Optical sensor chip package and electronic device

Abstract

The application discloses an optical sensor chip package and electronic equipment, and relates to the technical field of optical sensor chip packaging. The optical sensor chip package comprises a substrate, a cover, a detection unit and a shielding assembly. The cover is arranged on the substrate to enclose two installation cavities arranged at intervals along the left-right direction. The upper end of the cover is provided with a window, and the window is communicated with the two installation cavities. The detection unit comprises a photosensitive part and a light emitting part, which are arranged in the two installation cavities and are mounted on the substrate. The shielding assembly comprises a first shielding part and a second shielding part. The first shielding part is arranged at the window to shield electromagnetic waves passing through the window. The second shielding part is arranged in the two installation cavities to shield electromagnetic waves passing through the cover. The application aims to solve the problem that the existing optical sensor is easily interfered by electromagnetic waves.

Description

Technical Field

[0001] This invention relates to the field of optical sensor chip packaging technology, specifically to an optical sensor chip package and electronic device. Background Technology

[0002] Light sensors, which are implemented through light sensing technology, are widely used in many applications. For example, in smartphones, ambient light sensors detect ambient light, which is then used by smartphones for various applications, including adjusting the brightness of the display screen and adjusting camera settings.

[0003] To prevent light from the light-emitting element from interfering with the photosensitive element, traditional methods maintain a distance between them to avoid crosstalk. However, this method occupies a significant amount of space in the electronic device and consumes considerable power. In space-constrained situations, a shielding component is placed between the light-emitting and photosensitive elements, typically incorporated into the chip packaging process. However, besides the light interference from the light-emitting element, electromagnetic waves generated by electromagnetic induction can also cause electromagnetic interference to the optical sensor, resulting in noise that affects its accuracy. Summary of the Invention

[0004] The main objective of this invention is to propose a light sensor chip package and electronic device, which aims to solve the problem that existing light sensors are susceptible to electromagnetic interference.

[0005] To achieve the above objectives, the present invention provides a light sensor chip package comprising:

[0006] substrate;

[0007] A cover is placed on the substrate to enclose and form two mounting cavities spaced apart in the left and right directions. A window is provided at the upper end of the cover, and the window connects the two mounting cavities.

[0008] The detection unit, including a photosensitive element and a light-emitting element, is disposed in two separate mounting cavities and mounted on the substrate; and,

[0009] The shielding assembly includes a first shielding component and a second shielding component. The first shielding component is disposed at the window to shield electromagnetic waves passing through the window, and the second shielding component is disposed in the two mounting cavities to shield electromagnetic waves passing through the cover.

[0010] Optionally, the first shielding component includes a filter, and each of the two ends of the filter along the vertical direction is provided with a conductive layer, and both conductive layers are used for grounding.

[0011] Optionally, the window is provided with a rib to form a mounting platform, and the filter is mounted on the mounting platform from top to bottom;

[0012] The optical sensor chip package also includes a buckle plate and a fastener, which are respectively disposed on the left and right sides of the window. The buckle plate is hinged to the cover and closes or opens the mounting platform during its movement stroke. An opening is provided on the buckle plate to expose at least a portion of the filter upward when the buckle plate closes the mounting platform. The fastener is used to fasten the buckle plate when the buckle plate closes the mounting platform.

[0013] Optionally, the fastener includes:

[0014] A latching rod is provided on one side of the latching plate along the front-rear direction; the latching rod is hinged to the cover body and can abut against the upper end of the latching plate during its travel; and,

[0015] A buckle is installed on the other side of the buckle plate along the front-rear direction. The buckle is used to prevent the buckle rod from separating from the buckle plate when the buckle rod abuts against the buckle plate.

[0016] Optionally, a sealing ring is installed at the upper end of the rib, and a receiving groove is recessed downward at the position corresponding to the sealing ring. The receiving groove is used to accommodate the lower part of the sealing ring. A cavity is opened inside the sealing ring, and sealant is placed in the cavity. Multiple slits are opened on both the upper and lower end faces of the sealing ring, and the sealant can flow to the outside of the sealing ring along the multiple slits.

[0017] Optionally, the lower end of the filter is provided with a plurality of sealing grooves at intervals at a plurality of the gap positions corresponding to the upper end face of the sealing ring;

[0018] When the filter is installed on the mounting platform, the sealant flows from the receiving groove into the plurality of sealing grooves.

