have been studied as photosensitizers (see, for example, Patent Document 1).

[0004] Previous technical documents

[0005] Patent documents

[0006] Patent Document 1: International Publication No. 2007 / 004619 Summary of the Invention

[0007] The technical problem to be solved by the invention

[0008] However, in the photosensitive resin composition containing DBA described in Patent Document 1, the formation of a resist pattern with an adhesion of less than 7 μm and a resolution of less than 12 μm has not yet been achieved, and there is a need to improve the adhesion and resolution of the obtained resist pattern in the photosensitive resin composition.

[0009] Therefore, the object of the present invention is to provide a photosensitive resin composition and a photosensitive element capable of forming resist patterns with excellent adhesion and resolution, as well as a method for manufacturing a wiring substrate using these methods.

[0010] means for solving technical problems

[0011] To achieve the above objectives, the present invention provides a photosensitive resin composition comprising an adhesive polymer, a photopolymerizable compound, a photopolymerization initiator, and an anthracene sensitizer, wherein the adhesive polymer comprises a polymer having (meth)acrylate hydroxyalkyl ester units and styrene or styrene derivative units, and the content of the styrene or styrene derivative units is 40% by mass or more (a).

[0012] According to the above-described photosensitive resin composition, by combining the specific polymer (a) and anthracene sensitizer, a resist pattern with excellent adhesion and resolution can be formed. This is believed to be because polymer (a) contains hydroxyalkyl (meth)acrylate units and more than 40% by mass of styrene or styrene derivative units, thereby improving the water absorption of polymer (a) and its dispersibility in the photosensitive resin composition. Furthermore, by combining this polymer (a) with the anthracene sensitizer, high developability and high adhesion can be achieved.

[0013] In the above-described photosensitive resin composition, the photopolymerizable compound may further comprise a polyfunctional monomer having two or more reactive groups that react via free radicals and having a total of 2 to 40 oxoethylidene and / or oxopropylidene groups. By including the above-described polyfunctional monomers, the alkali resistance of the obtained resist pattern can be further improved, and superior adhesion can be obtained.

[0014] In the above-described photosensitive resin composition, the photopolymerizable compound may further contain 2,2-bis(4-((meth)acryloyloxypolyethoxy)phenyl)propane in an amount of 10 or more oxyethylidenes. By including the above compound, the adhesion and resolution of the obtained resist pattern can be further improved.

[0015] In the above-described photosensitive resin composition, the photopolymerizable compound may further comprise 2,2-bis(4-((meth)acryloyloxypolyethoxy)phenyl)propane in an amount of less than 10 oxyethylides. By including the above compound, adhesion can be further improved. By setting the amount of oxyethylides to less than 10, the molecular weight between crosslinking points of the exposed portion decreases, swelling of the exposed portion in the developer is suppressed, and adhesion is improved.

[0016] In the above-mentioned photosensitive resin composition, the above-mentioned photopolymerizable compound may further include 2,2-bis(4-((meth)acryloyloxypolyethoxy)phenyl)propane with an oxyethylidene quantity of 10 or more and 2,2-bis(4-((meth)acryloyloxypolyethoxy)phenyl)propane with an oxyethylidene quantity of less than 10.

[0017] In the above-described photosensitive resin composition, the weight-average molecular weight of the polymer (a) can be 30,000 to 40,000. By using this polymer (a), the dispersibility in the photosensitive resin composition can be further improved, and superior developability and adhesion can be achieved.

[0018] In the above-described photosensitive resin composition, the content of the anthracene sensitizer is 0.2 parts by mass or more and less than 0.8 parts by mass relative to 100 parts by mass of the total amount of the adhesive polymer and the photopolymerizable compound. By keeping the content of the anthracene sensitizer within this range, superior developability and adhesion can be achieved, and the resist pattern shape can be improved. Furthermore, if the content of the anthracene sensitizer is less than 0.8 parts by mass, the precipitation of the anthracene sensitizer on the surface of the photosensitive resin layer formed using the photosensitive resin composition can be suppressed when forming the photosensitive element and storing it under cold conditions.

[0019] The present invention also provides a photosensitive element comprising: a support; and a photosensitive resin layer formed on the support using the photosensitive resin composition of the present invention described above.

[0020] The present invention also provides a method for manufacturing a wiring substrate, comprising: a step of disposing a photosensitive resin layer on a substrate using the photosensitive resin composition or the photosensitive element of the present invention described above; a step of photocuring a portion of the photosensitive resin layer; a step of removing the uncured portion of the photosensitive resin layer to form a resist pattern; and a step of forming a wiring layer on the portion of the substrate where the resist pattern is not formed.

[0021] Invention Effects

[0022] According to the present invention, a photosensitive resin composition and a photosensitive element capable of forming resist patterns with excellent adhesion and resolution can be provided, as well as a method for manufacturing a wiring substrate using the above. Attached Figure Description

[0023] Figure 1 This is a schematic cross-sectional view showing a photosensitive element according to one embodiment.

[0024] Figure 2 This is a schematic diagram illustrating a method for manufacturing a wiring board according to one embodiment. Detailed Implementation

[0025] The embodiments of the present invention will now be described in detail.

[0026] In this specification, the term "process" includes not only independent processes, but also processes that cannot be clearly distinguished from others, as long as the intended function of the process is achieved. The numerical range indicated by "~" means that the values ​​before and after "~" are included as minimum and maximum values, respectively. Regarding the term "layer," when viewed in a top view, it includes structures formed on a portion of a surface, in addition to structures with shapes formed on the entire surface. "(Meth)acrylic acid" refers to at least one of "acrylic acid" and its corresponding "methacrylic acid." The same applies to other similar expressions such as (meth)acrylates.

[0027] In this specification, "(poly)oxyethylidene" refers to a polyoxyethylidene or a polyoxyethylidene composed of oxyethylidene or two or more ethylidenes linked by ether bonds. "(poly)oxypropylene" refers to a polyoxypropylene or a polyoxypropylene composed of oxypropylene or two or more propylene groups linked by ether bonds. "EO modified" refers to a compound containing (poly)oxyethylidene. "PO modified" refers to a compound containing (poly)oxypropylene. "EO / PO modified" refers to a compound containing (poly)oxyethylidene and / or (poly)oxypropylene.

