Side fingerprint structure and electronic device

Abstract

The embodiment of the application discloses a side fingerprint structure and electronic equipment, and relates to the technical field of electronic equipment. The side fingerprint structure comprises a substrate, a fingerprint sensor, a switch assembly and a flexible connecting body. The outer surface of the substrate comprises opposite first and second sides and a side wall between the first and second sides. The first side faces the outside of the electronic equipment, and the second side faces the inside of the electronic equipment. The fingerprint sensor is arranged on the first side and electrically connected to electronic elements on the substrate. The switch assembly is arranged on the second side and electrically connected to the electronic elements on the substrate. The first end of the flexible connecting body is connected to the second side or the side wall and electrically connected to the fingerprint sensor through the electronic elements on the substrate. The second end of the flexible connecting body is used for electrically connecting a processor in the electronic equipment.

Description

Technical Field

[0001] This application relates to the field of electronic device technology, and in particular to a side fingerprint structure and electronic device. Background Technology

[0002] Some electronic devices incorporate fingerprint verification functionality into their power-on / off mechanisms. For example, a power-on / off mechanism located on the side bezel of an electronic device may integrate the fingerprint sensor. When the power button is pressed, fingerprint information is simultaneously acquired, enabling fingerprint verification during both power-on and power-off processes.

[0003] When setting a side fingerprint structure on the side of an electronic device, the width of the side fingerprint structure will directly affect the overall thickness of the electronic device. Therefore, it is necessary to minimize the width of the side fingerprint as much as possible. Summary of the Invention

[0004] This application provides a side fingerprint structure and electronic device that can reduce its width and is easy to lay out.

[0005] In a first aspect, embodiments of this application provide a side fingerprint structure, including a substrate, a fingerprint sensor, a switch assembly, and a flexible connector. The substrate is used to carry and conduct electronic components. The outer surface of the substrate includes a first side and a second side opposite to each other, and a sidewall located between the first side and the second side. The first side faces the outside of the electronic device, and the second side faces the inside of the electronic device. The fingerprint sensor is disposed on the first side and electrically connected to the electronic components on the substrate for detecting fingerprint information. The switch assembly is disposed on the second side and electrically connected to the electronic components on the substrate for at least controlling the electronic device to power on and / or power off. The first end of the flexible connector is connected to the second side or the sidewall and electrically connected to the fingerprint sensor through the electronic components on the substrate. The second end of the flexible connector is used to electrically connect to a processor inside the electronic device.

[0006] In one possible implementation of this application, a groove is provided on the sidewall, and the portion of the flexible connector near the first end is accommodated in the groove.

[0007] In one possible implementation of this application, the outer contour of the first end of the flexible connector when bent at the groove does not extend beyond the outer edge of the substrate.

[0008] In one possible implementation of this application, a bracket is included for connecting to the side frame of an electronic device, and a substrate is fixed on the bracket.

[0009] In one possible implementation of this application, the bracket includes a support portion and two connecting portions located on both sides of the support portion. The two connecting portions are used to connect with the side frame of the electronic device, and the substrate is fixed on the support portion. When the substrate is pressed, it drives the support portion to move, and elastic deformation occurs between the support portion and the connecting portions. The elastic deformation is used to provide elastic restoring force to the support portion.

[0010] In one possible implementation of this application, the connecting part is provided with a snap-fit ​​groove for snapping into a corresponding position of the electronic device.

[0011] In one possible implementation of this application, the connecting portion is bent along the plane of the supporting portion to form a snap-fit ​​groove.

[0012] In one possible implementation of this application, each connector is bent to form two snap-fit ​​grooves, and the opening directions of the two snap-fit ​​grooves on each connector are opposite.

[0013] In one possible implementation of this application, a clearance area is provided on the support portion, and the switch assembly is located within the clearance area.

[0014] Secondly, embodiments of this application provide an electronic device, including a housing, a processor, and a side fingerprint structure as described in the first aspect. The housing includes a side frame with a switch hole. The processor is disposed within the housing. The side fingerprint structure is disposed within the switch hole of the side frame, and the processor is used to control at least the power-on and / or power-off operations of the electronic device through the side fingerprint structure.

