Electronic device including camera module

Abstract

An electronic system including a camera module includes: a camera module on a metal plate; a metal flange surrounding the camera module; a metal frame connected to the metal flange; and a first adhesive between the metal flange and the metal plate. The camera module includes: a substrate including a cavity; an image sensor in the cavity; and a lens assembly over the image sensor. The area of the metal plate is greater than the area of the substrate, viewed in plan. The metal plate includes: a first portion overlapping the substrate, viewed in plan; and a second portion not overlapping the substrate, viewed in plan. The second portion corresponds to an edge portion of the metal plate. The image sensor contacts the metal plate through an adhesive material. A lower portion of the metal flange and the second portion of the metal plate contact the first adhesive.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2021-0058934, filed with the Korean Intellectual Property Office on May 7, 2021, the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] The present invention relates to an electronic device including a camera module. Background Technology

[0004] Electronic devices (e.g., mobile electronic devices) have been applied in many areas that are closely related to our daily lives.

[0005] This electronic device is manufactured in various sizes according to its functions and user preferences, and may include a large touchscreen display to ensure wide visibility and convenient operation. The electronic device may include at least one camera module. For example, the electronic device may include at least one camera module located on or near the display. Summary of the Invention

[0006] Some embodiments of the present invention provide an electronic device including a camera module whose reliability is increased due to an expanded heat dissipation path.

[0007] According to some embodiments of the present invention, the electronic system may include: a metal plate; at least one first camera module on the metal plate; a metal flange covering the sidewall of the first camera module; a metal frame connected to the metal flange; and a first adhesive material between the metal flange and the metal plate, attaching the metal flange to the metal plate. The first camera module may include: a substrate including at least one cavity extending through the substrate; an image sensor within the cavity; a lens assembly on the image sensor; and an actuator coupled to the lens assembly. The area of ​​the metal plate as viewed in a plan view may be larger than the area of ​​the substrate as viewed in a plan view. The metal plate may include: a first portion overlapping the substrate as viewed in a plan view; and a second portion not overlapping the substrate as viewed in a plan view. The second portion may correspond to an edge portion of the metal plate. The image sensor may contact the metal plate via the second adhesive material. The lower portion of the metal flange and the second portion of the metal plate may contact the first adhesive material.

[0008] According to some embodiments of the present invention, the electronic system may include: a metal plate; a camera module on the metal plate; a metal flange surrounding a sidewall of the camera module; a metal frame connected to the metal flange; a first adhesive between the metal flange and the metal plate; and a second adhesive between the metal flange and the camera module. The camera module may include: a substrate having a top surface and a bottom surface, and including at least one cavity; an image sensor in the cavity; and a lens assembly on the image sensor. The metal flange may include: a body extending in a direction perpendicular to the substrate; and a protrusion projecting from the body and along a direction parallel to the top surface of the substrate. The bottom surface of the body included in the metal flange and the top surface of the metal plate may contact the first adhesive. The side surfaces of the body included in the metal flange and the side surfaces of the camera module may contact the second adhesive.

[0009] According to some embodiments of the present invention, the electronic system may include: a metal plate; at least one first camera module on the metal plate; a metal flange covering the sidewall of the first camera module; a metal frame connected to the metal flange; and a first adhesive between the metal flange and the metal plate. The first camera module may include: a substrate including at least one cavity extending through the substrate; a passive element on the substrate; an image sensor in the cavity; an infrared filter on the image sensor; an inner shell surrounding the infrared filter; a lens assembly on the infrared filter; an actuator on the inner shell and coupled to the camera assembly; and a housing surrounding the inner shell and the actuator. The area of ​​the metal plate as viewed in plan view may be larger than the area of ​​the substrate as viewed in plan view. The metal plate may include: a first portion overlapping the substrate as viewed in plan view; and a second portion not overlapping the substrate as viewed in plan view. The image sensor may be in thermal contact with the metal plate. The second portion may correspond to an edge portion of the metal plate. The lower portion of the metal flange and the second portion of the metal plate may contact the first adhesive. Attached Figure Description

[0010] Figure 1 A plan view of an electronic device including a camera module, illustrating some embodiments of a concept according to the present invention, is shown.

