Cooking appliance with at least one support plate and method for assembling vibration sensors
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-03-19
- Publication Date
- 2026-08-14
Smart Images

Figure CN115299179B_ABST
Abstract
Description
[0001] This invention relates to a cooking appliance having at least one support plate adapted to receive a cooker placed thereon, particularly a cooking stove with a top plate. More specifically, the invention relates to a corresponding cooking appliance including at least one sensing device for detecting vibrations generated when food to be cooked and / or cooking aids inside the cooker are heated. The invention also relates to a method for assembling a support plate of the cooking appliance, particularly the top plate of the cooking stove, with a vibration sensor, which transmits vibrational motion from the cooker to the vibration sensor.
[0002] The cooking process, which prepares food for consumption, is increasingly being placed under automatic control. Vibration sensors are used in automatically controlled cooking appliances, particularly cooktops. These sensors allow for better monitoring of the cooking process, especially when using cooking liquids, enabling better monitoring of temperature increases involving the food and / or the cooking liquids.
[0003] A method for controlling a cooking process is known from EP 3 413 687 A1, which operates when food is cooked in a cooking container placed on a cooking stove. A vibration sensor is arranged in the cooking stove to detect the boiling of the cooking liquid. However, this document does not teach how to assemble the vibration sensor to obtain its optimal performance and accurate and consistent measurement results.
[0004] EP 2 999 301 A1 discloses a cooking appliance that includes a boiling detection function, comprising an accelerometer or vibration sensor, particularly a microelectromechanical system (MEMS), to detect vibrations caused by bubbles forming inside the heated material. The vibration sensor is placed between heating zones such that vibrations caused by boiling of material in any heating zone surrounding the sensor can be detected with substantially the same sensitivity. The MEMS sensor can be mounted on a printed circuit board, which can be mechanically coupled to the glass-ceramic material via a pin or wall.
[0005] The object of the present invention is to provide a cooking appliance having at least one support plate and a method for assembling a vibration sensor that provides measurement results that particularly well support automated cooking processes.
[0006] This objective is achieved by a cooking appliance having at least one support plate and at least one sensing device for detecting vibration, as described in this disclosure.
[0007] The cooking appliance according to the invention includes at least one support plate adapted to receive cookware placed thereon. The cooking appliance may be a cooking stove with a top plate. The cooking appliance further includes at least one sensing device for detecting vibrations generated when food to be cooked and / or cooking aids inside the cookware are heated. The food to be cooked and / or cooking aids may be cooking liquids. The vibration sensor is detachably attached to the support plate, which may be the top plate of the cooking stove, in a fixing manner, which prevents relative movement between the vibration sensor and the support plate, particularly in directions toward and / or away from each other. The fixing device includes a first rigid frame portion rigidly connected to the support plate. In particular, the first rigid frame portion is made of plastic, which is a cost-saving solution in terms of material costs and its use as an electrical insulation device. The vibration sensor or an electronic circuit board including the vibration sensor is correspondingly defined on all sides by the first rigid frame portion. This omnidirectional definition further eliminates undesirable relative movement. The cooking appliance may also be an oven including a baking tray for receiving cookware placed thereon. In this alternative embodiment, a vibration sensor is attached to the baking pan to sense vibrations at or inside the cookware.
[0008] Vibration sensors can be attached to the underside of a support plate, particularly the top plate of a cooking appliance or the underside of a baking tray inside an oven. Vibration sensors are preferably positioned in the central area of the support plate.
[0009] In a particular embodiment, the vibration sensor is arranged on an electronic circuit board. This can be an advantageous solution for optimally supporting the vibration sensor to prevent relative movement.
[0010] The first rigid frame section can be connected to the load-bearing plate in the circumferential direction to prevent it from twisting during vibration, which could also lead to negative relative motion.
