Display device

Abstract

The present invention relates to a display device comprising: a substrate; a pixel electrode and a counter electrode located on the substrate; an encapsulation portion located on the counter electrode, the encapsulation portion comprising at least one organic layer and at least one inorganic layer alternately deposited; and a planarization layer located on the encapsulation portion, the planarization layer comprising a portion covering an edge portion of the encapsulation portion, wherein a first angle between the edge side surface of the planarization layer and the surface of the substrate is greater than a second angle between the edge side surface of the encapsulation portion and the surface of the substrate.

Description

[0001] Cross-references to related applications

[0002] Korean Patent Application No. 10-2015-0054016, entitled "Display Device", filed with the Korean Intellectual Property Office on April 16, 2015, is incorporated herein by reference in its entirety. Technical Field

[0003] The implementation method relates to a display device. Background Technology

[0004] Display devices such as liquid crystal displays (LCDs), organic light-emitting diode (OLED) displays, and electrophoretic displays may include field-generating electrodes and photoactive layers. For example, an OLED display device may include an organic layer as the photoactive layer. The field-generating electrodes may be connected to switching elements (such as thin-film transistors) to receive data signals, while the photoactive layer may convert the data signals into light signals to display images. Summary of the Invention

[0005] The implementation can be achieved by providing a display device comprising: a substrate; a pixel electrode and a counter electrode located on the substrate; an encapsulation portion located on the counter electrode, the encapsulation portion comprising at least one organic layer and at least one inorganic layer alternately deposited; and a planarization layer located on the encapsulation portion, the planarization layer comprising a portion covering an edge portion of the encapsulation portion, wherein a first angle between the edge side surface of the planarization layer and the surface of the substrate is greater than a second angle between the edge side surface of the encapsulation portion and the surface of the substrate.

[0006] The planarization layer may include organic materials.

[0007] The organic layer included in the encapsulation portion may be covered by the inorganic layer.

[0008] The first angle can be equal to or greater than approximately 70 degrees.

[0009] The upper surface of the planarization layer can be completely flat.

[0010] The display device may also include a pattern located on the planarization layer.

[0011] The substrate may include a display area for displaying an image and a peripheral area located outside the display area, and the pattern may include a portion located in the peripheral area.

[0012] The edge portion of the package may include an area with a gradually decreasing height on the upper surface.

[0013] The edge side surfaces of the planarization layer may include substantially curved portions.

[0014] The edge side surfaces of the planarization layer can be substantially flat.

[0015] The planarization layer can expose parts of the package.

[0016] The top surface of the package and the planarization layer can be completely flat.

[0017] The organic layer included in the encapsulation portion may be covered by the inorganic layer.

[0018] The first angle can be equal to or greater than approximately 70 degrees.

[0019] The display device may also include a pattern located on the planarization layer.

[0020] The edge side surfaces of the planarization layer may include substantially curved portions.

[0021] The edge side surfaces of the planarization layer can be substantially flat.

[0022] The planarization layer can expose a portion of the package.

[0023] The display device may also include touch electrodes or touch lines located on the planarization layer. Attached Figure Description

[0024] Features will become apparent to those skilled in the art from the detailed description of exemplary embodiments with reference to the accompanying drawings, wherein:

[0025] Figure 1 A block diagram of a display device according to an exemplary embodiment is shown;

[0026] Figure 2 A cross-sectional view of a pixel of a display device according to an exemplary embodiment is shown;

[0027] Figure 3 A schematic cross-sectional view of a display device according to an exemplary embodiment is shown;

[0028] Figure 4 A top plan view of a touch sensor of a display device according to an exemplary embodiment is shown;

[0029] Figure 5 A schematic cross-sectional view of a display device according to an exemplary embodiment is shown;

[0030] Figure 6 A schematic cross-sectional view of a display device according to an exemplary embodiment is shown; and

[0031] Figure 7 A cross-sectional view of a pixel of a display device according to an exemplary embodiment is shown. Detailed Implementation

[0032] Exemplary embodiments will now be described more fully below with reference to the accompanying drawings; however, these exemplary embodiments may be implemented in different forms and should not be construed as limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the exemplary embodiments to those skilled in the art.

[0033] In the accompanying drawings, the thickness of layers, films, panels, regions, etc., may be exaggerated for clarity. Throughout the drawings, the same reference numerals indicate the same elements. For clearer explanation of the embodiments, parts unrelated to this specification may be omitted.

[0034] It will be understood that when an element, such as a layer, thin film, region, or substrate, is referred to as being "on" another element, the element may be directly on the other element, or there may be intermediate elements present. Conversely, when an element is referred to as being "directly on" another element, there are no intermediate elements present.

