A sinusoidal microchannel heat sink based on phase change microcapsule / nanoparticle hybrid suspension and having porous fins

Abstract

A sinusoidal microchannel heat sink based on phase change microcapsule / nanoparticle mixed suspension and having porous fins. A closed heat sink shell composed of a substrate, a heat-conducting baffle and a heat-conducting cover plate, the substrate being connected to the heat generation end of an electronic device, a plurality of microchannel phase change heat transfer units being arranged in the heat sink shell, the microchannel phase change heat transfer units comprising sinusoidal corrugated porous fins and channel cavities connected thereto, and the sinusoidal corrugated porous fins and channel cavities being filled with phase change microcapsule / nanoparticle mixed suspension as working fluid. By arranging sinusoidal corrugated porous fins between the microchannel substrate and the cover plate, and using mixed suspension as working fluid to improve the effective transmission of heat inside the channel, the overall heat dissipation efficiency of the heat sink is improved, and the heat resistance and pressure drop are simultaneously reduced.

Description

Technical Field

[0001] This invention relates to the field of microchannel heat sinks, and more specifically, to a sinusoidal microchannel heat sink based on a phase change microcapsule / nanoparticle hybrid suspension and having porous fins. Background Technology

[0002] Today, microelectronic devices and chips are evolving towards faster, smaller, and more powerful designs to meet the growing demand for high-performance, miniaturized, and highly integrated electronics. The dramatic increase in heat generation from these devices can lead to overheating, impacting performance and reliability. Effective thermal management is crucial for the stable operation of microdevices and chips, but traditional cooling technologies are insufficient. Fluid cooling is a common and effective method for addressing the heat dissipation problem of electronic components. Currently, the continuous shrinking of electronic device packaging sizes and the further increase in system and component integration have led to a significant increase in heat flux, posing a significant challenge to the heat dissipation requirements of simple water-cooled microchannel heat sinks. Phase change microcapsule / nanoparticle hybrid suspensions are mixed fluids created by adding phase change microcapsules and metal / non-metal nanoparticles to a base fluid. This fluid absorbs / releases a large amount of heat through the melting / solidification of the phase change material within the microcapsule shell. The nanoparticles possess excellent thermal conductivity, resulting in high energy density and heat transfer efficiency without sacrificing fluidity. The wall material of the microcapsule particles ensures excellent dispersion stability. Furthermore, microchannels filled with porous materials are considered a promising alternative for high heat density applications due to their large surface contact area and strong local fluid mixing capabilities, which enhance convective heat transfer. However, in straight-channel configurations, the coolant streamlines almost parallel to the channel lead to poor fluid mixing and a thicker thermal boundary layer. The regular flow of the coolant also inevitably reduces heat transfer along the flow direction. In contrast, wavy designs can improve the problem of poor coolant mixing and exhibit significantly better heat transfer performance than straight channels at the same cross-section.

[0003] With the increasing power density of electronic devices, further improvements are needed to the heat sink body to enhance its heat dissipation performance and simultaneously reduce thermal resistance and voltage drop. Summary of the Invention

[0004] The purpose of this invention is to provide a sinusoidal microchannel heat sink based on a phase change microcapsule / nanoparticle hybrid suspension and having porous fins, which can improve the overall heat dissipation efficiency of the heat sink while reducing thermal resistance and voltage drop.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows: a sealed heat sink housing comprising a substrate, a heat-conducting baffle, and a heat-conducting cover plate, wherein the substrate is connected to the heat-generating end of the electronic device, and a plurality of microchannel phase change heat transfer units are provided inside the heat sink housing, wherein the microchannel phase change heat transfer unit comprises sinusoidal corrugated porous fins and a channel cavity formed between two adjacent sinusoidal corrugated porous fins and communicating with the sinusoidal corrugated porous fins, wherein a gap is provided between the two ends of the sinusoidal corrugated porous fins and the heat-conducting baffle, and a phase change microcapsule / nanoparticle mixed suspension as a working fluid is filled in the sinusoidal corrugated porous fins and the channel cavity.

[0006] The sinusoidal corrugated porous fins are made of sintered porous media, and the porosity of the sinusoidal corrugated porous fins along the coolant flow direction can be designed with a non-uniform arrangement according to the principle of "high heat transfer efficiency and low flow resistance".

[0007] The substrate has a fixing groove on the surface opposite to the heat-conducting cover plate for fixing the sinusoidal corrugated porous fins.

