Component mounting apparatus and component mounting method

Abstract

The present application provides a component mounting apparatus and a component mounting method, which efficiently corrects a lead and mounts a lead component on a substrate. The component mounting apparatus includes: a holding apparatus that holds a main body of a lead component having a plurality of leads; a moving apparatus that moves the holding apparatus; a detecting apparatus that detects a tip end of each of the plurality of leads while the main body is held by the holding apparatus; a correction lead setting section that sets, from the plurality of leads, a correction lead to be corrected in the substrate, based on a detected position of the tip end detected by the detecting apparatus; and a moving control section that controls the moving apparatus so as to insert the correction lead into a first hole of the substrate in a state where the lead component is inclined at a first angle, and then insert a non-correction lead into a second hole of the substrate until the lead component becomes a second angle.

Description

Technical Field

[0001] This invention relates to a component mounting device and a component mounting method. Background Technology

[0002] In the field of component mounting apparatus, a substrate mounting machine disclosed in Patent Document 1 is known for inserting the leads of a lead component into a through hole in a substrate.

[0003] Patent Document 1: International Publication No. 2117 / 085864

[0004] Patent Document 1 discloses a technique for mounting a lead assembly having long and short leads to a substrate. Furthermore, Patent Document 1 discloses a method whereby, after inserting a long lead into a through-hole of the substrate, the lead assembly is moved in the X and Y directions to bend the long lead, and then a short lead is inserted into the through-hole of the substrate. Lead assemblies come in various forms. Therefore, a technique is desired that can efficiently straighten the leads and mount the lead assembly to the substrate, regardless of the type of lead assembly used. Summary of the Invention

[0005] The purpose of this invention is to efficiently correct leads and mount lead components onto a substrate.

[0006] According to the present invention, a component mounting apparatus is provided, comprising: a clamping device for holding a main body having a lead component having a plurality of leads; a moving device for moving the clamping device; a detection device for detecting the front ends of each of the plurality of leads while the main body is held in the clamping device; a corrected lead setting unit for setting a corrected lead to be corrected in a substrate from the plurality of leads based on the detection position of the front ends detected by the detection device; and a moving control unit for controlling the moving device so that after inserting the corrected lead into a first hole of the substrate while the lead component is tilted at a first angle, a non-corrected lead is inserted into a second hole of the substrate until the lead component is at a second angle.

[0007] According to the present invention, lead wires can be efficiently straightened to mount lead wire components onto a substrate. Attached Figure Description

[0008] Figure 1 This is a perspective view showing the component mounting device of the embodiment.

[0009] Figure 2 This is a side view showing the component mounting device of the embodiment.

[0010] Figure 3 This is a perspective view showing the clamping device of the embodiment.

[0011] Figure 4This is a side view showing the lead wire component held by the clamping device in the embodiment.

[0012] Figure 5 This is a diagram showing the lead wire component of the embodiment from below.

[0013] Figure 6 This is a perspective view of the detection device according to the implementation method.

[0014] Figure 7 This is a block diagram illustrating the component mounting apparatus of the embodiment.

[0015] Figure 8 This diagram illustrates the processing of the position error calculation unit and the correction lead setting unit in the implementation method.

[0016] Figure 9 This is a diagram used to illustrate the corrective insertion in the implementation method.

[0017] Figure 10 This is a diagram used to illustrate the corrective insertion in the implementation method.

[0018] Figure 11 This is a diagram used to illustrate the corrective insertion in the implementation method.

[0019] Figure 12 This is a diagram used to illustrate the corrective insertion in the implementation method.

[0020] Figure 13 This is a diagram used to illustrate the corrective insertion in the implementation method.

[0021] Figure 14 This is a flowchart illustrating the component installation method of the implementation method.

[0022] Explanation of reference numerals in the attached figures:

[0023] 1: Component mounting device; 2: Base; 3: Component supply component; 4: Base plate support component; 5: Clamping device; 5A: Connecting component; 5B: Rotating component; 5C: Moving component; 5D: Clamping part; 6: Moving device; 6A: Base component; 6B: Rotating component; 6C: First arm; 6D: Second arm; 6E: Third arm; 7: Detection device; 7A: Projection device; 7B: Imaging device; 7C: Calculation device; 7D: Housing; 7E: Transparent component; 8: Force sensor; 9: Control device; 9A: Calculation and processing device; 9B: Storage device; 9C: Input / output interface; 10: Position error calculation 11: Correction lead setting unit; 12: Movement control unit; 13: Clamping control unit; 100: Lead component; 101: Main body; 110: Lead; 111: First lead (non-correction lead); 112: Second lead (correction lead); 200: Substrate; 210: Hole; 211: Hole (second hole); 212: Hole (first hole); AX1: First rotation axis; AX2: Second rotation axis; AX3: Third rotation axis; L1: Distance; L2: Distance; Pr: Ideal position; Ps: Detection position; RX: Rotation axis; TX: Rotation axis; Δ: Difference; θ1: First angle; θ2: Second angle. Detailed Implementation

[0024] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings; however, the present invention is not limited to these embodiments. The constituent elements of the embodiments described below can be appropriately combined. Furthermore, sometimes some constituent elements are not used.

