Encapsulation and its preparation method

Abstract

This invention discloses a package and its preparation method. The package includes: a core board with heat dissipation channels formed therein, the heat dissipation channels being filled with a phase change material; at least two electronic devices, each attached to opposite sides of the core board; a packaging layer encapsulating the core board and each electronic device; and two conductive lines, each attached to opposite sides of the packaging layer, and electrically connected to the corresponding electronic devices via connectors. Through this structure, this invention can significantly improve the heat dissipation capacity of the package by utilizing the ability of the phase change material to change its physical state.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, and in particular to a package and its preparation method. Background Technology

[0002] Packaging technology is used to house semiconductor integrated circuit chips, and plays a role in placing, fixing, sealing, protecting electronic devices, enhancing their electrothermal performance, and serving as a bridge between the internal circuitry and external circuitry of electronic devices.

[0003] Traditional semiconductor packaging structures use high thermal conductivity substrates such as copper substrates and aluminum substrates for heat dissipation, or embed copper blocks or high thermal conductivity materials in the substrate for heat dissipation, or set heat sinks on the outside of the package for heat dissipation.

[0004] These heat dissipation methods mainly rely on the thermal conductivity of the material itself to dissipate heat, but their heat dissipation capacity is limited and their heat dissipation efficiency is insufficient. Summary of the Invention

[0005] This invention provides a package and its preparation method to solve the problem of insufficient heat dissipation efficiency of the package.

[0006] To address the aforementioned technical problems, the present invention provides a package comprising: a core board with a heat dissipation channel formed therein, the heat dissipation channel being filled with a phase change material; at least two electronic devices, the at least two electronic devices being respectively attached to opposite sides of the core board; a package layer, the package layer encapsulating the core board and each electronic device; and two conductive lines, the two conductive lines being respectively attached to opposite sides of the package layer, and the conductive lines being electrically connected to the corresponding electronic devices through connectors.

[0007] In this design, blind vias are formed on the encapsulation layer on the side of the electronic device away from the core board, and connectors are filled in the corresponding blind vias to electrically connect the electronic device to the corresponding conductive lines.

[0008] The core board also includes a first through hole, which is spaced apart from the heat dissipation channel and is filled with an encapsulation layer; a conductive through hole is formed in the encapsulation layer within the first through hole, and the conductive through hole is electrically connected to two layers of conductive lines on opposite sides of the encapsulation layer.

[0009] The core board is defined with a drilling area, a heat source area, and a non-heat source area; the first through hole is located in the drilling area; the heat dissipation channel is located in the heat source area and the non-heat source area; at least two electronic devices are located in the heat source area; wherein the slot width of the heat dissipation channel located in the non-heat source area is equal to or less than the slot width of the heat dissipation channel located in the heat source area.

[0010] Among them, the heat dissipation channels include long slot type heat dissipation channels;

[0011] Among them, the projection of the long slot heat dissipation channel on the core board includes grid shape, closed ring shape and baffle shape.

[0012] To address the aforementioned technical problems, this invention provides a packaging method for a package, comprising: obtaining a core board with a groove formed on one side; filling the groove with a phase change material and sealing the opening of the groove to form a heat dissipation channel; attaching at least two electronic devices to opposite sides of the core board and packaging the core board to encapsulate the core board and each electronic device; preparing a connector on the side of each electronic device away from the core board; and preparing conductive lines on opposite sides of the packaging layer to connect the conductive lines to the corresponding electronic devices through the connector, thereby obtaining a package.

[0013] The steps of obtaining a core plate with a groove on one side, filling the groove with phase change material, and sealing the opening of the groove to form a heat dissipation channel include: obtaining a core plate with a groove on one side, filling the groove with phase change material; metallizing the surface of the phase change material, and electroplating the side of the core plate with the groove until the opening of the groove is sealed to form a heat dissipation channel.

[0014] The steps of mounting at least two electronic devices onto opposite sides of a core board and encapsulating the core board to wrap the core board and the electronic devices include: drilling holes in the core board to form at least one first through hole; mounting at least two electronic devices onto opposite sides of the core board and encapsulating the core board until the first through holes are filled and the core board and the electronic devices are wrapped.

