Endoscope imaging device and endoscope

CN115363510BActive Publication Date: 2026-10-27FUJIFILM CORP
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Patent Information

Application Number
CN202210340140.8
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2021-05-21
Filing Date
2022-04-01
Publication Date
2026-10-27
Estimated Expiration
2042-04-01

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[0022]根据本发明,能够提供一种即使增大成像透镜的直径也不会大型化,且成像透镜和成像元件的位置精度高的内窥镜摄像装置及内窥镜。

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Abstract

Provided is an endoscope camera device and an endoscope in which the diameter of an imaging lens is increased without increasing the size, and the positional accuracy of the imaging lens and an imaging element is high. The endoscope camera device includes a lens barrel in which an imaging lens is provided inside; an imaging element that receives light that has passed through the imaging lens and performs photoelectric conversion; and a holder that is coupled to the lens barrel and holds the imaging element. The holder includes a mounting cylinder portion that has a through-hole for mounting the lens barrel; a flange portion; and a pair of restriction members that are provided on the opposite side of the mounting cylinder portion. The imaging element is held by the pair of restriction members of the holder. The inner diameter of the through-hole of the mounting cylinder portion is larger than the width of the imaging element. When the pair of restriction members is viewed from the optical axis direction of the optical axis of the imaging lens toward the through-hole, the pair of restriction members are respectively recessed in regions corresponding to the periphery of the through-hole or are respectively left empty in regions corresponding to the periphery of the through-hole.
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Description

Technical Field

[0001] This invention relates to an endoscopic imaging device and endoscope for acquiring images of an object to be observed, and more particularly to an endoscopic imaging device and endoscope having a support that is connected to a lens barrel provided with an imaging lens and holds the imaging element. Background Technology

[0002] In recent years, diagnostic work has been widely carried out using endoscopic systems equipped with endoscopic light source devices, endoscopes (endoscopic observers), and processors.

[0003] The endoscope has an insertion section that is inserted into the patient's body. Illumination light from an endoscopic light source device is shone onto the object being observed through the insertion section. The endoscope captures an image of the illuminated object using an imaging element and generates an image signal. A processor processes the image signal generated by the endoscope to generate an image for display on a monitor. The imaging element is electrically connected to a signal cable via a circuit board made of a flexible wiring board or the like, and the signal cable is electrically connected to the processor. Regarding the endoscope, from the perspective of minimizing physical burden on the patient, it is preferable that the insertion section is relatively thin.

[0004] For example, Patent Document 1 describes an endoscope comprising: a retaining frame that holds an objective lens disposed at the end of the insertion portion of the endoscope directly or indirectly via an indirect component; an imaging element having a light-receiving portion on its surface that receives light from the objective lens; and a retaining component that holds the imaging element, the retaining component having a back side of the imaging element that is different from the surface and is electrically connected to a connection terminal of the imaging element, having a fitting portion that fits into a hole disposed on the retaining frame, the fitting portion being configured to position and fix the imaging element relative to the objective lens by fitting into the hole, and having a conductive pattern.

[0005] Patent Document 1: Japanese Patent Application Publication No. 2015-062555 Summary of the Invention

[0006] In the endoscope described in Patent Document 1, if the diameter of the objective lens, which serves as the imaging lens, is increased, the holding frame needs to be enlarged, resulting in a larger endoscope.

[0007] As mentioned above, regarding endoscopes, from the perspective of minimizing the physical burden on the patient, it is preferable to have a thinner insertion portion that is inserted into the patient's body, but the diameter of the imaging lens is preferably larger. Even in this case, it is desirable to avoid making the endoscope too large. Moreover, the image quality of an endoscope is affected by the positional accuracy of the imaging lens and imaging element. If the positional accuracy is poor, the optical image cannot be imaged accurately on the image receiving surface of the imaging element, resulting in image defects and defocusing, thus degrading the image quality. Therefore, it is necessary to assemble various components such as the imaging lens and imaging element with high positional accuracy.

[0008] The purpose of this invention is to provide an endoscope imaging device and endoscope that do not become too large even when the diameter of the imaging lens is increased, and that have high positional accuracy of the imaging lens and imaging element.

[0009] To achieve the above objectives, one aspect of the present invention provides an endoscopic imaging device for acquiring images of an object under observation. The endoscopic imaging device comprises: a lens barrel with an imaging lens disposed inside; an imaging element that receives light passing through the imaging lens and performs photoelectric conversion; and a support connected to the lens barrel and holding the imaging element. The support comprises: a mounting cylinder having a through hole for mounting the lens barrel; a flange; and a pair of limiting members located on the opposite side of the mounting cylinder in the flange. The pair of limiting members are disposed opposite each other. The imaging element is held by the pair of limiting members of the support. The inner diameter of the through hole in the mounting cylinder is larger than the width of the imaging element. When the pair of limiting members are observed from the optical axis direction of the imaging lens toward the through hole, the pair of limiting members are either recessed in the area corresponding to the periphery of the through hole, or open in the area corresponding to the periphery of the through hole.

[0010] Preferably, the opposing direction of the pair of limiting components is orthogonal to the optical axis of the imaging lens.

[0011] Preferably, a mask is disposed on the imaging lens side of the imaging element. The mask restricts a portion of the light passing through the imaging lens, and the components connected to both sides of the optical axis of the mask pass through light of the wavelength that is cured by the photocurable adhesive.

[0012] Preferably, the circuit board has an imaging element electrically connected to it, and the width of the circuit board is narrower than the width of the imaging element.

[0013] Preferably, the ends of the pair of limiting components in the optical axis direction are positioned closer to the support side than the circuit board.

[0014] Preferably, it includes: a signal cable electrically connected to the imaging element, and an anchor that holds the signal cable relative to the support. The anchor has a pair of arms that are opposite each other and the arms of the anchor are fixed to the outer surface of the limiting member of the support.

