Power modules and inverters

Abstract

This invention provides a power module and an inverter. The power module includes: a first power switching device, comprising a first chip assembly, the first chip assembly including a first chip and a second chip connected in parallel; and a second power switching device, operating alternately with the first power switching device, the second power switching device including a second chip assembly, the second chip assembly including a third chip and a fourth chip connected in parallel; the first chip and the third chip are spaced apart on a first plane, and along a direction perpendicular to the first plane, the fourth chip is located below the first chip and at least a portion of the fourth chip is opposite to the first chip, and the second chip is located below the third chip and at least a portion of the second chip is opposite to the third chip. The power module of this invention solves the problems of poor heat dissipation and large size of existing power modules.

Description

Technical Field

[0001] This invention relates to the field of inverter technology, and more specifically, to a power module and an inverter. Background Technology

[0002] Semiconductor (IGBT, MOSFET, etc.) power module packaging technology mainly addresses issues such as heat dissipation, current carrying capacity, reliable connection, and power density improvement of the module.

[0003] Currently, traditional power module packaging typically employs a planar chip layout. High-power modules, in particular, require multiple chips connected in parallel to generate significant power. Higher power output leads to larger module size and larger heatsink surface area, resulting in low system power density, large size, high stray inductance, and poor heat dissipation. Furthermore, traditional power modules use single-sided cooling, further contributing to their large size and poor heat dissipation. Summary of the Invention

[0004] The main objective of this invention is to provide a power module and inverter to solve the problems of poor heat dissipation and large size of existing power modules.

[0005] To achieve the above objectives, according to one aspect of the present invention, a power module is provided, comprising: a first power switching device including a first chip assembly, the first chip assembly including a first chip and a second chip arranged in parallel; a second power switching device operating alternately with the first power switching device, the second power switching device including a second chip assembly, the second chip assembly including a third chip and a fourth chip arranged in parallel; the first chip and the third chip are spaced apart on a first plane, and along a direction perpendicular to the first plane, the fourth chip is located below the first chip and at least a portion of the fourth chip is arranged opposite to the first chip, and the second chip is located below the third chip and at least a portion of the second chip is arranged opposite to the third chip.

[0006] Furthermore, the power module also includes: a first circuit having a first positive power terminal, a first negative power terminal, and a first phase output power terminal; a first chip and a third chip are disposed on the first circuit, the first chip being disposed between the first positive power terminal and the first phase output power terminal, and the third chip being disposed between the first negative power terminal and the first phase output power terminal; and a second circuit having a second positive power terminal, a second negative power terminal, and a second phase output power terminal; a second chip and a fourth chip are disposed on the second circuit, the second chip being disposed between the second positive power terminal and the second phase output power terminal, and the fourth chip being disposed between the second negative power terminal and the second phase output power terminal.

[0007] Furthermore, the first chip component and the second chip component are arranged in pairs, and the power module includes multiple pairs of first chip components and second chip components arranged in pairs; multiple first chip components are arranged in parallel, and multiple second chip components are arranged in parallel.

[0008] Furthermore, the power module includes a terminal assembly, which includes multiple terminals, including a first positive power terminal, a first negative power terminal, a second positive power terminal, a second negative power terminal, a first phase output power terminal, and a second phase output power terminal; the first positive power terminal is connected to the first positive power terminal, the first negative power terminal is connected to the first negative power terminal, and the first phase output power terminal is connected to the first phase output power terminal; the second positive power terminal is connected to the second positive power terminal, the second negative power terminal is connected to the second negative power terminal, and the second phase output power terminal is connected to the second phase output power terminal; the first positive power terminal and the second negative power terminal are arranged sequentially along a direction perpendicular to the first plane, the second positive power terminal and the first negative power terminal are arranged sequentially along a direction perpendicular to the first plane, and the first phase output power terminal and the second phase output power terminal are arranged sequentially along a direction perpendicular to the first plane.

[0009] Furthermore, the power module also includes a power module housing, and both the first power switching device and the second power switching device are disposed within the power module housing. The power module housing includes a first encapsulation plate. The multiple terminals also include multiple signal terminals, and the multiple terminals are disposed through the first encapsulation plate.