[0015] The steps of preparing connectors on the side of each electronic device away from the core board and preparing conductive lines on opposite sides of the encapsulation layer to connect the conductive lines to the corresponding electronic devices through the connectors to obtain the encapsulation body include: drilling holes in the core board based on the positions of each electronic device and the first through hole to form blind holes exposing each electronic device and second through holes penetrating the first through hole; electroplating the core board to fill the blind holes and second through holes to obtain connectors and conductive through holes, and forming conductive layers on opposite sides of the core board; etching each conductive layer to form conductive lines to obtain the encapsulation body, wherein the conductive lines are electrically connected to the corresponding electronic devices through the connectors, and the conductive lines on opposite sides of the core board are electrically connected through conductive through holes.

[0016] The phase change materials include one or more of the following: composite paraffin-polyethylene-expanded graphite, n-tetradecane, n-pentadecane, n-hexadecane, formic acid, acetic acid, and phenol.

[0017] To address the aforementioned technical problems, the package of the present invention incorporates heat dissipation channels formed within a core board, and these channels are filled with a phase change material. This significantly enhances the heat dissipation capacity of the package by utilizing the phase change material's ability to change its physical state. Because the heat dissipation efficiency of the package in this embodiment is greatly improved, electronic devices can be placed on both sides of the core board and encapsulated for conductivity, thereby increasing the package density, reducing the package thickness, and facilitating miniaturization of the package. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of an embodiment of the package provided by the present invention;

[0019] Figure 2 yes Figure 1 A top view of the core board 110 in one embodiment;

[0020] Figure 3 yes Figure 1 A top view of the core board 110 in other embodiments of the example;

[0021] Figure 4 A schematic flowchart of an embodiment of the method for preparing the package provided by the present invention;

[0022] Figure 5 A schematic flowchart of another embodiment of the method for preparing the package provided by the present invention;

[0023] Figure 6 yes Figure 5 A schematic diagram of the structure of a core plate after the groove is prepared in the embodiment;

[0024] Figure 7 yes Figure 5 A schematic diagram of the structure of the core board after the heat dissipation channel is prepared in the embodiment;

[0025] Figure 8 yes Figure 5 A schematic diagram of the structure of the electronic device after mounting in the embodiment;

[0026] Figure 9 yes Figure 5 A schematic diagram of the structure of one embodiment of the prepared encapsulated structure;

[0027] Figure 10 yes Figure 5 A schematic diagram of the structure after secondary drilling in the embodiment;

[0028] Figure 11 yes Figure 5 The metallized structure in the embodiment is shown in the schematic diagram of one implementation. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0031] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0032] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of an embodiment of the package provided by the present invention.

[0033] The package 100 of this embodiment includes a core board 110, at least two electronic devices 130, a package layer 150, and two layers of conductive lines 140.

[0034] The core board 110 in this embodiment may include a metal core board and a non-metal core board. When the core board 110 is a metal core board, its material may include copper, aluminum, nickel, silver, gold, or alloys, etc., and is not limited thereto. When the core board 110 is a non-metal core board, it may include ceramic core boards such as alumina substrate, aluminum nitride substrate, silicon carbide substrate, and low-temperature co-fired glass-ceramic substrate (LTCC).

[0035] A heat dissipation channel 111 is formed within the core board 110, and the heat dissipation channel 111 is filled with a phase change material. The heat dissipation channel 111 refers to a cavity structure completely enclosed by the core board 110. The phase change material allows heat to be dissipated from the interior of the core board 110 to the entire package 100. The phase change material has the ability to change its physical state within a certain temperature range, thereby releasing or absorbing a large amount of heat during the phase change to achieve heating or cooling. Taking solid-liquid phase change as an example, when heated to the melting temperature, a phase change occurs from solid to liquid. During the melting process, the phase change material absorbs and stores a large amount of latent heat. By filling the heat dissipation channel 111 within the core board 110 with a phase change material, the heat dissipation capacity of the package 100 is significantly improved by utilizing the phase change material's ability to change its physical state.