[0015] The preferred anchor arm has a groove or through hole in the area where it is fixed to the limiting component of the bracket.

[0016] The preferred imaging element is positioned using the flange of the support, at least one of a pair of limiting members, and the end face of the limiting members in the vertical direction, wherein the vertical direction is the opposing direction of the pair of limiting members and the direction orthogonal to the optical axis.

[0017] The preferred bracket and anchor use the flange of the bracket, a pair of limiting members, and the upper end face of the limiting members in the vertical direction to position the arm of the anchor. The vertical direction is the opposite direction of the pair of limiting members and the direction orthogonal to the optical axis.

[0018] The preferred circuit board has a bent portion that protrudes from the lower end face of the anchor in the opposing direction of a pair of limiting members and in the up-down direction orthogonal to the optical axis.

[0019] In the bracket, plating is preferably applied to the area where the arm is fixed.

[0020] Furthermore, one aspect of the present invention provides an endoscope having the endoscopic imaging device of the present invention.

[0021] Invention Effects

[0022] According to the present invention, an endoscope imaging device and endoscope can be provided that do not become too large even if the diameter of the imaging lens is increased, and that the positional accuracy of the imaging lens and imaging element is high. Attached Figure Description

[0023] Figure 1 This is a schematic diagram illustrating an example of an endoscope system according to an embodiment of the present invention.

[0024] Figure 2 This is a schematic perspective view illustrating an example of an endoscopic imaging device according to an embodiment of the present invention.

[0025] Figure 3 This is a schematic partial cross-sectional perspective view illustrating an example of an endoscopic imaging device according to an embodiment of the present invention.

[0026] Figure 4 This is a schematic top view illustrating an example of an endoscopic imaging device according to an embodiment of the present invention.

[0027] Figure 5 This is a schematic side view illustrating an endoscopic imaging device according to an embodiment of the present invention.

[0028] Figure 6 This is a schematic perspective view of an example of a bracket for an endoscopic imaging device according to an embodiment of the present invention.

[0029] Figure 7 This is a schematic diagram of an example of a bracket for an endoscopic imaging device according to an embodiment of the present invention.

[0030] Figure 8 This is a schematic diagram of another example of the bracket of an endoscopic camera device according to an embodiment of the present invention. Detailed Implementation

[0031] Hereinafter, the endoscopic imaging device and endoscope of the present invention will be described in detail with reference to the preferred embodiments shown in the accompanying drawings.

[0032] Furthermore, the figures described below are illustrative for illustrating the present invention, and the present invention is not limited to the figures shown below.

[0033] The terms "parallel," "perpendicular," and "orthogonal" used in the following descriptions include the error ranges that are generally permissible in this technical field.

[0034] [Endoscopic System]

[0035] The endoscope system illuminates the observation site (not shown) inside the body of the subject and takes a picture of the observation site. It generates and displays a display image of the observation site based on the image signal obtained by the picture.

[0036] Figure 1 This is a schematic diagram illustrating an example of an endoscope system according to an embodiment of the present invention.

[0037] Endoscopic system 10 includes an endoscope 12, a light source device 14, and a processor device 16. In addition to the endoscope 12 described later, there is an endoscopic imaging device 20 (see reference). Figure 2 Apart from the portion that is part of the endoscope, the endoscope system 10 has the same structure as a conventional endoscope.

[0038] Endoscope 12 includes an endoscopic imaging device. Furthermore, although not shown in detail, endoscope 12 includes an insertion section for insertion into the patient, an operating section connected to the insertion section, and a universal plug extending from the operating section. The insertion section comprises a front end, a curved section connected to the front end, and a flexible section connecting the curved section and the operating section. The endoscopic imaging device will be described later.

[0039] An endoscope camera device 20 is provided at the distal end of the endoscope 12 (reference). Figure 2 This endoscopic imaging device includes an illumination optical system that emits illumination light to illuminate the area being observed, and an imaging element and imaging optical system that capture images of the area being observed. The bending section is configured to bend in a direction orthogonal to the longitudinal axis of the insertion section, and the bending action of the bending section is operated by an operating section. Furthermore, the flexible section is configured to deform relatively flexibly to conform to the shape of the insertion path of the insertion section.

[0040] An endoscope camera device 20 (reference) is provided at the operating end of the operating section. Figure 2 The device includes buttons for shooting actions and knobs for bending actions of the bending section. Furthermore, the operating section has an inlet for inserting surgical instruments such as electrosurgical scalpels, and the insertion section has an instrument channel extending from the inlet to the end section for inserting instruments such as forceps.

[0041] A connector is provided at the end of the universal plug cord, and the endoscope 12 is connected via the connector to the light source device 14 that generates illumination light emitted from the illumination optics system at the end and the endoscope camera device 20 that processes the image emitted from the end (see reference). Figure 2 The processor device 16 that acquires the video signal is connected.

[0042] The processor device 16 processes the input video signal, generates video data of the observed area, and displays the generated video data on a monitor (not shown) or records it to a storage medium such as a hard disk. Alternatively, the processor device 16 may also be composed of a processor such as a personal computer.

[0043] The light source device 14 is a device for performing the following: [referencing] the endoscopic imaging device 20 (see reference) for the endoscope 12. Figure 2 The endoscope 12 captures images of the object to be observed within the body cavity, acquires image signals of the object, and generates illumination light, such as white light or light of a specific wavelength composed of three primary colors (red, green, and blue), which is supplied to the endoscope 12. The light propagates through the light guide within the endoscope 12 and is emitted from the illumination optical system at the end of the insertion part of the endoscope 12 to illuminate the object to be observed within the body cavity.

