Method for manufacturing circuit board and back drilling processing device for circuit board

Abstract

The present application provides a method for manufacturing a circuit board and a back-drilling processing device for the circuit board. The method includes: providing a circuit board; wherein the circuit board includes a substrate, a top metal layer arranged on a first surface of the substrate, and a bottom metal layer arranged on a second surface opposite to the first surface; drilling holes in the circuit board to form conductive holes and sensing the height value of the drill bit dropping when the drill bit contacts the surface of the top metal layer away from the bottom metal layer to obtain a first height; sensing the height value of the drill bit dropping when the drill bit contacts the surface of the bottom metal layer close to the top metal layer to obtain a second height; obtaining the actual controlled depth of the conductive hole according to the first height, the second height, the theoretical board thickness, and the theoretical controlled depth; and back-drilling the current conductive hole of the circuit board based on the actual controlled depth. The method for manufacturing a circuit board can improve the accuracy of the back-drilling process during the back-drilling process, thereby effectively improving the product qualification rate.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board manufacturing, and in particular to a circuit board manufacturing method and a circuit board back drilling processing device. Background Art

[0002] In the process of manufacturing circuit boards, the back drilling process is often used to remove the copper of the through-hole sections that do not play any connection or transmission role, so as to avoid the residual metal (stub) causing reflection, scattering, delay, etc. during the transmission process, which ultimately causes signal "distortion".

[0003] However, in the existing method for manufacturing circuit boards, the back drilling process has a low back drilling accuracy, which leads to a decrease in the product qualification rate. Summary of the invention

[0004] The present application provides a method for manufacturing a circuit board and a back drilling processing device for a circuit board. The method for manufacturing a circuit board can solve the problem of a conventional method for manufacturing a circuit board in which the back drilling processing accuracy is low during the back drilling processing, resulting in a decrease in the product qualification rate.

[0005] In order to solve the above technical problems, a technical solution adopted by the present application is: to provide a method for manufacturing a circuit board. The method includes: providing a circuit board; wherein the circuit board includes a substrate, a top metal layer arranged on a first surface of the substrate, and a bottom metal layer arranged on a second surface opposite to the first surface; drilling holes in the circuit board to form conductive holes and sensing the height value of the drill bit descending when the drill bit drills down to contact the surface of the top metal layer away from the bottom metal layer to obtain a first height; sensing the height value of the drill bit descending when the drill bit contacts the surface of the bottom metal layer close to the top metal layer to obtain a second height; obtaining the actual controlled depth of the conductive hole according to the first height, the second height, the theoretical board thickness, and the theoretical controlled depth; and back-drilling the current conductive hole of the circuit board based on the actual controlled depth.

[0006] Among them, the step of obtaining the actual controlled depth of the conductive hole according to the first height, the second height, the theoretical board thickness and the theoretical controlled depth specifically includes: obtaining the actual board thickness of the circuit board according to the first height and the second height; obtaining the actual controlled depth of the conductive hole based on the actual board thickness, the theoretical board thickness and the theoretical controlled depth.

[0007] The step of obtaining the actual thickness of the circuit board according to the first height and the second height includes: obtaining the actual thickness of the circuit board according to the first height and the second height by the following formula (1):

[0008] H1=|Z2-Z1|+h (1)

[0009] Among them, H1 is the actual thickness of the circuit board; Z1 is the first height; Z2 is the second height; h is the thickness of the bottom metal layer.

[0010] The step of obtaining the actual controlled depth of the conductive hole based on the actual plate thickness, the theoretical plate thickness and the theoretical controlled depth specifically includes: obtaining the actual controlled depth of the conductive hole according to the actual plate thickness, the theoretical plate thickness and the theoretical controlled depth by the following formula (2):

[0011]

[0012] Among them, Z is the actual controlled depth of the conductive hole; H1 is the actual board thickness of the circuit board; H2 is the theoretical board thickness of the circuit board; H0 is the total thickness of the core board; Z0 is the theoretical controlled depth of the circuit board.