[0028] In this specification, the amount of each component in the composition refers to the total amount of the various substances present in the composition, unless otherwise specified, when multiple substances equivalent to each component are present in the composition. In this specification, "solid component" refers to the non-volatile component in the photosensitive resin composition other than volatile substances (water, solvents, etc.). That is, "solid component" refers to components other than solvents that do not volatilize and remain after drying the photosensitive resin composition as described later, and also includes components that are liquid, syrupy, or waxy at room temperature (25°C).

[0029] <Photosensitive Resin Composition>

[0030] The photosensitive resin composition according to this embodiment contains component (A): a binder polymer, component (B): a photopolymerizable compound, component (C): a photopolymerization initiator, and component (D): an anthracene sensitizer. Here, component (A) comprises a polymer (a) having (meth)acrylate hydroxyalkyl ester units and styrene or styrene derivative units, wherein the content of the aforementioned styrene or styrene derivative units is 40% by mass or more. Furthermore, the photosensitive resin composition according to this embodiment may further contain component (E): a polymerization inhibitor. Each component will be described below.

[0031] (A) Composition: Adhesive polymer

[0032] The photosensitive resin composition comprises one or more components (A). Examples of components (A) include acrylic resins, styrene resins, epoxy resins, amide resins, amide-epoxy resins, alkyd resins, and phenolic resins. From the viewpoint of further improving alkaline developability, component (A) may include acrylic resins. The photosensitive resin composition according to this embodiment comprises, as component (A), at least a polymer (a) having (meth)acrylate hydroxyalkyl ester units and styrene or styrene derivative units, wherein the content of the styrene or styrene derivative units is 40% by mass or more.

[0033] The polymer (a) described above has a (meth)acrylate hydroxyalkyl ester unit (a structural unit derived from (meth)acrylate hydroxyalkyl ester). Examples of (meth)acrylate hydroxyalkyl esters include methyl methacrylate, ethyl methacrylate, propyl methacrylate, butyl methacrylate, pentyl methacrylate, and hexyl methacrylate. Furthermore, in the (meth)acrylate hydroxyalkyl ester unit, if the alkyl portion has 3 or more carbon atoms, it may also have a branched structure.

[0034] The content of (meth)acrylate hydroxyalkyl ester units in polymer (a) is based on the total amount of monomer units constituting polymer (a). From the viewpoint of dispersibility, it can be 0.5% by mass or more, 0.75% by mass or more, or 1.0% by mass or more. From the viewpoint of water absorption, it can be 20% by mass or less, 15% by mass or less, or 8% by mass or less.

[0035] The polymer (a) described above has styrene or styrene derivative units (structural units derived from styrene or styrene derivatives), and the content of styrene or styrene derivative units is 40% by mass or more based on the total amount of monomer units constituting polymer (a). Styrene derivatives may be, for example, vinyltoluene, α-methylstyrene, etc.

[0036] The content of styrene and styrene derivatives in polymer (a) is 40% by mass or more based on the total amount of monomer units constituting polymer (a), but from the viewpoint of resolution, it may be 45% by mass or more, 47% by mass or more, or 50% by mass or more, and from the viewpoint of reproducibility, it may be 90% by mass or less, 85% by mass or less, or 80% by mass or less.

[0037] In addition to the structural units described above, the polymer (a) may also have structural units derived from (meth)acrylic acid, and may further have structural units derived from other monomers besides (meth)acrylic acid. There may be one or more other monomers.

[0038] Other monomers can be, for example, (meth)acrylates. Examples of (meth)acrylates include alkyl (meth)acrylates, cycloalkyl (meth)acrylates, and aryl (meth)acrylates.

[0039] From the viewpoint of improving alkaline developability and peeling properties, other monomers are preferably alkyl (meth)acrylates. The alkyl group of the alkyl (meth)acrylate can be, for example, methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, undecyl, dodecyl, or structural isomers thereof. From the viewpoint of further improving peeling properties, it can be an alkyl group having 1 to 4 carbon atoms.

[0040] When other monomers are alkyl (meth)acrylates, the content of alkyl (meth)acrylates is based on the total amount of monomers constituting component (A). From the viewpoint of excellent peeling properties, it can be 1% or more by mass, 2% or more by mass, or 3% or more by mass. From the viewpoint of further improving resolution and adhesion, it can be 80% or less by mass, 60% or less by mass, or 50% or less by mass.

[0041] Furthermore, other monomers include acrylamides such as diacetone acrylamide, acrylonitrile, ethers of vinyl alcohols such as vinyl-n-butyl ether, alkyl methacrylates, benzyl methacrylates such as benzyl methacrylate, tetrahydrofurfuryl methacrylate, dimethylaminoethyl methacrylate, diethylaminoethyl methacrylate, glycidyl methacrylate, 2,2,2-trifluoroethyl methacrylate, 2,2,3,3-tetrafluoropropyl methacrylate, α-bromoacrylic acid, α-chloroacrylic acid, β-furanyl (meth)acrylic acid, β-styryl (meth)acrylic acid, maleic acid, maleic anhydride, monomethyl maleate, monoethyl maleate, monoisopropyl maleate and other maleic acid monoesters, fumaric acid, cinnamic acid, α-cyanocinonic acid, itaconic acid, crotonic acid and propynic acid.

[0042] Component (A) may contain adhesive polymers other than polymer (a) mentioned above, or may consist only of polymer (a). From the viewpoint of obtaining better adhesion and resolution, the content of polymer (a) in component (A) may be 50-100% by mass or 80-100% by mass, based on the total amount of component (A).

[0043] From the viewpoint of achieving suitable development, the acid value of polymer (a) can be 100 mg KOH / g or more, 120 mg KOH / g or more, 140 mg KOH / g or more, or 150 mg KOH / g or more. From the viewpoint of improving the adhesion (developer resistance) of the cured photosensitive resin composition, the acid value of polymer (a) can be 250 mg KOH / g or less, 240 mg KOH / g or less, or 230 mg KOH / g or less. The acid value of polymer (a) can be adjusted by the content of the structural units constituting polymer (a) (e.g., structural units derived from (meth)acrylic acid). When component (A) contains other binder polymers besides polymer (a), the acid values ​​of the other binder polymers can also be within the above-mentioned ranges.

