Heat dissipation structure, power supply device and electric vehicle

Abstract

The application discloses a heat dissipation structure, a power supply device and an electric vehicle. The heat dissipation structure comprises a shell and a liquid passage pipe. The shell has a heat dissipation cavity which can be installed with heat generating elements inside and outside to improve the utilization rate of the heat dissipation space. The shell comprises at least two heat dissipation parts and at least one connecting part. A plurality of flow channels are arranged in the heat dissipation part. At least two liquid passage pipes are connected with the liquid inlet and the liquid outlet at two ends of each flow channel. One end of the liquid passage pipe is connected with the cooling liquid with lower temperature to flow through the plurality of liquid inlets and the plurality of flow channels to dissipate heat. The cooling liquid with higher temperature after heat dissipation is discharged through the liquid passage pipe connected with one side of the liquid outlet. The shell is supported by the flow channel wall between every two adjacent flow channels to improve the support strength. The arrangement of the flow channels can reduce the weight of the shell, increase the effective contact area of heat dissipation and improve the heat dissipation efficiency, and solve the technical problems of the existing liquid cooling heat dissipation device, such as large weight and insufficient compression strength.

Description

Technical Field

[0001] This invention relates to the field of liquid cooling technology, and particularly to a heat dissipation structure, power supply equipment, and electric vehicle. Background Technology

[0002] Existing on-board chargers typically use liquid cooling devices that are either die-cast or sheet metal formed. Due to process limitations, die-cast cooling channels have thicker walls, resulting in heavier liquid cooling devices with higher thermal resistance and poorer heat dissipation. Sheet metal cooling channels have thinner walls, but lower pressure resistance and are prone to deformation. Summary of the Invention

[0003] The main objective of this invention is to provide a heat dissipation structure that addresses the technical problems of existing liquid cooling devices being too heavy or lacking sufficient compressive strength, and to improve the applicability of the heat dissipation structure.

[0004] To achieve the above objectives, the heat dissipation structure proposed in this invention includes:

[0005] A housing having a heat dissipation cavity, the housing including at least one connecting portion and at least two heat dissipation portions, adjacent heat dissipation portions being connected by the connecting portion, each heat dissipation portion having a plurality of spaced-apart flow channels surrounding the heat dissipation cavity, the inner wall and / or the outer wall of the heat dissipation cavity being used to mount heating elements, each flow channel having an inlet and an outlet at both ends; and

[0006] At least two liquid passages are connected to the housing, wherein at least one liquid passage is connected to the liquid inlet and at least one liquid passage is connected to the liquid outlet.

[0007] In one embodiment, the housing includes:

[0008] A liquid cooling component, wherein a groove is recessed on one surface of the liquid cooling component, and the liquid inlet and the liquid outlet are arranged around the opening of the groove. The liquid cooling component includes at least one connecting portion and at least two heat dissipation portions, which are staggered along the extending direction of the groove.

[0009] Two partitions connect the two sides of the liquid cooling component and enclose the container to form the heat dissipation cavity with an opening on one side.

[0010] In one embodiment, the receiving groove is a U-shaped groove;

[0011] Alternatively, the liquid cooling component may have extensions at both ends, with the two extensions extending away from the opening respectively. The liquid inlet and the liquid outlet pass through the extensions, and the outer peripheral wall of the extension is used to mount the heating element.

[0012] In one embodiment, the thickness of the heat dissipation portion is greater than the thickness of the connecting portion;

[0013] And / or, the partition is an aluminum substrate;

[0014] And / or, the liquid cooling component is a heat spreader;

[0015] And / or, the liquid cooling component is an extruded structure;

[0016] And / or, at least one of the partitions is welded to the liquid cooling component;

[0017] And / or, at least one of the partitions is detachably connected to the liquid cooling component.

[0018] In one embodiment, each of the partitions is provided with a first mounting portion, which is located at the opening. Two first mounting portions extend to the sides opposite to the opening, respectively. The first mounting portions are detachably connected to a first circuit board or an external component, which covers the opening.

[0019] In one embodiment, the side of the heat dissipation section opposite to the opening is used to mount at least one of the heating elements, and a thermally conductive adhesive layer is provided between the heating element and the heat dissipation section.

[0020] In one embodiment, each of the partitions is further provided with a second mounting portion on the side away from the opening, the second mounting portion being used to mount a second circuit board, on which the heating element is provided.

[0021] In one embodiment, the connecting portion is provided with a through hole communicating with the receiving groove;

[0022] And / or, the liquid cooling component has a conductive portion on at least one side adjacent to the partition, and the conductive portion has a plurality of through holes to allow the pins of the heating element housed in the heat dissipation cavity to pass through.

