Systems and methods for multicolor LEDs with stacked bonding structures

CN115335889BActive Publication Date: 2025-08-29JADE BIRD DISPLAY (SHANGHAI) LTD
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Patent Information

Application Number
CN202180024512.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2020-03-30
Filing Date
2021-03-30
Publication Date
2025-08-29
Estimated Expiration
2041-03-30

AI Technical Summary

Technical Problem

The traditional micro LED display panel preparation process is low efficiency, high cost and poor reliability. Especially in multi-color display panels, the substrate thermal mismatch and optical crosstalk are serious problems, making it difficult to meet the needs of high resolution and low power consumption.

Method used

Using a multi-color LED device design, a stacked structure is formed by placing multiple micro LED structures horizontally on the display panel, each LED structure emits light of different colors and is directly bonded to the substrate with a pixel driver through metal bonding, avoiding the retention of additional substrates, simplifying the preparation process.

Benefits of technology

It improves the preparation efficiency and reliability of micro LED devices, reduces the production complexity, and meets the display requirements of AR, VR, head-up display, mobile device display, wearable device display and high-definition small projector.

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Abstract

A single-pixel multicolor LED device includes two or more LED structures for emitting a range of colors of light. The two or more LED structures are horizontally formed into sub-pixels to combine light. In some embodiments, two or more light-emitting layers are formed on a substrate having an integrated circuit and the two or more light-emitting layers are bonded together by a bonding layer. In some embodiments, the two or more LED structures are formed by utilizing the corresponding top light-emitting layers of the corresponding LED structures and by removing the top light-emitting layers that are redundant with the corresponding LED structures. In some embodiments, the vertical orientation of the P-type region and the N-type region in the first light-emitting layer is different from the vertical orientation of the P-type region and the N-type region in the second light-emitting layer.
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Citation Information

Patent Citations

  • Display device having light emitting stacked structure

    CN110709995A

  • Iii-nitride multi-color on wafer micro-led enabled by tunnel junctions

    US20190198709A1