[0010] Furthermore, the power module also includes: a power module housing, with both the first power switching device and the second power switching device disposed within the power module housing; a first heat sink, at least partially disposed within the power module housing, with the first chip and the third chip disposed on a first side of the first heat sink, and the second chip and the fourth chip disposed on a second side of the first heat sink; a second heat sink, at least partially disposed within the power module housing, disposed on the side of the first chip and the third chip away from the first heat sink; and a third heat sink, at least partially disposed within the power module housing, disposed on the side of the second chip and the fourth chip away from the first heat sink.

[0011] Further, the first heat sink includes a first heat sink plate and a second heat sink plate, with a heat dissipation cavity for containing coolant between the first and second heat sink plates. The first heat sink plate is disposed opposite to the first chip and the third chip, and the second heat sink plate is disposed opposite to the second chip and the fourth chip. And / or, the second heat sink includes a third heat sink plate and a plurality of first heat dissipation pins disposed on the third heat sink plate. The third heat sink plate is disposed opposite to the first chip and the third chip, and the second heat sink contacts the coolant in the cavity of the inverter housing through a first opening on the power module housing. And / or, the third heat sink includes a fourth heat sink plate and a plurality of second heat dissipation pins disposed on the fourth heat sink plate. The fourth heat sink plate is disposed opposite to the second chip and the fourth chip, and the third heat sink contacts the coolant in the cavity of the inverter housing through a second opening on the power module housing.

[0012] Furthermore, each terminal includes a first connecting portion and a second connecting portion connected to the first connecting portion. The first connecting portion is used to connect to a first power switching device or a second power switching device, and the second connecting portion is used to connect to an external component. Both the first connecting portion and the second connecting portion are flat plate structures, and the first connecting portion and the second connecting portion are arranged perpendicularly to each other.

[0013] Furthermore, each terminal also includes a third connecting part, through which the first connecting part is connected to the second connecting part. The terminal has a flat plate structure so that the first connecting part and the second connecting part are arranged perpendicularly by twisting the third connecting part.

[0014] According to another aspect of the present invention, an inverter is provided, including a housing, the housing including a plurality of receiving cavities for containing coolant; the inverter also includes a plurality of the above-described power modules, the plurality of power modules being disposed in a one-to-one correspondence with the plurality of receiving cavities, and at least a portion of each power module being disposed within a corresponding receiving cavity.

[0015] The power module of this invention includes a first power switching device and a second power switching device. The first and second power switching devices on the upper and lower bridges operate alternately and cannot be simultaneously turned on, otherwise a short circuit would occur. Therefore, the heating of the first and second power switching devices also alternates; that is, the first and second chips operate and heat up simultaneously; the third and fourth chips operate and heat up simultaneously; the first and third chips operate and heat up alternately; and the first and fourth chips operate and heat up alternately. The power module arranges the four chips as follows: the first and third chips are spaced apart on a first plane, and along a direction perpendicular to the first plane, the fourth chip is located below the first chip with at least a portion opposite to the first chip; the second chip is located below the third chip with at least a portion opposite to the third chip. This arrangement ensures that the first and second chips are far apart, and the first, third, and fourth chips are close together, improving heat dissipation. Furthermore, the double-layer arrangement effectively utilizes space, reducing the volume of the power switching devices and achieving high-temperature resistant, small-volume, and high-power-density packaging of the power switching devices. Attached Figure Description

[0016] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0017] Figure 1 An arrangement diagram of the first chip, second chip, third chip and fourth chip of the power module according to the present invention is shown;

[0018] Figure 2 A connection diagram of the power switching device of the power module according to the present invention is shown;

[0019] Figure 3 A schematic diagram of the first and second circuits of the power module according to the present invention is shown;

[0020] Figure 4 A schematic diagram of the power module according to the present invention is shown from a top view.

[0021] Figure 5 A schematic diagram of the power module according to the present invention from a low angle is shown;

[0022] Figure 6 A schematic diagram of the power module according to the present invention from a side view is shown;

[0023] Figure 7 A schematic diagram of the structure of the first heat sink of the power module according to the present invention is shown;

[0024] Figure 8A schematic diagram of the structure of the second heat sink of the power module according to the present invention is shown;

[0025] Figure 9 A schematic diagram of the inverter according to the present invention is shown;

[0026] Figure 10 A schematic diagram of the terminal structure of the power module according to the present invention is shown;

[0027] Figure 11 A schematic diagram of the structure of the third heat sink of the power module according to the present invention is shown;

[0028] Figure 12 A schematic diagram showing the connection between the first connection portion of the power module according to the present invention and the first copper substrate is shown;

[0029] Figure 13 A schematic diagram of the structure of the first packaged board of the power module according to the present invention is shown;

[0030] Figure 14 A schematic diagram of the power module according to the present invention is shown.