[0036] At least two electronic devices 130 are respectively attached to opposite sides of the core board 110. These electronic devices 130 may include chips, capacitors, resistors, power devices, and other electronic components. The specific types of electronic devices 130 can be chosen based on actual circumstances and are not limited here.

[0037] Since the heat dissipation efficiency of the package 100 in this embodiment is greatly improved, electronic devices can be set on both sides of the core board 110, thereby increasing the package density and reducing the package thickness.

[0038] Electronic components 130 can be attached to opposite sides of the core board 110 by welding or bonding.

[0039] The encapsulation layer 150 encapsulates the core board 110 and each electronic component 130, thereby encapsulating the core board 110 and each electronic component 130 into an integral structure. Specifically, the encapsulation layer 150 may include one or more of thermoplastic resins or thermosetting resins such as polyimide (PI), epoxy resin, prepreg (PP), BT resin, polyphenylene ether resin (PPE / PPO), polytetrafluoroethylene (PTFE), polystyrene (PS), and cyanate ester resin (CE), and is not limited thereto.

[0040] Two conductive lines 140 are respectively attached to opposite sides of the encapsulation layer 150, and the conductive lines 140 are electrically connected to the corresponding electronic devices 130 through connectors 131. Thus, the electronic devices 130 on both sides of the core board 110 are electrically connected through the conductive lines 140 to realize the function of the electronic devices 130.

[0041] In one specific application scenario, connector 131 can be obtained by drilling and electroplating the encapsulation layer 150 between conductive line 140 and electronic device 130 sequentially, thereby electrically connecting the corresponding conductive line 140 and electronic device 130. In another specific application scenario, connector 131 may also include external leads of electronic device 130, which are led out by wire bonding before encapsulation and electrically connected to the corresponding conductive line 140 after encapsulation. This embodiment does not limit the specific structure of connector 131.

[0042] With the above structure, the package in this embodiment forms a heat dissipation channel within the core board, and the heat dissipation channel is filled with a phase change material. This significantly improves the heat dissipation capacity of the package by utilizing the ability of the phase change material to change its physical state. Because the heat dissipation efficiency of the package in this embodiment is greatly improved, electronic devices can be placed on both sides of the core board and encapsulated for conductivity, thereby increasing the package density, reducing the package thickness, and facilitating miniaturization of the package.

[0043] In other embodiments, a blind via (not shown in the figure) is formed on the encapsulation layer 150 on the side of the electronic device 130 away from the core board 110, and the connector 131 fills the corresponding blind via to electrically connect the electronic device 130 to the corresponding conductive line 140.

[0044] The number of blind holes and corresponding connectors 131 on the packaging layer 150 on the side of a single electronic device 130 away from the core board 110 can be determined based on the electrical connection requirements of the electronic device 130, such as 2, 3, etc., and is not limited here.

[0045] In a specific application scenario, the connector 131 and the conductive line 140 in this embodiment are formed by electroplating the two sides of the encapsulation layer 150 and the blind via. Therefore, the connection structure between the connector 131, the conductive line 140, and the corresponding electronic device 130 is stable and inseparable, thereby improving the stability and reliability of the electrical connection between the conductive line 140 and the corresponding electronic device 130.

[0046] In other embodiments, the core board 110 further includes a first through hole 120, which is spaced apart from the heat dissipation channel 111, and the first through hole 120 is filled with an encapsulation layer 150.

[0047] The number of first through holes 120 can be one or more, depending on actual needs, and is not limited here.

[0048] Conductive vias 121 are formed in the encapsulation layer 150 within the first via 120, i.e., a large hole encapsulates a small hole. The conductive via 121 electrically connects the two layers of conductive lines 140 on opposite sides of the encapsulation layer 150, thereby realizing the electrical connection between the two layers of conductive lines 140 and between the electronic devices 130 on both sides of the core board 110.

[0049] In other embodiments, please refer to Figure 2 , Figure 2 yes Figure 1 A top view of the core board 110 in one embodiment.