[0044] A light guide or a wire assembly (signal cable) is housed inside the insertion section, the operating section, and the universal plug cord. Illumination light generated by the light source device 14 is guided via the light guide to the illumination optics system at the distal end, and at least one of the signal and power is transmitted via the wire assembly to the endoscope imaging device 20 at the distal end (see reference). Figure 2 Transmission between the processor device 16 and the processor device 16.

[0045] Furthermore, the end portion of the endoscope system 10 includes a receiving hole (not shown) in which a treatment instrument channel (not shown) is received and fixed, and an illumination optical system (not shown) that emits illumination light guided from the light source device 14 via a light guide.

[0046] For example, the endoscopic camera device 20 uses an imaging element 29 (reference) Figure 4 ) light receiving surface 29a (reference) Figure 4 It is fixed to the end of the endoscope system 10 in a manner that is approximately perpendicular to the longitudinal axis of the insertion part.

[0047] Furthermore, the endoscope system 10 may also include a water supply tank for storing cleaning water, a suction pump for aspirating material (including the supplied cleaning water) from the body cavity, and a supply pump for supplying cleaning water from the water supply tank or external air into the endoscope.

[0048] [An example of an endoscopic camera device]

[0049] Figure 2 This is a schematic perspective view illustrating an example of an endoscopic imaging device according to an embodiment of the present invention. Figure 3 This is a schematic partial cross-sectional perspective view illustrating an example of an endoscopic imaging device according to an embodiment of the present invention. Figure 4 This is a schematic top view illustrating an example of an endoscopic imaging device according to an embodiment of the present invention. Figure 5 This is a schematic side view illustrating an example of an endoscopic imaging device according to an embodiment of the present invention.

[0050] exist Figure 1 The distal end of the endoscope 12 of the endoscope system 10 shown is equipped with Figure 2 The endoscopic camera device 20 shown is also called a camera.

[0051] Figures 2-5 The endoscopic camera device 20 shown acquires images of the object being observed. The endoscopic camera device 20 has an imaging lens 23 (reference). Figure 3 The endoscope camera device 20 includes a lens barrel 22, a support 24, a filter 26, a mask 27, a cover glass 28, an imaging element 29, a circuit board 30, and a signal cable 32, which hold the imaging lens 23. Furthermore, the endoscope camera device 20 has an anchor 34.

[0052] The lens barrel 22 is a cylindrical component, although not shown in the figure, inside 22a (see reference). Figure 3 The endoscope camera device 20 holds one or more imaging lenses 23. The lens barrel 22 holds the imaging lens 23 so that the optical axis C of the imaging lens 23 is perpendicular to the light receiving surface 29a of the imaging element 29. Although not shown in detail, the endoscope camera device 20 has, for example, four imaging lenses 23.

[0053] Here, as Figure 2 As shown, the direction parallel to the optical axis C is designated as the X direction. Of the two directions orthogonal to the optical axis C, one is designated as the Y direction, and the remaining direction is designated as the Z direction. The Y direction corresponds to the width direction of the endoscope camera device 20, and the Z direction corresponds to the height direction of the endoscope camera device 20, which are equivalent to the up-down directions described later.

[0054] Imaging lens 23 images the light incident on it onto the light receiving surface 29a of imaging element 29 (reference). Figure 4 The imaging lens 23 is an optical element on the lens barrel 22.

[0055] There are no particular limitations on the structure of the imaging lens 23 and the lens barrel 22. For example, it can be a structure with one imaging lens 23, or it can be a structure with two, three, or more than five imaging lenses 23. Furthermore, each imaging lens 23 can be a convex lens or a concave lens.

[0056] Imaging element 29 is an imaging element that performs imaging by converting the light imaged by imaging lens 23 into an electrical signal through photoelectric conversion. Imaging element 29 is a conventionally known imaging element that can use a CCD (Charge Coupled Device) type image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor.

[0057] A cover glass 28 is disposed on the light-receiving surface 29a of the imaging element 29, and the cover glass 28 protects the light-receiving surface 29a. The imaging element 29 and the cover glass 28 are, for example, integral, and the cover glass 28 constitutes a part of the imaging element 29. In addition, unless otherwise specified, the positioning of the imaging element 29 also includes positioning the imaging element 29 using the cover glass 28.

[0058] Furthermore, the imaging element 29 can also be a structure without the cover glass 28.

[0059] The imaging element 29 is held by a support 24. For example, the imaging element 29 is electrically connected to the circuit board 30 via conductive bumps 33. And, as... Figure 4 As shown, the imaging element 29 is mounted on the circuit board 30 with its light-receiving surface 29a orthogonal to the optical axis C of the imaging lens 23. Note that "mounted" refers to electrical connection.

[0060] In order to securely connect the imaging element 29 and the circuit board 30, an underfill layer (not shown) can also be provided between the imaging element 29 and the circuit board 30.

[0061] The bump 33 is made of metal or alloy. More specifically, the bump 33 is made of solder. The bump 33 formed by solder is also called a solder ball. In addition, the bump 33 is not limited to solder or the like as long as it can electrically connect the imaging element 29 to the circuit board 30. Furthermore, the imaging element 29 and the circuit board 30 can be electrically connected using anisotropic conductive film or directly.

[0062] Furthermore, due to the difference in the coefficients of thermal expansion between the imaging element 29 and the circuit board 30, stress is generated at the junction of the imaging element 29 and the circuit board 30, for example at the bump 33, but the bottom filler layer alleviates this stress. Through the bottom filler layer, the imaging element 29 and the circuit board 30 are firmly connected, the reliability of the electrical connection is increased, and a highly reliable endoscope imaging device 20 is obtained.

[0063] The underfiller constituting the underfill layer is not particularly limited, and an underfiller that serves as a sealing resin between the imaging element 29 and the circuit board 30 can be appropriately used. For example, a one-component heat-curing epoxy resin can be used as the underfiller. In this case, after supplying the underfiller, heating is maintained at a predetermined temperature to form the underfill layer.