[0044] Regarding the weight-average molecular weight (Mw) of polymer (a), from the viewpoint of excellent adhesion (developer resistance) of the cured photosensitive resin composition, it can be 10,000 or more, 20,000 or more, 25,000 or more, or 30,000 or more; from the viewpoint of being able to develop appropriately, it can be 100,000 or less, 80,000 or less, 60,000 or less, or 40,000 or less. The dispersion (Mw / Mn) of polymer (a) can, for example, be 1.0 or more or 1.5 or more; from the viewpoint of further improving adhesion and resolution, it can be 3.0 or less or 2.5 or less. When component (A) includes other binder polymers besides polymer (a), the Mw of the other binder polymers can also be within the above range.

[0045] Weight-average molecular weight and dispersion can be measured, for example, by gel permeation chromatography (GPC) using a calibration curve of standard polystyrene. More specifically, they can be measured under the conditions described in the examples. Additionally, for compounds with low molecular weights, where it is difficult to measure them using the aforementioned weight-average molecular weight measurement methods, other methods can be used to measure the molecular weight and calculate its average value.

[0046] Regarding the content of component (A), based on the total amount of solid components in the photosensitive resin composition, from the viewpoint of excellent film formability, it can be 20% or more by mass, 30% or more by mass, or 40% or more by mass; from the viewpoint of superior sensitivity and resolution, it can be 90% or less by mass, 80% or less by mass, or 65% or less by mass.

[0047] The content of component (A) relative to the total amount of components (A) and (B) 100 parts by mass, from the viewpoint of excellent membrane formability, can be 30 parts by mass or more, 35 parts by mass or more, or 40 parts by mass or more. From the viewpoint of further improving sensitivity and resolution, it can be 70 parts by mass or less, 65 parts by mass or less, or 60 parts by mass or less.

[0048] (B) Components: Photopolymerizable compounds

[0049] The photosensitive resin composition comprises one or more components (B). Component (B) may be a compound polymerized by light, for example, a compound having olefinic unsaturated bonds. Component (B) may also contain a polyfunctional monomer having two or more reactive groups that react via free radicals. From the viewpoint of further improving alkaline developability, resolution, and peel properties after curing, component (B) may also contain a bisphenol A type (meth)acrylate compound.

[0050] Examples of bisphenol A type di(meth)acrylate compounds include 2,2-bis(4-((meth)acryloyloxypolyethoxy)phenyl)propane (2,2-bis(4-((meth)acryloyloxypentethoxy)phenyl)propane, 2,2-bis(4-((meth)acryloyloxypolypropoxy)phenyl)propane, 2,2-bis(4-((meth)acryloyloxypolybutoxy)phenyl)propane, 2,2-bis(4-((meth)acryloyloxypolyethoxypolypropoxy)phenyl)propane, etc. From the viewpoint of further improving resolution and peeling properties, component (B) may include 2,2-bis(4-((meth)acryloyloxypolyethoxy)phenyl)propane (2,2-bis(4-((meth)acryloyloxypentethoxy)phenyl)propane, etc.). As 2,2-bis(4-((meth)acryloyloxypolyethoxy)phenyl)propane, compounds with 10 or more oxyethylidenes can be used, compounds with fewer than 10 oxyethylidenes can also be used, and compounds with 10 or more oxyethylidenes and compounds with fewer than 10 oxyethylidenes can be used simultaneously.

[0051] From the perspective of further improving the resolution of the resist, the content of bisphenol A type (meth)acrylate compounds, based on the total amount of component (B), can be more than 20% by mass or more than 40% by mass, or less than 100% by mass, less than 95% by mass or less than 90% by mass.

[0052] From the viewpoint of further appropriately improving resolution and flexibility, component (B) may also include α,β-unsaturated ester compounds obtained by reacting a polyol with an α,β-unsaturated carboxylic acid. Examples of α,β-unsaturated ester compounds include, for example, polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, EO-modified polypropylene glycol and other polyalkylene glycol di(meth)acrylates, trimethylolpropane di(meth)acrylate, trimethylolpropane tri(meth)acrylate, EO-modified trimethylolpropane tri(meth)acrylate, PO-modified trimethylolpropane tri(meth)acrylate, EO / PO-modified trimethylolpropane tri(meth)acrylate, tetramethylolmethane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, etc.

[0053] From the viewpoint of improving sensitivity and adhesion, component (B) may also contain compounds having three or more (meth)acryloyl groups. Such compounds may include trimethylolpropane tri(meth)acrylate, EO-modified trimethylolpropane tri(meth)acrylate, PO-modified trimethylolpropane tri(meth)acrylate, EO / PO-modified trimethylolpropane tri(meth)acrylate, EO-modified pentaerythritol tetra(meth)acrylate, EO-modified di(trimethylolpropane tetra(meth)acrylate, and EO-modified dipentaerythritol hexa(meth)acrylate.

[0054] The content of α,β-unsaturated ester compounds, based on the total amount of component (B), can be 20% or more by mass or 30% or more by mass from the viewpoint of improving flexibility, and can be 70% or less by mass or 60% or less by mass from the viewpoint of further improving resolution.

[0055] The photosensitive resin composition, as component (B), may also contain other photopolymerizable compounds besides bisphenol A (meth)acrylate compounds and α,β-unsaturated ester compounds.

[0056] Other photopolymerizable compounds include nonylphenoxy polyethylene oxyacrylate, phthalic acid compounds, alkyl (meth)acrylates, and photopolymerizable compounds having at least one cationicly polymerizable cyclic ether group (such as oxobutane compounds). From the viewpoint of further appropriately improving resolution, adhesion, resist shape, and post-curing peel properties, other photopolymerizable compounds may be at least one selected from the group consisting of nonylphenoxy polyethylene oxyacrylate and phthalic acid compounds.

[0057] Examples of nonylphenoxy polyethylene oxyacrylates include nonylphenoxy triethyleneoxy acrylate, nonylphenoxy tetraethyleneoxy acrylate, nonylphenoxy pentaethyleneoxy acrylate, nonylphenoxy hexaethyleneoxy acrylate, nonylphenoxy heptaethyleneoxy acrylate, nonylphenoxy octaethyleneoxy acrylate, nonylphenoxy nonaethyleneoxy acrylate, nonylphenoxy decaethyleneoxy acrylate, and nonylphenoxy undecaethyleneoxy acrylate.