[0035] Throughout this specification and the appended claims, when an element is described as being "coupled" to another element, that element may be "directly coupled" to that other element or "electrically coupled" to that other element via a third element. Furthermore, unless explicitly stated otherwise, the word "comprise" and variations such as "comprises" or "comprising" shall be understood to imply inclusion of the relevant element, rather than exclusion of any other element.

[0036] The display device according to an exemplary embodiment will now be described with reference to the accompanying drawings.

[0037] Figure 1 A block diagram of a display device according to an exemplary embodiment is shown. Figure 2 A cross-sectional view of a pixel of a display device according to an exemplary embodiment is shown, and Figure 3 A schematic cross-sectional view of a display device according to an exemplary embodiment is shown.

[0038] Reference Figure 1 A display device according to an exemplary embodiment may include a display panel 300. A plan view of the display panel 300 may show a display area DA for displaying images and a peripheral area PA located outside the display area DA. A plurality of pixels PX and a plurality of display signal lines that can be connected to the plurality of pixels PX to transmit drive signals may be located in the display area DA.

[0039] Display signal lines may include multiple gate signal lines for transmitting gate signals and multiple data lines for transmitting data signals. The gate signal lines and data lines may extend and intersect each other. Display signal lines may extend to the peripheral area and form pad cells.

[0040] In this implementation, the pixels PX can be arranged substantially in a matrix. Each pixel PX may include at least one switching element connected to a gate signal line and a data line, and a pixel electrode connected to the at least one switching element. The switching element may be a three-terminal element, such as a thin-film transistor that may be integrated into the display panel 300. The at least one switching element included in each pixel PX can selectively transmit data signals transmitted via the data line to the pixel electrode by turning on or off according to a gate signal transmitted via the gate signal line.

[0041] To achieve a color display, each pixel (PX) can display a primary color, and the desired color can be identified by combining the primary colors. Examples of primary colors can include three or four primary colors, such as red, green, and blue.

[0042] Next, refer to Figure 2 and Figure 3 as well as Figure 1 The detailed structure of a display device according to an exemplary embodiment will be described.

[0043] Figure 2 A detailed cross-sectional view of the pixel PX of the display device is shown, and Figure 3 An overall cross-sectional view is shown, including the display area DA and the surrounding area PA of the display device.

[0044] A display device according to an exemplary embodiment may include a substrate 110. The substrate 110 may be made of, for example, glass or plastic (e.g., the substrate 110 may include, for example, glass or plastic). The substrate 110 may be flexible, in which case the substrate 110 may be made of various plastics, metal films, or thin-film glass (e.g., the substrate 110 may include various plastics, metal films, or thin-film glass), wherein the various plastics are, for example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polyisopropylene diphenylene terephthalate / isophthalate copolymer (PAR), polyetherimide (PEI), polyethersulfone (PES), or polyimide (PI).

[0045] A barrier layer 111 may be positioned on the substrate 110. The barrier layer 111 prevents external impurities from penetrating the substrate 110 and seeping into the upper surface, and the surface of the barrier layer 111 may be planar. The barrier layer 111 may include at least one inorganic layer and an organic layer. For example, the barrier layer 111 may include silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiOxNy). The barrier layer 111 may be omitted.

[0046] A plurality of semiconductors 154b may be positioned on the barrier layer 111. Semiconductors 154b may include a channel region 152b, and source regions 153b and drain regions 155b formed by doping and positioned on both sides of the channel region 152b. Semiconductors 154b may include amorphous silicon, polycrystalline silicon or oxide semiconductors.

[0047] A gate insulating layer 140, formed of, for example, silicon nitride (SiNx) or silicon oxide (SiOx), may be formed on semiconductor 154b.

[0048] Multiple gate conductors, including multiple gate signal lines and gate electrodes 124b, may be formed on the gate insulating layer 140. The gate electrodes 124b may overlap with a portion of the semiconductor 154b (e.g., channel region 152b).

[0049] A first passivation layer 180a may be positioned on the gate insulating layer 140 and the gate conductor. The first passivation layer 180a and the gate insulating layer 140 may include contact holes 183b and 185b, wherein the source region 153b of the semiconductor 154b may be exposed through the contact hole 183b, and the drain region 155b may be exposed through the contact hole 185b.

[0050] Multiple data conductors, including multiple data lines 171, multiple input electrodes 173b, and multiple output electrodes 175b, can be positioned on the first passivation layer 180a. Data lines 171 can transmit data signals and can intersect with scan signal lines. Input electrodes 173b can be connected to data lines 171. Output electrodes 175b can be separated from data lines 171. Input electrodes 173b and output electrodes 175b can be positioned opposite each other above semiconductor 154b.