[0031] The above figures include the following reference numerals:

[0032] 10. First power switching device; 11. First chip; 12. Second chip; 20. Second power switching device; 21. Third chip; 22. Fourth chip; 31. First positive power terminal; 32. First negative power terminal; 33. Second positive power terminal; 34. Second negative power terminal; 35. First phase output power terminal; 36. Second phase output power terminal; 37. Signal terminal; 381. First connecting part; 382. Second connecting part; 383. Third connecting part; 384. Soldering part; 385. Bonding copper strip; 40. Power module housing; 41. First encapsulation board; 42. First housing ; 43. Second housing; 50. First radiator; 51. First heat sink plate; 52. Second heat sink plate; 53. Heat dissipation cavity; 60. Second radiator; 61. Third heat sink plate; 62. First heat dissipation pin; 70. Third radiator; 71. Fourth heat sink plate; 72. Second heat dissipation pin; 81. Housing; 811. Receiving cavity; 90. First copper substrate; 100. Second copper substrate; 110. Third copper substrate; 120. Fourth copper substrate; 130. First circuit; 140. Second circuit; 150. First bonding wire; 160. Second bonding wire; 411. Second fixing hole; 812. First fixing hole;

[0033] 1-1, First positive power terminal; 1-2, Second positive power terminal; 2-1, First negative power terminal; 2-2, Second negative power terminal; 3-1, First phase output power terminal; 3-2, Second phase output power terminal;

[0034] 4-1-1, First control signal terminal; 4-1-2, Third control signal terminal; 4-3-1, Second control signal terminal; 4-3-2, Fourth control signal terminal;

[0035] 3. Third power switching device; 4. Fourth power switching device; 5. Fifth power switching device; 6. Sixth power switching device. Detailed Implementation

[0036] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0037] It should be noted that the following detailed descriptions are illustrative and intended to provide further explanation of this application. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0038] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0039] This invention provides a power module, please refer to... Figures 1 to 13 The device includes: a first power switching device 10, which includes a first chip assembly, the first chip assembly including a first chip 11 and a second chip 12 arranged in parallel; a second power switching device 20, which operates alternately with the first power switching device 10, the second power switching device 20 including a second chip assembly, the second chip assembly including a third chip 21 and a fourth chip 22 arranged in parallel; the first chip 11 and the third chip 21 are spaced apart on a first plane, and along a direction perpendicular to the first plane, the fourth chip 22 is located below the first chip 11 and at least a portion of the fourth chip 22 is arranged opposite to the first chip 11, and the second chip 12 is located below the third chip 21 and at least a portion of the second chip 12 is arranged opposite to the third chip 21.

[0040] The power module of this invention includes a first power switching device 10 and a second power switching device 20. The first power switching device 10 and the second power switching device 20 of the upper and lower bridges operate alternately and cannot be turned on simultaneously, otherwise a direct short circuit would occur. Therefore, the heating of the first power switching device 10 and the second power switching device 20 also alternates. That is, the first chip 11 and the second chip 12 operate and heat up simultaneously; the third chip 21 and the fourth chip 22 operate and heat up simultaneously; the first chip 11 and the third chip 21 operate and heat up alternately, and the first chip 11 and the fourth chip 22 operate and heat up alternately. The power module arranges the four chips as follows: the first chip 11 and the third chip 21 are spaced apart on a first plane, and along a direction perpendicular to the first plane, the fourth chip 22 is located below the first chip 11, with at least a portion of the fourth chip 22 opposite to the first chip 11; the second chip 12 is located below the third chip 21, with at least a portion of the second chip 12 opposite to the third chip 21. This arrangement ensures that the first chip 11 and the second chip 12 are far apart, while the first chip 11 is close to the third chip 21 and the fourth chip 22, which improves heat dissipation. The double-layer arrangement also makes effective use of space, reduces the size of the power switching device, and enables the power switching device to be packaged in high temperature, small size and high power density.

[0041] The third chip 21 and the fourth chip 22 are spaced apart on the second plane, while the first plane and the second plane are parallel and spaced apart. At least a portion of the fourth chip 22 is positioned opposite to the first chip 11, meaning that at least a portion of the projections of the fourth chip 22 and the first chip 11 on the first plane coincide. At least a portion of the second chip 12 is positioned opposite to the third chip 21, meaning that at least a portion of the projections of the second chip 12 and the third chip 21 on the first plane coincide.

