Device and method for testing the resistivity of semiconductive elastomeric materials

Abstract

The present application relates to detection equipment technical field, especially to a kind of semi-conductive rubber material resistivity's testing device, including fixed clamping assembly and moving clamping assembly being formed detection area along X direction relative spacing and being located on base, drive assembly drives moving clamping assembly moves along X direction, conductor assembly is located at one side of detection area, including lift platform being movably located on base along X direction, support structure being movably located on lift platform along Y direction and lower, upper conductor being located on support structure.It also relates to the evaluation method of semi-conductive rubber material resistivity using the device, by drive assembly driving moving clamping assembly moves, after the tensile of semi-conductive test piece being respectively clamped in fixed clamping assembly and moving clamping assembly at both ends, conductor assembly moves and is sent lower, upper conductor to detection area and respectively contacts the lower, upper surface of semi-conductive test piece, the voltage and current of semi-conductive test piece after tensile are measured by measuring instrument, and the volume resistivity is calculated.

Claims

1. A device for testing the resistivity of semiconductive rubber and plastic materials, characterized in that, include: Base (1); A fixed clamping assembly (2) is fixed on the base (1) and is used to clamp one end of the semiconducting test piece to be tested. The movable clamping assembly (3) is movably disposed on the base (1) along the X direction. The movable clamping assembly (3) and the fixed clamping assembly (2) are spaced apart along the X direction to form a detection area (A). The movable clamping assembly (3) is used to clamp the other end of the semiconductive test piece. A drive assembly (4) is connected to the movable clamping assembly (3). The drive assembly (4) is used to drive the movable clamping assembly (3) to move along the X direction and keep the movable clamping assembly (3) at a specified position. A conductor assembly (5) is disposed on one side of the detection area (A) along the Y direction. The conductor assembly (5) includes a lifting platform (51) that is movable along the X direction on the base (1) and can be raised and lowered along the Z direction, a support structure (52) that is movable along the Y direction on the lifting platform (51), and a lower conductor (53) and an upper conductor (54) disposed on the support structure (52). A gap is formed between the upper conductor (54) and the lower conductor (53) along the Z direction for the semiconducting test piece to pass through. The semiconductive test piece to be tested is placed in the detection area (A) between the movable clamping assembly (3) and the fixed clamping assembly (2). The two ends of the semiconductive test piece are clamped and fixed to the fixed clamping assembly (2) and the movable clamping assembly (3) respectively. The movable clamping assembly (3) is driven to move along the X direction by the driving assembly (4) to perform a tensile test on the semiconductive test piece. After the tensile test is completed, the conductor assembly (5) is activated. The lower conductor (53) and the upper conductor (54) are moved to the detection area (A) by the lifting platform (51) moving along the X direction, the lifting platform (51) moving along the Z direction, and the support structure (52) moving along the Y direction. The lower conductor (53) and the upper conductor (54) are then in contact with the lower surface and the upper surface of the semiconductive test piece respectively.

2. The apparatus for testing the resistivity of semiconductive rubber and plastic materials according to claim 1, characterized in that, The fixed clamping assembly (2) includes a connecting block (21), a first clamping block (22), a second clamping block (23), and a first pressure block (24) stacked from bottom to top and connected by a first screw (25). The connecting block (21) is fixedly connected to the base (1). The two ends of the first screw (25) pass through the connecting block (21) and the first pressure block (24) respectively and are connected to a first nut (26). The opposing surfaces of the first clamping block (22) and the second clamping block (23) are clamping surfaces (a) that contact the semiconductive test piece.

3. The apparatus for testing the resistivity of semiconductive rubber and plastic materials according to claim 1, characterized in that, The movable clamping assembly (3) includes a movable block (31), a third clamping block (32), a fourth clamping block (33), and a second pressure block (34) stacked from bottom to top and connected by a second screw (35). The movable block (31) is connected to the drive assembly (4) and fixedly connected to the lower end of the second screw (35). The upper end of the second screw (35) passes through the second pressure block (34) and is connected to a second nut (36). The faces of the third clamping block (32) and the fourth clamping block (33) are the clamping surfaces (a) that are in contact with the semiconductive test piece.

