IGBT application circuit for heating device and control method thereof

Abstract

The application discloses an IGBT application circuit for a heating device and a control method thereof; the IGBT application circuit comprises a power supply circuit, an IGBT driving circuit connected with the power supply circuit, and a heating element connected with the IGBT driving circuit; further comprising a radiator connected with an IGBT chip of the IGBT driving circuit; the radiator is further fixed with a bimetallic temperature switch, a fan corresponding to the radiator in wind direction, and the fan is electrically connected with the power supply circuit through the bimetallic temperature switch; or, the radiator is further fixed with a temperature sensor electrically connected with a temperature control circuit, the fan corresponding to the radiator in wind direction, and the fan is electrically connected with the power supply circuit through the temperature control circuit. The fan is started only when the temperature of the radiator rises to a set value, heat can be effectively dissipated, thereby saving power and saving cost for users. An open slot is arranged at the bottom of the shell of the heating device, the radiator exchanges heat with air outside the heating device through the open slot, and better heat dissipation efficiency can be achieved.

Description

Technical Field

[0001] This invention relates to an IGBT application circuit for heating equipment, and more specifically, to an IGBT application circuit for heating equipment and its control method. Background Technology

[0002] Most cooking appliances (such as rice cookers and induction cookers) currently use IGBTs and other power transistors to drive the heating elements. However, IGBT power transistors generate significant heat, and the cooking appliances themselves also generate heat. Due to their compact structure, the heat from the cooking appliances easily transfers to the vicinity of the IGBTs and other power transistors. Therefore, heat sinks are needed to reduce the operating temperature of the IGBT chips. Since the IGBT chips are fixed to a PCB board, which is often installed inside the cooking appliance, the IGBT chips often reach high temperatures, making them prone to burning out. To address this, some manufacturers have increased the size of the heat sinks. For example, patent application CN201510647279.7 provides a large heat sink whose dimensions exceed the size of the PCB board, increasing both raw material costs and the product's perceived importance.

[0003] It is evident that the IGBT application circuits used in cooking equipment need to be innovated to improve heat dissipation, ensuring stable use and lifespan of the product, while also reducing product and operating costs. Summary of the Invention

[0004] The purpose of this invention is to address the aforementioned problems in the prior art by providing an IGBT application circuit and its control method for heating equipment.

[0005] The objective of this invention is achieved through the following technical solutions:

[0006] This invention relates to an IGBT application circuit for heating equipment, comprising a power supply circuit, an IGBT drive circuit connected to the power supply circuit, and a heating element connected to the IGBT drive circuit; it also includes a heat sink connected to the IGBT chip of the IGBT drive circuit; the heat sink is further equipped with a bimetallic temperature switch, with the airflow direction corresponding to the fan of the heat sink, and the fan is electrically connected to the power supply circuit through the bimetallic temperature switch; or, the heat sink is further equipped with a temperature sensor electrically connected to a temperature control circuit, with the airflow direction corresponding to the fan of the heat sink, and the fan is electrically connected to the power supply circuit through the temperature control circuit.

[0007] Preferably, the circuit further includes a microcontroller connected to the power supply circuit, control buttons and a display screen connected to the microcontroller; the microcontroller also has an output terminal connected to the IGBT drive circuit.

[0008] Preferably, when a bimetallic temperature switch is used, the bimetallic temperature switch has two normally open contacts, which are connected when the set temperature is exceeded; the set temperature is 25-55 degrees Celsius.

[0009] Preferably, when a temperature sensor is used, the temperature sensor is a thermocouple or a resistance temperature detector (RTD) inserted into the heat sink.

[0010] Preferably, the bottom of the housing of the heating device is provided with an opening groove, the opening groove extends upward and the heat sink is fixed thereon, the heat sink is a metal plate with at least one U-shaped groove with an upward opening, the U-shaped groove is used to accommodate and tightly fit the IGBT chip; a circuit board connected to the housing is fixed above the opening groove, and the IGBT chip is fixed on the lower side of the circuit board.

[0011] Preferably, end caps are fixedly connected to both ends of the metal plate.

[0012] Preferably, the metal plate is further fixedly provided with a bottom cover to form a sealed cavity, the sealed cavity being filled with a phase change energy storage material; the phase change energy storage material has a crystallization temperature of 20-25 degrees and a melting temperature of 27-32 degrees.