[0011] Advantageously, the second rigid frame portion is connected to the first rigid frame portion, and the vibration sensor, or in particular the electronic circuit board including the vibration sensor, is clamped between the first rigid frame portion and the second rigid frame portion. Preferably, the first rigid frame portion and the second rigid frame portion are connected to each other by a snap-fit device.
[0012] In a preferred embodiment, the sealing frame portion is positioned between the electronic circuit board and the first rigid frame portion and / or between the electronic circuit board and the second rigid frame portion. The sealing frame portion is preferably made of a soft and / or flexible material, such as rubber or silicone. Using such a soft and / or flexible material allows for further enhanced gapless assembly.
[0013] Specifically, the vibration sensor and / or the electronic circuit board including or carrying the vibration sensor is connected to the data bus of the cooking appliance. For this purpose, a communication cable is preferably used, which can be connected to any component that can receive data bus communication signals, such as the user interface unit or power board of the cooking appliance.
[0014] Specifically, the vibration sensor and / or the electronic circuit board including or carrying the vibration sensor can be connected to the control unit and / or user interface unit of the cooking appliance via a connecting cable. The connecting cable can be a MACS cable or any other cable, such as a cable for serial or parallel bus connections.
[0015] This objective is achieved by a method for assembling a vibration sensor onto a support plate of a cooking appliance, according to the features of this disclosure.
[0016] According to another aspect of the present invention, a method for assembling a vibration sensor to a support plate of a cooking appliance is disclosed. The support plate may be the top plate of a cooking appliance. The support plate transmits vibrational motion from the cookware to the vibration sensor. The assembly includes the following assembly steps:
[0017] - The first rigid frame portion is rigidly connected to the load-bearing plate, preferably in the first assembly step; and
[0018] - The vibration sensor is connected to the first rigid frame portion in a manner that prevents relative movement between the vibration sensor and the support plate, preferably in the second assembly step.
[0019] In subsequent assembly steps, the second rigid frame portion is connected to, and preferably snapped into, the first rigid frame portion. The vibration sensor, and in particular the electronic circuit board including the vibration sensor, is sandwiched between the first and second rigid frame portions. Preferably, the vibration sensor or electronic circuit board is sandwiched between these frame portions with its circumferential boundary.
[0020] It is desirable to prevent any kind of relative motion, but it is most advantageous to prevent motion in directions toward and / or away from each other.
[0021] Specifically, the vibration sensor is assembled into an electronic circuit board, and thereafter, the electronic circuit board including the vibration sensor is connected to the first rigid frame portion. A preferred assembly method is soldering.
[0022] A preferred embodiment is characterized in that, prior to the assembly step of connecting the second rigid frame portion to the first rigid frame portion, the sealing frame portion is positioned between the vibration sensor or correspondingly included electronic circuit board and the first rigid frame portion, and / or between the vibration sensor or correspondingly included electronic circuit board and the second rigid frame portion. The sealing frame portion can be connected to the vibration sensor or included electronic circuit board, and in subsequent assembly steps, the combination of the sealing frame and the vibration sensor or included electronic circuit board is connected to or implemented into the first rigid frame portion.
[0023] In further assembly steps, the first connector of the connecting cable can be connected to a vibration sensor or a circuit system including a vibration sensor, and the second connector of the connecting cable can be connected to the control unit and / or user interface unit of the cooking appliance. The connecting cable can be attached to the support plate, for example, by gluing, to prevent it from being pulled off.
[0024] The novelty and inventiveness of the invention are set forth in the appended claims.
[0025] The invention will be described in further detail with reference to the accompanying drawings, in which:
[0026] Figure 1 It is an exploded view of the cooking stove, showing the components and modules arranged in the cooking stove;
[0027] Figure 2 This is an exploded view of the sensor assembly, showing the sensor circuit board and mounting frame; and
[0028] Figure 3 Showing Figure 2 A cross-sectional view of a sensor assembly attached to the top plate of a cooking stove.