[0011] Figure 2A The following are shown according to some embodiments. Figure 1 The cross-sectional view taken from line I-I'.

[0012] Figure 2B It shows Figure 2A An enlarged view of part aa.

[0013] Figure 2C A cross-sectional view is shown conceptually illustrating heat transfer in an electronic device including a camera module.

[0014] Figure 3AThe following are shown according to some embodiments. Figure 1 The cross-sectional view taken from line I-I'.

[0015] Figure 3B It shows Figure 3A A magnified view of the bb section.

[0016] Figure 4A A plan view of an electronic device including a camera module, illustrating some embodiments of a concept according to the present invention, is shown.

[0017] Figure 4B The following are shown according to some embodiments. Figure 4A The cross-sectional view taken from line II-II'.

[0018] Figure 5A A plan view of an electronic device including a camera module, illustrating some embodiments of a concept according to the present invention, is shown.

[0019] Figure 5B The following are shown according to some embodiments. Figure 5A The cross-sectional view taken from line III-III'. Detailed Implementation

[0020] Electronic devices including camera modules of various embodiments according to the present invention will now be described with reference to the accompanying drawings.

[0021] Figure 1 A plan view of an electronic device including a camera module, illustrating some embodiments of a concept according to the present invention, is shown. Figure 2A It shows along Figure 1 The cross-sectional view taken from line I-I'. Figure 2B It shows Figure 2A An enlarged view of part aa. For clarity, Figure 1 Omitted Figure 2A The diagram shows some of the components.

[0022] Electronic device 1 may be, for example, a mobile phone or tablet, a drone, an action camera or a monitoring device, each of which includes a camera module CM.

[0023] The camera module CM may include a substrate 110, an image sensor 120, an infrared (IR) filter 130, an inner housing 140, an actuator 150, a lens assembly 160, and a housing 170.

[0024] According to some embodiments, the camera module CM may be provided with a flexible substrate 200 connected to the substrate 110 and an additional substrate 300 connected to the substrate 110 via the flexible substrate 200. A connector 310 may be provided on the additional substrate 300. The connector 310 may be an electronic component for power and / or data communication with external electronic devices. The substrate 110, the flexible substrate 200, and the additional substrate 300 may all be, for example, printed circuit boards.

[0025] The substrate 110 may include at least one cavity OP extending through the substrate 110. For example, the cavity OP may completely extend through the substrate 110. An image sensor 120 may be disposed within the cavity OP of the substrate 110. The image sensor 120 may convert an external image into an electrical signal and send the electrical signal to a display for display, to a processor for processing, and / or to a memory for storing. The electrical signal converted from the external image may be described as a converted electrical signal. The image sensor 120 may be one of a charge-coupled device (CCD) or a CMOS image sensor (CIS). Because the image sensor 120 is disposed within the cavity OP of the substrate 110, the overall height of the camera module CM can be reduced. The image sensor 120 may be electrically connected to the substrate 110 via bonding wires or the like.