[0023] In one embodiment, the heat dissipation structure includes a plurality of housings and a plurality of liquid passage pipes, wherein the flow channels of two adjacent housings are connected in series through the liquid passage pipes;

[0024] And / or, at least two of the heat dissipation sections have their flow channels connected in parallel via the liquid passage pipe.

[0025] The present invention also proposes a power supply device, the power supply device comprising: at least one heat source and a heat dissipation structure as described in any of the above embodiments;

[0026] At least one of the heat sources is thermally connected to the inner and / or outer surfaces of the heat dissipation cavity of the heat dissipation structure.

[0027] The present invention also proposes an electric vehicle, the electric vehicle comprising:

[0028] Vehicle body;

[0029] A power battery, wherein the power battery is disposed within the vehicle body; and

[0030] As described in the previous embodiment, the power supply device is located inside the vehicle body and is electrically connected to the power battery to provide charging power to the power battery.

[0031] The technical solution of this invention solves the technical problems of existing liquid cooling heat dissipation devices being too heavy or having insufficient compressive strength by using a shell with flow channels to form a heat dissipation cavity, where heating elements can be installed both inside and outside the heat dissipation cavity.

[0032] This heat dissipation structure includes a shell and liquid-conducting pipes. The shell has heat dissipation cavities where heating elements can be installed both internally and externally to improve the utilization of heat dissipation space. The shell has at least two heat dissipation sections spaced apart, with adjacent sections connected by a connecting part. Each heat dissipation section has multiple flow channels. The liquid-conducting pipe connects to both sides of the shell and connects to the inlet and outlet of each flow channel. Lower-temperature coolant flows through one end of the liquid-conducting pipe, passing through multiple inlets and flow channels for heat dissipation. Higher-temperature coolant is discharged through the liquid-conducting pipe connected to the outlet. The shell is reinforced with the walls of each pair of adjacent flow channels to enhance its structural strength. The flow channel arrangement reduces the shell's weight and increases the effective contact area for heat dissipation, improving heat dissipation efficiency and solving the technical problems of excessive weight or insufficient compressive strength in existing liquid-cooled heat dissipation devices. Furthermore, the multiple heat dissipation sections facilitate the arrangement of heating elements, making their placement more flexible and improving the applicability of the heat dissipation structure. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0034] Figure 1 This is a schematic diagram of the liquid cooling component in one embodiment of the heat dissipation structure of this application;

[0035] Figure 2 This is a partial structural diagram of the housing of one embodiment of the heat dissipation structure of this application;

[0036] Figure 3 for Figure 2 A schematic diagram of the assembly structure of one embodiment of the middle shell;

[0037] Figure 4 for Figure 2 A schematic diagram of the assembly structure of another embodiment of the middle shell;

[0038] Figure 5 This is a schematic diagram of the liquid flow structure of one embodiment of the heat dissipation structure of this application;

[0039] Figure 6 This is an exploded view of the assembly of one embodiment of the heat dissipation structure of this application;

[0040] Figure 7 For the heat dissipation structure of this application Figure 6 A schematic diagram of liquid flow direction in one embodiment;

[0041] Figure 8 This is a schematic diagram of the liquid cooling component in another embodiment of the heat dissipation structure of this application;

[0042] Figure 9 This is a partial structural diagram of the housing of another embodiment of the heat dissipation structure of this application;

[0043] Figure 10 for Figure 9 A schematic diagram of the assembly structure of one embodiment of the middle shell;

[0044] Figure 11 for Figure 9 A schematic diagram of the assembly structure of another embodiment of the middle shell;

[0045] Figure 12 This is a schematic diagram of the liquid flow structure of another embodiment of the heat dissipation structure of this application;

[0046] Figure 13 This is an exploded view of the assembly of another embodiment of the heat dissipation structure of this application;

[0047] Figure 14 For the heat dissipation structure of this application Figure 13 A schematic diagram of liquid flow direction in one embodiment.

[0048] Explanation of icon numbers:

[0049]

[0050]

[0051] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0052] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0053] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0054] Furthermore, the use of terms such as "first" and "second" in this invention is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this invention.

[0055] Reference Figures 1 to 14 The present invention proposes a heat dissipation structure 100.