[0042] In this embodiment, the power module further includes: a first circuit 130 having a first positive power terminal 1-1, a first negative power terminal 2-1, and a first phase output power terminal 3-1; a first chip 11 and a third chip 21 are disposed on the first circuit 130, with the first chip 11 positioned between the first positive power terminal 1-1 and the first phase output power terminal 3-1, and the third chip 21 positioned between the first negative power terminal 2-1 and the first phase output power terminal 3-1; and a second circuit 140 having a second positive power terminal 1-2, a second negative power terminal 2-2, and a second phase output power terminal 3-2; a second chip 12 and a fourth chip 22 are disposed on the second circuit 140, with the second chip 12 positioned between the second positive power terminal 1-2 and the second phase output power terminal 3-2, and the fourth chip 22 positioned between the second negative power terminal 2-2 and the second phase output power terminal 3-2. This arrangement ensures complete overlap of positive and negative currents, minimizing stray inductance parameters related to the external motor and capacitor.

[0043] In this embodiment, the first chip assembly and the second chip assembly are arranged in pairs, and the power module includes multiple pairs of paired first chip assemblies and second chip assemblies; multiple first chip assemblies are arranged in parallel, and multiple second chip assemblies are arranged in parallel. The parallel arrangement of multiple first chip assemblies means that all the first chips and second chips included in the multiple first chip assemblies are arranged in parallel; the parallel arrangement of multiple second chip assemblies means that all the third chips and fourth chips included in the multiple second chip assemblies are arranged in parallel. When the first power switching device 10 includes multiple chips and the second power switching device 20 includes multiple chips, a reasonable chip layout can be ensured, achieving high-temperature resistant packaging, small-volume packaging, and high-power-density packaging of the power switching devices. This arrangement provides good power scalability, and the uniform arrangement is beneficial to the consistency of the device switching characteristics.

[0044] In this embodiment, the power module includes a terminal assembly comprising multiple terminals, including a first positive power terminal 31, a first negative power terminal 32, a second positive power terminal 33, a second negative power terminal 34, a first phase output power terminal 35, and a second phase output power terminal 36. The first positive power terminal 31 is connected to the first positive power terminal, the first negative power terminal 32 is connected to the first negative power terminal, and the first phase output power terminal 35 is connected to the first phase output power terminal. The second positive power terminal 33 is connected to the second positive power terminal, the second negative power terminal 34 is connected to the second negative power terminal, and the second phase output power terminal 36 is connected to the second phase output power terminal. The first positive power terminal 31 and the second negative power terminal 34 are arranged sequentially along a direction perpendicular to the first plane, the second positive power terminal 33 and the first negative power terminal 32 are arranged sequentially along a direction perpendicular to the first plane, and the first phase output power terminal 35 and the second phase output power terminal 36 are arranged sequentially along a direction perpendicular to the first plane. This arrangement ensures complete overlap of positive and negative currents, minimizing stray inductance parameters related to external motors and capacitors.

[0045] Specifically, the power module includes multiple terminal components, and multiple pairs of paired first chip components and second chip components are arranged one-to-one. Each terminal component is connected to the corresponding paired first chip component and second chip component.

[0046] In this embodiment, the power module further includes a power module housing 40. The first power switching device 10 and the second power switching device 20 are both disposed within the power module housing 40. The power module housing 40 includes a first encapsulation plate 41. The multiple terminals also include multiple signal terminals 37, all of which are disposed on the first encapsulation plate 41. The multiple terminals are positioned on one plane of the power module, allowing the other sides of the power module to be completely immersed in coolant, which facilitates heat dissipation and does not affect the design of the drive unit and input / output copper busbars, further reducing the size of the power unit system.

[0047] In this embodiment, the power module further includes: a power module housing 40, with the first power switch device 10 and the second power switch device 20 both disposed within the power module housing 40; a first heat sink 50, at least partially disposed within the power module housing 40, with the first chip 11 and the third chip 21 disposed on a first side of the first heat sink 50, and the second chip 12 and the fourth chip 22 disposed on a second side of the first heat sink 50; a second heat sink 60, at least partially disposed within the power module housing 40, disposed on the side of the first chip 11 and the third chip 21 away from the first heat sink 50; and a third heat sink 70, at least partially disposed within the power module housing 40, disposed on the side of the second chip 12 and the fourth chip 22 away from the first heat sink 50. This arrangement allows for simultaneous heat dissipation from both the upper and lower surfaces of the chips, resulting in good heat dissipation and effectively reducing the size of the heat sink.