[0026] The substrate 110 may have a first surface 110a and a second surface 110b opposite to the first surface 110a. The first surface 110a and the second surface 110b may correspond to the top surface and bottom surface of the substrate 110, respectively. For example, as shown in the figures, for ease of description, spatially related terms such as “below,” “under,” “down,” “above,” “top,” “bottom,” and “top” may be used herein to describe positional relationships. It should be understood that, in addition to the orientations depicted in the figures, spatially related terms also include different orientations of the device. In the following description, the first direction D1 is defined as indicating a direction parallel to the top surface 110a of the substrate 110. The second direction D2 is defined as indicating a direction parallel to the top surface 110a of the substrate 110 and orthogonal to the first direction D1. The first direction D1 and the second direction D2 may be described as horizontal directions. The third direction D3 is defined as indicating a direction perpendicular to the top surface 110a of the substrate 110. The third direction D3 may be described as a vertical direction. Ordinal numbers such as “first,” “second,” “third,” etc., may simply be used as labels for certain elements, steps, etc., to distinguish them from each other. Terms such as "first" and "second" that are not used in the specification may still be referred to as "first" or "second" in the claims. Furthermore, terms referenced with a specific ordinal number (e.g., "first" in a particular claim) may be described elsewhere with a different ordinal number (e.g., "second" in the specification or another claim).

[0027] One or more passive components 112, such as capacitors, may be disposed on the top surface 110a of the substrate 110.

[0028] An IR filter 130 can be disposed on the image sensor 120. The IR filter 130 can remove wavelengths in the near-infrared radiation range.

[0029] An inner housing 140 may be disposed on the top surface 110a of the substrate 110. The inner housing 140 may comprise, for example, plastic (e.g., a polymer) or a combination of plastics. The inner housing 140 may be used to secure the IR filter 130 and support the actuator 150. An adhesive material 142 (e.g., a thermal interface material (TIM)) may be disposed between the inner housing 140 and the top surface 110a of the substrate 110. For any of the various components described herein, the layer formed by the adhesive material described herein may be referred to as an adhesive layer.

[0030] Lens assembly 160 can be disposed on IR filter 130. Lens assembly 160 may include a plurality of lenses 161 and a lens barrel 162 for fixing the lenses 161.

[0031] Actuator 150 may be disposed on inner housing 140. Actuator 150 may engage with the outer side of lens barrel 162 (e.g., may be attached to the outer side of lens barrel 162). Actuator 150 may drive lens assembly 160 to move in a vertical and / or horizontal direction. Actuator 150 may include, for example, magnets and coils.

[0032] The substrate 110 may have a housing 170 surrounding the actuator 150 and the inner housing 140 on its top surface 110a. The housing 170 may be described as a shielding canister. For example, the housing 170 may include or be formed of metal. The housing 170 may be used to prevent electromagnetic waves from escaping from the camera module CM and to protect the camera module CM. The housing 170 may be connected to a grounding pad located on the top surface 110a of the substrate 110, and a grounding circuit may be used to remove electromagnetic waves.

[0033] The camera module CM can be configured such that lens 161 receives an optical image of an object, and the received optical image is transmitted to IR filter 130. IR filter 130 can block infrared radiation from the received optical image, which can then illuminate image sensor 120. Image sensor 120 can convert the illuminated optical image into an electrical signal, and the electrical signal can be transmitted through substrate 110. The transmitted electrical signal can form an image on a display (e.g., LCD or OLED) in electronic device 1.

[0034] The metal plate 600 can be positioned below the camera module CM. In this sense, the camera module CM can be positioned on the metal plate 600.

[0035] The substrate 110 and the image sensor 120 can be bonded to the metal plate 600 using an adhesive material (e.g., they can be attached to the metal plate 600 using an adhesive material). The adhesive material can be, for example, a thermal interface material (TIM). The metal plate 600 can include or be formed of one or more of, for example, stainless steel (SUS) and copper alloys.

