Magnetic structure and arrangement of inductor path

Abstract

Embodiments of this disclosure relate to the magnetic structure and arrangement of inductor paths. According to one configuration, a manufacturer receives a magnetically conductive material and manufactures a device comprising a multidimensional arrangement of conductive paths extending through the magnetically conductive material. Each conductive path is a corresponding inductor path.

Description

Technical Field

[0001] This disclosure relates to the magnetic structure and arrangement of inductor paths. Background Technology

[0002] Traditional switching power supply circuits sometimes include energy storage components such as inductors to generate an output voltage that supplies power to the load. For example, in order to maintain the magnitude of the output voltage within a desired range, a controller controls the switching of the input current through one or more inductors.

[0003] Typically, a conventional inductor is an assembly comprising wires or other conductive materials shaped into coils or helices to increase the amount of magnetic flux through the corresponding circuit path. Winding the wires into multiple turns of coil increases the number of corresponding magnetic flux lines in the corresponding inductor assembly, thereby increasing the magnetic field and thus increasing the total inductance of the corresponding inductor assembly. Summary of the Invention

[0004] The realization of clean energy (or so-called green technologies) is crucial for reducing our impact on the environment as humans. Generally speaking, clean energy encompasses any evolving methods and materials for reducing the overall environmental toxicity of energy consumption.

[0005] This disclosure includes the observation that raw energy, whether received from green or non-green energy sources, typically needs to be converted into an appropriate form (such as the desired AC voltage, DC voltage, etc.) before it can be used to power terminal devices such as servers, computers, mobile communication devices, wireless base stations, etc. In some instances, the energy is stored in one or more corresponding unit resources. Regardless of whether the energy comes from green or non-green energy sources, it is desirable to utilize the raw energy provided by such systems (such as storage and subsequent distribution) in the most efficient way possible to reduce our environmental impact. This disclosure contributes to reducing our carbon footprint and making better use of energy through more efficient energy conversion.

[0006] For example, this disclosure includes the observation that conventional wire-wound inductor assemblies (such as those used to support power conversion) are typically bulky and therefore undesirable in some applications. Such conventional devices inevitably make it difficult to create compact, efficient, and high-current output power supply circuits.

[0007] The embodiments described herein provide novel and improved inductor assemblies for use in applications such as power conversion. For example, the embodiments herein include novel inductor devices, hardware, corresponding uses, methods of manufacturing them, etc.

[0008] More specifically, the embodiments described herein include the manufacture of devices (such as hardware, apparatus, components, etc.) such as circuit components. In one example embodiment, the manufacturer produces the device to include a magnetically conductive material. The manufacturer further produces the circuit component to include a multidimensional arrangement of conductive paths (inductive paths) extending through the magnetically conductive material, such as from one surface of the circuit component to another. The presence of magnetically conductive material around the conductive path makes the conductive path an inductive path. Therefore, the device discussed herein includes a multidimensional arrangement of inductive paths extending through the magnetically conductive material.

[0009] In another example embodiment, the conductive paths in the multidimensional arrangement of the manufacturer's manufacturing apparatus, as discussed herein, may include a first conductive path and a second conductive path disposed along a first axis. Additionally, the conductive paths in the manufacturer's manufacturing apparatus may include a third conductive path offset relative to the first axis in the multidimensional arrangement.

[0010] Other exemplary embodiments described herein include fabricating a multidimensional arrangement of conductive paths via a fabricator to include a first conductive path and a second conductive path; and fabricating a magnetically conductive material to include one or more cut-off portions to reduce inductive coupling between the first and second conductive paths, wherein the at least one cut-off portion is free of magnetically conductive material.

[0011] In yet another example embodiment, during manufacturing, the manufacturer arranges each conductive path in the conductive path as a single-turn inductor device in a multidimensional arrangement of multiple conductive paths.

[0012] In another example embodiment, the manufacturer creates conductive paths in a multidimensional arrangement to include a first conductive path and a second conductive path. To control the corresponding inductance, the manufacturer manufactures the height of the magnetic material relative to the first conductive path to be different from the height of the magnetic material relative to the second conductive path.

[0013] Further embodiments described herein include manufacturing conductive paths in a multidimensional arrangement via a fabricator in a manner similar to those previously discussed, to include a first conductive path and a second conductive path, and manufacturing the volumetric shape of the magnetically conductive material surrounding the first conductive path differently from the volumetric shape of the magnetically conductive material surrounding the second conductive path. In other words, each cell of the multidimensional arrangement may be sized differently depending on the location of the conductive path in the device.

[0014] Another example embodiment in this document includes manufacturing conductive paths in a multidimensional arrangement via a fabricator to include a first conductive path and a second conductive path; and manufacturing the volumetric shape of a magnetically conductive material surrounding the first conductive path to be different from the volumetric shape of a magnetically conductive material surrounding the second conductive path.

[0015] Further example embodiments described herein include fabricating conductive paths in a multidimensional arrangement, via a fabricator, to include a first conductive path and a second conductive path; and fabricating, in a device (such as a circuit assembly), the cross-sectional area of ​​the first conductive path as observed along the longitudinal axis of the first conductive path to be different from the cross-sectional area of ​​the second conductive path as observed along the longitudinal axis of the second conductive path.

[0016] The apparatus discussed herein can be manufactured from one or more different types of magnetically conductive materials. For example, in one embodiment, the manufacturer produces magnetically conductive materials to include a first magnetically conductive material and a second magnetically conductive material. The first magnetically conductive material has a first permeability; the second magnetically conductive material has a second permeability different from the first permeability.

[0017] Another example embodiment of this document includes, via a fabricator, fabricating conductive paths in a multidimensional arrangement to include a first conductive path, a second conductive path, and a third conductive path; fabricating a multidimensional arrangement to include a first unit residing therein, the first unit being at least partially defined by a first portion of a magnetically conductive material surrounding the first conductive path; fabricating a second unit in a multidimensional arrangement to include a second conductive path residing therein, the second unit being at least partially defined by a second portion of a magnetically conductive material surrounding the first conductive path; and fabricating a third unit in a multidimensional arrangement to include a third conductive path residing therein, the third unit being at least partially defined by a third portion of a magnetically conductive material, the third unit being offset relative to an axis between the first unit and the second unit.

[0018] In one embodiment, the fabricator places one or more cut-out portions between a first and second unit arranged in a multidimensional configuration, wherein no magnetically conductive material is present in the one or more cut-out portions. If desired, in one embodiment, the fabricator fills the cut-out portions with a conductive material or other suitable material, such as other magnetically conductive materials.

[0019] In another example embodiment, each conductive path in the multidimensional arrangement is placed in a corresponding unit of magnetic material; the fabricator encapsulates each corresponding unit with conductive material.

[0020] In yet another example embodiment, the fabricator fabricates a multidimensional arrangement of conductive paths comprising: a first set of conductive paths, each conductive path in the first set being encapsulated by a corresponding portion of a magnetically conductive material to form a first set of units, the first set of units being encapsulated by a first portion of the conductive material; and a second set of conductive paths, each conductive path in the second set being encapsulated by a second portion of a magnetically conductive material to form a second set of units, the second set of units being encapsulated by a second portion of the conductive material.

[0021] Additionally or alternatively, the fabricator fabricates a multidimensional arrangement of conductive paths comprising: a first set of conductive paths; a first set of units, each unit in the first set of units including a conductive path in the first set of conductive paths, each conductive path in the first set of conductive paths being encapsulated by a magnetically conductive material to form a corresponding unit in the first set of units; a first portion of the conductive material encapsulating the first set of units; a second set of conductive paths; a second set of units, each unit in the second set of units including a conductive path in the second set of conductive paths, each conductive path in the second set of conductive paths being encapsulated by a magnetically conductive material to form a corresponding unit in the second set of units; and a second portion of the conductive material encapsulating the second set of units. In one embodiment, the fabricator places a first cut-off portion at the center of the first set of units, in which the magnetically conductive material is not present; the fabricator places a second cut-off portion at the center of the second set of units, in which the magnetically conductive material is not present. In another example embodiment, the fabricator fabricates: i) the diameter of the first conductive path in the first set of conductive paths is greater than the diameter of the second conductive path in the first set of conductive paths; and ii) the diameter of the first conductive path in the second set of conductive paths is greater than the diameter of the second conductive path in the second set of conductive paths.

[0022] In yet another non-limiting example embodiment, the manufacturer: i) arranges a multidimensional arrangement of conductive paths to include a first conductive path and a second conductive path; ii) encapsulates the first conductive path with a first portion of a magnetically conductive material to form a first unit; iii) encapsulates the first conductive path with a first portion of a magnetically conductive material to form a second unit, the second unit being larger than the first unit.

[0023] These and other more specific embodiments are disclosed in more detail below.

[0024] Note that any resources implemented in the system as discussed herein (such as a manufacturer) may include one or more computerized devices, manufacturing apparatus, circuit board assemblers, material processors, controllers, mobile communication devices, handheld or laptop computers, etc., to perform and / or support any or all of the methods disclosed herein. In other words, one or more computerized devices or processors or corresponding apparatuses may be programmed and / or configured to operate as explained herein to perform the different embodiments described herein.

[0025] Further embodiments described herein include software programs for performing the steps and operations summarized above and disclosed in detail below. One such embodiment includes a computer program product comprising a non-transitory computer-readable storage medium (i.e., any computer-readable hardware storage medium) on which software instructions are encoded for subsequent execution. When executed in a computerized device (hardware) having a processor, the instructions program the processor and / or cause the processor (hardware) to perform the operations disclosed herein. Such arrangements are typically provided as firmware disposed or encoded in a non-transitory computer-readable storage medium such as an optical medium (e.g., CD-ROM), floppy disk, hard disk, memory stick, memory device, etc., or as software, code, instructions, and / or other data (e.g., data structures) on other media such as an application-specific integrated circuit (ASIC). Software or firmware or other such configurations may be installed onto a computerized device to cause the computerized device to perform the techniques explained herein.

[0026] Therefore, the embodiments described herein relate to methods, systems, computer program products, etc., that support the operations discussed herein.

[0027] One embodiment includes a manufacturer, such as a computer-readable storage medium and / or system having instructions stored thereon to manufacture an inductor assembly as described herein. When executed by computer processor hardware, the instructions cause the computer processor hardware (such as one or more processor devices or hardware located in the same or different locations) to: receive a magnetically conductive material; and manufacture a multidimensional arrangement of conductive paths extending through the magnetically conductive material, each conductive path being a corresponding inductor path.

[0028] For clarity, the order of the steps above has been added. Note that any processing steps discussed herein can be performed in any suitable order.

[0029] Other embodiments of this disclosure include software programs and / or corresponding hardware to perform any of the method embodiment steps and operations summarized above and disclosed in detail below.

[0030] It should be understood that, as discussed herein, systems, methods, apparatuses, instructions, etc., on computer-readable storage media can also be strictly embodied as software programs, firmware, software, hardware and / or a mixture of firmware, or as hardware alone, such as within a processor (hardware or software), or within an operating system or within a software application.

[0031] It should also be noted that while the embodiments discussed herein are applicable to switching power supplies, the concepts disclosed herein can be advantageously applied to any other suitable topology.