[0056] In an embodiment of the present invention, the heat dissipation structure 100 includes a housing 10 and at least two liquid passages 90, the housing 10 having a heat dissipation cavity 10A. For example... Figure 1 and Figure 8 As shown, the housing 10 includes at least one connecting portion 32 and at least two heat dissipation portions 31. Adjacent heat dissipation portions 31 are connected by a connecting portion 32. Each heat dissipation portion 31 has a plurality of spaced-apart flow channels 31A surrounding the heat dissipation cavity 10A. The inner wall and / or outer wall of the heat dissipation cavity 10A are used to mount the heating element 70. Each flow channel 31A has an inlet 311A ​​and an outlet 312A at both ends. (Refer to...) Figure 5 and Figure 12 At least two liquid inlet pipes 90 are connected to the housing 10, wherein at least one liquid inlet pipe 90 is connected to the liquid inlet 311A ​​and at least one liquid inlet pipe 90 is connected to the liquid outlet 312A.

[0057] Reference Figures 2 to 4 , Figures 9 to 11The technical solution of the present invention uses a shell 10 with a flow channel 31A to form a heat dissipation cavity 10A, and a heat dissipation element 70 can be installed inside and outside the heat dissipation cavity 10A, so as to solve the technical problems of existing liquid cooling heat dissipation devices being too heavy or having insufficient compressive strength.

[0058] The heat dissipation structure 100 includes a housing 10 and a liquid passage pipe 90. The housing 10 has a heat dissipation cavity 10A on both the inside and outside where heating elements 70 can be installed to improve the utilization rate of heat dissipation space. The housing 10 is provided with at least two heat dissipation sections 31 at intervals. Two adjacent heat dissipation sections 31 are connected by a connecting section 32. The heat dissipation section 31 is provided with multiple flow channels 31A. The liquid passage pipe 90 connects to both sides of the housing 10 and connects to the inlet 311A ​​and outlet 312A at both ends of each flow channel 31A. A lower temperature coolant is introduced into one end of the liquid passage pipe 90 so that it can be dissipated by flowing through multiple flow channels 31A through multiple inlet 311A. The higher temperature coolant after dissipation is discharged through the liquid passage pipe 90 connected to the outlet 312A on one side. The housing 10 is reinforced with the support strength by the walls of the flow channels 31A between every two adjacent flow channels 31A. At the same time, the arrangement of the flow channels 31A can reduce the weight of the housing 10 and increase the effective contact area for heat dissipation and improve the heat dissipation efficiency, thus solving the technical problems of the existing liquid cooling heat dissipation devices being too heavy or having insufficient compressive strength.

[0059] In addition, providing at least two heat dissipation sections 31 facilitates the arrangement of the heat-generating elements 70, making the arrangement of the heat-generating elements 70 more flexible, improving the applicability of the heat dissipation structure 100 and increasing the material utilization rate.

[0060] It is understood that the heating element 70 includes a first heating source and a second heating source. The first heating source is a PCB board, which includes a circuit board 71 and a magnetic core component 72. The magnetic core component 72 can be a transformer, a capacitor, or a power supply board, etc., which are high-heat-generating components. The core of the transformer or capacitor can be housed in the heat dissipation cavity 10A and electrically connected to the circuit board 71 through pins. The circuit board 71 can be set as one or two, namely the first circuit board 71 and the second circuit board 71. The first circuit board 71 and / or the second circuit board 71 are set on one or both sides of the heat dissipation cavity 10A, or they can be set as adjacent sides or opposite sides. The second heating source can be set on the outer wall of the heat dissipation cavity 10A, including the outer side wall and / or the outer bottom wall. The second heating source can be a surface-mount MOS 73, a through-hole MOS, etc.

[0061] When multiple heat dissipation sections 31 can be separately installed, they can be flexibly spliced ​​according to the needs of the heating element 70 to adapt to the size and number of the heating element 70; when the housing 10 is an integral structure, the heating element 70 can be flexibly arranged in multiple heat dissipation sections 31.

[0062] Understandably, if installation permits, the second heat source can be placed on the outer wall of the liquid pipe 90 to facilitate heat dissipation.

[0063] In one embodiment, the housing 10 includes a liquid cooling component 30 and two partitions 50. A groove 30A is recessed on one surface of the liquid cooling component 30. An inlet 311A ​​and an outlet 312A are arranged around the opening of the groove 30A. The liquid cooling component 30 includes at least one connecting portion 32 and at least two heat dissipation portions 31. The connecting portion 32 and the heat dissipation portions 31 are arranged alternately along the extending direction of the groove 30A. The two partitions 50 connect the two sides of the liquid cooling component 30 and enclose the groove 30A to form a heat dissipation cavity 10A with an opening 10B on one side.