[0015] The side fingerprint structure and electronic device provided in this application include a substrate, a fingerprint sensor, a switch assembly, and a flexible connector. The substrate is used to support and conduct electronic components. The fingerprint sensor and the switch assembly are electrically connected to the electronic components on the substrate. The fingerprint sensor is used to detect fingerprint information, and the switch assembly is used to control the electronic device to power on and / or power off. The device also includes a flexible connector, with a first end connected to the substrate and a second end used to connect to a processor inside the electronic device. However, if the flexible connector and the substrate are stacked, the thickness of the side fingerprint structure will increase. If the flexible connector is connected to the first side of the substrate facing outwards from the electronic device, the flexible connector needs to bend around the substrate from the side to connect to the processor inside the electronic device, which will increase the width of the side fingerprint structure. Therefore, the first end of the flexible connector is connected to the second side or sidewall of the substrate, wherein the second side of the substrate is the side facing the inside of the electronic device, and the sidewall is the outer surface of the substrate located between the first side and the second side. That is, the flexible connector is not connected to the first side of the substrate. In this way, when the flexible connector is connected to the processor inside the electronic device, it does not need to go around the substrate, avoiding bending of the flexible connector on the side of the substrate, and thus not increasing the thickness of the side fingerprint. That is, its width can be reduced and it is easy to lay out. Attached Figure Description

[0016] Figure 1 A bottom view of the connection between the processor and the side fingerprint structure of the electronic device provided in this application embodiment;

[0017] Figure 2 A schematic diagram showing the connection between the processor of the electronic device provided in this application embodiment and the bent side fingerprint structure;

[0018] Figure 3 A three-dimensional structural diagram showing the connection between the processor and the side fingerprint structure of the electronic device provided in this application embodiment;

[0019] Figure 4 An exploded view of the connection between the processor and the side fingerprint structure of the electronic device provided in the embodiments of this application;

[0020] Figure 5 This is a schematic cross-sectional view of the side fingerprint structure provided in an embodiment of this application;

[0021] Figure 6 A schematic diagram of the connection between the flexible connector and the substrate of the side fingerprint structure provided in this application embodiment;

[0022] Figure 7 This is a schematic diagram of the structure of the bracket for the side fingerprint structure provided in the embodiments of this application;

[0023] Figure 8A hardware module diagram of an electronic device provided in an embodiment of this application.

[0024] Figure label:

[0025] 1-Processor; 2-Side fingerprint structure; 21-Baseboard; 211-Groove; 22-Fingerprint sensor; 23-Switch assembly; 24-Flexible connector; 25-Bracket; 251-Support part; 252-Connecting part; 253-Card slot; 254-Avoidance area; 100-Switch module; 200-Fingerprint sensing module; 300-Fingerprint control module; 400-Processor module. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the specific technical solutions of this application will be further described in detail below with reference to the accompanying drawings of the embodiments of this application. The following embodiments are used to illustrate this application, but are not intended to limit the scope of this application.

[0027] In the embodiments of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more.

[0028] In the embodiments of this application, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium.

[0029] In embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0030] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0031] This application provides an electronic device, which can be a type of electronic device with side fingerprint verification function. Specifically, the electronic device can be a portable electronic device or other suitable electronic device. For example, the electronic device can be a mobile phone, tablet personal computer, laptop computer, personal digital assistant (PDA), camera, personal computer, laptop computer, in-vehicle equipment, wearable device, augmented reality (AR) glasses, AR headset, virtual reality (VR) glasses, or VR headset, etc.

[0032] This application provides an electronic device, with reference to... Figure 1 , Figure 2 and Figure 3 The device includes a housing (not shown in the figure), a processor 1, and a side fingerprint structure 2. The housing includes a side frame with a switch hole. The processor 1 is disposed within the housing. The side fingerprint structure 2 is disposed within the switch hole on the side frame. The processor 1 is used to control at least the power-on and / or power-off operations of the electronic device via the side fingerprint structure. Of course, the electronic device of this application can also perform various functions such as reset, hibernation, and application fingerprint verification via the side fingerprint structure.