[0032] Furthermore, it should be noted that although each of the different features, techniques, configurations, etc., described herein may be discussed in different places within this disclosure, each concept is intended to be optionally practiced independently of each other or in combination with each other where appropriate. Therefore, one or more of the inventions described herein may be embodied and observed in many different ways.

[0033] Furthermore, please note that the preliminary discussion of the embodiments herein (a brief description of the embodiments) is intentionally not to specify every embodiment and / or incremental novelty aspect of this disclosure or the claimed invention(s). Rather, this brief description only presents the general embodiments and their corresponding points of novelty relative to conventional technology. For additional details and / or possible views (arrangements) of the invention(s), the reader should refer to the detailed description section of this disclosure (which is a summary of the embodiments) and the corresponding drawings discussed further below. Attached Figure Description

[0034] Figure 1A This is an example 3-D diagram of an apparatus including a multidimensional arrangement of conductive paths in circuit components according to embodiments herein.

[0035] Figure 1B This is an example top view of an apparatus including a multidimensional arrangement of conductive paths according to embodiments herein.

[0036] Figure 1C This is an example cross-sectional side view of an apparatus including a multidimensional arrangement of conductive paths according to embodiments herein.

[0037] Figure 2 This is an example graph illustrating the percentage change in magnetic permeability of a magnetically conductive material relative to a magnetic field according to embodiments herein.

[0038] Figure 3A This is an example top view of an inductor circuit assembly comprising a conductive path and multiple cut-off portions, according to embodiments herein.

[0039] Figure 3B This is an example top view of an inductor circuit assembly comprising a conductive path and multiple cut-off portions, according to embodiments herein.

[0040] Figure 4 This is an example top view of an inductor circuit assembly including a multidimensional arrangement of conductive paths according to embodiments herein.

[0041] Figure 5 This is an example top view of an inductor circuit assembly including a multidimensional arrangement of conductive paths according to embodiments herein.

[0042] Figure 6This is an example top view of a multi-inductor assembly including multiple grouped conductive paths according to embodiments herein.

[0043] Figure 7 This is an example top view of a multi-inductor assembly including multiple grouped conductive paths and variability of magnetic material between cells, according to embodiments herein.

[0044] Figure 8 This is an example top view of a multi-inductor assembly including multiple grouped conductive paths and variable magnetic material unit sizes, according to embodiments herein.

[0045] Figure 9 This is an example top view of a multi-inductor assembly including multiple grouped conductive paths and variable conductive path diameters, according to embodiments herein.

[0046] Figure 10A This is an example 3-D view of a multi-inductor assembly including multiple grouped conductive paths and variable magnetic material unit heights according to embodiments herein.

[0047] Figure 10B This is an example 3-D view of a grouped conductive path and a variable magnetic material unit height in a multidimensional arrangement according to the embodiments herein.

[0048] Figure 11 This is an example top view of a multi-inductor assembly including multiple grouped conductive paths and variable magnetic material within one or more cells, according to embodiments herein.

[0049] Figure 12 This is an example exploded view illustrating an exploded 3-D view of a substrate, voltage regulator circuit assembly, and dynamic load according to embodiments herein.

[0050] Figure 13 This is an example diagram illustrating the connectivity of circuit components in a power supply for an inductor device according to embodiments herein.

[0051] Figure 14 This illustration depicts a multiphase power supply (in...) according to an embodiment described herein. Figure 13 (middle) and an example side view of inductor hardware that supports vertical power flow.

[0052] Figure 15 This illustration depicts a multiphase power supply (in...) according to an embodiment described herein. Figure 13 (middle) and an example side view of inductor hardware that supports vertical power flow.

[0053] Figure 16 This illustration depicts a multiphase power supply (in...) according to an embodiment described herein. Figure 13(middle) and an example side view of inductor hardware that supports vertical power flow.

[0054] Figure 17 This illustration depicts a multiphase power supply (in...) according to an embodiment described herein. Figure 13 (middle) and an example side view of inductor hardware that supports vertical power flow.

[0055] Figure 18 This is an example diagram illustrating an example computer architecture (manufacturing system, manufacturing hardware, etc.) operable to perform one or more methods according to embodiments herein.

[0056] Figure 19 This is an example diagram illustrating a method according to an embodiment of the present document.

[0057] The foregoing and other objects, features, and advantages of the embodiments described herein will become apparent from the more specific description that follows, as illustrated in the accompanying drawings, wherein the same reference numerals refer to the same parts in different views. The drawings are not necessarily drawn to scale, but rather to emphasize the illustration of embodiments, principles, concepts, etc. Detailed Implementation

[0058] According to one configuration, the fabricator receives a magnetically conductive material. The fabricator also produces circuit components in a multidimensional arrangement including conductive paths (inductive paths), such as at least three conductive paths not all residing on the same axis. Each conductive path in the multidimensional arrangement extends through the magnetically conductive material, such as from one surface of the circuit component to another. The presence of the magnetically conductive material surrounding the conductive path makes the conductive path an inductive path. Therefore, the apparatus discussed herein includes a multidimensional arrangement of inductive paths extending through the magnetically conductive material.

[0059] Now, referring to the attached diagram, Figure 1A This is an example 3-D diagram of an apparatus including a multidimensional arrangement of conductive paths according to embodiments herein.

[0060] In this example embodiment, the manufacturer 140 receives one or more of the following: metal (conductive material), metal alloy, magnetic material (such as a first magnetic material, a second magnetic material, etc.).

[0061] Based on the received materials, the fabricator 140 uses magnetic material 161 and conductive material to fabricate the core (such as a monolithic solid structure or a single hardware component) of the circuit assembly 110 to generate conductive paths 120-11, 120-12, 120-13, 120-14, 120-21, 120-22, ..., 120-44 (collectively referred to as conductive path 120) and the frame 160.

[0062] The fabricator 140 fabricates the conductive path 120 as a magnetic material 161 extending through the core of the circuit assembly 110.

[0063] Any suitable technique can be used to place the conductive path 120 in the circuit assembly 110. For example, in one embodiment, the fabricator 140 drills a hole through the magnetic material 161 and fills the hole with a conductive material to create the conductive path 120.

[0064] If desired, each conductive path 120 is surrounded by an insulating material layer (such as a non-conductive or insulating material) so that the conductive path does not come into contact with the core magnetic material 161. In other words, each conductive path 120 may optionally be coated with an insulating material layer disposed between the corresponding conductive path and the magnetic material 161.

[0065] Note that the implementation of the sixteen conductive paths disposed in the inductor circuit assembly 110 is shown only by way of a non-limiting example embodiment. In another example embodiment, the plurality of conductive paths 120 disposed in the core include a number N conductive paths along a first axis, where N is any value greater than 2. The plurality of conductive paths 120 disposed in the core include a number M conductive paths along a second axis, where M is any value greater than 2.

[0066] Additionally, note that, if desired, circuit assembly 110 can be configured for a multidimensional arrangement, including a corresponding array of more than two dimensions, with each element comprising a conductive path. Each dimension of the array of elements in the multidimensional arrangement of circuit assembly 110 can be positioned in any orientation relative to the X, Y, and Z axes.

[0067] As the name suggests, the magnetically conductive material 161 surrounding the conductive path 120 is magnetically conductive. The magnetically conductive material 160 can be made of any suitable material. In one embodiment, by way of a non-limiting example, the core material 120 has a magnetic flux permeability between 10 and 100 Henry / meter or any other suitable value or range.

[0068] In another embodiment, it is noted again that the conductive path 120 can be made of any suitable conductive material, such as metals, metal alloys (a combination of various metals, including conductive materials such as copper, tin, etc.).

[0069] Also note that the conductive path 120 can be manufactured in any suitable shape, such as rod-shaped, column-shaped, etc.

[0070] In another example embodiment, each conductive path in the magnetic material 161 is a non-winding circuit path (such as a so-called single-turn inductor device) extending along (parallel to) the Y-axis through the inductor circuit assembly 110. As mentioned, it should be noted again that each inductor path (also referred to as a conductive path) disposed in the shared medium (i.e., the magnetic material 161) can be manufactured in a cylindrical or any other suitable shape.

[0071] Therefore, the embodiments described herein include a novel multi-inductor circuit assembly 110 comprising a common core (structure) of magnetically conductive material 161. The implementation of multiple inductor devices within the same structure of magnetically conductive material 161, as a multidimensional arrangement, facilitates mounting or fixing of the corresponding circuit assembly 110 on corresponding circuit boards and assemblies. Implementing multiple inductor devices within the same structure (multidimensional arrangement) of the circuit assembly 110 (as opposed to individual inductor assemblies) enables the manufacture of circuits with a smaller footprint.

[0072] As previously discussed, existing (traditional) multiphase solutions involve implementing independent magnetic devices and independent cores for each phase of the power supply, rather than providing an integrated monolithic structure as described herein (such as circuit assembly 110). From the perspective of overall board space consumption, conventional individual inductor assemblies are not optimal, resulting in a larger system size. This not only affects the overall power density of the generated power but also limits the choice of how close the inductor assembly can be physically placed to the corresponding power load.

[0073] Therefore, compared to conventional techniques, the embodiments described herein present a monolithic magnetic structure (such as a block of magnetic material 161) with a single-turn inductor path (such as conductive path 120) and a multidimensional arrangement of a frame 160. As further discussed herein, different embodiments include adjusting the lateral coupling of adjacent phases (conductive path 120) from a primary amount of inductive coupling to potentially no (or significantly reduced) inductive coupling by means of geometric cutouts (removed portions) in the core magnetic material 161 disposed in the frame 160.

[0074] In one embodiment, the conductive material frame 160 is optional or can be made of any suitable material.

[0075] In some instances, such as the magnetic structures (corresponding multidimensional arrangements of circuit components 110 and conductive paths 120) discussed in the accompanying figures and text, the integration of vertical power flow and multiphase arrangements of single-turn inductors (such as conductive paths 120) is achieved.

[0076] Additionally, note that the presence of the magnetically conductive material 161 around each conductive path transforms each conductive path into an inductive path (i.e., inductor device 110). For example, current flowing through the corresponding conductive path results in a corresponding magnetic flux (in the magnetically conductive material 161) according to the right-hand rule.

[0077] Figure 1B This is an example top view of an apparatus including a multidimensional arrangement of conductive paths according to embodiments herein.

[0078] In this example embodiment, circuit component 110 includes a multidimensional arrangement (such as a multidimensional array, a two-dimensional array, etc.) of conductive paths 120, where m = the number of paths on the X-axis (m = 4), and n = the number of paths on the Z-axis (n = 4).

[0079] All conductive paths 120 (such as inductors or inductor paths) share a single magnetic core (i.e., magnetic material 161).

[0080] In a non-limiting example embodiment, each conductive path (such as a copper rod or other suitable shape or material) represents a single-turn winding of an inductor belonging to a single phase of a multiphase VRM (voltage regulator module), such as implementing a total of 16 phases, each with one conductive path. The amount of coupling between windings varies depending on the embodiment and can be reduced as shown below.

[0081] In another example embodiment, the frame 160 (peripheral shell) of the core of the magnetic material 161 in the encapsulated circuit assembly 110 is made of a conductive material. In one embodiment, the 2D magnetic structure of the core of the magnetic material 161 is surrounded (encapsulated) by the frame 160 made of a conductive material. In one embodiment, the frame 160 serves as a return path for inductor current (associated with a conductive path) and provides a ground plane or enclosure that acts as magnetic shielding to reduce electromagnetic interference and emissions.