[0064] In this embodiment, the plate of the liquid cooling component 30 includes at least one connecting portion 32 and at least two heat dissipation portions 31. Each heat dissipation portion 31 has multiple spaced-apart flow channels 31A inside. The two ends of the flow channels 31A penetrate the two ends of the plate to form a liquid inlet 311A ​​and a liquid outlet 312A. The liquid inlet 311A ​​and the liquid outlet 312A are distributed at the ends of the two walls of the container 30A. One end of the liquid inlet pipe is connected to the liquid inlet 311A ​​to input a lower temperature coolant, and the other end of the liquid inlet pipe is connected to the liquid outlet 312A to discharge a higher temperature coolant after heat absorption. The lower temperature coolant flows inside the flow channels 31A and is discharged from the liquid outlet 312A located on the opposite side of the liquid inlet 311A, so that the coolant surrounds the entire plate extension direction of the liquid cooling component 30, greatly increasing the heat dissipation contact area and improving the heat dissipation efficiency.

[0065] Optionally, the partition 50 is made of aluminum substrate. Aluminum substrate has the characteristics of low cost, light weight and good thermal conductivity, which reduces the manufacturing cost and weight of the heat dissipation structure 100. The partition 50 can be connected to the liquid cooling component 30 along both sides of the extension direction of the container 30A by means of adhesive bonding or welding, so as to block the openings 10B on both sides of the container 30A, forming a heat dissipation cavity 10A with an opening 10B on one side.

[0066] It is understandable that heating elements 70 located inside and / or outside the heat dissipation cavity 10A can be directly attached to the liquid cooling component 30; heating elements 70 located inside the heat dissipation cavity 10A that cannot directly contact the liquid cooling component 30 due to structural reasons or space constraints are addressed by potting adhesive inside the heat dissipation cavity 10A to fix the relative position of the heating elements 70 and increase thermal conductivity.

[0067] In one embodiment, reference is made to Figure 1 The 30A trough is a U-shaped groove.

[0068] In this embodiment, the liquid cooling component 30 is bent on both sides to form a U-shaped groove, and two partitions 50 are respectively disposed on both sides of the U-shaped groove to form a heat dissipation cavity 10A with the liquid cooling component 30. The structure is simple, stable and reliable, and has low manufacturing cost.

[0069] Understandably, the heat dissipation section 31 and the connecting section 32 are also U-shaped, and each flow channel 31A within the heat dissipation section 31 is also U-shaped. In this way, while forming the heat dissipation cavity 10A, the resistance within the flow channel 31A is reduced, and the heat dissipation efficiency is improved. The heating element 70 can be disposed within the U-shaped groove formed by the liquid cooling component 30, or it can be disposed on the outer wall of the U-shaped groove.

[0070] In other embodiments, reference is made to Figure 8 The liquid cooling component 30 has extensions 34 at both ends. The two extensions 34 extend away from the opening 10B respectively. The liquid inlet 311A ​​and the liquid outlet 312A pass through the extensions 34. The outer peripheral wall of the extensions 34 is used to install the heating element 70.

[0071] In this embodiment, the liquid cooling component 30 is provided with extensions 34 on both sides of the flow channel 31A. Both extensions 34 are positioned away from the opening 10B of the heat dissipation cavity 10A, making the liquid cooling component 30 π-shaped. The liquid inlet 311A ​​and liquid outlet 312A of the flow channel 31A pass through the extensions 34 and face the surface of the liquid pipe 90. The extensions 34 do not contact the outer surface of the liquid pipe 90 and can also be provided with plug-in MOS to increase heat dissipation elements, improve the utilization rate of the low temperature difference of the coolant for heat dissipation, and reduce energy loss.

[0072] Reference Figure 2 and Figure 9 In one embodiment, the thickness of the heat dissipation portion 31 is greater than the thickness of the connecting portion 32.

[0073] In this embodiment, a portion of the liquid cooling component 30 is observed through a cross-section perpendicular to the extension direction of the flow channel 31A. It can be seen that the cross-sections of several flow channels 31A in the heat dissipation part 31 are square or circular. To ensure smooth water flow, the heat dissipation part 31 needs a certain thickness. Generally, the connecting part 32 is a plate-like solid. While ensuring the stability of the housing 10, since there is no need to provide flow channels 31A, the thickness of the connecting part 32 is less than the thickness of the heat dissipation part 31. This not only makes it easier to distinguish between the heat dissipation part 31 and the connecting part 32, preventing the heating element 70 from being misplaced, but also saves material to some extent and facilitates drilling holes to fix the circuit board 71.

[0074] Optionally, the partition 50 is made of aluminum substrate, which has the characteristics of low cost, light weight and good thermal conductivity, thus reducing the manufacturing cost and weight of the heat dissipation structure 100.