[0013] The step of obtaining the actual controlled depth of the conductive hole based on the actual board thickness, the theoretical board thickness and the theoretical controlled depth specifically includes: obtaining the compensation parameter of the circuit board; and obtaining the actual controlled depth of the conductive hole according to the actual board thickness, the theoretical board thickness, the theoretical controlled depth and the compensation parameter by the following formula (3):

[0014]

[0015] Among them, Z is the actual controlled depth of the conductive hole; H1 is the actual board thickness of the circuit board; H2 is the theoretical board thickness of the circuit board; H0 is the total thickness of the core board; Z0 is the theoretical controlled depth of the circuit board; k is the compensation parameter of the circuit board.

[0016] The compensation parameters include one or more of the thickness of the aluminum plate used in back drilling of the circuit board, the angle between the drill tip and the horizontal plane, the safety distance, the thickness of the electroplated copper of the circuit board pattern, and the thickness of the solder mask ink of the circuit board.

[0017] In order to solve the above technical problems, another technical solution adopted by the present application is: to provide a drilling processing device for a circuit board. The circuit board includes a substrate, a top metal layer arranged on a first surface of the substrate, and a bottom metal layer arranged on a second surface opposite to the first surface; the drilling processing device for the circuit board includes a drill bit, a detector, and a processor; wherein the drill bit is used to drill holes in the circuit board to form conductive holes, and to achieve electrical connection with the metal layer when in contact with the metal layer on the circuit board; the detector is connected to the drill bit, and is used to sense the height value of the drill bit falling when the drill bit drills down and contacts the surface of the top metal layer away from the bottom metal layer, so as to obtain a first height; and sense the height value of the drill bit falling when the drill bit contacts the surface of the bottom metal layer close to the top metal layer, so as to obtain a second height; the processor is connected to the detector, and is used to obtain the actual control depth of the circuit board according to the first height, the second height, the theoretical board thickness, and the theoretical control depth.

[0018] The processor is specifically used to obtain the actual board thickness of the circuit board according to the first height and the second height; and obtain the actual controlled depth of the conductive hole based on the actual board thickness, theoretical board thickness and theoretical controlled depth.

[0019] The processor is specifically used to obtain the actual controlled depth of the conductive hole according to the actual plate thickness, the theoretical plate thickness and the theoretical controlled depth through the following formula (2):

[0020]

[0021] Among them, Z is the actual controlled depth of the conductive hole; H1 is the actual board thickness of the circuit board; H2 is the theoretical board thickness of the circuit board; H0 is the total thickness of the core board; Z0 is the theoretical controlled depth of the circuit board.

[0022] The processor is specifically used to obtain the actual control depth of the circuit board according to the actual board thickness, theoretical board thickness, theoretical control depth and compensation parameters through the following formula (3):

[0023]

[0024] Among them, Z is the actual controlled depth of the circuit board; H1 is the actual board thickness of the circuit board; H2 is the theoretical board thickness of the circuit board; Z0 is the theoretical board thickness of the circuit board; H0 is the total thickness of the core board; k is the compensation parameter of the circuit board.

[0025] The present application provides a method for manufacturing a circuit board and a drilling processing device for a circuit board. The method for manufacturing a circuit board obtains a first height by sensing the height value of the drill bit falling when the drill bit drills down and contacts the surface of the top metal layer away from the bottom metal layer during the drilling process; and senses the height value of the drill bit falling when the drill bit contacts the surface of the bottom metal layer close to the top metal layer to obtain a second height, and then obtains the actual controlled depth of the conductive hole currently drilled in the circuit board based on the obtained first height, second height, theoretical board thickness and theoretical controlled depth. Compared with the scheme in the prior art that obtains the actual controlled depth by measuring the board thickness data, theoretical board thickness and theoretical controlled depth, the actual controlled depth of the conductive hole currently drilled in the circuit board has a higher accuracy, so that in the process of back-drilling the circuit board based on the actual controlled depth, the accuracy of the back-drilling processing can be greatly improved, thereby not only reducing the signal loss of the signal hole, but also effectively improving the product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic diagram of a drill bit provided in an embodiment of the present application performing back drilling processing on different positions of a circuit board based on the same theoretical depth control;

[0027] Figure 2 A flowchart of a method for manufacturing a circuit board provided in one embodiment of the present application;

[0028] Figure 3An embodiment of the present application provides Figure 2 Sub-flow chart of step S13;