[0082] In a non-limiting example embodiment, circuit component 140 is manufactured according to the following parameters:

[0083] - The initial core permeability of magnetic material 161 is μ: 80

[0084] –μ vs. Hdc curve, as shown Figure 2 The description in

[0085] - Core and frame 160 Height: 2 mm

[0086] -Single inductor unit XZ size: 7.5mm x 7.5mm

[0087] - Overall core XZ area size: 30mm

[0088] - Conductive path 120 diameter: 1mm

[0089] - Supported current through each conductive path: 70 Adc (Ampere DC).

[0090] However, as previously discussed, these dimensions vary depending on the embodiment.

[0091] Similarly, in one embodiment, each conductive path 120 is a single-turn inductor device (path) in a multidimensional arrangement of multiple conductive paths 120 disposed in circuit assembly 110.

[0092] In another example embodiment, refer to Figure 1B The conductive path 120 in the multidimensional arrangement of the circuit assembly 110 includes a first conductive path 120-1 and a second conductive path 120-2 arranged along a first axis (such as parallel to the X-axis). The circuit assembly 110 also includes at least one additional conductive path (such as any one of conductive paths 120-21, 120-22, ..., 120-31, 120-32, etc.) that is offset relative to the first axis in the multidimensional arrangement.

[0093] Figure 1C This is an example cross-sectional side view of an apparatus including a multidimensional arrangement of conductive paths according to embodiments herein.

[0094] Figure 1C The side view of the circuit assembly 110 illustrates that each conductive path 120 in the circuit assembly 110 extends from the top surface 151 of the circuit assembly 110 to the bottom surface 152 of the circuit assembly 110.

[0095] More specifically, the first axial end of conductive path 120-11 in the first row is exposed on the top surface 151 of circuit assembly 110; the second axial end of conductive path 120-11 is exposed on the bottom surface 152 of circuit assembly 110. The first axial end of conductive path 120-12 in the first row is exposed on the top surface 151 of circuit assembly 110; the second axial end of conductive path 120-12 is exposed on the bottom surface 152 of circuit assembly 110, and so on.

[0096] The first axial end of conductive path 120-21 in the second row is exposed on the top surface 151 of circuit assembly 110; the second axial end of conductive path 120-21 is exposed on the bottom surface 152 of circuit assembly 110. The first axial end of conductive path 120-22 in the second row is exposed on the top surface 151 of circuit assembly 110; the second axial end of conductive path 120-22 is exposed on the bottom surface 152 of circuit assembly 110, and so on.

[0097] Therefore, in a similar manner, each conductive path 120 has a first axial end exposed on the top surface 151 of the circuit assembly 110 and a second axial end exposed on the bottom surface 152 of the circuit assembly 110.

[0098] The exposure of the surface of circuit component 110 enables connectivity with other circuit components.

[0099] Refer again Figure 1A Note that in the multidimensional arrangement of circuit assembly 110, each conductive path and the corresponding portion of the magnetically conductive material encapsulating the conductive path can be considered as a corresponding inductor unit. In this example, Figure 1A The example circuit assembly 110 includes 16 units, such as including: i) a first unit residing therein in conductive paths 120-11, the first unit being at least partially defined by a first portion of a magnetically conductive material 160 surrounding (encapsulating) the first conductive path 120-11; ii) a second unit residing therein in conductive paths 120-12, the second unit being at least partially defined by a second portion of the magnetically conductive material 160 surrounding the conductive path 120-12; iii) a third unit residing therein in conductive paths 120-13, the third unit being at least partially defined by a third portion of the magnetically conductive material 160 surrounding the conductive path 120-13; ...; and v) a fifth unit residing therein in conductive paths 120-21, the fifth unit being at least partially defined by a fifth portion of the magnetically conductive material 160, the fifth unit being offset relative to the axis between the first unit and the second unit; and so on.

[0100] In one embodiment, the surface and cross-sectional views (such as in the XZ plane) of each circuit component in multiple instances of circuit component 110, as further discussed herein, are identical at any depth along the Y-axis.

[0101] Figure 2 This is an example graph illustrating the percentage change in magnetic permeability of a magnetically conductive material relative to a magnetic field according to embodiments herein.

[0102] In one embodiment, by way of a non-limiting example, Figure 1A The circuit component 110 is manufactured as follows:

[0103] - The initial core permeability μ of the magnetic material 161 is: 80

[0104] - The corresponding μ and Hdc curves are depicted in Figure 2.

[0105] Core height of magnetic material 161 in the Y-axis: 2mm

[0106] -Single inductor unit XZ size: 6.75mm x 6.75mm

[0107] - Overall core XZ size: 30mm

[0108] - Conductive path diameter (e.g., copper rod diameter): 1mm

[0109] - Current: 70 amps DC.

[0110] As discussed earlier, Figure 2 Curve 220 in graph 200 illustrates the percentage change in permeability of the magnetic material 161 with respect to a DC magnetic field. As shown, the permeability decreases slowly with increasing DC magnetic field (i.e., by increasing the current in the corresponding conductive path, such as a single-turn inductor).

[0111] Refer again Figure 1A Note that the resulting inductance for each conductive path (such as conductive paths 120-11, 120-14, 120-41, and 120-44 in the corners of circuit assembly 110) is 31 nH, while the inductance for the four inductor paths at the center of circuit assembly 110 (conductive paths 120-22, 120-23, 120-32, and 120-33) is 59 nH; all other inductor paths (such as conductive paths) have an inductance of 24.5 nH. The reason for this change in inductance is the fact that the internal conductive paths experience a higher amount of magnetic flux cancellation. Therefore, the core magnetic material 160 has lower saturation in these regions, resulting in a higher inductance for the inner phase.

[0112] For the four phases at the corners of circuit assembly 110, the various magnetic fluxes generated by all other phases are balanced by themselves, while for the remaining eight phases, the magnetic fluxes generated by other phases are added to each other, resulting in higher core saturation and thus lower inductance values.

[0113] This structural imbalance in inductance values ​​and the magnetic coupling between inductor paths in circuit assembly 110 can be reduced by applying cut-off portions, using different magnetically conductive materials, and changing the size of circuit assembly 110, as discussed further below.

[0114] Therefore, as further discussed herein, the embodiments herein include implementations of different configurations and cut-off portions of the circuit components to control inductive coupling and the inductance value associated with each inductive path (conductive path) in the circuit components.

[0115] Figure 3A This is an example top view of an inductor circuit assembly comprising a conductive path and multiple cut-off portions, according to embodiments herein.

[0116] In one embodiment, a cross-sectional view (in the plane XZ) of an instance of circuit assembly 110-2 is identical at any depth along the Y-axis.

[0117] Note that other embodiments described herein include tuning the cells in the multidimensional arrangement of the circuit assembly 110 during manufacturing to control the inductance of each conductive path and the coupling between conductive paths. For example, reduced inductive coupling between adjacent conductive paths can be achieved by removing small portions (partial portions) of the shared core magnetic material 160 at certain locations for each inductor cell.

[0118] For example, in a manner similar to that discussed earlier, Figure 3A Examples of circuit components 110-2 include: i) conductive paths 120-11, 120-12, 120-13 and 120-14 in the first row; ii) conductive paths 120-21, 120-22, 120-23 and 120-24 in the second row; iii) conductive paths 120-31, 120-32, 120-33 and 120-34 in the third row; and iv) conductive paths 120-41, 120-42, 120-43 and 120-44 in the fourth row.

[0119] In this example embodiment, each unit of circuit assembly 110-2 includes a corresponding conductive path. For example, unit 391-1 includes a portion of magnetically conductive material 160 encapsulating conductive path 120-11; unit 391-2 includes a portion of magnetically conductive material 160 encapsulating conductive path 120-12; unit 391-3 includes a portion of magnetically conductive material 160 encapsulating conductive path 120-13; unit 391-4 includes a portion of magnetically conductive material 160 encapsulating conductive path 120-14; unit 392-1 includes a portion of magnetically conductive material 160 encapsulating conductive path 120-21; unit 392-2 includes a portion of magnetically conductive material 160 encapsulating conductive path 120-22; unit 392-3 includes a portion of magnetically conductive material 160 encapsulating conductive path 120-23; unit 392-4 includes a portion of magnetically conductive material 160 encapsulating conductive path 120-24; and so on.

[0120] As further shown, the magnetic material 160 in circuit assembly 110-2 includes multiple cut-out portions 330-1, 330-2, 330-3, 330-4, etc. (collectively referred to as cut-out portions 330) to reduce inductive coupling. The size of the cut-out portions may vary depending on the amount of inductive coupling to be reduced.

[0121] The magnetic material 160 is not present in each cut portion 330. In one embodiment, each cut portion 330 is filled with a conductive material to create a frame 360 ​​encapsulating the multidimensional arrangement of the conductive paths 120. Alternatively, the cut portions may be filled with any other suitable material.

[0122] In another example embodiment, instances of circuit assembly 110-2 include additional cut-out portions 331, 332, 333, 334, 335, 336, etc., wherein the magnetic material 160 is not present between corresponding units in circuit assembly 110-2.

[0123] More specifically, circuit assembly 110-2 includes: i) a cut-off portion 331 disposed between units 391-1, 391-2, 392-1, and 392-2; ii) a cut-off portion 332 disposed between units 391-2, 391-3, 392-2, and 392-3; iii) a cut-off portion 333 disposed between units 391-3, 391-4, 392-3, and 392-4; iv) a cut-off portion 334 disposed between units 392-1, 392-2, 393-1, and 393-2; and so on. The presence of the cut-off portions reduces inductive coupling between conductive paths.

[0124] In one embodiment, such as Figure 3A As shown, one or more cut-out portions 331, 332, 33, 334, 335, 336, etc., inside the circuit assembly 110-2 are filled with a conductive material such as metal. Alternatively, in Figure 3B In the example of circuit assembly 110-2, one or more cut-out portions 331, 332, 333, 334, 335, 336, etc., inside are filled with air, gas, vacuum, etc.

[0125] In one embodiment, the fabricator 140 controls the size and corresponding number of cut-off portions manufactured in the control circuit assembly 110 to control the degree of inductive coupling between adjacent conductive paths.

[0126] In one embodiment, voids in the magnetic material 161 (such as the resulting spaces associated with the cut-off portions) may be filled, for example, with metal for better heat dissipation. In an example embodiment, the internal cut-off portions (such as cut-off portions 331, 332, 333, 334, 335, etc.) are electrically isolated from the frame 360 ​​(such as the GND return path).

[0127] Figure 4 This is an example top view of an inductor circuit assembly including a multidimensional arrangement of conductive paths according to embodiments herein.

[0128] Note that other embodiments described herein include providing isolation between cells in a multidimensional arrangement of circuit assembly 110-2 during manufacturing. For example, reduced inductive coupling between adjacent conductive paths can be achieved by removing small portions (partial portions) of the shared core magnetic material 160 at certain locations for each inductor cell.

[0129] More specifically, in a manner similar to that discussed earlier, Figure 4 Examples of circuit components 110-4 include: i) conductive paths 120-11, 120-12, 120-13 and 120-14 in the first row; ii) conductive paths 120-21, 120-22, 120-23 and 120-24 in the second row; iii) conductive paths 120-31, 120-32, 120-33 and 120-34 in the third row; and iv) conductive paths 120-11, 120-12, 120-13 and 120-14 in the fourth row.