[0075] Optionally, the liquid cooling component 30 is a vapor chamber with a harmonica tube-shaped heat dissipation section 31. Multiple flow channels 31A penetrate the extended area of ​​the vapor chamber, which can improve the uniformity of heat dissipation, avoid local overheating during the heat dissipation process, and improve the effective heat dissipation efficiency. The heat dissipation structure 100 has high heat dissipation reliability.

[0076] Furthermore, in one embodiment, the liquid cooling component 30 is an extruded structure. Understandably, the parameters can be easily designed on the molding equipment to adjust the quantity, proportion, size, and other parameters of the heat dissipation part 31 and the connecting part 32, ensuring the consistency of each part of the liquid cooling plate and obtaining a good heat dissipation effect.

[0077] The multiple flow channels 31A in the extruded harmonica tube-shaped heat dissipation section 31 increase the convection exchange area and improve the heat dissipation effect. Among them, the baffle between each adjacent flow channel 31A provides support for the upper and lower surfaces of the plate, thereby enhancing the pressure resistance of the liquid cooling component 30 and preventing the flow channels 31A from deforming under high pressure, resulting in high stability and high reliability.

[0078] Optionally, at least one partition 50 is welded to the liquid cooling component 30; and / or, at least one partition 50 is detachably connected to the liquid cooling component 30.

[0079] In some embodiments, the arrangement of the partition 50 and the liquid cooling component 30 includes the following cases:

[0080] First, the two partitions 50 and the liquid cooling component 30 can be directly welded together to form a heat dissipation cavity 10A structure with an opening 10B on one side, reducing the installation steps and accommodating the heat-generating element 70 through the opening 10B.

[0081] Secondly, both partitions 50 and liquid cooling components 30 can be detachably connected to facilitate adjustments to the spatial layout within the heat dissipation cavity 10A, thereby improving space utilization. In specific usage scenarios where frequent disassembly is not required, the two partitions 50 and liquid cooling components 30 can be pre-installed. Even if disassembly is required, there is no need to disassemble the heat dissipation structure 100 into individual parts, thus improving assembly, maintenance, or replacement efficiency.

[0082] Third, one partition 50 is welded to the liquid cooling component 30, and the other partition 50 is detachably connected to the liquid cooling component 30. When multiple baffles are also provided in the heat dissipation cavity 10A, the baffles and the liquid cooling component 30 are detachably connected to facilitate adjustment of the installation space, improve space utilization, and also improve the disassembly speed, making it easier to remove the potting compound and reuse the heat dissipation structure 100.

[0083] It is understood that, without conflicting with the technical concept of this application, the above-mentioned embodiments can be freely combined, and the combined solutions are also within the protection scope of this application.

[0084] For example, in one embodiment, the partition 50 is an aluminum substrate, and the liquid cooling component 30 is an extruded heat spreader. The two partitions 50 are directly welded to the liquid cooling component 30 to form a heat dissipation cavity 10A.

[0085] Other combination schemes will not be elaborated here.

[0086] Reference Figure 2 and Figure 9 In one embodiment, each partition 50 is provided with a first mounting part 51, which is located at the opening 10B. The two first mounting parts 51 extend to the sides away from the opening 10B respectively. The first mounting part 51 is detachably connected to the first circuit board 71 or the external component, and the first circuit board 71 or the external component covers the opening 10B.

[0087] The first mounting part 51 is provided with mounting holes 51A for connecting the first circuit board 71 or external components.

[0088] Optionally, the first circuit board 71 is located on the opening 10B side of the heat dissipation cavity 10A, and is assembled and disassembled through the first mounting part 51 on the two side partitions 50. The first mounting part 51 extends away from the opening 10B, which facilitates installation and does not obstruct the placement space of components on the first circuit board 71, reducing the risk of bumping or damaging the components on the first circuit board 71. This allows the first circuit board 71 to accommodate the heat-generating element 70 with high heat generation properties in the heat dissipation cavity 10A for rapid heat dissipation and avoids damage to the first circuit board 71 or other electronic components on it.

[0089] Alternatively, the first mounting part 51 is used to connect with an external component. Specifically, the external component can be the inner wall of the mounting cavity of the housing, and the heating element 70 is attached to the outer wall of the heat dissipation part 31.