[0033] This application embodiment also provides a side fingerprint structure 2, which can be installed in a type of electronic device that requires fingerprint verification function for power on / off.

[0034] Reference Figure 3 , Figure 4 and Figure 5 The side fingerprint structure 2 of this application embodiment includes a substrate 21, a fingerprint sensor 22, a switch assembly 23, and a flexible connector 24. The substrate 21 is used to support and conduct electronic components. The outer surface of the substrate 21 includes a first side and a second side opposite to each other, and a sidewall located between the first side and the second side. The first side faces the outside of the electronic device, and the second side faces the inside of the electronic device. The fingerprint sensor 22 is disposed on the first side and electrically connected to the electronic components on the substrate 21 for detecting fingerprint information. The switch assembly 23 is disposed on the second side and electrically connected to the electronic components on the substrate 21 for at least controlling the power-on and / or power-off of the electronic device. The first end of the flexible connector 24 is connected to the second side or the sidewall and electrically connected to the fingerprint sensor 22 through the electronic components on the substrate 21. The second end of the flexible connector 24 is used to electrically connect to the processor 1 inside the electronic device.

[0035] The side fingerprint structure 2 provided in this application embodiment includes a substrate 21, a fingerprint sensor 22, a switch assembly 23, and a flexible connector 24. The substrate 21 is used to carry and conduct electronic components. The fingerprint sensor 22 and the switch assembly 23 are electrically connected to the electronic components on the substrate 21. The fingerprint sensor 22 is used to detect fingerprint information. The switch assembly 23 is used to control the electronic device to turn on and / or turn off. The flexible connector 24 is also included. The first end of the flexible connector 24 is connected to the substrate 21, and the second end is used to connect to the processor 1 in the electronic device.

[0036] Based on this, if the flexible connector 24 and the substrate 21 are stacked, the thickness of the side fingerprint will be increased. If the flexible connector 24 is connected to the first side of the substrate 21 facing the outside of the electronic device, the flexible connector 24 needs to go around the substrate 21 and bend from the side of the substrate 21 in order to connect to the processor 1 inside the electronic device, which will increase the width of the side fingerprint structure 2.

[0037] Therefore, the first end of the flexible connector 24 is connected to the second side or sidewall of the substrate 21, wherein the second side of the substrate 21 is the side facing the inside of the electronic device, and the sidewall is the outer surface of the substrate 21 located between the first side and the second side. That is, the flexible connector 24 is not connected to the first side of the substrate 21. In this way, when the flexible connector 24 is connected to the processor 1 inside the electronic device, it does not need to go around the substrate 21, avoiding bending of the flexible connector 24 on the side of the substrate 21, and thus not increasing the thickness of the side fingerprint structure. That is, its width can be reduced and it is easy to lay out.

[0038] It should be noted that the substrate 21 can be a rigid / flexible carrier for supporting and conducting electronic components, a carrier board for the substrate on which electronic devices are mounted, such as a printed circuit board (PCB). Furthermore, the PCB can be a single-layer circuit board or a multi-layer circuit board, i.e., it has multiple wiring layers to meet different wiring requirements. Additionally, the flexible connector 24 can be a flexible carrier for conducting electronic components, such as a flexible printed circuit (FPC), to accommodate bending and facilitate layout.

[0039] Because the flexible connector 24 requires a certain bending space when bent, it can also be said to have a bending radius. To facilitate the connection between the flexible connector 24 and the substrate 21, and to reduce the impact of the bending space required for the flexible connector 24 when bending at its first end on the overall structural width, refer to... Figure 6 In some embodiments of this application, the sidewall of the substrate 21 is provided with a groove 211, and the portion of the flexible connector 24 near the first end is accommodated in the groove 211.