[0019] Optionally, the lower end of the buckle plate is detachably connected to multiple fasteners, and each fastener has a plug movably installed at its lower end;

[0020] Each filter has a socket at a position corresponding to the plug. The socket is adapted to the corresponding plug. When the plug is inserted into the corresponding socket, the corresponding fixing member is fixed relative to the filter.

[0021] Optionally, an antistatic layer is also attached to the upper surface of the filter.

[0022] Optionally, the second shielding element includes a metal shielding layer attached to the cavity walls of the two mounting cavities.

[0023] The present invention also proposes an electronic device comprising a photosensitive chip package as described above. The photosensitive chip package includes a substrate, a cover plate, a detection unit, and a shielding assembly. The cover plate covers the substrate to enclose two mounting cavities spaced apart in a left-right direction. A window is provided at the upper end of the cover plate, and the window communicates with the two mounting cavities. The detection unit includes a photosensitive element and a light-emitting element, which are respectively disposed in the two mounting cavities and mounted on the substrate. The shielding assembly includes a first shielding element and a second shielding element. The first shielding element is disposed at the window to shield electromagnetic waves passing through the window, and the second shielding element is disposed in the two mounting cavities to shield electromagnetic waves passing through the cover plate.

[0024] In the technical solution of the present invention, two spaced-apart mounting cavities are used to separate the photosensitive element and the light-emitting element to prevent the light generated by the light-emitting element from interfering with the photosensitive element. Both the light-emitting element and the photosensitive element can emit and receive light from the window position. At the same time, a first shielding element is provided at the window position, and a second shielding element is provided in the mounting cavity, so that the photosensitive element and the light-emitting element are surrounded by the first shielding element and the second shielding element to achieve the effect of electromagnetic shielding, thereby preventing electromagnetic waves from interfering with the detection unit. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0026] Figure 1 An exploded perspective view of an embodiment of the optical sensor chip package provided by the present invention;

[0027] Figure 2 for Figure 1 Schematic diagram of the assembly structure of the intermediate filter and the cover;

[0028] Figure 3 for Figure 1 A schematic diagram of the assembly structure of the central buckle and the filter;

[0029] Figure 4 for Figure 2 A three-dimensional exploded assembly diagram of the central rib and the sealing ring;

[0030] Figure 5 for Figure 2 A schematic diagram of the structure of the intermediate filter from below;

[0031] Figure 6 for Figure 1 A schematic diagram of the assembly structure of the middle buckle plate and fasteners.

[0032] Explanation of icon numbers:

[0033] 100 Light sensor chip packaging 7 ribs 1 substrate 8 Installation platform 2 Cover 9 snap-on panels 3 Mounting cavity 10 Fasteners 4 window 10a Buckle 5 Detection unit 10b Buckle 51 Photosensitive element 11 Sealing ring 52 Light-emitting components 12 Container slot 6 Shielding components 13 gap 61 First shielding component 14 Sealing groove 61a Filter 15 Fasteners 62 Second shielding component 16 plug 62a Metal shielding layer 17 Socket

[0034] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0035] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0036] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0037] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0038] Light sensors, which are implemented through light sensing technology, are widely used in many applications. For example, in smartphones, ambient light sensors detect ambient light, which is then used by smartphones for various applications, including adjusting the brightness of the display screen and adjusting camera settings.

[0039] To prevent light from the light-emitting element from interfering with the photosensitive element, traditional methods maintain a distance between them to avoid crosstalk. However, this method occupies a significant amount of space in the electronic device and consumes considerable power. In space-constrained situations, a shielding component is placed between the light-emitting and photosensitive elements, typically incorporated into the chip packaging process. However, besides the light interference from the light-emitting element, electromagnetic waves generated by electromagnetic induction can also cause electromagnetic interference to the optical sensor, resulting in noise that affects its accuracy.

[0040] In view of this, the present invention proposes a light sensor chip package. Figures 1 to 6 This is one embodiment of the present invention.

[0041] Please see Figures 1 to 2 The optical sensor chip package 100 includes a substrate 1, a cover 2, a detection unit 5, and a shielding component 6. The cover 2 covers the substrate 1 to enclose two mounting cavities 3 spaced apart in the left-right direction. The upper end of the cover 2 has a window 4 that connects the two mounting cavities 3. The detection unit 5 includes a photosensitive element 51 and a light-emitting element 52, which are respectively disposed in the two mounting cavities 3 and mounted on the substrate 1. The shielding component 6 includes a first shielding element 61 and a second shielding element 62. The first shielding element 61 is disposed at the window 4 to shield electromagnetic waves passing through the window 4, and the second shielding element 62 is disposed in the two mounting cavities 3 to shield electromagnetic waves passing through the cover 2.