[0064] The circuit board 30 is a substrate for mounting the imaging element 29. Furthermore, in addition to the imaging element 29, electronic components 31 are mounted on the circuit board 30. The electronic components 31 are used to drive the imaging element 29 and are not particularly limited; examples include voltage regulators, resistors, and capacitors. The voltage regulator is a device that stabilizes the voltage to the imaging element 29, outputting a constant voltage to the imaging element 29.

[0065] Furthermore, multiple connection terminals (not shown) for inputting or outputting signals or power to the imaging element 29 and electronic components 31 are provided on the surface 30a of the circuit board 30. The signal line 32a of the signal cable 32 is electrically connected to the connection terminals.

[0066] In the example shown, the circuit board 30 is, for example, shaped to bend the plate-like component at point 1, and has a bent portion 30c (see reference). Figure 2 and Figure 5 Specifically, the circuit board 30 is bent relative to an axis extending in the Y direction, which is orthogonal to the optical axis C of the imaging lens 23. The front end portion 30b of the circuit board 30, which is further from the end of the bent portion 30c, extends in the Z direction and is electrically connected to the imaging element 29. The rear end portion of the bent portion 30c extends in the optical axis C direction. An electronic component 31 is mounted on the surface 30a of the rear end portion of the circuit board 30, and a connection terminal electrically connected to the signal cable 32 is provided. Furthermore, a GND pad 30d is provided on the surface 30a of the circuit board 30 (see reference). Figure 2 The shielding conductor 32c of the signal cable 32 is electrically connected to the GND pad 30d via solder or the like. This makes the potential of the shielding conductor 32c ground potential. Furthermore, this increases the noise immunity of the endoscope imaging device 20, reducing the impact of noise on the imaging element 29. Additionally, as described later, the signal cable 32 is electrically connected to the imaging element 29, which will be explained later.

[0067] The circuit board 30 is preferably a flexible substrate, such as a flexible printed circuit board. Furthermore, the circuit board 30 is not limited to a single bend; the number of bends is appropriately determined based on the structure of the endoscope imaging device 20. Also, the arrangement of the imaging element 29, electronic components 31, and connection terminals on the circuit board 30 is not particularly limited.

[0068] Furthermore, in the circuit board 30, for example, such as Figure 5 As shown, in the Z direction (vertical direction) of the endoscope imaging device 20, the curved portion 30c protrudes from the lower end face 34g of the anchor 34. Thus, by having the curved portion 30c protrude from the lower end face 34g of the anchor 34, the curvature of the curved portion 30c of the circuit board 30 can be increased. That is, the radius of curvature of the curved portion 30c of the circuit board 30 can be reduced. Furthermore, by having the curved portion 30c protrude from the lower end face 34g of the anchor 34 in the circuit board 30, the space below the anchor 34 can be utilized effectively.

[0069] In addition, the lower end face 34g of the anchor 34 is the lower surface of the bottom 34a of the anchor 34.

[0070] The signal cable 32 is connected to a connection terminal (not shown) on surface 30a of the circuit board 30, and the imaging element 29 is electrically connected to the signal cable 32. The imaging element 29 converts light into an electrical signal, which is transmitted via the signal cable 32. The signal cable 32 is inserted into the insertion part, operating part, universal tether, etc., of the endoscope, and connects to the processor device 16 (see reference). Figure 1 Electrical connection. Furthermore, there are no particular limitations on the signal cable 32 as long as it has a sheath 32d forming the outer periphery.

[0071] like Figure 2 and Figure 4 As shown, for example, the signal cable 32 has: a plurality of signal lines 32a; a sheathing layer 32b covering each signal line 32a; a shielding conductor 32c disposed around the plurality of signal lines 32a as a whole, covered by the sheathing layer 32b; and an outer sheath 32d covering the shielding conductor 32c. As described above, the outer sheath 32d constitutes the outer periphery of the signal cable 32. The sheathing layer 32b, the shielding conductor 32c, and the outer sheath 32d are, for example, cylindrical. The shielding conductor 32c of the signal cable 32 is referred to as a shielding element. The signal cable 32 has, for example, four signal lines 32a. The number of signal lines 32a corresponds to the structure of the endoscope imaging device 20 and is not particularly limited; it can be two, three, or five or more.

[0072] The signal cable 32 is a multi-core cable with multiple signal lines 32a bundled together, shielded conductors 32c surrounding it, and housed in a cylindrical outer sheath 32d.

[0073] Figure 6 This is a schematic perspective view of an example of a bracket for an endoscopic imaging device according to an embodiment of the present invention. Figure 7 This is a schematic diagram of an example of a bracket for an endoscopic imaging device according to an embodiment of the present invention.

[0074] Figure 6 The bracket 24 shown is a component that connects to and holds the imaging element 29 in the lens barrel 22. The bracket 24 is a generally cylindrical component with a mounting section 24a having a through hole 24d for mounting the lens barrel 22.

[0075] The lens barrel 22 is embedded inside the through hole 24d (reference). Figure 2 To hold the lens barrel 22 in place. The inner surface of the bracket 24 is bonded to the outer peripheral surface of the lens barrel 22, for example.

[0076] As the adhesive for bonding the support 24 and the lens barrel 22, various known adhesives used in conventional endoscopes can be used. For example, epoxy adhesives, silicone adhesives, or acrylic adhesives can be used, and adhesives for bonding other components to each other are also applicable.

[0077] Adjusting the lens barrel 22 in the imaging lens 23 (reference) Figure 3 The relative position of the optical axis C of the imaging element 29 with respect to the bracket 24 is adjusted so that it is focused with the light receiving surface 29a of the imaging element 29, thereby bonding and fixing it to the bracket 24.