[0050] The core board 110 is defined with a drilling area 112, a heat source area 113, and a non-heat source area. The drilling area 112 refers to the area on the core board 110 used for drilling. The heat source area 113 refers to the location on the core board 110 where electronic devices 130 are disposed. The non-heat source area refers to all other locations on the core board 110 except for the drilling area 112 and the heat source area 113. The number of drilling areas 112 and heat source areas 113 can be one or more, and is not limited here.

[0051] Specifically, the first through hole 120 is located within the drilling area 112; the heat dissipation channel 111 is located within the heat source area 113 and the non-heat source area; at least two electronic devices 130 are located within the heat source area 113;

[0052] The slot width of the heat dissipation channel 111 located in the non-heat source area is equal to or less than the slot width of the heat dissipation channel 111 located in the heat source area. Since the heat dissipation requirements in the non-heat source area are not high, in order to save phase change materials and enhance the strength of the core board 110, the slot width of the heat dissipation channel 111 located in the non-heat source area can be less than the slot width of the heat dissipation channel 111 located in the heat source area, thereby improving the reliability of the core board 110 and the cost of the package 100.

[0053] Because the phase change material in the heat dissipation channel is distributed not only in the heat source area but also in the non-heat source area, the heat generated by the electronic device during operation can be absorbed and diffused to the entire package through the phase change process of the phase change material, which expands the heat dissipation surface, improves heat dissipation efficiency, and has a better temperature uniformity effect, preventing problems such as package warping caused by excessive local temperature, and improving the reliability of the package.

[0054] In other embodiments, the heat dissipation channel 111 includes an elongated slot-shaped heat dissipation channel; wherein the projection of the elongated slot-shaped heat dissipation channel on the core board 110 includes a grid shape, a closed ring shape, and a baffle shape.

[0055] in, Figure 2 The schematic diagram shows a baffle-shaped heat dissipation channel 111.

[0056] Please see Figure 3 , Figure 3 yes Figure 1 A top view of another embodiment of the core board 110 in this example.

[0057] Figure 3 Figure a shows a heat dissipation channel of one embodiment with a grid shape; Figure b shows a heat dissipation channel of one embodiment with a closed ring shape; Figure c shows a heat dissipation channel of another embodiment with a grid shape.

[0058] In other embodiments, the heat dissipation channel 111 may also include multiple long slot-shaped heat dissipation channels, wave-shaped heat dissipation channels, annular heat dissipation channels, etc., which are not limited here.

[0059] Please see Figure 4 , Figure 4 This is a schematic flowchart of an embodiment of the method for preparing a package provided by the present invention. The method for preparing a package in this embodiment is used to prepare a package in any of the above embodiments.

[0060] Step S11: Obtain a core plate with a groove on one side, fill the groove with phase change material, and seal the opening of the groove to form a heat dissipation channel.

[0061] A core board with a groove formed on one side is obtained. The core board can be a metal core board or a non-metal core board. When the core board is a metal core board, its material can include copper, aluminum, nickel, silver, gold, or alloys, etc., without limitation. When the core board is a non-metallic core board, it can include ceramic core boards such as alumina substrate, aluminum nitride substrate, silicon carbide substrate, and low temperature cofired ceramic substrate (LTCC).

[0062] The phase change material is filled into the groove, and the opening of the groove is sealed to form a heat dissipation channel.

[0063] The heat dissipation channel refers to a cavity structure completely enclosed by the core board. It is filled with a phase change material (PCM) to dissipate heat from within the core board to the entire package. PCM has the ability to change its physical state within a certain temperature range, releasing or absorbing a large amount of heat during the phase change to achieve heating or cooling. Taking solid-liquid phase change as an example, when heated to the melting temperature, a phase change occurs from solid to liquid. During melting, the PCM absorbs and stores a large amount of latent heat. By filling the heat dissipation channel within the core board with PCM, the heat dissipation capacity of the package is significantly improved by utilizing the PCM's ability to change its physical state.

