connection structure

Abstract

This disclosure provides a connection structure for realizing a detachable connection between a board and a motherboard, including a first connection component and a second connection component. The first connection component is disposed on the motherboard, and the second connection component is disposed on the board to cooperate with the first connection component to realize a detachable connection between the board and the motherboard. Under the action of a first force, the board can move relative to the motherboard to different connection states. Under the action of a second force, the board can move along a first direction to separate from the motherboard. The first direction does not include the direction parallel to the plane of the motherboard.

Description

Technical Field

[0001] This disclosure relates to the field of plate connection technology, and more specifically, to a connection structure. Background Technology

[0002] On motherboards, it is often necessary to reserve interfaces for adjustment or expansion. However, these reserved interfaces frequently interfere with nearby boards or components, preventing normal use. To resolve this interference, the common methods are either to remake the motherboard or to modify nearby boards or components. These methods are inflexible and costly. Summary of the Invention

[0003] This disclosure provides a connection structure, the technical solution of which is as follows:

[0004] A connection structure for enabling a detachable connection between a board and a motherboard, comprising:

[0005] The first connection component is disposed on the motherboard;

[0006] A second connection component is disposed on the board to cooperate with the first connection component to realize a detachable connection between the board and the motherboard;

[0007] Under the action of the first force, the board can move relative to the motherboard to different connection states;

[0008] Under the action of the second force, the board can move along the first direction to separate from the motherboard. The first direction does not include the direction parallel to the plane where the motherboard is located.

[0009] Alternatively, the first connection assembly includes a first electrical component, and the second connection assembly includes a second electrical component.

[0010] The second electrical component and the first electrical component can be electrically connected when the board moves relative to the motherboard to a designated position; and / or,

[0011] The first connecting component includes a first positioning element, and the second connecting component includes a second positioning element. The first positioning element and the second positioning element cooperate to position the relative position between the board and the motherboard.

[0012] Alternatively, the first connection component includes a first connector, and the second connection component includes a second connector, wherein the first connector and the second connector cooperate to achieve a fixed connection or a movable connection between the board and the motherboard.

[0013] Alternatively, one of the first connector and the second connector is a magnetic connector, and the other is a fastener that can be attracted by the magnetic connector. The magnetic connector and the fastener cooperate to achieve a fixed connection or a movable connection between the board and the motherboard.

[0014] Alternatively, the second connector is connected to the first connector via a locking structure, and the second connector and the first connector can rotate relative to each other; the locking structure includes a locking part and a slot with an opening, and the second connector and the first connector can separate from each other when the locking part rotates to the opening.

[0015] Alternatively, there may be multiple first electrical components surrounding the first connector; there may also be multiple second electrical components surrounding the second connector, and the multiple second electrical components and the multiple first electrical components may be electrically connected to each other when the board moves relative to the motherboard to a designated position.

[0016] Alternatively, the motherboard has a first mounting area around the first connector, the first mounting area forming a square ring or a circular ring, and a plurality of the first electrical components are spaced apart within the first mounting area; the board has a second mounting area around the second connector, a plurality of the second electrical components are spaced apart within the second mounting area, the second mounting area forming the same shape as the first mounting area, and when the board moves relative to the motherboard to a designated position, the second mounting area and the first mounting area face each other to jointly form a connection limiting area.

[0017] Optionally, within the connection limiting area, at least one first positioning element and at least one second positioning element are provided between each pair of adjacent first electrical components, wherein at least one first positioning element and at least one second positioning element correspond one-to-one and can limit the board relative to the motherboard to the designated position by plugging in.

[0018] Alternatively, the board has a chip that, when the second electrical component is electrically connected to the first electrical component, is located at a position of 0°, 90°, 180° or 270° relative to the motherboard.

[0019] Alternatively, the first electrical component may be a solder joint capable of transmitting and receiving signals, and the second electrical component may be a probe capable of detecting transmitted signals; or the first electrical component may be a probe capable of detecting transmitted signals, and the second electrical component may be a solder joint capable of transmitting and receiving signals.