[0029] Figure 4 A schematic structural diagram of a circuit board drilling device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0031] The terms "first", "second", "third" in this application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", "third" can expressly or implicitly include at least one of the features. In the description of this application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the embodiments of this application, all directional indications (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the steps or units listed, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0032] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0033] See also Figure 1 , Figure 1 Schematic diagram of a drill bit according to an embodiment of the present application performing back drilling processing on different positions of a circuit board based on the same theoretical depth control; during the production process of the circuit board 10, the drilling processing device 20 (see below) Figure 4) will perform back drilling on the circuit board 10 based on the theoretical controlled depth of the circuit board 10 to reduce the signal loss of the signal hole; wherein, one circuit board 10 corresponds to one theoretical controlled depth; however, since the actual board thickness H1 at various positions of the circuit board 10 is not necessarily the same, the accuracy of the back drilling based on the same theoretical controlled depth is low, resulting in a decrease in the product qualification rate; for details, see Figure 1 , at the first position A, the second position B and the third position C of the circuit board 10, the actual board thickness H1 of the circuit board 10 gradually decreases. Therefore, if the depth of the back drilling process at the second position B of the circuit board 10 is the theoretical depth, the first position A of the circuit board 10 is further back drilled based on the theoretical depth, and the copper of the through hole segment that does not play any connection or transmission role cannot be completely removed; if the third position C of the circuit board 10 is further back drilled based on the theoretical depth, part of the copper of the through hole segment that plays a connection or transmission role will be removed, thereby affecting the signal connection or transmission; and the prior art uses a ruler to measure the board thickness of the circuit board 10, and it is difficult to obtain the actual board thickness H1 at each drilling position, and it is also impossible to obtain the actual control depth Z at each drilling position. In order to solve this problem, the present application provides a method for manufacturing a circuit board, which can improve the accuracy of the back drilling process, thereby improving the product qualification rate.

[0034] The present application is described in detail below with reference to the accompanying drawings and embodiments.

[0035] See also Figure 2 , Figure 2 This is a flow chart of a method for manufacturing a circuit board provided in one embodiment of the present application; in this embodiment, a method for manufacturing a circuit board is provided, and the method specifically includes:

[0036] Step S11: providing a circuit board.

[0037] The circuit board 10 specifically includes at least one substrate board 101 and a metal layer 102 disposed on at least one surface of the substrate board 101; wherein the substrate board 101 may be a prepreg, and the metal layer 102 may be a copper foil; in a specific embodiment, when the circuit board 10 includes more than three metal layers 102, starting from the side close to the drill bit 21, the first metal layer 102 is defined as the top metal layer, the last metal layer 102 is defined as the bottom metal layer, and the portion between the top metal layer and the bottom metal layer is defined as the substrate. That is, the circuit board 10 includes a substrate, a top metal layer disposed on a first surface of the substrate, and a bottom metal layer disposed on a second surface of the substrate opposite to the first surface. In a specific embodiment, the circuit board 10 includes multiple layers of substrate boards 101 and multiple layers of metal layers 102, for example, three metal layers 102 and two substrate boards 101 are alternately stacked, that is, the topmost layer and the bottommost layer of the circuit board 10 are both metal layers 102.

[0038] Step S12: drilling a hole in the circuit board to form a conductive hole and sensing the height of the drill bit descending when the drill bit contacts the surface of the top metal layer away from the bottom metal layer to obtain a first height; sensing the height of the drill bit descending when the drill bit contacts the surface of the bottom metal layer close to the top metal layer to obtain a second height.

[0039] In the drilling process of the drill bit 21, the first contact of the drill bit 21 with the metal layer of the circuit board 10 is judged as the contact of the drill bit 21 with the top metal layer, and the last contact of the drill bit 21 with the metal layer is judged as the contact of the drill bit 21 with the bottom metal layer.

