Mask, mask assembly, and manufacturing device of display device

Abstract

The application discloses a mask, a mask assembly and a manufacturing device of a display device. The mask comprises a deposition pattern part provided with a plurality of deposition holes for passing a deposition substance, and a dummy pattern part arranged outside the deposition pattern part, wherein the dummy pattern part comprises a negative Poisson's ratio structure.

Description

Technical Field

[0001] The present invention relates to an apparatus for manufacturing a mask, a mask assembly, and a display device, and more particularly to an apparatus for manufacturing a deposition mask, a mask assembly including the deposition mask, and a display device. Background Technology

[0002] With the development of the information society, the requirements for display devices used to display images are increasing in various forms. The display device field has rapidly evolved to replace bulky cathode ray tubes with thin, lightweight, and large-area flat panel display devices. Flat panel display devices include liquid crystal display devices, plasma display panels, organic light emitting display devices, and electrophoretic display devices, among others.

[0003] In display devices, organic light-emitting display devices include organic light-emitting diodes (OLEDs) equipped with pixel electrodes, opposing electrodes, and an emissive layer. The electrodes and emissive layer can be formed using various methods, one of which is a separate deposition method. The separate deposition method involves stretching a fine metal mask (FMM) along its length and attaching it tightly to a mask frame, through which the deposition material is deposited onto the surface to be deposited. For precise deposition, the mask and mask frame need to be precisely aligned and tightly attached to each other. Summary of the Invention

[0004] However, because the mask has a very thin thickness compared to its length and / or width, curling and wrinkling may occur in the mask when it is stretched due to internal stress. Curling in the mask may prevent the mask and mask frame from being precisely aligned and attached to each other. Furthermore, wrinkling in the mask may prevent the mask and mask frame from being tightly attached to each other.

[0005] The present invention was made to solve a variety of problems, including those described above, and aims to provide a manufacturing apparatus for a mask, mask assembly, and display device that can reduce curling and wrinkling on the mask. However, these problems are exemplary, and the scope of the present invention is not limited thereto.

[0006] According to one aspect of the present invention, a mask is provided, comprising: a deposition pattern portion equipped with a plurality of deposition holes through which a deposition material passes; and a dummy pattern portion disposed outside the deposition pattern portion, wherein the dummy pattern portion comprises an induced structure having a negative Poisson's ratio.

[0007] According to this embodiment, the dummy pattern portion may be equipped with a plurality of dummy holes, which have a different shape on the plane than the plurality of deposition holes of the deposition pattern portion.

[0008] According to this embodiment, the deposition pattern portion may include a first deposition hole and a second deposition hole having shapes on different planes from each other, the second deposition hole being arranged adjacent to one of the plurality of dummy holes of the dummy pattern portion.

[0009] According to this embodiment, the second deposition hole can be equipped with a shape corresponding to the shape of the dummy hole in such a way that the width between the second deposition hole and the dummy hole is constant in the plane.

[0010] According to this embodiment, the dummy pattern portion can surround the entire deposited pattern portion on a plane.

[0011] According to this embodiment, the dummy pattern portion can partially surround the deposited pattern portion on a plane.

[0012] According to this embodiment, the deposited pattern portion can be configured as a plurality of portions, and the dummy pattern portion is located between the deposited pattern portions that are adjacent to each other on the plane.

[0013] According to this embodiment, the dummy pattern portion can be located on a plane between the end of the mask that intersects with the longitudinal direction and the deposited pattern portion.

[0014] According to another aspect of the invention, a mask assembly is provided, comprising: a mask frame having an opening; and a mask disposed on the mask frame, and including a deposited pattern portion arranged to overlap with the opening and a dummy pattern portion disposed outside the deposited pattern portion, wherein the dummy pattern portion includes an induced structure having a negative Poisson's ratio.

[0015] According to this embodiment, the deposited pattern portion may be equipped with a plurality of deposited holes, and the dummy pattern portion is equipped with a plurality of dummy holes, the plurality of dummy holes having a different shape on the plane than the plurality of deposited holes of the deposited pattern portion.

[0016] According to this embodiment, the deposition pattern portion may include a first deposition hole and a second deposition hole having shapes on different planes from each other, the second deposition hole being arranged adjacent to one of the plurality of dummy holes of the dummy pattern portion.

[0017] According to this embodiment, the second deposition hole can be equipped with a shape corresponding to the shape of the dummy hole in such a way that the width between the second deposition hole and the dummy hole is constant in the plane.

[0018] According to this embodiment, the dummy pattern portion can surround the entire deposited pattern portion on a plane.

[0019] According to this embodiment, the dummy pattern portion can partially surround the deposited pattern portion on a plane.

[0020] According to this embodiment, the deposited pattern portions may be configured as a plurality and arranged along a first direction, and the dummy pattern portions are located between two adjacent deposited pattern portions among the plurality of deposited pattern portions.

[0021] According to another aspect of the present invention, a manufacturing apparatus for a display device is provided, comprising: a chamber in which a display substrate is disposed; a deposition source disposed inside the chamber for supplying a deposition material to the interior of the chamber; and a mask assembly disposed between the display substrate and the deposition source for allowing the deposition material to pass through, wherein the mask assembly comprises: a mask frame having an opening; and a mask disposed on the mask frame and including a deposition pattern portion arranged overlapping the opening and a dummy pattern portion disposed outside the deposition pattern portion, wherein the dummy pattern portion includes an induced structure having a negative Poisson's ratio.

[0022] According to this embodiment, the deposition pattern portion may include a first deposition hole and a second deposition hole having shapes on different planes from each other, and the dummy pattern portion is equipped with dummy holes having shapes on different planes than the first deposition hole and the second deposition hole.

[0023] According to this embodiment, the second deposition hole can be arranged adjacent to the dummy hole, and equipped with a shape corresponding to the shape of the dummy hole in such a way that the width between the second deposition hole and the dummy hole is constant in the plane.

[0024] According to this embodiment, the dummy pattern portion can surround the entire deposited pattern portion on a plane.

[0025] According to this embodiment, the deposited pattern portion can be configured as a plurality of portions, and the dummy pattern portion is located between adjacent deposited pattern portions.

[0026] Other aspects, features, and advantages beyond those described above will become apparent from the following detailed description, claims, and drawings.

[0027] These general and specific aspects can be achieved by using systems, methods, computer programs, or a combination of systems, methods, and computer programs.