[0025] In this embodiment, a local coordinate system is established in the component mounting device 1, and the positional relationships of each part are explained with reference to this local coordinate system. An XYZ orthogonal coordinate system is established as the local coordinate system. Within a defined plane, the direction parallel to the X-axis is defined as the X-axis direction. Within the defined plane, the direction parallel to the Y-axis, which is orthogonal to the X-axis, is defined as the Y-axis direction. The directions parallel to the Z-axis, which are orthogonal to both the X-axis and Y-axis, are defined as the Z-axis direction. The rotational or tilting direction centered on the X-axis is defined as the θX direction. The rotational or tilting direction centered on the Y-axis is defined as the θY direction. The rotational or tilting direction centered on the Z-axis is defined as the θZ direction. The defined plane is the XY plane. The Z-axis is orthogonal to the defined plane. In this embodiment, the defined plane is parallel to the horizontal plane. The Z-axis direction is vertical. Alternatively, the defined plane may be tilted relative to the horizontal plane.

[0026] [Component mounting device]

[0027] Figure 1 This is a perspective view of the component mounting device 1 according to the embodiment. Figure 2 This is a side view showing the component mounting device 1 of the embodiment. (e.g.) Figure 1 and Figure 2As shown, the component mounting device 1 includes a base 2, a component supply component 3, a base plate support component 4, a clamping device 5, a moving device 6, and a detection device 7.

[0028] The base 2 supports the component supply component 3, the base plate support component 4, the moving device 6, and the detection device 7 respectively.

[0029] The component supply member 3 supplies lead components 100. In one embodiment, the component supply member 3 includes a tray on which the lead components 100 are disposed. Multiple lead components 100 are disposed on the component supply member 3. The multiple lead components 100 may be of the same type or different types.

[0030] The substrate support member 4 supports the substrate 200 on which the lead wire component 100 is mounted. The substrate support member 4 supports the substrate 200 in such a way that the upper surface of the substrate 200 is parallel to the XY plane.

[0031] The clamping device 5 holds the lead wire component 100. The clamping device 5 includes a robotic arm.

[0032] The mobile device 6 moves the gripping device 5. The mobile device 6 includes a multi-joint robot. In one embodiment, the mobile device 6 is a vertical multi-joint robot. Alternatively, the mobile device 6 can also be a horizontal multi-joint robot. The mobile device 6 has: a base member 6A fixed to the base 2; a rotating member 6B supported on the base member 6A; a first arm 6C connected to the rotating member 6B; a second arm 6D connected to the first arm 6C; and a third arm 6E connected to the second arm 6D.

[0033] Rotating member 6B is supported on base member 6A in a manner that allows it to rotate about a rotation axis TX. The rotation axis TX is parallel to the Z-axis. First arm 6C is connected to rotating member 6B in a manner that allows it to rotate about a first rotation axis AX1. The first rotation axis AX1 is orthogonal to the Z-axis. Second arm 6D is connected to first arm 6C in a manner that allows it to rotate about a second rotation axis AX2. The second rotation axis AX2 is parallel to the first rotation axis AX1. Third arm 6E is connected to second arm 6D in a manner that allows it to rotate about a third rotation axis AX3. The third rotation axis AX3 is parallel to the second rotation axis AX2. Clamping device 5 is mounted on third arm 6E.

[0034] The moving device 6 includes: a rotary actuator for rotating the rotary member 6B; a first rotary actuator for rotating the first arm 6C; a second rotary actuator for rotating the second arm 6D; and a third rotary actuator for rotating the third arm 6E.

[0035] The detection device 7 detects the lead wire component 100 held in the clamping device 5. The detection device 7 includes a three-dimensional measuring device. The detection device 7 detects the position of the lead wire component 100 in a local coordinate system based on the phase shift method.

[0036] [Clamping device]

[0037] Figure 3 This is a perspective view of the clamping device 5 according to the embodiment. The clamping device 5 includes a robotic arm. The clamping device 5 has: a connecting member 5A mounted on the third arm 6E; a rotating member 5B supported on the connecting member 5A; and a pair of moving members 5C supported on the rotating member 5B.

[0038] Rotating member 5B is supported on connecting member 5A in a manner that allows it to rotate about the rotation axis RX. The rotation axis RX is orthogonal to the third rotation axis AX3. A pair of moving members 5C move in directions of approaching each other and directions of separation. A clamping part 5D is provided at the lower end of the moving member 5C. The pair of clamping parts 5D approach and separate from each other.

[0039] The clamping device 5 has a rotary actuator for rotating the rotating member 5B and a clamping actuator for bringing a pair of moving members 5C closer to or apart from each other.

[0040] With the lead member 100 positioned between a pair of clamping portions 5D, the lead member 100 is held in the clamping portions 5D by bringing the pair of clamping portions 5D close to each other. The lead member 100 is released from the clamping portions 5D by separating the pair of clamping portions 5D.

[0041] A force sensor 8 is disposed on one of the moving components 5C. The force sensor 8 is capable of detecting the load applied to the clamping part 5D.

[0042] [Lead wire components]

[0043] Figure 4 This is a side view showing the lead wire component 100 held by the clamping device 5 in the embodiment. Figure 5 This is a diagram showing the lead wire component 100 of the embodiment from below.