[0064] In a specific application scenario, the surface of the phase change material can be metallized by vapor deposition, and then the side of the core board with grooves can be electroplated until the opening of the grooves is sealed to form a heat dissipation channel.

[0065] In another specific application scenario, copper foil can be laminated onto the side of the core board where the groove is formed, thereby sealing the opening of the groove and forming a heat dissipation channel. The method of sealing the groove opening is not limited here.

[0066] The grooves include elongated grooves; and can also include mesh-shaped, closed-ring, and baffle-shaped grooves, as well as wave-shaped and annular heat dissipation channels. The number of grooves on the core board can be one or more, and is not limited here.

[0067] Step S12: Attach at least two electronic components to opposite sides of the core board and encapsulate the core board to wrap the core board and each electronic component.

[0068] At least two electronic components are mounted on opposite sides of the core board. These electronic components may include chips, capacitors, resistors, power devices, etc. The specific types of electronic components can be chosen based on the actual situation and are not limited here.

[0069] Electronic components can be attached to opposite sides of the core board by welding or bonding.

[0070] The core board is encapsulated with encapsulation materials to encapsulate the core board and various electronic components. The encapsulation materials may include one or more of the following thermoplastic or thermosetting resins: polyimide (PI), epoxy resin, prepreg (PP), BT resin, polyphenylene ether resin (PPE / PPO), polytetrafluoroethylene (PTFE), polystyrene (PS), cyanate ester resin (CE), etc., without limitation.

[0071] Step S13: Prepare connectors on the side of each electronic device away from the core board, and prepare conductive lines on opposite sides of the encapsulation layer, so as to connect the conductive lines to the corresponding electronic devices through the connectors to obtain the encapsulation body.

[0072] Connectors are fabricated on the side of each electronic component away from the core board, and conductive lines are fabricated on opposite sides of the encapsulation layer to connect the conductive lines to the corresponding electronic components through the connectors, thereby obtaining the encapsulation body.

[0073] In one specific application scenario, the connector can be obtained by drilling and electroplating the encapsulation layer between the conductive line and the electronic device, thereby electrically connecting the corresponding conductive line and the electronic device. In another specific application scenario, the connector may also include external leads of the electronic device, which are led out by wire bonding before encapsulation and electrically connected to the corresponding conductive line after encapsulation. This embodiment does not limit the specific manufacturing method of the connector.

[0074] Through the above method, the package preparation method of this embodiment forms a heat dissipation channel within the core board and fills the heat dissipation channel with a phase change material, thereby significantly improving the heat dissipation capacity of the package by utilizing the ability of the phase change material to change its physical state. Since the heat dissipation efficiency of the package in this embodiment is greatly improved, electronic devices can be placed on both sides of the core board and encapsulated for conductivity, thereby increasing the package density, reducing the package thickness, and facilitating the miniaturization of the package.

[0075] Please see Figure 5 , Figure 5 This is a schematic flowchart illustrating another embodiment of the method for preparing a package provided by the present invention. The method for preparing a package in this embodiment is used to prepare a package according to any of the above embodiments.

[0076] Step S21: Obtain a core plate with a groove on one side, fill the groove with phase change material; metallize the surface of the phase change material, and electroplate the side of the core plate with the groove until the opening of the groove is sealed to form a heat dissipation channel.

[0077] A core plate with a groove formed on one side is obtained, and phase change material is filled into the groove.

[0078] In a specific application scenario, a core board can be obtained first. Drilling areas, heat source areas, and non-heat source areas are defined on the core board. The drilling area refers to the area on the core board used for drilling. The heat source area refers to the location on the core board where electronic components are placed. The non-heat source area refers to all other locations on the core board except for the drilling and heat source areas. The number of drilling and heat source areas can be one or more, and is not limited here.

[0079] Based on the location of the heat source and non-heat source areas, grooves are fabricated on one side of the core board. Specifically, grooves can be etched onto the core board using a pattern transfer method; alternatively, grooves can be created using mechanical drilling, laser drilling, or other methods. The pattern transfer method involves processes such as applying dry film to a metal substrate, exposure, development, etching, and film removal.