[0130] In this example embodiment, each unit of circuit assembly 110-4 includes a corresponding conductive path. For example, unit 491-1 includes a portion of magnetic material 160 encapsulating conductive path 120-11; unit 491-2 includes a portion of magnetic material 160 encapsulating conductive path 120-12; unit 491-3 includes a portion of magnetic material 160 encapsulating conductive path 120-13; unit 491-4 includes a portion of magnetic material 160 encapsulating conductive path 120-14; unit 492-1 includes a portion of magnetic material 160 encapsulating conductive path 120-21; unit 492-2 includes a portion of magnetic material 160 encapsulating conductive path 120-22; unit 492-3 includes a portion of magnetic material 160 encapsulating conductive path 120-23; unit 492-4 includes a portion of magnetic material 160 encapsulating conductive path 120-24; and so on.

[0131] As further shown, the magnetic material 160 in circuit assembly 110-4 includes multiple cut-out portions 430-1, 430-2, 430-3, 430-4, etc. (collectively referred to as cut-out portions 430) to reduce inductive coupling. The size of the cut-out portions may vary depending on the amount of inductive coupling reduction.

[0132] Each cut portion 430 lacks a magnetically conductive material 160. In one embodiment, each of the one or more cut portions 430 is filled with a conductive material to create a frame 460 encapsulating a multidimensional arrangement of conductive paths 120.

[0133] In another example embodiment, instances of circuit assembly 110-4 include additional cut-out portions 431, 432, 433, 434, 435, 436, etc., wherein the magnetic material 160 is not present in circuit assembly 110-4 and the corresponding unit.

[0134] More specifically, circuit assembly 110-4 includes: i) a cut-off portion 431 disposed between units 491-1, 491-2, 492-1 and 492-2; ii) a cut-off portion 432 disposed between units 491-2, 491-3, 492-2 and 492-3; iii) a cut-off portion 433 disposed between units 491-3, 491-4, 492-3 and 492-4; iv) a cut-off portion 334 disposed between units 492-1, 492-2, 493-1 and 493-2; and so on.

[0135] In one embodiment, the cut-off portion is connected to frame 460 and is made of the same conductive material.

[0136] The presence of cut-off portions between corresponding units of circuit assembly 110-4 reduces inductive coupling between conductive paths.

[0137] In one embodiment, such as Figure 4 As shown, one or more cut-out portions 431, 432, 433, 434, 435, 436, etc., inside the circuit assembly 110-4 are filled with a conductive material, such as metal, other magnetically conductive materials, etc. Alternatively, the cut-out portions 431, 432, 433, 434, 435, 436, etc., inside the example of the circuit assembly 110-4 are filled with air, gas, vacuum, etc.

[0138] Figure 5 This is an example top view of an inductor circuit assembly including a multidimensional arrangement of conductive paths according to embodiments herein.

[0139] In this example embodiment, the circuit assembly 110-5 includes multiple units that are independently isolated from each other via a frame 560 (a conductive material such as metal). For example, in one embodiment, each conductive path 520 is disposed in a corresponding unit of magnetic material; each corresponding unit is independently encapsulated by the conductive material of the frame 560.

[0140] More specifically, circuit assembly 110-5 includes unit 591-1, which includes: i) conductive path 520-11 encapsulated by a corresponding portion of magnetic material 160; ii) conductive path 520-12 encapsulated by a corresponding portion of magnetic material 160; iii) conductive path 520-13 encapsulated by a portion of magnetic material 160; iv) conductive path 520-14 encapsulated by a corresponding portion of magnetic material 160; and so on.

[0141] As previously discussed, each unit in circuit assembly 110-5 is surrounded or encapsulated by a corresponding conductive material associated with frame 560. For example, unit 591-11 is surrounded by a first portion of frame 560; unit 591-12 is surrounded by a second portion of frame 560; unit 591-13 is surrounded by a third portion of frame 560; unit 591-14 is surrounded by a fourth portion of frame 560; and so on.

[0142] Figure 6 This is an example top view of a multi-inductor assembly including multiple grouped conductive paths according to embodiments herein.

[0143] Note that other embodiments described herein include providing isolation between cell groups in a multidimensional arrangement of circuit assemblies 110-6 during manufacturing. For example, reduced inductive coupling between adjacent conductive paths can be achieved by removing a small portion (partial) of the shared core magnetic material 160 at certain locations for each inductor cell and encapsulating the cell group with a frame 660 (a conductive material such as metal).

[0144] More specifically, in a manner similar to that discussed earlier, Figure 6 Examples of circuit components 110-6 include: i) conductive paths 120-11, 120-12, 120-13 and 120-14 in the first row; ii) conductive paths 120-21, 120-22, 120-23 and 120-24 in the second row; iii) conductive paths 120-31, 120-32, 120-33 and 120-34 in the third row; and iv) conductive paths 120-41, 120-42, 120-43 and 120-44 in the fourth row.

[0145] In this example embodiment, each unit of circuit assembly 110-6 includes a corresponding conductive path. For example, unit 691-1 includes a portion of magnetically conductive material 160 encapsulating conductive path 120-11; unit 691-2 includes a portion of magnetically conductive material 160 encapsulating conductive path 120-12; unit 691-3 includes a portion of magnetically conductive material 160 encapsulating conductive path 120-13; unit 691-4 includes a portion of magnetically conductive material 160 encapsulating conductive path 120-14; unit 692-1 includes a portion of magnetically conductive material 160 encapsulating conductive path 120-21; unit 692-2 includes a portion of magnetically conductive material 160 encapsulating conductive path 120-22; unit 692-3 includes a portion of magnetically conductive material 160 encapsulating conductive path 120-23; unit 692-4 includes a portion of magnetically conductive material 160 encapsulating conductive path 120-24; and so on.

[0146] As further shown, the magnetic material 160 in circuit assembly 110-6 includes multiple cut-out portions 630-1, 630-2, 630-3, 630-4, etc. (collectively referred to as cut-out portions 630) to reduce inductive coupling between conductive paths. The size of the cut-out portions may vary depending on the amount of inductive coupling reduction.

[0147] The magnetic material 160 is not present in each cut portion 630. In one embodiment, each cut portion of one or more cut portions 630 is filled with a conductive material or other material to create a frame 660 that encapsulates the multidimensional arrangement of the conductive paths 120.

[0148] In another example embodiment, instances of circuit assembly 110-6 include additional cut-out portions 631, 632, 633, 634, 635, 636, etc., wherein the magnetic material 160 is not present in circuit assembly 110-6 and the corresponding unit.

[0149] More specifically, circuit assembly 110-6 includes: i) a cut-out portion 631 disposed between units 691-1, 691-2, 692-1 and 692-2; ii) a cut-out portion 632 disposed between units 691-2, 691-3, 692-2 and 692-3; iii) a cut-out portion 633 disposed between units 691-3, 691-4, 692-3 and 692-4; iv) a cut-out portion 634 disposed between units 692-1, 692-2, 693-1 and 693-2; and so on.

[0150] The presence of cut-off portions between corresponding units of circuit assembly 110-6 reduces inductive coupling between conductive paths within each corresponding group of conductive paths.

[0151] In one embodiment, such as Figure 6 As shown, one or more cut-out portions 631, 632, 633, 634, 635, 636, etc., inside the circuit assembly 110-6 are filled with a conductive material such as metal. Alternatively, the cut-out portions 631, 632, 633, 634, 635, 636, etc., inside the examples of the circuit assembly 110-6 are filled with different magnetic materials, air, gas, vacuum, etc.

[0152] Therefore, embodiments of circuit assembly 110-6 include: i) a first set of conductive paths (120-11, 120-12, 120-21, 120-22), each conductive path in the first set being encapsulated by magnetic material 160 to form a first set of units (691-1, 691-2, 692-1, 692-2), the first set of units being encapsulated by a first portion of conductive material associated with frame 660; ii) a second set of conductive paths (120-13, 120-14, 120-23, 120-24), each conductive path in the second set being encapsulated by magnetic material to form a second set of units (691-3, 691-4, 692-3, 692-4), the second set of units being encapsulated by a second portion of conductive material of frame 660. The cut portion 631 is placed between unit 691-1 and unit 692-2, and the magnetic material is not present in the cut portion 631 and other cut portions.

[0153] Therefore, in another embodiment of the circuit assembly, the unit is divided into multiple sub-cores. A key advantage of this implementation is that the impedance of the current return path is equal for each phase, and it further reduces magnetic coupling, which can be beneficial in certain applications. In one embodiment, in circuit assembly 110-6 (a 4x4 magnetic matrix divided into four sub-modules), a frame 660 of conductive material surrounding the four sub-cores provides a current return path with similar impedance for all 16 phases.

[0154] In one embodiment, the reduced coupling resulting from the sub-core arrangement also significantly reduces mismatch between inductors. Consider the following characteristics of example circuit component 110-6:

[0155] -Initial core (magnetic material 160) Material 160, permeability μ: 80

[0156] –μ vs. Hdc curve, as shown Figure 2 The description in

[0157] The core height of the circuit components in the Y-axis is 2mm.

[0158] -Single inductor unit XZ size: 7.5mm x 7.5mm

[0159] - Overall core XZ size: 30mm

[0160] - Conductive path diameter: 1mm

[0161] - Current: 70Adc.

[0162] In one embodiment, the inductance associated with the conductive path 120 in circuit assembly 110-6 is 37.5 nH for the four inductors (units 692-2, 692-3, 693-2, and 693-3) at the center of circuit assembly 110-6 and 32.5 nH for all other units. As mentioned, this mismatch is due to the high flux cancellation experienced by the four intermediate inductors (units 692-2, 692-3, 693-2, and 693-3), which is based on Figure 2 The μ-HDC curve results in lower soft saturation of the core and thus higher local permeability.

[0163] Additionally, note that in some applications implementing circuit component 110-6, it may be required that all inductors in the multiphase magnetic structure of circuit component 110-6 have the same or nearly the same inductance. As an example, the inductance associated with a cell in circuit component 110-6 can be different values, leading to problems such as higher peak current in the outer phase or slower transient response in the inner phase.

[0164] The following embodiments can solve this problem: In order to balance the inductance in circuit component 110, the embodiments herein include: reducing the inductance of each phase experiencing peak flux cancellation, which in Figure 6 The example shows the four phases (units 692-2, 692-3, 693-2, and 693-3) in the middle of the multi-dimensional arrangement of circuit component 110-6. Therefore, it is necessary to increase the magnetic reluctance relative to the core. The magnetic reluctance formula is as follows:

[0165]

[0166] Among them l m It is the average magnetic circuit length, A core The core area is as seen from the magnetic flux, and μ is the permeability.

[0167] One possible solution is to use a material with lower permeability relative to the outer phase for the core undergoing high flux cancellation (at the point where the core is designed for the Hdc field), such as... Figure 7 As described in [the document / article].

[0168] Figure 7 This is an example top view of a multi-inductor assembly according to embodiments herein, the multi-inductor assembly including multiple grouped conductive paths and variability of magnetic material between cells.