[0028] According to one embodiment of the present invention configured as described above, the mask is equipped with a dummy pattern portion including an auxetic structure, thereby reducing curling and wrinkling that occur on the mask when it is stretched. Using a mask assembly including such a mask, a manufacturing apparatus for a display device capable of precise deposition can be realized. However, the scope of the present invention is not limited to this effect. Attached Figure Description

[0029] Figure 1 This is a schematic cross-sectional view of a manufacturing apparatus for a display device according to an embodiment of the present invention.

[0030] Figure 2 This is a schematic perspective view of a mask assembly according to an embodiment of the present invention.

[0031] Figure 3 This is a schematic plan view of a mask according to an embodiment of the present invention.

[0032] Figure 4 This is an enlarged plan view schematically showing a portion of a mask provided in a manufacturing apparatus for a display device according to an embodiment of the present invention.

[0033] Figure 5 This is an image illustrating the structure of a dummy pattern portion provided with a mask according to an embodiment of the present invention.

[0034] Figure 6a and Figure 6b These are enlarged plan views showing the structure of the dummy pattern portion provided with a mask according to another embodiment of the present invention.

[0035] Figure 7a and Figure 7b It is an image showing the deformation of the mask when a tensile force is applied to the mask according to the comparative example.

[0036] Figure 8a and Figure 8b This is an image showing the deformation of a mask when a tensile force is applied to it according to an embodiment of the present invention.

[0037] Figure 9 This is an enlarged plan view schematically illustrating a portion of a mask provided with a manufacturing apparatus for a display device according to another embodiment of the present invention.

[0038] Figure 10 This is a schematic plan view of a mask according to another embodiment of the present invention.

[0039] Figure 11 This is a perspective view schematically illustrating a display device manufactured using a display device manufacturing apparatus according to an embodiment of the present invention.

[0040] Figure 12 This is a schematic cross-sectional view illustrating a display device manufactured using a display device manufacturing apparatus according to an embodiment of the present invention.

[0041] Explanation of reference numerals in the attached figures

[0042] 1: Display device manufacturing apparatus 1000: Mask assembly

[0043] 1100: Mask frame 1200: Mask

[0044] 2: Display device AP: Deposition pattern section

[0045] AH: Depositional pores; DP: Dummy pattern section

[0046] DH: Dummy Hole Detailed Implementation

[0047] This invention can be modified in various ways and can have multiple embodiments. Specific embodiments are illustrated in the accompanying drawings and described in detail. References and Appendix Figure 1 The embodiments described in detail below will clearly demonstrate the effects and features of the present invention, as well as the methods for achieving said effects and features. However, the present invention is not limited to the embodiments disclosed below and can be implemented in various forms.

[0048] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. When describing the invention with reference to the accompanying drawings, the same or corresponding constituent elements will be given the same reference numerals and repeated descriptions of them will be omitted.

[0049] In the following embodiments, terms such as "first" and "second" are not used in a limiting sense, but are used for the purpose of distinguishing one constituent element from other constituent elements.

[0050] In the following embodiments, the singular expression includes the plural expression unless otherwise explicitly indicated in the context.

[0051] In the following embodiments, terms such as "comprising" or "having" indicate the presence of features or constituent elements described in the specification, without pre-excluding the possibility of adding more than one other feature or constituent element.

[0052] In the following embodiments, when referring to a portion of a membrane, region, constituent element, etc., located on or above another portion, it includes not only the case where it is immediately above the other portion, but also the case where other membranes, regions, constituent elements, etc. are sandwiched in between.

[0053] For ease of explanation, the sizes of the constituent elements in the accompanying drawings may be exaggerated or reduced. For example, for ease of explanation, the sizes and thicknesses of the various components shown in the drawings are arbitrarily depicted, and therefore the invention is not necessarily limited to the content shown in the drawings.

[0054] Where an embodiment can be implemented in different ways, a particular process sequence may be performed in a different order than that described. For example, two processes described consecutively may be performed substantially simultaneously, or they may be performed in the reverse order of the description.

[0055] In this specification, "A and / or B" means that it is A, is B, or is both A and B. Furthermore, "at least one of A and B" means that it is A, is B, or is both A and B.

[0056] In the following embodiments, when it is mentioned that membranes, regions, constituent elements, etc., form a connection, it includes cases where the membranes, regions, and constituent elements are directly connected and / or cases where the membranes, regions, and constituent elements are indirectly connected by intercalating other membranes, regions, and constituent elements. For example, in this specification, when it is mentioned that membranes, regions, constituent elements, etc., form an electrical connection, it includes cases where the membranes, regions, and constituent elements are directly electrically connected and / or cases where the membranes, regions, and constituent elements are indirectly electrically connected by intercalating other membranes, regions, and constituent elements.

[0057] The x-axis, y-axis, and z-axis are not limited to the three axes of a rectangular coordinate system; they can be interpreted in a broad sense. For example, while the x-axis, y-axis, and z-axis can be perpendicular, they can also refer to directions that are not perpendicular to each other and are different from each other.

[0058] Figure 1 This is a schematic cross-sectional view of a manufacturing apparatus for a display device according to an embodiment of the present invention.

[0059] Reference Figure 1 The manufacturing apparatus 1 for the display device may include a chamber 11, an opening and closing part 12, a deposition source 13, a first support part 14, a second support part 15, a magnetic force generation part 16, a pressure adjustment part 17, a display substrate DS, and a mask assembly 1000.

[0060] The cavity 11 can have an internal space, and a display substrate DS can be disposed inside the cavity 11. The internal space of the cavity 11 can be a working space for the deposition process. In this case, the display substrate DS can be positioned as a reference... Figure 11A part of the display device 2 in the process of manufacturing the display device 2 as described below.

[0061] An opening through which the display substrate DS can pass can be provided on one side of the chamber 11. That is, the display substrate DS can be inserted into or removed from the interior space of the chamber 11 through the opening. At this time, an opening and closing part 12, including a gate valve, is provided at the opening of the chamber 11, so that the opening can be selectively opened and closed.

[0062] The deposition source 13 can be disposed inside the chamber 11. The deposition source 13 can contain deposited material and supply the deposited material to the internal space of the chamber 11. Here, the deposited material can be a substance on which a predetermined pattern layer (e.g., an organic pattern layer) is formed on the display substrate DS. The deposition source 13 can vaporize or sublimate the deposited material by applying energy (e.g., thermal energy, light energy, vibrational energy, etc.). As an embodiment, the deposition source 13 can include a heater internally, and the operation of the heater heats the deposited material inside the deposition source 13, thereby vaporizing or sublimating the deposited material. This deposition source 13 can be replaceable. In this case, when the contained deposited material is exhausted, the deposition source 13 can be replaced with a new deposition source.