[0020] The connection structure disclosed herein achieves a detachable connection between the board and the motherboard through the cooperation of the second connection component and the first connection component. The motherboard does not need to reserve an additional interface, and the connection process between the board and the motherboard does not require tools. This not only avoids interference problems, but also provides high flexibility and saves costs.

[0021] The advantages and features of this disclosure are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0022] The following drawings, which are incorporated herein by reference as part of this disclosure, are provided for understanding the disclosure. The drawings illustrate embodiments of the disclosure and their descriptions, serving to explain the principles of the disclosure. In the drawings,

[0023] Figure 1 This is a schematic diagram of a connection structure according to an exemplary embodiment of the present disclosure;

[0024] Figure 2 This is a schematic diagram showing the arrangement of a connection structure on a motherboard according to an exemplary embodiment of the present disclosure;

[0025] Figure 3 This is a schematic diagram of the connection structure arranged on a board according to an exemplary embodiment of the present disclosure;

[0026] Figure 4 To and Figure 3 Side view of the corresponding structure;

[0027] Figure 5 Usage of a connection structure according to an exemplary embodiment of this disclosure Figure 1 ;

[0028] Figure 6 Usage of a connection structure according to an exemplary embodiment of this disclosure Figure 2 ;

[0029] Figure 7 Usage of a connection structure according to an exemplary embodiment of this disclosure Figure 3 ;

[0030] Figure 8 Usage of a connection structure according to an exemplary embodiment of this disclosure Figure 4 .

[0031] The following are the labeling instructions in the diagram: 10, board; 11, chip; 101, second mounting area; 20, motherboard; 201, first mounting area; 30, first connecting component; 31, first electrical component; 311, first signal transmission component; 312, second signal transmission component; 32, first connector; 33, first positioning component; 40, second connecting component; 41, second electrical component; 411, third signal transmission component; 412, fourth signal transmission component; 42, second connector; 43, second positioning component. Detailed Implementation

[0032] In the following description, numerous details are provided to enable a thorough understanding of this disclosure. However, those skilled in the art will appreciate that the following description merely illustrates alternative embodiments of this disclosure by way of example, and that this disclosure can be implemented without one or more of these details. Furthermore, to avoid confusion with this disclosure, some technical features well-known in the art have not been described in detail.

[0033] like Figures 1 to 4 As shown, the connection structure is used to realize the detachable connection between the board 10 and the motherboard 20. It includes a first connection component 30 and a second connection component 40. The first connection component 30 is disposed on the motherboard 20, and the second connection component 40 is disposed on the board 10. The second connection component 40 cooperates with the first connection component 30 to realize the detachable connection between the board 10 and the motherboard 20. Under the action of a first force, the board 10 can move relative to the motherboard 20 to different connection states; under the action of a second force, the board 10 can move along a first direction to separate from the motherboard 20. The first direction does not include the direction parallel to the plane of the motherboard 20.

[0034] In the embodiments of this disclosure, the board 10 is a plate-like structure with a top surface and a bottom surface, and the form of the board 10 is not limited. For example, the board 10 can be a memory card, a graphics card, an adapter card, a test card, etc.

[0035] In the embodiments of this disclosure, the direction of the first force is not limited, as long as it can rotate the plate 10. For example, the direction of the first force can be... Figure 5 The counter-clockwise direction indicated by the middle arrow B can also be... Figure 5 The middle arrow B points in the opposite direction, that is, clockwise.

[0036] In the embodiments of this disclosure, the direction of the second force is not particularly limited, as long as it is not parallel to the plane where the motherboard 20 is located. For example, it can be as follows: Figure 1 Arrow A in the diagram points to a direction that is vertically upward relative to the motherboard 20; it can also be a direction that is obliquely upward relative to the motherboard 20 at an angle of 30°, 45°, 60°, etc.

[0037] In the embodiments of this disclosure, different connection states may be different connection locations, different connection channels, or different connection channels caused by different connection locations, in order to adapt the motherboard's access to the board in different scenarios or modes.