[0080] In a specific application scenario, when fabricating the grooves, the groove width of the groove located in the non-heat source area can be less than or equal to the groove width of the groove located in the heat source area. Since the heat dissipation requirements of the non-heat source area are not high, in order to save phase change material and enhance the strength of the core board, the groove width of the groove located in the non-heat source area can be smaller than the groove width of the groove located in the heat source area, thereby improving the reliability of the core board and the cost of the package.

[0081] Because the phase change material in the heat dissipation channel is distributed not only in the heat source area but also in the non-heat source area, the heat generated by the electronic device during operation can be absorbed and diffused to the entire package through the phase change process of the phase change material, which expands the heat dissipation surface, improves heat dissipation efficiency, and has a better temperature uniformity effect, preventing problems such as package warping caused by excessive local temperature, and improving the reliability of the package.

[0082] Please see Figure 6 , Figure 6 yes Figure 5 A schematic diagram of the structure of the core plate after the groove is prepared in the embodiment.

[0083] In this embodiment, a groove 211 is formed on one side of the core plate 210. The groove 211 includes an elongated groove; and may also include a mesh shape, a closed ring shape, a baffle shape, or a wave-shaped heat dissipation channel or an annular heat dissipation channel. The number of grooves 211 on the core plate 210 can be one or more, and is not limited here.

[0084] After a groove is formed on one side of the core board, a phase change material is filled into the groove. When the package works and generates a large amount of heat, the phase change material absorbs a large amount of heat during the phase change, thereby achieving a cooling effect. The phase change material includes one or more of the following: composite paraffin-polyethylene-expanded graphite, n-tetradecane, n-pentadecane, n-hexadecane, formic acid, acetic acid, and phenol, and is not limited thereto.

[0085] After the phase change material is filled, the surface of the phase change material is metallized. Specifically, the surface of the phase change material can be metallized by physical vapor deposition, chemical vapor deposition or metal sputtering, etc., and then the side of the core board with the groove is electroplated until the opening of the groove is sealed by the electroplated metal layer to form a heat dissipation channel.

[0086] Please see Figure 7 , Figure 7 yes Figure 5 A schematic diagram of the structure of the core board after the heat dissipation channel is prepared in the embodiment.

[0087] This embodiment is in Figure 6 Based on the implementation method, the groove in the core board 210 is sealed to form a heat dissipation channel 212.

[0088] Step S22: Drill holes in the core board to form at least one first through hole; attach at least two electronic components to opposite sides of the core board and encapsulate the core board until each first through hole is filled and the core board and each electronic component are encapsulated.

[0089] In a specific application scenario, the core board can be drilled based on the location of the drilling area to form at least one first through hole on the core board, and the first through hole and the heat dissipation channel are spaced apart to avoid mutual interference.

[0090] At least two electronic components are mounted on opposite sides of the core board, specifically, on the heat source area of ​​the core board. The electronic components can be fixed to the opposite sides of the heat source area of ​​the core board by soldering or using thermally conductive adhesive.

[0091] Please see Figure 8 , Figure 8 yes Figure 5 The embodiment shows a schematic diagram of the structure of the electronic device after mounting.

[0092] This embodiment is in Figure 7 Based on the implementation method, at least one first through hole 213 is formed on the core board 210, and each first through hole 213 is spaced apart from the heat dissipation channel 212. Electronic devices 214 are respectively attached to opposite sides of the core board 210.

[0093] After mounting the electronic components, the core board is encapsulated with encapsulating materials until all the first through-holes are filled and the core board and electronic components are encapsulated. Encapsulating materials can be thermoplastic resins and / or thermosetting resins such as polyimide (PI), epoxy resin, prepreg (PP), BT resin, polyphenylene ether resin (PPE / PPO), polytetrafluoroethylene (PTFE), polystyrene (PS), and cyanate ester resin (CE). Furthermore, to improve the heat dissipation capacity of the encapsulating material, thermally conductive fillers such as zinc oxide powder, aluminum nitride powder, and silicon carbide powder can be added. Alternatively, an adhesive, such as underfill, can be used to plastic encapsulate the core board and electronic components.