[0040] In this way, the groove 211 is recessed towards the inside of the substrate 21, and the first end of the flexible connector 24 is connected to the groove 211. When the first end of the flexible connector 24 is bent, a certain bending space can be provided by the groove 211, thereby reducing the influence of the bending space required by the flexible connector 24 when its first end is bent on the width of the entire structure.

[0041] To minimize the impact of the bending of the flexible connector 24 on the overall structural width, in some embodiments, the outer contour of the first end of the flexible connector 24 when bent at the groove 211 does not exceed the outer edge of the substrate 21. Thus, regardless of whether the first end of the flexible connector 24 is bent, the width of the flexible connector 24 at the groove 211 will not exceed the original width of the substrate 21. In other words, the width of the entire structure remains the width of the substrate 21 and will not increase due to the bending of the flexible connector 24.

[0042] When the substrate 21 is a PCB board with multiple wiring layers, the first end of the flexible connector 24 can be electrically connected to any one of the wiring layers to achieve signal transmission. To facilitate installation and reduce the impact of bending at the first end of the flexible connector 24 on the width of the overall structure, in some embodiments, the first end of the flexible connector 24 is electrically connected to the wiring layer of the substrate 21 facing the interior of the electronic device. In this embodiment, the groove 211 can be formed only on the wiring layer of the substrate 21 facing the interior of the electronic device.

[0043] It should be noted that the connection between the substrate 21 and the flexible connector 24 needs to ensure the connection of electrical signals. This can be achieved through a bonding process, specifically anisotropic conductive film (ACF) bonding. This process uses conductive particles to connect the electrodes between the electronic device and the substrate, making them conductive while preventing short circuits between adjacent electrodes. For example, the substrate 21 and the flexible connector 24 can be bonded together by laminating a printed circuit board assembly (PCBA) to the FPC using an ACF bonding process.

[0044] To facilitate the installation of the side fingerprint structure 2 of this application embodiment on the side frame of the electronic device, refer to Figure 4 and Figure 7In one embodiment of the side fingerprint structure 2 of this application, a bracket 25 is included. The bracket 25 is used to connect to the side frame of the electronic device, and the substrate 21 is fixed on the bracket 25. In this way, the substrate 21 is fixed on the bracket 25, the fingerprint sensor 22 and the switch assembly 23 are fixed on the substrate 21, and the flexible connector 24 is connected to the substrate 21. The entire side fingerprint structure 2 is directly or indirectly supported on the bracket 25. Through the connection between the bracket 25 and the side frame of the electronic device, the side fingerprint structure 2 can be conveniently installed at the side frame, and the bracket 25 can support and facilitate the layout of various components.

[0045] In some embodiments, the bracket 25 is implemented as follows: Figure 1 and Figure 7 As shown, the bracket 25 includes a support portion 251 and two connecting portions 252 located on both sides of the support portion 251. The two connecting portions 252 are used to connect with the side frame of the electronic device, and the substrate 21 is fixed on the support portion 251. By connecting with the side frame of the electronic device through the two connecting portions 252, the support portion 251 is subjected to forces on both sides, resulting in a relatively balanced force distribution and facilitating its placement on the side frame of the electronic device.

[0046] Here, in order to facilitate the triggering of the switch assembly 23 and its linkage with the fingerprint sensor 22, the switch adopts a press-triggered method.

[0047] To facilitate pressing the switch assembly 23 and improve the user experience, the entire bracket 25 can be made of a material capable of elastic deformation, such as a metal plate or a plastic plate. The two connecting parts 252 are fixed to their corresponding positions on the electronic device, and the support part 251 can be suspended in the middle, leaving space for pressing. When the side fingerprint structure 2 is pressed, the pressure is transmitted from the fingerprint sensor 22 to the substrate 21. The substrate 21 drives the support part 251 to move, and elastic deformation occurs between the support part 251 and the connecting part 252. This elastic deformation can provide elastic restoring force to the support part 251.