[0078] The bracket 24 has a polygonal flange 24b on the side opposite to the mounting lens barrel 22 of the mounting barrel 24a. Within the flange 24b, on the side opposite to the mounting barrel 24a, there is a pair of limiting members 25. The pair of limiting members 25 are arranged opposite each other. The pair of limiting members 25 are identical in shape and size, for example, constituted by a quadrilateral plate.

[0079] In the bracket 24, as described above, a pair of limiting members 25 are disposed opposite each other on the surface 24c of the flange portion 24b, opposite to the mounting cylinder portion 24a. For example, the opposing direction of the pair of limiting members 25 is orthogonal to the optical axis direction of the optical axis C of the imaging lens 23. The opposing direction is, for example, a direction parallel to the Y direction. In addition, the optical axis direction of the optical axis C refers to the direction in which the optical axis C extends. Here, the above-mentioned up and down direction refers to the opposing direction of the pair of limiting members 25 and the direction orthogonal to the optical axis direction.

[0080] The imaging element 29 is held by a pair of limiting members 25 of the support 24. Figure 2 and Figure 3As shown, a filter 26, a mask 27, and a cover glass 28 are sequentially arranged from the flange 24b side of the support 24 between the surface 24c of the flange 24b of the support 24 and the imaging element 29. The filter 26, mask 27, cover glass 28, and imaging element 29 have approximately the same shape and size when viewed from above; for example, they are quadrilaterals when viewed from above. The filter 26, mask 27, and cover glass 28 are also held by a pair of limiting members 25.

[0081] like Figure 7 As shown, the inner diameter D of the through hole 24d in the mounting cylinder portion 24a of the bracket 24 is larger than the width W of the imaging element 29. However, on the surface 24c of the flange portion 24b, there is a portion where the filter 26 abuts. By abutting the filter 26, the mask 27, the cover glass 28, and the imaging element 29 against the surface 24c of the flange portion 24b, the imaging element 29 is positioned relative to the optical axis.

[0082] When observing the pair of limiting members 25 from the optical axis C of the imaging lens 23 toward the through hole 24d, the pair of limiting members 25 are recessed along the periphery of the through hole 24d. That is, the pair of limiting members 25 are provided with recesses 25d along the periphery of the through hole 24d. This allows the inner diameter D of the through hole 24d to be larger than the width W of the imaging element 29, thus increasing the diameter of the imaging lens 23. In this case, even if the diameter of the imaging lens 23 increases, the flange portion 24b will not increase, preventing the support 24 from becoming too large. Even if the imaging lens 23 (refer to...) is enlarged... Figure 3 The diameter of the endoscope camera device 20 can also prevent it from becoming too large. Moreover, since the imaging element 29 can be held in a positioned state by the limiting member 25, the positional accuracy of the imaging lens 23 and the imaging element 29 can also be improved.

[0083] As described above, the imaging element 29 is positioned by abutting against the surface 24c of the flange portion 24b. Therefore, the inner diameter D of the through hole 24d is at most the size at which the four corners of the imaging element 29 can contact the surface 24c of the flange portion 24b when the imaging element 29 abuts against the surface 24c of the flange portion 24b.

[0084] For example, when viewed from above, if the center (not shown) of the imaging area (not shown) of the quadrilateral imaging element 29 is different from the geometric center (not shown) of the imaging element 29, in a circle centered on the center of the imaging area, if the inner diameter D of the through hole 24d is smaller than the diameter of the circle that initially contacts any one of the four vertices of the imaging element 29, then when the imaging element 29 abuts against the surface 24c of the flange portion 24b, the four corners of the imaging element 29 become sizes that can contact the surface 24c of the flange portion 24b.

[0085] In addition, the inner diameter D of the through hole 24d and the width W of the imaging element 29 are appropriately determined according to the size of the imaging element 29 used.

[0086] The difference between the inner diameter D of the through hole 24d and the width W of the imaging element 29 varies depending on the size of the imaging element 29, for example, from 0.05 to 0.3 mm, but is not limited to this. The difference between the inner diameter D of the through hole 24d and the width W of the imaging element 29 indicates that the inner diameter D of the through hole 24d is greater than the width W of the imaging element 29.

[0087] The width W of the imaging element 29 is its length in a direction parallel to the opposing direction of the pair of limiting members 25. Figure 7 In the image element 29, the width W is the length in the Y direction.

[0088] The inner diameter D of the through hole 24d and the width W of the imaging element 29 can be measured using a vernier caliper or a micrometer.

[0089] Figure 2 The filter 26 shown suppresses light spots and other light incident on the light receiving surface 29a of the imaging element 29. The filter 26 is made of glass, for example.

[0090] Mask 27 restricts a portion of the light passing through imaging lens 23, preventing stray light and the like from incident on imaging element 29. Mask 27, for example, has a circular aperture 27a in the region corresponding to the through-hole 24d (see reference). Figure 7 The through-hole 24d is a plate-shaped component. When viewed from the optical axis C of the imaging lens 23, the outer edge of the through-hole 24d is completely blocked by the mask 27. The mask 27 is made of, for example, stainless steel, synthetic resin, brass alloy, or aluminum alloy.

[0091] The mask 27 is in contact with the filter 26 and the cover glass 28 on both sides of the optical axis. The mask 27, the filter 26, and the cover glass 28 are bonded together, for example, using a photocurable adhesive. When using a photocurable adhesive, the filter 26 and the cover glass 28, which are in contact with both sides of the mask 27 in the optical axis direction, preferably transmit light of the wavelength at which the photocurable adhesive cures. Furthermore, even if no filter 26 or cover glass 28 is provided on both sides of the mask 27 in the optical axis direction, the components in contact with both sides of the mask 27 in the optical axis direction preferably transmit light of the wavelength at which the photocurable adhesive cures.

