Elastic average coupling device

Abstract

A passive optical alignment coupling device is disclosed for use between an optical connector having a first two-dimensional planar array with alignment configuration and a base having a second two-dimensional planar array with alignment configuration. One array is a network of orthogonally intersecting longitudinal trenches defining a discrete array of protrusions, each protrusion being generally pyramidal in shape and having a truncated top separated from each other by the orthogonally intersecting longitudinal trenches. The other array is a network of longitudinal cylindrical protrusions. The cylindrical protrusions are received in the trenches, with the protruding surfaces of the cylindrical protrusions contacting the trench surfaces, and the tops of the discrete protrusions contacting the surfaces defined by the cylindrical protrusions. The optical connector is removably attached to the base to define a detachable coupling, wherein the first array of alignment configurations abuts against the second array of alignment configurations to define a resiliently averaged coupling.

Description

[0001] Priority Statement

[0002] This application claims priority to U.S. Provisional Patent Application No. 62 / 969,536, filed February 3, 2020. That application is incorporated herein by reference in its entirety as if it were fully set forth herein. All publications mentioned below are incorporated herein by reference in their entirety as if they were fully set forth herein. Technical Field

[0003] The present invention relates to coupling light into and out of optoelectronic components (e.g., photonic integrated circuits (PIC)), and more specifically, to an optical connection between an optical fiber and a PIC. Background Technology

[0004] Photonic integrated circuits (PICs), or integrated optical circuits, are part of an emerging technology that uses light instead of electric current as the basis for operation. PIC devices integrate multiple (at least two) photonic functions, thus resembling electronic integrated circuits. The key difference is that photonic integrated circuits provide functionality for information signals applied to light wavelengths typically in the visible spectrum or near-infrared 850 nm–1650 nm range.

[0005] Photonic Chip Packages (PICs) are used in a variety of applications in telecommunications, instrumentation, and signal processing. PIC devices (in the form of photonic chip packages) typically use optical waveguides to realize and / or interconnect various on-chip components, such as waveguides, optical switches, couplers, routers, splitters, multiplexers / demultiplexers, modulators, amplifiers, wavelength converters, and opto-to-electric (O / E) and electro-optical (E / O) signal converters (e.g., photodiodes, lasers). The waveguides in PIC devices are typically solid-state optical conductors on the chip, guiding light due to the refractive index difference between the core and cladding layers.

[0006] One of the most expensive components in photonic networks is the fiber optic connector. For proper operation, a photonic device (PIC) typically needs to efficiently couple light between an external optical fiber and one or more on-chip waveguides. PIC devices often require optical connections to other PIC devices, typically in the form of an organized network of optical signal communications. Connection distances can range from millimeters in chip-to-chip communications to kilometers in long-distance applications. Fiber optics provide an efficient connection method because light can flow over long distances at very high data rates (>25 Gbps) due to the low loss of fiber. For proper operation, PIC devices need to efficiently couple light between an external optical fiber and one or more on-chip waveguides. One advantage of using light as the basis for circuit operation in PIC devices is that its energy cost for high-speed signal transmission is significantly lower than that of electronic chips. Therefore, maintaining this advantage through efficient coupling between PIC devices and other optical components, such as optical fibers, is a crucial aspect of PICs.

[0007] One method for coupling optical fiber to a PIC device (or PIC chip package) is to attach an optical fiber array to the edge of the PIC chip. Until now, an active alignment method has been used to align the optical fiber array with the components on the PIC. In this method, the position and orientation of the optical fiber are mechanically adjusted until the amount of light transmitted between the fiber and the PIC is maximized. This is a time-consuming process that typically occurs after the PIC has been diced from the wafer and installed within the package. This postpones the fiber optic connection to the very end of the manufacturing process. Once the connection is formed, it is permanent and cannot be removed, separated, or disconnected without compromising the integrity of the connection so that the optical fiber array can be reattached to the PIC. In other words, the optical fiber array cannot be removably attached to the PIC, and connecting or disconnecting the optical fiber array would be destructive and irreversible (i.e., not reconnectable).

[0008] Current attempts to achieve tight alignment tolerances using polymer connector elements have several fundamental drawbacks. First, polymers are flexible and therefore easily deformed under applied loads. Second, they are dimensionally unstable and can change size and shape, especially when subjected to high temperatures, such as in computer and network hardware. Third, polymers have a much higher coefficient of thermal expansion (CTE) than materials typically used in PIC devices. Therefore, temperature cycling can lead to misalignment between the fiber optic cable and the optics on the PIC device. In some cases, polymers cannot withstand the processing temperatures used when soldering PIC devices onto printed circuit boards.

[0009] Furthermore, it is advantageous to establish fiber optic connections before the discrete PICs are diced from the wafer; this is often referred to as wafer-level attachment. Manufacturers of integrated circuits and PICs typically possess expensive assets capable of submicron alignment (e.g., wafer detectors and loaders for testing integrated circuits), while chip packaging companies typically have less capable machines (often with alignment tolerances of a few micrometers, insufficient for single-mode devices) and often rely on manual operation. However, permanently attaching fiber optics to the PIC prior to dicing is impractical because the fibers would become tangled, hindering the dicing and packaging processes, and are virtually impossible to handle when the PIC is picked up and placed onto the printed circuit board and subsequently soldered to the PCB at high temperatures.

[0010] U.S. Patent Publication No. 2016 / 0161686A1 (commonly assigned to the assignee of this application and incorporated herein by reference in its entirety) discloses a detachable optical connector for optoelectronic devices. The disclosed detachable optical connector includes an implementation of a resilient averaging coupling device to provide an improved method for coupling the input / output light of an optical fiber to a PIC, which improves tolerances, manufacturability, ease of use, functionality, and reliability at a lower cost. As known in the prior art, resilient averaging represents a subset of surface coupling types, where improved accuracy is obtained from averaging errors from a large number of contact surfaces. In contrast to kinematic design, resilient averaging is based on significantly over-constraining the solid body with a large number of more compliant components. When the system is preloaded, the elasticity of the material allows the dimensional and positional errors of each individual contact configuration to be averaged relative to the sum of contact configurations throughout the solid body. While the repeatability and accuracy obtained through resilient averaging may not be as high as in deterministic systems, the resilient averaging design allows for higher stiffness and lower localized stress compared to kinematic coupling devices. In a well-designed and preloaded elastic average coupling device, repeatability is approximately inversely proportional to the square root of the number of contact points.

[0011] Most PIC devices require single-mode optical connections, which necessitate tight alignment tolerances between the fiber and the PIC, typically less than 1 micrometer. Efficient optical coupling from the on-chip single-mode waveguide to the external fiber is challenging due to the size mismatch between the single-mode waveguide and the optical core within the fiber. For example, a typical silica fiber is approximately 40 times larger than a typical waveguide on a PIC. This size mismatch means that if the single-mode waveguide is directly coupled to the fiber, the respective modes of the waveguide and fiber may not couple efficiently, resulting in unacceptable insertion loss (e.g., >20 dB).

[0012] U.S. Patent Publication No. 2020 / 0124798A1 (commonly assigned to the assignee of this application and incorporated herein by reference in its entirety) discloses a detachable edge coupler with a micromirror optical platform for a PIC, which provides a mechanism for bringing the mode dimensions of optical fibers in an optical fiber array and on-chip optical elements close to each other to achieve efficient optical coupling input / output from fiber to PIC device.