[0038] The connection structure disclosed herein is primarily applied to electronic devices to ensure signal transmission between the motherboard 20 and the board 10 while avoiding interference issues and enabling tool-free disassembly between them. The structure of the electronic device is not limited here; for example, it can be an all-in-one computer, a television, a desktop computer host, a laptop, a server, a workstation, etc.

[0039] As an example, the first connection component 30 includes a first electrical component 31, and the second connection component 40 includes a second electrical component 41. The second electrical component 41 and the first electrical component 31 can be electrically connected when the board 10 moves relative to the motherboard 20 to a designated position. Through the electrical connection between the second electrical component 41 and the first electrical component 31, the board 10 and the motherboard 20 can transmit signals to each other. Since signal transmission involves not only sending signals but also receiving signals, both the first electrical component 31 and the second electrical component 41 include two signal transmission components. One signal transmission component is used to send signals, and the other signal transmission component is used to receive signals. To distinguish them, the signal transmission component in the first electrical component 31 used to send signals can be called the first signal transmission component 311, and the signal transmission component in the first electrical component 31 used to receive signals can be called the second signal transmission component 312; the signal transmission component in the second electrical component 41 used to send signals can be called the third signal transmission component 411, and the signal transmission component in the fourth electrical component used to receive signals can be called the fourth signal transmission component 412.

[0040] Here, the structure of the first electrical component 31 and the structure of the second electrical component 41 are not limited, as long as they can achieve electrical connection when the board 10 moves to the designated position relative to the motherboard 20.

[0041] like Figure 3 As shown, as an example, the first electrical component 31 is a solder joint capable of transmitting and receiving signals, correspondingly, as... Figure 4 As shown, the second electrical component 41 is a probe capable of detecting transmitted signals, extending from the bottom surface of the board 10 in a direction away from the top surface. In some optional implementations of the embodiments of this disclosure, the first electrical component 31 can also be a probe capable of detecting transmitted signals, extending from the top surface of the motherboard 20 in a direction away from the bottom surface; correspondingly, the second electrical component 41 is a solder joint capable of transmitting and receiving signals.

[0042] Here, the shape of the solder joint is not limited; it can be square, round, polygonal, etc.

[0043] Here, the shape of the probe's cross-section is not limited; it can be square, circular, polygonal, etc.

[0044] Based on the setting of solder joints and probes, an electrical connection can be achieved when the probes and solder joints come into contact, thus realizing the purpose of signal transmission. Furthermore, based on the setting of probes and solder joints, a relative position reference can also be provided during the connection process between board 10 and motherboard 20, so as to achieve the purpose of locating the relative position between board 10 and motherboard 20.

[0045] As an example, the first connecting component 30 includes a first positioning member 33, and the second connecting component 40 includes a second positioning member 43. The first positioning member 33 and the second positioning member 43 cooperate to position the relative position between the board 10 and the motherboard 20.

[0046] Here, the first positioning member 33 may include a first opening on the motherboard 20 and a second opening on the board 10. The second positioning member 43 may be a columnar body that can pass through the second opening and the first opening, with one end connected to the motherboard 20 and the other end connected to the board 10. By the insertion and cooperation of the columnar body with the first opening and the second opening, the relative position of the board 10 and the motherboard 20 can be positioned.

[0047] Here, solder joints capable of transmitting and receiving signals can also be provided at the first and second opening positions. Correspondingly, the columnar body can adopt the same structure as the probe. Thus, when the first positioning member 33 and the second positioning member 43 cooperate, they can not only position the relative positions of the board 10 and the motherboard 20, but also enable the board 10 and the motherboard 20 to transmit signals to each other. In this case, the first positioning member 33 has the function of the first electrical component 31, and the second positioning member 43 has the function of the second electrical component 41. This means that in this case, the first electrical component 31 and the second electrical component 41 can be omitted, thereby saving costs.

[0048] See again Figures 1 to 4 The first connecting component 30 includes a first connector 32, and the second connecting component 40 includes a second connector 42. The first connector 32 and the second connector 42 cooperate to realize a fixed connection or a movable connection between the board 10 and the motherboard 20. Thus, based on the cooperation of the first connector 32 and the second connector 42, the board 10 can move to a specified position relative to the motherboard 20.