[0048] In this embodiment, the first heat sink 50 includes a first heat sink 51 and a second heat sink 52. A heat dissipation cavity 53 for containing coolant is located between the first heat sink 51 and the second heat sink 52. The first heat sink 51 is disposed opposite to the first chip 11 and the third chip 21, and the second heat sink 52 is disposed opposite to the second chip 12 and the fourth chip 22. The heat dissipation cavity 53 increases the contact area with the coolant. This is just one example of a heat sink design; any heat sink with two solderable surfaces will satisfy this design. The first copper substrate 90 and the third copper substrate 110 can be arranged on the upper and lower surfaces of the first heat sink 50, or on the upper and lower surfaces of a metal plate, facilitating high and low power platforms, easy platformization for packaging, and cost reduction.

[0049] Specifically, the first radiator 50 has a communication port that is connected to the heat dissipation cavity 53. The communication port extends out of the power module housing 40 so that the coolant in the receiving cavity 811 of the housing 81 enters the heat dissipation cavity 53 through the communication port.

[0050] In this embodiment, the second heat sink 60 includes a third heat sink 61 and a plurality of first heat sink pins 62 disposed on the third heat sink 61. The third heat sink 61 is disposed opposite to the first chip 11 and the third chip 21. The second heat sink 60 contacts the coolant in the receiving cavity 811 of the inverter housing 81 through a first opening on the power module housing 40, and the second heat sink 60 can seal the first opening. The plurality of first heat sink pins 62 increase the contact area with the coolant. Of course, this is only one form of heat sink, and any heat sink with a solderable surface can satisfy this design.

[0051] In this embodiment, the third heat sink 70 includes a fourth heat sink 71 and a plurality of second heat sink pins 72 disposed on the fourth heat sink 71. The fourth heat sink 71 is disposed opposite to the second chip 12 and the fourth chip 22. The third heat sink 70 contacts the coolant in the receiving cavity 811 of the inverter housing 81 through a second opening on the power module housing 40, and the third heat sink 70 can seal the second opening. The plurality of second heat sink pins 72 increase the contact area with the coolant. Of course, this is only one form of heat sink, and any heat sink with a solderable surface can satisfy this design.

[0052] Specifically, the first opening and the second opening are located on opposite sides of the power module housing 40.

[0053] In this embodiment, each terminal includes a first connecting portion 381 and a second connecting portion 382 connected to the first connecting portion 381. The first connecting portion 381 is used to connect to the first power switching device 10 or the second power switching device 20, and the second connecting portion 382 is used to connect to an external component. Both the first connecting portion 381 and the second connecting portion 382 are flat plate structures, and are arranged perpendicularly to each other. This allows the second connecting portion 382 to be arranged vertically, and it can be widened accordingly in the vertical direction to increase current carrying capacity and heat dissipation capacity, while reducing the space occupied by the copper busbar. The external component is a motor or a capacitor.

[0054] Specifically, the first connecting part and the second connecting part are arranged sequentially along the first preset direction. The width of the second connecting part 382 perpendicular to the first preset direction is greater than the width of the first connecting part 381 perpendicular to the first preset direction. The width of the second connecting part 382 is its width along the vertical direction, and the width of the first connecting part 381 is its width along the horizontal direction. Both the second connecting part 382 and the first connecting part 381 are of equal width.

[0055] In this embodiment, each terminal also includes a third connecting portion 383. The first connecting portion 381 is connected to the second connecting portion 382 through the third connecting portion 383. The terminal has a flat plate structure, so that the first connecting portion 381 and the second connecting portion 382 are arranged perpendicularly by twisting the third connecting portion 383. The terminal is bent at 90°, from the previous horizontal direction to the vertical direction. After bending, the second connecting portion 382 can be widened accordingly in the vertical direction to increase the current carrying capacity and heat dissipation capacity, and reduce the space occupied by the copper busbar.

[0056] Specifically, the end of the first connecting part 381 away from the second connecting part 382 is provided with a notch, which facilitates tolerance adjustment.