[0169] In addition to grouping the multiple units of the multidimensional arrangement of circuit components 110-7 and constructing such groups via frame 760, the embodiments herein include implementing different magnetic materials in each unit.

[0170] For example, in one embodiment, the manufacturer 140 uses a first magnetically conductive material 160-1 to manufacture units 791-1, 791-2, 791-3, 791-4, 792-1, 792-4, 793-1, 793-4, 794-1, 794-2, 794-3, and 794-4. The first magnetically conductive material 160 has a first permeability. The manufacturer 140 uses a second magnetically conductive material 160-2 to manufacture units 792-2, 792-3, 793-2, and 793-3. The second magnetically conductive material 160-2 has a second permeability.

[0171] Therefore, in one embodiment, the magnetic material 160 includes a first magnetic material 160-1 and a second magnetic material 160-2; the first magnetic material 160-1 has a first permeability, and the second magnetic material 160-2 has a second permeability. In one embodiment, the second magnetic material 160-2 has a lower permeability than the first magnetic material 160-1. In one embodiment, using different magnetic materials to fabricate the circuit assembly 110-6 adjusts the cells in each group to be closer to a common inductance value, thereby reducing inductance mismatch between cells.

[0172] Figure 8 This is an example top view of a multi-inductor assembly including multiple grouped conductive paths and variable magnetic material unit sizes, according to embodiments herein.

[0173] In another example embodiment, determining the precise material of the inductor for the core of the fine-tuning circuit assembly 110-6 may not be concise. The embodiments herein also include another way of looking at the magnetoresistance formula where alternative solutions can be found: for example, embodiments herein include increasing the magnetoresistance of the core experiencing the highest flux cancellation by intentionally reducing their cross-sectional area (A_core) relative to cores belonging to all other phases by introducing asymmetry in their geometry. In one embodiment, as... Figure 8 In this design, the area of ​​the inner core (such as cells 892-2, 892-3, 893-2, and 893-3) is reduced by removing material from its exterior. In one embodiment, this results in a more balanced inductance for each cell, such as an inductance of approximately 32.5 nH per cell.

[0174] In other words, the embodiments described herein include adjusting the dimensions of the magnetically conductive material surrounding the conductive path to different sizes. For example, each of units 892-2, 892-3, 893-2, and 893-3 is smaller in size (top view cross-sectional area) than the corresponding common size associated with each of units 891-1, 891-2, 891-3, 891-4, 892-1, 892-4, 893-1, 893-4, 894-1, 894-2, 894-3, and 894-4. Since the circuit assembly 110-8 has the same cross-sectional view in the XZ plane for any Y depth, the volumetric shape of the magnetic material surrounding the first conductive paths 120-11, 120-12, 120-13, 120-14, 120-21, 120-24, 120-31, 120-34, 120-41, 120-42, 120-43, and 120-44 is different from the volumetric shape of the magnetic material surrounding the second conductive paths 120-22, 120-23, 120-32, and 120-33.

[0175] Figure 9 This is an example top view of a multi-inductor assembly including multiple grouped conductive paths and variable path diameters, according to embodiments herein.

[0176] In addition to grouping and constructing multiple units of the multidimensional arrangement of circuit assembly 110-6, embodiments herein include implementing conductive paths of different diameters depending on their positions within circuit assembly 110-6.

[0177] For example, the manufacturer 140 manufactures each of the conductive paths 120-22, 120-23, 120-32, and 120-33 with a first diameter value that is different from and greater than the common diameter value of the conductive paths 120-11, 120-12, 120-13, 120-14, 120-21, 120-24, 120-31, 120-34, 120-41, 120-42, 120-43, and 120-44.

[0178] Therefore, in one embodiment, the cross-sectional areas of the first conductive paths 120-22, 120-23, 120-32, and 120-33 observed along the longitudinal axis (Y-axis) of the first conductive path are different from (and larger than) the cross-sectional areas of the second conductive paths 120-11, 120-12, 120-13, 120-14, 120-21, 120-24, 120-31, 120-34, 120-41, 120-42, 120-43, and 120-44 observed along the longitudinal axis (Y-axis) of the second conductive path. Therefore, embodiments herein include adjusting the diameter of one or more conductive paths 120 to control the inductance value associated with each cell in the circuit assembly 110. For example, by increasing the diameter of the conductive path while maintaining the same individual cell size, this reduces the core area. Adjusting the cross-sectional core area (and thus adjusting the volume shape) controls the inductance value.

[0179] Figure 10A This is an example 3-D view of a multi-inductor assembly including multiple grouped conductive paths and variable cell height according to embodiments herein.

[0180] In addition to grouping and constructing multiple units of the multidimensional arrangement of circuit assembly 110-6, embodiments herein include implementing the corresponding magnetic material in each unit at a specific height, depending on their position in the instance of circuit assembly 110-10.

[0181] For example, the manufacturer 140 manufactures each unit 691-1, 691-2, 691-3, 691-4, 692-1, 692-4, 693-1, 693-4, 694-1, 694-2, 694-3, 694-4 of the magnetic material 160 with a first height H1 value that is different from and greater than the common height value of the magnetic material in units 692-2, 692-3, 693-2, 693-3.

[0182] Therefore, in one embodiment, the height H1 of the magnetic material 160 of one or more units in the first group of circuit components 110-10 on the Y-axis is greater than the height H2 of the magnetic material 160 of one or more units in the second group on the Y-axis.

[0183] Figure 10B This is an exemplary 3-D view of a grouped conductive path and variable cell height in a multidimensional arrangement according to embodiments herein.

[0184] As shown in the figure, the height H1 of units 691-1, 691-2 and 692-1 is different from the height H2 of unit 692-2.

[0185] Figure 11This is an example top view of a multi-inductor assembly according to embodiments herein, the multi-inductor assembly including multiple grouped conductive paths and variability of magnetic material within one or more cells.

[0186] Other embodiments described herein include: implementing multilayer cells of different magnetic materials to achieve different or desired inductance values ​​in circuit components 110-11.

[0187] For example, as previously in Figure 8 The embodiments discussed herein include supplementing or replacing the adjustment of unit size by varying the permeability of the magnetic material according to the distance from the corresponding conductive path. More specifically, unit 971-1 includes a first magnetic material 990-11 (having a first permeability) surrounding the conductive path 120-11; unit 971-1 also includes a second magnetic material 991-12 surrounding the first magnetic material 991-11.

[0188] Unit 971-2 includes a first magnetic material 990-11 (having a first magnetic permeability) surrounding the conductive path 120-12; unit 971-2 also includes a second magnetic material 991-12 surrounding the first magnetic material 991-11.

[0189] In a similar manner, each unit in circuit assemblies 110-11 is manufactured using two or more different types of magnetically conductive materials.

[0190] Figure 12 This is an example exploded view illustrating an exploded 3-D view of a substrate, voltage regulator circuit assembly, and dynamic load according to embodiments herein.

[0191] In this example embodiment, circuit component 110 is disposed in a corresponding circuit 1200 between circuit component layer 1230 and voltage converter 1210. Power flow 1299 is delivered from substrate 1220 through circuit 1200 via circuit component 1230, the inductor path of circuit component 110, and voltage converter 1210 to load 118.

[0192] Note that the conductive paths discussed herein can be connected in any suitable manner. For example, any one of all conductive paths 120 (inductive paths) in circuit assembly 110 can be connected in parallel, in series, or a combination of both, via additional connection hardware associated with the layers of circuit components in circuit assembly 1230 and the layers of circuit components in voltage converter 1210. Additionally or alternatively, any or all conductive paths in circuit assembly 110 can be configured to carry a corresponding current independently of other conductive paths in circuit assembly 110.

[0193] Figure 13This is an example diagram illustrating the connectivity of circuit components in a power supply according to embodiments herein.

[0194] In this non-limiting example embodiment, power supply 1500 includes controller 1540 and multiple phases 221 and 222 that collectively generate a corresponding output voltage 123 (output current) to power load 118. Load 118 can be any suitable circuitry, such as a CPU (Central Processing Unit), GPU, and ASIC (such as those including one or more artificial intelligence accelerators), which can be located on a separate circuit board or a remote circuit board.

[0195] Note that the power supply 1500 may include any number of phases. If desired, the phases may be split such that the first phase 221 supplies power to the first load independently of the second phase 222 which supplies power to the second load. Alternatively, a combination of phases 221 and 222 drives the same load 118.

[0196] As shown in an example embodiment where a combination of operating phases 221 and 222 is used to power the same load 118, phase 221 includes switches QA1 and QB1 and an inductor path 1531 (such as conductive path 120-1). Phase 222 includes switches QA2 and QB2 and an inductor path 1532.

[0197] Furthermore, in this example embodiment, voltage source 120-1 supplies voltage V1 (such as 6VDC or any suitable voltage) to a series combination of switch QA1 (such as a high-side switch) and switch QB1 (such as a low-side switch).

[0198] In one embodiment, the combination of switches QA1 and QB1 and inductor path 1531 (such as an inductor implemented via conductive path 120-1 of circuit component 110) operate according to a buck converter topology to produce output voltage 123.

[0199] Furthermore, in this example embodiment, note that the drain node (D) of switch QA1 is connected to receive the voltage V1 provided by voltage source 120-1. The source node (S) of switch QA1 is coupled to the drain node (D) of switch QB1 and the input node of inductor path 1531. The source node of switch QB1 is coupled to ground. The output node of inductor path 1531 is coupled to load 118.

[0200] In this example embodiment, the drain node of switch QA2 in phase 222 is connected to receive voltage V1 provided by voltage source 120-1. The source node (S) of switch QA2 is coupled to the drain node (D) of switch QB2 and the input node of inductor path 1532 (such as an inductor implemented via conductive path 120-2 of circuit component 110). The source node of switch QB2 is grounded. The output node of inductor path 1532 is coupled to load 118.

[0201] As previously discussed, the combination of phases 221 and 222 produces an output voltage 123 that supplies power to load 118. That is, inductor path 1531 produces output voltage 123; inductor path 1532 also produces output voltage 123.

[0202] As shown in the figure, during operation, the controller 1540 generates control signals 105 (such as control signals A1 and B1) to control the state of the corresponding switches QA1 and QB1. For example, control signal A1 generated by the controller 1540 drives and controls the gate node of switch QA1; control signal B1 generated by the controller 1540 drives and controls the gate node of switch QB1.

[0203] In addition, controller 1540 generates control signals A2 and B2 to control the states of switches QA2 and QB2. For example, control signal A2 generated by controller 1540 drives and controls the gate node of switch QA2; control signal B2 generated by controller 1540 drives and controls the gate node of switch QB2.

[0204] In one embodiment, controller 1540 controls phases 221 and 222 to be 180 degrees out of phase with respect to each other.

[0205] As is known for buck converters, in phase 221, while switch QB1 is deactivated (off), high-side switch QA1 is activated to the ON state. This couples the input voltage V1 to the input of inductor path 1531, resulting in an increase (e.g., a ramp) in the amount of current supplied to load 118 by inductor path 1531. Conversely, while switch QA1 is deactivated (off), low-side switch QB1 is activated to the ON state. This couples the ground reference voltage to the input of inductor path 1531, resulting in a decrease (e.g., a ramp) in the amount of current supplied to load 118 by inductor path 1531. Controller 1540 monitors the magnitude of output voltage 123 and controls switches QA1 and QB1 to maintain output voltage 123 within the desired voltage range.