[0051] The input electrode 173b and the output electrode 175b can be connected to the source region 153b and the drain region 155b of the semiconductor 154b through contact holes 183b and 185b, respectively.

[0052] The gate electrode 124b, input electrode 173b, and output electrode 175b can be formed together with the semiconductor 154b to form a driving thin-film transistor Qd. In various embodiments, the structure of the driving thin-film transistor Qd can be modified.

[0053] A second passivation layer 180b, formed of an inorganic insulating material such as silicon nitride or silicon oxide, may be positioned on the data conductor. The second passivation layer 180b may have a contact hole 185c that exposes the output electrode 175b.

[0054] Multiple pixel electrodes 191 may be formed on the second passivation layer 180b.

[0055] The pixel electrode 191 of each pixel PX can be physically and electrically connected to the output electrode 175b through the contact hole 185c of the second passivation layer 180b. The pixel electrode 191 may include a semi-transparent and semi-reflective conductive material or a reflective conductive material.

[0056] For convenience, the layers located on the substrate 110, namely the layers from the barrier layer 111 to the second passivation layer 180b, are collectively referred to as the transistor layer TFL.

[0057] A pixel defining layer (also called an isolation wall) 360 with multiple openings exposing pixel electrodes 191 may be positioned on the second passivation layer 180b. The openings in the pixel defining layer 360 that expose the pixel electrodes 191 define a unit display area in each pixel PX that can emit light. The pixel defining layer 360 may be omitted.

[0058] An emission assembly 370 may be positioned on the pixel defining layer 360 and the pixel electrode 191. The emission assembly 370 may include a first organic common layer 371, a plurality of emission layers 373 and a second organic common layer 375 that can be stacked sequentially.

[0059] The first organic common layer 371 may include at least one of, for example, a hole injection layer and a hole transport layer that can be sequentially stacked. The first organic common layer 371 may be formed over the entire surface of the display area, where pixels PX may be disposed, or the first organic common layer 371 may be formed only in the area of ​​each pixel PX.

[0060] The emitting layer 373 can be positioned on the pixel electrode 191 of the corresponding pixel PX. The emitting layer 373 can be formed of an organic material that uniquely emits primary colors (such as red, green and blue) light, or it can have a structure in which multiple organic material layers that emit different colors of light can be stacked.

[0061] The second organic common layer 375 may include at least one of, for example, an electron transport layer and an electron injection layer that can be sequentially stacked. The second organic common layer 375 may be formed over the entire surface of the display area where the pixels PX may be disposed, or the second organic common layer 375 may be formed only in the area of ​​each pixel PX.

[0062] The first organic common layer 371 and the second organic common layer 375 can improve the luminescence efficiency of the emitting layer 373, and one of the first organic common layer 371 and the second organic common layer 375 can be omitted.

[0063] A counter electrode 270 for transmitting a common voltage may be positioned on the transmitting assembly 370. The counter electrode 270 may comprise a transparent conductive material. For example, the counter electrode 270 may be formed of a transparent conductive material, or it may be formed by very thinly stacking metals such as calcium (Ca), barium (Ba), magnesium (Mg), aluminum (Al), or silver (Ag), thereby having transmission properties.

[0064] Each pixel PX has a pixel electrode 191, an emitting component 370, and a counter electrode 270 that can form a light-emitting diode, and one of the pixel electrode 191 and the counter electrode 270 can be used as a cathode and the other can be used as an anode.

[0065] For convenience, the pixel limiting layer 360 and the layer from the pixel electrode 191 to the opposite electrode 270 are collectively referred to as the light-emitting device layer EL.

[0066] The display device according to the exemplary embodiment may be a top-emitting type that can emit internal light upward from the emitting component 370 and display an image.

[0067] An encapsulation portion 380 may be positioned on the opposing electrode 270. The encapsulation portion 380 can prevent the passage of moisture and / or oxygen from the outside by encapsulating the emission component 370 and the opposing electrode 270.

[0068] The encapsulation portion 380 may include multiple encapsulation thin film layers 380_1, 380_2, 380_3…380_n. Each encapsulation thin film layer 380_1, 380_2, 380_3…380_n may include at least one inorganic layer and at least one organic layer, and the inorganic and organic layers may be deposited alternately. The organic layer may include organic materials and may have planar properties. The inorganic layer may include inorganic materials such as alumina (AlOx), silicon oxide (SiOx), and silicon nitride (SiNx).