[0057] In this embodiment, the power module further includes: a first copper substrate 90, soldered to a first heat sink 51, and a first chip 11 and a third chip 21 soldered to the first copper substrate 90; a second copper substrate 100, with the first chip 11 and the third chip 21 soldered between the first copper substrate 90 and the second copper substrate 100; the side of the second copper substrate 100 away from the first chip 11 is soldered to the third heat sink 61; a first bonding wire 150 leads the electrical signals of the first chip 11 and the third chip 21 to the first copper substrate 90; and a first phase output power terminal 35, a first positive power terminal 31, a first negative power terminal 32, and multiple signal terminals 37 are all soldered to the first copper substrate 90.

[0058] In specific implementation, the connection method of the first phase output power terminal 35 is as follows: a welding part 384 is provided in the power module housing 40, and the first connecting part 381 is welded and fixed to the welding part 384; the binding copper strip 385 is used to connect the first connecting part 381 and the first copper substrate 90.

[0059] In this embodiment, the third copper substrate 110 is soldered onto the second heat sink 52, and the second chip 12 and the fourth chip 22 are soldered onto the third copper substrate 110; the fourth copper substrate 120 is between the third copper substrate 110 and the fourth copper substrate 120; the side of the fourth copper substrate 120 away from the second chip 12 is soldered to the fourth heat sink 71; the second bonding wire 160 leads the electrical signals of the second chip 12 and the fourth chip 22 to the third copper substrate 110, and the second phase output power terminal 36, the second positive power terminal 33, and the second negative power terminal 34 are all soldered to the third copper substrate 110.

[0060] Specifically, the power module housing 40 includes a first housing 42 and a second housing 43. A first chip 11 and a third chip 21 are disposed in the first housing 42, and a second chip 12 and a fourth chip 22 are disposed in the second housing 43. The first housing 42 and the second housing 43 are potted with epoxy resin to form a sealed cavity.

[0061] Specifically, the chip within the power module can be an IGBT (Insulated Gate Bipolar Transistor) or a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor). Specifically, the first circuit 130 has a first control signal terminal 4-1-1 and a second control signal terminal 4-3-1, and the second circuit 140 has a third control signal terminal 4-1-2 and a fourth control signal terminal 4-3-2, as shown below. Figure 3 As shown, the first positive power terminal 1-1 and the second positive power terminal 1-2 correspond to the collector (C) of the IGBT or the drain (D) of the MOSFET; the second negative power terminal 2-1 and the second negative power terminal 2-2 correspond to the emitter (E) of the IGBT or the source (S) of the MOSFET; the first control signal terminal 4-1-1 and the second control signal terminal 4-3-1, and the second circuit 140 has a third control signal terminal 4-1-2 and a fourth control signal terminal 4-3-2 corresponding to the gate (G) of the IGBT / MOSFET. Each signal terminal 37 is connected to its corresponding control signal terminal.

[0062] In practical implementation, this power module can be used to realize the parallel use of two modules, to realize the H-bridge module of single-phase DC to AC conversion, or to be used for the control of multiple motors.

[0063] The present invention also provides an inverter, including a housing 81, the housing including a plurality of receiving cavities 811 for containing coolant; the inverter also includes a plurality of power modules as described in the above embodiments, the plurality of power modules being arranged one-to-one with the plurality of receiving cavities 811, and at least a portion of each power module being disposed within the corresponding receiving cavity 811.

[0064] Specifically, such as Figure 2 As shown, the inverter's DC-to-three-phase AC conversion requires six power switching devices: a first power switching device 10, a second power switching device 20, a third power switching device 3, a fourth power switching device 4, a fifth power switching device 5, and a sixth power switching device 6. These six power switching devices form the inverter's full-bridge topology. Due to the high power requirements, each power switching device requires multiple chips connected in parallel. This three-phase inverter requires three power modules.

[0065] like Figure 2As shown, the first power switch device 10 and the second power switch device 20 of the upper and lower bridges cannot be turned on at the same time, otherwise a short circuit will occur. The two chips that are not turned on at the same time will also alternate in heat generation. Therefore, the heat dissipation of the first power switch device 10 and the second power switch device 20 can be carried out alternately. Similarly, the third power switch device 3 and the fourth power switch device 4 alternate, and the fifth power switch device 5 and the sixth power switch device 6 alternate.