[0013] Preferably, the phase change energy storage material includes borax, sodium sulfate decahydrate, sodium chloride, and sodium carboxymethyl cellulose.

[0014] The present invention discloses a heating device comprising a housing with an opening slot at the bottom, wherein a heat sink is fixedly attached to the opening slot extending upward, the heat sink being a metal plate with at least one U-shaped groove facing upward, the U-shaped groove being used to accommodate and tightly fit a power chip (such as an IGBT chip) of a driving circuit; a circuit board connected to the housing is fixedly disposed above the opening slot, and the power chip is fixedly disposed on the lower side of the circuit board.

[0015] Preferably, a seal is provided at the connection between the opening slot and the metal plate to achieve a sealed connection. This prevents humid or oily air from entering from the bottom and contaminating the heating equipment, which could lead to circuit board failure. The housing of the heating equipment also has heat dissipation holes (including air inlets and outlets), which are located on the sides of the upper part of the housing.

[0016] Preferably, these heat dissipation holes are located at the bottom of the handle fixing part of the heating device and are oriented vertically, allowing air to enter or exit, but preventing water from seeping in when water is poured from top to bottom.

[0017] Preferably, the air inlet is located below the front control panel of the heating device and is equipped with a filter to filter oil fumes, making it easy to replace and adapting the heating device to kitchen environments with oil fumes. The air outlet is located at the lower rear of the heating device, such as above the opening of the water collection box. This conceals it, prevents water from entering, and allows the blown air to dry the water collection box. The fan is installed inside the housing, with the airflow directed towards the rear of the heating device. To create an airflow channel, a flat air duct is provided between the air outlet and the circuit board. The air outlet itself is also flat, facilitating connection with the cavity below the circuit board.

[0018] Preferably, in order to adapt to higher ambient temperatures, two folds can be made at the lower end of the metal plate to form a suspension cavity, into which a plastic block containing refrigerant can be placed to reduce the temperature of the internal IGBT chip and other components.

[0019] Preferably, the refrigerant block made of phase change energy storage material adopts a snap-fit ​​structure and is snapped into the downward-facing cavity of the metal plate. During use, different amounts of refrigerant blocks can be installed according to the length of time. This structure is suitable for commercial heating equipment, such as heating equipment in restaurants and hotels, which require more refrigerant blocks for long-term use.

[0020] Preferably, a rotary structure is used to place the refrigerant blocks. Generally, there can be two to three refrigerant blocks, of which only one refrigerant block corresponds to the metal plate. The other refrigerant blocks make full use of the surrounding air to dissipate heat while waiting to be used, and remain in a crystalline state.

[0021] The control method of the heating device of the present invention adopts the aforementioned IGBT application circuit, and selects a phase change energy storage material with a crystallization temperature 0-5 degrees higher than the common ambient temperature according to the common ambient temperature of the heating device; the set temperature of the bimetallic temperature switch or the temperature control circuit is 0-5 degrees higher than the melting temperature of the phase change energy storage material.

[0022] Preferably, when using the heating device, the power supply circuit is kept connected to an external power source, and the power supply circuit is provided with a separate fan power supply line to supply DC or AC power to the fan.

[0023] Compared with existing technologies, the advantages of this invention are as follows: Because it incorporates a bimetallic temperature switch or temperature sensor, the fan only activates when the radiator temperature reaches a set value, effectively dissipating heat. When the heating device's power consumption is low and the heat generation is minimal, the radiator can maintain a low temperature, eliminating the need for the fan and saving power and operating costs for the user. Furthermore, an opening slot is provided at the bottom of the heating device's housing, and the radiator is positioned within this slot, allowing heat exchange between the other side of the radiator and the air outside the heating device, achieving even better heat dissipation efficiency and reducing reliance on the fan. Additionally, a sealed cavity is provided within the radiator, filled with phase change energy storage material. This material can absorb a large amount of heat during its phase change process; therefore, the fan does not need to be activated during short-term use of the heating device. Even during long-term use, the IGBT chip can be kept at a low temperature, ensuring the IGBT's reliability and lifespan. Attached Figure Description

[0024] Figure 1 This is a circuit block diagram of a specific embodiment of the IGBT application circuit for heating equipment according to the present invention;

[0025] Figure 2 This is a circuit block diagram of a specific embodiment two of the IGBT application circuit for heating equipment according to the present invention;