[0069] exist Figure 2In the encapsulation film layers 380_1, 380_2, 380_3…380_n, the bottommost encapsulation film layer 380_1 can be an inorganic layer or an organic layer. The topmost encapsulation film layer 380_n can also be an inorganic layer or an organic layer. When the topmost encapsulation film layer 380_n is an inorganic layer, it can further prevent moisture from penetrating the encapsulation portion 380. The inorganic layer included in the encapsulation portion 380 can cover the underlying organic layer so that the organic layer is not exposed to the outside. The organic layer included in the encapsulation portion 380 can be covered by the inorganic layer so that it is not exposed to the outside of the encapsulation portion 380, thereby blocking moisture from the outside from passing through the organic layer.

[0070] In most of the display area DA, the upper surface of the encapsulation portion 380, which includes multiple encapsulation film layers 380_1, 380_2, 380_3…380_n, can be substantially flat.

[0071] Reference Figure 3 The edge of the encapsulation portion 380 may gradually thin towards the edge of the display device, and the upper surface of the encapsulation portion 380 may gradually decrease in height. For example... Figure 3 As shown, the edge portion of the encapsulation portion 380, whose upper surface can gradually decrease, can be formed to span the edge of the display area DA and the peripheral area PA, or it can be mainly located in the peripheral area PA. The upper surface of the encapsulation portion 380 can gradually decrease outward from the edge area adjacent to the boundary between the display area DA and the peripheral area PA, or it can gradually decrease outward from the interior of the peripheral area PA.

[0072] The thickness of the package portion 380 may also be reduced in the portion (e.g., region) where the height of the upper surface of the package portion 380 decreases. As described above, the upper surface of the edge portion where the thickness of the package portion 380 gradually decreases may not face upwards but may face to the side, such that the upper surface of the edge portion may be referred to as the side surface of the package portion 380. In an embodiment, the side surface of the package portion 380 may be formed by a curved surface.

[0073] At the end of the package portion 380, the side surface of the package portion 380 may meet the surface of the substrate 110, and the side surface of the package portion 380 or the imaginary surface in contact with the side surface may form an acute angle B with the surface of the substrate 110, for example, angle B may be less than 45 degrees, and further, may be less than about 20 degrees. The edge portion of the package portion 380 may form a gentle contour.

[0074] A planarization layer 390 may be positioned on the package portion 380. The planarization layer 390 may be formed on the entire surface of the package portion 380 or may be formed only on a portion of the surface of the package portion 380. The planarization layer 390 may include covering at least a portion of an edge portion, in which the height of the upper surface of the package portion 380 may gradually decrease. Figure 2 and Figure 3 An example is shown where the planarization layer 390 can be formed substantially over the entire surface of the package portion 380.

[0075] The planarization layer 390 may include an organic material. The organic material included in the planarization layer 390 may be the same material as the organic material included in the organic layer of the encapsulation portion 380, or it may include a different organic material. The organic material included in the planarization layer 390 may be the same material as the organic material included in the organic layer of the encapsulation portion 380. In some embodiments, the organic material included in the planarization layer 390 may have different viscosities.

[0076] The angle A formed by most of the side surface of the planarization layer 390 and the surface of the substrate 110 can be greater than the angle B formed by the side surface of the package portion 380 and the substrate 110. The contour of the edge portion of the planarization layer 390 can be formed steeper than the contour of the edge portion of the package portion 380. For example, the angle A between the edge side surface of the planarization layer 390 and the surface of the substrate 110 can be equal to or greater than approximately 70 degrees, almost 90 degrees. As described above, by forming the edge side surface of the planarization layer 390 vertically relative to the surface of the substrate 110, the flat area of ​​the upper surface of the planarization layer 390 can be maximized.

[0077] In one implementation, the edge side surface of the planarization layer 390 may be positioned in the peripheral region PA.

[0078] Reference Figure 3 The edge side surface of the planarization layer 390 may be substantially flat and may include curved or bent portions.

[0079] The planarization layer 390 can be formed on the package portion 380 by using screen printing or photolithography using photosensitive organic materials.

[0080] According to an exemplary embodiment, the planarization layer 390, which includes organic material, may include an externally exposed portion where moisture infiltration can occur. However, because the encapsulation portion 380 is positioned beneath the planarization layer 390, reliability failures caused by moisture infiltration are prevented. Most of the organic layer included in the encapsulation portion 380 can be covered by an inorganic layer, and although moisture infiltration through the planarization layer 390 may occur, the moisture infiltration may not reach the light-emitting device layer EL through the encapsulation portion 380.