[0042] In the technical solution of the present invention, two spaced-apart mounting cavities 3 are used to separate the photosensitive element 51 and the light-emitting element 52 to prevent the light generated by the light-emitting element 52 from interfering with the photosensitive element 51. Both the light-emitting element 52 and the photosensitive element 51 can emit and receive light from the window 4. At the same time, a first shielding element 61 is provided at the window 4, and a second shielding element 62 is provided in the mounting cavity 3, so that the photosensitive element 51 and the light-emitting element 52 are surrounded by the first shielding element 61 and the second shielding element 62 to achieve electromagnetic shielding, thereby preventing electromagnetic waves from interfering with the detection unit 5.

[0043] The material of the substrate 1 is not limited; it can be a copper foil substrate 1, a ceramic substrate 1, or a printed circuit board, etc. The light-emitting element 52 and the photosensitive element 51 are connected to the substrate 1 through wires.

[0044] Furthermore, the first shielding component 61 includes a filter 61a, with conductive layers on both ends of the filter 61a along the vertical direction, and both conductive layers are grounded. By providing the filter 61a, which covers the window 4, the detection unit 5 is protected without affecting light transmission, preventing interference from external foreign objects. To allow light to pass through, the filter 61a can be made of a light-transmitting material, such as glass, acrylic sheet with an attached infrared-absorbing film, or a vapor-deposited condensation filter with infrared absorption. Additionally, the opening size of the window 4 is larger than the opening size at the junction of the window 4 and the two mounting cavities 3, facilitating the installation of the filter 61a and providing a larger contact area when installed on the cover 2, thus achieving better sealing.

[0045] The first metal shielding layer 62a has conductive layers on both ends, and both conductive layers are grounded to achieve double-layer electromagnetic shielding, thereby achieving a better shielding effect at the window 4 position. At the same time, the conductive layers are made of transparent material to avoid affecting the detection effect of the detection unit 5.

[0046] Please refer to it again. Figures 1 to 2 The window 4 is provided with a circumferential rib 7 to form an installation platform 8. The filter 61a is installed on the installation platform 8 from top to bottom. The optical sensor chip package 100 also includes a buckle plate 9 and a fastener 10. The buckle plate 9 and the fastener 10 are respectively provided on the left and right sides of the window 4. The buckle plate 9 is hinged to the cover 2 and covers or opens the installation platform 8 during its movement stroke. The buckle plate 9 has an opening to allow at least a portion of the filter 61a to be exposed upward when the buckle plate 9 covers the installation platform 8. The fastener 10 is used to fasten the buckle plate 9 when the buckle plate 9 covers the installation platform 8.

[0047] By placing the filter 61a on the mounting platform 8, with the periphery of the filter 61a in contact with the rib 7, the buckle 9 is controlled to cover the upper end of the filter 61a, and the buckle 9 is fastened by the fastener 10, so as to achieve relative fixation between the buckle 9, the filter 61a and the cover 2, and seal the window 4. Compared with the traditional method of gluing the filter 61a to the cover 2, by setting the buckle 9 and the buckle frame 10b, the filter 61a can be easily replaced after the filter 61a does not achieve the desired effect or is damaged.

[0048] Further, please refer to Figure 6The fastener 10 includes a fastener rod 10a and a fastener bracket 10b. The fastener rod 10a is located on one side of the fastener plate 9 along the front-back direction. The fastener rod 10a is hinged to the cover body 2 and can abut against the upper end of the fastener plate 9 during its movement. The fastener bracket 10b is installed on the other side of the fastener plate 9 along the front-back direction. The fastener bracket 10b is used to restrict the fastener rod 10a from separating from the fastener plate 9 when the fastener rod 10a abuts against the fastener plate 9.