[0058] Phthalic acid compounds include, for example, γ-chloro-β-hydroxypropyl-β'-(meth)acryloyloxyethyl-phthalate (also known as 3-chloro-2-hydroxypropyl-2-(meth)acryloyloxyethyl-phthalate), β-hydroxyethyl-β'-(meth)acryloyloxyethyl-phthalate, β-hydroxypropyl-β'-(meth)acryloyloxyethyl-phthalate, etc., preferably γ-chloro-β-hydroxypropyl-β'-(meth)acryloyloxyethyl-phthalate.

[0059] When component (B) contains other photopolymerizable compounds, from the viewpoint of further appropriately improving resolution, adhesion, resist shape and post-curing peel properties, the content of other photopolymerizable compounds may be more than 1%, more than 3%, or more than 5% by mass, or less than 30%, less than 25%, or less than 20% by mass, based on the total amount of component (B).

[0060] In the above compounds, from the viewpoint of further improving adhesion and resolution, component (B) may also include compounds having a total of 2 to 40 oxyethylidene (EO groups) and / or oxypropylidene (PO groups) within the molecule. From the viewpoint of further improving adhesion and resolution, the total number of EO groups and / or PO groups may be 2 to 40 or 2 to 30.

[0061] From the viewpoint of further improving adhesion and resolution, the content of compounds having a total of 2 to 40 EO groups and / or PO groups can be 2 to 15% by mass, 4 to 12% by mass, or 5 to 8% by mass, based on the total amount of component (B).

[0062] From the viewpoint of further improving sensitivity and resolution, the content of component (B) can be more than 3% by mass, more than 10% by mass, or more than 25% by mass, based on the total amount of solid components in the photosensitive resin composition. From the viewpoint of excellent film formability, it can be less than 70% by mass, less than 60% by mass, or less than 50% by mass.

[0063] (C) Component: Photopolymerization initiator

[0064] The photosensitive resin composition comprises one or more (C) components. Examples of (C) components include hexaaryl biimidazole compounds; benzophenone; 2-benzyl-2-dimethylamino-1-(4-morpholinylphenyl)-1-butanone; 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone; 4-(2-hydroxyethoxy)phenyl-2-(hydroxy-2-propyl)one; and 2-methyl-1-[4-(methylthio)phenyl] Aromatic ketones such as -2-morpholine-propane-1; quinones such as alkyl anthraquinones; benzoin ether compounds such as benzoin alkyl ethers; benzoin compounds such as benzoin and alkylbenzoin; benzyl derivatives such as benzyl dimethyl ketal; bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide; bis(2,6-dimethylbenzoyl)-2,4,4-trimethyl-pentylphosphine oxide; (2,4,6-trimethylbenzoyl)ethoxyphenylphosphine oxide, etc.

[0065] From the viewpoint of further inhibiting the permeation of photosensitizers into the polyethylene film, component (C) may contain a hexaarylbiimidazole compound. The aryl group in the hexaarylbiimidazole compound may be phenyl or the like. The hydrogen atom bonded to the aryl group in the hexaarylbiimidazole compound may be replaced by a halogen atom (chlorine atom, etc.).

[0066] The hexaarylbiimidazole compound can be a 2,4,5-triarylimidazolium dimer. Examples of 2,4,5-triarylimidazolium dimers include 2-(o-chlorophenyl)-4,5-diphenylimidazolium dimer, 2-(o-chlorophenyl)-4,5-bis-(m-methoxyphenyl)imidazolium dimer, and 2-(p-methoxyphenyl)-4,5-diphenylimidazolium dimer. From the viewpoint of further inhibiting the permeation of photosensitizers into the polyethylene film, the hexaarylbiimidazole compound is preferably a 2-(o-chlorophenyl)-4,5-diphenylimidazolium dimer, more preferably a 2,2-bis(o-chlorophenyl)-4,5-4',5'-tetraphenyl-1,2'biimidazole.

[0067] From the viewpoint of further inhibiting the permeation of photosensitizers into the polyethylene film, the content of hexaaryl biimidazole compounds, based on the total amount of component (C), can be 90% by mass or more, 95% by mass or more, or 99% by mass or more. Component (C) may consist solely of hexaaryl biimidazole compounds.

[0068] From the perspective of further improving sensitivity and adhesion, the content of component (C) can be more than 0.1% by mass, more than 0.5% by mass, or more than 1% by mass, or less than 20% by mass, less than 10% by mass, or less than 5% by mass, based on the total amount of solid components in the photosensitive resin composition.

[0069] (D) Ingredients: Anthracene sensitizers

[0070] The photosensitive resin composition contains one or more (D) components. The (D) components serve as photosensitizers. Examples of (D) components include 9,10-dibutoxyanthracene, 9,10-diphenylanthracene, and 9,10-diethoxyanthracene. From the viewpoint of further improving adhesion and resolution, 9,10-dibutoxyanthracene is preferred.

[0071] From the viewpoint of further improving sensitivity, adhesion, and resolution, the content of component (D) relative to the total amount of components (A) and (B) is 100 parts by mass, for example, 0.2 parts by mass or more, preferably 0.3 parts by mass or more, more preferably 0.4 parts by mass or more, and even more preferably 0.5 parts by mass or more. From the viewpoint of improving the shape of the resist pattern, it is, for example, 1.5 parts by mass or less, preferably 1.0 parts by mass or less, more preferably 0.8 parts by mass or less, even more preferably less than 0.8 parts by mass, and particularly preferably less than 0.7 parts by mass. Furthermore, if the content of component (D) is less than 0.8 parts by mass, the storage stability of the photosensitive element can be improved when it is formed. Specifically, for example, when the photosensitive element is stored under cold storage, the precipitation of component (D) on the surface of the photosensitive resin layer (between the photosensitive resin layer and the protective layer when the photosensitive element has a protective layer) can be suppressed. In addition, the precipitation of component (D) is prone to occur when 9,10-dibutoxyanthracene is used as component (D) and the protective layer is a polyethylene film. However, even when this combination is used, the precipitation of component (D) during refrigerated storage can be suppressed by setting the content of component (D) to less than 0.8 parts by mass.

[0072] In addition to component (D), the photosensitive resin composition may also contain known photosensitizers as other photosensitizers. The content of other sensitizers relative to the total amount of components (A) and (B) 100 parts by mass may be, for example, 0.2 to 1.5 parts by mass or 0.4 to 1.0 parts by mass.