[0013] There is a need for an improved detachable optical coupling device based on an improved elastic averaging method for use between connectors, which further improves tolerance, manufacturability, ease of use, functionality and reliability at a lower cost. Summary of the Invention

[0014] This invention overcomes the shortcomings of the prior art by providing a detachable / separable and reconnectable passive alignment coupling / connection that achieves high alignment accuracy. The optical connector (e.g., a portion supporting an optical bench or a supporting fiber of the optical bench) is configured and constructed to be non-destructively and removably attached for reconnection to a base with which it is aligned. This base can be a component of an optoelectronic device (e.g., part of a photonic integrated circuit (PIC) chip) or a separate component attached to the optoelectronic device.

[0015] The invention will now be explained with reference to the illustrated embodiments. The base can be aligned with electro-optical elements (e.g., grating couplers, waveguides, etc.) in an optoelectronic device. The base is permanently arranged relative to the optoelectronic device to provide an alignment reference relative to an external optical connector. The optical connector can be removably attached to the base by a 'separable' or 'detachable' or 'separable' action that precisely optically aligns the optical components / elements in the optical bench with the optoelectronic device along the desired optical path. To maintain optical alignment during each connection, disconnection, and reconnection, the connector needs to be precisely aligned with the base. According to the invention, a passive mechanical alignment is used to align the connector and base to each other; specifically, this passive mechanical alignment is an elastically averaged alignment formed by the geometry of the two bodies. Based on the foregoing description, the invention can be summarized as follows.

[0016] This invention relates to a passive optical alignment coupling for an optical connector and a base (e.g., associated with a PIC chip). The optical connector includes a first body for transmitting optical signals. The first body defines a first substrate (which may support an array of optical fibers) having a first flat surface defining a first two-dimensional planar array of alignment configurations integrally defined on the first surface of the first substrate; and a base (which may be coupled to a photonic integrated circuit PIC) including a second body providing an alignment reference to an external optoelectronic device transmitting optical signals with the optical connector. The second body defines a second substrate having a second flat surface defining a second two-dimensional planar array of alignment configurations integrally defined on the second surface of the second substrate. One of the first array and the second array of the alignment configurations includes a first network of orthogonally intersecting longitudinally opening trenches, and the other includes a second network of longitudinally cylindrical protrusions (each longitudinally cylindrical protrusion may be a continuous cylindrical protrusion or a series of discontinuous cylindrical protrusions), each longitudinally cylindrical protrusion having a longitudinal axis parallel to a corresponding surface of a first surface of the first substrate or a second surface of the second substrate. (Alternatively, the alignment configurations on the optical connector and the base can be interchanged.) The second network of cylindrical protrusions is received in a mating complementary first opening trench network, the protruding surfaces of the cylindrical protrusions contacting the trench surfaces of the longitudinal trenches. The optical connector is removably attached to the base to define a detachable coupling, wherein the first array of alignment configurations abuts against the second array of alignment configurations to define a resiliently averaged coupling, thereby aligning the optical connector with the base.

[0017] In one embodiment, the first orthogonal intersecting longitudinal trench network of the first alignment configuration defines an array of discrete protrusions separated and isolated from each other by orthogonal intersecting longitudinal trenches on a first surface of a first substrate (or alternatively on a second surface of a second substrate), each protrusion being a generally pyramidal shape with a truncated top (e.g., a flat or slightly convex curved top). The discrete protrusion array may include protrusion structures, each protrusion structure being symmetrical with respect to a first plane orthogonal to a corresponding surface of the first and second substrates, and also symmetrical with respect to a second plane orthogonal to the first plane and to a corresponding surface of the first and second surfaces (i.e., each protrusion structure is symmetrical along two orthogonal planes about a central axis orthogonal to the first surface of the first substrate of the optical connector (or, alternatively, to the second surface of the second substrate of the base).

[0018] In one embodiment, the second cylindrical protrusion network comprises an intersecting network of longitudinal cylindrical protrusions (forming a cross-grid structure on the surface of the corresponding substrate), and in one embodiment, the cross-section of each longitudinal cylindrical protrusion may be a substantially semi-circular profile. Other curved cross-sections of the protrusions may also be used (e.g., elliptical, parabolic, or Gothic pointed arch profiles).

[0019] In one embodiment, when the optical connector is coupled to the base, the protruding surface of the longitudinal cylindrical protrusion makes line contact with the trench surface to define a line contact array. In this embodiment, the longitudinal trench is a V-shaped trench, and each discrete protrusion includes a substantially flat surface corresponding to the trench surface, thereby defining a line contact with the protruding surface when the optical connector is coupled to the base. In another embodiment, when the optical connector is coupled to the base, the protruding surface of the longitudinal cylindrical protrusion makes point contact with the trench surface to define a point contact array. In this embodiment, each discrete protrusion includes a convex surface corresponding to the trench surface, thereby defining a point contact with the protruding surface when the optical connector is coupled to the base.

[0020] In one embodiment, the discrete protrusion array is a rectangular array of (M+1)×(N+1) discrete protrusions, corresponding to a first intersecting trench network comprising M×N orthogonally intersecting longitudinal trenches. The second cylindrical protrusion network comprises M×N orthogonally intersecting longitudinal cylindrical protrusions to match the first M×N intersecting longitudinal trench network. For a coupling interface with a planar area of ​​approximately 3 mm × 3 mm between the first surface of the optical connector and the second surface of the base, to achieve a coupling accuracy of less than 1 micrometer between the optical connector and the base, M is preferably in the range of 3 to 10, and N is in the range of 3 to 10.

[0021] In one embodiment, when the optical connector is coupled to the base, the discrete protrusions defined by the longitudinal grooves contact a corresponding surface of the first and second surfaces. Furthermore, in one embodiment, to ensure the optical connector is positioned in a predetermined, unique location on the base, the discrete protrusion array further includes a plurality of key protrusions having raised structures arranged along the periphery / edge of the first surface (or alternatively the second surface). The surface profile of these raised structures on the surface opposite the periphery / edge (i.e., the surface that does not contact the cylindrical protrusions when the optical connector is coupled to the base) differs from the surface profile of the symmetrical discrete protrusions located within the periphery / edge (i.e., the discrete protrusions that contact a corresponding surface of the first and second surfaces). For example, some discrete protrusions located at the periphery of a 10×5 discrete protrusion array (i.e., M=9 and N=4) (e.g., at corners (1,1), (10,1), (1,5), and (10,5)) may each include a surface profile different from that of discrete protrusions at interior locations in the array away from the periphery (e.g., at (2,2) to (9,2)). The shape of the corner protrusions cannot fit within the interior space defined by cylindrical protrusions on the four sides of the opposing surfaces. The corner protrusions can only fit within the space at the corners of the opposing surfaces because they are not limited by the cylindrical protrusions. Therefore, a guide key is provided at the coupling interface to initially guide the mating of the first array and the second array of the alignment configurations, thereby uniquely positioning the relative positions of the complementary alignment configurations to couple the optical connector to the base at a predetermined, intended relative position.

[0022] In one embodiment, the first substrate includes a first malleable metal material, and a first array of alignment structures of the optical connector is integrally defined on the first substrate by stamping the malleable metal material, and the second substrate includes a second malleable material, and a second array of alignment structures is integrally defined on the substrate by stamping the second malleable metal material.