[0090] Reference Figure 3 and Figure 10 In one embodiment, the side of the heat sink 31 facing away from the outlet 10B is used to mount at least one heating element 70, and a thermally conductive adhesive layer is provided between the heating element 70 and the heat sink 31. In this embodiment, the heating element 70 is a surface-mount MOS 73 or the like, and multiple heating elements 70 are arrayed on the heat sink 31. The thermally conductive adhesive layer between the heating element 70 and the wall of the heat sink 31 can fix the heating element 70 and also make the heat transfer more uniform, thereby improving the heat dissipation efficiency.

[0091] Furthermore, in one embodiment, each partition 50 is provided with a second mounting portion 52 on the side away from the opening 10B. The second mounting portion 52 is used to mount a second circuit board 71, on which a heating element 70 is provided.

[0092] In this embodiment, the heating element 70 is disposed on the surface of the second circuit board 71 facing the housing 10. When the second circuit board 71 is disposed on the side of the heat dissipation cavity 10A away from the outlet 10B, each partition 50 is provided with two second mounting parts 52, which increases the assembly space utilization and heat dissipation contact area of ​​the liquid cooling component 30 and the heating element 70, reduces the heat dissipation loss of the coolant, and improves the heat dissipation efficiency.

[0093] Reference Figure 3 , Figure 4 , Figure 10 and Figure 11 Furthermore, in some embodiments, the connecting portion 32 is provided with a through hole 33A communicating with the receiving groove 30A, and / or, the liquid cooling component 30 is provided with a guide portion 33 on at least one side adjacent to the partition 50, the guide portion 33 having a plurality of through holes 33A to allow the pins of the heating element 70 housed in the heat dissipation cavity 10A to pass through.

[0094] In other words, the liquid cooling component 30 can have a through hole 33A provided separately in the connecting part 32, or it can have a guide part 33 provided separately and have a through hole 33A provided in the guide part 33. Of course, the liquid cooling component 30 can also have a connecting part 32 and a guide part 33 provided at the same time, and have a through hole 33A provided in both of them.

[0095] Optionally, the through hole 33A is used to avoid the pins of the heat-generating element 70. In one embodiment, a second circuit board 71 is provided on the side of the housing 10 away from the outlet 10B, and a power device such as a transformer is provided in the heat dissipation cavity 10A. The pins on the device can be connected to the second circuit board 71 through the through hole 33A of the connecting part 32 and / or the conductive part 33.

[0096] Optionally, the perforation 33A is used to fix the heating element 70. In another embodiment, a second circuit board 71 is provided on the side of the housing 10 away from the opening 10B. The second circuit board 71 can be fixed to the housing 10 by fasteners such as bolts provided in the perforation 33A, so that the two fit tightly together and improve heat dissipation efficiency.

[0097] Furthermore, in this embodiment, the housing 10 is provided with a guide portion 33, and the second circuit board 71 is fixed together by the through holes of the guide portion 33 and the connecting portion 32. A thermally conductive adhesive layer is provided between the circuit board 71 and the housing 10 to prevent the magnetic adhesive layer from arching, so that the two are more closely attached.

[0098] Of course, the perforation 33A can also be used to fix the heating element 70 inside the heat dissipation cavity 10A, which will not be elaborated here.

[0099] Reference Figure 5 and Figure 12 In one embodiment, the liquid inlet pipe 90 includes at least a first liquid inlet pipe 91 for liquid inlet and a second liquid inlet pipe 92 for liquid outlet.

[0100] In this embodiment, the heat dissipation structure 100 includes a housing 10. A first liquid passage 91 is provided with a liquid inlet 91A at one end away from the liquid cooling component 30. The first liquid passage 91 is provided with a first passage and a first liquid passage 911 inside. The first liquid passage 911 is provided with a liquid inlet 311A ​​corresponding to the liquid inlet of the flow path. The two ends of the first passage are respectively connected to the liquid inlet 91A and the first liquid passage 911 to form a liquid inlet channel. The liquid inlet channel is connected to multiple liquid inlets 311A ​​through the first liquid passage 911. A liquid outlet section is provided with a liquid outlet 92A at one end away from the liquid cooling component 30. The liquid outlet section is provided with a second passage and a second liquid passage 921 inside. The second liquid passage 921 is provided with a liquid outlet 312A corresponding to the liquid outlet of the flow path. The two ends of the second passage are respectively connected to the liquid outlet 92A and the second liquid passage 921 to form a liquid outlet channel. The liquid outlet channel is connected to multiple liquid outlets 312A through the second liquid passage 921. The arrangement of the first liquid pipe 91 and the second liquid pipe 92 ensures smooth inflow and outflow of coolant, improving the smoothness of coolant flow.