[0029] according to Figure 1 The demonstration shows that the induction cooktop 1 includes a top plate 3, the upper side of which faces the user, on which the user can place cookware for cooking. The top plate 3 is typically made of glass-ceramic material and usually has cooking zones (not shown) marked on it. Four cooking zones are defined by corresponding induction coil assemblies 5 positioned below the top plate 3.
[0030] The induction coil 5 is powered by two power boards 7, which have identical structures and include multiple different electrical and electronic components interconnected by a circuit system. To provide enhanced cooling for the power electronics 9, which are also integrated into the power board circuit system, metal cooling channels 11 are placed on each power board 7, and the power electronics 9 of each power board 7 are attached to the outer surface of their assigned cooling channel 11. The enhanced cooling effect is further amplified by cooling air being blown into the interior of the cooling channel 11 by a cooling fan 13 for each power board 7.
[0031] The induction cooktop 1 further includes a user interface 15 for inputting control commands by the user. The user interface 15 is attached to the bottom side of the top plate 3 via a user interface housing 17. All electrical and electronic components are powered by household power via a power cable (not shown) connected to a power terminal 19 inside the induction cooktop 1.
[0032] Finally, the induction cooktop 1 is also equipped with a vibration sensor suitable for monitoring the progress of the cooking process, particularly for automatic cooking programs. Specifically, the cooking liquid inside the cooktop, placed on the top plate 3 of the induction cooktop 1, causes the cooktop to vibrate at a certain temperature level, and this vibration exhibits a specific degree when the cooking liquid begins to boil. The initiation of the boiling state is sensed by the vibration sensor.
[0033] A vibration sensor is attached to the bottom surface of the top plate 3, which transmits vibration signals from the cookware to the vibration sensor. To provide proper arrangement of the vibration sensor and its proper connection to the control unit arranged in the user interface 15, the sensor is arranged on a sensor printed circuit board 21, which also includes connection devices. For secure and safe attachment, the sensor printed circuit board 21 is enclosed by a first frame portion 23 and a second frame portion 25, as will be explained below.
[0034] Reference Figure 2 This describes the arrangement of the sensor printed circuit board 21 within the first frame portion and the second frame portions 23, 25. For example, in... Figure 2 As can be seen, the first frame portion 23 is rectangular in shape to accommodate the sensor printed circuit board 21, which is also rectangular in shape. The first frame portion 23 is made of plastic material and includes (in its mounting position) an upper horizontal frame portion 23a, through which a vertical frame portion 23b passes (see...). Figure 3 The vertical frame portion 23b forms the outer boundary, and the inner section of the horizontal frame portion 23a provides an upper stop surface for the sensor printed circuit board after the sensor printed circuit board 21 is integrated into the first frame portion 23 (see...). Figure 3 ).
[0035] The second frame portion 25 is also made of plastic and has a rectangular shape. The external dimensions of the second frame portion are adapted to the internal dimensions of the vertical frame portion 23b of the first frame portion 23, such that the second frame portion 25 can be arranged inside the vertical frame portion 23b with at least no substantial gap. After the second frame portion 25 is arranged inside the vertical frame portion 23b, the upper surface of the second frame portion provides a lower stop surface for the sensor printed circuit board. In this assembled position, the upper stop surface and the lower stop surface form a sandwich-like holding mechanism for the sensor printed circuit board 21.
[0036] To securely mount the sensor printed circuit board 21 between the first frame portion 23 and the second frame portion 25, preventing movement of these portions relative to each other, the sensor printed circuit board 21 is defined by a sealing frame portion 27 having a U-shaped cross-section and surrounding the outer edge of the sensor printed circuit board 21 on all sides. The sealing frame portion 27 is made of a soft and / or flexible material (such as heat-resistant rubber or silicone) and allows the outer edge of the sensor printed circuit board 21 to be tightly clamped between the first frame portion 23 and the second frame portion 25. The connection between the second frame portion 25 and the first frame portion 23 is achieved by a snap-fit device 29a arranged at the vertical frame portion 23b, and as a mating component, it is achieved by a snap-fit device 29b arranged at the second frame portion 25.