[0044] The lead component 100 has a body 101 and a plurality of leads 110 protruding from the body 101.

[0045] The main body 101 includes a housing made of synthetic resin. An element, such as a coil, is disposed within the internal space of the main body 101. A lead 110 is a metallic protrusion. The lead 110 is connected, for example, to an element disposed within the internal space of the main body 101.

[0046] The lead wire 110 protrudes downward from the lower surface of the main body 101. With the lead wire component 100 mounted on the substrate 200, the lower surface of the main body 101 faces the upper surface of the substrate 200.

[0047] In one embodiment, the lead component 100 has two leads 110. In another embodiment, the leads 110 include a first lead 111 and a second lead 112.

[0048] The clamping device 5 holds the main body 101 of the lead wire component 100. A pair of clamping parts 5D hold the lead wire component 100 by clamping the main body 101.

[0049] [Detection device]

[0050] Figure 6 This is a perspective view showing the detection device 7 of the embodiment. (e.g.) Figure 6 As shown, with the main body 101 held in the clamping device 5, the detection device 7 detects the front ends of each of the plurality of leads 110. In this embodiment, the detection device 7 detects the position of the front ends of the leads 110. In the following description, the position of the front ends of the leads 110 detected by the detection device 7 will be appropriately referred to as the detection position.

[0051] The detection device 7 includes: a projection device 7A that illuminates striped pattern light onto the lead member 100 held in the clamping device 5; an imaging device 7B that captures images of the lead member 100 illuminated with striped pattern light; and a calculation device 7C that calculates the detection position of the front end of the lead 110 in three-dimensional space based on the image data captured by the imaging device 7B using a phase-shifting method.

[0052] In this embodiment, the projection device 7A and the imaging device 7B are respectively housed in the housing 7D. The projection device 7A and the imaging device 7B are respectively fixed to the housing 7D. A transparent member 7E is disposed in the opening at the upper end of the housing 7D. A glass plate is exemplified as the transparent member 7E.

[0053] The projection device 7A includes: a light source; a light modulation element that modulates the light emitted from the light source to generate a striped pattern light; and an emission optical system that emits the striped pattern light generated by the light modulation element. Examples of light modulation elements include a digital micromirror device (DMD), a transmissive liquid crystal panel, or a reflective liquid crystal panel.

[0054] The imaging device 7B includes: an imaging optical system for imaging the striped pattern light reflected by the lead member 100; and an imaging element for acquiring image data of the lead member 100 via the imaging optical system. Examples of imaging elements include a CMOS image sensor (Complementary Metal Oxide Semiconductor Image Sensor) or a CCD image sensor (Charge Coupled Device Image Sensor).

[0055] The arithmetic unit 7C includes a computer system. The arithmetic unit 7C has a processor such as a CPU (Central Processing Unit), a memory such as ROM (Read Only Memory) or RAM (Random Access Memory), and an input / output interface including input / output circuitry capable of inputting and outputting signals and data.

[0056] The detection device 7 measures the three-dimensional shape of the lead member 100 held in the clamping device 5 based on the phase-shifting method. The projection device 7A illuminates the lead member 100 while shifting the phase of a striped pattern light with a brightness distribution, such as a sinusoidal wave. The lead member 100 held in the clamping device 5 is positioned above the transparent member 7E. The striped pattern light emitted from the projection device 7A illuminates the lead member 100 via the transparent member 7E. The imaging device 7B captures images of the lead member 100 projected with the striped pattern light. The imaging device 7B captures images of the lead member 100 via the transparent member 7E. The imaging device 7B captures images of the lead member 100 from a position slightly below it. The calculation device 7C calculates the detection position of the leading end of the lead 110 in the local coordinate system based on the data captured by the imaging device 7B.

[0057] [Control Device]

[0058] Figure 7 This is a block diagram illustrating the component mounting device 1 of the embodiment. For example... Figure 7 As shown, the component mounting device 1 includes a control device 9. The control device 9 includes a computer system. The control device 9 includes: an arithmetic processing unit 9A, including a processor such as a CPU (Central Processing Unit); a storage device 9B, including volatile memory such as RAM (Random Access Memory) and non-volatile memory such as ROM (Read Only Memory); and an input / output interface 9C.

[0059] The clamping device 5, the moving device 6, the detection device 7, and the force sensor 8 are connected to the input / output interface 9C. The clamping device 5 and the moving device 6 are controlled by the control device 9. The control device 9 controls the rotary actuator and the clamping actuator of the clamping device 5. The control device 9 controls the rotary actuator, the first rotary actuator, the second rotary actuator, and the third rotary actuator of the moving device 6. The detection data from the detection device 7 and the detection data from the force sensor 8 are sent to the control device 9.

[0060] The arithmetic processing unit 9A includes a position error calculation unit 10, a correction lead setting unit 11, a movement control unit 12, and a clamping control unit 13.

[0061] The position error calculation unit 10 calculates the difference Δ between the detection position Ps of the leading end of the lead 110 detected by the detection device 7 and the ideal position Pr of the leading end of the lead 110 for each of the multiple leads 110. The ideal position Pr of the leading end of the lead 110 is the design position of the leading end of the lead 110. The ideal position Pr of the leading end of the lead 110 is known data derived from the design data or specification data of the lead component 100. The ideal position Pr of the leading end of the lead 110 is pre-stored in the storage device 9B.