[0063] The first support portion 14 can support the display substrate DS. In this case, the first support portion 14 can support the display substrate DS by placing it on itself, or by adsorbing or attaching one side of the display substrate DS. For example, the first support portion 14 may include a frame, rod, etc., connected inside the chamber 11. As another example, the first support portion 14 may include a clamp for holding the display substrate DS. As yet another example, the first support portion 14 may also include an adhesive chuck or an electrostatic chuck. In this case, the first support portion 14 can be integrally formed with the magnetic force generating portion 16. The first support portion 14 can adjust the position of the display substrate DS. For example, the first support portion 14 may include a UVW stage.

[0064] The second support portion 15 can support the mask assembly 1000. In this case, the second support portion 15 may be the same as or similar to the first support portion 14 described above; therefore, for ease of explanation, detailed descriptions are omitted below. Furthermore, the following detailed description focuses on the scenario where the second support portion 15 includes a frame connected to the interior of the chamber 11, and the mask assembly 1000 is placed and supported within said frame.

[0065] At least one of the first support portion 14 and the second support portion 15 can rise and / or fall within the chamber 11. In this case, at least one of the first support portion 14 and the second support portion 15 can adjust the spacing between the display substrate DS and the mask assembly 1000.

[0066] The magnetic force generating unit 16 can be arranged in the cavity 11 so that the mask assembly 1000 is in close contact with the display substrate DS. At this time, the magnetic force generating unit 16 may include an electromagnet or a permanent magnet that generates magnetic force.

[0067] The pressure regulating unit 17 can be connected to the chamber 11 to regulate the pressure inside the chamber 11. In this case, the pressure regulating unit 17 may include piping connected to the chamber 11 and a pump arranged in the piping.

[0068] Although not shown, the manufacturing apparatus 1 for the display device may include a vision unit (not shown). The vision unit may be arranged inside or outside the chamber 11 to capture the positions of the mask assembly 1000 and the display substrate DS. At this time, the vision unit may capture alignment marks, etc., of at least one of the mask assembly 1000 and the display substrate DS.

[0069] A mask assembly 1000 may be disposed between a display substrate DS and a deposition source 13. The mask assembly 1000 may include a mask frame 1100 and a mask 1200. The mask 1200 may be fixed to the mask frame 1100 in a stretched state in one direction. The mask 1200 may include at least one patterned hole.

[0070] Observing the operation of the manufacturing apparatus 1 for the display device as described above, with the pressure regulating unit 17 maintaining the pressure inside the chamber 11 at the same or similar level as atmospheric pressure, the opening and closing unit 12 is opened to insert the display substrate DS and the mask assembly 1000 into the chamber 11. At this time, at least one of the display substrate DS and the mask assembly 1000 can be moved by a separate robotic arm arranged outside the chamber 11 or by a shuttle inserted into or removed from the chamber 11.

[0071] After the display substrate DS and the mask assembly 1000 are respectively arranged on the first support portion 14 and the second support portion 15, the positions of the mask assembly 1000 and the display substrate DS can be sensed by the vision portion (not shown) and they can be aligned. Then, after the display substrate DS and the mask assembly 1000 are brought close to each other, the mask assembly 1000 and the display substrate DS can be pressed tightly together by the magnetic force generating portion 16.

[0072] If the deposited material is released from the deposition source 13, it can be deposited onto the display substrate DS through the holes in the mask 1200 provided in the mask assembly 1000. Accordingly, a predetermined pattern can be formed on the display substrate DS. For example, the deposited material on the display substrate DS can form a light-emitting layer 222 as described below (see...). Figure 12 Organic layers such as )

[0073] If the above process is completed, the display substrate DS can be moved outside the cavity 11 or to another location in the cavity 11 to form another layer on the display substrate DS.

[0074] Figure 2 This is a schematic perspective view of a mask assembly according to an embodiment of the present invention. Figure 3 This is a schematic plan view of a mask according to an embodiment of the present invention.

[0075] Reference Figure 2 and Figure 3 The mask assembly 1000 may include a mask frame 1100 and a mask 1200 disposed on the mask frame 1100.

[0076] The mask frame 1100 may be equipped with an opening 1150 through which the deposited material can pass, and may include a plurality of sub-frames forming the opening 1150.

[0077] As one embodiment, the mask frame 1100 may include a first sub-frame 1110 and a second sub-frame 1120 facing each other, as well as a third sub-frame 1130 and a fourth sub-frame 1140. For example, the first sub-frame 1110 and the second sub-frame 1120 may be spaced apart from each other in the x-direction, which is the longitudinal direction of the mask 1200, and may extend in the y-direction, which is the direction intersecting the longitudinal direction of the mask 1200 (i.e., the transverse direction). The third sub-frame 1130 and the fourth sub-frame 1140 may be spaced apart from each other in the y-direction and may extend in the x-direction. The first sub-frame 1110 may be connected to the third sub-frame 1130 and the fourth sub-frame 1140, and the second sub-frame 1120 may be connected to the third sub-frame 1130 and the fourth sub-frame 1140.

[0078] Thus, as Figure 2 As shown, the mask frame 1100 can have a quadrilateral shape on a plane, but is not limited to this. For example, the mask frame 1100 can have various shapes such as triangles, pentagons, circles, and ellipses. Furthermore, as an example, the opening 1150 of the mask frame 1100 can have a quadrilateral shape on a plane. As another example, the opening 1150 can have various shapes such as triangles, pentagons, circles, and ellipses.

[0079] The mask frame 1100 can have a thickness that is very thin compared to its width or length. If the thickness is too thick, it will restrict the passage of deposited material through the mask 1200 during the deposition process utilizing the mask assembly 1000. Conversely, if the thickness is too thin, it may be difficult to ensure the rigidity used to support the mask 1200. Therefore, considering the above aspects, the mask frame 1100 can have a suitable thickness.

[0080] Furthermore, the mask frame 1100 can be made of metal, for example. For example, the mask frame 1100 can be made of metal that does not deform much during welding.