[0048] The connection between the connecting part 252 and the side frame of the electronic device can be made in various ways, such as snap-fitting, riveting, welding, threaded connection, etc. For example, refer to Figure 7 This is one embodiment of the connection part 252 engaging with an electronic device. The connection part 252 is provided with a snap-fit ​​groove 253 for engaging with a corresponding position on the electronic device. Furthermore, a corresponding snap-fit ​​protrusion is provided at a corresponding position on the side frame of the electronic device, which can cooperate with the snap-fit ​​groove 253 to allow the connection part 252 to engage with the side frame of the electronic device.

[0049] It should be noted that the specific position of the snap-fit ​​structure between the connecting part 252 and the side frame of the electronic device can be replaced. For example, the connecting part 252 is provided with a snap-fit ​​protrusion, while the side frame of the electronic device is provided with a snap-fit ​​groove 253. Similarly, the connecting part 252 can be snapped onto the side frame of the electronic device by the cooperation of the snap-fit ​​protrusion and the snap-fit ​​groove 253.

[0050] The snap-fit ​​groove 253 provided in the connecting part 252 can be implemented in various ways. For example, a hole-groove structure can be opened on the connecting part 252, which can be formed by processes such as stamping, casting, injection molding, etching, drilling, and milling. Alternatively, the snap-fit ​​groove 253 can be formed by bending the connecting part 252, such as bending, twisting, and forging.

[0051] For example, refer to Figure 7 In some embodiments, the connecting portion 252 is bent along the plane of the supporting portion 251 to form a snap-fit ​​groove 253. By bending, the snap-fit ​​groove 253 can be formed, and the snap-fit ​​groove 253 snaps into the corresponding structure of the side frame of the electronic device.

[0052] To make the snap-fit ​​connection more secure and reliable, multiple snap-fit ​​slots 253 can be provided in the connecting part 252. Through the redundant design of multiple snap-fit ​​slots 253, the snap-fit ​​connection failure can be avoided when one of the snap-fit ​​slots 253 is damaged or fails.

[0053] Each connecting part 252 can be provided with multiple snap-fit ​​slots 253, and the position and orientation of the snap-fit ​​slots 253 can be selected as needed. For example, the openings of the snap-fit ​​slots 253 facing the same direction facilitate snap-fitting, while the openings of the snap-fit ​​slots 253 facing opposite directions ensure the stability of the snap-fit ​​connection. See the example below. Figure 7 Each connecting part 252 is bent and twisted to form two snap-fit ​​grooves 253, and the opening directions of the two snap-fit ​​grooves 253 on each connecting part 252 are opposite.

[0054] It should be noted that, for the two connecting parts 252, the shape and structure of the two connecting parts 252 can be the same, they can be centrally symmetrical about the center position of the support part 251, or they can be axially symmetrical about the center line position of the support part 251.

[0055] A fingerprint sensor 22 is disposed on the first side of substrate 21 facing the outside of the electronic device, and a switch assembly 23 is disposed on the second side of substrate 21 facing the inside of the electronic device. Substrate 21 is mounted on a support 25; either the first sidewall of substrate 21 or the second sidewall of substrate 21 can be connected to the support 25. Comparatively, to facilitate the connection between the fingerprint sensor 22 and substrate 21, the second side of substrate 21 is connected to the support 25, while the fingerprint sensor 22 is directly connected to the first side of substrate 21. Thus, to connect the switch assembly 23 to the second side of substrate 21, refer to... Figure 1 and Figure 7 An avoidance area 254 is provided on the support part 251 of the bracket 25, and the switch assembly 23 is located in the avoidance area 254.

[0056] Additionally, refer to Figure 1 and Figure 2 In the electronic devices of this application, in some embodiments of the flexible connector 24, the second end of the flexible connector 24 is connected to the processor 1 for fingerprint recognition in the electronic device, or a separate fingerprint processing chip, or it may be integrated into the central processing unit.