[0094] Please see Figure 9 , Figure 9 yes Figure 5 The encapsulated structure prepared in the embodiment is shown in the schematic diagram of one of the embodiments.

[0095] This embodiment is in Figure 8 Based on the implementation method, a new encapsulation layer 215 is added. The encapsulation layer 215 fills each of the first through holes 213 and wraps the core board 210 and each electronic device 214 to integrate the core board 210 and each electronic device 214 into an integral structure.

[0096] Step S23: Drill holes in the core board based on the positions of each electronic component and the first through hole to form blind holes that expose each electronic component and second through holes that penetrate the first through hole.

[0097] After encapsulation, the core board is drilled based on the location of the first through-hole to create a second through-hole within the first through-hole, forming a large hole surrounding a smaller hole. Additionally, the core board is drilled based on the location of each electronic component to create blind holes exposing each electronic component; specifically, this could expose the electrodes of the electronic components.

[0098] Please see Figure 10 , Figure 10 yes Figure 5 The structural diagram of the embodiment after secondary drilling is shown in the example.

[0099] This embodiment is in Figure 9 Based on the implementation method, a second through-hole 216 and a blind hole 217 are formed on the encapsulation layer 215. The second through-hole 216 penetrates the encapsulation layer 215 within the corresponding first through-hole 213, and the bottom of the blind hole 217 exposes the electrode of the corresponding electronic device 214.

[0100] Step S24: Electroplating is performed on the core board to fill all blind holes and second through holes, thereby obtaining connectors and conductive through holes, and conductive layers are formed on the opposite two sides of the core board; each conductive layer is etched to form conductive lines to obtain a package, wherein the conductive lines are electrically connected to the corresponding electronic devices through connectors, and the conductive lines on the opposite two sides of the core board are electrically connected through conductive through holes.

[0101] In a specific application scenario, before metallization, surface treatment can be performed on the second via, blind via, and encapsulation layer to form a seed layer; specifically, surface treatment can be performed by methods such as copper plating and metal sputtering to improve the reliability of subsequent metallization.

[0102] After surface treatment, the core board is electroplated to fill all blind holes and second through holes, thereby obtaining the connector and conductive through holes, and forming a conductive layer on the opposite two sides of the core board.

[0103] Please see Figure 11 , Figure 11 yes Figure 5 The metallized structure in the embodiment is shown in the schematic diagram of one implementation.

[0104] This embodiment is in Figure 10 Based on the implementation method, the blind hole is electroplated to form a connector 219, the second through hole is electroplated to form a conductive through hole 218, and the encapsulation layer 215 has conductive layers 220 formed on opposite sides, and the connector 219, the conductive through hole 218 and the conductive layer 220 are integrally formed.

[0105] One end of the connector 219 is connected to the electrode of the electronic device 214, and the other end is connected to the corresponding conductive layer 220. The two ends of the conductive via 218 are respectively connected to the conductive layers 220 on both sides of the encapsulation layer 215.

[0106] After metallization, the conductive layer is etched to form conductive lines, resulting in the package. Etching can be performed using a tenting method. The package structure can be found in [reference needed]. Figure 1 This will not be elaborated upon here.

[0107] In a specific application scenario, a protective layer, such as ink, can be printed on the conductive lines to provide solder resist protection for the package.

[0108] Through the above steps, the packaging method of this embodiment embeds a phase change material in the core board. The phase change material is distributed not only in the heat source area but also in the non-heat source area. When the electronic device is working, the heat generated can be absorbed and diffused to the entire package through the phase change process of the phase change material, which expands the heat dissipation surface and improves the heat dissipation efficiency. At the same time, it has a better temperature uniformity effect and prevents problems such as warping of the package due to excessive local temperature. In addition, the packaging thickness is reduced and the packaging density is increased by setting electronic devices on both sides of the core board.