[0040] In a specific embodiment, step S12 specifically includes: drilling the circuit board 10 to form an opening, and when the drill bit 21 drills down and contacts the surface of the top metal layer of the circuit board 10 away from the bottom metal layer, the detector 22 senses the height value of the drill bit 21 being dropped, so as to obtain a first height Z1; the drill bit 21 continues to drill down, and when the drill bit 21 contacts the surface of the bottom metal layer close to the top metal layer, the detector 22 senses the height value of the drill bit 21 being dropped at this time, so as to obtain a second height Z2, and form a through hole penetrating the first surface and the second surface of the circuit board 10; in a specific embodiment, step S12 also includes forming a conductive layer in the opening to form a conductive hole, so as to connect the various metal layers of the circuit board 10 through the conductive hole; wherein the conductive layer can be formed in the opening by electroplating or copper plating.

[0041] Step S13: obtaining the actual controlled depth of the conductive hole according to the first height, the second height, the theoretical plate thickness and the theoretical controlled depth.

[0042] For details, see Figure 3 , Figure 3 An embodiment of the present application provides Figure 2 Sub-flow chart of step S13 in FIG. 1 ; step S13 specifically includes:

[0043] Step S131: obtaining the actual thickness of the circuit board according to the first height and the second height.

[0044] Specifically, the processor 23 may be used to obtain the actual thickness H1 of the circuit board 10 according to the first height Z1 and the second height Z2 using the following formula (1):

[0045] H1=|Z2-Z1|+h (1)

[0046] Among them, H1 is the actual thickness of the circuit board 10; Z1 is the first height; Z2 is the second height; and h is the thickness of the bottom metal layer.

[0047] In the process of obtaining the actual plate thickness H1, further considering the influence of the thickness of the underlying metal layer on the actual plate thickness H1 data can further improve the accuracy of the actual plate thickness H1 data, thereby further improving the accuracy of the back drilling process.

[0048] Step S132: obtaining the actual controlled depth of the conductive hole based on the actual plate thickness, the theoretical plate thickness and the theoretical controlled depth.

[0049] It can be understood that, in a specific implementation process, each conductive hole on the circuit board 10 has an actual controlled depth Z at a corresponding position.

[0050] In a specific embodiment, the processor 23 can be used to obtain the actual control depth Z of the circuit board 10 according to the actual board thickness H1, the theoretical board thickness, the total thickness of the core board H0 and the theoretical control depth through the following formula (2); wherein the total thickness of the core board H0 is the theoretical thickness below the reference layer of the circuit board 10 for back drilling processing, which can be specifically seen in Figure 1 .

[0051]

[0052] Among them, Z is the actual controlled depth of the conductive hole; H1 is the actual board thickness of the circuit board 10; H2 is the theoretical board thickness of the circuit board 10; H0 is the total thickness of the core board; and Z0 is the theoretical controlled depth of the circuit board 10.

[0053] In the above-mentioned process of sensing the first height Z1 and the second height Z2 by the drill bit 21 during the first drilling process to obtain the actual board thickness H1 of the circuit board 10, not only will the production time of the circuit board 10 not be prolonged, but also compared with the solution of directly measuring the board thickness of the circuit board 10, it can effectively improve the measurement accuracy of the actual board thickness H1 of the circuit board 10, so as to improve the accuracy of the actual control depth Z obtained, so that in the process of back-drilling the circuit board 10 based on the actual control depth Z, the accuracy of the back-drilling process can be greatly improved, thereby not only reducing the signal loss of the signal hole, but also effectively improving the product yield.

[0054] In another specific embodiment, in order to further improve the accuracy of the actual control depth Z data obtained, step S13 further compensates the actual control depth Z obtained in the above specific embodiment based on the compensation parameter k; wherein the compensation parameter k is one or more of the thickness of the aluminum plate used when back-drilling the circuit board 10, the angle between the drill tip of the drill bit 21 and the horizontal plane, the safety distance, the thickness of the graphic electroplated copper of the circuit board 10, and the thickness of the solder mask ink of the circuit board 10.

[0055] Specifically, in this embodiment, step S13 specifically includes the processor 23 obtaining the compensation parameter k of the circuit board 10; then the processor 23 obtains the actual controlled depth Z of the conductive hole according to the actual board thickness H1, the theoretical board thickness, the theoretical controlled depth and the compensation parameter k through the following formula (3):

[0056]

[0057] Among them, Z is the actual controlled depth of the conductive hole; H1 is the actual board thickness of the circuit board 10; H2 is the theoretical board thickness of the circuit board 10; H0 is the total thickness of the core board; Z0 is the theoretical controlled depth of the circuit board 10; k is the compensation parameter k of the circuit board 10. It can be understood that when there are multiple supplementary parameters, the k value is the sum of the multiple supplementary parameters.

