Multi-component refrigeration cycle device

Abstract

Provided is a multiple refrigeration cycle device that can reduce the installation area of equipment installed in a subsidiary room and can shorten a pipe for transferring a cooling medium to a semiconductor device manufacturing device. A multiple refrigeration cycle device (2) includes a first refrigeration cycle (5) for a first refrigerant that exchanges heat with a cooling medium for cooling a semiconductor device manufacturing device (1), and a second refrigeration cycle (6) for a second refrigerant that exchanges heat with the first refrigerant. At least a portion of the first refrigeration cycle (5) is disposed in a clean room in which the semiconductor device manufacturing device (1) is installed, and the second refrigeration cycle (6) is disposed in a subsidiary room.

Description

Technical Field

[0001] This invention relates to a multi-stage refrigeration cycle apparatus comprising a low-temperature side refrigeration cycle and a high-temperature side refrigeration cycle, and more particularly to a multi-stage refrigeration cycle apparatus used in the cooling of semiconductor device manufacturing apparatuses such as etching apparatuses. Background Technology

[0002] To expand memory capacity, layering is continuously being advanced as a technological innovation in 3D-NAND. However, the increased processing time required for etching due to layering has led to a decrease in throughput. Cooling the etching chamber to a low temperature of approximately -30°C to -120°C is effective in shortening etching time and improving throughput.

[0003] Therefore, in order to achieve low temperatures of around -30℃ to -120℃, refrigeration devices such as binary refrigeration cycle devices have been used since the beginning of the year, and these devices have been commercialized by many companies.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2012-193908

[0007] Patent Document 2: Japanese Patent Application Publication No. 2013-64559

[0008] Patent Document 3: International Publication No. 2012 / 128229 Summary of the Invention

[0009] However, in these binary refrigeration cycle systems, the number of devices increases compared to single-stage refrigeration cycle systems, and the piping connecting these devices also increases, inevitably leading to a larger overall size of the system. This is a typical setup for semiconductor device manufacturing equipment, such as... Figure 10 As shown, the process chambers responsible for semiconductor device processing (e.g., the processing chambers of the etching apparatus) are located in the clean room, while the binary cooling cycle device that cools the process chambers is located in a different area from the clean room, namely the sub-fabrication area where various peripheral equipment is located, commonly referred to as the sub-fabrication area.

[0010] In most cases, cleanrooms and auxiliary rooms are located on different floors, and the floor space of equipment in the auxiliary room should generally not exceed the floor space of the semiconductor device manufacturing equipment upstairs. Furthermore, multiple devices are located in the auxiliary room, making minimizing the floor space a fundamental issue for all types of equipment. However, the number of layers in the stacked structure of semiconductor device manufacturing equipment is increasing, and consequently, it is anticipated that binary refrigeration cycle systems will become larger in the future.

[0011] In addition to the problems mentioned above, the piping used to transport cryogenic cooling media needs to be covered with insulation material of appropriate thickness for preventing condensation and providing thermal insulation, increasing the labor and cost of construction. Moreover, not only is space required for such piping over long distances from the auxiliary room to the cleanroom, but the longer the piping, the easier it is for the temperature of the surrounding gas to be transferred to the cooling medium inside the piping (resulting in reduced cooling efficiency).

[0012] Furthermore, the temperature of the cooling medium used in semiconductor device manufacturing equipment varies significantly depending on the process, and correspondingly, the temperature of the refrigerant in the cooling system is also prone to fluctuation. As a result, there are situations where the operation of the cooling system becomes unstable and fails to properly cool the semiconductor device manufacturing equipment.

[0013] Therefore, the present invention provides a multi-element refrigeration cycle device that can reduce the installation area of ​​equipment in the auxiliary room and shorten the piping used to transfer cooling medium to the semiconductor device manufacturing apparatus.

[0014] In addition, the present invention provides a multi-stage cooling cycle device that can achieve stable operation and properly cool a semiconductor device manufacturing apparatus.

[0015] In one embodiment, a multi-stage refrigeration cycle apparatus is provided for cooling a semiconductor device manufacturing apparatus, comprising: a first refrigeration cycle for supplying a first refrigerant, the first refrigerant exchanging heat with a cooling medium for cooling the semiconductor device manufacturing apparatus; and a second refrigeration cycle for supplying a second refrigerant, the second refrigerant exchanging heat with the first refrigerant, at least a portion of the first refrigeration cycle being disposed in a cleanroom housing the semiconductor device manufacturing apparatus, and the second refrigeration cycle being disposed in an auxiliary room.

[0016] According to the present invention, the constituent elements of the multi-element refrigeration cycle device are divided into two parts and respectively arranged in a clean room and an auxiliary room, thereby reducing the installation area of ​​the equipment installed in the auxiliary room.

[0017] Furthermore, since at least a portion of the first refrigeration cycle is located within a cleanroom, the cooling piping used to transfer the cryogenic cooling medium from the first refrigeration cycle to the semiconductor device manufacturing apparatus (e.g., the processing chamber of an etching apparatus) can be shortened. As a result, the space required for cooling piping can be reduced, and cooling efficiency is improved.

[0018] In one embodiment, the first refrigeration cycle is configured entirely within the cleanroom.

[0019] According to the present invention, the installation area in the auxiliary room can be further reduced.

[0020] In one embodiment, the first refrigeration cycle includes: a first evaporator configured to exchange heat between the cooling medium and the first refrigerant to generate a gaseous first refrigerant; a first compressor configured to compress the gaseous first refrigerant; a first condenser configured to condense the compressed gaseous first refrigerant to generate a liquid first refrigerant; and a first expansion mechanism disposed between the first condenser and the first evaporator to reduce the pressure and temperature of the first refrigerant. The first evaporator and the first expansion mechanism are disposed in the cleanroom, and the first compressor and the first condenser are disposed in the auxiliary room.