[0073] (E) Component: Polymerization inhibitor

[0074] From the viewpoint of suppressing polymerization in the unexposed areas during resist pattern formation and further improving resolution, the photosensitive resin composition may also contain component (E): polymerization inhibitor. Examples of polymerization inhibitors include tert-butylcatechol, 4-hydroxy-2,2,6,6-tetramethylpiperidine-N-oxy, etc.

[0075] From the perspective of sensitivity and resolution, the content of component (E) relative to the total amount of components (A) and (B) 100 parts by mass can be more than 0.001 parts by mass, more than 0.002 parts by mass, or more than 0.003 parts by mass. From the perspective of sensitivity and tightness, it can be less than 0.1 parts by mass, less than 0.05 parts by mass, or less than 0.01 parts by mass.

[0076] The photosensitive resin composition may also contain one or more other components besides those mentioned above. Examples of other components include hydrogen donors (bis[4-(dimethylamino)phenyl]methane, bis[4-(diethylamino)phenyl]methane, colorless crystal violet, N-phenylglycine, etc.), dyes (malachite green, etc.), tribromophenyl sulfone, photochromic agents, thermochromic inhibitors, plasticizers (p-toluenesulfonamide, etc.), pigments, fillers, defoamers, flame retardants, stabilizers, adhesion promoters, leveling agents, peel accelerators, antioxidants, fragrances, imaging agents, and thermal crosslinking agents. The content of other components relative to 100 parts by mass of the total amount of components (A) and (B) may be 0.005 parts by mass or more, 0.01 parts by mass or more, or 20 parts by mass or less.

[0077] From the perspective of viscosity adjustment, the photosensitive resin composition may also contain one or more organic solvents. Examples of organic solvents include methanol, ethanol, acetone, methyl ethyl ketone, methyl cellosolve, ethyl cellosolve, toluene, N,N-dimethylformamide, and propylene glycol monomethyl ether. The content of organic solvents, based on the total amount of the photosensitive resin composition, can be 40% by mass or more, or 70% by mass or less.

[0078] The photosensitive resin composition is suitable for the formation of resist patterns, and is particularly suitable for the manufacturing method of the wiring substrate described later.

[0079] <Photosensitive element>

[0080] Figure 1 This is a schematic cross-sectional view of a photosensitive element according to one embodiment. Figure 1 As shown, the photosensitive element 1 includes a support 2, a photosensitive resin layer 3 disposed on the support 2, and a protective layer 4 disposed on the side of the photosensitive resin layer 3 opposite to the support 2.

[0081] The support 2 and the protective layer 4 can each be a polymer film with heat resistance and solvent resistance, such as a polyester film (e.g., polyethylene film), a polyolefin film (e.g., polypropylene film), or a polyester film (e.g., polyethylene film). The support 2 and the protective layer 4 can also be films made of hydrocarbon polymers other than polyolefins. Films containing polyolefin hydrocarbon polymers can have low density, for example, a density of 1.014 g / cm³. 3The following density. Support 2 and protective layer 4 can both be stretched films formed by stretching this low-density hydrocarbon polymer film. The type of polymer film constituting protective layer 4 can be the same as or different from the type of polymer film constituting support 2.

[0082] These polymer films can be purchased as, for example, polyethylene terephthalate films such as the PS series (e.g., PS-25) manufactured by Teijin Limited, polyethylene films such as NF-15 manufactured by TAMAPOLY CO., LTD., or polypropylene films such as ALPHAN MA-410 and E-200C manufactured by OJI PAPER CO., LTD., and SHIN-ETSU FILM CO., LTD.

[0083] From the viewpoint of being able to suppress the breakage of the support 2 when it is peeled off from the photosensitive resin layer 3, the thickness of the support 2 can be 1 μm or more or 5 μm or more. From the viewpoint of being able to be appropriately exposed even when the exposure is performed through the support 2, the thickness can be 100 μm or less, 50 μm or less or 30 μm or less.

[0084] When the protective layer 4 is peeled off and the photosensitive resin layer 3 and the support 2 are laminated onto the substrate, from the viewpoint of suppressing damage to the protective layer 4, the thickness of the protective layer 4 can be 1 μm or more, 5 μm or more, or 15 μm or more. From the viewpoint of improving productivity, it can be 100 μm or less, 50 μm or less, or 30 μm or less.

[0085] The photosensitive resin layer 3 is composed of the above-described photosensitive resin composition. From the viewpoint of making coating easier and increasing productivity, the thickness of the photosensitive resin layer 3 after drying (after the organic solvent in the photosensitive resin composition has evaporated) can be 1 μm or more or 5 μm or more. From the viewpoint of further improving adhesion and resolution, it can be 100 μm or less, 50 μm or less, or 40 μm or less.

[0086] The photosensitive element 1 can be obtained, for example, as follows. First, a photosensitive resin layer 3 is formed on the support 2. The photosensitive resin layer 3 can be formed, for example, by coating a photosensitive resin composition containing an organic solvent to form a coating layer and drying the coating layer. Next, a protective layer 4 is formed on the surface of the photosensitive resin layer 3 on the side opposite to the support 2.

[0087] The coating layer is formed by known methods such as roller coating, comma coating, gravure coating, air knife coating, mold coating, and bar coating. The coating layer is dried so that the amount of organic solvent remaining in the photosensitive resin layer 3 is, for example, less than 2% by mass, specifically, for example, at 70 to 150°C for about 5 to 30 minutes.

[0088] In another embodiment, the photosensitive element may not have a protective layer, but may have other layers such as a buffer layer, an adhesive layer, a light-absorbing layer, and a gas barrier layer.

[0089] The photosensitive element 1 can be in the form of a sheet or a roll of photosensitive elements wound on a core. In the roll of photosensitive elements, the photosensitive element 1 is preferably wound to form the support 2 on the outside. The core is formed, for example, of polyethylene, polypropylene, polystyrene, polyvinyl chloride, acrylonitrile-butadiene-styrene copolymer, etc. From the viewpoint of end-face protection, an end-face separator can be provided on the end face of the photosensitive element roll; from the viewpoint of resistance to edge fusion, a moisture-proof end-face separator can be provided. The photosensitive element 1 can be packaged, for example, in a black sheet with low moisture permeability.

[0090] The photosensitive element 1 is suitable for forming resist patterns, and is particularly suitable for the manufacturing method of the wiring substrate described later.