[0008] The phase change materials in the microcapsules of the phase change microcapsule / nanoparticle hybrid suspension include n-hexadecane, n-octadecane, n-eicosane and their derivatives.

[0009] The nanoparticles in the phase change microcapsule / nanoparticle mixed suspension are aluminum, titanium, silicon and their oxides, with a mass concentration of 1-15%, and the flow rate of the phase change microcapsule / nanoparticle mixed suspension is 0.01-2 m / s.

[0010] The substrate and sintered porous dielectric material are made of copper, aluminum or silicon with high thermal conductivity.

[0011] The phase difference between the interface between the sinusoidal corrugated porous fin and the cavity of the channel on both sides can be automatically adjusted according to the different channel inlet width requirements. The phase difference between the two boundaries of the sinusoidal corrugated porous fin can be adjusted, including but not limited to the channel boundary of 0°, 90°, 180° or 270°.

[0012] The interface between the sinusoidal corrugated porous fin and the cavity of the channel on both sides adopts a uniform corrugation pattern with constant wavelength, a front dense and back sparse corrugation pattern with wavelength first small and then large, or a front sparse and back dense corrugation pattern with wavelength first large and then small.

[0013] The height of the sinusoidal corrugated porous fin is 0.1–10 mm, the width of the channel cavity is 0.01–1 mm, the amplitude of the sinusoidal corrugated porous fin is 0.01–1 mm, the wavelength of the sinusoidal corrugated porous fin is 0.1–10 mm, the porosity of the sinusoidal corrugated porous fin is 0.3–0.99, the pore diameter of the sinusoidal corrugated porous fin is 0.01–0.5 mm, the porosity ratio of the non-uniformly arranged sinusoidal corrugated porous fin is in the range of 0.3–3.3, and the length ratio of the non-uniformly arranged sinusoidal corrugated porous fin along the coolant flow direction is in the range of 0.1–10.

[0014] This invention improves the overall heat dissipation efficiency of the radiator and simultaneously reduces thermal resistance and voltage drop by setting sinusoidal corrugated porous fins between the microchannel substrate and the cover plate, and using a mixed suspension as the working fluid to improve the effective heat transfer inside the channel.

[0015] Compared with the prior art, the advantages of the present invention are as follows:

[0016] (1) The combination design of porous fins and mixed suspension can significantly improve the heat transfer capacity of microchannel radiators. Compared with traditional solid fin radiators, it has a smaller temperature gradient and a more uniform temperature distribution. Porous fin microchannel radiators can simultaneously obtain a larger heat transfer coefficient and a lower pressure drop.

[0017] (2) The porous fins increase the specific surface area and reduce the flow resistance, which can effectively decouple the conflict between flow performance and heat transfer performance, improve the heat exchange effect of the radiator, and shorten the time to cool to the predetermined temperature.

[0018] (3) The sinusoidal corrugated flow channel arrangement increases the convective heat transfer area while enhancing the mixing and secondary disturbance of the coolant, making the temperature distribution inside the channel more uniform.

[0019] (4) The porosity of the sinusoidal corrugated porous fins along the coolant flow direction is arranged in a non-uniform manner, which can achieve the control principle of "high heat transfer efficiency and low flow resistance".

[0020] (5) The sinusoidal corrugated porous fins can automatically adjust the phase difference between the two sides of the sinusoidal corrugated porous fins according to the width of the channel inlet, which can achieve precise control of coolant flow rate and flow rate under different channel inlet conditions.

[0021] (6) Through the efficient heat transport of high thermal conductivity nanoparticles in the suspension and the latent heat storage of phase change capsules, the coolant can absorb a large amount of heat in a short time, solving the problems of difficult heat collection and low power density.

[0022] (7) By improving the existing technology, the present invention effectively reduces the overall volume of the radiator body, improves the heat dissipation efficiency of the radiator, and has a reasonable structure that is easy to implement. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0024] Figure 2 This is a schematic diagram of the structure of the microchannel phase change heat transfer unit 4 of the present invention;

[0025] In the figure: 1. Substrate; 2. Vertically placed solid thermally conductive baffle; 3. Thermally conductive cover plate; 4. Microchannel phase change heat transfer unit; 5. Sinusoidal corrugated porous fins; 6. Channel cavity.