[0021] According to the present invention, the first compressor and the first condenser are arranged in the auxiliary room downstairs, and the first evaporator and the first expansion mechanism are arranged in the clean room upstairs. Therefore, the lubricating oil leaking from the first compressor into the first refrigerant will not remain in the first evaporator, and can be returned to the first compressor under its gravity.

[0022] In one embodiment, the aforementioned multi-stage refrigeration cycle apparatus further comprises an intermediate medium circulation pipe for circulating an intermediate medium between the first refrigeration cycle and the second refrigeration cycle, the intermediate medium circulation pipe extending between the first refrigeration cycle and the second refrigeration cycle.

[0023] According to the present invention, the first refrigerant of the first refrigeration cycle and the second refrigerant of the second refrigeration cycle exchange heat via an intermediate medium. For the intermediate medium, as long as the heat from the first refrigerant can be transferred to the second refrigerant, a fluid that is easier to handle than the first and second refrigerants can be used. Therefore, flexible piping such as resin pipes can be used for the intermediate medium circulation pipe. As a result, manufacturing costs can be reduced, and the configuration freedom of the first and second refrigeration cycles is increased. Since the temperature of the intermediate medium (e.g., 0°C to -80°C) is higher than the temperature of the cooling medium (e.g., -30°C to -120°C), the insulation material covering the intermediate medium circulation pipe can be simpler compared to the insulation material covering the cooling piping.

[0024] Furthermore, the intermediate medium, due to its heat capacity corresponding to its volume, also functions as a thermal buffer between the first and second refrigerants. Typically, the temperature of the cooling medium used in the cooling of a semiconductor device manufacturing apparatus fluctuates, and correspondingly, the temperature of the first refrigerant also tends to fluctuate. Because the intermediate medium can absorb such temperature fluctuations of the first refrigerant, it can stabilize the operation of the multi-stage refrigeration cycle apparatus. As a result, the multi-stage refrigeration cycle apparatus can supply a cooling medium at a stable temperature to the semiconductor device manufacturing apparatus.

[0025] In one embodiment, the aforementioned multi-element refrigeration cycle device also includes a buffer tank connected to the aforementioned intermediate medium circulation pipeline.

[0026] According to the present invention, the heat capacity of the intermediate medium can be increased, and the operation of the multi-stage refrigeration cycle device can be further stabilized.

[0027] In one embodiment, the intermediate medium is a refrigerant (antifreeze).

[0028] According to the present invention, inexpensive piping with flexibility, such as resin pipes, can be used for intermediate medium circulation pipelines. As a result, manufacturing costs can be reduced, and the flexibility in configuring the first and second refrigeration cycles is increased.

[0029] In one embodiment, the aforementioned multi-stage refrigeration cycle device further includes a cascaded condenser for heat exchange between the first refrigerant and the second refrigerant.

[0030] According to the present invention, since the condenser of the first refrigeration cycle in the cascaded condenser also serves as the evaporator of the second refrigeration cycle, the number of heat exchangers can be reduced, and the installation area of ​​the multi-stage refrigeration cycle device can be reduced.

[0031] In one embodiment, the first refrigeration cycle comprises: a first evaporator configured to exchange heat between the cooling medium and the first refrigerant to generate a gaseous first refrigerant; a first compressor configured to compress the gaseous first refrigerant; a first condenser configured to condense the compressed gaseous first refrigerant to generate a liquid first refrigerant; and a heat exchanger disposed between the first compressor and the first condenser for cooling the compressed gaseous first refrigerant.

[0032] According to the present invention, since the first refrigerant in the gaseous phase is pre-cooled before entering the first condenser, the required cooling heat in the first condenser is reduced. That is, since the cooling heat is reduced due to the use of an intermediate medium, the cooling capacity required for the second refrigeration cycle can be smaller. This results in a reduction in the power consumption of the second refrigeration cycle, which in turn improves the operating efficiency of the multi-stage refrigeration cycle device. In addition, since the cooling capacity of the second refrigeration cycle can be reduced, the installation area of ​​the equipment can be reduced. Moreover, the cooling water or refrigerant (antifreeze) used in cooling is discharged from the heat exchanger after being heated, so it can be used for other purposes requiring heating, and the power consumption for heating can also be reduced.

[0033] In one embodiment, a multi-stage refrigeration cycle apparatus is provided for cooling a semiconductor device manufacturing apparatus, comprising: a first refrigeration cycle for circulating a first refrigerant, the first refrigerant exchanging heat with a cooling medium for cooling the semiconductor device manufacturing apparatus; a second refrigeration cycle for circulating a second refrigerant, the second refrigerant exchanging heat with the first refrigerant; and an intermediate medium circulation pipe for circulating an intermediate medium between the first refrigeration cycle and the second refrigeration cycle.

[0034] In one embodiment, the intermediate medium circulation pipe extends between the condenser of the first refrigeration cycle and the evaporator of the second refrigeration cycle.

[0035] In one embodiment, the aforementioned multi-element refrigeration cycle device also includes a buffer tank connected to the aforementioned intermediate medium circulation pipeline.

[0036] In one embodiment, the intermediate medium is a refrigerant (antifreeze).

[0037] Invention Effects

[0038] According to the present invention, the installation area of ​​equipment installed in the auxiliary room can be reduced, the piping for transferring cooling medium to the semiconductor device manufacturing apparatus can be shortened, the space required for cooling piping can be reduced, and the cooling efficiency can be improved.

[0039] According to the present invention, the intermediate medium can absorb temperature fluctuations of the cooling medium after its use in the cooling of the semiconductor device manufacturing apparatus, thereby stabilizing the operation of the multi-stage refrigeration cycle apparatus. As a result, the multi-stage refrigeration cycle apparatus can supply a cooling medium at a stable temperature to the semiconductor device manufacturing apparatus, thereby properly cooling the semiconductor device manufacturing apparatus. Attached Figure Description

[0040] Figure 1 This is a schematic diagram illustrating one embodiment of a multi-stage cooling cycle apparatus for cooling semiconductor device manufacturing equipment.