[0049] As an example, one of the first connector 32 and the second connector 42 is a magnetic connector, and the other is a fastener that can be attracted by the magnetic connector. The magnetic connector and the fastener work together to achieve a fixed connection or a movable connection between the board 10 and the motherboard 20.

[0050] Here, the second connector 42 is a magnetic suction component, and the first connector 32 is a fastener. The fastener can be a common screw used to fix the motherboard 20 inside the electronic device. The screw can be an iron screw so that it can be attracted by the magnetic suction component. In this way, based on the attraction connection between the magnetic suction component and the fastener, the board 10 can move relative to the motherboard 20 to different connection states under the action of the first force.

[0051] Here, the first connector 32 can be a magnetic chuck, and the second connector 42 can be a fastener. The fastener can be a common screw used to fix the board 10. The screw can be an iron screw so that it can be attracted by the magnetic chuck. In this way, based on the attraction between the magnetic chuck and the fastener, the board 10 can also move relative to the motherboard 20 to different connection states under the action of the first force. Here, the shape of the magnetic chuck is not limited, as long as it can attract the fastener. For example, it can be a shape that can attract the screw head. When the screw head is round, the shape of the magnetic chuck can be round or square, etc.; when the screw head is polygonal, the shape of the magnetic chuck can be round or polygonal, etc. Through the attraction between the magnetic chuck and the fastener, the screws that originally play a fixing role on the motherboard 20 or board 10 can be used without the need for additional connectors, thereby further reducing costs.

[0052] In some optional implementations of the embodiments of this disclosure, the second connector 42 and the first connector 32 may be connected by a locking structure, and the second connector 42 and the first connector 32 may be able to rotate relative to each other; the locking structure includes a locking part and a slot with an opening, and the second connector 42 and the first connector 32 may be separated from each other when the locking part rotates to the opening.

[0053] Here, the second connector 42 can be a ring-shaped piece with an open slot, and the first connector 32 can be a fastener, such as a screw commonly used to fix the motherboard 20 inside an electronic device. A locking part is located on the outer edge of the screw's head. When the locking part aligns with the opening, the second connector 42 and the first connector 32 separate. Alternatively, the first connector 32 can be a ring-shaped piece with an open slot, and the second connector 42 can be a fastener, such as a screw commonly used to fix the board 10. The locking part is located on the outer edge of the screw's head, and when the locking part aligns with the opening, the second connector 42 and the first connector 32 separate. Through the locking connection between the ring-shaped piece and the fastener, the existing screws on the motherboard 20 or board 10 can be used for fixing, eliminating the need for additional connectors and further reducing costs.

[0054] In some optional implementations of the embodiments of this disclosure, there are multiple first electrical components 31, which surround the first connector 32; there are multiple second electrical components 41, which surround the second connector 42, and the multiple second electrical components 41 and the multiple first electrical components 31 can be electrically connected one-to-one when the board 10 moves to a designated position relative to the motherboard 20, so as to meet the transmission requirements of multiple different signals.

[0055] like Figure 2 and Figure 3 As shown, the motherboard 20 has a first mounting area 201 around the first connector 32, forming a square ring (the square ring corresponds to the area between the two dashed boxes in the figure). Multiple first electrical components 31 are spaced apart within the first mounting area 201. Correspondingly, the board 10 has a second mounting area 101 around the second connector 42, with multiple second electrical components 41 spaced apart within the second mounting area 101. The second mounting area 101 has the same shape as the first mounting area 201, and when the board 10 moves relative to the motherboard 20 to a designated position, the second mounting area 101 and the first mounting area 201 face each other to form a connection limiting area. Thus, through the cooperation of the second mounting area 101 and the first mounting area 201, the electrical connection between the board 10 and the motherboard 20 is made easier to achieve, avoiding the problem of poor contact between individual first electrical components 31 and individual second electrical components 41 at designated positions.

[0056] Here, the shape of the first installation area 201 and the second installation area 101 is not limited to a square ring; it can also be a circular ring or other forms of ring.