[0058] Of course, in another embodiment, step S13 can specifically use the processor 23 to obtain the actual controlled depth Z of the current conductive hole of the circuit board 10 according to the actual board thickness H1, the theoretical board thickness, the theoretical controlled depth and the compensation parameter k through the following formula (4):

[0059]

[0060] Among them, Z is the actual controlled depth of the conductive hole; H1 is the actual board thickness of the circuit board 10; H2 is the theoretical board thickness of the circuit board 10; Z0 is the theoretical controlled depth of the circuit board 10; and k is the compensation parameter of the circuit board 10.

[0061] Step S14: back-drilling the current conductive hole of the circuit board based on the actual controlled depth.

[0062] Specifically, the specific implementation process of step S14 is the same or similar to the specific implementation process of back drilling processing in the prior art, and can achieve the same or similar technical effects. For details, please refer to the prior art and will not be repeated here.

[0063] The method for manufacturing a circuit board provided in the present embodiment senses the height value of the drill bit 21 descending when the drill bit 21 drills down and contacts the surface of the top metal layer of the circuit board 10 away from the bottom metal layer during the drilling process to obtain a first height Z1; senses the height value of the drill bit 21 descending when the drill bit 21 contacts the surface of the bottom metal layer close to the top metal layer to obtain a second height Z2, and then obtains the actual controlled depth Z of the conductive hole currently drilled in the circuit board 10 according to the obtained first height Z1, second height Z2, theoretical board thickness and theoretical controlled depth. Compared with the scheme in the prior art of obtaining the actual controlled depth Z by measuring board thickness data, theoretical board thickness and theoretical controlled depth, the actual controlled depth Z of the conductive hole currently drilled in the circuit board 10 has a higher accuracy, so that in the process of back-drilling the circuit board 10 based on the actual controlled depth Z, the accuracy of the back-drilling process can be greatly improved, thereby not only reducing the signal loss of the signal hole, but also effectively improving the product yield.

[0064] See also Figure 4 , Figure 4 A schematic diagram of the structure of a circuit board drilling device provided in an embodiment of the present application. In this embodiment, a circuit board drilling device 20 is provided, wherein the specific structure of the circuit board 10 can be referred to the above-mentioned related text description, which will not be repeated here; the drilling device 20 can be used to execute the method involved in the above-mentioned embodiment; specifically, the circuit board drilling device 20 includes a drill bit 21, a detector 22 and a processor 23.

[0065] Among them, the drill bit 21 is used to drill holes in the circuit board 10 to form conductive holes, and to achieve electrical connection with the metal layer 102 when in contact with the metal layer 102 on the circuit board 10; specifically, other specific structures and functions of the drill bit 21 are the same or similar to the structures and functions of the drill bits used for drilling holes in the circuit board 10 in the prior art, and can achieve the same or similar technical effects. For details, please refer to the prior art and will not be repeated here.

[0066] The detector 22 is connected to the drill bit 21 and is used to obtain a first height Z1 at which the drill bit 21 contacts the top metal layer and a second height Z2 at which the drill bit 21 contacts the bottom metal layer.

[0067] Specifically, during the drilling process of the drill bit 21, the detector 22 senses the height value of the drill bit 21 when the drill bit 21 drills down and contacts the surface of the top metal layer away from the bottom metal layer, so as to obtain a first height Z1; and senses the height value of the drill bit 21 when the drill bit 21 contacts the surface of the bottom metal layer close to the top metal layer, so as to obtain a second height Z2.

[0068] The processor 23 is connected to the detector 22 and is used to obtain the actual controlled depth Z of the circuit board 10 according to the first height Z1, the second height Z2, the theoretical board thickness and the theoretical controlled depth.