[0037] Figure 3 This figure illustrates the installation of the sensor printed circuit board 21 assembly in an induction cooking cooker 1 between the first frame portion 23 and the second frame portion 25. The figure shows a cross-sectional side view of the central region of the top plate 3. The sensor printed circuit board assembly is glued to the central region. Adhesive beads 31 are arranged between the outer section of the horizontal frame portion 23a and the bottom side of the central region for permanent fixation of the sensor printed circuit board assembly.
[0038] During the assembly of the induction cooking cooker 1, the sensor printed circuit board assembly is manufactured as follows: First, adhesive beads are applied to the underside of the central region of the top plate 3. Then, the first frame portion 23 is pressed against the underside of the top plate 3 until the top edge of the vertical frame portion 23b rests on the bottom surface of the top plate 3. In this position, adhesive beads are also applied to the upper surface of the outer section of the horizontal frame portion 23a, thereby achieving a permanent adhesive bond between the first frame portion 23 and the top plate 3. Only after this is the sensor printed circuit board 21 implemented in the first frame portion 23, and the second frame portion 25 is installed to complete the assembly.
[0039] Although illustrative embodiments of the invention have been described herein with reference to the accompanying drawings, it should be understood that the invention is not limited to the precise embodiments, and many different other changes and modifications can be made therein by those skilled in the art without departing from the scope or spirit of the invention. All such changes and modifications are intended to be included within the scope of the invention as defined by the appended claims.
[0040] List of reference numerals
[0041] 1. Induction Cooktop
[0042] 3 top plates
[0043] 5 Induction Coil Assembly
[0044] 7 power boards
[0045] 9 power electronic components
[0046] 11 cooling channels
[0047] 13 cooling fans
[0048] 15 User Interfaces
[0049] 17 User Interface Shell
[0050] 19 power terminals
[0051] 21 Sensor Printed Circuit Board
[0052] 23 First Framework Part
[0053] 23a Horizontal Frame Section
[0054] 23b Vertical Frame Section
[0055] 25 Second Frame Part
[0056] 27 Sealing Frame Section
[0057] 29a, b Snap-fit device
[0058] 31 Adhesive Beads
Claims
1. A cooking appliance having at least one support plate adapted to receive a cooker placed thereon, and at least one sensing device for detecting vibrations generated when food to be cooked and / or cooking aids inside the cooker are heated. in, The vibration sensor is attached to the support plate by a fixing device that prevents relative movement between the vibration sensor and the support plate. The fixing device includes a first rigid frame portion, which is rigidly connected to the support plate. Furthermore, the vibration sensor is defined by the first rigid frame portion on all sides.
2. The cooking appliance according to claim 1, wherein, The vibration sensor is attached to the bottom side of the support plate.
3. The cooking appliance according to claim 1 or 2, wherein, The vibration sensor is positioned on an electronic circuit board.
4. The cooking appliance according to claim 1 or 2, wherein, The first rigid frame section is connected to the load-bearing plate in the circumferential direction.
5. The cooking appliance according to claim 1 or 2, wherein, The second rigid frame portion is connected to the first rigid frame portion, wherein the vibration sensor is sandwiched between the first rigid frame portion and the second rigid frame portion.
6. The cooking appliance according to claim 5, wherein, The sealing frame portion is positioned between the electronic circuit board including the vibration sensor and the first rigid frame portion and / or between the electronic circuit board and the second rigid frame portion.
7. The cooking appliance according to claim 1 or 2, wherein, The vibration sensor and / or the electronic circuit board including the vibration sensor are connected to the data bus via a communication cable.