[0057] In some optional implementations of the embodiments of this disclosure, both the first positioning member 33 and the second positioning member 43 are disposed within the connection limiting area. Furthermore, to enhance the positioning effect, within the connection limiting area, at least one first positioning member 33 and at least one second positioning member 43 are disposed between every two adjacent first electrical components 31. Each of the at least one first positioning member 33 and the at least one second positioning member 43 corresponds one-to-one and can, through a plug-in connection, limit the board 10 relative to the motherboard 20 to a designated position.

[0058] Here, in the case where a square ring is formed in the first installation area 201, i.e., as Figure 2 and Figure 3 The structure shown has the first positioning member 33 and the second positioning member 43 respectively connected to the corner of the limiting area.

[0059] Here, when the first installation area 201 forms a circular ring, the first positioning member 33 and the second positioning member 43 are defined to jointly form a positioning assembly, and multiple positioning assemblies are evenly spaced along the circumference within the connecting limiting area.

[0060] In some optional implementations of the embodiments of this disclosure, the board 10 has a chip 11, and when the second electrical component 41 is electrically connected to the first electrical component 31, the chip 11 is located at a 0° position relative to the motherboard 20 (e.g., Figure 5 As shown in the figure, this can meet the 0° position connection requirement between board 10 and motherboard 20.

[0061] In some optional implementations of the embodiments of this disclosure, the board 10 has a chip 11, and when the second electrical component 41 is electrically connected to the first electrical component 31, the chip 11 is located at a 90° position relative to the motherboard 20 (e.g., Figure 6 As shown in the figure, this can meet the 90° connection requirement between board 10 and motherboard 20.

[0062] In some optional implementations of the embodiments of this disclosure, the board 10 has a chip 11, and when the second electrical component 41 is electrically connected to the first electrical component 31, the chip 11 is located at a 180° position relative to the motherboard 20 (e.g., Figure 7 As shown in the figure, this can meet the 180° position connection requirement between board 10 and motherboard 20.

[0063] In some optional implementations of the embodiments of this disclosure, the board 10 has a chip 11, and when the second electrical component 41 is electrically connected to the first electrical component 31, the chip 11 is located at a 270° position relative to the motherboard 20 (e.g., Figure 8 As shown in the figure, this can meet the 270° position connection requirement between board 10 and motherboard 20.

[0064] Here, from Figures 5 to 8 As can be seen from the four usage states shown, from Figure 5 The status shown has switched to Figure 6 As shown, the board 10 has rotated 90° counterclockwise relative to the motherboard 20, and the connection channel between the first electrical component 31 and the second electrical component 41 has also changed; from Figure 5 The status shown has switched to Figure 7 As shown, the board 10 has rotated 180° counterclockwise relative to the motherboard 20, and the connection channel between the first electrical component 31 and the second electrical component 41 has also changed; from Figure 5 The status shown has switched to Figure 8 As shown, the board 10 has rotated 270° counterclockwise relative to the motherboard 20, and the connection channel between the first electrical component 31 and the second electrical component 41 has also changed.

[0065] Here, the connection between the board 10 and the motherboard 20 is not limited to the position described above. The position of the chip 11 relative to the motherboard 20 can be determined according to the position of nearby boards or components. It can be any angle from 0° to 360°, as long as it does not interfere with nearby boards or components.

[0066] The connection structure disclosed herein achieves a detachable connection between the board 10 and the motherboard 20 based on the cooperation of the second connection component 40 and the first connection component 30. The motherboard 20 does not need to reserve an additional interface, and the connection process between the board 10 and the motherboard 20 does not require tools. This not only avoids interference problems, but also provides high flexibility and saves costs.

[0067] In the description of this disclosure, it should be understood that the orientation or positional relationship indicated by directional terms is usually based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this disclosure and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this disclosure; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0068] For ease of description, spatial relative terms such as "above," "over," "on the upper surface of," and "above" are used herein to describe the spatial positional relationship between one or more components or features shown in the figures and other components or features. It should be understood that spatial relative terms include not only the orientation of the component as depicted in the figures but also different orientations during use or operation. For example, if the components in the figures are inverted as a whole, "above" or "above other components or features" will include cases where the component is "below" or "under" other components or features. Thus, the exemplary term "above" can include both "above" and "below." Furthermore, these components or features may also be positioned at other different angles (e.g., rotated 90 degrees or other angles), and this document intends to include all such cases.