[0066] Specifically, the housing 81 includes multiple housing parts arranged sequentially along the vertical direction, and each housing part is arranged in a one-to-one correspondence with a multiple receiving cavity 811, with each housing part forming a corresponding receiving cavity 811; each housing part is provided with a first fixing hole 812; the power module housing 40 is a rectangular housing, and the first encapsulation plate 41 is one of the panels of the rectangular housing, with a second fixing hole 411 provided on the first encapsulation plate 41, and the other parts of the power module housing 40 except for the first encapsulation plate 41 are disposed in the receiving cavity 811; the first encapsulation plate 41 is locked by bolts inserted into the second fixing hole 411 and the first fixing hole 812, such a arrangement allows the other five encapsulation plates of the power module to enter the cooling cavity.

[0067] This application relates to a high power density power module and inverter, and focuses on solving three key technologies: small-volume packaging of power switching devices, high-temperature resistant packaging, and high-power density packaging. The power module has high integration, good heat dissipation, and small size, which maximizes the performance of the module and reduces the size by half. It also provides an implementation method for the inverter.

[0068] This application reduces the surface area of ​​the power module by half. By analyzing the operation of a three-phase, six-power-switching inverter full-bridge topology, the optimal placement of each chip was determined, and a two-layer chip arrangement structure was designed. This transforms the chip arrangement from a planar layout to a vertical arrangement of two layers, effectively utilizing space. Chips that operate alternately are placed close together, while chips operating simultaneously are placed separately. Furthermore, the two layers employ a completely symmetrical layout and wiring structure, reducing stray inductance parameters. This rational chip layout also facilitates the expansion of power ratings.

[0069] As can be seen from the above description, the embodiments of the present invention achieve the following technical effects:

[0070] The power module of this invention includes a first power switching device 10 and a second power switching device 20. The first power switching device 10 and the second power switching device 20 of the upper and lower bridges operate alternately and cannot be turned on simultaneously, otherwise a direct short circuit would occur. Therefore, the heating of the first power switching device 10 and the second power switching device 20 also alternates. That is, the first chip 11 and the second chip 12 operate and heat up simultaneously; the third chip 21 and the fourth chip 22 operate and heat up simultaneously; the first chip 11 and the third chip 21 operate and heat up alternately, and the first chip 11 and the fourth chip 22 operate and heat up alternately. The power module arranges the four chips as follows: the first chip 11 and the third chip 21 are spaced apart on a first plane, and along a direction perpendicular to the first plane, the fourth chip 22 is located below the first chip 11, with at least a portion of the fourth chip 22 opposite to the first chip 11; the second chip 12 is located below the third chip 21, with at least a portion of the second chip 12 opposite to the third chip 21. This arrangement ensures that the first chip 11 and the second chip 12 are far apart, while the first chip 11 is close to the third chip 21 and the fourth chip 22, which improves heat dissipation. The double-layer arrangement also makes effective use of space, reduces the size of the power switching device, and enables the power switching device to be packaged in high temperature, small size and high power density.

[0071] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0072] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0073] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A power module, characterized in that, include: The first power switching device (10) includes a first chip assembly, which includes a first chip (11) and a second chip (12) connected in parallel. The second power switching device (20) operates alternately with the first power switching device (10). The second power switching device (20) includes a second chip assembly, which includes a third chip (21) and a fourth chip (22) connected in parallel. The first chip (11) and the third chip (21) are spaced apart on a first plane. Along a direction perpendicular to the first plane, the fourth chip (22) is located below the first chip (11) and at least a portion of the fourth chip (22) is disposed opposite to the first chip (11). The second chip (12) is located below the third chip (21) and at least a portion of the second chip (12) is disposed opposite to the third chip (21).

2. The power module according to claim 1, characterized in that, The power module also includes: The first circuit (130) has a first positive power terminal, a first negative power terminal and a first phase output power terminal. The first circuit (130) is provided with a first chip (11) and a third chip (21). The first chip (11) is disposed between the first positive power terminal and the first phase output power terminal, and the third chip (21) is located between the first negative power terminal and the first phase output power terminal. The second circuit (140) has a second positive power terminal, a second negative power terminal and a second phase output power terminal. The second circuit (140) is provided with a second chip (12) and a fourth chip (22). The second chip (12) is disposed between the second positive power terminal and the second phase output power terminal, and the fourth chip (22) is located between the second negative power terminal and the second phase output power terminal.

3. The power module according to claim 1, characterized in that, The first chip component and the second chip component are arranged in pairs, and the power module includes multiple pairs of first chip components and second chip components arranged in pairs; multiple first chip components are arranged in parallel, and multiple second chip components are arranged in parallel.