[0036] When viewed in a plan view, the area of ​​the metal plate 600 may be larger than the area of ​​the substrate 110. The metal plate 600 may have a first width 600W in a first direction D1. The substrate 110 may have a second width 110W in the first direction D1. The first width 600W may be greater than the second width 110W. For example, the first width 600W may be about 1.1 to about 1.5 times the second width 110W. Although not shown, in one embodiment, the width of the metal plate 600 in the second direction D2 may be greater than the width of the substrate 110, for example, about 1.1 to 1.5 times. Alternatively, in one embodiment, the width of the metal plate in the second direction D2 may be the same as the width of the substrate 110. Terms such as “same,” “equal,” “planar,” “coplanar,” “parallel,” and “perpendicular” as used herein cover “same” or “nearly identical,” including variations that may occur, for example, due to manufacturing processes. Unless the context or other statements otherwise indicate, the term “substantially” may be used herein to emphasize that meaning. Terms such as “about” or “approximately” can reflect variations in quantity, size, orientation, or layout that are only minor and / or do not significantly alter the operation, function, or structure of certain elements. For example, a range from “about 0.1 to about 1” can encompass ranges such as 0%–5% deviation of about 0.1 and 0%–5% deviation of about 1, especially if such deviations maintain the same effect as the listed ranges.

[0037] The metal plate 600 may include a first portion 610 and a second portion 620. The first portion 610 of the metal plate 600 may be a cavity OP that is vertically overlapped with the substrate 110 and the image sensor 120 and exposed to the substrate 110.

[0038] The second portion 620 of the metal plate 600 may be a portion that does not vertically overlap with the substrate 110 and corresponds to the edge portion of the metal plate 600.

[0039] A metal flange 400 may be disposed on a second portion 620 of a metal plate 600. The metal flange 400 may include or be formed of aluminum, zinc, or any alloy thereof. A first adhesive pattern AD1 may be disposed between the metal flange 400 and the top surface 620a of the second portion 620 included in the metal plate 600. The first adhesive pattern AD1 may include or may be an adhesive material, such as a thermal interface material (TIM).

[0040] The metal flange 400 can be used as a frame including an opening corresponding to the maximum diameter of the camera module CM. The metal flange 400 is not limited to the shape described above.

[0041] Metal flange 400 may include body 410 and protrusion 420. Body 410 may extend along a third direction D3. The inner wall of body 410 may face camera module CM. Second adhesive pattern AD2 may be inserted between housing 170 and the inner wall of body 410. The inner walls of housing 170 and body 410 (e.g., the side surface of housing 170 forming the side surface of camera module CM, and the side surface of body 410) may contact the second adhesive pattern AD2. It should be understood that when an element is referred to as “connected” or “coupled” to another element or “on” another element, the element may be directly connected or coupled to the other element or on the other element, or there may be intermediate elements. In contrast, when an element is referred to as “directly connected” or “directly coupled” to another element, there are no intermediate elements at the point of contact. Components herein may be described as “contacting” or “in contact with” each other. Unless otherwise stated, the use of “contact,” “making contact,” or “contacting with” as used herein means directly coupled to each other (e.g., physically in contact with each other). Articles described as being in contact with each other by an adhesive material or by some other component have only an adhesive material or other component between them. Components described as being "thermally connected" or "thermally contacting" each other, or "thermally in contact" with each other, are in contact with each other by direct coupling, allowing heat to be transferred directly from one component to the other, or are joined using thermally conductive components (e.g., thermal interface materials) designed to transfer heat between the components. The second adhesive pattern AD2 may include or be formed of the same material as the first adhesive pattern AD1.

[0042] The protrusion 420 may be a portion protruding from the body 410 in a first direction D1 and / or a second direction D2. The protrusion 420 may be bonded to the metal frame 500 using an adhesive material. Although in Figure 2A and Figure 2BNot shown in the diagram, but as viewed from the plan view, the camera module CM may have a rectangular shape (e.g., a square shape), and as viewed from the plan view surrounding the camera module CM, the first body 410 and the protrusion 420 may have rectangular shapes (e.g., square shapes). The first body 410 may cover (e.g., only by adhesive material) all the sidewalls of the camera module CM, thereby surrounding the camera module CM.

[0043] The metal flange 400 can be used to fix the camera module CM to the metal frame 500.