[0062] For example, if the lead 110 is bent during the transport of the lead component 100 or if the lead component 100 contains manufacturing errors, the difference Δ will increase.

[0063] The correction lead setting unit 11 sets correction leads to be corrected in the substrate 200 from among a plurality of leads 110 based on the detection position of the front end of the lead 110 detected by the detection device 7. In an embodiment, the correction lead setting unit 11 sets the lead 110 whose difference Δ calculated by the position error calculation unit 10 exceeds a predetermined allowable value as a correction lead.

[0064] In this embodiment, the corrective lead refers to the lead 110 corrected using the substrate 200. The corrective lead 110 includes a bent lead 110. When correcting the corrective lead, the corrective lead is bent so that the front end of the corrective lead is close to an ideal position or multiple leads 110 are respectively inserted into the holes 210 of the substrate 200.

[0065] In the embodiment, the lead 110 that is not set as a correction lead by the correction lead setting unit 11 is appropriately referred to as a non-correction lead.

[0066] Figure 8 This diagram illustrates the processing of the position error calculation unit 10 and the processing of the correction lead setting unit 11 in the embodiment. Figure 8 In this process, the ideal position Pr of the leading end of the lead 110 is predetermined. Furthermore, based on the ideal position Pr, the allowable range TL of the position of the leading end of the lead 110 is predetermined. Figure 8 In the example shown, the allowable range TL is a circular range centered on the front end of the lead 110. The allowable range TL and the allowable value are determined based on the lead spacing, which represents the distance between the two leads 110, and the hole spacing, which represents the distance between the holes 210 of the substrate 200 into which the two leads 110 are respectively inserted. That is, the allowable range TL and the allowable value are set such that the two leads 110 are simultaneously inserted into the two holes 210.

[0067] The position error calculation unit 10 calculates the difference Δ between the detection position Ps, which represents the actual position of the front end of the lead wire 110, and the ideal position Pr.

[0068] Figure 8 (A) represents an example where the detection position Ps of the first lead 111 is configured within the allowable range TL, and the detection position Ps of the second lead 112 is configured within the allowable range TL. When the detection position Ps of the first lead 111 is configured within the allowable range TL, the correction lead setting unit 11 determines that the difference Δ between the detection position Ps of the leading end of the first lead 111 and the ideal position Pr of the leading end of the first lead 111 is below an allowable value. Similarly, when the detection position Ps of the second lead 112 is configured within the allowable range TL, the correction lead setting unit 11 determines that the difference Δ between the detection position Ps of the leading end of the second lead 112 and the ideal position Pr of the leading end of the second lead 112 is below an allowable value. Figure 8 In the example shown in (A), the correction lead setting unit 11 does not set both the first lead 111 and the second lead 112 as correction leads. Figure 8 In the example shown in (A), the first lead 111 and the second lead 112 are respectively set as non-corrected leads.

[0069] The first lead 111 and the second lead 112 are designated as non-corrective leads because the lead spacing of the first lead 111 and the second lead 112 is substantially the same as the hole spacing of the two holes 210 into which the first lead 111 and the second lead 112 are respectively inserted. That is, it means that the two leads 110 can be inserted into the two holes 210 simultaneously.

[0070] Figure 8 (B) represents an example where the detection position Ps of the first lead 111 is configured within the allowable range TL, but the detection position Ps of the second lead 112 is not configured within the allowable range TL. When the detection position Ps of the second lead 112 is not configured within the allowable range TL, the correction lead setting unit 11 determines that the difference Δ between the detection position Ps of the leading end of the second lead 112 and the ideal position Pr of the leading end of the second lead 112 exceeds an allowable value. Figure 8 In the example shown in (B), the correction lead setting unit 11 does not set the first lead 111 as the correction lead but sets the second lead 112 as the correction lead. Figure 8 In the example shown in (B), the first lead 111 is set as a non-corrected lead.

[0071] Setting at least one of the first lead 111 and the second lead 112 as a corrective lead means that the lead spacing of the first lead 111 and the second lead 112 is inconsistent with the hole spacing of the two holes 210 into which the first lead 111 and the second lead 112 are respectively inserted. That is, it means that the two leads 110 cannot be inserted into the two holes 210 at the same time.

[0072] The movement control unit 12 controls the movement device 6. The movement control unit 12 controls the movement device 6 so that after inserting the corrected lead into the first hole 210 of the substrate 200 with the main body 101 of the lead member 100 tilted at a first angle θ1, the non-corrected lead is inserted into the second hole 210 of the substrate 200 until the main body 101 of the lead member 100 is at a second angle θ2.

[0073] In one embodiment, the movement control unit 12 controls the movement device 6 to insert the correction lead into the first hole 210 of the substrate 200 while the main body 101 of the lead member 100 is tilted at a first angle θ1, and to correct the correction lead until the non-correction lead is opposite to the second hole 210 of the substrate 200, and then insert the non-correction lead into the second hole 210 of the substrate 200 until the main body 101 of the lead member 100 is at a second angle θ2.