[0023] In one embodiment, the optical connector further includes a first micromirror optical platform comprising a first substrate; a first mirror array defined on the first substrate, wherein each mirror includes a structured reflective surface profile that deflects light between a first optical path in a first direction along a first plane substantially parallel to a first surface of the first substrate and a second optical path in a second direction outside the first plane; and an array of fiber trenches defined on the first substrate, each fiber trench receiving a segment of optical fiber with its longitudinal axis along the first optical path and one end of the fiber optically aligned with a corresponding mirror along the first optical path. In one embodiment, the base includes a second micromirror optical platform comprising: a second substrate; and a second mirror array defined on the second substrate, wherein each mirror in the second mirror array includes a structured reflective surface profile that deflects light between a third optical path in a third direction along a second plane substantially parallel to a second surface of the second substrate and a fourth optical path in a fourth direction outside the second plane. In one embodiment, the first array of mirrors and the first array of the alignment structure are simultaneously defined on a first substrate by stamping a first metal blank, and the second array of mirrors and the second array of the alignment structure are simultaneously defined on a second substrate by stamping a second metal blank. By using high-precision stamping to integrally / simultaneously form the passive alignment structure and / or the miniature optical platform (MOB) on the base and the optical connector, these components can be produced economically in large or small quantities, while improving tolerances, manufacturability, ease of use, functionality, and reliability. The base and / or the optical platform components should be made of a stampable material, such as a ductile metal, such as Kova alloy, Invar alloy, stainless steel, or aluminum. Preferably, both the optical platform and the base should have similar coefficients of thermal expansion (CTE) to avoid misalignment during temperature cycling and to prevent stress / strain.

[0024] In one embodiment, the first substrate of the optical connector has a first reference surface on a first side of the first substrate, while the second substrate of the base has a second reference surface on a second side of the second substrate. The first and second reference surfaces are typically aligned by a flexible clip that biases the first substrate onto the second substrate and abuts the first array of the alignment configuration against the second array of the alignment configuration.

[0025] According to the present invention, the optical connector and the base define a free-space coupling, and light shaping is achieved without any refractive optical elements disposed between the optical connector and the base. Furthermore, the detachable, elastic, uniform coupling between the optical connector and the base is not defined using any complementary alignment pins and alignment holes.

[0026] The inventive flexible average coupling of this invention can be deployed in a photonic device. In one embodiment, the photonic device includes a support; an optoelectronic device attached to the top surface of the support; and a passive optical alignment including the flexible average coupling of this invention. A base is arranged on the optoelectronic device and / or the support relative to the optoelectronic device to define an alignment position of the optoelectronic device, thereby transmitting optical signals with an optical connector removably / detachably coupled to the base. The optoelectronic device may include a photonic integrated circuit (PIC) chip including optical elements as an optical interface to the outside of the PIC chip. The base is optically aligned with the optical elements of the PIC chip.

[0027] In one embodiment, the base includes an edge coupler optically aligned with the PIC chip, supported on the support member. The PIC chip's optical elements transmit light to the edge of the PIC chip. The edge coupler may include an array of mirrors optically aligned with the PIC chip's optical elements, and light travels along the optical path between the mirrors in the array and the corresponding optical elements in the PIC chip.

[0028] The present invention also relates to a method for providing a detachable connection between an optical connector and an optoelectronic device, the method comprising providing a support; attaching the optoelectronic device to a top surface of the support; and providing a passive optical alignment coupling device as described in any of the preceding claims, wherein a base is arranged on the optoelectronic device and / or the support relative to the optoelectronic device, and wherein the base defines an alignment position for the optoelectronic device to transmit optical signals with the optical connector detachably coupled to the base.

[0029] In one embodiment, the optical connector is first coupled to a base. The optical connector is actively aligned with the optoelectronic device (e.g., a PIC chip or optical I / O chip) by positioning the base relative to the optoelectronic device to obtain optimal optical signal between the optoelectronic device and the optical connector (e.g., an optical fiber supported by the optical connector). The base is fixed in alignment relative to the optoelectronic device (e.g., by using solder to fix the base to a support for the optoelectronic device, such as an insert, printed circuit board, sub-mount, etc.). The optical connector is then removed from the base, allowing the base to be permanently attached to the support (e.g., by reflowing solder) without changing its position on the support. Subsequently, the optical connector can be repeatedly connected, disconnected, and reconnected to the base without loss of the original optical alignment obtained through the active alignment between the optical connector and the optoelectronic device. For each connection, disconnection, and reconnection, the optical alignment remains consistent with the initial active alignment, ensuring precise and accurate alignment between the optical connector and the base.

[0030] In one embodiment, the base may be a component of the optoelectronic device or a support for the optoelectronic device. Attached Figure Description

[0031] To gain a fuller understanding of the nature and advantages of the invention, as well as preferred modes of use, reference should be made to the following detailed description in conjunction with the accompanying drawings. In the following drawings, the same reference numerals denote the same or similar parts throughout all the drawings.

[0032] Figures 1A to 1C A passive alignment configuration of an optical connector and base according to an embodiment of the present invention is shown.

[0033] Figures 2A to 2D An embodiment of the present invention is shown, illustrating the elastic average coupling interface between the optical connector and the base.

[0034] Figure 3A and 3B A passive alignment configuration of an optical connector and base according to another embodiment of the present invention is shown.

[0035] Figures 4A to 4D The elastic average coupling interface between the optical connector and the base is shown in another embodiment of the present invention.

[0036] Figure 5 A key protrusion according to another embodiment of the present invention is shown.

[0037] Figure 6A and 6B The positioning of the base as an edge coupler for a PIC chip is shown in one embodiment of the present invention.

[0038] Figures 7A to 7C The connection between the optical connector and the base is shown in one embodiment of the present invention.

[0039] Figures 8A to 8D The process for locating a fixed base for subsequent detachable connection, according to one embodiment of the present invention, is illustrated. Detailed Implementation

[0040] The present invention will now be described with reference to the accompanying drawings and various embodiments. Although the invention has been described in accordance with the best mode for carrying out the objectives of the invention, those skilled in the art will understand that various changes can be made based on these teachings without departing from the spirit or scope of the invention.

[0041] This invention overcomes the shortcomings of the prior art by providing a detachable / separable and reconnectable passive alignment coupling / connection that achieves high alignment accuracy. The optical connector (e.g., a portion supporting an optical bench or a supporting fiber of the optical bench) is configured and constructed to be non-destructively and removably attached for reconnection to a base with which it is aligned. This base can be a component of an optoelectronic device (e.g., part of a photonic integrated circuit (PIC) chip) or a separate component attached to the optoelectronic device.

[0042] The concept of flexible average coupling of the present invention is discussed below by reference to examples of a PIC as an optoelectronic device and an optical connector that includes an optical bench and optionally optically couples the input / output ends of an optical component (e.g., an optical fiber) supported in the optical bench to the optoelectronic device. The present invention can be used to provide structures and components in removable / reconnectable forms for use in other fields.

[0043] Figures 1A to 1C A passive alignment configuration of an optical connector 10 and a base 12 according to an embodiment of the present invention is shown. The optical connector 10 includes a first body B1 supporting an optical fiber array (schematically shown by dashed line FA) for transmitting optical signals. The base 12 includes a second body B2 providing an alignment reference to an external optoelectronic device (e.g., a PIC chip 100 in FIG. 7, or an I / O PIC chip 101 for an ASIC chip (e.g., a CPU, GPU, or switching ASIC) 102 in FIG. 8) that transmits optical signals with the optical fiber OF in the optical connector 10.