[0081] Although Figure 2 Not shown in the diagram, but support rods may be arranged in the mask frame 1100. These support rods can be connected to the mask 1200 described later, except for the deposited pattern portion AP (see reference). Figure 3 The area overlaps with the area outside the mask frame 1100. The support rod can extend in the y-direction and connect to the third sub-frame 1130 and / or the fourth sub-frame 1140. The support rod can block the deposition material in a certain area, ensuring that the deposition material is only deposited in a predetermined area. Furthermore, the support rod can prevent the mask 1200 from bending due to its own weight and can also support the mask frame 1100.

[0082] The mask frame 1100 can support the mask 1200. As an example, the mask 1200 can be fixed to the mask frame 1100 in a stretched state in the longitudinal direction (i.e., the x direction).

[0083] The mask 1200 can be made of materials such as stainless steel, invar, nickel, cobalt, nickel alloys, or nickel-cobalt alloys. Because these materials have low coefficients of thermal expansion, deformation of the mask frame 1100 due to heat during the manufacturing process of the mask assembly 1000 can be minimized.

[0084] As one embodiment, the width of the mask 1200 can be smaller than the width of the opening 1150. For example, as Figure 2 As shown, the width of the mask 1200 in the y-direction can be smaller than the width of the opening 1150 in the y-direction. Multiple masks 1200 can be configured, and these masks 1200 can be arranged consecutively between the third subframe 1130 and the fourth subframe 1140. Each mask 1200 can be welded to the first subframe 1110 and the second subframe 1120. The multiple masks 1200 can cover the opening 1150 of the mask frame 1100.

[0085] Reference Figure 3 As one embodiment, the mask 1200 may include a first region AR1, a second region AR2, and a third region AR3 arranged along the longitudinal direction (i.e., the ±x direction) of the mask 1200. The first region AR1 is located at the center of the mask 1200 and may be a region that overlaps with the opening 1150 of the mask frame 1100.

[0086] The second region AR2 can be located at both ends EP along the longitudinal direction of the mask 1200. The second region AR2 can be a region held, for example, by a jig for stretching the mask 1200. Alternatively, the second region AR2 can be a region secured by an adhesive chuck or an electrostatic chuck for stretching the mask 1200. As part of an embodiment, the second region AR2 of the mask 1200 can be cut and removed after the mask 1200 is secured to the mask frame 1100.

[0087] The third region AR3 can be located between the first region AR1 and the second region AR2, and can be the region where the mask 1200 and the mask frame 1100 are connected to each other. For example, the third region AR3 can be welded to the first sub-frame 1110 or the second sub-frame 1120 of the mask frame 1100 and thus connected to the first sub-frame 1110 or the second sub-frame 1120 of the mask frame 1100.

[0088] According to one embodiment of the present invention, the mask 1200 may include a deposited pattern portion AP and a dummy pattern portion DP disposed in a first region AR1. At least the deposited pattern portion AP of the mask 1200 may be arranged to overlap with the opening 1150 of the mask frame 1100. The deposited pattern portion AP of the mask 1200 may include a plurality of deposition holes AH for passing through which the deposited material passes. Therefore, in the deposition process, the deposited material can reach the display substrate DS after passing through the opening 1150 of the mask frame 1100 and the deposition holes AH of the mask 1200, thereby allowing deposition only in a predetermined area of ​​the display substrate DS.

[0089] As one embodiment, multiple deposition pattern portions AP can be provided. The multiple deposition pattern portions AP can be arranged at predetermined intervals, for example, they can be arranged along the longitudinal direction (i.e., the x-direction) of the mask 1200. The multiple deposition pattern portions AP may include a first deposition pattern portion AP1, a second deposition pattern portion AP2, ... and an nth deposition pattern portion APn. Here, n is a positive integer.

[0090] like Figure 3 As shown, the deposited pattern portion AP can have a quadrilateral shape on a plane, but is not limited to this. For example, the deposited pattern portion AP can have various shapes such as triangles, pentagons, polygons, circles, and ellipses. As an example, the deposited pattern portion AP can correspond to the display device 2 described later (see reference 2). Figure 11 The display area DA (refer to) Figure 11 (The shape of)

[0091] The dummy pattern portion DP can be arranged outside the deposited pattern portion AP. As one embodiment, the dummy pattern portion DP can be arranged to surround the entire deposited pattern portion AP in a plane. As described above, when multiple deposited pattern portions AP are provided, the dummy pattern portion DP can be arranged to surround the entirety of each of the deposited pattern portions AP. As one embodiment, the dummy pattern portion DP can be in contact with the deposited pattern portion AP in a plane.

[0092] exist Figure 3 The illustration shows that the width of the dummy pattern portion DP in the y-direction is smaller than the interval between the edge of the deposited pattern portion AP and the edge of the mask 1200. However, the present invention is not limited to this, and the width of the dummy pattern portion DP in the y-direction can be varied in various ways. For example, the width of the dummy pattern portion DP in the y-direction can be equal to the interval between the edge of the deposited pattern portion AP and the edge of the mask 1200. In this case, it can be understood that the edge of the dummy pattern portion DP and the edge of the mask 1200 are aligned with each other in the plane.

[0093] The dummy pattern section DP may include an auxetic structure and may be equipped with multiple auxetic holes DH for the auxetic structure. For a detailed explanation, please refer to the following... Figure 4 and Figure 5 This will be described later.

[0094] Figure 4 This is an enlarged plan view schematically illustrating a portion of a mask provided in a manufacturing apparatus for a display device according to an embodiment of the present invention, and may correspond to... Figure 3 The IV region of the mask. Figure 5 This is an image illustrating the structure of a dummy pattern portion provided with a mask according to an embodiment of the present invention. Figure 5 This shows the lateral displacement of the dummy pattern portion when a longitudinal tension is applied.

[0095] Reference Figure 4 The deposition pattern portion AP of the mask 1200 may include multiple deposition holes AH. The multiple deposition holes AH may be through-holes that allow deposited material to pass through, ensuring that the deposited material is deposited only in a predefined region (i.e., the deposition region). Therefore, each deposition hole AH may have a shape corresponding to the deposition region. For example, the deposition hole AH may have a quadrilateral shape in a plane. Alternatively, the deposition hole AH may have various shapes such as triangles, pentagons, polygons, circles, and ellipses.

[0096] According to one embodiment of the present invention, the dummy pattern portion DP of the mask 1200 may include an auxetic structure with a negative Poisson's ratio. When a longitudinal tensile force is applied to the component, deformation occurs both longitudinally and laterally. In this case, the negative ratio between the longitudinal deformation rate and the lateral deformation rate is defined as Poisson's ratio. Typical components have a positive Poisson's ratio because the signs of their longitudinal and lateral deformation rates are different. That is, when a longitudinal tensile force is applied, longitudinal elongation and lateral contraction occur.