[0041] Figure 2 This is a schematic diagram showing the detailed structure of one embodiment of a multi-stage refrigeration cycle device.

[0042] Figure 3 This is a schematic diagram showing the detailed construction of other embodiments of the multi-element refrigeration cycle device.

[0043] Figure 4 This is a schematic diagram showing the detailed construction of another embodiment of the multi-element refrigeration cycle device.

[0044] Figure 5 This is a schematic diagram showing the detailed construction of another embodiment of the multi-element refrigeration cycle device.

[0045] Figure 6 This is a schematic diagram showing the detailed construction of another embodiment of the multi-element refrigeration cycle device.

[0046] Figure 7 This is a schematic diagram showing the detailed structure of one embodiment of a multi-stage refrigeration cycle device.

[0047] Figure 8 This is a schematic diagram showing the detailed construction of other embodiments of the multi-element refrigeration cycle device.

[0048] Figure 9 This is a schematic diagram illustrating one embodiment of the configuration of a multi-stage refrigeration cycle device.

[0049] Figure 10 This is a schematic diagram illustrating the conventional configuration of a semiconductor device manufacturing apparatus and a multi-stage refrigeration cycle apparatus. Detailed Implementation

[0050] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. Figure 1 This is a schematic diagram illustrating one embodiment of a multi-stage cooling cycle apparatus for cooling a semiconductor device manufacturing device. Figure 1 In the illustrated embodiment, the semiconductor device manufacturing apparatus 1 is an etching apparatus equipped with a processing chamber. The semiconductor device manufacturing apparatus 1 is disposed within a cleanroom, and a portion of the multi-stage cooling cycle unit 2 is disposed in an auxiliary room located below the cleanroom. The cleanroom is on the upper floor, and the auxiliary room is on the lower floor.

[0051] The multi-stage cooling cycle device 2 is connected to the semiconductor device manufacturing apparatus 1 via cooling piping 3. The multi-stage cooling cycle device 2 supplies cooling medium to the semiconductor device manufacturing apparatus 1 (e.g., the processing chamber of an etching apparatus) via cooling piping 3, thereby cooling the semiconductor device manufacturing apparatus 1. The cooling medium circulates between the semiconductor device manufacturing apparatus 1 and the multi-stage cooling cycle device 2. That is, the low-temperature (e.g., -30°C to -120°C) cooling medium generated by the multi-stage cooling cycle device 2 is supplied to the semiconductor device manufacturing apparatus 1 via cooling piping 3, and the cooling medium used in the cooling of the semiconductor device manufacturing apparatus 1 is returned to the multi-stage cooling cycle device 2 via cooling piping 3.

[0052] The multi-stage refrigeration cycle device 2 includes a first refrigeration cycle 5, which provides a first refrigerant cycle for heat exchange with a cooling medium, and a second refrigeration cycle 6, which provides a second refrigerant cycle for heat exchange with the first refrigerant. Therefore, the multi-stage refrigeration cycle device 2 of this embodiment is a binary refrigeration cycle device. In one embodiment, the multi-stage refrigeration cycle device 2 may also include three or more refrigeration cycles.

[0053] The first refrigeration cycle 5 is entirely housed within the cleanroom, while the second refrigeration cycle 6 is entirely housed in an auxiliary room located below the cleanroom. The cleanroom is equipped with a metal floor 7, such as a grating, and beneath the floor 7 lies an underfloor space 9. This underfloor space 9 is part of the cleanroom. The semiconductor device manufacturing apparatus 1 is mounted on the floor 7, and the first refrigeration cycle 5 is located in the surrounding space of the semiconductor device manufacturing apparatus 1, within the underfloor space 9, and so on.

[0054] According to this embodiment, since the first refrigeration cycle 5 and the second refrigeration cycle 6, which are components of the multi-stage refrigeration cycle device 2, are respectively arranged in a cleanroom and an auxiliary room, the installation area of ​​the equipment installed in the auxiliary room can be reduced. Furthermore, since the first refrigeration cycle 5 is arranged in a cleanroom, the cooling piping 3 used to transfer the ultra-low temperature cooling medium from the first refrigeration cycle 5 to the semiconductor device manufacturing apparatus 1 (e.g., the processing chamber of an etching apparatus) can be shortened. As a result, the space required for the cooling piping 3 can be reduced, and the cooling efficiency is improved.

[0055] Figure 2 This is a schematic diagram showing the detailed structure of one embodiment of the multi-element refrigeration cycle device 2. (Example) Figure 2As shown, the first refrigeration cycle 5 includes a first evaporator 11 for evaporating a liquid first refrigerant (refrigerant liquid) to generate a gaseous first refrigerant (refrigerant gas), a first compressor 12 for compressing the gaseous first refrigerant, and a first condenser 14 for condensing the compressed gaseous first refrigerant to generate a liquid first refrigerant. The first evaporator 11, the first compressor 12, and the first condenser 14 are connected by a first refrigerant piping 16. The first refrigerant circulates in the first evaporator 11, the first compressor 12, and the first condenser 14 through the first refrigerant piping 16.

[0056] The first refrigeration cycle 5 also includes a first expansion valve 17, which serves as a first expansion mechanism, located between the first evaporator 11 and the first condenser 14. The first expansion valve 17 is installed on the portion of the first refrigerant piping 16 extending between the first evaporator 11 and the first condenser 14. The first refrigerant flowing from the first condenser 14 to the first evaporator 11 passes through the first expansion valve 17, thereby reducing the pressure and temperature of the first refrigerant. The first refrigerant that has passed through the first expansion valve 17 flows into the first evaporator 11.