[0091] <Manufacturing Method of Wiring Board>

[0092] Figure 2 This is a schematic diagram illustrating a method for manufacturing a wiring board (also called a printed circuit board) according to one embodiment. In this manufacturing method, firstly, as... Figure 2 As shown in (a), a substrate (e.g., a circuit forming substrate) having an insulating layer 11 and a conductor layer 12 formed on the insulating layer 11 is prepared. The conductor layer 12 may be, for example, a copper layer.

[0093] Next, as Figure 2 (b) shows that a photosensitive resin layer 13 is provided on a substrate (conductor layer 12). In this process, the photosensitive resin composition or the photosensitive element 1 described above is used to form a photosensitive resin layer 13 composed of the photosensitive resin composition on the substrate (conductor layer 12). For example, the photosensitive resin layer 13 is formed by coating the photosensitive resin composition onto the substrate and allowing it to dry. Alternatively, the photosensitive resin layer 13 is formed by removing the protective layer 4 from the photosensitive element 1, heating the photosensitive resin layer 3 of the photosensitive element 1, and pressing it onto the substrate. During pressing, at least one of the photosensitive resin layer 3 and the substrate may be heated, for example, to 70 to 130°C. The pressure during pressing may be, for example, 0.1 to 1.0 MPa.

[0094] Next, as Figure 2As shown in (c), a mask 14 is disposed on the photosensitive resin layer 13, and an active light 15 is irradiated to expose the area other than the area where the mask 14 is disposed, thereby photocuring the photosensitive resin layer 13. The light source of the active light 15 can be, for example, an ultraviolet light source or a visible light source such as a carbon arc lamp, a mercury vapor arc lamp, a high-pressure mercury lamp, a xenon lamp, a gas laser (argon laser, etc.), a solid-state laser (YAG laser, etc.), or a semiconductor laser.

[0095] In another embodiment, a portion of the photosensitive resin layer 13 can be exposed to active light 15 with the desired pattern by direct drawing exposure method such as LDI exposure method or DLP exposure method, without using mask 14.

[0096] Next, as Figure 2 As shown in (d), the area (uncured portion) other than the photocured portion formed by exposure is removed from the substrate by development, thereby forming a resist pattern 16 composed of the photocured portion (cured photosensitive resin layer). The development method can be, for example, wet development or dry development, preferably wet development.

[0097] Wet development uses a developer solution corresponding to the photosensitive resin composition and is carried out by methods such as immersion, paddle immersion, spraying, brushing, slapping, scraping, and agitation immersion. The developer solution is appropriately selected according to the structure of the photosensitive resin composition and can be an alkaline developer solution or an organic solvent developer solution.

[0098] Alkaline developing solutions can be aqueous solutions of bases such as hydroxides containing lithium, sodium, or potassium hydroxides; carbonates such as lithium, sodium, potassium, or ammonium carbonates or bicarbonates; alkali metal phosphates such as potassium phosphate and sodium phosphate; alkali metal pyrophosphates such as sodium pyrophosphate and potassium pyrophosphate; borax; sodium metasilicate; tetramethylammonium hydroxide; ethanolamine; ethylenediamine; diethylenetriamine; 2-amino-2-hydroxymethyl-1,3-propanediol; 1,3-diamino-2-propanol; morpholine, etc.

[0099] Alkaline developing solutions can be, for example, 0.1–5% by mass sodium carbonate aqueous solution, 0.1–5% by mass potassium carbonate aqueous solution, 0.1–5% by mass sodium hydroxide aqueous solution, 0.1–5% by mass sodium tetraborate aqueous solution, etc. The pH of the alkaline developing solution can be, for example, 9–11.

[0100] Alkaline developers may also contain surfactants, defoamers, and organic solvents. Examples of organic solvents include acetone, ethyl acetate, alkoxyethanol (containing alkoxy groups with 1-4 carbon atoms), ethanol, isopropanol, butanol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, and diethylene glycol monobutyl ether. The content of organic solvents, based on the total amount of the alkaline developer, can range from 2% to 90% by mass.

[0101] Organic solvent developers may contain organic solvents such as 1,1,1-trichloroethane, N-methylpyrrolidone, N,N-dimethylformamide, cyclohexanone, methyl isobutyl ketone, and γ-butyrolactone. Organic solvent developers may also contain 1–20% by mass of water.

[0102] In this process, after removing the unexposed parts, the resist pattern 16 is further cured by heating at 60–250°C or exposing it at 0.2–10 J / cm² as needed.

[0103] Next, as Figure 2 As shown in (e), the portion of the conductor layer 12 where the resist pattern 16 is not formed is covered by a plating process, for example, to form a wiring layer 17. The wiring layer 17 can be formed of the same type of material as the conductor layer 12, or it can be formed of a different type of material. The wiring layer 17 can be, for example, a copper layer. The plating process can be one or both of electrolytic plating and electroless plating.

[0104] Next, as Figure 2 As shown in (f), the resist pattern 16 is removed, and the conductor layer 12 disposed at the position corresponding to the resist pattern 16 is also removed. Thus, a wiring substrate 18 with a wiring layer 17 formed on the substrate can be obtained.

[0105] The resist pattern 16 can be removed, for example, by developing it using a strongly alkaline aqueous solution through immersion or spraying. The strongly alkaline aqueous solution can be, for example, a 1-10% by mass sodium hydroxide aqueous solution or a 1-10% by mass potassium hydroxide aqueous solution.

[0106] The conductor layer 12 can be removed by etching. The etching solution is appropriately selected according to the type of conductor layer 12, such as copper chloride solution, ferric chloride solution, alkaline etching solution, hydrogen peroxide etching solution, etc.

[0107] Example

[0108] The present invention will be further described in detail below with reference to the embodiments, but the present invention is not limited to these embodiments.

[0109] <(A) Synthesis of Components>

[0110] Solution (a) was prepared by mixing the monomers shown in Table 1 with 0.9 parts by mass of azobisisobutyronitrile (AIB) in the proportions shown in Table 1 (unit: parts by mass). Solution (b) was prepared by dissolving 0.5 parts by mass of AIB in 50 parts by mass of a mixture (x) of 30 parts by mass of methyl cellosolve and 20 parts by mass of toluene. After adding 500 g of the mixture (x) to a flask equipped with a stirrer, reflux cooler, thermometer, dropping funnel, and nitrogen inlet tube, nitrogen was blown into the flask and the mixture was stirred and heated to 80°C. Solution (a) was added dropwise to the mixture in the flask at a constant dropping rate over 4 hours, and the mixture was stirred at 80°C for 2 hours. Then, solution (b) was added dropwise to the solution in the flask at a constant dropping rate over 10 minutes, and the mixture was stirred at 80°C for 3 hours. The solution in the flask was then heated to 90°C over 30 minutes and held at 90°C for 2 hours. After stirring was stopped, the solution was cooled to room temperature (25°C) to obtain solutions of adhesive polymers A-1 to A-9. The non-volatile component (solid component) of the solutions of adhesive polymers A-1 to A-9 was 49% by mass. The weight-average molecular weight (Mw) of adhesive polymers A-1 to A-9 is shown in Table 1.