[0101] It is understandable that the first liquid passage hole 911 can be set as one or a small number of strip holes that can simultaneously connect multiple liquid inlets 311A ​​to ensure the structural strength of the first liquid passage pipe 91 and improve the pressure resistance of the first liquid passage pipe 91; or the first liquid passage hole 911 can be set as multiple through holes that correspond one-to-one with the number of liquid inlets 311A, to clearly plan and divert the flow process of coolant. It can be understood that multiple through holes are connected in series to form the liquid inlet channel of the first liquid passage pipe 91, so that the coolant flows in an orderly manner and dissipates heat accurately.

[0102] Understandably, the second liquid passage 921 can be set in the same way.

[0103] Optionally, the heat dissipation structure 100 may be provided with a first liquid passage pipe 91 and a second liquid passage pipe 92, and multiple heat dissipation parts 31 are arranged in parallel. The first liquid passage pipe 91 is provided with multiple first liquid passage holes 911 corresponding one-to-one with the liquid inlets 311A ​​of the multiple heat dissipation parts 31, and the second liquid passage pipe 92 is provided with multiple second liquid passage holes 921 corresponding one-to-one with the liquid outlets 312A of the multiple heat dissipation parts 31. The coolant enters the flow channels 31A of the multiple heat dissipation parts 31 from the liquid inlet 91A through the liquid inlet channel and the multiple first liquid passage holes 911, and is discharged to the liquid outlet 92A through the multiple second liquid passage holes 921 and the liquid outlet channel.

[0104] It is understandable that the inlet 311A ​​and outlet 312A of the flow channel 31A are two ports that connect the internal space of the flow channel 31A. That is to say, for one of the ports, the coolant flows into the port that is the inlet 311A, and the coolant flows out of the port that is the outlet 312A. The naming is not the only limitation on the port position and the direction of liquid flow, but is based on the actual application.

[0105] Of course, multiple heat dissipation units 31 can also be connected in series through a third liquid passage pipe 93, which has multiple liquid passage holes.

[0106] Reference Figure 6 , Figure 7 , Figure 13 and Figure 14 Understandably, in one embodiment, the heat dissipation structure 100 includes a plurality of housings 10 and a plurality of liquid passage pipes 90. According to the above embodiment, the flow channels 31A of the plurality of housings 10 can be arranged in parallel, that is, the coolant flows from the first liquid passage pipe 91 through the plurality of housings 10 into the second liquid passage pipe 92.

[0107] In other embodiments, the heat dissipation structure 100 includes a plurality of housings 10 and a plurality of liquid passage pipes 90, and the flow channels 31A of two adjacent housings 10 are connected in series through the liquid passage pipes 90.

[0108] Optionally, taking three housings 10 as an example, the heat dissipation structure 100 includes a first liquid passage pipe 91, a second liquid passage pipe 92, and two third liquid passage pipes 93. The flow channels 31A of at least two heat dissipation sections 31 of each housing 10 are arranged in parallel. The three housings 10 are arranged along the extending direction of the trough 30A. The first liquid passage pipe 91 connects to one side of the heat dissipation section 31 of one end of the housing 10, the second liquid passage pipe 92 connects to one side of the heat dissipation section 31 of the other end of the housing 10, and the two third liquid passage pipes 93 connect to the remaining heat dissipation sections 31 of the three housings 10. This ensures smooth coolant flow and guarantees efficient heat dissipation.

[0109] Of course, the heat dissipation structure 100 can also be provided with more third liquid passages 93, so that the flow channels 31A of at least two heat dissipation parts 31 of each housing 10 are connected in series, or the flow channels 31A of some heat dissipation parts 31 can be connected in series and the flow channels 31A of the heat dissipation parts 31 can be connected in parallel. Such flexible combination improves the applicability of the heat dissipation structure 100 and improves the heat dissipation efficiency.

[0110] Optionally, when the external liquid inlet 91A and liquid outlet 92A are provided on both sides, the first liquid passage pipe 91 and the second liquid passage pipe 92 can be located on both sides of the liquid cooler 30 with the flow channel 31A adjacent to its liquid inlet 311A ​​and liquid outlet 312A, respectively;

[0111] When the external liquid inlet 91A and liquid outlet 92A are not suitable for double-sided installation, the first liquid inlet pipe 91 or the second liquid inlet pipe 92 can be bent and extended so that the first liquid inlet pipe 91 and the second liquid inlet pipe 92 are at least partially single-sided and on the same side, so as to meet the single-sided liquid inlet and liquid outlet requirements.

[0112] Furthermore, the two ends of the liquid inlet pipe 90 located on the same side can be fixedly connected to enhance structural stability.