8. The cooking appliance according to claim 1, wherein, This cooking appliance is a cooking stove with a top plate.
9. The cooking appliance according to claim 1, wherein, The food to be cooked and / or the cooking aid is a cooking liquid.
10. The cooking appliance according to claim 1, wherein, The vibration sensor is detachably attached to the support plate via a fixing device.
11. The cooking appliance according to claim 1, wherein, The fixing device prevents relative movement between the vibration sensor and the support plate in directions toward and / or away from each other.
12. The cooking appliance according to claim 1, wherein, The first rigid frame section is a plastic frame section.
13. The cooking appliance according to claim 1, wherein, The electronic circuit board, including the vibration sensor, is defined on all sides by the first rigid frame section.
14. The cooking appliance according to claim 2, wherein, The vibration sensor is attached to the bottom side of the support plate in the central region of the support plate.
15. The cooking appliance according to claim 5, wherein, The electronic circuit board, including the vibration sensor, is sandwiched between the first rigid frame portion and the second rigid frame portion.
16. The cooking appliance according to claim 5, wherein, The second rigid frame portion is connected to the first rigid frame portion using a snap-fit device.
17. The cooking appliance according to claim 7, wherein, The vibration sensor and / or the electronic circuit board including the vibration sensor are connected via a MACS cable to any component capable of receiving data bus communication.
18. The cooking appliance according to claim 17, wherein, Any of the components mentioned are the user interface unit or power board of the cooking appliance.
19. A method for assembling a vibration sensor to a support plate of a cooking appliance, the support plate transmitting vibrational motion from the appliance to the vibration sensor, wherein, The assembly includes the following assembly steps: - In the first assembly step, the first rigid frame portion is rigidly connected to the load-bearing plate; as well as - In the second assembly step, the vibration sensor is connected to the first rigid frame section in a manner that prevents relative movement between the vibration sensor and the support plate. Furthermore, in a subsequent assembly step, the second rigid frame portion is connected to the first rigid frame portion, wherein the vibration sensor is sandwiched between the first rigid frame portion and the second rigid frame portion.
20. The method of claim 19, wherein, The vibration sensor is assembled into the electronic circuit board, and thereafter, the electronic circuit board including the vibration sensor is connected to the first rigid frame portion.
21. The method according to claim 20, wherein, Prior to the assembly step of connecting the second rigid frame portion to the first rigid frame portion, the sealing frame portion is positioned between the electronic circuit board and the first rigid frame portion and / or between the electronic circuit board and the second rigid frame portion.
22. The method according to claim 21, wherein, The sealing frame portion is connected to the electronic circuit board, and in a subsequent assembly step, the combination of the sealing frame portion and the electronic circuit board is connected to the first rigid frame portion.
23. The method according to claim 19 or 20, wherein, In subsequent assembly steps, the first connector of the connecting cable is connected to the vibration sensor or to the circuit system including the vibration sensor, and the second connector of the connecting cable is connected to the control unit and / or user interface unit of the cooking appliance.
24. The method of claim 19, wherein the method is a method of assembling a vibration sensor to the top plate of a cooking stove.
25. The method according to claim 19, wherein, The vibration sensor is connected to the first rigid frame section in a manner that prevents relative movement between the vibration sensor and the support plate in directions toward and / or away from each other.
26. The method according to claim 19, wherein, The electronic circuit board, including the vibration sensor, is sandwiched between the first rigid frame portion and the second rigid frame portion with its circumferential boundary.
27. The method of claim 20, wherein, The vibration sensor was assembled onto the electronic circuit board by soldering.
28. The method according to claim 19, wherein, The second rigid frame portion is snapped into the first rigid frame portion.
Citation Information
Patent Citations
Induction hob with boiling detection and induction energy control, method for heating food with an induction hob and computer program product
EP2999301A1
Method for controlling a cooking process by using a liquid
EP3413687A1
Food cooking utensil
CN104622256A
Induction-heating cooker
JP2008305631A