[0026] Figure 3 This is a bottom cross-sectional view and a partial enlarged view of the heating device according to a specific embodiment three of the IGBT application circuit for heating devices of the present invention;

[0027] Figure 4 for Figure 3 A schematic diagram of the heat sink structure in the embodiment;

[0028] Figure 5 This is a bottom cross-sectional view and a partial enlarged view of the heating device according to a specific embodiment four of the IGBT application circuit for heating devices of the present invention;

[0029] Figure 6 for Figure 5 A schematic diagram of the heat sink structure in the embodiment;

[0030] Figure 7 This is a schematic diagram of the refrigerant block with a U-shaped structure used in the heating device of the present invention;

[0031] Figure 8 This is a schematic diagram of the refrigerant block with a planar structure used in the heating device of the present invention.

[0032] Figure Labels

[0033] 11 Power supply circuit 12 IGBT drive circuit

[0034] 13 Heating element 14 Bimetallic temperature switch

[0035] 15 Fans 16 Microcontrollers

[0036] 17 Control buttons 18 Display screen

[0037] 19 Temperature control circuit 21 Heat sink

[0038] 30 Housing 31 Opening slot

[0039] 32 Metal plate 33 Bottom cover

[0040] 34 Sealed cavity 41 Circuit board

[0041] 191 Temperature sensor 319 Reinforcement section

[0042] 321 U-shaped groove 322 End cap

[0043] 411 IGBT chip 412 Fan Detailed Implementation

[0044] The technical solution of the present invention will be clearly and completely described below through the following embodiments. Obviously, the embodiments described below are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0045] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0046] It should also be understood that the terminology used in this specification of embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to limit the embodiments of the invention. As used in this specification of embodiments of the invention and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0047] like Figure 1The first embodiment shown in the present invention is an IGBT application circuit for a heating device, including a power supply circuit 11, an IGBT drive circuit 12 connected to the power supply circuit 11, and a heating element 13 connected to the IGBT drive circuit 12; it also includes a heat sink 21 connected to the IGBT chip of the IGBT drive circuit 12; the heat sink 21 is also fixed with a bimetallic temperature switch 14, and a fan 15 with the airflow direction corresponding to the heat sink 21 is electrically connected to the power supply circuit 11 through the bimetallic temperature switch 14.

[0048] More specifically, it also includes a microcontroller 16 connected to the power supply circuit 11, a control button 17 and a display screen 18 connected to the microcontroller 16; the microcontroller 16 also has an output terminal connected to the IGBT drive circuit 12. More specifically, the bimetallic temperature switch 14 has two normally open contacts, which conduct when the set temperature is exceeded; the set temperature is 25-55 degrees Celsius. That is, it is open at room temperature, and only conducts when the temperature exceeds the set value, so that the fan works.

[0049] like Figure 2 The second embodiment shown differs from the first embodiment in that: the radiator 21 is further equipped with a temperature sensor 191 electrically connected to the temperature control circuit 19, and the fan 15, whose airflow direction corresponds to that of the radiator 21, is electrically connected to the power supply circuit 11 through the temperature control circuit 19. More specifically, the temperature sensor is a thermocouple or a resistance temperature detector (RTD), which is inserted into the radiator.

[0050] like Figures 3 to 4 In the third embodiment shown, the heating device has an opening groove 31 at the bottom of its housing 30. A heat sink is fixedly attached to the opening groove 31 extending upwards. The heat sink is a metal plate 32 with at least one upward-facing U-shaped groove 321, which is used to accommodate and tightly fit the IGBT chip 411. A circuit board 41 connected to the housing 30 is fixedly attached above the opening groove 31, and the IGBT chip 411 and a fan 412 are fixedly attached to the lower side of the circuit board 41. In mass production, the metal plate 32 can be processed using a stretching forming process. More specifically, end caps 322 are also fixedly connected to both ends of the metal plate 32.

[0051] In other embodiments, end caps may be omitted, and side plates may be provided on the sides of the opening slot to form a structure that closes the ends of the metal plate. More specifically, the side plates at both ends may be beveled to form a downward-facing V-shape, creating a tight fit with the upward-moving metal plate during installation. More specifically, the IGBT chip is a plate-like structure with at least one heat dissipation surface, preferably two. More specifically, the circuit board is fixed to the inner surface of the bottom of the housing by screws or other means, and the IGBT chip and the metal plate form surface contact after installation.