[0049] When the buckle plate 9 is fastened to the upper end of the filter 61a, the buckle rod 10a is rotated so that it fastens to the end of the buckle plate 9 away from its hinge end. Simultaneously, the movable end of the buckle rod 10a is embedded in the buckle frame 10b to prevent the buckle rod 10a from separating from the buckle plate 9. Specifically, the buckle plate 9 is hinged to the cover 2 along its front-rear axis, and the corresponding buckle rod 10a is hinged to the cover 2 along its left-right axis. To reduce the space occupied by the buckle rod 10a when it is fixed to the buckle plate 9, a buckle rod is positioned at the upper end of the buckle plate 9, corresponding to the buckle rod. A buckle groove is recessed at position 10a along the front-to-back direction. When the buckle rod 10a is fastened to the buckle plate 9, it will enter the buckle groove to reduce the space it occupies. In addition, the buckle frame 10b is an inverted hook-shaped structure along the vertical direction. The buckle rod 10a can have a certain elastic deformation capability. When the movable end of the buckle rod 10a away from its hinge position is embedded in the buckle frame 10b, the buckle frame 10b will restrict the upward movement of the buckle rod 10a and restrict the periphery of the buckle rod 10a to prevent the buckle rod 10a from separating from the buckle frame 10b, thereby causing the filter 61a to fall off.

[0050] Please see Figure 2 and Figure 4The upper end of the rib 7 is fitted with a sealing ring 11, and a receiving groove 12 is recessed downward at the position corresponding to the sealing ring 11. The receiving groove 12 is used to accommodate the lower part of the sealing ring 11. The sealing ring 11 has a cavity inside, and the cavity contains sealant. Multiple slits 13 are opened on both the upper and lower end faces of the sealing ring 11, and the sealant can flow along the multiple slits 13 to the outside of the sealing ring 11. By installing the sealing exchange at the upper end of the rib 7, the receiving groove 12 allows the lower end of the sealing ring 11 to be inserted, thereby limiting the sealing ring 11. The upper and lower end faces of the sealing ring 11 have multiple gaps 13. When the sealing ring 11 is not in the installed state, the cavity is not connected to the gaps 13, and the sealant will not solidify in a sealed environment. However, when the sealing ring 11 is in the installed state, the sealing ring 11 is squeezed, thereby connecting the cavity to the gaps 13. The sealant can flow out from the gaps 13 at the upper and lower ends of the sealing ring 11, filling the gaps 13 between the sealing ring 11, the filter 61a, and the rib 7, and fastening the filter 61a, the sealing ring 11, and the rib 7. This prevents the filter 61a from falling off or gaps from forming between it and the cover 2 when the buckle plate 9 and the fastener 10 malfunction.

[0051] Furthermore, the lower end of the filter 61a has multiple sealing grooves 14 spaced apart at the positions of the multiple gaps 13 corresponding to the upper end face of the sealing ring 11. When the filter 61a is installed on the mounting platform 8, the sealant flows from the receiving groove 12 into the multiple sealing grooves 14. By having multiple surrounding sealing grooves 14 at the lower end of the filter 61a, the sealant can flow into the sealing grooves 14 and fill them when the filter 61a is installed. After the sealant solidifies, the solidified sealant between the sealing grooves 14 and the sealing ring 11 forms multiple protective barriers, thereby separating the internal environment of the cover 2 from the external environment to achieve better sealing.

[0052] Furthermore, since the filter 61a is fixed to the mounting platform 8 with the sealant, it is not easy to remove the filter 61a when replacing it. Specifically, please refer to [link to relevant documentation]. Figure 3The lower end of the buckle plate 9 is detachably connected to a plurality of fasteners 15, and each of the fasteners 15 has a plug 16 movably installed at its lower end; the filter 61a has a socket 17 at the position corresponding to the plug 16, and the socket 17 is adapted to the corresponding plug 16. When the plug 16 is inserted into the corresponding socket 17, the corresponding fastener 15 is fixed relative to the filter 61a. The method of detachable connection between the fixing member 15 and the buckle plate 9 is not limited; it can be a snap-fit ​​or a connection using screws or other fasteners. In this application, the fixing member 15 and the buckle plate 9 are snap-fitted together via a T-shaped groove. When the fixing member 15 slides into the T-shaped groove, the fixing member 15 and the buckle plate 9 are fixed vertically. When the fixing member 15 slides out of the T-shaped groove, the fixing member 15 can be separated from the buckle plate 9. The lower end of the fixing member 15 is slidably connected to the plug 16. When the buckle plate 9 covers the upper end of the filter 61a, the plug 16 is embedded in the filter. The lower end of the filter 61a, in conjunction with the fixing member 15, presses the filter 61a between the fixing member 15 and the plug 16. When replacing the filter 61a, the filter 61a can be disengaged from the cover 2 by rotating the buckle plate 9. Since the fixing member 15 and the plug 16 are slidably arranged, the fixing member 15 can slide on the cover 2 while the filter 61a is fixed, thereby disengaging the fixing member 15 from the cover plate to replace the new fixing member 15 and the filter 61a, enabling quick replacement of the filter 61a.