[0074] For example, when the second lead 112 is set as a corrective lead and the first lead 111 is set as a non-corrective lead, the movement control unit 12 controls the movement device 6 to insert the second lead 112 into the first hole 210 of the substrate 200 while the main body 101 of the lead member 100 is tilted at a first angle θ1, and bend the second lead 112 until the first lead 111 is aligned with the second hole 210 of the substrate 200, and then insert the first lead 111 into the second hole 210 of the substrate 200 until the main body 101 of the lead member 100 is at a second angle θ2.

[0075] Furthermore, the motion control unit 12 controls the moving device 6 based on the detection value of the force sensor 8. The force sensor 8 can detect the load applied to the lead 110 when it is inserted into the hole 210 of the substrate 200. If the force sensor 8 determines that the load applied to the lead 110 exceeds a predetermined threshold, the motion control unit 12 controls the moving device 6, for example, to stop the operation of inserting the lead 110 into the hole 210.

[0076] The clamping control unit 13 controls the clamping device 5. The clamping control unit 13 controls the clamping device 5 to bring the pair of clamping portions 5D closer together or separate them. With the main body 101 positioned between the pair of clamping portions 5D, the main body 101 is held in place by the clamping portions 5D when the pair of clamping portions 5D bring them closer together. When the pair of clamping portions 5D separate, the lead wire member 100 is released from the clamping portions 5D.

[0077] [Correcting Insertion]

[0078] Next, the method of inserting the corrected lead and the non-corrected lead of the lead member 100 into the holes 210 of the substrate 200 will be described. In the following description, the action of inserting the corrected lead into the first hole 210 of the substrate 200 and then inserting the non-corrected lead into the second hole 210 of the substrate 200 will be appropriately referred to as corrected insertion.

[0079] Figures 9 to 13 These are diagrams illustrating the corrective insertion used to explain the implementation method.

[0080] In this embodiment, "the lead component 100 is mounted on the substrate 200" means that both ends of the two leads 110 are inserted into the holes 210 of the substrate 200. "Before the lead component 100 is mounted on the substrate 200" means before both ends of the two leads 110 are inserted into the holes 210 of the substrate 200.

[0081] The clamping device 5 can move the component supply member 3, the detection device 7, and the substrate support member 4 via the moving device 6. The clamping device 5 moves to the component supply member 3, and after holding the main body 101 of the lead member 100 disposed on the component supply member 3, it moves to the detection device 7. The detection device 7 detects the position of the front end of the lead 110 held in the lead member 100 of the clamping device 5. After the position of the front end of the lead 110 is detected by the detection device 7, the clamping device 5 moves to the substrate support member 4 and begins the operation of inserting the lead 110 of the lead member 100 into the hole 210 of the substrate 200 supported by the substrate support member 4.

[0082] The upper surface of the substrate 200 is parallel to the XY plane. A hole 210 is formed in the substrate 200. The hole 210 includes a hole 211 for inserting a first lead 111 and a hole 212 for inserting a second lead 112.

[0083] exist Figures 9 to 13 In the example shown, the length of the first lead 111 is equal to the length of the second lead 112. Furthermore, as... Figure 9As shown, before the lead component 100 is mounted on the substrate 200, the second lead 112 is bent, and the difference Δ between the detection position Ps of the front end of the second lead 112 and the ideal position Pr of the front end of the second lead 112 exceeds an allowable value. On the other hand, the difference Δ between the detection position Ps of the front end of the first lead 111 and the ideal position Pr of the front end of the first lead 111 is below an allowable value. That is, the second lead 112 is set as a corrected lead, and the first lead 111 is set as a non-corrected lead. The second lead 112 (corrected lead) is inserted into the hole 212 (first hole), and the first lead 111 (non-corrected lead) is inserted into the hole 211 (second hole).

[0084] In this embodiment, the moving device 6 is a multi-joint robot. Therefore, the moving device 6 is capable of tilting the lead member 100 relative to the upper surface of the substrate 200. The moving device 6 can arbitrarily adjust the angle between the upper surface of the substrate 200 and the lower surface of the body 101 held in the clamping device 5.

[0085] like Figure 9 As shown, with the main body 101 adjusted to the second angle θ2 before the lead wire component 100 is mounted on the substrate 200, the distance L2 between the front end of the second lead wire 112 (correction lead wire) and the upper surface of the substrate 200 is longer than the distance L1 between the front end of the first lead wire 111 (non-correction lead wire) and the upper surface of the substrate 200. Furthermore, the distances (L1, L2) referred to here are distances in the Z-axis direction orthogonal to the upper surface of the substrate 200.

[0086] The second angle θ2 is the angle formed by the upper surface of the substrate 200 and the lower surface of the body 101 held in the clamping device 5. For example... Figure 9 As shown, the second angle θ2 is 0°. That is, the upper surface of the substrate 200 is substantially parallel to the lower surface of the body 101 held in the clamping device 5. Before the lead member 100 is installed on the substrate 200, with the upper surface of the substrate 200 parallel to the lower surface of the body 101, the distance L2 between the front end of the second lead 112 (correction lead) and the upper surface of the substrate 200 is longer than the distance L1 between the front end of the first lead 111 (non-correction lead) and the upper surface of the substrate 200.