[0044] The first body of connector 10 defines a first substrate B1 supporting an optical fiber array FA having a first flat surface S1 defining a first two-dimensional planar array of alignment configurations F1 integrally defined on the first surface S1 of the first substrate B1. In this embodiment, connector 10 incorporates a miniature optical platform OB for supporting and aligning the optical fiber array FA. The optical fiber array FA has multiple optical fibers OF protected by a protective buffer layer and a matrix / sheath layer P. The substrate B1 of connector 10 defines a structured configuration and a structured reflective surface (e.g., eight mirrors M1) including an alignment configuration comprising an open trench G for holding exposed segments of the optical fibers OF (with exposed cladding, without the protective buffer layer and matrix / sheath layer J), the structured reflective surface having a plane that is larger and angled relative to the substrate B1. The dimensions of the open trench G adapt it to receive the end segments of the optical fibers OF, and its position allows it to precisely position the end segments of the optical fibers OF such that the end segments are aligned relative to the first mirror array M along a first optical path L. The end face (input / output end) of each optical fiber OF is maintained at a predetermined distance relative to the corresponding reflector M1. Figure 6AIn one embodiment, a transparent glass, quartz, or sapphire plate cover SP1 covers the exposed surface of the optical platform OB to protect the reflector M1. In one embodiment, the connector 10 may fill the space between the reflector surface M1 and the plate cover SP1 with an epoxy resin of matching refractive index.

[0045] In one embodiment, each mirror M1 is an exposed free surface of the substrate B1 (i.e., a surface exposed to air, or not within the body of the substrate of the optical platform), having an exposed free-reflecting side away from the substrate B1. This exposed free-reflecting side includes a structured reflective surface profile at which light is guided in and out via an optical fiber OF, directed to and from the base 12. Each mirror M1 bends, reflects, and / or shapes the incident light. Depending on the geometry and shape (e.g., curvature) of the structured reflective surface profile, the mirror M1 can collimate, expand, or focus the incident beam. For example, the structured reflective surface profile may include one of the following geometries / profiles: (a) an ellipsoid, (b) an off-axis parabola, or (c) other free-form optical surfaces. For example, to provide optical power, the mirror surface can have, individually or in combination, any of the following surface geometry curvature functions: ellipsoidal or hyperbolic conical foci, annular aspherical surfaces with a variety of even or odd aspherical terms, XY aspherical curves with a variety of even or odd aspherical terms, Zernike polynomials of various orders, and simpler surfaces of various families covered by these functions. The surface can also be a freeform surface asymmetric along any plane or vector. The mirror M can be defined on the substrate B by stamping a malleable metal material. Various malleable metals that can be stamped using tool steel or tungsten carbide tools can constitute the body of the mirror, including any 300 or 400 series stainless steel, any Kova alloy composition, any precipitation or solution hardened metal, and any alloy of silver, aluminum, gold, and copper. Aluminum is highly reflective (>98%) at long wavelengths above 1310 nm and can be economically formed by stamping. The reflective surface of the metal portion constituting the mirror can be any of the metals mentioned above, or any highly reflective metal coating applied by sputtering, evaporation, or electroplating processes.

[0046] U.S. Patent No. 7,343,770, jointly assigned to the assignee of this invention, discloses a novel precision stamping system for manufacturing parts with small tolerances. This inventive stamping system can be implemented to manufacture the structures of connector 10 and base 12 disclosed herein (including the structure of the optical platform OB discussed above, and the structures discussed below). These stamping processes involve stamping a large, malleable mass of metal material (e.g., a metal billet or raw material) to form a final surface configuration with tight (i.e., very small) tolerances, including a reflective surface having a desired geometry precisely aligned with other defined surface configurations. U.S. Patent Application Publication No. US2016 / 0016218A1, also jointly assigned to the assignee of this invention, discloses a composite structure comprising a substrate having a main portion and auxiliary portions made of different metallic materials. The substrate and the auxiliary portions are formed by stamping. When the auxiliary portion is stamped, it interlocks with the substrate while simultaneously forming desired structured configurations on the auxiliary portion, such as structured reflective surfaces, fiber optic alignment configurations, etc. This method allows for the relatively less critical structured features to be formed on the main body of the substrate with minimal effort, while maintaining relatively large tolerances. Simultaneously, it enables the more precise formation of relatively critical structured features on auxiliary sections, incorporating more factors to define dimensions, geometries, and / or finishes with relatively smaller tolerances. The auxiliary sections may include another composite structure of two different metallic materials with varying properties, used to stamp different structured features. This stamping method improves upon an earlier stamping process in U.S. Patent No. 7,343,770, in which the bulk material being stamped is a homogeneous material (e.g., metal strip, such as Kova alloy, aluminum, etc.). This stamping process produces structured features from a single homogeneous material. Therefore, different features share material properties that may not be optimized for one or more features. For example, a material with properties suitable for stamping alignment features may not have properties suitable for stamping reflective surface features with optimal light reflection efficiency to reduce light signal loss.

[0047] The overall functional structure of the optical platform OB is generally similar to the structure of some optical platform embodiments disclosed in the assignee's earlier patent documents (i.e., fiber alignment trenches aligned with structured reflective surfaces, and additional structures facilitating proper optical alignment). The connector 10, comprising a first array of mirrors M1, trenches G, and alignment structures F1 in the optical platform OB, can be manufactured using previously disclosed composite structures and stamping techniques, and also includes a base 12 comprising a second array of mirrors M2 and alignment structures F2, as described below. The respective alignment structures F1 and F2 are formed on corresponding flat surfaces S1 and S2, which facilitates the alignment and / or precise positioning of the connector 10 relative to the base 12, and thus relative to the PIC chip 100 / chip 102 or I / O chip 101, as explained below.

[0048] The reflector M1 surface and fiber alignment structure in an optical connector can be integrally / simultaneously formed by precision stamping of raw materials (e.g., metal blanks or strips). This allows for the economical production of connector components in large or small quantities, while improving tolerances, manufacturability, ease of use, functionality, and reliability. By simultaneously forming the structural reflective surface, passive alignment structure (discussed below), and fiber alignment structure in a single final stamping operation, the dimensional relationships of all required alignment structures on the same workpiece / part can be maintained during the final stamping step. It is conceivable that multiple stamping operations can be performed to progressively pre-form certain structures on the optical platform, rather than using a single stamping operation to form all structures on the optical platform. The final stamping simultaneously defines on the optical platform the final dimensions, geometry, and / or finish of various structured structures required to ensure (or play a crucial role in ensuring) the correct alignment of individual components / structures along the designed optical path. These structured structures include reflectors, fiber alignment structures / grooves, passive alignment structures (discussed below), etc.

[0049] Essentially, for the optical connector 10, the substrate B1 defines an optical platform OB for aligning the fiber OF relative to the reflector M1. By including the fiber trench G on the same structure that also defines the reflector M, the alignment of the fiber OF end with the reflector M1 can be achieved more precisely with relatively small tolerances by defining the final structure on a single part in a single final stamping operation, compared to attempting to achieve similar alignment based on constructions defined on separate parts or structures or based on separate forming steps. By forming the reflector M1 and the fiber alignment trench G simultaneously in the same final stamping operation, the dimensional relationships of all constructions / components that need to be aligned (or play a role in providing alignment) on the same workpiece / part can be maintained during the final stamping step. Furthermore, for the same reason, a first array of alignment constructions F1 can also be formed simultaneously with the reflector M1 and the trench G in the same final stamping operation to maintain the dimensional relationships of all constructions (i.e., the trench G, the reflector M1, and the alignment construction F1), thereby achieving the desired alignment with very small tolerances.