4. The power module according to claim 2, characterized in that, The power module includes a terminal assembly, which includes multiple terminals, including a first positive power terminal (31), a first negative power terminal (32), a second positive power terminal (33), a second negative power terminal (34), a first phase output power terminal (35), and a second phase output power terminal (36); the first positive power terminal (31) is connected to the first positive power terminal, the first negative power terminal (32) is connected to the first negative power terminal, the first phase output power terminal (35) is connected to the first phase output power terminal; the second positive power terminal (33) is connected to the second positive power terminal, the second negative power terminal (34) is connected to the second negative power terminal, and the second phase output power terminal (36) is connected to the second phase output power terminal; The first positive power terminal (31) and the second negative power terminal (34) are arranged sequentially along a direction perpendicular to the first plane, the second positive power terminal (33) and the first negative power terminal (32) are arranged sequentially along a direction perpendicular to the first plane, and the first phase output power terminal (35) and the second phase output power terminal (36) are arranged sequentially along a direction perpendicular to the first plane.

5. The power module according to claim 4, characterized in that, The power module further includes a power module housing (40), and the first power switching device (10) and the second power switching device (20) are both disposed inside the power module housing (40). The power module housing (40) includes a first encapsulation plate (41). The multiple terminals include multiple signal terminals (37), and all of the terminals are disposed on the first encapsulation plate (41).

6. The power module according to any one of claims 1 to 4, characterized in that, The power module also includes: The power module housing (40) is provided with the first power switch device (10) and the second power switch device (20) both disposed inside the power module housing (40); The first heat sink (50) is at least partially disposed within the power module housing (40), the first chip (11) and the third chip (21) are disposed on the first side of the first heat sink (50), and the second chip (12) and the fourth chip (22) are disposed on the second side of the first heat sink (50). The second heat sink (60) is at least partially disposed inside the power module housing (40), and the second heat sink (60) is disposed on the side of the first chip (11) and the third chip (21) away from the first heat sink (50); A third heat sink (70) is at least partially disposed within the power module housing (40), and the third heat sink (70) is disposed on the side of the second chip (12) and the fourth chip (22) away from the first heat sink (50).

7. The power module according to claim 6, characterized in that, The first heat sink (50) includes a first heat sink (51) and a second heat sink (52), with a heat dissipation cavity (53) for containing coolant between the first heat sink (51) and the second heat sink (52). The first heat sink (51) is disposed opposite to the first chip (11) and the third chip (21), and the second heat sink (52) is disposed opposite to the second chip (12) and the fourth chip (22); and / or, The second heat sink (60) includes a third heat sink plate (61) and a plurality of first heat sink pins (62) disposed on the third heat sink plate (61). The third heat sink plate (61) is disposed opposite to the first chip (11) and the third chip (21). The second heat sink (60) contacts the coolant in the receiving cavity (811) of the inverter housing (81) through a first opening on the power module housing (40); and / or, The third heat sink (70) includes a fourth heat sink plate (71) and a plurality of second heat sink pins (72) disposed on the fourth heat sink plate (71). The fourth heat sink plate (71) is disposed opposite to the second chip (12) and the fourth chip (22). The third heat sink (70) contacts the coolant in the receiving cavity (811) of the inverter housing (81) through a second opening on the power module housing (40).

8. The power module according to claim 4 or 5, characterized in that, Each of the terminals includes a first connecting portion (381) and a second connecting portion (382) connected to the first connecting portion (381). The first connecting portion (381) is used to connect to the first power switching device (10) or the second power switching device (20), and the second connecting portion (382) is used to connect to an external component. Both the first connecting portion (381) and the second connecting portion (382) are flat plate structures, and the first connecting portion (381) and the second connecting portion (382) are arranged perpendicularly to each other.

9. The power module according to claim 8, characterized in that, Each of the terminals also includes a third connecting portion (383), through which the first connecting portion (381) is connected to the second connecting portion (382). The terminal has a flat plate structure so that the first connecting portion (381) and the second connecting portion (382) are arranged perpendicularly by twisting the third connecting portion (383).

10. An inverter, comprising a housing (81), characterized in that, The housing includes a plurality of cavities (811) for containing coolant; the inverter also includes a plurality of power modules according to any one of claims 1 to 9, wherein the plurality of power modules are arranged in a one-to-one correspondence with the plurality of cavities (811), and at least a portion of each power module is disposed in the corresponding cavity (811).

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