[0052] More specifically, the metal plate has at least three U-shaped grooves: one upper U-shaped groove with its opening facing upwards to accommodate the IGBT chip, and two lower U-shaped grooves 328 with their openings facing downwards. These three U-shaped grooves are adjacent to each other, firstly to facilitate forming, and secondly to create springback space for the upper U-shaped groove to accommodate processing errors in the metal plate. More specifically, a thermocouple or resistance temperature detector (RTD) is provided at the bottom of the upper U-shaped groove; alternatively, a bimetallic switch 14 is provided at the end of the metal plate furthest from the fan.

[0053] More specifically, the lower ends of the metal plate are connected to the opening of the slot by snap-fit ​​or screw connection to achieve a fixed connection. More specifically, the opening of the slot also extends upward to provide a reinforcing part 319 to increase strength and facilitate screw connection or snap-fit ​​connection.

[0054] More specifically, a seal is provided at the connection between the opening slot and the metal plate to achieve a sealed connection. This prevents humid or oily air from entering from the bottom and contaminating the heating equipment, thus preventing circuit board failure. The heating equipment housing also has heat dissipation holes (including air inlets and outlets), which are located on the sides of the upper part of the housing. More preferably, these heat dissipation holes are located at the bottom of the handle fixing part of the heating equipment and are oriented vertically, allowing air to enter or exit, but preventing water from seeping in when pouring water from top to bottom. More specifically, the air inlet is located below the front control panel of the heating equipment and is equipped with a filter screen for filtering oil fumes, which is also easy to replace, making the heating equipment more suitable for kitchen environments with oil fumes. The air outlet is located on the lower rear side of the heating equipment, such as above the opening of the water collection box, which is both hidden and difficult to find, prevents water from entering, and allows the blown air to dry the water collection box. At the same time, the fan is installed inside the housing, and the airflow direction must be towards the rear of the heating equipment. To create an airflow channel, a flat air outlet is provided between the air outlet and the circuit board. The air outlet is also flat, making it easy to connect with the cavity below the circuit board. To withstand higher ambient temperatures, two folds can be made at the bottom of the metal plate to form a suspension cavity, where a plastic block filled with refrigerant can be placed to reduce the temperature of the internal IGBT chips and other components.

[0055] More specifically, heating devices can be household kitchen appliances such as rice cookers, electric pressure cookers, electric frying pans, and induction cookers.

[0056] In other embodiments, when the fan has a high power and is not only used for heat dissipation of the IGBT chip, it may not be fixed to the circuit board, but fixed to the inner wall of the housing.

[0057] like Figures 5 to 6The fourth embodiment shown differs in that the metal plate 32 is also fixedly provided with a bottom cover 33 to form a sealed cavity 34, which is filled with a phase change energy storage material. The phase change energy storage material has a crystallization temperature of 20-25 degrees Celsius and a melting temperature of 27-32 degrees Celsius. More specifically, the phase change energy storage material includes materials such as borax, sodium sulfate decahydrate, sodium chloride, and sodium carboxymethyl cellulose, and can also be other known phase change energy storage materials. The crystallization temperature and melting temperature can be adjusted by varying the proportions of the various materials.

[0058] The present invention also discloses a heating device, which includes a housing with an opening groove at the bottom, and a heat sink is fixedly attached to the opening groove extending upward. The heat sink is a metal plate with at least one U-shaped groove facing upward. The U-shaped groove is used to accommodate and tightly fit a power chip (such as IGBT, MCT, IEGT, IGCT, IPEM chip, etc.) of a driving circuit. A circuit board connected to the housing is fixedly attached above the opening groove, and the power chip is fixedly attached to the lower side of the circuit board.

[0059] More specifically, a seal is provided at the connection between the opening slot and the metal plate to achieve a sealed connection. This prevents humid or oily air from entering from the bottom and contaminating the heating equipment, which could lead to circuit board failure. The housing of the heating equipment also has heat dissipation holes (including air inlets and outlets), which are located on the sides of the upper part of the housing.

[0060] More specifically, these heat dissipation holes are located at the bottom of the handle fixing part of the heating device and are oriented vertically, allowing air to enter or exit, but preventing water from seeping in when water is poured from top to bottom.