[0050] exist Figures 1A to 1C In the illustrated embodiment, the first array of the alignment configuration F1 of the connector 10 includes a first network of orthogonal intersecting longitudinal opening trenches LG1 and LG2, both of which are V-shaped trenches with flat walls. In one embodiment, the first network of orthogonal intersecting longitudinal trenches LG1 and LG2 of the first alignment configuration F1 defines an array of discrete protrusions P, which are separated and isolated from each other by orthogonal intersecting longitudinal trenches LG1 and LG2 on a first surface S1 of the first substrate B1. The discrete protrusions P are generally pyramidal in shape, having four flat, sloping surfaces GS and a truncated top T (e.g., a flat or slightly convex curved top). The top T of the protrusion P generally conforms to the shape of the first surface S1. Each discrete protrusion P (except for those at corners and / or edges, which will be explained further below) is a raised structure that is symmetrical with respect to a first plane orthogonal to the first surface S1 of the first base B1, and also symmetrical with respect to a second plane orthogonal to both the first plane and the first surface S1 (i.e., each raised structure is symmetrical along two orthogonal planes surrounding a central axis A orthogonal to the first surface S1 of the first base B1). Figure 1C The enlarged image better depicts the characteristics of protrusion P.

[0051] U.S. Patent Publication No. 2020 / 0124798A1 (commonly assigned to the assignee of this application and incorporated herein by reference in its entirety) discloses a detachable edge coupler with a micromirror optical platform for a PIC, which provides a mechanism for bringing the mode dimensions of optical fibers in an optical fiber array and on-chip optical elements close to each other to achieve efficient optical coupling input / output between the optical fiber and the PIC device. The base 12 in this invention has a structure similar to that of the edge coupler, and, except that the passive alignment configuration on the base 12 differs from the passive alignment configuration disclosed herein, it can actually be constructed similarly to the edge coupler previously disclosed herein.

[0052] Please refer to Figure 1A and 1B The base 12 includes a body having a substrate B2 (e.g., made of silicon, glass, or a malleable metal (e.g., Kova alloy, Invar alloy, aluminum, stainless steel)), on which a second mirror array M2 is defined. Figure 6A In one embodiment, a transparent glass, quartz, or sapphire plate cover SP2 covers the exposed surface on the substrate B2. In one embodiment, the base 12 may be filled with an epoxy resin of matching refractive index between the mirror surface M2 and the plate cover SP2. The structure of the mirror M2 on the substrate B2 of the base 12 is very similar to the corresponding structure of the mirror M1 on the substrate B1 of the connector 10. The optical geometry of each mirror M1 and M2 is selected to achieve the desired optical path. In the illustrated embodiment, the base 12 does not include any optical fiber compared to the connector 10. However, the substrate B2 may also define a trench for receiving short optical fiber segments (not shown) as a waveguide for transmitting optical signals to and from the mirror B2, as in the case of the edge coupler disclosed in U.S. Patent Publication No. 2020 / 0124798A1.

[0053] The base B2 of the base 12 has a second flat surface S2 that defines a second two-dimensional planar array of alignment structures F2 integrally defined on the second surface S2 of the second base B2. The second array of alignment structures F2 of the base 12 includes a second longitudinal cylindrical protrusion network (each longitudinal cylindrical protrusion may be a continuous cylindrical protrusion, or a series of discontinuous independent cylindrical protrusions or a row of independent cylindrical protrusions arranged along a common axial direction of the independent cylindrical protrusions), each cylindrical protrusion having a longitudinal axis parallel to a corresponding surface of the second surface S2 of the second base B2. In this illustrated embodiment, the second cylindrical protrusion network includes a network of intersecting longitudinal cylindrical protrusions LP1 and longitudinal cylindrical protrusions LP2 (forming as shown in the image). Figure 1A and 1BThe cross-grid protrusion structure shown has each cylindrical protrusion with a substantially semi-circular cross-sectional profile. Other protrusions with curved cross-sections (e.g., elliptical, parabolic, or Gothic pointed arch profiles) may also be used.

[0054] Figures 2A to 2D An embodiment of the present invention is shown, illustrating the elastic average coupling interface between the optical connector and the base. Figure 2A This is a view of the coupling of connector 10 on base 12 when viewed from one end along the longitudinal axis of the fiber OF. Figure 2A It is an enlarged view of the contact surface between the first array of the alignment structure and the second array of the alignment structure. Figure 2C and 2D (Enlarged cross-sectional view) shows along Figure 2A and 2C The cross-sectional view is taken from line 2C-2C. The second network of orthogonal cylindrical protrusions LP1 and LP2 is received in the first network of complementary matching orthogonal open grooves LG1 and LG2. The protruding surfaces of the cylindrical protrusions LP1 and LP2 are in contact with the groove surfaces GS of the longitudinal grooves LG1 and LG2.

[0055] from Figure 2B It can be seen that the longitudinal grooves LG1 are V-shaped grooves with flat groove wall surfaces in their longitudinal direction, and each discrete protrusion P includes a substantially flat inclined surface corresponding to the surface of the V-shaped groove. When the optical connector 10 is coupled to the base 12, the flat surface of the V-shaped groove LG1 and the convex surface of the cylindrical protrusion LP1 define the line contact LC between adjacent cylindrical protrusions LP2 (e.g., ...). Figure 2C and 2D (As shown). Therefore, when the optical connector 10 is coupled to the base 12, the protruding surfaces of the network of intersecting longitudinal cylindrical protrusions LP1 and LP2 (which are flat surfaces in their respective longitudinal directions) make line contact with the flat surfaces of the network of intersecting longitudinal grooves LG1 and LG2 to define an array of line contacts LC. These multiple line contacts correspond to resilient average coupling, allowing the optical connector 10 to be removably attached to the base to define a detachable coupling, wherein the first array of alignment configurations F1 abuts against the second array of alignment configurations F2 to define resilient average coupling, thereby aligning the optical connector to the base. It should be noted that, to achieve the line contact LC, the cylindrical protrusions LP1 and LP2 can each be a series of discontinuous discrete / isolated cylindrical protrusions arranged along an axial direction parallel to the base B2 of the base 12, provided that a cylindrical protruding surface exists in the region of the interface with the flat surface GS of each discrete protrusion P. In other words, the cylindrical protrusions LP1 and LP2 do not need to physically intersect to form an array as shown. Figure 1A and 1B The cross-grid structure shown.

[0056] Figure 3A and 3B A passive alignment configuration of an optical connector and base according to another embodiment of the present invention is shown. In this embodiment, the base 12 is still similar to the embodiment shown in FIG. 1. The connector 10 is generally similar to the aforementioned embodiment, except that the structure of the intersecting longitudinal grooves LG1' and LG2' and the discrete protrusions P' is modified. Each protrusion P' is generally pyramidal in shape, having a convex surface GS' corresponding to the groove surface GS' and a flat or convex top T. Unlike the previous embodiment of FIG. 1, the intersecting longitudinal grooves LG1' and LG2' are no longer V-shaped grooves with flat walls. In this embodiment, the longitudinal grooves LG1' and LG2' are generally V-shaped grooves, each having sidewalls with convex surfaces corresponding to the protrusions P'. In particular, the protrusions P' have an inclined surface GS', which is convex at least in the direction along the longitudinal groove. It should be noted that the inclined surface GS' may also be curved in the height direction or the inclined direction, or a combination of these directions.