[0026] Figures 3-8 This is a top-view cross-sectional view of a single phase change heat transfer unit. Detailed Implementation

[0027] To enable a clearer understanding of the present invention, the present invention will be described in detail below with reference to the accompanying drawings of the embodiments. However, the description of the embodiments is not intended to limit the present invention. Any formal but not substantive equivalent transformations made based on the concept of the present invention should be considered within the scope of the present invention.

[0028] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and size ratio of each component can be changed accordingly according to actual needs.

[0029] like Figure 1 and Figure 2As shown, the present invention comprises a sealed heat sink housing consisting of a substrate 1, a heat-conducting baffle 2, and a heat-conducting cover plate 3. The substrate 1 is connected to the heat-generating end of the electronic device. Several microchannel phase change heat transfer units 4 are provided inside the heat sink housing. Each microchannel phase change heat transfer unit 4 includes sinusoidal corrugated porous fins 5 made of sintered porous medium and channel cavities 6 formed between adjacent sinusoidal corrugated porous fins 5, which are connected to the sinusoidal corrugated porous fins 5. The porosity of the sinusoidal corrugated porous fins 5 along the coolant flow direction can be designed with a non-uniform arrangement according to the principle of "high heat transfer efficiency and low flow resistance". There is a gap between the two ends of the sinusoidal corrugated porous fins 5 and the heat-conducting baffle 2. Fixing grooves for fixing the sinusoidal corrugated porous fins 5 are opened on the surface opposite to the heat-conducting cover plate 3. The sinusoidal corrugated porous fins 5 and the channel cavity 6 are filled with a phase change microcapsule / nanoparticle mixed suspension as the working fluid. The substrate 1 and the sintered porous dielectric material are made of copper, aluminum or silicon with high thermal conductivity.

[0030] The phase change microcapsule / nanoparticle hybrid suspension undergoes phase change heat transfer and is uniformly distributed within the internal channel cavity 6 of the heat sink. The substrate 1 and the thermally conductive cover plate 3 have polished inner surfaces to reduce fluid flow resistance. The key to the efficient heat transfer of the phase change microcapsule / nanoparticle hybrid suspension lies in selecting a phase change material with a suitable melting point that matches the high thermal conductivity nanoparticles; this must be determined based on the actual operating conditions.

[0031] The phase change materials in the microcapsules of the phase change microcapsule / nanoparticle mixed suspension of the present invention include n-hexadecane, n-octadecane, n-eicosane and their derivatives, and the nanoparticles are aluminum, titanium, silicon and their oxides, with a mass concentration of 1-15%, and the flow rate of the phase change microcapsule / nanoparticle mixed suspension is 0.01-2 m / s.

[0032] Figures 3-8 The diagram shows a top-view cross-sectional view of the microchannel unit, including sinusoidal corrugated porous fins 5 and channel cavities 6 located on both sides of the fins. The interface between the sinusoidal corrugated porous fins and the channel cavities on both sides can automatically adjust the phase difference between the two boundaries of the sinusoidal corrugated porous fins according to the width of the channel inlet. The interface type between the sinusoidal corrugated porous fins 5 and the channel cavities on both sides 6 includes, for example: Figure 3 The channel boundary shown has a phase difference of 0°, such as Figure 4 The channel boundary shown has a phase difference of 90°, as... Figure 5 The channel boundary shown has a phase difference of 180°, as... Figure 6 The channel boundary shown has a phase difference of 270°. The interface type between the sinusoidal corrugated porous fin 5 and the channel cavities on both sides also includes, for example... Figure 3 The uniform ripple pattern with constant wavelength shown, such as Figure 7The wave pattern shown is characterized by wavelengths increasing from small to large, with denser waves at the beginning and sparser waves at the end. Figure 8 The wave pattern shown is characterized by a wavelength that decreases from large to small, with sparser and denser ripples at the beginning.

[0033] The height of the sinusoidal corrugated porous fin 5 of the present invention is 0.1-10 mm, the width of the channel cavity 6 is 0.01-1 mm, the amplitude of the sinusoidal corrugated porous fin 5 is 0.01-1 mm, the wavelength of the sinusoidal corrugated porous fin 5 is 0.1-10 mm, the porosity of the sinusoidal corrugated porous fin 5 varies from 0.3 to 0.99, the pore diameter of the sinusoidal corrugated porous fin 5 varies from 0.01 to 0.5 mm, the porosity ratio of the non-uniformly arranged sinusoidal corrugated porous fins ranges from 0.3 to 3.3, and the length ratio of the non-uniformly arranged sinusoidal corrugated porous fins along the coolant flow direction ranges from 0.1 to 10.