[0057] Cooling pipe 3 is connected to the first evaporator 11, where heat exchange occurs between the cooling medium and the first refrigerant. This heat exchange results in the cooling medium being cooled to a low temperature (e.g., -30°C to -120°C), while the first refrigerant is heated by the cooling medium and evaporates into refrigerant gas. The cooled cooling medium is transported through cooling pipe 3 to the semiconductor device manufacturing apparatus 1, and the refrigerant gas is transported through the first refrigerant pipe 16 to the first compressor 12. The first compressor 12 compresses the refrigerant gas and delivers the compressed refrigerant gas to the first condenser 14. In the first condenser 14, as described later, the refrigerant gas condenses into refrigerant liquid.

[0058] The second refrigeration cycle 6 includes a second evaporator 21 for evaporating a liquid second refrigerant (refrigerant liquid) to generate a gaseous second refrigerant (refrigerant gas), a second compressor 22 for compressing the gaseous second refrigerant, and a second condenser 24 for condensing the compressed gaseous second refrigerant to generate a liquid second refrigerant. The second evaporator 21, the second compressor 22, and the second condenser 24 are connected by a second refrigerant piping 26. The second refrigerant circulates in the second evaporator 21, the second compressor 22, and the second condenser 24 through the second refrigerant piping 26.

[0059] The multi-stage refrigeration cycle unit 2 also includes an intermediate medium circulation pipe 31 for circulating an intermediate medium between the first refrigeration cycle 5 and the second refrigeration cycle 6. The intermediate medium circulation pipe 31 is connected to both the first refrigeration cycle 5 and the second refrigeration cycle 6. More specifically, the intermediate medium circulation pipe 31 has a delivery pipe 31A for conveying the intermediate medium from the second evaporator 21 of the second refrigeration cycle 6 to the first condenser 14 of the first refrigeration cycle 5, and a return pipe 31B for returning the intermediate medium from the first condenser 14 of the first refrigeration cycle 5 to the second evaporator 21 of the second refrigeration cycle 6. One end of the delivery pipe 31A is connected to the first condenser 14, and the other end is connected to the second evaporator 21. One end of the return pipe 31B is connected to the first condenser 14, and the other end is connected to the second evaporator 21.

[0060] The intermediate medium circulates between the first condenser 14 of the first refrigeration cycle 5 and the second evaporator 21 of the second refrigeration cycle 6 via the intermediate medium circulation pipe 31. The gaseous first refrigerant (refrigerant gas) exchanges heat with the intermediate medium within the first condenser 14. As a result, the gaseous first refrigerant is cooled by the intermediate medium to become the liquid first refrigerant (refrigerant liquid). The intermediate medium is heated by the first refrigerant, causing its temperature to rise.

[0061] The intermediate medium, heated by the first refrigerant, exchanges heat with the liquid phase of the second refrigerant (refrigerant liquid) within the second evaporator 21. As a result, the liquid phase of the second refrigerant is heated by the intermediate medium to become a gaseous phase of the second refrigerant (refrigerant gas), while the intermediate medium is cooled by the second refrigerant, causing its temperature to decrease. The cooled intermediate medium is then transported to the first condenser 14 of the first refrigeration cycle 5 via the intermediate medium circulation pipe 31. The cooled intermediate medium exchanges heat with the first refrigerant within the first condenser 14. In this way, the intermediate medium circulates between the first condenser 14 of the first refrigeration cycle 5 and the second evaporator 21 of the second refrigeration cycle 6 via the intermediate medium circulation pipe 31. The temperature of the intermediate medium flowing from the second evaporator 21 towards the first condenser 14 is, for example, 0°C to -80°C.

[0062] In the second evaporator 21, the second refrigerant is heated by an intermediate medium and evaporates into refrigerant gas. This refrigerant gas is then transported to the second compressor 22 via the second refrigerant piping 26. The second compressor 22 compresses the refrigerant gas and delivers the compressed refrigerant gas to the second condenser 24. In the second condenser 24, heat exchange occurs between cooling water supplied by a cooling water source (not shown) and the refrigerant gas (the gaseous second refrigerant). As a result, the refrigerant gas condenses into refrigerant liquid.

[0063] As described above, the first refrigerant in the first refrigeration cycle 5 and the second refrigerant in the second refrigeration cycle 6 exchange heat via an intermediate medium. This intermediate medium is a liquid of a different type than the first and second refrigerants. More specifically, the intermediate medium is a refrigerant (antifreeze) such as perfluorocarbon (PFC) liquid or ethylene glycol liquid. Therefore, the intermediate medium remains in the liquid phase and circulates in the intermediate medium circulation pipe 31.

[0064] For the intermediate medium, as long as the heat from the first refrigerant can be transferred to the second refrigerant, a heat transfer fluid (antifreeze) that is easier to handle than the first and second refrigerants can be used. Therefore, for the intermediate medium circulation pipe 31, inexpensive piping with flexibility, such as resin pipes, can be used. As a result, manufacturing costs can be reduced, and the configuration freedom of the first refrigeration cycle 5 and the second refrigeration cycle 6 is increased. In addition, since the temperature of the intermediate medium (e.g., 0°C to -80°C) is higher than the temperature of the cooling medium (e.g., -30°C to -120°C), the insulation material covering the intermediate medium circulation pipe 31 can be simpler compared to the insulation material covering the cooling piping 3.

[0065] Furthermore, the intermediate medium, due to its heat capacity corresponding to its volume, also functions as a thermal buffer between the first and second refrigerants. Typically, the temperature of the cooling medium used in the semiconductor device manufacturing apparatus 1 fluctuates, and correspondingly, the temperature of the first refrigerant also fluctuates. Because the intermediate medium can absorb such temperature fluctuations of the first refrigerant, it can stabilize the operation of the multi-stage refrigeration cycle apparatus 2. As a result, the multi-stage refrigeration cycle apparatus 2 can supply the semiconductor device manufacturing apparatus 1 with a cooling medium at a stable temperature.