[0097] However, in the case of a component including a tensile structure, unlike a general component, the longitudinal and transverse deformation rates have the same sign. That is, the tensile structure has a negative Poisson's ratio. If a longitudinal tensile force is applied to a component including a tensile structure, elongation can occur not only in the longitudinal direction but also in the transverse direction.

[0098] Reference Figure 5 When a longitudinal tensile force is applied to the dummy pattern portion DP equipped with such a tensile structure, lateral (i.e., ±y direction) deformation occurs in the dummy pattern portion DP. Specifically, due to the applied tensile force in the ±x direction, the left side of the dummy pattern portion DP shifts in the -y direction, and the right side shifts in the +y direction, thereby allowing the dummy pattern portion DP to elongate as a whole along the ±y direction. This tensile structure of the dummy pattern portion DP can be caused by multiple dummy holes DH provided in the dummy pattern portion DP.

[0099] As one embodiment, the dummy pattern portion DP of the mask 1200 may include a plurality of dummy holes DH, which have a different shape on the plane from the plurality of deposited holes AH of the deposited pattern portion AP. For example, as... Figure 4 and Figure 5 As shown, each dummy hole DH can have an hourglass shape. That is, each dummy hole DH can have a shape formed by an equilateral trapezoid and an inverted equilateral trapezoid meeting each other at one corner. Furthermore, a portion of the dummy holes DH can also have an inverted equilateral trapezoid shape depending on their position.

[0100] Such a virtual hole DH can be understood as being formed by intersecting first ribs R1 and second ribs R2. The first rib R1 can extend entirely in the x-direction and in a zigzag pattern. That is, the first rib R1 can include a first part and a second part that form a predetermined angle with each other, and the first part and the second part can be arranged alternately in the x-direction. The second rib R2 can extend in the y-direction.

[0101] If a tensile force in the ±x direction is applied to the dummy pattern portion DP, the first rib R1 tends to unfold into a straight line. That is, the angle between the first and second parts of the first rib R1 can change. Accordingly, the second rib R2 can shift in the ±y direction. As a result of this action, the dummy pattern portion DP as a whole has a tensile structure.

[0102] Figure 6a and Figure 6b These are enlarged plan views showing the structure of the dummy pattern portion provided with a mask according to another embodiment of the present invention.

[0103] Reference Figure 6a and Figure 6b The dummy hole DH of the dummy pattern section DP can be formed by ribs extending in various directions. The ribs that intersect each other can have a predetermined angle. Figure 5 Similar to the dummy pattern section DP, if a tensile force in the ±x direction is applied to the dummy pattern section DP, the angle between the intersecting ribs changes. Accordingly, some ribs can shift in the ±y direction. As a result of this action, the dummy pattern section DP as a whole has a tensile structure.

[0104] in addition, Figure 6a and Figure 6b The tectonic structure of the dummy pattern portion DP shown is merely exemplary, and the present invention is not limited thereto. Any structure can be used as long as it is a tectonic structure with a negative Poisson's ratio.

[0105] Figure 7a and Figure 7b This is a simulated image showing the deformation of the mask when a tensile force is applied to the mask according to the comparative example. Figure 8a and Figure 8b This is a simulated image showing the deformation of a mask when a tensile force is applied to it according to an embodiment of the present invention. Figure 7a , Figure 7b , Figure 8a and Figure 8b The results of simulations performed under the same conditions are shown.

[0106] First, refer to Figure 7a and Figure 7b The comparative mask 1200-C does not include a tensile structure. Generally, mask 1200-C may have a very thin thickness compared to its length and / or width. Therefore, if mask 1200-C is stretched along a direction (e.g., ±x direction), undesirable curling and / or wrinkling may form on mask 1200-C due to internal stress. Such curling and wrinkling may indicate partial displacement of mask 1200-C in a thickness direction (e.g., ±z direction) perpendicular to the stretching direction (i.e., ±x direction).

[0107] As mentioned above, the curling formed on mask 1200-C may interfere with the connection between mask 1200-C and mask frame 1100 (see reference). Figure 2 They must be precisely aligned and attached to each other. Furthermore, wrinkles formed on mask 1200-C may prevent mask 1200-C from adhering tightly to mask frame 1100. If a mask assembly 1000 including such mask 1200-C (see reference...) is used... Figure 2 If this occurs, poor deposition may result.

[0108] Reference Figure 8a and Figure 8b According to an embodiment of the present invention, the mask 1200 includes the above-described tensile structure, thereby reducing curling and wrinkling. Figure 7a In the case of the comparative example mask 1200-C, the maximum displacement in the z-direction is 0.027 μm, conversely, Figure 8a The maximum displacement of the mask 1200 in the z-direction is 0.014 μm. That is, according to an embodiment of the present invention, it can be confirmed that when the mask 1200 is stretched, the maximum displacement of the mask 1200 in the z-direction is reduced by about 48.3% compared with the comparative example.

[0109] As described above, by reducing the formation of curls and wrinkles in the mask 1200, a mask assembly 1000 and a manufacturing apparatus 1 for a display device that can ultimately be precisely deposited can be provided.

[0110] Figure 9 This is an enlarged plan view schematically illustrating a portion of a mask provided in a manufacturing apparatus for a display device according to another embodiment of the present invention. References to the preceding text are omitted. Figure 4 The following explanation focuses on the differences between the repeated descriptions.

[0111] Reference Figure 9 The deposition pattern portion AP of the mask 1200 may include a first deposition hole AH1 and a second deposition hole AH2 having shapes on different planes from each other.

[0112] As one embodiment, the second deposition aperture AH2 can be arranged adjacent to one of the plurality of dummy apertures DH of the dummy pattern portion DP. For example, the second deposition aperture AH2 can be arranged on the outermost side of the deposition pattern portion AP. Multiple second deposition apertures AH2 can be provided, and the multiple second deposition apertures AH2 can be arranged along the edge of the deposition pattern portion AP on the outermost side of the deposition pattern portion AP. Since the deposition pattern portion AP and the dummy pattern portion DP are connected to each other in a plane, the second deposition aperture AH2 can be adjacent to one dummy aperture DH.

[0113] As one embodiment, the second deposition aperture AH2 can be equipped with a shape corresponding to the shape of the dummy aperture DH in such a way that the width w between the second deposition aperture AH2 and the dummy aperture DH is constant in the plane. That is, the width w between adjacent second deposition apertures AH2 and dummy aperture DH can be constant.

