A method, apparatus, system, and storage medium for power module assembly

CN115361799BActive Publication Date: 2026-06-19GUIZHOU YAGUANG ELECTRONICS TECH
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
GUIZHOU YAGUANG ELECTRONICS TECH
Filing Date
2022-08-16
Publication Date
2026-06-19

AI Technical Summary

Technical Problem

In the current power module assembly process, there are many solder joints. Manually handling each one results in low assembly efficiency and inconsistent solder joint sizes, requiring rework and wasting a lot of time.

Method used

Automated equipment is used for dispensing glue, applying solder paste, and soldering connections. The glue dispensing equipment forms cured glue dots on the module box, and the solder paste application equipment applies solder paste at staggered positions. Combined with gripper equipment and testing equipment, automated assembly and quality inspection are achieved.

Benefits of technology

It improved assembly efficiency, reduced inconsistencies in solder joint size, decreased rework time, achieved automated assembly, and reduced labor costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

This application discloses a method, apparatus, system, and storage medium for assembling power modules, which improves the efficiency of solder paste application and the assembly efficiency of power modules. The application includes: controlling a dispensing device to apply curable adhesive to a first preset position on a module box located on a tray, forming an adhesive dot; controlling a first gripper device to pass a PCB board through a pin in the module box and cover it on the adhesive dot; controlling a solder paste application device to apply solder paste to a second preset position on the module box, the PCB board, and the intersection of the pin and the PCB board, forming solder paste dots; controlling a second gripper device to cover a sensor on the solder paste dots on the PCB board, and to cover a solder pad on the solder paste dot at the second preset position; controlling the solder paste application device to apply solder paste to the solder pad; and controlling a third gripper device to cover a chip on the solder pad, thereby forming a power module.
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