[0111] In addition, the weight-average molecular weight was measured using gel permeation chromatography (GPC) and derived by conversion using a calibration curve of standard polystyrene. The GPC conditions are shown below.

[0112] (GPC conditions)

[0113] Pump: Hitachi L-6000 model (manufactured by Hitachi, Ltd., product name)

[0114] Tubing: 3 in total

[0115] Gelpack GL-R420

[0116] Gelpack GL-R430

[0117] Gelpack GL-R440 (the above is a product name manufactured by Showa Denko Materials Co., Ltd.)

[0118] Eluent: Tetrahydrofuran

[0119] Temperature measured: 40℃

[0120] Flow rate: 2.05 mL / min

[0121] Detector: Hitachi L-3300 RI (manufactured by Hitachi, Ltd., trade name)

[0122] [Table 1]

[0123]

[0124] [Examples 1-16 and Comparative Examples 1-10]

[0125] <Preparation of Photosensitive Resin Composition>

[0126] Photosensitive resin compositions were prepared by mixing the components shown in Tables 2 to 4 at the amounts (parts by mass) shown in Tables 2 to 4. Furthermore, the amounts (parts by mass) of component (A) shown in Tables 2 to 4 refer to the mass of the non-volatile component (amount of solids). Details regarding the components shown in Tables 2 to 4 are as follows.

[0127] (B) Ingredients

[0128] FA-321M(70): 70% solution of propylene glycol monomethyl ether of 2,2-bis(4-(methacryloyloxyethoxy)phenyl)propane (10 mol average ethylene oxide adduct) (manufactured by Showa Denko Materials co., Ltd.)

[0129] FA-024M: (PO)(EO)(PO) modified dimethacrylate (manufactured by Showa Denko Materials Co., Ltd., with an average of 6 mol of ethylene oxide and an average of 12 mol of propylene oxide adducts (total value)).

[0130] BP-2EM: 2,2-bis(4-(methacryloyloxypolyethoxy)phenyl)propane (manufactured by KYOEISHA CHEMICAL Co., LTD., EO group: 5.2 (total value))

[0131] 3. Functional Monomer 1: EO-Modified Trimethylolpropane Trimethacrylate (EO group: 21 (total value))

[0132] 4-functional monomer 1: EO-modified pentaerythritol tetramethacrylate (EO group: 4 (total value))

[0133] 4. Functional monomer 2: EO-modified pentaerythritol tetramethacrylate (EO group: 12 (total value))

[0134] 4-functional monomer 3:EO modified di(trimethylolpropane)tetramethacrylate (EO group: 4 (total value))

[0135] 4-functional monomer 4:EO-modified di(trimethylolpropane)tetramethacrylate (EO group: 12 (total value))

[0136] 6-functional monomer 1: EO-modified dipentaerythritol hexamethacrylate (EO group: 6 (total value))

[0137] 6-functional monomer 2: EO-modified dipentaerythritol hexamethacrylate (EO group: 18 (total value))

[0138] 6-functional monomer 3:EO-modified dipentaerythritol hexaacrylate (EO group: 12 (total value))

[0139] (C) Components

[0140] BCIM: 2,2'-bis(o-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole (manufactured by Hampford Company)

[0141] (D) Components

[0142] DBA: 9,10-Dibutoxyanthracene (prepared by KAWASAKI KASEI CHEMICALS LTD.)

[0143] DPA: 9,10-Diphenylanthracene (manufactured by KAWASAKI KASEI CHEMICALS LTD.)

[0144] (D)' Components

[0145] PZ-501D: 1-Phenyl-3-(4-methoxystyryl)-5-(4-methoxyphenyl)pyrazoline (manufactured by Nippon Chemical Works Co., Ltd.)

[0146] (E) Components

[0147] TBC: 4-tert-butylcatechol (manufactured by DIC Corporation, trade name "DIC-TBC")

[0148] (Other ingredients)

[0149] LCV: Colorless Crystal Violet (manufactured by YAMADA CHEMICAL CO., LTD.)

[0150] MKG: Malachite Green (manufactured by OSAKA ORGANIC CHEMICAL INDUSTRY LTD.)

[0151] SF-808H: A mixture of carboxybenzotriazole, 5-amino-1H-tetrazole, and methoxypropanol (prepared by SANWA KASEICORP)

[0152] (solvent)

[0153] TLS: Toluene

[0154] MAL: Methanol

[0155] ACS: Acetone

[0156] <Fabrication of Photosensitive Elements>

[0157] A 16 μm thick polyethylene terephthalate film (manufactured by Teijin Limited, trade name "HTF-01") was prepared as a support. A photosensitive resin composition was coated onto the support to achieve uniform thickness, and then dried sequentially using a hot air convection dryer at 70°C and 110°C to form a 25 μm thick photosensitive resin layer. A polyethylene film (manufactured by TAMAPOLY CO., LTD., trade name "NF-15") was then laminated onto this photosensitive resin layer as a protective layer, resulting in a photosensitive element formed by sequentially stacking the support, photosensitive resin layer, and protective layer.

[0158] <Creating Layered Objects>

[0159] The copper-clad laminate (substrate, manufactured by ShowaDenko Materials Co., Ltd., trade name) with copper foil (thickness: 35 μm) laminated on both sides was surface-treated using a surface roughening treatment liquid, "Mech-Etch Bond CZ-8100" (manufactured by MEC COMPANY LTD.). Following washing with water, acid washing, and then washing again, it was dried with an air stream. The surface-treated copper-clad laminate was heated to 80°C, the protective layer was peeled off, and the aforementioned photosensitive elements were laminated separately, so that the photosensitive resin layer was bonded to the copper surface. Thus, laminates were obtained by sequentially stacking the copper-clad laminate, the photosensitive resin layer, and the support. The obtained laminates were used as test pieces in the experiments shown below. Furthermore, lamination was performed using a 110°C hot roller at a pressing pressure of 0.4 MPa and a roller speed of 1.5 m / min.