[0114] By using the shape and arrangement of the second deposition aperture AH2 as described above, the thickness of the rib R of the dummy aperture DH forming the dummy pattern portion DP can be uniformly formed near the boundary between the dummy pattern portion DP and the deposition pattern portion AP. Accordingly, a more uniform and better tumbling structure of the dummy pattern portion DP can be formed, thus minimizing the curl and / or wrinkles that may form on the mask 1200.

[0115] Figure 10 This is a schematic plan view of a mask according to another embodiment of the present invention. References to the preceding text are omitted. Figure 3 The following explanation focuses on the differences between the repeated descriptions.

[0116] Reference Figure 10 The dummy pattern portion DP of the mask 1200 can partially surround the deposited pattern portion AP on a plane. As an embodiment, the dummy pattern portion DP can be located between adjacent deposited pattern portions AP. That is, the dummy pattern portion DP can be located in the gap region between adjacent deposited pattern portions AP. Accordingly, in order to maximize the occupied area of ​​the deposited pattern portion AP, the occupied area of ​​the dummy pattern portion DP can be minimized, while minimizing the occurrence of curling and wrinkling. This is because curling and wrinkling of the mask 1200 are more likely to occur the further away from the third region AR3 of the mask 1200 or the closer to the central region of the mask 1200.

[0117] As one embodiment, the dummy pattern portion DP' of the mask 1200 can be located between the end EP of the mask 1200 that intersects the longitudinal direction (e.g., the x-direction) and the deposited pattern portion AP. In this case, the dummy pattern portion DP' can have a rectangular shape extending laterally (y-direction) in a plane that intersects the longitudinal direction (x-direction) of the mask 1200. As a partial embodiment, the dummy pattern portion DP' can be located in the first region AR1 and can be arranged adjacent to the outer side of the deposited pattern portion AP. For example, the dummy pattern portion DP' can be arranged adjacent to one side of the first deposited pattern portion AP1 or the nth deposited pattern portion APn that is closest to the two end ends EP of the mask 1200. Although Figure 10 Not shown in the figure, but as another embodiment, the dummy pattern portion DP' may also be located in the second region AR2 and / or the third region AR3.

[0118] Figure 11This is a perspective view schematically illustrating a display device manufactured using a display device manufacturing apparatus according to an embodiment of the present invention.

[0119] Reference Figure 11 The display device 2 may include a display area DA and a peripheral area PA located outside the display area DA. The display device 2 can provide an image by means of an array of multiple pixels PX arranged in two dimensions in the display area DA.

[0120] A pixel PX can be defined as an area in the display area DA where a light-emitting element emits light. Each pixel PX can emit light of a predetermined color. For example, a pixel PX can emit red, green, or blue light, or it can emit red, green, blue, or white light. Furthermore, pixel circuitry that drives the light-emitting element can be arranged in the display area DA.

[0121] The peripheral area PA, which does not provide an image, can completely or partially surround the display area DA. Drivers, wiring, etc., for providing electrical signals or power to the pixel circuits can be arranged in the peripheral area PA. Pads for electrically connected electronic components, printed circuit boards, etc., can also be arranged in the peripheral area PA.

[0122] Furthermore, the display device 2 can be used as a display screen for various products such as mobile phones, smartphones, tablet personal computers, mobile communication terminals, electronic notebooks, e-books, portable multimedia players (PMPs), navigators, ultra-portable mobile PCs (UMPCs), televisions, laptops, monitors, billboards, and Internet of Things (IoT) devices. Moreover, according to one embodiment, the display device 2 can be used for wearable devices such as smartwatches, watch phones, glasses-type displays, and head-mounted displays (HMDs). Furthermore, according to one embodiment, the display device 2 can be used as a car dashboard and center fascia, or as a center information display (CID) arranged on a dashboard, as a room mirror display replacing a rearview mirror, or as a display screen arranged on the back of the front seats as a rear-seat entertainment device.

[0123] Figure 12 This is a schematic cross-sectional view of a display device manufactured using a display device manufacturing apparatus according to an embodiment of the present invention, and can correspond to the view along... Figure 11 A cross-section of the display device cut along line XII-XII'.

[0124] Reference Figure 12 The display device 2 may include a stacked structure of substrate 100, pixel circuit layer PCL, display layer DISL, and encapsulation layer 300.

[0125] The substrate 100 can be a multilayer structure comprising a base layer containing a polymer resin and an inorganic layer. For example, the substrate 100 may include a barrier layer comprising a base layer containing a polymer resin and an inorganic insulating layer. For example, the substrate 100 may include a first base layer 101, a first barrier layer 102, a second base layer 103, and a second barrier layer 104 stacked sequentially. The first base layer 101 and the second base layer 103 may include polyimide (PI), polyethersulfone (PES), polyarylate, polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polycarbonate (PC), cellulose triacetate (TAC), and / or cellulose acetate propionate (CAP). The first barrier layer 102 and the second barrier layer 104 may comprise inorganic insulators such as silicon oxide, silicon oxynitride, and / or silicon nitride. The substrate 100 may have flexible properties.

[0126] A pixel circuit layer PCL may be disposed on the substrate 100. The pixel circuit layer PCL may include pixel circuits PC. As an example, Figure 12 The illustration shows a cross-section of a portion of the pixel circuit PC. The pixel circuit PC may include at least one thin-film transistor (TFT) and at least one storage capacitor (Cst). The pixel circuit layer PCL may include the pixel circuit PC and buffer layer 111, first gate insulating layer 112, second gate insulating layer 113, interlayer insulating layer 114, first planarization insulating layer 115, and second planarization insulating layer 116 disposed below and / or above the various elements constituting the pixel circuit PC.

[0127] The buffer layer 111 can reduce or block the penetration of foreign matter, moisture or external air from the lower part of the substrate 100, and can provide a flat surface on the substrate 100. The buffer layer 111 may include inorganic insulating materials such as silicon oxide, silicon oxynitride, or silicon nitride, and may be configured as a single layer or multiple layers including the above materials.

[0128] The thin-film transistor (TFT) on the buffer layer 111 may include a semiconductor layer Act, and the semiconductor layer Act may include polycrystalline silicon. Alternatively, the semiconductor layer Act may include amorphous silicon, or may include oxide semiconductors, or may include organic semiconductors, etc. The semiconductor layer Act may include a channel region C and a drain region D and a source region S respectively disposed on both sides of the channel region C. The gate electrode GE may overlap with the channel region C.