[0057] Figures 4A to 4D It shows Figure 3A and 3B The embodiment shows the elastic average coupling interface between the optical connector 10 and the base 12. The view in FIG4 corresponds to the view in FIG2 above, to provide a comparison with the previous embodiment.

[0058] exist Figure 4B As can be seen, each longitudinal trench LG1' is a generally V-shaped trench, and each discrete protrusion P' includes a raised inclined surface GS' corresponding to the trench surface GS'. When the optical connector 10 is coupled to the base 12, the raised surface GS' of the trench LG1' and the raised curved surface of the cylindrical protrusion LP1 define the point contact PC between adjacent cylindrical protrusions LP2 (e.g., ...). Figure 4C and 4D(As shown). Therefore, the protruding surfaces of the network of intersecting longitudinal cylindrical protrusions LP1 and LP2 are flat surfaces in their respective longitudinal directions, thus making point contact with the protruding surfaces GS' of the network of intersecting longitudinal grooves LG1' and LG2' when the optical connector 10 is coupled to the base 12, defining an array of point contact PCs. The plurality of point contact PCs correspond to an improved elastic average coupling, allowing the optical connector 10 to be removably attached to the base to define a detachable coupling, wherein the first array of alignment configurations F1 abuts against the second array of alignment configurations F2 to define an elastic average coupling, thereby aligning the optical connector with the base. It should be noted that, since they are point contact PCs, each of the cylindrical protrusions LP1 and LP2 can be a series of discontinuous discrete / isolated cylindrical protrusions along an axial direction parallel to the base B2 of the base, as long as the cylindrical protruding surfaces exist in the interface region with the protruding surface GS' of each discrete protrusion P'. In other words, the cylindrical protrusions LP1 and LP2 do not need to physically intersect to form as shown. Figure 1A The cross-grid structure shown.

[0059] The discrete protrusion array (P, P') is a rectangular array of (M+1)×(N+1) discrete protrusions, corresponding to the first intersecting trench network comprising M×N orthogonally intersecting longitudinal trenches (LG1, LG2; LG1' and LG2'). The second cylindrical protrusion network comprises M×N orthogonally intersecting longitudinal cylindrical protrusions LP1 and LP2 to match the first M×N intersecting longitudinal trench network. In the two embodiments shown in Figures 2 and 4, M=10 and N=4 are merely for illustrative purposes. For the coupling interface with a planar area of ​​approximately 3 mm × 4 mm between the first surface S1 of the optical connector 10 and the second surface S2 of the base 12, in order to achieve a coupling accuracy of less than 1 micrometer between the optical connector and the base, M is preferably in the range of 3 to 10, and N is in the range of 3 to 10.

[0060] Please refer to Figure 2B In one embodiment, when the optical connector 10 is coupled to the base 12, a discrete protrusion P defined by a network of intersecting longitudinal grooves LG1 and LG2 on the connector 10 contacts a second surface S2 within the space between adjacent cylindrical protrusions LP1 on the base 12. Similarly, in Figure 4B In one embodiment, when the optical connector 10 is coupled to the base 12, the discrete protrusion P' defined by the intersecting longitudinal grooves LG1' and LG2' on the connector 10 contacts the second surface S2 in the space between the adjacent cylindrical protrusions LP1 of the base 12.

[0061] In one embodiment, please refer to Figure 1CTo ensure that the optical connector 10 is positioned in a predetermined unique location on the base 12, the array of discrete protrusions P further includes multiple key protrusions GP having a raised structure arranged along the periphery / edge of the first surface S1. The surface profile of these key protrusions GP at the surface opposite to the periphery / edge (i.e., the surface that does not contact the cylindrical protrusions when the optical connector is coupled to the base) differs from the surface profile of the symmetrical discrete protrusions P located within the periphery / edge (i.e., the discrete protrusions P that contact the second surface S2 of the base 12). Figure 1C As shown, the protrusions GP along the periphery of the first surface S1 each have a straight wall surface W facing away from the periphery. Considering the wall surface W, the shape of the protrusions GP cannot fit into the internal space defined by the cylindrical protrusions LP1 and LP2 on the four sides of the opposing surface S2. However, since the straight wall surface W is not constrained by the cylindrical protrusions at the edges, the protrusions GP will only fit into the space along the edges of the opposing surface S2.

[0062] Figure 5 An embodiment of a key protrusion that can be implemented for the convex protruding surface GS' in the embodiment of FIG3 is shown. For example, for the illustrated 10×5 discrete protrusion P' array (i.e., M=9 and N=4), the discrete protrusions GP' located at the corners (1,1), (10,1), (1,5), and (10,5) can each include a surface profile different from the surface profile of the discrete protrusions P' at the interior locations in the array that are far from the periphery (e.g., at (2,2) to (9,2)). Due to the shape of the corner protrusions GP', they cannot fit within the interior space defined by the cylindrical protrusions LP1 and LP2 on the four sides of the opposing surface S2. The corner protrusions GP' can only fit into the space at the corners of the opposing surface S2 because they are not entirely limited by the cylindrical protrusions LP1 and LP2 at the corners.

[0063] Therefore, guide keys, such as GP and GP', can be provided at the coupling interface to guide the first array of alignment configuration F1 and the second array of alignment configuration F2, thereby uniquely positioning the relative positions of the complementary alignment configurations to couple the optical connector 10 to the base 12 at a predetermined expected relative position.

[0064] It should be understood that, optionally, the longitudinal groove and longitudinal cylindrical protrusion alignment configuration disclosed in the above embodiments can be interchangeably provided between the interface of the optical connector 10 and the base 12 without departing from the scope and spirit of the invention.

[0065] In one embodiment, a first substrate B1 comprises a first malleable metal material, and a first array of alignment structures F1 of the optical connector 10 is integrally defined on the first substrate by stamping the malleable metal material. A second substrate B2 comprises a second malleable material, and a second array of alignment structures F2 of the base is integrally defined on the substrate by stamping the second malleable metal material. In one embodiment, the first mirror array M1 and the first array of alignment structures F1 are simultaneously defined on the first substrate by stamping a first metal blank, and the second mirror array M2 and the second array of alignment structures F2 are simultaneously defined on the second substrate by stamping a second metal blank. By using high-precision stamping to integrally / simultaneously form passive alignment structures and / or miniature optical platforms (MOBs) on the base and the optical connector, these components can be produced economically in large or small quantities, while improving tolerances, manufacturability, ease of use, functionality, and reliability. The base and / or the optical platform components should be made of a stampable material, such as a malleable metal, such as Kova alloy, Invar alloy, stainless steel, or aluminum. Preferably, both the optical platform and the base should have similar coefficients of thermal expansion (CTE) to avoid misalignment during temperature cycling and to prevent stress / strain.