[0113] The present invention also proposes a power supply device, which includes at least one heat source and a heat dissipation structure 100 as described in any of the above embodiments; the at least one heat source is thermally connected to the inner surface and / or outer surface of the heat dissipation cavity 10A of the heat dissipation structure 100. Since this power supply device adopts all the technical solutions of all the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated further here.

[0114] The power supply equipment can be an on-board charger or a DC-DC power module, etc.

[0115] The present invention also proposes an electric vehicle, which includes a vehicle body, a power battery, and a power supply device as described above. The specific structure of the power supply device is as described in the above embodiments. Since this electric vehicle adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here. The power supply device is located inside the vehicle body and is electrically connected to the power battery to provide charging power to the power battery.

[0116] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A heat dissipation structure, characterized in that, The heat dissipation structure includes: A housing having a heat dissipation cavity, the housing including at least one connecting portion and at least two heat dissipation portions, adjacent heat dissipation portions being connected by the connecting portion, each heat dissipation portion having a plurality of spaced-apart flow channels surrounding the heat dissipation cavity, the inner wall and / or the outer wall of the heat dissipation cavity being used to mount heating elements, each flow channel having an inlet and an outlet at both ends; and At least two liquid passages are connected to the housing, wherein at least one liquid passage is connected to the liquid inlet and at least one liquid passage is connected to the liquid outlet; The housing includes: A liquid cooling component includes a first side plate, a bottom plate, and a second side plate connected in sequence. The first side plate, the bottom plate, and the second side plate surround a trough. The liquid inlet and the liquid outlet are arranged around the opening of the trough. The liquid cooling component includes at least one connecting part and at least two heat dissipation parts. The connecting part and the heat dissipation parts are arranged alternately along the extension direction of the trough. The flow channel passes through the first side plate, the bottom plate, and the second side plate. The liquid cooling component is an extruded structure; the connecting part is provided with a through hole that communicates with the receiving groove.

2. The heat dissipation structure as described in claim 1, characterized in that, The housing includes: Two partitions connect the two sides of the liquid cooling component and enclose the container to form the heat dissipation cavity with an opening on one side.

3. The heat dissipation structure as described in claim 2, characterized in that, The receiving groove is a U-shaped groove; Alternatively, the liquid cooling component may have extensions at both ends, with the two extensions extending away from the opening respectively. The liquid inlet and the liquid outlet pass through the extensions, and the outer peripheral wall of the extension is used to mount the heating element.

4. The heat dissipation structure as described in claim 2, characterized in that, The thickness of the heat dissipation part is greater than the thickness of the connecting part; And / or, the partition is an aluminum substrate; And / or, the liquid cooling component is a heat spreader; And / or, at least one of the partitions is welded to the liquid cooling component; And / or, at least one of the partitions is detachably connected to the liquid cooling component.

5. The heat dissipation structure as described in claim 2, characterized in that, Each of the partitions is provided with a first mounting portion, which is located at the opening. Two first mounting portions extend to the sides away from the opening, respectively. The first mounting portion is detachably connected to a first circuit board or an external component, which covers the opening.

6. The heat dissipation structure as described in claim 5, characterized in that, The side of the heat dissipation section away from the opening is used to install at least one of the heating elements, and a thermally conductive adhesive layer is provided between the heating element and the heat dissipation section.

7. The heat dissipation structure as described in claim 6, characterized in that, Each of the partitions is further provided with a second mounting portion on the side away from the opening. The second mounting portion is used to mount a second circuit board, on which the heating element is provided.

8. The heat dissipation structure as described in claim 7, characterized in that, The liquid cooling component has a conductive portion on at least one side adjacent to the partition, and the conductive portion has multiple through holes to allow the pins of the heating element housed in the heat dissipation cavity to pass through.

9. The heat dissipation structure as described in any one of claims 1 to 8, characterized in that, The heat dissipation structure includes multiple housings and multiple liquid passage pipes, and the flow channels of two adjacent housings are connected in series through the liquid passage pipes; And / or, at least two of the heat dissipation sections have their flow channels connected in parallel via the liquid passage pipe.

10. A power supply device, characterized in that, The power supply device includes: at least one heat source and a heat dissipation structure as described in any one of claims 1 to 9; At least one of the heat sources is thermally connected to the inner and / or outer surfaces of the heat dissipation cavity of the heat dissipation structure.

11. An electric vehicle, characterized in that, The electric vehicle includes: Vehicle body; A power battery, wherein the power battery is disposed within the vehicle body; and The power supply device as described in claim 10 is disposed within the vehicle body and electrically connected to the power battery to provide charging power to the power battery.

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