[0087] In this embodiment, the second lead 112 is inserted into the hole 210 before the first lead 111. That is, before the lead member 100 is mounted on the substrate 200, with the upper surface of the substrate 200 parallel to the lower surface of the body 101, the lead 110 is inserted into the hole 210 of the substrate 200 in the order that the leading ends of the lead 110 are away from the upper surface of the substrate 200.

[0088] like Figure 9As shown, when the front end of the first lead 111 is opposite to the hole 211 of the substrate 200, the front end of the second lead 112 cannot be opposite to the hole 212 of the substrate 200.

[0089] like Figure 10 As shown, the movement control unit 12 tilts the main body 101 of the lead wire member 100 held in the clamping device 5 so that the lower surface of the main body 101 of the lead wire member 100 forms a first angle θ1 relative to the upper surface of the substrate 200. The first angle θ1 is the angle formed by the upper surface of the substrate 200 and the lower surface of the main body 101 held in the clamping device 5. The first angle θ1 is greater than the second angle θ2. As an example, the first angle θ1 is 5° or more and 45° or less.

[0090] The movement control unit 12 controls the movement device 6 so that the front end of the second lead 112 is aligned with the hole 212 while the main body 101 of the lead member 100 is tilted at a first angle θ1. Figure 10 In the example shown, the movement control unit 12 causes the main body 101 of the lead wire component 100 to move from... Figure 9 The state shown is tilted at a first angle θ1, and the lead wire component 100 is moved in the +X direction so that the front end of the second lead wire 112 is aligned with the hole 212.

[0091] After aligning the front end of the second lead 112 with the hole 212, as follows Figure 11 As shown, the movement control unit 12 controls the movement device 6 to insert the second lead 112 into the hole 212. The movement control unit 12, while maintaining the main body 101 of the lead member 100 at a first angle θ1, inserts the second lead 112 into the hole 212 at an angle. That is, while maintaining the main body 101 at the first angle θ1, the movement control unit 12 moves the main body 101 towards the upper surface of the substrate 200 and in an inclined direction relative to the upper surface of the substrate 200, inserting the second lead 112 into the hole 212. In this embodiment, the movement control unit 12, while maintaining the main body 101 at the first angle θ1, moves the lead member 100 from... Figure 10 The state shown moves in both the -X and -Z directions. Therefore, as... Figure 11 As shown, the second lead 112 is inserted into the hole 212.

[0092] When the second lead 112 is inserted into the hole 212, the load applied to the second lead 112 is detected by the force sensor 8. The movement control unit 12 controls the movement device 6 based on the detection value of the force sensor 8. If the force sensor 8 determines that the load applied to the second lead 112 exceeds a predetermined threshold, the movement control unit 12 controls the movement device 6, for example, to stop the operation of inserting the second lead 112 into the hole 212, or to perform the operation of inserting the second lead 112 into the hole 212 again after correcting the movement trajectory of the lead member 100, so as not to apply excessive load to the second lead 112.

[0093] After the second lead 112 is inserted into the hole 212, the second lead 112 is straightened using the substrate 200. For example... Figure 12 As shown, with the second lead 112 disposed in the hole 212, the movement control unit 12 moves the lead member 100 until the leading end of the first lead 111 is aligned with the hole 211 of the substrate 200. That is, with the second lead 112 disposed in the hole 212, the movement control unit 12 moves the lead member 100 in a direction parallel to the upper surface of the substrate 200 until the leading end of the first lead 111 is aligned with the hole 211 of the substrate 200. In this embodiment, the movement control unit 12, while maintaining the main body 101 at a first angle θ1, moves the lead member 100 from... Figure 11 The state shown shifts in the -X direction. Therefore, as... Figure 12 As shown, the second lead 112 is bent and straightened. The second lead 112 is straightened so that its front end is close to the ideal position Pr of the second lead 112.

[0094] After correcting the second lead 112 until the first lead 111 aligns with the hole 211 of the substrate 200, as follows Figure 13 As shown, the movement control unit 12 controls the movement device 6 to insert the first lead 111 into the hole 211 while the second lead 112 is disposed in the hole 212. The movement control unit 12 controls the movement device 6 to insert the first lead 111 into the hole 211 of the substrate 200 until the main body 101 of the lead member 100 becomes a reference. Figure 9 The second angle θ2 is explained. That is, the movement control unit 12 inserts the first lead 111 into the hole 211 of the substrate 200 with the lower surface of the main body 101 parallel to the upper surface of the substrate 200.

[0095] In addition, Figures 9 to 13In the example shown, the first lead 111 is not bent (not straightened). Alternatively, the first lead 111 can also be bent (or straightened). That is, when the first lead 111 is set as an unstraightened lead, the first lead 111 can be straightened or not.

[0096] [Component Installation Method]

[0097] Figure 14 This is a flowchart illustrating the component mounting method of the embodiment. The movement control unit 12 controls the movement device 6 to move the clamping device 5 toward the component supply member 3. After the clamping device 5 moves to the component supply member 3, the clamping control unit 13 holds the clamping device 5 on the lead member 100 disposed on the component supply member 3 (step S1).