[0044] Reference Figure 2A and Figure 2B The second portion 620 of the metal plate 600 may have a shape that is bent in a direction away from the substrate 110. For example, the second portion 620 of the metal plate 600 may have an inverted "L" shape. The bending shapes at both ends of the metal plate 600 may form, for example, an "Z" shape that bends upward first and then outward.

[0045] The metal plate 600 may have a stepped difference between the first portion 610 and the second portion 620. The top surface 620a of the second portion 620 included in the metal plate 600 may be located at a height (e.g., a vertical height in the third direction D3) between the top surface 110a and the bottom surface 110b of the substrate 110. An adhesive material may be disposed between the metal plate 600 and the substrate 110, and between the metal plate 600 and the image sensor 120 (e.g., at the top surface of the metal plate 600, and at the bottom surface of the substrate 110 and the image sensor 120). A rolling process may be employed so that the adhesive material can be used to bond the metal plate 600 and the substrate 110 to each other (e.g., attach the metal plate 600 to the substrate 110). Rollers may be used to apply pressure to the top surface 110a of the substrate 110 to bond the metal plate 600 to the substrate 110. The top surface 620a of the second portion 620 included in the metal plate 600 can be located at a vertical height below the top surface 110a of the substrate 110, so that the metal plate 600 can remain undamaged even during the rolling process.

[0046] The body 410 of the metal flange 400 may have a bottom surface 410b that contacts the first adhesive pattern AD1. The bottom surface 410b may be located at the lowest part of the body 410 of the metal flange 400. The second portion 620 of the metal plate 600 may contact the first adhesive pattern AD1. The body 410 of the metal flange 400 and the second portion 620 of the metal plate 600 may be spaced apart from each other across the first adhesive pattern AD1 (e.g., on a third direction D3). Additionally, for example, when viewed from a plan view, the body 410 of the metal flange 400 may vertically overlap the second portion 620 of the metal plate 600.

[0047] Figure 2C A cross-sectional view is shown conceptually illustrating heat transfer in an electronic device including a camera module.

[0048] According to existing technology, during the use of the camera module, the image sensor may generate heat, which may cause a decrease in resolution and noise in the captured images.

[0049] The electronic device 1, including the camera module CM according to the present invention, can be configured to easily dissipate heat generated from the image sensor 120.

[0050] Image sensor 120 can be configured to contact metal plate 600 via adhesive material. Metal plate 600 may include a second portion 620 extending below the body 410 of metal flange 400. The body 410 of metal flange 400 and the second portion 620 of metal plate 600 can be connected to each other via a first adhesive pattern AD1, and this configuration can increase heat dissipation path.

[0051] The protrusion 420 of the metal flange 400 can contact the metal frame 500 and transfer heat to the metal frame 500 of the electronic device 1, which can lead to an increased thermal radiation effect. Because the contact area with the protrusion 420 is larger than the contact area without the protrusion, this can also increase the heat transfer to the metal frame 500.

[0052] Figure 3A The following are shown according to some embodiments. Figure 1 The cross-sectional view taken from line I-I'. Figure 3B It shows Figure 3A A magnified view of the bb section. Except as discussed below, details related to... Figure 1 and Figures 2A to 2C To avoid duplication, the same feature descriptions are used in the same way.

[0053] Reference Figure 3A and Figure 3B According to some embodiments, the electronic device 2 may include a metal plate 600, the first portion of which 610 has a top surface 610a of substantially the same height as the top surface 620a of the second portion 620. The second portion 620 of the metal plate 600 may vertically overlap with the body 410 of the metal flange 400. The metal plate 600 may, for example, be entirely flat and without L-shaped or Z-shaped ends.

[0054] The bottom surface 410b of the body 410 included in the metal flange 400 may be located at a vertical height between the top surface 110a and the bottom surface 110b of the substrate 110. For example, the bottom surface 410b of the body 410 included in the metal flange 400 may extend to a height lower than the top surface 110a of the substrate 110.