[0081] In an implementation, the total thickness d1 of the encapsulation portion 380 and the planarization layer 390 in the display area DA may be equal to or greater than approximately 10 μm.

[0082] Reference Figure 3 Multiple patterns can be positioned on the planarization layer 390. These multiple patterns can be patterns of a touch sensor capable of sensing touch from an external source. Touch can include situations where an external object approaches the touch surface of the display device, where an external object hovers in a near-proximity state, or where an external object (such as a user's finger) directly contacts the touch surface of the display device. The touch sensor pattern can include touch electrodes 410 and touch lines 411 connected to the touch electrodes 410. The touch electrodes 410 can be primarily located in the display area DA. In an embodiment, the touch electrodes 410 can be located in the peripheral area PA. The touch lines 411 can be primarily located in the peripheral area PA. In an embodiment, the touch lines 411 can include portions located in the display area DA. Thus, a touch sensor formed directly on the upper surface of the display device is called an on-cell type touch sensor.

[0083] According to an exemplary embodiment, as described above, the side surface of the edge portion of the planarization layer 390 may form a steep inclination relative to the surface of the substrate 110, which can maximize the flat area of ​​the upper surface of the planarization layer 390 and maximize the area in the planarization layer 390 where multiple patterns can be formed.

[0084] Without the planarization layer 390, multiple patterns can be formed on the upper surface of the package portion 380. The contours of the edge portions of the package portion 380 can be smooth, and the only option is to form patterns on the flat upper surface of the package portion 380 to prevent pattern failure, with no other choice. Accordingly, it is difficult to form patterns at the edge portions of the display area DA, and the area for forming patterns (e.g., touch sensors) can be limited. Therefore, the dead zone in the display device that does not sense touch may increase. However, according to the exemplary embodiment, the smooth contour portions of the package portion 380 can be covered by the planarization layer 390, the flat upper surface of the planarization layer 390 can be maximized, and the upper surface of the planarization layer 390 can be flat in most of the peripheral area PA. Accordingly, the area where patterns (e.g., touch sensors) can be formed can be sufficiently ensured, and the area of ​​the dead zone can be reduced. Accordingly, the bezel of the display device can be reduced, and consumer satisfaction can be increased.

[0085] Parasitic capacitance can be generated between the relative electrode 270 located in the light-emitting device layer EL and the pattern of the touch sensor, and if the parasitic capacitance increases, the characteristics of the touch sensor can be affected. When the touch sensor pattern is formed directly on the package portion 380 without the planarization layer 390, the touch sensor pattern formed at the edge portion of the package portion 380 can increase the parasitic capacitance between the relative electrode 270 and the touch sensor pattern. To prevent this, the touch sensor pattern can be formed only on the flat upper surface of the package portion 380, which may increase the dead zone. However, according to an exemplary embodiment, the planarization layer 390 can be formed on the package portion 380, which can reduce the parasitic capacitance between the relative electrode 270 and the pattern, and can increase the touch sensitivity of the touch sensor composed of the pattern while reducing the area of ​​the dead zone.

[0086] Next, refer to Figure 4 The accompanying drawings described above illustrate examples of patterns formed on the planarization layer 390.

[0087] Figure 4 A top plan view of a touch sensor of a display device according to an exemplary embodiment is shown.

[0088] In the display device according to an exemplary embodiment, the pattern formed on the planarization layer 390 may, for example, constitute a touch sensor. The display panel 300 of the display device may display images and may be a touch-sensing display device that senses touch.

[0089] Reference Figure 4 as well as Figure 1 The display panel 300 may include a touch sensing area TA and a touch peripheral area PAt, wherein the touch sensing area TA is a touch-sensing area and the touch peripheral area PAt is located around the touch sensing area TA.

[0090] The touch sensing area TA can be an area that can sense touch when an external object approaches or touches a touch surface on the display panel 300. The touch sensing area TA may overlap with the display area DA. In an embodiment, the touch sensing area TA and most of the display area DA may correspond to each other, and the touch peripheral area PAt and most of the peripheral area PA may correspond to each other. In an embodiment, a portion of the peripheral area PA may be included in the touch sensing area TA, while a portion of the display area DA may correspond only to the touch sensing area TA.

[0091] A touch sensor may be positioned within a touch sensing area TA. The touch sensor can sense contact using various methods. For example, touch sensors can be classified into various types, such as resistive, capacitive, electromagnetic (EM), or optical. In the present exemplary embodiment, a capacitive touch sensor will be described exemplarily.