[0092] In addition, the wavelength of light that allows the light to cure through a UV-curable adhesive refers to the transmittance that enables the UV-curable adhesive to bond.

[0093] Photocurable adhesives are adhesives that are cured using ultraviolet light with a wavelength of 100-400 nm, visible light with a wavelength of more than 400 nm but less than 780 nm, or infrared light with a wavelength of 780 nm to 1 mm.

[0094] UV-curable adhesives include, for example, epoxy resin-based UV-curable adhesives, acrylic resin-based UV-curable adhesives, or silicone-based UV-curable adhesives. Furthermore, adhesives that combine both UV curing and heat curing can also be used.

[0095] Figures 2-5 The anchor 34 shown holds the signal cable 32 relative to the bracket 24. Furthermore, the anchor 34 maintains the mechanical strength of the endoscope camera device 20.

[0096] For example, such as Figure 2 As shown, the anchor 34 has a retaining portion 34d, which has a flat bottom 34a formed by bending a sheet metal and a flat substrate portion 34c connected to the bottom 34a. The retaining portions 34d are arranged opposite each other in the Y direction, and as described later, retain the signal cable 32.

[0097] In the anchor 34, the retaining portion 34d side serves as the base end 35a. The base material portion 34c is bent along the outer sheath 32d of the signal cable 32, for example, by riveting. Thus, the signal cable 32 is fixed and held on the retaining portion 34d. With the signal cable 32 fixed to the retaining portion 34d, when viewing the base end 35a of the anchor 34 in the optical axis direction, it forms a roughly triangular shape, for example, with a pair of retaining portions 34d and the base 34a. This suppresses the application of load to the circuit board 30 and suppresses deformation of the circuit board 30.

[0098] Furthermore, a pair of arms 34b extending in a straight line are provided at the bottom 34a of the anchor 34. The arms 34b are positioned opposite each other. The arms 34b are physically separated from the base portion 34c by a gap 34e at the base end 35a side. This prevents deformation of the arms 34b from being transmitted to the retaining portion 34d, and deformation of the retaining portion 34d from being transmitted to the arms 34b.

[0099] The opposing direction of the pair of arms 34b is the same as the opposing direction of the pair of limiting members 25, and is orthogonal to the optical axis C of the imaging lens 23. For example, the opposing direction of the pair of arms 34b is parallel to the Y direction.

[0100] The spacing between the pair of arms 34b is appropriately determined according to the configuration of the limiting member 25 of the bracket 24.

[0101] A pair of arms 34b on the end 35b side of the anchor 34 are fixed via the limiting member 25 of the bracket 24. The arms 34b are fixed to the outer surface 25c of the limiting member 25 (see reference). Figure 2 and Figure 6 The outer surface 25c of the limiting member 25 is provided with a recess 25d (see reference). Figure 6 The inner surface 25f is the opposite side of the face.

[0102] By fixing the arm 34b to the outer surface 25c of the limiting member 25, interference with the arm 34b is suppressed when positioning the support 24 and the imaging element 29, and interference with the circuit board 30 is also suppressed. Furthermore, by fixing the arm 34b to the outer surface 25c of the limiting member 25, the limiting member 25 can be used for positioning the imaging element 29, thereby improving the positional accuracy of the imaging element 29 and the imaging lens 23 of the lens barrel 22.

[0103] And, as Figure 2 and Figure 5 As shown, a groove 34f is provided, for example, at the end 35b side of each arm 34b. Solder 37 is supplied to the groove 34f, and the arm 34b is fixed to the limiting member 25 of the bracket 24. The shape of the groove 34f is not particularly limited; for example, the bottom of the groove 34f may be curved. In this case, the groove 34f is called a U-shaped groove. Furthermore, for example, the bottom of the groove 34f may be polygonal. In this case, the groove 34f is called, for example, a V-shaped groove. Moreover, it is not limited to the above-described groove 34f; a structure in which a through hole (not shown) is provided in the arm 34b may also exist. The shape of the through hole is not particularly limited; for example, it may be a circle, an ellipse, or a polygon.

[0104] Furthermore, as long as the arm portion 34b is the area fixed to the bracket 24, specifically, if the portion that contacts the outer surface 25c of the limiting member 25 has a groove 34f or a through hole, then when the arm portion 34b is joined and fixed to the bracket 24 using solder 37, the joint area can be increased, which is therefore preferred.

[0105] The anchor 34 is formed of a metallic material, for example. The metallic material used to form the anchor 34 is not particularly limited, but stainless steel and copper alloys are preferred, considering factors such as machinability, availability, and strength. When using solder 37 to fix the anchor 34, it is preferable to perform a plating treatment on the anchor 34 to facilitate solder adhesion.

[0106] By connecting the anchor 34 to the bracket 24 and the signal cable 32 respectively, it is prevented that when the signal cable 32 is pulled, the connection between the connection terminal on the circuit board 30 and the signal line 32a of the signal cable 32 will be pulled, and the connection between the connection terminal and the signal line 32a will be broken.

[0107] The signal cable 32 is secured to the anchor 34, for example, using adhesive or solder (not shown). Preferably, solder is used to join the retaining portion 34d of the anchor 34 to the shielding conductor 32c of the signal cable 32. By using solder, including the anchor 34, the potential can be set to ground potential, and the resistance of the joint can also be reduced. This further improves noise immunity and reduces the impact of noise on the imaging element 29. Furthermore, the use of solder also improves the mechanical strength of the joint.

[0108] After the endoscope camera device 20 uses solder to join the circuit board 30 to the signal cable 32, it uses solder to join the retaining part 34d of the anchor 34 to the signal cable 32.