4. The apparatus for testing the resistivity of semiconductive rubber and plastic materials according to claim 2 or 3, characterized in that, The clamping surface (a) is provided with dot-shaped protrusions (b1), short strip-shaped protrusions (b2), or long strip-shaped protrusions (b3).

5. The apparatus for testing the resistivity of semiconductive rubber and plastic materials according to claim 1, characterized in that, The drive assembly (4) includes a fixing block (41) fixed on the base (1), a pull rod (42) arranged along the X direction, and a handle (43) provided on one end of the pull rod (42). The outer circumferential surface of the pull rod (42) is provided with an external thread, and the fixing block (41) is provided with a through hole (411) with an internal thread. The pull rod (42) passes through the through hole (411) and is connected to the internal thread of the through hole (411) through the external thread. The other end of the pull rod (42) is movably connected to the movable clamping assembly (3).

6. The apparatus for testing the resistivity of semiconductive rubber and plastic materials according to claim 5, characterized in that, A fastening block (44) is fitted on the outer circumferential surface of the pull rod (42). The fastening block (44) has an inner hole with internal threads, and the internal threads of the inner hole are engaged with the external threads of the pull rod (42).

7. The apparatus for testing the resistivity of semiconductive rubber and plastic materials according to claim 5, characterized in that, The pull rod (42) is connected to the movable clamping assembly (3) at one end, and an annular groove (422) is provided on the outer circumferential surface. A baffle (37) is connected to the movable clamping assembly (3), and the baffle (37) engages with the annular groove (422).

8. The apparatus for testing the resistivity of semiconductive rubber and plastic materials according to claim 1, characterized in that, The support structure (52) includes a lower support plate (521) and an upper support plate (522). The lower support plate (521) is movable along the Y direction on the lifting platform (51). A blind hole is provided on the upper surface of the lower support plate (521). The lower end of the lower conductor (53) is placed in the blind hole. The upper support plate (522) is arranged parallel to the lower support plate (521) above it and connected to the lower support plate (521). A through hole is provided on the upper support plate (522). The through hole is coaxial with the blind hole. The upper conductor (54) passes through the through hole.

9. A method for evaluating the resistivity of a semiconductive rubber-plastic material, characterized in that, The resistivity testing apparatus for semiconductive rubber and plastic materials as described in any one of claims 1 to 8 comprises the following steps: Step 1: Clamp and fix both ends of the semiconductive test piece to the fixed clamping assembly (2) and the movable clamping assembly (3) respectively. Drive the movable clamping assembly (3) along the X direction through the driving assembly (4) to perform a tensile test on the semiconductive test piece. The tensile test is carried out at a preset ambient temperature and has a preset tensile ratio or preset tensile time. Step 2: The conductor assembly (5) moves the lower conductor (53) and the upper conductor (54) to the detection area (A), so that the lower conductor (53) and the upper conductor (54) contact the lower surface and the upper surface of the semiconducting test piece respectively. The measuring instrument is connected to the lower conductor (53) and the upper conductor (54), and the voltage and current of the semiconducting test piece are measured by the measuring instrument. Step 3: Calculate the volume resistivity of the semiconductive specimen after stretching.

10. The method for evaluating the resistivity of semiconductive rubber and plastic materials according to claim 9, characterized in that, Also includes: Step 4: Set multiple preset stretching ratios that increase sequentially, and repeat Step 1 to Step 3 sequentially according to the multiple preset stretching ratios under the same preset ambient temperature to obtain the relationship between the volume resistivity of the semiconductive sample after stretching and the preset stretching ratio. Step 5: Set multiple preset stretching times that increase sequentially, and repeat Step 1 to Step 3 sequentially according to the multiple preset stretching times under the same preset ambient temperature to obtain the relationship between the volume resistivity of the semiconductive sample after stretching and the preset stretching time. Step 6: Place the detection area (A) in an oven, change the preset ambient temperature through the oven, set multiple preset ambient temperatures that increase sequentially, and repeat steps 1 to 3 sequentially at multiple preset ambient temperatures under the same preset stretching ratio to obtain the relationship between the volume resistivity of the semiconductive sample after stretching and the preset ambient temperature.

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