[0066] The second refrigeration cycle 6 also includes a second expansion valve 27, which serves as a second expansion mechanism, located between the second evaporator 21 and the second condenser 24. The second expansion valve 27 is installed on the portion of the second refrigerant piping 26 extending between the second evaporator 21 and the second condenser 24. The second refrigerant flowing from the second condenser 24 to the second evaporator 21 passes through the second expansion valve 27, thereby reducing the pressure and temperature of the second refrigerant. The second refrigerant that has passed through the second expansion valve 27 flows into the second evaporator 21.

[0067] Figure 3 This is a schematic diagram showing the detailed structure of another embodiment of the multi-element refrigeration cycle device 2. Structures and operations not specifically described in this embodiment are referenced elsewhere. Figure 1 and Figure 2 The implementation methods described are the same, therefore repeated descriptions are omitted. Figure 3In the illustrated embodiment, a portion of the first refrigeration cycle 5 is disposed in a cleanroom, while the remaining portions of the first refrigeration cycle 5 are disposed in an auxiliary room. In this embodiment, the first evaporator 11 and the first expansion valve 17 are disposed in the cleanroom, while the first compressor 12 and the first condenser 14 are disposed in the auxiliary room. The intermediate medium circulation pipeline 31 is also entirely disposed in the auxiliary room.

[0068] This embodiment is advantageous when the cleanroom area is small. Furthermore, according to this embodiment, the first compressor 12 and the first condenser 14 are arranged in the auxiliary room downstairs, while the first evaporator 11 is arranged in the cleanroom upstairs. Therefore, lubricating oil leaking from the first compressor 12 into the first refrigerant will not remain in the first evaporator 11, and can return to the first compressor 12 under gravity. Additionally, in the first refrigeration cycle 5, by arranging the first evaporator 11 and the first expansion valve 17, which are components that become colder, in the cleanroom, the cooling piping 3 used to transfer the cooling medium from the first refrigeration cycle 5 to the semiconductor device manufacturing apparatus 1 can be shortened.

[0069] like Figure 4 As shown, in one embodiment, the multi-stage refrigeration cycle device 2 may also include a buffer tank 32 connected to the intermediate medium circulation pipe 31. Figure 4 In the illustrated embodiment, the buffer tank 32 is connected to a return pipe 31B for returning the intermediate medium from the first condenser 14 of the first refrigeration cycle 5 to the second evaporator 21 of the second refrigeration cycle 6. The buffer tank 32 is disposed in an auxiliary room with sufficient space. The intermediate medium exiting from the first condenser 14 of the first refrigeration cycle 5 is temporarily stored in the buffer tank 32, and then returned from the buffer tank 32 to the second evaporator 21 of the second refrigeration cycle 6.

[0070] According to this embodiment, since the volume of the intermediate medium can be increased accordingly to the volume of the buffer tank 32, the heat capacity of the intermediate medium is increased, which can further stabilize the operation of the multi-element refrigeration cycle device 2. Figure 4 The buffer box 32 shown can also be assembled into Figure 3 The implementation method.

[0071] Figure 5 This is a schematic diagram showing the detailed structure of another embodiment of the multi-element refrigeration cycle device 2. Structures and operations not specifically described in this embodiment are referenced elsewhere. Figure 2 The implementation methods described are the same, therefore repeated descriptions are omitted. Figure 5In the illustrated embodiment, the condenser of the first refrigeration cycle 5 and the evaporator of the second refrigeration cycle 6 are constituted by a common cascade condenser 40. The cascade condenser 40, which serves as both the condenser of the first refrigeration cycle 5 and the evaporator of the second refrigeration cycle 6, is a heat exchanger and is located in an auxiliary room. In one embodiment, if there is sufficient space in the cleanroom, the first evaporator 11, the first compressor 12, the first expansion valve 17, and the cascade condenser 40 of the first refrigeration cycle 5 can be located within the cleanroom.

[0072] In this embodiment, an intermediate medium circulation pipe 31 is not provided. The first refrigerant pipe 16 of the first refrigeration cycle 5 and the second refrigerant pipe 26 of the second refrigeration cycle 6 are both connected to the cascade condenser 40. The first refrigerant circulating in the first refrigeration cycle 5 and the second refrigerant circulating in the second refrigeration cycle 6 flow through the cascade condenser 40, where heat exchange occurs between the first and second refrigerants. Since the condenser of the first refrigeration cycle 5 in the cascade condenser 40 also serves as the evaporator of the second refrigeration cycle 6, the number of heat exchangers can be reduced, and the installation area of ​​the multi-stage refrigeration cycle device 2 can be decreased.

[0073] Figure 6 This is a schematic diagram showing the detailed structure of another embodiment of the multi-element refrigeration cycle device 2. Structures and operations not specifically described in this embodiment are referenced elsewhere. Figure 2 The implementation method described is the same, so repeated descriptions are omitted. In this embodiment, a heat exchanger 50 is provided between the first compressor 12 and the first condenser 14 in the first refrigeration cycle 5. The heat exchanger 50 is connected to the portion of the first refrigerant piping 16 extending between the first compressor 12 and the first condenser 14. Coolant such as cooling water or a refrigerant (antifreeze) and the compressed gaseous first refrigerant flow in the heat exchanger 50, and heat exchange occurs between the coolant and the gaseous first refrigerant. The gaseous first refrigerant, cooled by heat exchange with the coolant, is introduced into the first condenser 14.