[0206] Similarly, via phase 222, while switch QB2 is deactivated (off), high-side switch QA2 is activated to the ON state. This couples the input voltage V1 to the input of inductor path 1532, resulting in an increase in the amount of current supplied to load 118 by inductor path 1532. Conversely, while switch QA2 is deactivated (off), low-side switch QB2 is activated to the ON state. This couples the ground reference voltage to the input of inductor path 1532, resulting in a decrease in the amount of current supplied to load 118 by inductor path 1532. Controller 1540 monitors the magnitude of output voltage 123 and controls switches QA2 and QB2 to maintain output voltage 123 within the desired voltage range.

[0207] Figure 14 This illustration shows an instance of a vertically stacked object according to an embodiment described herein. Figure 13 An example side view of a multiphase power supply.

[0208] Further embodiments described herein include receiving a circuit component 110 as previously discussed (such as including conductive paths 120-1 and 120-2).

[0209] The circuit board manufacturer 140 or manufacturing system places the circuit assembly 110 in a power converter fixed to a circuit board (such as substrate 1505). In one embodiment, the power converter (such as a voltage regulator) is operable to convert an input voltage to an output voltage.

[0210] In another example embodiment, when mounting circuit components in a power converter, the fabricator 140 positions the longitudinal axis of the first conductive path 120-1 (also referred to as the inductor path 1531 along the Y-axis) orthogonal to the planar surface of the substrate 1505; and the fabrication system positions the longitudinal axis of the second conductive path 1202 (also referred to as the inductor path 1532 along the Y-axis) orthogonal to the surface of the substrate 1505.

[0211] The instantiation of power supply 1500 in this example embodiment supports vertical power flow. For example, substrate 1505 and one or more corresponding power supplies (such as V1) supply power to power stack assembly 1600, which in turn supplies power to dynamic load 118. A ground reference (GND) transmitted through power stack assembly 1600 provides a return path and reference voltage for the current transmitted through the stack to load 118. As previously discussed, cut-out portions associated with circuit assembly 110 (such as cut-out portion 130-1, cut-out portion 130-2, etc.) may be filled with conductive material that provides a corresponding path between load 118 and substrate 1505.

[0212] In one embodiment, substrate 1505 is a circuit board (such as a standalone board, a motherboard, a standalone board intended to be coupled to a motherboard, etc.). A power stack assembly 1600, including one or more inductor devices, is coupled to substrate 1505. As previously discussed, load 118 can be any suitable circuitry, such as a CPU (Central Processing Unit), GPU, and ASIC (such as those including one or more artificial intelligence accelerators), which can be located on a standalone circuit board.

[0213] Note that the inductor paths 1531, 1532, etc., in the power stack assembly 1600 (instantiations of any inductor device 110, etc., discussed herein) can be instantiated in any suitable manner as described herein. In this non-limiting example embodiment, the power stack assembly 1600 includes one or more instantiations of any inductor device, such as conductive paths 120-1, 120-2, etc., as discussed herein. The power stack assembly 1600 can be configured to include any number of inductor devices (conductive paths) as described herein. In this example embodiment, circuit assembly 110 includes two instances of conductive paths 120-1 and 120-2.

[0214] In this example embodiment, the manufacturer 140 manufactures a power stack assembly 1600 (such as a DC-DC power converter) by stacking multiple components, including a first power interface 1601, one or more switches in a switching layer 1610, a connection layer 1620, one or more inductor assemblies (such as a circuit assembly 110 including inductor devices), and a second power interface 1602.

[0215] The fabricator 140 also places a first power interface 1601 at the base of the stack (power assembly 1600 of the component). The base of the power stack assembly 1600 (such as the power interface 1601) couples the power stack assembly 1600 to the substrate 1505.

[0216] In one embodiment, the fabricator 140 places capacitors 1521 and 1522 in a layer of a power stack assembly 1600 that includes a power interface 1601.

[0217] Furthermore, when manufacturing the power stack assembly 1600, the fabricator 140 electrically couples multiple switches, such as switches QA1, QB1, QA2, and QB2, in the power stack assembly 1600 to a first power interface 1601. The first power interface 1601 and its corresponding connection to the substrate 1505 enable switches QA1, QB1, QA2, and QB2 to receive power from the substrate 1505, such as power input from the input voltage V1 and the GND reference voltage. One or more traces, power layers, etc., on the substrate 1505 provide or transmit voltage from a voltage source (or power supply) to the power interface 1601 of the power stack assembly 1600.

[0218] As previously discussed, controller 1540 generates control signals 105 to control corresponding switches QA1, QB1, QA2, and QB2 in power stack assembly 1600 (see [link]). Figure 11 (Interconnectivity). The manufacturer 140 provides connectivity between the controller 1540 and switches QA1, QB1, QA2 and QB2 in any suitable manner to transmit the corresponding signals 105.

[0219] On top of the switches in the switch layer 1610, the manufacturer 140 also manufactures a power stack assembly 1600 to include one or more inductor devices as described herein. Furthermore, via the connection layer 1620, the manufacturer 140 connects switches QA1, QB1, QA2, and QB2 to one or more inductor devices 1531 (such as conductive path 120-1), 1532 (such as conductive path 120-2), etc.

[0220] More specifically, in this example embodiment, the fabricator 140 connects the source node (S) of switch QB1 to a ground reference node 1510-1 in the power interface 1601. Note that the ground reference node 1510-1 (such as a ground reference return path connected to the dynamic load 118) extends from the substrate 1505 to the dynamic load 118 via an L-shaped ground node 1510-1 (which is connected to a ground voltage reference). Additionally or alternatively, as previously discussed, cut-out portions filled with conductive material may also be used to provide a return path through the circuit assembly 110.

[0221] Fabricator 140 connects the drain node (D) of switch QB1 to node 1621 (e.g., made of metal), which is electrically connected to the first end 141 of inductor path 1531 (e.g., an instantiation of conductive path 120-1). Thus, via connection layer 1620, fabricator 140 connects the drain node of switch QB1 to inductor path 1531.

[0222] Fabricator 140 connects the drain node (D) of switch QA1 to the voltage source node 1520 of the first power interface 1601 (which is electrically connected to the input voltage V1). Fabricator 140 connects the source node (S) of switch QA1 to node 1621, which, as previously discussed, is electrically connected to the first end 141 of inductor path 1531 (such as an instantiation of conductive path 120-1). Thus, via connection layer 1620 and the corresponding node 1621, the source node of switch QA1 is connected to the inductor path 1531 of inductor device 110.

[0223] As further shown, fabricator 140 connects the source node (S) of switch QB2 to a ground reference node 15102 in power interface 1601. Ground reference node 1510-2 (current return path) extends from substrate 1505 to dynamic load 118 via an L-shaped ground reference node 1510-2 (which is connected to a ground voltage reference). Fabricator 140 connects the drain node (D) of switch QB2 to node 1622 (e.g., made of metal), which is electrically connected to the first end 141 of inductor path 1532 (e.g., an instantiation of conductive path 831 or conductive path 131). Thus, via connection layer 1620, the drain node of switch QB2 is connected to the inductor path 1532 of inductor device 110.

[0224] Note that although each of nodes 1510-1 and 1510-2 appears L-shaped from the side view of the power stack assembly 1600, in one embodiment, node 1510 extends circumferentially around the outer surface of the power stack assembly 1600 (in a manner similar to the conductive path 133 discussed earlier). Additionally or alternatively, as previously discussed, cut-off portions of circuit assembly 110 provide a means of transmitting voltage through circuit assembly 110.

[0225] As further shown, the fabricator 140 connects the drain node (D) of switch QA2 to the voltage source node 1520 in the power interface 1601 (which is connected to voltage V1). The fabricator 140 connects the source node (S) of switch QA2 to node 1622, which is electrically connected to the first axial end 141 of inductor path 1532 (an instantiation of conductive path 131 or conductive path 831). Thus, via the connection layer 1620 and the corresponding node 1622, the source node of switch QA2 is connected to inductor path 1532 (such as conductive path 120-2).

[0226] Therefore, the fabricator 140 places one or more switches (such as QA1, QB1, QA2 and QB2) in the power stack assembly 1600 between the first power interface 1601 and the inductor device 110.

[0227] In a non-limiting example embodiment, each of one or more switches QA1, QB1, QA2, and QB2 in the power stack assembly 1600 is a vertical field-effect transistor (VFET) disposed between the first power interface 1601 and the inductor device. However, it is noted, additionally or alternatively, that one or more switches QA1, QB1, QA2, and QB2 can be any suitable type of switch, such as a vertical or lateral VFET, a bipolar junction transistor (BJT), etc. Lateral VFETs are possible, but vertical VFETs are ideal for this concept because the flip-chip approach minimizes current loops.

[0228] As previously discussed, manufacturer 140 manufactures power stack assembly 1600 to include one or more inductor devices. In this example embodiment, manufacturer 140 arranges multiple inductor paths 1531 (conductive path 120-1) and inductor paths 1532 (conductive path 120-2) in the power stack assembly 1600 between multiple switches QA1, QB1, QA2, and QB2 and the second power interface 1602.

[0229] According to another embodiment, note that the fabrication of the plurality of inductor paths 1531 and 1532 includes: fabricating the plurality of inductor paths to include a first inductor path 1531 (conductive path 120-1) and a second inductor path 1532 (conductive path 120-2), which extend through the core magnetic material 161 of the respective inductor device 110 between the connection layer 1620 and the power interface 1602. In one embodiment, the fabricator 140 fabricates each inductor device 1510 to include: i) a core magnetic material 161, wherein the core magnetic material is a magnetically conductive material, and ii) a conductive path 120-1 extending from a first axial end of the conductive path 120-1 through the core material 161 to a second axial end 142 of the conductive path 120-1.

[0230] In this example embodiment, the first inductor path 1531 is located in the first phase 221 of the power supply stack assembly 1600 (power converter circuit). Figure 11 In the second inductor path 1532, the second inductor path 1532 is placed in the second phase 222 of the power supply stack assembly 1600 (power converter circuit). Figure 11 In the power converter (power stack assembly 1600), during operation, the combination of the first phase 221 and the second phase 222 arranged in parallel produces the output voltage 123. The controller 1540 can also be manufactured into the power stack assembly 1600 if desired.

[0231] In one embodiment, each of one or more inductor paths 1531 (such as conductive path 120-1) and 1532 (such as conductive path 120-2) is a corresponding non-winding path extending from a first layer (such as switch layer 1610) in a stack comprising a plurality of switches QA1, QB1, QA2 and QB2 to a second layer in the stack comprising a second power interface 1602.

[0232] Note that other embodiments described herein include: connecting multiple inductor paths in inductor device 1510 in parallel to increase the inductance of the respective inductor paths. As described herein, any number of inductor paths can be connected in parallel to provide the desired total inductance. Therefore, in addition to parameters such as the permeability of the core material 161 of the respective circuit component 110 and the respective length (between the first end 141 and the second end 142) of each non-winding conductive path (such as a straight path or direct path) in inductor device 110, embodiments herein also include: connecting multiple inductor paths in parallel to control the inductance value provided by the respective inductor device 110. Furthermore, as previously discussed, embodiments herein include: manufacturing the core material 161 in the inductor device such that the magnitude of the core's permeability varies relative to the respective conductive path providing connectivity between layers 1620 and 1602.