[0160] <Evaluation>

[0161] (Measurement of minimum development time)

[0162] The above-mentioned laminate was cut into 5cm squares to obtain test pieces for measuring the minimum development time. After peeling the support from the test pieces, the unexposed photosensitive resin layer was spray-developed using a 1% sodium carbonate aqueous solution at 30°C and a pressure of 0.15MPa. The shortest development time was defined as the shortest time at which the removal of more than 1mm of unexposed area could be visually confirmed. A full-cone nozzle was used. The distance between the test piece and the nozzle tip was 6cm, with the center of the test piece aligned with the center of the nozzle. The shorter the minimum development time (in seconds), the better the developability. The results are shown in Tables 2 to 4.

[0163] (Evaluation of sensitivity)

[0164] A Hitachi 41-stage exposure meter was placed on a test substrate, and a projection exposure machine (manufactured by Ushio Inc., product name UX-2240SM-XJ01) with a high-pressure mercury lamp of 365 nm was used to expose the photosensitive resin layer through the substrate. The exposure energy was 15 stages after development using the Hitachi 41-stage exposure meter. The photosensitivity was evaluated based on the exposure energy (unit: mJ / cm2). The lower the exposure energy, the higher the photosensitivity.

[0165] (Evaluation of fit)

[0166] Using a drawing pattern with a linewidth (L) / space width (S) (hereinafter referred to as "L / S") of x / 3x (x = 1 to 20 (varying in 1 μm intervals)) (unit: μm), the photosensitive resin layer of the above laminate was exposed (drawn) using a direct drawing exposure machine (manufactured by Via Mechanics, Ltd., product name DE-1UH) with a wavelength of 405 nm blue-violet laser diode as the light source, at an energy level of 17 levels of the residual order of the Hitachi 41-level staged exposure meter.

[0167] After exposure, the support was peeled off from the laminate to expose the photosensitive resin layer. A 1% sodium carbonate aqueous solution was sprayed at 30°C for 60 seconds to remove the unexposed areas. After development, the adhesion was evaluated by the minimum line width in the resist pattern formed by removing the unexposed areas (spaces) without residue and without creating bends or gaps (exposed areas). A smaller value indicates better adhesion. The results are shown in Tables 2-4. Adhesion of 7 μm or less was considered acceptable.

[0168] (Resolution evaluation)

[0169] Using a drawing pattern with a linewidth (L) / space width (S) (hereinafter referred to as "L / S") of x / x (x = 1 to 20 (varying in 1 μm intervals)) (unit: μm), the photosensitive resin layer of the above laminate was exposed (drawn) using a direct drawing exposure machine (manufactured by Via Mechanics, Ltd., product name DE-1UH) with a wavelength of 405 nm blue-violet laser diode as the light source, at an energy level of 17 levels with the residual order of a Hitachi 41-level staged exposure meter.

[0170] After exposure, the support was peeled off from the laminate to expose the photosensitive resin layer. A 1% sodium carbonate aqueous solution was sprayed at 30°C for 60 seconds to remove the unexposed areas. After development, the resolution was evaluated by the minimum value of the space width in the resist pattern, where the unexposed areas were removed without residue and no bends or gaps were formed, resulting in the exposed areas. A smaller value indicates better resolution. The results are shown in Tables 2 to 4. A resolution of 12 μm or less was considered acceptable.

[0171] (Evaluation of storage stability)

[0172] The aforementioned photosensitive element was stored at a temperature below 15°C for 30 days. After storage, the surface of the photosensitive resin layer (between the protective layer and the photosensitive resin layer) was visually observed from the polyethylene film side, and the presence or absence of precipitates was confirmed. No precipitates were identified as "A", and precipitates were identified as "B". The results are shown in Tables 2 to 4. It can be said that the storage stability without identified precipitates is excellent.

[0173]

[0174]

[0175] [Table 4]

[0176]

[0177] Symbol Explanation

[0178] 1-Photosensitive element, 2-Support, 3, 13-Photosensitive resin layer, 4-Protective layer, 11-Insulating layer, 12-Conductor layer, 14-Mask, 15-Active light, 16-Resist pattern, 17-Wiring layer, 18-Wiring substrate.

Claims

1. A photosensitive resin composition comprising a binder polymer, a photopolymerizable compound, a photopolymerization initiator, an anthracene sensitizer, and a polymerization inhibitor. The adhesive polymer comprises a polymer (a) having (meth)acrylate hydroxyalkyl ester units, styrene or styrene derivative units, (meth)acrylate units and (meth)acrylate benzyl ester units, wherein the content of the styrene or styrene derivative units is 40% by mass or more. The photopolymerizable compound comprises (PO)(EO)(PO) modified dimethacrylate as an adduct of 6 mol of ethylene oxide and 12 mol of propylene oxide, and contains 2,2-bis(4-((meth)acryloyloxypolyethoxy)phenyl)propane in an amount of 10 or more oxyethylidenes. The polymerization inhibitor contains tert-butylcatechol.

2. The photosensitive resin composition according to claim 1, wherein, The photopolymerizable compound contains 2,2-bis(4-((meth)acryloyloxypolyethoxy)phenyl)propane in an amount of less than 10 oxyethylidenes.

3. The photosensitive resin composition according to claim 1 or 2, wherein, The weight-average molecular weight of the polymer (a) is 30,000 to 40,000.

4. The photosensitive resin composition according to claim 1 or 2, wherein, The content of the anthracene sensitizer is 0.2 parts by mass or more and less than 0.8 parts by mass relative to the total amount of the adhesive polymer and the photopolymerizable compound (100 parts by mass).

5. A photosensitive element comprising a support and a photosensitive resin layer formed on the support using the photosensitive resin composition according to any one of claims 1 to 4.

6. A method for manufacturing a wiring board, comprising: The process of depositing a photosensitive resin layer on a substrate using the photosensitive resin composition of any one of claims 1 to 4 or the photosensitive element of claim 5; A process of photocuring a portion of the photosensitive resin layer; The process of removing the uncured portions of the photosensitive resin layer to form a resist pattern; and The process of forming a wiring layer on the portion of the substrate where the resist pattern is not formed.

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