[0034] The microchannel radiator is horizontally positioned, with sinusoidal corrugated porous fins 5 uniformly arranged within the cavity formed by the heat-conducting baffle 2. The arrangement of the sinusoidal corrugated porous fins 5 increases the convective heat transfer area while enhancing the mixing and secondary disturbance of the coolant, thereby improving the heat dissipation effect of the radiator and shortening the time to cool to the predetermined temperature.

[0035] This invention improves upon existing technologies, effectively enhancing the heat dissipation rate and efficiency of radiators. It also features a reasonable structure, ease of manufacture, high reliability, lightweight and compact design, making it widely applicable.

[0036] The foregoing has shown and described the basic principles, main features, and outstanding advantages of the present invention. Those skilled in the art should understand that the above embodiments are merely illustrative of the principles and effects of the invention and are not intended to limit the scope of the patent. All equivalent modifications or alterations made within the spirit and principles of this patent should be included within the protection scope of this patent.

Claims

1. A sinusoidal microchannel heat sink based on a phase change microcapsule / nanoparticle hybrid suspension and having porous fins, characterized in that: The heat sink housing consists of a substrate (1), a heat-conducting baffle (2) and a heat-conducting cover plate (3). The substrate (1) is connected to the heat-generating end of the electronic device. Several microchannel phase change heat transfer units (4) are provided in the heat sink housing. Each microchannel phase change heat transfer unit (4) includes a sinusoidal corrugated porous fin (5) and a channel cavity (6) formed between two adjacent sinusoidal corrugated porous fins (5) that is connected to the sinusoidal corrugated porous fin (5). There is a gap between the two ends of the sinusoidal corrugated porous fin (5) and the heat-conducting baffle (2). The sinusoidal corrugated porous fin (5) and the channel cavity (6) are filled with a phase change microcapsule / nanoparticle mixed suspension as a working fluid. The phase difference between the interface between the sinusoidal corrugated porous fin (5) and the channel cavity (6) on both sides is 270° at the channel boundary; The interface between the sinusoidal corrugated porous fin (5) and the two side channel cavities (6) adopts a wave pattern with a large wavelength followed by a small wavelength and a sparse front and dense back. The height of the sinusoidal corrugated porous fin (5) is 0.1~10mm, the width of the channel cavity (6) is 0.01~1mm, the amplitude of the sinusoidal corrugated porous fin (5) is 0.01~1mm, the wavelength of the sinusoidal corrugated porous fin (5) is 0.1~10mm, the porosity of the sinusoidal corrugated porous fin (5) varies from 0.3 to 0.99, and the pore size of the sinusoidal corrugated porous fin (5) varies from 0.01 to 0.5mm.

2. The sinusoidal microchannel heat sink based on a phase change microcapsule / nanoparticle hybrid suspension and having porous fins according to claim 1, characterized in that: The sinusoidal corrugated porous fins (5) are made of sintered porous media, and the porosity of the sinusoidal corrugated porous fins along the coolant flow direction can be designed in a non-uniform arrangement according to the principle of "high heat transfer efficiency and low flow resistance".

3. The sinusoidal microchannel heat sink based on a phase change microcapsule / nanoparticle hybrid suspension and having porous fins according to claim 1, characterized in that: The substrate (1) has a fixing groove on the surface opposite to the heat-conducting cover plate (3) for fixing the sinusoidal corrugated porous fins (5).

4. The sinusoidal microchannel heat sink based on a phase change microcapsule / nanoparticle hybrid suspension and having porous fins according to claim 1, characterized in that: The phase change materials in the microcapsules of the phase change microcapsule / nanoparticle hybrid suspension include n-hexadecane, n-octadecane, n-eicosane and their derivatives.

5. The sinusoidal microchannel heat sink based on a phase change microcapsule / nanoparticle hybrid suspension and having porous fins according to claim 1, characterized in that: The nanoparticles in the phase change microcapsule / nanoparticle mixed suspension are aluminum, titanium, silicon and their oxides, with a mass concentration of 1-15%, and the flow rate of the phase change microcapsule / nanoparticle mixed suspension is 0.01-2 m / s.

6. The sinusoidal microchannel heat sink based on a phase change microcapsule / nanoparticle hybrid suspension and having porous fins according to claim 1, characterized in that: The substrate (1) and the sintered porous dielectric material are made of copper, aluminum or silicon with high thermal conductivity.

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