[0098] The movement control unit 12 controls the movement device 6 to move the clamping device 5 holding the lead member 100 toward the detection device 7. After the clamping device 5 moves to the detection device 7, the detection device 7 detects the position of the front end of each of the plurality of leads 110 while the main body 101 is held by the clamping device 5 (step S2).

[0099] The position error calculation unit 10 calculates the difference Δ between the detection position Ps of the front end of each of the multiple leads 110 and the ideal position Pr of the front end of the lead 110. The correction lead setting unit 11 determines whether the difference Δ is below the allowable value (step S3).

[0100] In step S3, if it is determined that the difference Δ is below the allowable value (step S3: Yes), the movement control unit 12 begins normal insertion (step S4).

[0101] Normal insertion refers to inserting two leads 110 into holes 210 of substrate 200 while maintaining the main body 101 of lead component 100 at a second angle θ2.

[0102] The motion control unit 12 determines whether the detection value of the force sensor 8 is normal (step S5).

[0103] In step S5, if the detection value of the force sensor 8 is determined to be normal (step S5: Yes), normal insertion is performed. While holding the main body 101, the clamping device 5 simultaneously inserts the two leads 110 into the two holes 210 of the substrate 200. By performing normal insertion, the insertion action of inserting the two leads 110 into the holes 210 of the substrate 200 is completed. By completing the insertion action, the lead member 100 is mounted on the substrate 200.

[0104] In step S5, if it is determined that the detection value of the force sensor 8 is abnormal (step S5: No), the normal insertion is interrupted. The position error calculation unit 10 calculates the detection measurement (step S6).

[0105] The probe measurement refers to the difference between the inner diameter of the hole 210 and the outer diameter of the lead wire 110.

[0106] After calculating the probe measurements, the movement control unit 12 begins the probe insertion (step S7).

[0107] Detection insertion refers to the method of reducing the detection value of the force sensor 8, changing the position of the lead component 100 relative to the substrate 200 or the movement trajectory of the lead 110 inserted into the hole 210 within the detection range, and determining the optimal position or movement trajectory to insert the lead 110 into the hole 210 of the substrate 200.

[0108] The motion control unit 12 determines whether the detection value of the force sensor 8 is normal (step S8).

[0109] In step S8, if the detection value of the force sensor 8 is determined to be normal (step S8: Yes), a probe insertion is performed. By performing the probe insertion, the insertion action of inserting the two leads 110 into the holes 210 of the substrate 200 is completed.

[0110] In step S8, if the detection value of the force sensor 8 is determined to be abnormal (step S8: no), the motion control unit 12 determines whether the predetermined number of retries has been exceeded (step S9).

[0111] In step S9, if it is determined that the number of retries has not been exceeded (step S9: No), the process returns to step S7. The movement control unit 12 performs multiple probe insertions within the number of retries until the insertion operation is completed.

[0112] In step S9, if it is determined that the number of retries has been exceeded (step S9: Yes), the movement control unit 12 stops the insertion operation.

[0113] In step S3, if it is determined that the difference Δ exceeds the allowable value (step S3: No), the movement control unit 12 starts to refer to... Figures 9 to 13 The corrective insertion is described (step S10).

[0114] The motion control unit 12 determines whether the detection value of the force sensor 8 is normal (step S11).

[0115] In step S11, if the detection value of the force sensor 8 is determined to be normal (step S11: Yes), a correction insertion is performed. By performing the correction insertion, the insertion action of inserting the two leads 110 into the holes 210 of the substrate 200 is completed.

[0116] In step S11, if it is determined that the detection value of the force sensor 8 is abnormal (step S11: no), the position error calculation unit 10 calculates the detection measurement (step S12).

[0117] After calculating the probe measurements, the movement control unit 12 begins to probe for insertion (step S13).

[0118] The motion control unit 12 determines whether the detection value of the force sensor 8 is normal (step S14).

[0119] In step S14, if the detection value of the force sensor 8 is determined to be normal (step S14: Yes), a probe insertion is performed. By performing the probe insertion, the insertion action of inserting the two leads 110 into the holes 210 of the substrate 200 is completed.

[0120] In step S14, if the detection value of the force sensor 8 is determined to be abnormal (step S14: No), the motion control unit 12 determines whether the predetermined number of retries has been exceeded (step S15).

[0121] In step S15, if it is determined that the number of retries has not been exceeded (step S15: No), the process returns to step S13. The movement control unit 12 performs multiple probe insertions within the number of retries until the insertion operation is completed.

[0122] In step S15, if it is determined that the number of retries has been exceeded (step S15: Yes), the movement control unit 12 stops the insertion operation.

[0123] [Effect]

[0124] As described above, the component mounting apparatus 1 of the embodiment includes: a clamping device 5 for holding the main body 101 of the lead member 100 having a plurality of leads 110; a moving device 6 for moving the clamping device 5; a detection device 7 for detecting the front ends of each of the plurality of leads 110 while the main body 101 is held in the clamping device 5; a correction lead setting unit 11 for setting a correction lead from the plurality of leads 110 to be corrected in the substrate 200 based on the detection position of the front ends of the leads 110 detected by the detection device 7; and a movement control unit 12 for controlling the moving device 6 so that after inserting the correction lead (second lead 112) into the first hole 210 (hole 212) of the substrate 200 while the main body 101 of the lead member 100 is tilted at a first angle θ1, a non-correction lead (first lead 111) is inserted into the second hole 210 (hole 211) of the substrate 200 until the main body 101 of the lead member 100 is at a second angle θ2.