[0055] Figure 4A A plan view of an electronic device including a camera module, illustrating some embodiments of a concept according to the present invention, is shown. Figure 4B It shows along Figure 4A The cross-sectional view taken from line II-II'. Except as discussed below, details related to... Figure 1 and Figures 2A to 2C To avoid duplication, the same feature descriptions are used in the same way.

[0056] Reference Figure 4A and Figure 4B According to some embodiments, the electronic device 3 may include a first camera module CM1 and a second camera module CM2. The first camera module CM1 and the second camera module CM2 may be substantially the same as the camera module CM discussed above. The boundaries of each camera module, and the boundaries of the camera modules in other embodiments described herein, may be defined by a substrate 110 and a housing 170 at the bottom and sides of the camera module. For example, the sidewalls of each camera module may be formed by the housing 170, and the bottom surface of each camera module may be formed by the bottom surface of the substrate 110.

[0057] Each of the first camera module CM1 and the second camera module CM2 may include a substrate 110. A gap GP may exist between the substrate 110 of the first camera module CM1 and the substrate 110 of the second camera module CM2 (see...). Figure 4B ).

[0058] Additionally, each of the first camera module CM1 and the second camera module CM2 may include a flexible substrate 200 connected to the substrate 110, and may also include an additional substrate 300 and a connector 310.

[0059] like Figure 4B As shown, the body 410 of the metal flange 400 can be set in... Figure 4A On the second part 620 of the depicted metal plate 600. The metal flange 400 can be used as a frame including an opening corresponding to the diameter of the first camera module CM1 and an opening corresponding to the diameter of the second camera module CM2.

[0060] The metal flange 400 may include a first body 410, a protrusion 420, and a second body 430. The first body 410 may correspond to the body 410 discussed above.

[0061] The second body 430 of the metal flange 400 can be inserted between the first camera module CM1 and the second camera module CM2. The third adhesive pattern AD3 can be inserted between the second body 430 and the housing 170 of the first camera module CM1, and between the second body 430 and the housing 170 of the second camera module CM2. The third adhesive pattern AD3 can include or be formed of the same material as the first adhesive pattern AD1 and the second adhesive pattern AD2.

[0062] Metal flanges 400 (e.g., first body 410 and second body 430) can be fixed to the first camera module CM1 and the second camera module CM2 via a second adhesive pattern AD2 and a third adhesive pattern AD3. Although in Figure 4A and Figure 4B Not shown in the diagram, but viewed from the plan view, each camera module CM1 and CM2 can have a rectangular shape (e.g., a square shape), and viewed from the plan view, the first body 410 and the protrusion 420 can also have a rectangular shape surrounding the first camera module CM1 (e.g., surrounding the sidewall of the first camera module CM1) and the second camera module CM2 (e.g., surrounding the sidewall of the second camera module CM2). The second body can extend from one side of the rectangle to the opposite side, for example, in a second direction D2, and in one embodiment, can contact the opposite side of the rectangle formed by the first body 410. The combined first body 410 and second body 430 can cover (e.g., only by adhesive material) all the sidewalls of both the first camera module CM1 and the second camera module CM2.

[0063] When viewed in a plan view, the metal plate 600 may include a third portion 630 located between the first camera module CM1 and the second camera module CM2. Unlike the second portion 620 of the metal plate 600, the third portion 630 of the metal plate 600 may not include the bent portion. The second portion 620 of the metal plate 600 may be bonded to the first body 410 of the metal flange 400 via a first adhesive pattern AD1.

[0064] According to some embodiments, the gap GP formed between the substrate of the first camera module CM1 and the substrate of the second camera module CM2 can be formed between the bottom of the second body 430 and the top of the third portion 630 of the metal plate 600. This gap may be free of solid material and may be filled with a gas, such as air. According to some other embodiments, the second body 430 of the metal flange 400 may also extend downward to be bonded to the third portion 630 of the metal plate 600 by an adhesive pattern (e.g., a thermal interface material). In this embodiment, there may be no gas (e.g., no air) between the substrate of the first camera module CM1 and the substrate of the second camera module CM2.