[0066] Figure 6A and 6B The diagram illustrates the positioning of a base 12, serving as an edge coupler for a PIC chip 100, according to an embodiment of the present invention. As shown, the base 12 abuts against or is arranged such that a gap (e.g., between the edge of the base B2 of the base and the facing edge of the PIC chip 100) is present. Figure 7C As shown, the cover SP2 extends over the PIC chip 100. In this embodiment, the base 12 is supported on the support S and is optically aligned with respect to the PIC chip 100. The optical elements of the PIC chip 100 transmit light to the edge of the PIC chip 100. The base 12 acts as an edge coupler. As described above, the mirror array M2 of the base 12 is optically aligned with the optical elements of the PIC chip 100, and light is transmitted along the optical path L3 between the mirror M2 in the mirror array and the corresponding optical element in the PIC chip 100.

[0067] exist Figure 6AIn the illustrated embodiment, the optical alignment of the reflector M2 in the base 12 with the optical elements in the PIC chip 100 is achieved through passive alignment of the reflector M2 with the edge of the PIC chip. This passive alignment is based on a reference V on an extension of the cover SP2 located outside the edge of the base B2 of the base 12 and a reference (not shown) on the top surface near the edge of the PIC chip 100. The gap can be filled with a material having an optical refractive index similar to the core layer of the optical fiber and waveguide on the PIC chip 100. By optically aligning the reference V on the cover SP2 with the reference (not shown) on the top surface of the PIC chip 100, the base 12 is passively aligned with the PIC chip 100. In another embodiment, the base 12 may be a component of the PIC chip 100 or a support S of the PIC chip 100.

[0068] Figures 7A to 7C The diagram illustrates the connection between an optical connector 10 and a base 12 according to an embodiment of the present invention. A PIC chip 100 is supported on a support member S (which may be a sub-mount bracket or insert), the support member S being able to support... Figure 7B On a printed circuit board (PCB) in the optical connector 10, the first base B1 has a first reference surface R1 on at least one side, while the second base B2 of the base 12 has a second reference surface R2 on at least one second side. The first reference surface R1 and the second reference surface R2 are typically aligned by a flexible clip C that biases the first base B1 onto the second base B2 and abuts the first array of alignment configuration F1 against the second array of alignment configuration F2. Figure 7B In this context, the fiber array FA can be a fiber optic patch cable to provide a flexible optical connection for optical signal communication with the PIC chip 100.

[0069] Figure 7C It is along Figure 7AThe image shows a cross-sectional view taken along lines 7A-7A. Each mirror M1 includes a structured reflective surface profile that deflects light between a first optical path L1 in a first direction along a first plane substantially parallel to the first surface S1 of the first substrate B1 of the connector 10 and a second optical path L2 in a second direction outside the first plane (e.g., deflected by 90 degrees). Each fiber trench G in an array of fiber trenches G defined on the first substrate B1 supports an end segment of an optical fiber OF that is optically aligned with the corresponding mirror M1 along the first optical path L1. Each mirror in the second mirror array M2 defined on the second substrate B2 of the base includes a structured reflective surface profile that deflects light between a third optical path L3 in a third direction along a second plane substantially parallel to the second surface S2 of the second substrate B2 and a fourth optical path L4 in a fourth direction outside the second plane. In the configuration shown, optical paths L3 and L4 coincide when coupling connector 10 and base 12, thereby forming an optical path between PIC chip 100 and optical fiber OF in fiber array FA.

[0070] The structured reflective surface profiles of mirrors M1 and / or M2 can be configured to shape the beam from the PIC chip 100 to produce a mode field that better matches the mode field of the optical fiber in connector 10. Furthermore, mirror M2 in base 12 can be configured with a reflective surface profile to extend or collimate the beam from the optical elements in the PIC chip 100 and output it to mirror M1 in connector 10. Mirror M1 in connector 10 can be configured with a reflective surface profile to focus the beam from mirror M2 in base 12 onto the core layer of the tip / end face of the optical fiber OF within the trench G held on the substrate B1 of the optical platform in connector 10. This extended beam optical coupling configuration reduces the optical alignment tolerance requirements between mirror M2 and the optical fiber OF held in connector 10.

[0071] Figures 8A to 8D The diagram illustrates the process of positioning the fixed base 12 for subsequent detachable connection according to one embodiment of the invention. In this embodiment, an additional I / O chip 101 is provided to interface with an ASIC (e.g., CPU, GPU, switching ASIC) chip 102. The optical path is similar to... Figure 7C The optical path shown is in which I / O chip 101 replaces PIC chip 100. Figure 8AIn this configuration, the optical connector 10 is first coupled to the base 12. The optical connector 10 is actively aligned with the chip 101 by positioning the base 12 relative to the chip 101 to obtain optimal optical signal between the chip 101 / chip 102 and the optical fiber OF supported by the optical connector 10. The position of the base 12 relative to the chip 101 is fixed in an optical alignment position (e.g., by using solder to fix the position of the base 12 to a support S of the chip 101), the support S being, for example, an insert, a printed circuit board, a sub-mount bracket, etc. Figure 8B Next, the optical connector 10 is removed from the base 12. Figure 8C In this configuration, the base 12 can be permanently attached to the support S (e.g., via reflow solder) without changing its position on the support S. Subsequently, in Figure 8D In this system, the optical connector 10 can be repeatedly connected, disconnected, and reconnected to the base 12 without damage, without losing the original optical alignment obtained through the active alignment between the optical connector 10 and the chip 101 / chip 102. For each connection, disconnection, and reconnection, the optical alignment is maintained consistent with the initial active alignment, so as to accurately and correctly align the optical connector 10 with the base 12.

[0072] According to the present invention, the optical connector and the base define a free-space coupling, and light shaping is achieved without any refractive optical elements disposed between the optical connector and the base. Furthermore, the detachable, elastic, uniform coupling between the optical connector and the base is not defined using any complementary alignment pins and alignment holes.

[0073] While the present invention has been specifically shown and described with reference to preferred exemplary embodiments, those skilled in the art will understand that various changes in form and detail can be made without departing from the spirit, scope, and teachings of the invention. Therefore, the disclosed invention should be considered merely exemplary, and its scope is defined only by the appended claims.

Claims

1. A passive alignment coupling device, comprising: A first body defining a first substrate having a first flat surface, the first flat surface defining a first two-dimensional planar array of alignment configurations integrally defined on the first surface of the first substrate. A second body provides an alignment reference with the first body, wherein the second body defines a second substrate having a second flat surface, the second flat surface defining a second two-dimensional planar array of alignment configurations integrally defined on a second surface of the second substrate. One of the first array and the second array of the alignment structures includes a first network of orthogonally intersecting longitudinal grooves, and the other of the first array and the second array of the alignment structures includes a second network of longitudinal cylindrical protrusions, each longitudinal cylindrical protrusion having a longitudinal axis parallel to a corresponding surface of a first surface of the first substrate or a second surface of the second substrate. The second network of cylindrical protrusions is received within the first network of the trench, the protruding surfaces of the cylindrical protrusions contacting the trench surface, and The first body is removably attached to the second body to define a detachable coupling, wherein the first array of the alignment configuration abuts against the second array of the alignment configuration to define a resilient average coupling, thereby aligning the first body with the second body.

2. The passive alignment coupling device of claim 1, wherein a first network of orthogonal intersecting longitudinal trenches defines an array of discrete protrusions separated and isolated from each other by orthogonal intersecting longitudinal trenches on a corresponding surface of a first surface of a first substrate and a second surface of a second substrate, each protrusion being a generally pyramidal shape having a truncated top.