[0109] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A package, characterized in that, The package includes: A core board, wherein a heat dissipation channel is formed within the core board and the heat dissipation channel is filled with a phase change material; wherein the heat dissipation channel is formed by obtaining a core board with a groove on one side, filling the groove with the phase change material, metallizing the surface of the phase change material, and electroplating the side of the core board with the groove until the opening of the groove is sealed. At least two electronic devices are respectively attached to opposite sides of the core board; An encapsulation layer that encapsulates the core board and each of the electronic components; Two layers of conductive lines are respectively attached to opposite sides of the encapsulation layer, and the conductive lines are electrically connected to the corresponding electronic devices through connectors. The core board is defined with a heat source area and a non-heat source area; the heat dissipation channel is located in the heat source area and the non-heat source area; the at least two electronic devices are located in the heat source area; wherein the slot width of the heat dissipation channel located in the non-heat source area is equal to or less than the slot width of the heat dissipation channel located in the heat source area. The core board further includes a first through hole, which is spaced apart from the heat dissipation channel and is filled with the encapsulation layer; a conductive through hole is formed in the encapsulation layer within the first through hole, and the conductive through hole electrically connects two layers of conductive lines on opposite sides of the encapsulation layer, and the conductive through hole and the first through hole form a large hole with a small hole. The heat dissipation channel includes a long slot type heat dissipation channel; wherein, the projection of the long slot type heat dissipation channel on the core board includes a grid shape, a closed ring shape, and a baffle shape.

2. The package according to claim 1, characterized in that, A blind via is formed on the encapsulation layer of the electronic device on the side away from the core board, and the connector fills the corresponding blind via to electrically connect the electronic device to the corresponding conductive line.

3. The package according to claim 1, characterized in that, The core board also defines a drilling area; The first through hole is located within the drilling area.

4. A method for packaging a package, characterized in that, The encapsulation method of the encapsulation body is applied to the encapsulation body according to any one of claims 1-3, including: A core plate with a groove formed on one side is obtained, a phase change material is filled into the groove, and the opening of the groove is sealed to form a heat dissipation channel; At least two electronic devices are respectively mounted on opposite sides of the core board, and the core board is encapsulated to enclose the core board and each of the electronic devices; A connector is prepared on the side of each electronic device away from the core board, and conductive lines are prepared on opposite sides of the encapsulation layer to connect the conductive lines to the corresponding electronic devices through the connector, thereby obtaining an encapsulation body.

5. The packaging method of the package according to claim 4, characterized in that, The steps of obtaining a core plate with a groove on one side, filling the groove with phase change material, and sealing the opening of the groove to form a heat dissipation channel include: A core plate with a groove formed on one side is obtained, and a phase change material is filled into the groove; The surface of the phase change material is metallized, and the side of the core plate with the groove is electroplated until the opening of the groove is sealed to form the heat dissipation channel.

6. The packaging method of the package according to claim 4, characterized in that, The step of mounting at least two electronic devices onto opposite sides of the core board and encapsulating the core board to encapsulate the core board and each of the electronic devices includes: Drill holes in the core board to form at least one first through hole in the core board; At least two electronic devices are respectively mounted on opposite sides of the core board, and the core board is encapsulated until each of the first through holes is filled and the core board and each of the electronic devices are encapsulated.

7. The packaging method of the package according to claim 6, characterized in that, The steps of fabricating connectors on the side of each electronic device away from the core board and fabricating conductive lines on opposite surfaces of the encapsulation layer to connect the conductive lines to the corresponding electronic devices via the connectors to obtain the encapsulation body include: The core board is drilled based on the positions of each electronic device and the first through hole to form blind holes that expose each electronic device and second through holes that penetrate the first through hole. The core board is electroplated to fill all the blind holes and the second through holes, thereby obtaining the connector and the conductive through hole, and a conductive layer is formed on the opposite two side surfaces of the core board. The conductive layers are etched to form conductive lines to obtain a package, wherein the conductive lines are electrically connected to the corresponding electronic devices through the connectors, and the conductive lines on opposite sides of the core board are electrically connected through the conductive vias.

8. The packaging method of the package according to claim 4, characterized in that, The phase change material is a composite paraffin-polyethylene-expanded graphite.

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