[0053] Furthermore, an antistatic layer is attached to the upper surface of the filter 61a. By attaching an antistatic layer to the upper surface of the filter 61a, dust can be prevented from adhering to the filter 61a, thus avoiding dust affecting the detection effect of the detection unit 5.

[0054] Please see Figure 2 The second shielding component 62 includes a metal shielding layer 62a, which is attached to the cavity walls of the two mounting cavities 3. By installing the metal shielding layer 62a on the inner side of the cavity walls of the two mounting cavities 3, electromagnetic protection is provided for the detection unit 5.

[0055] Furthermore, this invention also proposes an electronic device, which includes the optical sensor chip package 100 as described above. Since this electronic device adopts all the technical solutions of all the above embodiments, it has at least the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0056] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A package for an optical sensor chip, characterized in that, include: substrate; A cover is placed on the substrate to enclose and form two mounting cavities spaced apart in the left and right directions. A window is provided at the upper end of the cover, and the window connects the two mounting cavities. The detection unit includes a photosensitive element and a light-emitting element, which are respectively disposed in the two mounting cavities and mounted on the substrate; as well as, The shielding assembly includes a first shielding component and a second shielding component. The first shielding component is disposed at the window to shield electromagnetic waves passing through the window, and the second shielding component is disposed in the two mounting cavities to shield electromagnetic waves passing through the cover. The first shielding component includes a filter, and each of the two ends of the filter along the vertical direction is provided with a conductive layer, and both conductive layers are used for grounding; The window is provided with a rib to form a mounting platform, and the filter is mounted on the mounting platform from top to bottom; The optical sensor chip package also includes a buckle plate and a fastener, which are respectively disposed on the left and right sides of the window. The buckle plate is hinged to the cover and closes or opens the mounting platform during its movement stroke. An opening is provided on the buckle plate to expose at least a portion of the filter upward when the buckle plate closes the mounting platform. The fastener is used to fasten the buckle plate when the buckle plate closes the mounting platform.

2. The optical sensor chip package as described in claim 1, characterized in that, The fastener includes: A latching rod is provided on one side of the latching plate along the front-rear direction; the latching rod is hinged to the cover body and can abut against the upper end of the latching plate during its travel; and, A buckle is installed on the other side of the buckle plate along the front-rear direction. The buckle is used to prevent the buckle rod from separating from the buckle plate when the buckle rod abuts against the buckle plate.

3. The optical sensor chip package as described in claim 1, characterized in that, The upper end of the rib is fitted with a sealing ring, and a receiving groove is recessed downward at the position corresponding to the sealing ring. The receiving groove is used to accommodate the lower part of the sealing ring. The sealing ring has a cavity inside, and the cavity contains sealant. Multiple slits are opened on both the upper and lower end faces of the sealing ring, and the sealant can flow to the outside of the sealing ring along the multiple slits.

4. The optical sensor chip package as described in claim 3, characterized in that, The lower end of the filter is provided with multiple sealing grooves at intervals at multiple gap positions corresponding to the upper end face of the sealing ring; When the filter is installed on the mounting platform, the sealant flows from the receiving groove into the plurality of sealing grooves.

5. The optical sensor chip package as described in claim 1, characterized in that, The lower end of the buckle plate is detachably connected to multiple fasteners, and each fastener has a plug movably installed at its lower end. Each filter has a socket at a position corresponding to the plug. The socket is adapted to the corresponding plug. When the plug is inserted into the corresponding socket, the corresponding fixing member is fixed relative to the filter.

6. The optical sensor chip package as described in claim 1, characterized in that, The upper surface of the filter is also covered with an antistatic layer.

7. The optical sensor chip package as described in claim 1, characterized in that, The second shielding component includes a metal shielding layer attached to the cavity walls of the two mounting cavities.

8. An electronic device, characterized in that, Includes the optical sensor chip package as described in any one of claims 1-7.

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