3. The passive alignment coupling device of claim 2, wherein the discrete protrusion array comprises protrusion structures, each protrusion structure being symmetrical with respect to a first vertical reference plane orthogonal to a corresponding surface of a first surface of a first substrate and a second surface of a second substrate, and also symmetrical with respect to a second vertical reference plane orthogonal to the first vertical reference plane and orthogonal to a corresponding surface of the first surface and the second surface.

4. The passive alignment coupling device of claim 3, wherein the discrete protrusion array further comprises a plurality of key-guide protrusions having protrusion structures arranged along the periphery / edge of a corresponding surface of the first surface and the second surface, the key-guide protrusions having a surface profile at a surface away from the periphery / edge that differs from the surface profile of symmetrical discrete protrusions located within the periphery / edge, thereby initially guiding the relative position of the first array and the second array of alignment configurations to uniquely locate the relative position of the first body of the first array of alignment configurations and the second body of the second array of alignment configurations to couple the first body to the second body at a predetermined expected relative position.

5. The passive alignment coupling device according to any one of claims 2-4, wherein the discrete protrusion array is a rectangular array of (M+1)×(N+1) discrete protrusions, wherein the first network of orthogonal intersecting longitudinal grooves comprises M×N orthogonal intersecting longitudinal grooves, and wherein for a coupling interface having a planar area of ​​approximately 3 mm×3 mm between the first body and the second body, M is preferably in the range of 3 to 10, and N is in the range of 3 to 10, so as to achieve a coupling accuracy of less than 1 micrometer between the first body and the second body.

6. The passive alignment coupling device as described in any one of claims 2-5, wherein, When the first body is coupled to the second body, the protruding surface of the longitudinal cylindrical protrusion is in line contact with the groove surface to define a line contact array, and wherein the longitudinal groove is a V-shaped groove, and wherein each discrete protrusion includes a substantially flat surface corresponding to the groove surface, thereby defining a line contact with the protruding surface when the first body is coupled to the second body.

7. The passive alignment coupling device as described in any one of claims 2-5, wherein, When the first body is coupled to the second body, the protruding surface of the longitudinal cylindrical protrusion makes point contact with the groove surface to define a point contact array, and each discrete protrusion includes a convex surface corresponding to the groove surface, thereby defining a point contact with the protruding surface when the first body is coupled to the second body.

8. The passive alignment coupling device as described in any one of claims 2-7, wherein, When the first body is coupled to the second body, the discrete protrusion defined by the longitudinal groove contacts a corresponding surface of the first and second surfaces.

9. The passive alignment coupling device as claimed in any of the preceding claims, wherein the second network of cylindrical protrusions comprises an orthogonally intersecting longitudinal cylindrical protrusion network.

10. The passive alignment coupling device of claim 9, wherein the second network of cylindrical protrusions comprises M×N orthogonally intersecting longitudinal cylindrical protrusions that match the first network of orthogonally intersecting longitudinal grooves.

11. The passive alignment coupling device as claimed in any of the preceding claims, wherein each cylindrical protrusion in the second network of cylindrical protrusions has a substantially semi-circular cross-section.

12. The passive alignment coupling device as claimed in any of the preceding claims, wherein the first substrate comprises a first malleable metal material, and a first array of the alignment configuration of the first body is integrally defined on the first substrate by stamping the first malleable metal material, the second substrate comprises a second malleable metal material, and a second array of the alignment configuration is integrally defined on the substrate by stamping the second malleable metal material.

13. The passive alignment coupling device as claimed in any of the preceding claims, wherein the first body comprises a first micromirror optical platform, the first micromirror optical platform comprising: First base; A first array of mirrors defined on a first substrate, wherein each mirror includes a structured reflective surface profile that causes light to deflect between a first optical path in a first direction along a first horizontal reference plane substantially parallel to the first surface of the first substrate and a second optical path in a second direction outside the first horizontal reference plane. as well as An array of fiber trenches is defined on a first substrate, each fiber trench receiving a segment of fiber, the longitudinal axis of the fiber being along a first optical path, and one end of the fiber being optically aligned with a corresponding reflector along the first optical path.

14. The passive alignment coupling device as claimed in any of the preceding claims, wherein the second body comprises a second micromirror optical platform, the second micromirror optical platform comprising: Second basement; as well as A second array of mirrors defined on a second substrate, wherein each mirror in the second array of mirrors includes a structured reflective surface profile that causes light to deflect between a third optical path in a third direction along a second horizontal reference plane substantially parallel to the second surface of the second substrate and a fourth optical path in a fourth direction outside the second horizontal reference plane.

15. The passive alignment coupling device according to any one of claims 1-12, wherein the first body includes a first mirror array defined on a first substrate, and the second body includes a second mirror array defined on a second substrate, wherein the first mirror array is simultaneously defined by a first array of alignment configurations on the first substrate, and the second mirror array is simultaneously defined by a second array of alignment configurations on the second substrate.

16. The passive alignment coupling device according to any one of claims 1-12, wherein at least one of the first body and the second body includes at least one optical waveguide.

17. The passive alignment coupling device as claimed in any of the preceding claims, wherein the first body and the second body define free space coupling without any refractive optical element disposed between the first body and the second body.

18. The passive alignment coupling device as claimed in any of the preceding claims, wherein the detachable coupling between the first body and the second body is not defined by any complementary alignment pins and alignment holes.

19. The passive alignment coupling device as claimed in any of the preceding claims, further comprising a flexible clamp that biases the first substrate onto the second substrate and abuts the first array of the alignment configuration against the second array of the alignment configuration.

20. The passive alignment coupling device as claimed in any of the preceding claims, wherein the second body is coupled to a photonic integrated circuit (PIC), and the first substrate of the first body supports an optical fiber array.

21. The passive alignment coupling device according to any one of claims 1-20, wherein the first body is included in an optical connector for transmitting optical signals.

22. The passive alignment coupling device as claimed in any of the preceding claims, wherein the second body is contained in a base providing an optical alignment reference.

23. A photonic device, comprising: Support components; Optoelectronic devices attached to the top surface of the support; as well as The passive alignment coupling device as described in any one of claims 1-20, The first main body is contained in the optical connector for transmitting optical signals. The second body is contained within a base that provides an optical alignment reference. The base is arranged relative to the optoelectronic device, and The base defines an alignment position for the optoelectronic device to transmit optical signals with the optical connector detachably coupled to the base.

24. The photonic device of claim 23, wherein the optoelectronic device includes a photonic integrated circuit (PIC) chip, the PIC chip including optical elements as an optical interface with the outside of the PIC chip, and wherein the base is optically aligned with the optical elements of the PIC chip.

25. The photonic device of claim 24, wherein the base includes an edge coupler optically aligned with the PIC chip supported on the support member, wherein the optical elements of the PIC chip transmit light to the edge of the PIC chip, wherein the edge coupler includes an array of mirrors optically aligned with the optical elements of the PIC chip, and light travels along an optical path between a mirror in the array of mirrors and a corresponding optical element in the PIC chip.

26. A method for providing a connection between an optical connector and an optoelectronic device, comprising: Provide support components; Attach the optoelectronic device to the top surface of the support; as well as A passive alignment coupling device is provided as described in any one of claims 1-20, wherein the first body is contained in an optical connector for transmitting optical signals, and wherein the second body is contained in a base for providing an optical alignment reference. The base is arranged relative to the optoelectronic device on the optoelectronic device and / or the support member, and The base defines an alignment position for the optoelectronic device to transmit optical signals with the optical connector detachably coupled to the base.

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