[0233] As further shown, the fabricator 140 places the inductor devices in the power stack assembly 1500 between a plurality of switches (QA1, QB1, QA2 and QB2) in the switch layer 1610 and the second power interface 1602.

[0234] More specifically, the manufacturer 140 produces a power assembly 1600 to include a second power interface 1602. In one embodiment, the manufacturer 140 connects the output axial ends and corresponding nodes of inductor devices (120-1 and 120-2) to the second power interface 1602. The second power interface 1602 is operable to receive and output the output voltage 123 generated by inductor devices L1 (conductive path 120-1) and L2 (conductive path 120-2) to a load 118. The manufacturer 140 couples the output nodes of both inductor paths 1531 and 1532 to an output voltage node 1631 (such as a material layer, such as metal). Thus, the output voltage node 1631 is electrically connected to the outputs of the respective inductor paths 1531 and 1532.

[0235] As the name suggests, the output voltage node 1631 transmits the output voltage 123 to power the load 118.

[0236] In one embodiment, one or more nodes or pins, pads, etc. of the dynamic load 118 are coupled to the output voltage node 1631. For example, the output voltage node 1631 of the power stack assembly 1500 delivers the output voltage 123 generated by each of the inductor paths 1531 and 1532 to one or more nodes, pins, pads, etc. of the load 118.

[0237] Therefore, by switching the inductor path between the ground voltage and the input voltage V1, the combination of inductor paths 1531 and 1532 jointly generates an output voltage 123 to power the load 118.

[0238] As previously discussed, the power stack assembly 1600 also includes ground nodes 1510-1 and 1510-2. In one embodiment, the instantiation of conductive paths 1510-1 and 1510-2 (such as ground nodes) provides perimeter electromagnetic shielding relative to the power stack assembly 1600, thereby preventing or reducing the corresponding radiation emitted into the surrounding environment.

[0239] In some other embodiments, the fabricator 140 fabricates a first power interface 1601 including a first contact element operable to connect the first power interface 1601 located at the base of the power stack assembly 1600 to the main substrate 1505. The fabricator 140 fabricates a second power interface 1602 including a second contact element operable to secure a dynamic load 118 to the power stack assembly 1600.

[0240] Note that the power stack assembly 1500 is manufactured to also include first capacitors 1521, 1522, etc., providing connectivity between input voltage node 1520 (a first conductive path that supplies input voltage V1 to power stack assembly 1600) and ground nodes 1510-1 and 1510-2 (such as a second conductive path that supplies ground reference voltage to power stack assembly 1600).

[0241] The fabricator 140 also places an output voltage node 1631 (such as another conductive path) in a layer of the power stack assembly 1602, which includes a second power interface 1602. As previously discussed, the output voltage node 1631 (such as a metal layer) is operable to deliver an output voltage 123 to the dynamic load 118.

[0242] According to another embodiment, the manufacturer 140 manufactures a power supply stack assembly 1600 to include a second capacitor (1691, 1692, etc.) connected between an output voltage node 1631 and a corresponding ground node 1510. More specifically, capacitor 1691 is coupled between the output voltage node 1631 and ground node 1510-1; capacitor 1692 is coupled between the output voltage node 1631 and ground node 1510-2.

[0243] Another embodiment described herein includes securing a dynamic load 118 to a second power interface 1602. Thus, the dynamic load 118 is secured to the top of the power stack assembly 1600.

[0244] The power stack assembly 1600 described herein (such as an assembly of vertically stacked components) offers advantages over conventional power converters. For example, the power stack assembly 1600 described herein provides novel connectivity of the components in the assembly (such as via stacking), resulting in shorter circuit paths and lower losses when converting and delivering power to the dynamic load 118.

[0245] As previously mentioned Figure 11 During operation, the inductor devices L1 and L2, and their corresponding inductor paths 1531 and 1532, are operable to generate an output voltage 123 based on the received power (current supplied by the input voltage V1). In other words, the power stack assembly 1600 and the corresponding manufactured component stack (such as the first power interface 1601, one or more switches QA1, QB1, QA2 and QB2, inductor device 110, and second power interface 1602) are power converters operable to convert the input voltage V1 (such as a DC voltage) received at the first power interface 1601 into an output voltage 123 (such as a DC voltage) output from the second power interface 1602 to the dynamic load 118.

[0246] Further embodiments described herein include the fabrication of a system. For example, embodiments described herein include a fabricator 140. The fabricator 140 receives a substrate 1505, such as a circuit board; the fabricator 140 attaches the base (such as interface 1601) of a stack of components (such as a power stack assembly 1600) to the circuit board. As previously discussed, the stack of components (power stack assembly 1600) is operable to generate an output voltage 123 to power a load 118. The load 118 is attached to the circuit board or to the top of the power stack assembly 1600.

[0247] Furthermore, as previously discussed, load 118 can be any suitable circuit, such as a CPU (Central Processing Unit), GPU, and ASIC (such as those including one or more AI accelerators), which can be located on a separate circuit board.

[0248] Figure 15 This is an example diagram illustrating a circuit assembly according to an embodiment described herein.

[0249] As shown in this example embodiment, circuit assembly 2100 includes a power stack assembly 1600 disposed in an insertion layer 2110. Insertion layer 2110 provides circuit path connectivity between substrate 2190 and load substrate 2130 (and load 118).

[0250] As previously discussed, the power stack assembly (1600) receives an input voltage (and any other voltage reference signals, such as ground and / or V1, V2, etc.) from the substrate 2190. The power stack assembly (1600) converts the input voltage into an output voltage 123 (and / or an output current), which powers the corresponding load 118 and / or other circuit components disposed on the load substrate 2130.

[0251] In one embodiment, substrate 2190 is a printed circuit board (PCB) substrate, although substrate 2190 can be any suitable component to which socket 2150 (optional) or insert layer 2110 is connected. Insert layer 2110 communicates with substrate 2190 via insertion into socket 2150. In the absence of socket 2150, insert layer 2110 is directly connected to substrate 2190.

[0252] Figure 16 This is an example diagram illustrating a circuit assembly according to an embodiment described herein.

[0253] As shown in this example embodiment, circuit assembly 2200 includes a power stack assembly 1600 disposed in a CPU (Central Processing Unit) substrate 2210. In one embodiment, the power stack assembly 1600 is integrated into a laminated portion of the CPU substrate 2210 itself. The CPU substrate 2210 provides circuit path connectivity between substrate 2290 and load 118 (and other components connected to CPU substrate load 2120).

[0254] As previously discussed, the power stack assembly (1600) receives an input voltage (and any other voltage reference signals, such as ground and / or voltages V1, V2, etc.) from the substrate 2290. The power stack assembly (1600) converts the input voltage into an output voltage (and / or output current) that powers the corresponding load 118 and / or other circuit components arranged on the load CPU substrate 2210.

[0255] In one embodiment, substrate 2290 is a printed circuit board (PCB) substrate, although substrate 2290 can be any suitable component directly connected to socket 2250 (optional) or CPU substrate 2210. CPU substrate layer 2210 and power stack assembly communicate with substrate 2290 via insertion into socket 2250. In the absence of socket 2250, CPU substrate 2210 is directly connected to substrate 2290.

[0256] Figure 17 This is an example diagram illustrating a circuit assembly according to an embodiment described herein.

[0257] As shown in this example embodiment, circuit assembly 1900 includes a power stack assembly 1600 disposed in a substrate 2390 such as a circuit board (e.g., a printed circuit board).

[0258] In one embodiment, the power stack assembly 1600 is embedded or fabricated in an opening in the substrate 2390. In other words, in one embodiment, the power stack assembly 1600 (converter unit) is fabricated (inserted) into an opening located beneath the CPU substrate 2310. The CPU substrate 2310 provides circuit path connectivity between the substrate 2390 and the load 128 (and / or other components connected to the CPU substrate load 1910).

[0259] As previously discussed, the power stack assembly (1600) receives an input voltage (and any other voltage reference signals, such as ground and / or V1, V2, etc.) from the substrate 2390. The power stack assembly (1600) converts the input voltage into an output voltage (and / or output current) that powers the corresponding load 118 and / or other circuit components disposed on the load CPU substrate 2310.

[0260] In one embodiment, substrate 2390 is a printed circuit board (PCB) substrate, although substrate 2390 can be any suitable component to which socket 2350 (optional) or CPU substrate 2310 is directly connected. In one embodiment, CPU substrate 2310 communicates with substrate 2390 via insertion into socket 2350. In the absence of socket 2350, CPU substrate 2310 is directly connected to substrate 2390.

[0261] The embodiments described herein introduce a two-dimensional arrangement with n rows and m columns (or, alternatively, k single-turn inductors arranged in a close-packed configuration) into a purely vertical power flow arrangement. Three different embodiments exist:

[0262] a) All inductors share a single magnetic core.

[0263] b) A group of inductors share a single magnetic core; the entire solution consists of more than one magnetic core.

[0264] c) Each inductor has its own magnetic core.

[0265] It should also be noted that the inductor device (circuit assembly 110) discussed herein may have one or more air gaps (e.g., distributed across the cross-section of the core). An air gap is a region spanning the entire cross-section of the core with a relative permeability very close to 1. The concept of an air gap can be extended to regions with very low permeability, such as <10. A distributed air gap is a core with several very thin air gaps. A preferred embodiment of the invention disclosed is an inductor without any air gaps but with cutouts (cut-out portions).

[0266] Other embodiments described herein include controlling the coupling between phases (conductive paths) and balanced electrical return paths by means of geometric arrangement and asymmetric physical layout.

[0267] Figure 18 This is a diagram illustrating an example computer architecture operable to perform one or more methods according to embodiments described herein.

[0268] As previously discussed, any resources discussed herein (such as manufacturer 140, etc.) can be configured to include computer processor hardware and / or corresponding executable instructions to perform the various operations discussed herein.

[0269] As shown in the figure, the computer system 1700 of this example includes interconnect 1711, which couples to computer-readable storage medium 1712, such as a non-transitory type medium (which can be any suitable type of hardware storage medium in which digital information can be stored and retrieved), processor 1713 (computer processor hardware), I / O interface 1714, and communication interface 1717.

[0270] The 1714 (multiple) I / O interfaces support connectivity with external hardware such as keyboards, displays, storage devices, manufacturing equipment, etc.

[0271] The computer-readable storage medium 1712 can be any hardware storage device, such as a memory, optical storage, hard disk drive, floppy disk, etc. In one embodiment, the computer-readable storage medium 1712 stores instructions and / or data.

[0272] As shown in the figure, the computer-readable storage medium 1712 can be encoded with a manufacturer application 150-1 (such as, including instructions) to perform any of the operations discussed herein.

[0273] During operation in one embodiment, processor 1713 accesses computer-readable storage medium 1712 via interconnect 1711 to initiate, run, execute, interpret, or otherwise perform instructions in manufacturer application 150-1 stored on computer-readable storage medium 1712. Execution of manufacturer application 150-1 produces manufacturer process 1502 to perform any operations and / or processes as discussed herein.

[0274] Those skilled in the art will understand that computer system 1700 may include other processes and / or software and hardware components, such as an operating system that controls the allocation and use of hardware resources to execute manufacturer application 150-1.