[0074] In this way, since the gaseous first refrigerant is pre-cooled before entering the first condenser 14, the required cooling heat in the first condenser 14 is reduced. That is, since the cooling heat is reduced due to the use of an intermediate medium, the cooling capacity required for the second refrigeration cycle 6 can be smaller. This results in a reduction in the power consumption of the second refrigeration cycle 6, which in turn improves the operating efficiency of the multi-stage refrigeration cycle device 2. In addition, since the cooling capacity of the second refrigeration cycle 6 can be reduced, the installation area of ​​the equipment can be reduced. Moreover, the coolant, such as cooling water or refrigerant (antifreeze), used in the cooling of the gaseous first refrigerant is heated and discharged from the heat exchanger 50, so it can be used for other applications requiring heating, and the power consumption for heating can also be reduced.

[0075] Heat exchanger 50 can also be used as a reference. Figures 3 to 5 The described implementation method. For example, heat exchanger 50 can also be configured in Figure 5 The first compressor 12 shown is located between the cascaded condenser 40.

[0076] Figure 7 This is a schematic diagram showing the detailed structure of one embodiment of the multi-element refrigeration cycle device 102. (See attached diagram.) Figure 7 As shown, the multi-stage cooling cycle device 102 is connected to the semiconductor device manufacturing apparatus 1 via cooling piping 103. The multi-stage cooling cycle device 102 supplies cooling medium to the semiconductor device manufacturing apparatus 1 (e.g., the processing chamber of an etching apparatus) via cooling piping 103, thereby cooling the semiconductor device manufacturing apparatus 1. The cooling medium circulates between the semiconductor device manufacturing apparatus 1 and the multi-stage cooling cycle device 102. That is, the low-temperature (e.g., -30°C to -120°C) cooling medium generated by the multi-stage cooling cycle device 102 is supplied to the semiconductor device manufacturing apparatus 1 via cooling piping 103, and the cooling medium used in the cooling of the semiconductor device manufacturing apparatus 1 is returned to the multi-stage cooling cycle device 102 via cooling piping 103.

[0077] The multi-stage refrigeration cycle device 102 includes a first refrigeration cycle 105 for heat exchange with a first refrigerant cycle and a second refrigeration cycle 106 for heat exchange with the first refrigerant via an intermediate medium. Therefore, the multi-stage refrigeration cycle device 102 of this embodiment is a binary refrigeration cycle device. In one embodiment, the multi-stage refrigeration cycle device 102 may also include three or more refrigeration cycles.

[0078] The first refrigeration cycle 105 includes a first evaporator 111 for evaporating a liquid first refrigerant (refrigerant liquid) to generate a gaseous first refrigerant (refrigerant gas), a first compressor 112 for compressing the gaseous first refrigerant, and a first condenser 114 for condensing the compressed gaseous first refrigerant to generate a liquid first refrigerant. The first evaporator 111, the first compressor 112, and the first condenser 114 are connected by a first refrigerant piping 116. The first refrigerant circulates in the first evaporator 111, the first compressor 112, and the first condenser 114 through the first refrigerant piping 116.

[0079] The first refrigeration cycle 105 also includes a first expansion valve 117, which serves as a first expansion mechanism, located between the first evaporator 111 and the first condenser 114. The first expansion valve 117 is installed on the portion of the first refrigerant piping 116 extending between the first evaporator 111 and the first condenser 114. The first refrigerant flowing from the first condenser 114 to the first evaporator 111 passes through the first expansion valve 117, thereby reducing the pressure and temperature of the first refrigerant. The first refrigerant that has passed through the first expansion valve 117 flows into the first evaporator 111.

[0080] Cooling pipe 103 is connected to the first evaporator 111, where heat exchange occurs between the cooling medium and the first refrigerant. This heat exchange results in the cooling medium being cooled to a low temperature (e.g., -30°C to -120°C), while the first refrigerant is heated by the cooling medium and evaporates into refrigerant gas. The cooled cooling medium is then transported to the semiconductor device manufacturing apparatus 1 via cooling pipe 103, and the refrigerant gas is transported to the first compressor 112 via the first refrigerant pipe 116. The first compressor 112 compresses the refrigerant gas and delivers the compressed refrigerant gas to the first condenser 114. In the first condenser 114, as described later, the refrigerant gas condenses into refrigerant liquid.

[0081] The second refrigeration cycle 106 includes a second evaporator 121 for evaporating a liquid second refrigerant (refrigerant liquid) to generate a gaseous second refrigerant (refrigerant gas), a second compressor 122 for compressing the gaseous second refrigerant, and a second condenser 124 for condensing the compressed gaseous second refrigerant to generate a liquid second refrigerant. The second evaporator 121, the second compressor 122, and the second condenser 124 are connected by a second refrigerant piping 126. The second refrigerant circulates in the second evaporator 121, the second compressor 122, and the second condenser 124 through the second refrigerant piping 126.

[0082] The multi-stage refrigeration cycle device 102 also includes an intermediate medium circulation conduit 131 for circulating an intermediate medium between the first refrigeration cycle 105 and the second refrigeration cycle 106. The intermediate medium circulation conduit 131 is connected to both the first refrigeration cycle 105 and the second refrigeration cycle 106. More specifically, the intermediate medium circulation conduit 131 has a delivery conduit 131A for conveying the intermediate medium from the second evaporator 121 of the second refrigeration cycle 106 to the first condenser 114 of the first refrigeration cycle 105, and a return conduit 131B for returning the intermediate medium from the first condenser 114 of the first refrigeration cycle 105 to the second evaporator 121 of the second refrigeration cycle 106. One end of the delivery conduit 131A is connected to the first condenser 114, and the other end is connected to the second evaporator 121. One end of the return conduit 131B is connected to the first condenser 114, and the other end is connected to the second evaporator 121.

[0083] The intermediate medium circulates between the first condenser 114 of the first refrigeration cycle 105 and the second evaporator 121 of the second refrigeration cycle 106 via the intermediate medium circulation pipe 131. The gaseous first refrigerant (refrigerant gas) exchanges heat with the intermediate medium within the first condenser 114. As a result, the gaseous first refrigerant is cooled by the intermediate medium to become the liquid first refrigerant (refrigerant liquid). The intermediate medium is heated by the first refrigerant, causing its temperature to rise.