[0092] Reference Figure 4 According to an exemplary embodiment, a touch sensor may include a plurality of touch electrodes 410, and the plurality of touch electrodes 410 may include a plurality of first touch electrodes 410a and a plurality of second touch electrodes 410b. The plurality of first touch electrodes 410a and the plurality of second touch electrodes 410b may be alternately arranged and distributed in a non-overlapping manner within a touch sensing area TA. The plurality of first touch electrodes 410a may be arranged along column and row directions, and the plurality of second touch electrodes 410b may be arranged along column and row directions. The first touch electrodes 410a and the second touch electrodes 410b may be positioned on the same layer.

[0093] At least some of the plurality of first touch electrodes 410a arranged in the same row or column may be connected to or separated from each other inside or outside the touch sensing area TA. Similarly, at least some of the plurality of second touch electrodes 410b arranged in the same column or row may be connected to or separated from each other inside or outside the touch sensing area TA. For example, as Figure 4 As shown, when multiple first touch electrodes 410a arranged in the same row are connected to each other within the touch sensing area TA, multiple second touch electrodes 410b arranged in the same column can be connected to each other within the touch sensing area TA.

[0094] Multiple first touch electrodes 410a positioned in each row can be connected to each other via a first connecting portion 412a, while second touch electrodes 410b positioned in each column can be connected to each other via a second connecting portion 412b.

[0095] Touch electrodes 410 can be connected to touch lines 411. First touch electrodes 410a connected to each other in each row can be connected to a touch driver via first touch lines 411a, while second touch electrodes 410b connected to each other in each column can be connected to a touch driver via second touch lines 411b. For example... Figure 4 As shown, the first touch line 411a and the second touch line 411b can be disposed in the touch peripheral area PAt. In an embodiment, the first touch line 411a and the second touch line 411b can be disposed in the touch sensing area TA.

[0096] The ends of the first touch line 411a and the ends of the second touch line 411b can form pads 450 in the touch periphery area PAt.

[0097] The first touch electrode 410a and the second touch electrode 410b may have at least a predetermined transmittance, and light may pass through the display panel 300. For example, the first touch electrode 410a and the second touch electrode 410b may be formed of a transparent conductive material such as a thin metal layer (including indium tin oxide (ITO), indium zinc oxide (IZO), and silver nanowires (AgNw)), a metal mesh, and carbon nanotubes (CNTs).

[0098] The first touch line 411a and the second touch line 411b may include a transparent conductive material included in the first touch electrode 410a and the second touch electrode 410b, or may include a low-resistance material such as molybdenum (Mo), silver (Ag), titanium (Ti), copper (Cu), aluminum (Al) and molybdenum / aluminum / molybdenum (Mo / Al / Mo).

[0099] The first touch electrode 410a and the second touch electrode 410b, which are adjacent to each other, can form a mutual inductance capacitor, which can be used as a touch detection sensor. The mutual inductance capacitor can receive a detection input signal through one of the first touch electrode 410a and the second touch electrode 410b, and output the change in charge caused, for example, by the touch of an external object, to the other touch electrode as a detection output signal.

[0100] According to another exemplary embodiment, a plurality of first touch electrodes 410a and a plurality of second touch electrodes 410b may be separated from each other to be connected to a touch controller via touch lines respectively. Each touch electrode may form a self-inductance capacitor as a touch detection sensor. The self-inductance capacitor may receive a detection input signal and be charged with a predetermined amount of charge, and the amount of charge may change when a touch from an external object (e.g., a finger) occurs, and the self-inductance capacitor may output a detection output signal that is different from the input detection input signal.

[0101] Next, refer to Figure 5 The accompanying drawings described above illustrate a display device according to an exemplary embodiment.

[0102] Figure 5 A schematic cross-sectional view of a display device according to an exemplary embodiment is shown. (Refer to...) Figure 5 The display device according to this exemplary embodiment can be used with Figure 2 and Figure 3The exemplary embodiments shown are substantially the same, except for the edge side surface of the planarization layer 390. According to this exemplary embodiment, the edge side surface of the planarization layer 390 may be formed as a substantially flat surface and may form an angle A greater than 70 degrees with the surface of the substrate 110. The edge side surface of the planarization layer 390 may be formed by cutting during the manufacturing process of the display device, such as when thin-film transistor elements are formed on a mother substrate and the mother substrate is diced into display device units. The edge side surface of the planarization layer 390 may be exposed without being covered by a separate inorganic layer.

[0103] Next, refer to Figure 6 and Figure 7 as well as Figure 3 A display device according to an exemplary embodiment will be described.

