A coated titanium anode for electrodepositing copper and its preparation method

CN115354384BActive Publication Date: 2026-05-26NORTHWEST UNIV +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
NORTHWEST UNIV
Filing Date
2022-08-31
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

Existing titanium anodes exhibit poor stability, high cell voltage, and high production costs during copper electrodeposition, making them difficult to promote in smaller metallurgical plants.

Method used

A coated titanium anode for electrodepositing copper was prepared by magnetron sputtering and electrodeposition using a TiN intermediate layer and a carbon-coated oxide surface active layer. The intermediate layer consists of TiN and tin-antimony oxide, and the surface active layer is composed of lead dioxide plating.

Benefits of technology

This reduces cell voltage and energy consumption, improves the stability and service life of coated titanium anodes, and lowers production costs.

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Abstract

This invention discloses a coated titanium anode for copper electrodeposition and its preparation method. The coated titanium anode for copper electrodeposition comprises a titanium base layer, an intermediate layer, and a surface active layer containing carbon-coated oxides, stacked sequentially. The intermediate layer is composed of one or both of TiN and tin-antimony oxide. By using the coated titanium anode for copper electrodeposition of this invention, the TiN layer can effectively prevent the oxidation of the titanium base layer, the tin-antimony oxide layer can improve the bonding force between the active layer and the titanium base layer, and the metal oxide can provide active sites for the oxygen evolution reaction, reducing the oxygen evolution overpotential. This effectively achieves the goal of reducing cell voltage and energy consumption when using the coated titanium anode for copper electrolysis.
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