[0084] The intermediate medium, heated by the first refrigerant, exchanges heat with the liquid phase of the second refrigerant (refrigerant liquid) within the second evaporator 121. As a result, the liquid phase of the second refrigerant is heated by the intermediate medium to become a gaseous phase of the second refrigerant (refrigerant gas), while the intermediate medium is cooled by the second refrigerant, causing its temperature to decrease. The cooled intermediate medium is then transported to the first condenser 114 of the first refrigeration cycle 105 via the intermediate medium circulation pipe 131. The cooled intermediate medium exchanges heat with the first refrigerant within the first condenser 114. In this way, the intermediate medium circulates between the first condenser 114 of the first refrigeration cycle 105 and the second evaporator 121 of the second refrigeration cycle 106 via the intermediate medium circulation pipe 131. The temperature of the intermediate medium flowing from the second evaporator 121 towards the first condenser 114 is, for example, 0°C to -80°C.

[0085] In the second evaporator 121, the second refrigerant is heated by an intermediate medium and evaporates into refrigerant gas. This refrigerant gas is then transported to the second compressor 122 via the second refrigerant piping 126. The second compressor 122 compresses the refrigerant gas and delivers the compressed refrigerant gas to the second condenser 124. In the second condenser 124, heat exchange occurs between cooling water supplied by a cooling water source (not shown) and the refrigerant gas (the gaseous second refrigerant). As a result, the refrigerant gas condenses into refrigerant liquid.

[0086] As described above, the first refrigerant in the first refrigeration cycle 105 and the second refrigerant in the second refrigeration cycle 106 exchange heat via an intermediate medium. This intermediate medium is a liquid of a different type than the first and second refrigerants. More specifically, the intermediate medium is a refrigerant (antifreeze) such as perfluorocarbon (PFC) liquid or ethylene glycol liquid. Therefore, the intermediate medium remains in a liquid phase and circulates in the intermediate medium circulation pipe 131.

[0087] For the intermediate medium, as long as the heat from the first refrigerant can be transferred to the second refrigerant, a heat transfer fluid (antifreeze) that is easier to handle than the first and second refrigerants can be used. Therefore, for the intermediate medium circulation pipe 131, inexpensive piping with flexibility, such as resin pipes, can be used. As a result, manufacturing costs can be reduced, and the configuration freedom of the first refrigeration cycle 105 and the second refrigeration cycle 106 is increased. In addition, since the temperature of the intermediate medium (e.g., 0°C to -80°C) is higher than the temperature of the cooling medium (e.g., -30°C to -120°C), the insulation material covering the intermediate medium circulation pipe 131 can be simpler compared to the insulation material covering the cooling piping 103.

[0088] Furthermore, the intermediate medium, due to its heat capacity corresponding to its volume, also functions as a thermal buffer between the first and second refrigerants. Typically, the temperature of the cooling medium used in the semiconductor device manufacturing apparatus 1 fluctuates, and correspondingly, the temperature of the first refrigerant also tends to fluctuate. Because the intermediate medium can absorb such temperature fluctuations of the first refrigerant, it can stabilize the operation of the multi-stage refrigeration cycle apparatus 102. As a result, the multi-stage refrigeration cycle apparatus 102 can supply the semiconductor device manufacturing apparatus 1 with a cooling medium at a stable temperature.

[0089] The second refrigeration cycle 106 further includes a second expansion valve 127, which serves as a second expansion mechanism, located between the second evaporator 121 and the second condenser 124. The second expansion valve 127 is installed on the portion of the second refrigerant piping 126 extending between the second evaporator 121 and the second condenser 124. The second refrigerant flowing from the second condenser 124 to the second evaporator 121 passes through the second expansion valve 127, thereby reducing the pressure and temperature of the second refrigerant. The second refrigerant that has passed through the second expansion valve 127 flows into the second evaporator 121.

[0090] like Figure 8 As shown, in one embodiment, the multi-stage refrigeration cycle device 102 may also include a buffer tank 132 connected to the intermediate medium circulation pipe 131. Figure 8 In the illustrated embodiment, the buffer tank 132 is connected to a return pipe 131B for returning the intermediate medium from the first condenser 114 of the first refrigeration cycle 105 to the second evaporator 121 of the second refrigeration cycle 106. The buffer tank 132 is disposed in an auxiliary production room, commonly referred to as the auxiliary room, where there is sufficient space for various peripheral equipment. The intermediate medium exiting from the first condenser 114 of the first refrigeration cycle 105 is temporarily stored in the buffer tank 132 and then returned from the buffer tank 132 to the second evaporator 121 of the second refrigeration cycle 106.

[0091] According to this embodiment, the volume of the intermediate medium increases in proportion to the volume of the buffer tank 132, thereby increasing the heat capacity of the intermediate medium and enabling the operation of the multi-element refrigeration cycle device 102 to be further stabilized.

[0092] Figure 9 This is a schematic diagram illustrating one embodiment of the configuration of a multi-stage cooling cycle device. A semiconductor device manufacturing apparatus 1 (e.g., the processing chamber of an etching apparatus) is disposed within a cleanroom, and a portion of the multi-stage cooling cycle device 102 is disposed in an auxiliary room located below the cleanroom. Typically, the cleanroom is on the upper floor, and the auxiliary room is on the lower floor.

[0093] The first refrigeration cycle 105 is entirely housed within the cleanroom, while the second refrigeration cycle 106 is entirely housed in an auxiliary room located below the cleanroom. The cleanroom is equipped with a metal floor 7, such as a grid panel, and beneath the floor 7 lies an underfloor space 9. This underfloor space 9 is part of the cleanroom. The semiconductor device manufacturing apparatus 1 is mounted on the floor 7, and the first refrigeration cycle 105 is located in the surrounding space of the semiconductor device manufacturing apparatus 1, within the underfloor space 9, and so on.