[0069] It should be noted that the terminology used herein is for the purpose of describing particular implementations only and is not intended to limit the exemplary implementations according to this disclosure. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms “comprising” and / or “including” are used in this specification, they indicate the presence of features, steps, operations, parts, components, and / or combinations thereof.

[0070] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this disclosure are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this disclosure described herein can be implemented in sequences other than those illustrated or described herein.

[0071] This disclosure has been described through the above embodiments; however, it should be understood that the above embodiments are for illustrative purposes only and are not intended to limit this disclosure to the described embodiments. Furthermore, those skilled in the art will understand that this disclosure is not limited to the above embodiments, and many more variations and modifications can be made based on the teachings of this disclosure, all of which fall within the scope of protection claimed by this disclosure. The scope of protection of this disclosure is defined by the appended claims and their equivalents.

Claims

1. A connection structure for enabling a detachable connection between a circuit board and a motherboard, comprising: The first connection component is disposed on the motherboard; A second connection component is disposed on the board to cooperate with the first connection component to realize a detachable connection between the board and the motherboard; Under the action of the first force, the board can move relative to the motherboard to different connection states; Under the action of the second force, the board can move along the first direction to separate from the motherboard. The first direction does not include the direction parallel to the plane where the motherboard is located. The first connection assembly includes a first electrical component and a first connector, wherein there are multiple first electrical components surrounding the first connector; The second connection assembly includes a second electrical component and a second connector, wherein there are multiple second electrical components surrounding the second connector; When the board moves relative to the motherboard to a designated position, the plurality of second electrical components and the plurality of first electrical components can be electrically connected one-to-one. The first connector and the second connector work together to achieve a fixed or movable connection between the board and the motherboard.

2. The connection structure according to claim 1, wherein the first connection component further includes a first positioning member, and the second connection component further includes a second positioning member, wherein the first positioning member and the second positioning member cooperate to position the relative position between the board and the motherboard.

3. The connection structure according to claim 1, wherein one of the first connector and the second connector is a magnetic connector, and the other is a fastener that can be attracted by the magnetic connector, wherein the magnetic connector and the fastener cooperate to realize a fixed connection or a movable connection between the board and the motherboard.

4. The connection structure according to claim 1, wherein the second connecting member is connected to the first connecting member via a locking structure, and the second connecting member and the first connecting member are rotatable relative to each other; the locking structure includes a locking part and a locking groove with an opening, wherein the second connecting member and the first connecting member can be separated from each other when the locking part rotates to the opening.

5. The connection structure according to claim 1, wherein the motherboard has a first mounting area around the first connector, the first mounting area forming a square ring or a circular ring, and a plurality of the first electrical components are spaced apart within the first mounting area; the board has a second mounting area around the second connector, a plurality of the second electrical components are spaced apart within the second mounting area, the second mounting area forming the same shape as the first mounting area, and when the board moves relative to the motherboard to a designated position, the second mounting area and the first mounting area face each other to jointly form a connection limiting area.

6. The connection structure according to claim 5, wherein within the connection limiting area, at least one first positioning member and at least one second positioning member are provided between each pair of adjacent first electrical components, wherein at least one first positioning member and at least one second positioning member correspond one-to-one and can limit the board relative to the motherboard to the designated position by plugging in.

7. The connection structure according to any one of claims 2 to 6, wherein the board has a chip, and when the second electrical component is electrically connected to the first electrical component, the chip is located at a position of 0°, 90°, 180° or 270° relative to the motherboard.

8. The connection structure according to any one of claims 2 to 6, wherein the first electrical component is a solder joint capable of transmitting and receiving signals, and the second electrical component is a probe capable of detecting transmitted signals; or the first electrical component is a probe capable of detecting transmitted signals, and the second electrical component is a solder joint capable of transmitting and receiving signals.

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