[0065] According to some embodiments, such as Figure 3A As shown, the metal plate 600 may have a planar shape, wherein the top surface of the third portion 630 is at the same height as the top surface 610a of the first portion 610 and the top surface 620a of the second portion 620.

[0066] Figure 5A A plan view of an electronic device including a camera module, illustrating some embodiments of a concept according to the present invention, is shown. Figure 5B It shows along Figure 5A The cross-sectional view taken from line III-III'. Except as discussed below, [the following will omit / discuss / etc.] Figure 4A and Figure 4B Use the same feature descriptions to avoid duplication.

[0067] Reference Figure 5A and Figure 5B According to some embodiments, the electronic device 4 may include a first camera module CM1 and a second camera module CM2.

[0068] The first camera module CM1 and the second camera module CM2 can be disposed on a single substrate 110. For example, the first camera module CM1 and the second camera module CM2 can share a substrate 110, but can occupy different areas of the substrate 110.

[0069] An electronic device including a camera module according to the present invention can be configured to easily dissipate heat generated from an image sensor. The image sensor can be configured to have thermal contact with a metal plate beneath it. The metal plate can extend to have thermal contact with a metal flange external to the camera module. The metal flange can have thermal contact with the metal frame of the electronic device. The heat generated by the image sensor can be transferred to all the metal plates, metal flange, and metal frame, which can result in increased thermal radiation effects. Therefore, the reliability of the electronic device including the camera module can be increased.

[0070] Although the inventive concept has been described in conjunction with some embodiments shown in the accompanying drawings, those skilled in the art will understand that variations in form and detail may be made therein without departing from the spirit and essential characteristics of the inventive concept. Therefore, the disclosed embodiments should be considered illustrative rather than restrictive.

Claims

1. An electronic system comprising: Metal sheet; At least one first camera module is on the metal plate; A metal flange covers the side wall of the first camera module; Metal frame, connected to the metal flange; as well as A first adhesive material is used to attach the metal flange to the metal plate between the metal flange and the metal plate. The first camera module includes: A substrate, including at least one cavity extending through the substrate; An image sensor is located within the cavity. Lens assembly, on the image sensor; and The actuator, combined with the lens assembly, The area of ​​the metal plate as viewed from the plan view is larger than the area of ​​the substrate as viewed from the plan view. The metal plate includes: The first part, as seen from the plan view, overlaps with the substrate; and The second part, as seen from the plan view, does not overlap with the substrate. The second part corresponds to the edge portion of the metal plate. The image sensor contacts the metal plate via a second adhesive material, and The lower part of the metal flange and the second part of the metal plate are in contact with the first adhesive material.

2. The electronic system according to claim 1, wherein, The second portion of the metal plate has an inverted "L" shape.

3. The electronic system according to claim 1, wherein: There is a step difference between the first portion and the second portion of the metal plate, and The second portion of the metal plate is located at a vertical height above the first portion of the metal plate.

4. The electronic system according to claim 3, wherein, The vertical height of the top surface of the second portion included in the metal plate is between the vertical height of the top surface of the substrate and the vertical height of the bottom surface of the substrate.

5. The electronic system according to claim 1, wherein, The vertical height of the top surface of the second portion included in the metal plate is the same as the vertical height of the top surface of the first portion included in the metal plate.

6. The electronic system according to claim 5, wherein, The height of the lowest part of the metal flange is between the height of the top surface of the substrate and the height of the bottom surface of the substrate.

7. The electronic system according to claim 1, wherein, The metal plate includes one of stainless steel and copper alloy.

8. The electronic system according to claim 1, wherein, The metal flange includes one of aluminum, zinc, aluminum alloy, and zinc alloy.