[0129] The gate electrode GE may include a low-resistance metallic material. The gate electrode GE may include a conductive material containing molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed as a multilayer or a single layer containing the above materials.

[0130] The first gate insulating layer 112 between the semiconductor layer Act and the gate electrode GE may include materials such as silicon oxide (SiO2) and silicon nitride (SiN). X ), silicon nitride oxide (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO) X Inorganic insulating materials such as zinc oxide (ZnO). X It can be ZnO and / or ZnO2.

[0131] The second gate insulating layer 113 may be configured to cover the gate electrode GE. Similar to the first gate insulating layer 112, the second gate insulating layer 113 may include materials such as silicon oxide (SiO2) and silicon nitride (SiN). X ), silicon nitride oxide (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO) X Inorganic insulating materials such as zinc oxide (ZnO). X It can be ZnO and / or ZnO2.

[0132] An upper electrode Cst2 of a storage capacitor Cst can be disposed on the upper part of the second gate insulating layer 113. The upper electrode Cst2 can overlap with the gate electrode GE below it. In this case, the gate electrode GE and the upper electrode Cst2, which overlap with the second gate insulating layer 113, can form the storage capacitor Cst. That is, the gate electrode GE can function as the lower electrode Cst1 of the storage capacitor Cst.

[0133] As described above, the storage capacitor Cst can be formed overlapping the thin-film transistor TFT. In some embodiments, the storage capacitor Cst can also be formed without overlapping the thin-film transistor TFT.

[0134] The upper electrode Cst2 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W) and / or copper (Cu), and may be a single layer or multiple layers of the above materials.

[0135] Interlayer insulating layer 114 may cover the upper electrode Cst2. Interlayer insulating layer 114 may include materials such as silicon oxide (SiO2) and silicon nitride (SiN). X ), silicon nitride oxide (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO) X Zinc oxide (ZnO), etc. X The inorganic insulating layer 114 can be ZnO and / or ZnO2. The interlayer insulating layer 114 can be a single layer or multiple layers containing the above-mentioned inorganic insulating material.

[0136] The drain electrode DE and source electrode SE can be located on the interlayer insulating layer 114. The drain electrode DE and source electrode SE can be connected to the drain region D and source region S respectively through contact holes formed in the insulating layer beneath them. The drain electrode DE and source electrode SE can include materials with good conductivity. The drain electrode DE and source electrode SE can include conductive materials containing molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and can be formed as a multilayer or a single layer including the above materials. As an embodiment, the drain electrode DE and source electrode SE can have a Ti / Al / Ti multilayer structure.

[0137] The first planarization insulating layer 115 may cover the drain electrode DE and the source electrode SE. A contact metal CM may be disposed on the first planarization insulating layer 115. The contact metal CM may include a conductive material comprising molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed as a multilayer or a single layer containing the aforementioned materials. A second planarization insulating layer 116 may be disposed on the first planarization insulating layer 115 and may cover the contact metal CM.

[0138] The first planarization insulating layer 115 and the second planarization insulating layer 116 may comprise organic insulating materials such as general-purpose polymers such as polymethyl methacrylate (PMMA) or polystyrene (PS), polymer derivatives having phenolic groups, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluorine polymers, p-xylene polymers, vinyl alcohol polymers, and mixtures thereof.

[0139] A display layer (DISL) can be disposed on the pixel circuit layer (PCL) having the above structure. The display layer (DISL) may include an organic light-emitting diode (OLED) as the light-emitting element. The OLED may include a stacked structure of pixel electrode 210, intermediate layer 220, and counter electrode 230. The OLED may emit red, green, or blue light, or red, green, blue, or white light. The OLED can emit light through a light-emitting region, and the light-emitting region can be defined as a pixel (PX).

[0140] The pixel electrode 210 of the organic light-emitting diode (OLED) can be electrically connected to the thin-film transistor (TFT) through contact holes formed in the second planarization insulating layer 116 and the first planarization insulating layer 115 and contact metal CM disposed on the first planarization insulating layer 115.

[0141] Pixel electrode 210 may include a conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), or aluminum zinc oxide (AZO). As another embodiment, pixel electrode 210 may include a reflective film comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or compounds thereof. As yet another embodiment, pixel electrode 210 may also include a film formed using ITO, IZO, ZnO, or In2O3 above / below the aforementioned reflective film.

[0142] A pixel defining film 117 with an aperture 117H exposing the center portion of the pixel electrode 210 may be disposed on the pixel electrode 210. The pixel defining film 117 may include organic and / or inorganic insulators. The aperture 117H may define the light-emitting region of light emitted from the organic light-emitting diode (OLED). For example, the size / width of the aperture 117H may correspond to the size / width of the light-emitting region. Therefore, the size and / or width of the pixel PX may depend on the size and / or width of the aperture 117H of the corresponding pixel defining film 117.

[0143] The intermediate layer 220 may include a light-emitting layer 222 formed in a manner corresponding to the pixel electrode 210. The light-emitting layer 222 may include a high- or low-molecular-weight organic material that emits light of a predetermined color. Alternatively, the light-emitting layer 222 may include an inorganic light-emitting material or may include quantum dots.

[0144] As one embodiment, the intermediate layer 220 may include a first functional layer 221 and a second functional layer 223 respectively disposed below and above the light-emitting layer 222. The first functional layer 221 may include, for example, a hole transport layer (HTL), or may include a hole transport layer and a hole injection layer (HIL). The second functional layer 223, as a component disposed on the light-emitting layer 222, may include an electron transport layer (ETL) and / or an electron injection layer (EIL). Similar to the counter electrode 230 described later, the first functional layer 221 and / or the second functional layer 223 may be a common layer formed to cover the entire substrate 100.

[0145] The counter electrode 230 can be disposed on and overlapped with the pixel electrode 210. The counter electrode 230 can be constructed using a conductive material with a low work function. For example, the counter electrode 230 may include a (semi-)transparent layer comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), or alloys thereof. Alternatively, the counter electrode 230 may also include a layer such as ITO, IZO, ZnO, or In2O3 on the (semi-)transparent layer comprising the aforementioned materials. The counter electrode 230 can be integrally formed to cover the entire substrate 100.

[0146] The encapsulation layer 300 can be disposed on and cover the display layer DISL. The encapsulation layer 300 includes at least one inorganic encapsulation layer and at least one organic encapsulation layer. As one embodiment, Figure 12 The illustration shows that the encapsulation layer 300 includes a first inorganic encapsulation layer 310, an organic encapsulation layer 320 and a second inorganic encapsulation layer 330 stacked in sequence.