[0104] Figure 6 A schematic cross-sectional view of a display device according to an exemplary embodiment is shown, while Figure 7 A cross-sectional view of a pixel of a display device according to an exemplary embodiment is shown. (Refer to...) Figure 6 and Figure 7 The display device according to this exemplary embodiment can be used with Figure 2 and Figure 3 The exemplary implementation shown is essentially the same, except for the planarization layer 390.

[0105] According to this exemplary embodiment, the planarization layer 390 may not be formed on the entire surface of the package portion 380, but may be formed on a portion of the surface of the package portion 380. The planarization layer 390 may expose a portion of the package portion 380. The planarization layer 390 may only include a portion covering an edge portion in which the height of the upper surface of the package portion 380 gradually decreases. The planarization layer 390 may not be positioned in the inner region of the display area DA, but may be primarily positioned in the peripheral region PA. Figure 6 As shown, the planarization layer 390 may include a portion located at the edge region of the display area DA.

[0106] According to this exemplary embodiment, the planarization layer 390 may cover the edge portion of the package portion 380, and the upper surface may be completely flat. Accordingly, a pattern (e.g., a touch sensor) may also be formed on the planarization layer 390, and the area used to form the pattern may be enlarged while the area of ​​the dead zone may be reduced.

[0107] Many features and effects of the above exemplary embodiments can be applied equivalently to the exemplary embodiments.

[0108] Through summarization and review, it was found that if external impurities (such as moisture or oxygen) flow into the display device, the lifespan of the electronic components included in the display device may be shortened. In the case of organic light-emitting devices, the luminous efficiency of the emitting layer may be degraded, and deformation of the emitting layer may occur.

[0109] Packaging processes can be performed during the manufacturing of a display device to separate electronic components from the external parts so that impurities (such as moisture) cannot penetrate the display device. Such packaging processes can use: methods of laminating layers made of organic polymers such as PET or polyester onto a lower substrate on which, for example, thin-film transistors and emitter layers are formed; methods of forming a cap or cover as a packaging substrate and sealing the edges of the packaging substrate and the lower substrate with a sealant; or methods of forming a package including a packaging film layer, wherein the packaging film layer is formed by depositing multiple films on the lower substrate (rather than the packaging substrate).

[0110] In a method for forming a package comprising multiple encapsulation film layers, the package can be formed by alternately depositing multiple organic and inorganic layers on a completed lower substrate. The encapsulation film layers can be highly flexible and can be increasingly used in flexible display devices.

[0111] In addition to displaying images, display devices may also include touch sensing capabilities for user interaction. When a user writes text or draws on the screen by bringing their finger or stylus close to or touching it, the touch sensing function detects touch information, such as whether an object is near or touching the screen and the object's touch location, by sensing changes in pressure, electrical charge, and light applied to the screen. The display device can then receive image signals based on the touch information to display an image.

[0112] This touch sensing function can be achieved through a touch sensor. Touch sensors can be classified into various types, such as resistive, capacitive, electromagnetic (EM), and optical.

[0113] For example, a capacitive touch sensor may include a sensing capacitor formed by sensing electrodes capable of transmitting sensing signals, and may sense changes in the capacitance of the sensing capacitor generated when a conductor (such as a finger) approaches the touch sensor to determine, for example, the presence or location of a touch. A capacitive touch sensor may include multiple touch electrodes disposed in a touch sensing area for sensing the touch and touch lines connected to the touch electrodes. The touch lines may transmit sensing input signals to the touch electrodes and may transmit sensing output signals from the touch electrodes generated according to the touch to a touch driver.

[0114] Touch sensors can be installed in the display device (in-cell type), formed on the outer surface of the display device (on-cell type), or attached to a separate touch sensor unit of the display device (add-on cell type).

[0115] When attaching a touch sensor to a display device, additional processes may be required to manufacture the touch sensor separately from the display panel and then attach it to the display device, potentially reducing yield and increasing cost. To attach and secure the touch sensor to the display device, an adhesive layer may be positioned between the touch sensor and the display device or on the touch sensor, potentially increasing the thickness of the display device. Because transmittance may deteriorate due to the attached touch sensor and reflectivity may increase, blurring may increase, and an on-chip forming process may be used to form the touch sensor on the outer surface of the display device.

[0116] In display devices comprising multiple encapsulation film layers, an on-chip touch sensor can be formed on the encapsulation film layer. However, the encapsulation film layer may include multiple organic and inorganic layers, and the height of the edge portions of the encapsulation film layer may be uneven, resulting in height differences. As described above, when a pattern for, for example, a touch sensor is formed on an encapsulation film layer with uneven height, the pattern forming the touch electrodes or touch lines constituting the touch sensor may be degraded. Accordingly, the area where the touch sensor pattern can be formed may be limited, and the dead zone in the peripheral area of ​​the display device where touch cannot be sensed may increase.