[0109] In the endoscopic imaging device 20, the observation image of the imaging element 29 is read from the imaging lens 23, imaged on the light receiving surface 29a of the imaging element 29, and converted into an electrical signal. This electrical signal is output to the processor device 16 (reference) via the signal cable 32. Figure 1 The image is converted into a video signal and displayed on a monitor connected to the processor device 16. In this case, the endoscope camera device 20 images the optical image onto the image receiving surface of the imaging element with high precision, without image defects or defocusing, and can obtain high-quality observation images.

[0110] exist Figure 6 and Figure 7 In the bracket 24 shown, an arm 34b is fixed on the outer surface 25c of the outer side of the limiting member 25 (see reference). Figure 4 For example, because arm 34b uses solder 37 (see reference). Figure 2 and Figure 5 To facilitate the adhesion of solder 37, it is preferable to plate the area of ​​the fixed arm 34b, for example, the outer surface 25c of the outer side of the limiting member 25.

[0111] In the bracket 24, for example, since the filter 26 is disposed on the surface 24c of the flange portion 24b, it is undesirable to braze it. Furthermore, it is also undesirable to braze the bracket 24 to the inner surface of the mating surface with the lens barrel 22, i.e., the through hole 24d. In the bracket 24, it is preferable not to perform plating treatment on the parts where brazing is not desired.

[0112] Furthermore, in the bracket 24, a portion that is not a solder resist layer can be provided between the portion that is not desired to be brazed and the portion that is to be brazed.

[0113] In the bracket 24, the parts that do not want to be brazed are, for example, the front surface 24e of the mounting cylinder 24a side of the mounting cylinder 24a and the flange 24b.

[0114] Furthermore, in Figure 4 In the illustrated holder 24, the positions of the end portions 25a of the pair of restricting members 25 in the optical axis direction are preferably closer to the holder 24 side than the circuit board 30. This suppresses interference between the restricting members 25 and the circuit board 30 when positioning the imaging element 29. Further, the positions of the end portions 25a of the pair of restricting members 25 in the optical axis direction are more preferably closer to the holder 24 side than the end portion of the imaging element 29 on the signal cable 32 side. Thereby, interference with the circuit board 30 can be further suppressed while retaining the imaging element 29.

[0115] Figure 8 is a schematic diagram showing another example of the holder of the endoscope imaging apparatus according to the embodiment of the present invention. The holder 24 is not limited to the configuration as shown in Figure 7 in which the recessed portion 25d is provided along the peripheral edge of the through hole 24d, and may also have a structure in which a region corresponding to the peripheral edge of the through hole 24d is partially recessed. Further, for example, as shown in Figure 8 , an opening 25e may be provided in the restricting member 25, so that the region corresponding to the peripheral edge of the through hole 24d is empty. In the structure of the holder 24 shown in Figure 8 , similarly to the holder 24 shown in Figure 7 , the inner diameter D of the through hole 24d of the mounting cylinder portion 24a of the holder 24 can be made larger than the width W of the imaging element 29.

[0116] Further, the width Wp of the circuit board 30 (refer to Figure 4 ) is preferably narrower than the width W of the imaging element 29 (refer to Figure 7 ). This suppresses interference between the circuit board 30 and other components of the endoscope imaging apparatus 20, such as the arm portion 34b, when positioning the imaging element 29. Further, in a case where the circuit board 30 is mounted obliquely relative to the imaging element 29, the allowable range of mounting errors can be expanded.

[0117] The width Wp of the circuit board 30 is the length in the direction parallel to the width W of the imaging element 29. The width Wp of the circuit board 30 is the length in the Y direction in Figure 4 . The width Wp of the circuit board 30 can be measured using a vernier caliper or a micrometer.

[0118] The ratio of the width Wp of the circuit board 30 to the width W of the imaging element 29, expressed as (width Wp of circuit board 30) / (width W of imaging element 29) (refer to Figure 7The ratio of (width Wp of circuit board 30) / (width W of imaging element 29) is preferably ≤ 0.95. The width Wp of circuit board 30 is not particularly limited as long as it is accommodated between the pair of arms 34b and is sufficient to mount the electronic components 31 and signal cables 32. The lower limit of (width Wp of circuit board 30) / (width W of imaging element 29) is appropriately determined based on the width Wp of circuit board 30 described above.

[0119] Imaging element 29 is preferably positioned using the flange 24b of the support 24, at least one of the pair of limiting members 25, and the vertical end face 25b of the limiting member 25. That is, imaging element 29 is positioned relative to the optical axis C (X-axis direction) by abutting against the surface 24c of the flange 24b of the support 24, and by contacting the inner surface 25f (see reference) of at least one of the limiting members 25. Figure 4 , Figures 6-8 Positioned relative to the width direction (Y direction) by a clamp 39 (see reference) that engages with the end face 25b of the limiting member 25. Figure 7 , Figure 8 The end face 25b of the limiting member 25 is used to position the imaging element 29 relative to the vertical direction (Z direction). Therefore, when positioning the imaging element 29, the end face 25b of the limiting member 25 is used, and the positioning part is not required, which can prevent the endoscope camera device 20 from becoming too large.

[0120] Alternatively, in the above-described positioning of the imaging element 29 and the support 24, the upper end face of the limiting member 25 in the vertical direction can also be used.

[0121] Here, the arm 34b is relatively long, and a slight tilt results in a large offset, causing interference with other components. Conversely, providing multiple positioning parts would lead to a larger endoscope camera device 20. Therefore, in the endoscope camera device 20, the support 24 and anchor 34 preferably use the flange 24b of the support 24, a pair of limiting members 25, and the vertical end faces of the limiting members 25 to position the arm 34b of the anchor 34. This facilitates the positioning of the arm 34b with the support 24.

[0122] Furthermore, since the lens barrel 22, imaging element 29, and anchor 34 can be positioned respectively using the bracket 24 as a reference, positioning with low cumulative tolerances is possible. As a result, the number of positioning parts can be reduced, and the size of the endoscope imaging device 20 can be suppressed.