[0275] According to different embodiments, note that the computer system can reside in any variety of devices, including but not limited to power supplies, switched-capacitor converters, power converters, mobile computers, personal computer systems, wireless devices, wireless access points, base stations, telephone equipment, desktop computers, laptop computers, notebook computers, netbook computers, mainframe computers, handheld computers, workstations, network computers, application servers, storage devices, consumer electronic devices such as cameras, camcorders, set-top boxes, mobile devices, video game consoles, handheld video game devices, peripheral devices such as switches, modems, routers, set-top boxes, content management devices, handheld remote control devices, any type of computing or electronic device, etc. The computer system 1700 can reside anywhere or can be included in any suitable resource in any network environment to achieve the functionality discussed herein.

[0276] As described in this article, functionality is supported by one or more resources via Figure 19 The following flowchart will be used for discussion. Please note that the steps in the flowchart below can be performed in any suitable order.

[0277] Figure 19 This is a flowchart 1900 illustrating an example method according to an embodiment of this document. Note that there is some overlap in the concepts discussed above.

[0278] In processing operation 1910, the fabricator 140 receives magnetic material 161.

[0279] In processing operation 1920, the fabricator 140 creates a multidimensional arrangement of conductive paths 120 to extend through the magnetically conductive material 161. Each of the conductive paths 120 is a corresponding inductive path.

[0280] Again, it should be noted that the techniques described herein are well-suited for use in corresponding implementations in the manufacture of inductor devices and power converter applications. However, it should be understood that the embodiments described herein are not limited to such applications, and the techniques discussed herein are also well-suited for other applications.

[0281] Although the invention has been specifically shown and described with reference to its preferred embodiments, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. Such variations are intended to be covered by the scope of the invention. Thus, the foregoing description of embodiments of the invention is not intended to be limiting. Rather, any limitation on the invention is set forth in the following claims.

Claims

1. A magnetic device, comprising: Magnetic materials; Multidimensional arrangement of conductive paths; as well as Each of the plurality of conductive paths is a corresponding inductive path extending through the magnetically conductive material; The conductive path in the multidimensional arrangement includes a first conductive path and a second conductive path; and The height of the magnetic material relative to the first conductive path is different from the height of the magnetic material relative to the second conductive path; or The dimensions of the magnetic material surrounding the first conductive path are different from the dimensions of the magnetic material surrounding the second conductive path. or The volume shape of the magnetic material surrounding the first conductive path is different from the volume shape of the magnetic material surrounding the second conductive path; or The cross-sectional area of ​​the first conductive path as observed along the longitudinal axis of the first conductive path is different from the cross-sectional area of ​​the second conductive path as observed along the longitudinal axis of the second conductive path.

2. The magnetic device according to claim 1, wherein the first conductive path and the second conductive path are arranged along a first axis; and The conductive path includes a third conductive path that is offset relative to the first axis in the multidimensional arrangement.

3. The magnetic device of claim 1, wherein the magnetically conductive material is manufactured to include at least one cut-off portion, the at least one cut-off portion being operable to reduce inductive coupling between the first conductive path and the second conductive path, and the magnetically conductive material is not present in the at least one cut-off portion.

4. The magnetic device according to claim 1, wherein each of the conductive paths is a single-turn inductor device disposed in the multidimensional arrangement of the plurality of conductive paths.

5. The magnetic device according to claim 1, wherein the magnetically conductive material comprises a first magnetically conductive material and a second magnetically conductive material, the first magnetically conductive material having a first permeability and the second magnetically conductive material having a second permeability.

6. The magnetic device according to claim 1, wherein the conductive path in the multidimensional arrangement further includes a third conductive path, and the magnetic device further includes: A first unit, wherein the first conductive path resides, the first unit being at least partially defined by a first portion of the magnetically conductive material surrounding the first conductive path; A second unit, wherein the second conductive path resides, the second unit being at least partially defined by a second portion of the magnetically conductive material surrounding the first conductive path; and A third unit, wherein the third conductive path resides, the third unit being at least partially defined by a third portion of the magnetically conductive material, the third unit being offset relative to the axis between the first unit and the second unit.

7. The magnetic device according to claim 6, further comprising: The cut-off portion is positioned between the first unit and the third unit, and the magnetic material is not present in the cut-off portion.

8. The magnetic device of claim 7, wherein the cut-off portion is at least partially filled with material.

9. The magnetic device according to claim 1, wherein each conductive path in the conductive path is disposed in a corresponding unit of the magnetically conductive material, and each corresponding unit is individually encapsulated by the conductive material.

10. The magnetic device of claim 1, wherein the multidimensional arrangement of the conductive path comprises: The first set of conductive paths; The first group of units, each unit in the first group of units includes a conductive path in the first group of conductive paths, each conductive path in the first group of conductive paths being encapsulated by the magnetically conductive material to form a corresponding unit in the first group of units; The first part of the conductive material encapsulates the first group of units; The second set of conductive paths; The second group of units, each unit in the second group of units includes a conductive path in the second group of conductive paths, each conductive path in the second group of conductive paths being encapsulated by the magnetically conductive material to form a corresponding unit in the second group of units; as well as The second part of the conductive material encapsulates the second set of units.

11. The magnetic device according to claim 10, further comprising: The first cut-off portion is placed at the center of the first group of units, and the magnetic material is not present in the first cut-off portion; as well as The second cut-off portion is placed at the center of the second group of units, and the magnetic material is not present in the second cut-off portion.

12. The magnetic device of claim 11, wherein the diameter of the first conductive path in the first group of conductive paths is larger than the diameter of the second conductive path in the first group of conductive paths; and The diameter of the first conductive path in the second group of conductive paths is greater than the diameter of the second conductive path in the second group of conductive paths.

13. The magnetic device according to claim 10, further comprising: At least one cut-off portion is disposed between the first group of units and the second group of units, and the magnetic material is not present in the at least one cut-off portion.

14. The magnetic device of claim 1, wherein the first conductive path is encapsulated by a first portion of the magnetically conductive material to form a first unit; The second conductive path is encapsulated by a second portion of the magnetically conductive material to form a second unit, which is larger than the first unit.

15. The apparatus of claim 10, further comprising: Multiple cut-out portions are placed at the perimeter of the first group of units, and the magnetic material is not present in the multiple cut-out portions.

16. A method for manufacturing a voltage regulator circuit, comprising: Receiving substrate; The magnetic device according to claim 1 is manufactured as part of the voltage regulator circuit coupled to the substrate.

17. A method for manufacturing an electronic device, comprising: Receive the magnetic device according to claim 1; as well as The magnetic device is housed in a power converter fixed to a circuit board, the power converter being operable to convert an input voltage into an output voltage.

18. A method for manufacturing a magnetic device, comprising: Receive magnetically conductive material; The conductive paths are arranged in a multidimensional manner to extend through the magnetically conductive material, and each conductive path is a corresponding inductive path. The multidimensional arrangement of the conductive paths is fabricated to include a first conductive path and a second conductive path; and The height of the magnetic material relative to the first conductive path is made different from the height of the magnetic material relative to the second conductive path; or The dimensions of the magnetic material surrounding the first conductive path are different from the dimensions of the magnetic material surrounding the second conductive path; or The volume shape of the magnetic material surrounding the first conductive path is manufactured to be different from the volume shape of the magnetic material surrounding the second conductive path; or The cross-sectional area of ​​the first conductive path, as observed along the longitudinal axis of the first conductive path, is manufactured to be different from the cross-sectional area of ​​the second conductive path, as observed along the longitudinal axis of the second conductive path.

19. The method of claim 18, further comprising: The first conductive path and the second conductive path are manufactured to be positioned along the first axis; as well as The conductive path is fabricated to include a third conductive path offset relative to the first axis in the multidimensional arrangement.

20. The method of claim 18, further comprising: The magnetic material is manufactured to include at least one cut-out portion to reduce inductive coupling between the first conductive path and the second conductive path, wherein the magnetic material is not present in the at least one cut-out portion.

21. The method of claim 18, further comprising: A single-turn inductor device in a multidimensional arrangement in which each of the conductive paths is arranged as a plurality of conductive paths.

22. The method of claim 18, further comprising: The magnetically conductive material is manufactured to include a first magnetically conductive material and a second magnetically conductive material, wherein the first magnetically conductive material has a first magnetic permeability and the second magnetically conductive material has a second magnetic permeability.

23. The method of claim 18, further comprising: The method further includes fabricating the conductive path in the multidimensional arrangement to include a third conductive path, wherein the method also includes: The multidimensional arrangement is fabricated to include a first unit, in which the first conductive path resides, and the first unit is at least partially defined by a first portion of the magnetically conductive material surrounding the first conductive path. The multidimensional arrangement is fabricated to include a second unit, in which the second conductive path resides, the second unit being at least partially defined by a second portion of the magnetically conductive material surrounding the first conductive path; and The multidimensional arrangement is manufactured to include a third unit, in which a third conductive path resides, the third unit being at least partially defined by a third portion of the magnetically conductive material, the third unit being offset relative to the axis between the first unit and the second unit.

24. The method of claim 23, further comprising: A cut-off portion is placed between the first unit and the third unit, wherein the magnetic material is not present in the cut-off portion.

25. The method of claim 24, further comprising: The cut-off portion is at least partially filled with material.

26. The method of claim 24, wherein each conductive path in the conductive path is disposed in a corresponding unit of the magnetically conductive material, the method further comprising: Each corresponding unit is encapsulated with a conductive material.

27. The method of claim 18, further comprising: The multidimensional arrangement of the conductive path is manufactured to include: A first group of conductive paths, each conductive path in the first group being encapsulated by the magnetically conductive material to form a first group of units, the first group of units being encapsulated by a first portion of the conductive material; and The second set of conductive paths, each of which is encapsulated by the magnetically conductive material to form a second set of units, the second set of units being encapsulated by a second portion of the conductive material.

28. The method of claim 18, further comprising: The multidimensional arrangement of the conductive paths is fabricated to include: The first set of conductive paths; The first group of units, each unit in the first group of units includes a conductive path in the first group of conductive paths, each conductive path in the first group of conductive paths being encapsulated by the magnetically conductive material to form a corresponding unit in the first group of units; The first part of the conductive material encapsulates the first group of units; The second set of conductive paths; A second group of units, each unit in the second group of units including a conductive path in the second group of conductive paths, each conductive path in the second group of conductive paths being encapsulated by the magnetically conductive material to form a corresponding unit in the second group of units; and The second part of the conductive material encapsulates the second set of units.

29. The method of claim 28, further comprising: The first cut-off portion is placed at the center of the first group of units, and the magnetic material is not present in the first cut-off portion; as well as The second cut-off portion is placed at the center of the second set of units, and the magnetic material is not present in the second cut-off portion.

30. The method of claim 29, further comprising: The diameter of the first conductive path in the first group of conductive paths is made larger than the diameter of the second conductive path in the first group of conductive paths. as well as The diameter of the first conductive path in the second group of conductive paths is made larger than the diameter of the second conductive path in the second group of conductive paths.

31. The method of claim 18, further comprising: The first conductive path is encapsulated by a first portion of the magnetically conductive material to form a first unit; as well as The second conductive path is encapsulated by a second portion of the magnetically conductive material to form a second unit, the second unit being larger than the first unit.

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