[0117] In a display device, the thickness of the encapsulation film layer in the peripheral region where the edge portion of the encapsulation film layer is located can be reduced. In this case, the parasitic capacitance (noise capacitance) formed between the electrode (e.g., cathode) formed on the lower substrate and the touch electrode of the touch sensor, or the parasitic capacitance (noise capacitance) formed between the touch lines, can increase. If the parasitic capacitance increases, the characteristics of the touch sensor may be affected. To prevent this, the touch sensor may be formed only in a region where the height of the top surface of the encapsulation film layer is uniformly maintained. This may reduce the area where the pattern of the touch sensor can be formed, and the dead zone may be further increased. This situation may also exist in display devices where a pattern other than a touch sensor is formed on the encapsulation film layer.

[0118] To prevent an increase in parasitic capacitance between the electrodes on the lower substrate and the touch sensor, the thickness of the encapsulation film layer can be increased. However, this may lead to an increase in the return current of the organic layer included in the encapsulation film layer. Furthermore, since the organic layer can be easily exposed to the outside and moisture can penetrate the exposed organic layer, the reliability of the display device may be degraded, potentially leading to a further increase in the area of ​​the inorganic layer covering the exposed organic layer. As a result, the dead zone may be further increased, and the size of the display device may also be increased.

[0119] Embodiments of the present invention may provide a display device in which, for example, a pattern of a touch sensor can be formed on an encapsulation film layer without increasing the dead zone or parasitic capacitance in the display device treated by the method of sealing the encapsulation film layer.

[0120] According to an exemplary embodiment, in a display device encapsulated using an encapsulation film layer, for example, a pattern for a touch sensor can be formed on the encapsulation film layer without increasing dead zones or parasitic capacitance.

[0121] Exemplary embodiments have been disclosed herein, and although specific terminology has been used, it is used and interpreted in its ordinary and descriptive sense only and is not intended to be limiting. In some cases, as will be apparent to those skilled in the art from the filing of this application, unless specifically instructed otherwise, features, characteristics, and / or elements described in connection with particular embodiments may be used alone or in combination with features, characteristics, and / or elements described in connection with other embodiments. Accordingly, those skilled in the art will understand that various changes in form and detail may be made without departing from the spirit and scope of the invention as set forth in the appended claims.

Claims

1. A display device, comprising: Substrate; Transistors are located on the substrate; A pixel electrode is located above and electrically connected to the transistor; The opposite electrode is located above the pixel electrode; The encapsulation portion is located above the opposing electrode, and the encapsulation portion includes a first inorganic layer and a first organic layer, with the first organic layer located above the first inorganic layer; The second organic layer is located above and covers the edge portion of the encapsulation portion; The touch sensing area includes multiple touch electrodes, which form a touch sensor and are disposed on the package portion; as well as The touch perimeter area is located outside the touch sensing area and includes multiple touch lines connecting the touch electrodes and the touch driver. In this embodiment, at least a portion of the plurality of touch lines in the touch periphery region overlaps with both the encapsulation portion and the second organic layer in a planar view. The upper surface of the second organic layer is flatter than the upper surface of the encapsulation portion in the touch periphery region.

2. The display device as claimed in claim 1, wherein, The edge portion of the package has an inclined surface close to the edge of the substrate.

3. The display device as claimed in claim 2, wherein, A portion of the plurality of touch electrodes overlaps with the inclined surface of the encapsulation portion in the plan view.

4. The display device as claimed in claim 3, wherein, The second organic layer, in the cross-sectional view, is located between the portion of the plurality of touch electrodes and the inclined surface of the encapsulation portion.

5. The display device as claimed in claim 4, wherein, The touch line contacts the upper surface of the second organic layer.

6. The display device as claimed in claim 1, wherein, At least a portion of the encapsulation portion does not overlap with the second organic layer in the plan view.

7. The display device as claimed in claim 1, wherein, At least a portion of the plurality of touch electrodes are in direct contact with the package portion.

8. The display device as claimed in claim 1, wherein: The plurality of touch electrodes includes a first touch electrode and a second touch electrode. The plurality of touch lines include a first set of touch lines located on a first side of the touch sensing area and a second set of touch lines located on a second side of the touch sensing area opposite to the first side. The first touch electrodes are arranged in multiple rows. The first set of touch lines is connected to the odd-numbered rows of the multiple rows, and The second set of touch lines is connected to the even-numbered rows of the multiple rows.

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