[0094] Because the intermediate medium circulation pipe 131 can increase the configuration freedom of the first refrigeration cycle 105 and the second refrigeration cycle 106, therefore... Figure 9As shown, the first refrigeration cycle 105 and the second refrigeration cycle 106, which are components of the multi-stage refrigeration cycle device 102, can be arranged in a cleanroom and an auxiliary room, respectively. As a result, the installation area of ​​the equipment installed in the auxiliary room can be reduced. In addition, since the first refrigeration cycle 105 is arranged in a cleanroom, the cooling piping 103 used to transfer the ultra-low temperature cooling medium from the first refrigeration cycle 105 to the semiconductor device manufacturing apparatus 1 (e.g., the processing chamber of the etching apparatus) can be shortened. As a result, the space required for the cooling piping 103 can be reduced, and the cooling efficiency can be improved.

[0095] Furthermore, by providing the intermediate medium circulation pipe 131, a second refrigeration cycle can be connected to multiple first refrigeration cycles. As a result, the installation area of ​​equipment located in the auxiliary room can be reduced, and operating efficiency can also be improved.

[0096] Furthermore, by having an intermediate medium circulation pipe 131, it is relatively easy to add a second refrigeration cycle even after the device has been put into use, and it is also possible to flexibly respond to changes in cooling capacity (increase) and changes in cooling temperature (decrease).

[0097] The above embodiments are described with the aim of enabling those skilled in the art to carry out the present invention. Various modifications of the above embodiments will be readily apparent to those skilled in the art, and the technical concept of the present invention can be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but is interpreted within the maximum scope of the technical concept defined by the claims.

Claims

1. A multi-element cooling cycle device, configured in a cleanroom or auxiliary room housing a semiconductor device manufacturing apparatus, for cooling the semiconductor device manufacturing apparatus, characterized in that, have: A first refrigeration cycle supplying a first refrigerant cycle, wherein the first refrigerant exchanges heat with a cooling medium used to cool the semiconductor device manufacturing apparatus; and A second refrigeration cycle supplies a second refrigerant cycle, wherein the second refrigerant exchanges heat with the first refrigerant. The cleanroom is located on the upper floor, and the auxiliary room is located on the lower floor. The first refrigeration cycle includes: The first evaporator is configured to exchange heat between the cooling medium and the first refrigerant to generate the first refrigerant in a gaseous phase; The first compressor is configured to compress the first refrigerant in the gas phase; A first condenser, configured to condense the compressed gaseous first refrigerant to generate a liquid first refrigerant; and A first expansion mechanism, which is configured between the first condenser and the first evaporator to reduce the pressure and temperature of the first refrigerant, The first evaporator and the first expansion mechanism are disposed in the cleanroom. The first compressor and the first condenser are disposed in the auxiliary room. The second refrigeration cycle is configured in the auxiliary room.

2. The multi-element refrigeration cycle device according to claim 1, characterized in that, The multi-stage refrigeration cycle device also includes an intermediate medium circulation pipe for circulating an intermediate medium between the first refrigeration cycle and the second refrigeration cycle. The intermediate medium circulation pipe extends between the first refrigeration cycle and the second refrigeration cycle.

3. The multi-element refrigeration cycle device according to claim 2, characterized in that, The multi-stage refrigeration cycle device also includes a buffer tank connected to the intermediate medium circulation pipeline.

4. The multi-element refrigeration cycle device according to claim 2, characterized in that, The intermediate medium is antifreeze, which serves as a refrigerant.

5. The multi-element refrigeration cycle device according to claim 1, characterized in that, It also includes a cascaded condenser for heat exchange between the first refrigerant and the second refrigerant.

6. The multi-element refrigeration cycle device according to claim 1, characterized in that, The first refrigeration cycle includes a heat exchanger disposed between the first compressor and the first condenser for cooling the compressed gaseous first refrigerant.

7. A multi-element cooling cycle device, configured in a cleanroom and an auxiliary room housing a semiconductor device manufacturing apparatus, for cooling the semiconductor device manufacturing apparatus, characterized in that, have: A first refrigeration cycle supplying a first refrigerant cycle, wherein the first refrigerant exchanges heat with a cooling medium used to cool the semiconductor device manufacturing apparatus; A second refrigeration cycle that supplies a second refrigerant cycle, wherein the second refrigerant exchanges heat with the first refrigerant; and An intermediate medium circulation pipe is used to circulate the intermediate medium between the first refrigeration cycle and the second refrigeration cycle. The cleanroom is located on the upper floor, and the auxiliary room is located on the lower floor. The first refrigeration cycle includes: The first evaporator is configured to exchange heat between the cooling medium and the first refrigerant to generate the first refrigerant in a gaseous phase; The first compressor is configured to compress the first refrigerant in the gas phase; A first condenser, configured to condense the compressed gaseous first refrigerant to generate a liquid first refrigerant; and A first expansion mechanism, which is configured between the first condenser and the first evaporator to reduce the pressure and temperature of the first refrigerant, The first evaporator and the first expansion mechanism are disposed in the cleanroom. The first compressor and the first condenser are disposed in the auxiliary room. The second refrigeration cycle is configured in the auxiliary room.

8. The multi-element refrigeration cycle device according to claim 7, characterized in that, The intermediate medium circulation pipe extends between the first condenser of the first refrigeration cycle and the evaporator of the second refrigeration cycle.

9. The multi-element refrigeration cycle device according to claim 7, characterized in that, The multi-stage refrigeration cycle device also includes a buffer tank connected to the intermediate medium circulation pipeline.

10. The multi-element refrigeration cycle device according to claim 7, characterized in that, The intermediate medium is antifreeze, which serves as a refrigerant.

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