[0069] Specifically, the processor 23 is specifically used to obtain the actual thickness H1 of the circuit board 10 according to the first height Z1 and the second height Z2; then, based on the actual thickness H1, the theoretical thickness and the theoretical control depth, the actual control depth Z of the circuit board 10 is obtained, so that in the process of back-drilling the circuit board 10, the processing device 20 of the circuit board 10 can perform back-drilling based on the actual control depth Z. Among them, since the device 20 can directly obtain the actual thickness H1 data of the circuit board 10 during the drilling process, it will not only not prolong the production time of the circuit board 10, but also, compared with the solution of directly measuring the thickness of the circuit board 10, it can effectively improve the measurement accuracy of the actual thickness H1 of the circuit board 10, so as to improve the accuracy of the actual control depth Z obtained, so that in the later process of back-drilling the circuit board 10 using the device 20 based on the actual control depth Z, the accuracy of the back-drilling can be greatly improved, thereby not only reducing the signal loss of the signal hole on the circuit board 10, but also effectively improving the product yield.

[0070] Specifically, the processor 23 may obtain the actual thickness H1 of the circuit board 10 according to the first height Z1 and the second height Z2 by using the following formula (1):

[0071] H1=|Z1-Z2|+h (1)

[0072] Wherein, H1 is the actual thickness of the circuit board 10; Z1 is the first height; Z2 is the second height; and h is the thickness of the bottom metal layer.

[0073] By further considering the influence of the thickness of the underlying metal layer on the actual plate thickness H1 data, the accuracy of the actual plate thickness H1 data can be further improved, thereby further improving the accuracy of the back drilling process.

[0074] In a specific embodiment, the processor 23 can obtain the actual controlled depth Z of the circuit board 10 according to the actual board thickness H1, the theoretical board thickness and the theoretical controlled depth through the following formula (2):

[0075]

[0076] Among them, Z is the actual controlled depth of the conductive hole; H1 is the actual board thickness of the circuit board 10; H2 is the theoretical board thickness of the circuit board 10; H0 is the total thickness of the core board; and Z0 is the theoretical controlled depth of the circuit board 10.

[0077] In another specific embodiment, in order to further improve the accuracy of the actual control depth Z data obtained, the processor 23 can obtain the actual control depth Z of the circuit board 10 according to the actual board thickness H1, the theoretical board thickness, the theoretical control depth and the compensation parameter k through the following formula (3): wherein the compensation parameter k is one or more of the thickness of the aluminum plate used when back-drilling the circuit board 10, the angle between the drill tip of the drill bit 21 and the horizontal plane, the safety distance, the thickness of the graphic electroplated copper of the circuit board 10, and the thickness of the solder mask ink of the circuit board 10.

[0078]

[0079] Among them, Z is the actual controlled depth of the conductive hole; H1 is the actual board thickness of the circuit board 10; H2 is the theoretical board thickness of the circuit board 10; H0 is the total thickness of the core board; Z0 is the theoretical controlled depth of the circuit board 10; and k is the compensation parameter of the circuit board 10.

[0080] Of course, in other embodiments, the processor 23 can also obtain the actual controlled depth Z of the current conductive hole of the circuit board 10 according to the actual board thickness H1, theoretical board thickness, theoretical controlled depth and compensation parameter k through the above formula (4), see above for details.

[0081] The improved circuit board processing device 20 of the present embodiment is provided with a drill bit 21, so as to use the drill bit 21 to drill holes in the circuit board 10 and realize electrical connection with the metal layer on the circuit board 10 when contacting the metal layer; at the same time, a detector 22 is provided and the detector 22 is connected to the drill bit 21, so as to obtain the first height Z1 of the drill bit 21 when the drill bit 21 contacts the top metal layer and the second height Z2 of the drill bit 21 when the drill bit 21 contacts the bottom metal layer through the detector 22; in addition, a processor 23 connected to the detector 22 is provided, so as to obtain the actual controlled depth Z of the circuit board 10 according to the first height Z1, the second height Z2, the theoretical board thickness and the theoretical controlled depth through the processor 23. Since the device 20 can directly obtain the actual board thickness H1 data of the circuit board 10 during the drilling process, not only will the production time of the circuit board 10 not be prolonged, but compared with the solution of directly measuring the board thickness of the circuit board 10, the measurement accuracy of the actual board thickness H1 of the current conductive hole of the circuit board 10 can be effectively improved, so as to improve the accuracy of the actual control depth Z of the current conductive hole obtained, so that in the later process of back-drilling the current conductive hole of the circuit board 10 using the device 20 based on the actual control depth Z, the accuracy of the back-drilling process can be greatly improved, thereby not only reducing the signal loss of the signal hole on the circuit board 10, but also effectively improving the product yield.