9. The electronic system according to claim 1, wherein: The substrate has a first width in a first direction parallel to the top surface of the substrate. The metal plate has a second width in the first direction, and The second width is 1.1 to 1.5 times the first width.

10. The electronic system according to claim 1, wherein, The metal flange includes: The main body extends in a direction perpendicular to the substrate; and A protrusion, extending from the body and along a direction parallel to the top surface of the substrate. The protrusion is connected to the metal frame.

11. The electronic system according to claim 1, wherein, The first camera module includes: An infrared filter is located between the substrate and the lens assembly; Inner shell surrounding the infrared filter; and The outer casing surrounds the actuator and the inner casing. The outer casing comprises metal.

12. The electronic system of claim 11, further comprising a third adhesive material between the housing and the metal flange.

13. The electronic system according to claim 12, wherein, The first adhesive material and the third adhesive material include thermal interface material (TIM).

14. The electronic system according to claim 1, further comprising: A second camera module, located on the metal plate, includes a substrate. The substrate of the first camera module and the substrate of the second camera module are spaced apart from each other.

15. The electronic system according to claim 1, further comprising: The second camera module is located on the metal plate; The first camera module and the second camera module share the same substrate. The substrate includes multiple cavities.

16. An electronic system comprising: Metal sheet; Camera module, on the metal plate; A metal flange surrounds the sidewall of the camera module; Metal frame, connected to the metal flange; A first adhesive element is present between the metal flange and the metal plate; as well as A second adhesive element is placed between the metal flange and the camera module. The camera module includes: A substrate having a top surface and a bottom surface, and including at least one cavity; An image sensor is located within the cavity; and Lens assembly, on the image sensor, The metal flange includes: The main body extends in a direction perpendicular to the substrate; and A protrusion, extending from the body and along a direction parallel to the top surface of the substrate. The bottom surface of the body and the top surface of the metal plate, both contained in the metal flange, contact the first adhesive element. The side surface of the body and the side surface of the camera module, both contained in the metal flange, contact the second adhesive.

17. The electronic system according to claim 16, wherein, The metal plate includes: The first part, as seen in the plan view, overlaps with the substrate; and The second part, as seen in the plan view, does not overlap with the substrate. Wherein, the second part corresponds to the edge portion of the metal plate, and The second part contacts the first adhesive.

18. The electronic system according to claim 17, wherein: There is a step difference between the first portion and the second portion of the metal plate. The second part is above the first part, and The vertical height of the top surface of the second portion included in the metal plate is between the vertical height of the top surface of the substrate and the vertical height of the bottom surface of the substrate.

19. The electronic system according to claim 17, wherein: The vertical height of the top surface of the second portion included in the metal plate is the same as the vertical height of the top surface of the first portion included in the metal plate, and The vertical height of the lowest portion of the metal flange is between the vertical height of the top surface of the substrate and the vertical height of the bottom surface of the substrate.

20. An electronic system comprising: Metal sheet; At least one first camera module is on the metal plate; A metal flange covers the side wall of the first camera module; Metal frame, connected to the metal flange; as well as The first adhesive element is located between the metal flange and the metal plate. The first camera module includes: A substrate, including at least one cavity extending through the substrate; Passive components are located on the substrate. An image sensor is located within the cavity. An infrared filter is applied to the image sensor. Inner shell surrounding the infrared filter; Lens assembly on the infrared filter; Actuator, on the inner housing and combined with the lens assembly; and The outer casing surrounds the inner casing and the actuator. The area of ​​the metal plate as viewed from the plan view is larger than the area of ​​the substrate as viewed from the plan view. The metal plate includes: The first part, as seen from the plan view, overlaps with the substrate; and The second part, as seen from the plan view, does not overlap with the substrate. The image sensor is in thermal contact with the metal plate. Wherein, the second part corresponds to the edge portion of the metal plate, and The lower part of the metal flange and the second part of the metal plate contact the first adhesive.

Images