[0147] The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may include one or more inorganic materials selected from aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon nitride. The organic encapsulation layer 320 may include a polymer-based material. Polymer-based materials may include acrylic resins, epoxy resins, polyimides, and polyethylene, etc. As an embodiment, the organic encapsulation layer 320 may include acrylate. The organic encapsulation layer 320 may be formed by curing monomers or coating a polymer. The organic encapsulation layer 320 may be transparent.

[0148] According to an embodiment of the present invention, it is possible to utilize Figure 1 The display device manufacturing apparatus 1 precisely forms a predetermined pattern layer that is fitted onto the display device 2. For example, the formation of the light-emitting layer 222 can be achieved using... Figure 1 Manufacturing apparatus 1 for a display device.

[0149] While the display device 2 has been described so far as to include an organic light-emitting diode (OLED) as the light-emitting element, the display device 2 of the present invention is not limited thereto as long as it includes a predetermined patterned layer containing organic matter. As another embodiment, the display device 2 may be a light-emitting display device including an inorganic light-emitting diode (i.e., an inorganic light-emitting display). As yet another embodiment, the display device 2 may be a quantum dot light-emitting display.

[0150] The present invention has been described above with reference to the embodiments shown in the accompanying drawings, but these are merely exemplary. Anyone skilled in the art will understand that the invention can be modified in various ways and can achieve other equivalent embodiments. Therefore, the true scope of protection of the present invention should be determined based on the technical concept of the appended claims.

Claims

1. A mask, comprising: The deposition pattern section is equipped with multiple deposition pores that allow the deposited material to pass through; A dummy pattern section is arranged outside the deposited pattern section. The dummy pattern portion includes an expansion structure with a negative Poisson's ratio. The dummy pattern portion is equipped with a plurality of dummy holes, which have a different shape on the plane than the plurality of deposition holes in the deposition pattern portion. The deposition pattern portion includes a first deposition aperture and a second deposition aperture having shapes different from each other on a plane, each of the second deposition apertures being arranged adjacent to one of the plurality of dummy apertures of the dummy pattern portion. Each of the second deposition holes is equipped with a shape corresponding to the shape of the adjacent dummy hole in such a way that the width between each of the second deposition holes and the adjacent dummy hole having the taut structure is constant in the plane.

2. The mask according to claim 1, wherein, The dummy hole is formed by intersecting first and second ribs. The first rib includes a first part and a second part that form a predetermined angle with each other, and the first part and the second part are arranged alternately along a first direction.

3. The mask according to claim 1, wherein, The dummy pattern portion surrounds the entire deposited pattern portion on the plane.

4. The mask according to claim 1, wherein, The dummy pattern portion partially surrounds the deposited pattern portion on the plane.

5. The mask according to claim 4, wherein, The deposition pattern section is equipped with multiple parts. The dummy pattern portion is located between the deposited pattern portions that are adjacent to each other on the plane.

6. The mask according to claim 4, wherein, The dummy pattern portion is located on the plane between the end of the mask that intersects with the longitudinal direction and the deposited pattern portion.

7. A mask assembly, comprising: Mask frame, equipped with openings; as well as A mask is disposed on the mask frame and includes a deposited pattern portion arranged to overlap with the opening and a dummy pattern portion disposed outside the deposited pattern portion. The dummy pattern portion includes an axially oriented structure with a negative Poisson's ratio. The deposition pattern section is equipped with multiple deposition holes. The dummy pattern portion is equipped with a plurality of dummy holes, which have a different shape on the plane than the plurality of deposition holes in the deposition pattern portion. The deposition pattern portion includes a first deposition aperture and a second deposition aperture having shapes different from each other on a plane, each of the second deposition apertures being arranged adjacent to one of the plurality of dummy apertures of the dummy pattern portion. Each of the second deposition holes is equipped with a shape corresponding to the shape of the adjacent dummy hole in such a way that the width between each of the second deposition holes and the adjacent dummy hole having the taut structure is constant in the plane.

8. The mask assembly according to claim 7, wherein, The dummy hole is formed by intersecting first and second ribs. The first rib includes a first part and a second part that form a predetermined angle with each other, and the first part and the second part are arranged alternately along a first direction.

9. The mask assembly according to claim 7, wherein, The dummy pattern portion surrounds the entire deposited pattern portion on the plane.

10. The mask assembly according to claim 7, wherein, The dummy pattern portion partially surrounds the deposited pattern portion on the plane.

11. The mask assembly of claim 10, wherein, The deposited pattern portions are configured in multiple ways and arranged along a first direction. The dummy pattern portion is located between two adjacent deposition pattern portions among the plurality of deposition pattern portions.

12. An apparatus for manufacturing a display device, comprising: The chamber contains a display substrate. A deposition source is disposed inside the chamber to supply deposition material to the interior of the chamber; as well as A mask assembly is disposed between the display substrate and the deposition source, allowing the deposited material to pass through. The mask assembly includes: Mask frame, equipped with openings; and A mask is disposed on the mask frame and includes a deposited pattern portion arranged to overlap with the opening and a dummy pattern portion disposed outside the deposited pattern portion. The dummy pattern portion includes an axially oriented structure with a negative Poisson's ratio. The deposition pattern section includes a first deposition hole and a second deposition hole having shapes on different planes from each other. The dummy pattern portion is equipped with dummy holes, which have a shape on a different plane than the first deposition hole and the second deposition hole. Each of the second deposition holes is arranged adjacent to one of the plurality of dummy holes in the dummy pattern portion. Each of the second deposition holes is equipped with a shape corresponding to the shape of the adjacent dummy hole in such a way that the width between each of the second deposition holes and the adjacent dummy hole having the taut structure is constant in the plane.

13. The manufacturing apparatus for the display device according to claim 12, wherein, The dummy hole is formed by intersecting first and second ribs. The first rib includes a first part and a second part that form a predetermined angle with each other, and the first part and the second part are arranged alternately along a first direction.

14. The manufacturing apparatus for a display device according to claim 12, wherein, The dummy pattern portion surrounds the entire deposited pattern portion on the plane.

15. The manufacturing apparatus for a display device according to claim 12, wherein, The deposition pattern section is equipped with multiple parts. The dummy pattern portion partially surrounds the deposited pattern portion on the plane and is located between adjacent deposited pattern portions.

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