[0061] More specifically, the air inlet is located below the front control panel of the heating unit and is equipped with a filter to filter oil fumes. This filter is also easy to replace, making the heating unit more suitable for kitchen environments with oil fumes. The air outlet is located at the lower rear of the heating unit, for example, above the opening of the water collection box. This conceals it, preventing water from entering and allowing the blown air to dry the water collection box. The fan is installed inside the housing, and the airflow must be directed towards the rear of the heating unit. To create an airflow channel, a flat air duct is provided between the air outlet and the circuit board. The air outlet itself is also flat, facilitating connection with the cavity below the circuit board.

[0062] More specifically, in order to adapt to higher ambient temperatures, two folds can be made at the bottom of the metal plate to form a suspension cavity, into which a plastic block containing refrigerant can be placed to reduce the temperature of the internal IGBT chip and other components.

[0063] More specifically, the refrigerant blocks made of phase change energy storage materials adopt a snap-fit ​​structure, which is snapped into the downward-facing cavity of the metal plate. During use, refrigerant blocks of different sizes can be installed according to the length of time. This structure is suitable for commercial heating equipment, such as heating equipment in restaurants and hotels, which require more refrigerant blocks for long-term use.

[0064] More specifically, a rotary structure is used to place the refrigerant blocks. Generally, there can be two or three refrigerant blocks, one of which corresponds to the metal plate. The other refrigerant blocks make full use of the surrounding air to dissipate heat while waiting to be used, and remain in a crystalline state.

[0065] More specifically, the refrigerant block is made into a U-shaped structure, with its bottom center in close contact with a metal plate to achieve heat transfer. The metal plate 32 extends downwards, protruding from the housing 30. The bottom of the U-shaped refrigerant block 39 is heated by the heat from the metal plate, gradually melting, thus achieving internal heat transfer within the U-shaped refrigerant block. Furthermore, the upper edge of the U-shaped refrigerant block 39 extends to the air inlet and connects to a filter made of metal sheet. This allows the metal sheet to maintain a low temperature under the action of the refrigerant block, making it easier for the filter to absorb grease components in the air entering the air inlet. The filter can be made directly of metal mesh 51, or a layer of filter cloth 52 can be attached to the air inlet side of the metal mesh. This filter cloth can be removed at any time. Figure 7 As shown. In other embodiments, the refrigerant block 38 can also be made into a planar structure, with the air inlet located at the bottom. This also allows the metal sheet to maintain a low temperature under the action of the refrigerant block, making it easier for the filter to absorb the grease components in the air entering the air inlet. Figure 8 As shown.

[0066] Such heating equipment can save electricity and resources to the greatest extent, and is worth promoting.

[0067] This invention also discloses a control method for the heating device. Using the IGBT application circuit described in the preceding embodiments, a phase change energy storage material with a crystallization temperature 0-5 degrees Celsius higher than the ambient temperature is selected based on the commonly used ambient temperature of the heating device (generally set at 25 degrees Celsius). The set temperature of the bimetallic temperature switch or temperature control circuit is 0-5 degrees Celsius higher than the melting temperature of the phase change energy storage material. When the heating device is not in operation, the temperature of the phase change energy storage material is the same as the ambient temperature. When the heating device starts operating, the temperature of the IGBT chip is transferred to the sealed cavity, and the phase change energy storage material quickly reaches its crystallization temperature and then begins to melt gradually until it is completely melted. This phase change process attracts a large amount of heat, and the temperature rises slowly. The fan only starts operating after the melting temperature is exceeded to accelerate heat dissipation. For short-term heating, it is often not necessary to start the fan.

[0068] More specifically, when using the heating equipment, the power circuit is kept connected to an external power source, and the power circuit has a separate fan power supply line to supply DC or AC power to the fan.

[0069] In other embodiments, an ambient temperature detection step is added. When the ambient temperature exceeds the set value (for example, in a smart kitchen, the temperature can easily become too high when there is no human intervention), an auxiliary cooling step is required. This involves making two folds at the bottom of the metal plate to form a hanging cavity, and then placing a plastic block containing refrigerant (usually a plastic box filled with water, which is frozen in a refrigerator before use) inside to reduce the temperature of the internal IGBT chip and other components.