[0082] The above are only implementation methods of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A method for manufacturing a circuit board, characterized in that: include: A circuit board is provided; wherein the circuit board comprises a substrate, a top metal layer arranged on a first surface of the substrate, and a bottom metal layer arranged on a second surface opposite to the first surface; Drilling the circuit board to form a conductive hole and sensing the height of the drill bit descending when the drill bit contacts the surface of the top metal layer away from the bottom metal layer to obtain a first height; sensing the height of the drill bit descending when the drill bit contacts the surface of the bottom metal layer close to the top metal layer to obtain a second height; Obtaining an actual controlled depth of the conductive hole according to the first height, the second height, the theoretical plate thickness, and the theoretical controlled depth; Performing back drilling on the current conductive hole of the circuit board based on the actual controlled depth; The step of obtaining the actual controlled depth of the conductive hole according to the first height, the second height, the theoretical plate thickness and the theoretical controlled depth specifically includes: Acquire the actual thickness of the circuit board according to the first height and the second height; Obtaining the actual controlled depth of the conductive hole based on the actual plate thickness, the theoretical plate thickness and the theoretical controlled depth; The step of obtaining the actual controlled depth of the conductive hole based on the actual plate thickness, the theoretical plate thickness and the theoretical controlled depth specifically includes: Obtaining compensation parameters of the circuit board; The actual controlled depth of the conductive hole is obtained according to the actual plate thickness, theoretical plate thickness, theoretical controlled depth and the compensation parameter through the following formula (3): （3） Wherein, Z is the actual controlled depth of the conductive hole; H1 is the actual board thickness of the circuit board; H2 is the theoretical board thickness of the circuit board; H0 is the total thickness of the core board; Z0 is the theoretical controlled depth of the circuit board; k is the compensation parameter of the circuit board; The compensation parameters are one or more of the thickness of the aluminum plate used when back-drilling the circuit board, the angle between the drill tip of the drill bit and the horizontal plane, the safety distance, the thickness of the patterned electroplated copper of the circuit board, and the thickness of the solder mask ink of the circuit board.

2. A circuit board drilling device, characterized in that: The circuit board comprises a substrate, a top metal layer arranged on a first surface of the substrate, and a bottom metal layer arranged on a second surface opposite to the first surface; the device comprises: A drill bit, used for drilling holes in the circuit board to form conductive holes, and achieving electrical connection with the metal layer on the circuit board when in contact with the metal layer; a detector connected to the drill bit, and used to sense the height of the drill bit when the drill bit contacts the surface of the top metal layer away from the bottom metal layer, so as to obtain a first height; and sense the height of the drill bit when the drill bit contacts the surface of the bottom metal layer close to the top metal layer, so as to obtain a second height; A processor connected to the detector, and configured to obtain an actual controlled depth of the circuit board according to the first height, the second height, the theoretical board thickness, and the theoretical controlled depth; The processor is specifically configured to obtain the actual board thickness of the circuit board according to the first height and the second height; and obtain the actual controlled depth of the conductive hole based on the actual board thickness, the theoretical board thickness and the theoretical controlled depth; The processor is specifically configured to obtain the actual controlled depth of the circuit board according to the actual board thickness, the theoretical board thickness, the theoretical controlled depth and the compensation parameter of the circuit board through the following formula (3): （3） Wherein, Z is the actual controlled depth of the circuit board; H1 is the actual board thickness of the circuit board; H2 is the theoretical board thickness of the circuit board; Z0 is the theoretical board thickness of the circuit board; H0 is the total thickness of the core board; k is the compensation parameter of the circuit board; The compensation parameters are one or more of the thickness of the aluminum plate used when back-drilling the circuit board, the angle between the drill tip of the drill bit and the horizontal plane, the safety distance, the thickness of the patterned electroplated copper of the circuit board, and the thickness of the solder mask ink of the circuit board.

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