[0123] In addition, in the above positioning of the arm 34b and the bracket 24, the upper end face of the limiting member 25 in the vertical direction or the lower end face 25b in the vertical direction can be used.

[0124] When positioning is performed using the end face 25b of the limiting member 25, for example, a clamp 39 that is connected to the end face 25b of the limiting member 25 may be used.

[0125] The present invention is basically constructed as described above. The endoscopic imaging device and endoscope of the present invention have been described in detail above, but the present invention is not limited to the above embodiments. Various improvements and modifications can be made without departing from the spirit of the present invention.

[0126] Symbol Explanation

[0127] 10-Endoscope system, 12-Endoscope, 14-Light source device, 16-Processor device, 20-Endoscope imaging device, 22-Lens barrel, 22a-Internal, 23-Imaging lens, 24-Support, 24a-Mounting barrel, 24b-Flange, 24c-Surface, 24d-Through hole, 24e-Front surface, 25-Restricting component, 25a-End end, 25b-End face, 25c-Outer surface, 25d-Recess, 25e-Opening, 25f-Inner surface, 26-Filter, 27-Mask, 27a-Hole, 28-Cover glass, 29-Imaging element, 29 a-Light receiving surface, 30-Circuit board, 30a-Surface, 30b-Front end, 30c-Bend, 30d-GND pad, 31-Electronic component, 32-Signal cable, 32a-Signal line, 32b-Covering layer, 32c-Shielding conductor, 32d-Sheath, 33-Bump, 34-Anchor, 34a-Bottom, 34b-Arm, 34c-Substrate part, 34d-Holding part, 34e-Gap, 34f-Slot, 34g-End face, 35a-Base end, 35b-End end, 37-Solder, 39-Clamp, C-Optical axis, D-Inner diameter, W, Wp-Width.

Claims

1. An endoscopic camera device for acquiring images of an object under observation, the endoscopic camera device comprising: The lens barrel contains an imaging lens. An imaging element receives light passing through the imaging lens and performs photoelectric conversion; and A support, connected to the lens barrel, and holding the imaging element. The support has: The mounting tube has a through hole for mounting the lens tube; Flange portion; and A pair of limiting members are located on the side opposite to the mounting cylinder portion within the flange portion. The pair of limiting components are arranged opposite each other. The imaging element is held by a pair of limiting members of the support. The inner diameter of the through hole in the mounting cylinder is larger than the width of the imaging element. When the pair of limiting members are viewed from the optical axis direction of the imaging lens toward the through hole, the pair of limiting members are respectively either recessed in the area corresponding to the periphery of the through hole, or open in the area corresponding to the periphery of the through hole.

2. The endoscopic imaging device according to claim 1, wherein, The opposing directions of the pair of limiting components are orthogonal to the optical axis direction of the imaging lens.

3. The endoscopic imaging device according to claim 1, wherein, The endoscopic imaging device has a mask disposed on the imaging lens side of the imaging element, the mask restricting a portion of the light passing through the imaging lens. The components that are connected to both sides of the optical axis of the mask are cured by light of the wavelength that the photocurable adhesive undergoes curing.

4. The endoscopic imaging device according to claim 2, wherein, The endoscopic imaging device has a mask disposed on the imaging lens side of the imaging element, the mask restricting a portion of the light passing through the imaging lens. The components that are connected to both sides of the optical axis of the mask are cured by light of the wavelength that the photocurable adhesive undergoes curing.

5. The endoscopic imaging device according to claim 1, wherein, The endoscopic camera device has the following features: The circuit board is electrically connected to the imaging element. The width of the circuit board is narrower than the width of the imaging element.

6. The endoscopic imaging device according to claim 2, wherein, The endoscopic camera device has the following features: The circuit board is electrically connected to the imaging element. The width of the circuit board is narrower than the width of the imaging element.

7. The endoscopic imaging device according to claim 3, wherein, The endoscopic camera device has the following features: The circuit board is electrically connected to the imaging element. The width of the circuit board is narrower than the width of the imaging element.

8. The endoscopic imaging device according to claim 6, wherein, The ends of the pair of limiting components along the optical axis are positioned closer to the support side than the circuit board.

9. The endoscopic imaging device according to any one of claims 1 to 8, wherein, The endoscopic camera device has the following features: A signal cable is electrically connected to the imaging element; and An anchor, relative to the bracket, holds the signal cable. The anchor has a pair of arms that are opposite each other. The arm of the anchor is fixed to the outer side of the limiting member of the bracket.

10. The endoscopic imaging device according to claim 9, wherein, The arm of the anchor has a groove or through hole in the area where it is fixed to the limiting member of the bracket.

11. The endoscopic imaging device according to any one of claims 1 to 8, wherein, The imaging element is positioned using the flange of the support, at least one of the pair of limiting members, and the vertical end face of the limiting member. The up and down direction refers to the opposing direction of the pair of limiting components and the direction orthogonal to the optical axis.

12. The endoscopic imaging device according to claim 9, wherein, The bracket and the anchor use the flange of the bracket, a pair of limiting members, and the vertical end faces of the limiting members to position the arm of the anchor. The up and down direction refers to the opposing direction of the pair of limiting components and the direction orthogonal to the optical axis.

13. The endoscopic imaging device according to claim 9, wherein, The circuit board has a bent portion. The curved portion protrudes from the lower end face of the anchor in the opposite direction of the pair of limiting components and in the up-down direction orthogonal to the optical axis.

14. The endoscopic imaging device according to claim 9, wherein, In the bracket, the area where the arm is fixed is plated.

15. An endoscope having an endoscope imaging device according to any one of claims 1 to 14.

Citation Information

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