[0070] In other embodiments, since the operating time of the heating equipment varies each time, the refrigerant block made of phase change energy storage material can be used with a snap-fit ​​structure, clipping onto the downward-facing cavity of the metal plate. During use, different amounts of refrigerant blocks can be loaded depending on the duration of operation. This structure is suitable for commercial heating equipment, such as those in restaurants and hotels, which require more refrigerant blocks for extended use. Furthermore, a rotary structure (i.e., a refrigerant turntable rotatably connected to the outer bottom) can be used to hold the refrigerant blocks. Generally, two to three refrigerant blocks can be provided, with only one block corresponding to the metal plate. The other blocks, while awaiting use, utilize the surrounding air for heat dissipation, remaining in a crystalline state. During use, the user can be reminded to rotate the refrigerant turntable to change the position of the refrigerant blocks by detecting temperature changes or using a timer function.

[0071] In summary, this invention, by incorporating a bimetallic temperature switch or temperature sensor, activates the fan only when the radiator temperature reaches a set value, effectively dissipating heat. When the heating device's power consumption is low and the heat generation is minimal, the radiator's cooling can maintain a low temperature, eliminating the need for the fan and saving power, thus reducing operating costs for the user. Furthermore, the invention includes an opening slot at the bottom of the heating device's housing, with the radiator positioned within this slot. This allows for heat exchange between the other side of the radiator and the air outside the heating device, achieving even better heat dissipation efficiency and reducing reliance on the fan. Additionally, the radiator contains a sealed cavity filled with phase change energy storage material. This material absorbs a large amount of heat during its phase change process; therefore, the fan does not need to be activated during short-term use of the heating device. Even during long-term use, the IGBT chip remains at a low temperature, ensuring the IGBT's reliability and lifespan.

[0072] The above examples are merely illustrative of the technical content of the present invention to facilitate easier understanding by the reader, but do not imply that the implementation of the present invention is limited to these examples. Any technical extensions or re-creations made based on the present invention are protected by the present invention. The scope of protection of the present invention is defined by the claims.

Claims

1. A control method for heating equipment, characterized in that... The heating device uses an IGBT application circuit. The IGBT application circuit includes a power supply circuit, an IGBT drive circuit connected to the power supply circuit, and a heating element connected to the IGBT drive circuit; it also includes a heat sink connected to the IGBT chip of the IGBT drive circuit. The radiator is also equipped with a bimetallic temperature switch, and the airflow direction corresponds to the fan of the radiator. The fan is electrically connected to the power circuit through the bimetallic temperature switch. or, The radiator is also equipped with a temperature sensor that is electrically connected to the temperature control circuit. The fan that corresponds to the radiator is electrically connected to the power supply circuit through the temperature control circuit. It also includes a microcontroller connected to the power supply circuit, control buttons and a display screen connected to the microcontroller; the microcontroller also has an output terminal connected to the IGBT drive circuit. When a bimetallic temperature switch is used, the bimetallic temperature switch has two normally open contacts. When the set temperature is exceeded, the two contacts are connected. The set temperature is 25-55 degrees Celsius. The bottom of the housing of the heating device is provided with an opening groove, and the heat sink is fixedly attached to the opening groove. The heat sink is a metal plate with at least one U-shaped groove with an upward opening. The U-shaped groove is used to accommodate and tightly fit the IGBT chip. A circuit board connected to the housing is fixedly attached above the opening groove, and the IGBT chip is fixed to the lower side of the circuit board. End caps are also fixedly connected to both ends of the metal plate; The metal plate is also provided with a fixed bottom cover to form a sealed cavity, which is filled with a phase change energy storage material; the phase change energy storage material has a crystallization temperature of 20-25 degrees and a melting temperature of 27-32 degrees. The control method selects a phase change energy storage material with a crystallization temperature 0-5 degrees higher than the common ambient temperature of the heating equipment; the set temperature of the bimetallic temperature switch or the temperature control circuit is 0-5 degrees higher than the melting temperature of the phase change energy storage material.

2. The control method for the heating equipment according to claim 1, characterized in that... When a temperature sensor is used, the temperature sensor is a thermocouple or a resistance temperature detector (RTD) inserted into the heat sink.

3. The control method for the heating equipment according to claim 1, characterized in that... The phase change energy storage material includes borax, sodium sulfate decahydrate, sodium chloride, and sodium carboxymethyl cellulose.

4. The control method for the heating equipment according to claim 1, characterized in that... When using the heating equipment, the power supply circuit is kept connected to an external power source. The power supply circuit is equipped with a separate fan power supply line to supply DC or AC power to the fan.

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