[0125] According to the embodiment, after inserting the correcting lead into the hole 212 with the main body 101 of the lead member 100 tilted at a first angle θ1, the correcting lead is corrected until the uncorrected lead is aligned with the hole 211. After correcting the correcting lead, the uncorrected lead is inserted into the hole 211 until the main body 101 of the lead member 100 is at a second angle θ2. Thus, regardless of the type of lead member 100, the lead 110 is efficiently corrected in the substrate 200, and the lead member 100 is efficiently mounted on the substrate 200.

[0126] In this embodiment, before the lead component 100 is mounted on the substrate 200, with the main body 101 adjusted to a second angle θ2, the distance L2 between the leading end of the corrected lead and the upper surface of the substrate 200 is longer than the distance L1 between the leading end of the uncorrected lead and the upper surface of the substrate 200. That is, before the lead component 100 is mounted on the substrate 200, with the upper surface of the substrate 200 parallel to the lower surface of the main body 101, the leads 110 are inserted into the holes 210 of the substrate 200 in the order that the leading ends of the leads 110 are furthest from the upper surface of the substrate 200. Regardless of the relative positions of the two leads 110 to the substrate 200 before the lead component 100 is mounted on the substrate 200, the component mounting device 1 can efficiently correct the leads 110 in the substrate 200, thereby mounting the lead component 100 onto the substrate 200.

[0127] In this embodiment, the difference Δ between the detection position Ps of the leading end of each of the plurality of leads 110 and the ideal position Pr of the leading end of the lead 110 is calculated. The lead setting unit 11 sets the leads 110 whose difference Δ exceeds a predetermined allowable value as corrective leads. Thus, corrective leads and non-corrective leads are set appropriately.

[0128] In this embodiment, the mobile device 6 includes a multi-jointed robot. Thus, the mobile device 6 can adjust the lower surface of the main body 101 relative to the upper surface of the substrate 200 to any angle.

[0129] When the lead 110 is inserted into the hole 210 of the substrate 200, the load applied to the lead 110 is detected by the force sensor 8. The movement control unit 12 controls the movement device 6 based on the detection value of the force sensor 8. If the force sensor 8 determines that the load applied to the lead 110 exceeds a predetermined threshold, the movement control unit 12 can control the movement device 6, for example, to stop the insertion of the lead 110 into the hole 210. Thus, excessive load is suppressed from being applied to the lead 110.

[0130] The detection device 7 detects the position of the leading end of the lead 110 based on the phase-shifting method. Therefore, it is possible to detect the position of the leading end of the lead 110 in three-dimensional space with high precision.

Claims

1. A component mounting device, characterized in that, have: A clamping device that holds the main body of a lead wire component with multiple leads; The moving device moves the clamping device; The detection device detects the front ends of each of the plurality of leads while the main body is held in the clamping device. The correction lead setting unit sets a correction lead to be corrected in the substrate from a plurality of leads based on the detection position of the front end detected by the detection device. as well as The movement control unit controls the movement device so that, after inserting the correcting lead into the first hole of the substrate while the lead member is tilted at a first angle, the non-correcting lead is inserted into the second hole of the substrate until the lead member reaches a second angle. When the lead component is adjusted to the second angle before being mounted on the substrate, the distance between the front end of the correcting lead and the surface of the substrate is longer than the distance between the front end of the uncorrecting lead and the surface of the substrate.

2. The component mounting device according to claim 1, characterized in that, The device includes a position error calculation unit, which calculates the difference between the detected position of the front end and the ideal position of the front end for each of the plurality of leads. The correction lead setting unit sets the lead whose difference exceeds the allowable value as the correction lead.

3. The component mounting device according to claim 1 or 2, characterized in that, The mobile device includes a multi-jointed robot.

4. The component mounting device according to claim 1 or 2, characterized in that, The device includes a force sensor that detects the load applied to the lead when the lead is inserted into a hole in the substrate. The motion control unit controls the motion device based on the detection values ​​of the force sensor.

5. The component mounting device according to claim 1 or 2, characterized in that, The detection device comprises: a projection device for irradiating the lead component with striped pattern light; an imaging device for photographing the lead component irradiated with the striped pattern light; and a calculation device for calculating the detection position of the front end in three-dimensional space based on the photographing data of the imaging device using a phase-shifting method.

6. A method for installing a component, characterized in that, include: With the main body of the lead component having multiple leads held in the clamping device, the front ends of each of the multiple leads are detected; Based on the detection position of the front end, a correction lead is set in the substrate from among the plurality of leads; as well as After inserting the correcting lead into the first hole of the substrate with the lead component tilted at a first angle, the non-correcting lead is inserted into the second hole of the substrate until the lead component reaches a second angle. When the lead component is adjusted to the second angle before being mounted on the substrate, the distance between the front end of the correcting lead and the surface of the substrate is longer than the distance between the front end of the uncorrecting lead and the surface of the substrate.

Images