[0057] In the electronic device of this application embodiment, in order to realize the linkage between fingerprint recognition action and the action of pressing the switch, so as to intelligently control the power-on and / or power-off of the electronic device, refer to... Figure 8 The device may include a switch module 100, a fingerprint sensor module 200, a fingerprint control module 300, and a processor module 400. The switch module 100 is electrically connected to the fingerprint control module 300. When the switch module 100 is pressed, it can send a power-on signal or a power-off signal to the fingerprint control module 300. The fingerprint sensor module 200 is also electrically connected to the fingerprint control module 300. The fingerprint information detected by the fingerprint sensor can be transmitted to the fingerprint control module 300, which can also control the detection parameters of the fingerprint sensor (e.g., delayed detection, detection duration). The fingerprint control module 300 is connected to the processor module 400 and can send a power-on signal or a power-off signal to the processor module 400. The processor module 400 controls the electronic device to power on or off based on the power-on or power-off signal. Furthermore, the side fingerprint structure of this application can also perform various functions such as reset, hibernation, and application fingerprint verification.

[0058] To improve the user experience of powering on / off electronic devices and increase fingerprint recognition rates, the electronic devices implemented in this application can have various control methods, which are illustrated below.

[0059] Taking booting up as an example, current technologies can only determine whether the device has actually booted into the system based on a countdown timer. For instance, if the system is not booted within 2 seconds, the fingerprint template is discarded, and the device waits for the next boot attempt. This requires re-verifying the fingerprint each time, potentially causing users to repeat the process and preventing the device from booting up smoothly as intended, thus degrading the user experience.

[0060] In some embodiments of the control methods of this application, since the fingerprint control module 300 can obtain the power-on signal status of the power button in real time, when the user presses the finger, the fingerprint sensing module 200 recognizes the fingerprint information. At the same time, the fingerprint control module 300 determines whether the switch module 100 is pressed. If it is pressed, fingerprint comparison can be started. If the fingerprint comparison is successful, the feedback system realizes one-click power-on.

[0061] In some embodiments of the control methods of this application, if the switch module 100 is not pressed, it is an invalid power-on process. At this time, the collected fingerprint information can be discarded and the fingerprint collection and comparison function can be terminated. If the fingerprint comparison is successful, the feedback system will realize one-click power-on.

[0062] In some embodiments of the control methods in this application, in order to improve security, the device can be powered on only after successful fingerprint comparison. Specifically, the following judgment can be made during the power-on process: if the switch module 100 is pressed and triggered, and fingerprint information still needs to be compared, the power-on signal will only be sent to the system after successful fingerprint comparison, thus realizing a single power-on process and improving the security level.

[0063] In some embodiments of the control methods in this application, in order to improve security, the following judgment can be made during the power-on process: if the switch module 100 is pressed and triggered, the power-on signal is combined with the fingerprint comparison result. Only when the fingerprint comparison fails, the power-on signal is blocked and the device cannot be powered on, thereby improving the security level.

[0064] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A side-mounted fingerprint structure, wherein, include: A substrate for carrying and conducting electronic components, the outer surface of the substrate including opposing first and second sides, and a sidewall located between the first and second sides, the first side facing the outside of the electronic device and the second side facing the inside of the electronic device; A fingerprint sensor is disposed on the first side and electrically connected to electronic components on the substrate for detecting fingerprint information; A switch assembly, disposed on the second side and electrically connected to electronic components on the substrate, is used at least to control the electronic device to be turned on and / or turned off; A flexible connector, wherein a first end of the flexible connector is connected to the second side or the sidewall and is electrically connected to the fingerprint sensor through electronic components on the substrate, and the second end of the flexible connector is used to electrically connect to a processor in an electronic device; A bracket for connecting to the side frame of an electronic device, wherein the substrate is fixed on the bracket; The bracket includes a support portion and two connecting portions located on both sides of the support portion. The two connecting portions are used to connect to the side frame of the electronic device, and the substrate is fixed on the support portion. When the substrate is pressed, it drives the support part to move, and elastic deformation is generated between the support part and the connecting part. The elastic deformation is used to provide elastic restoring force to the support part. The two connecting parts are fixed to their corresponding positions with the electronic device, and the support part can be suspended in the middle to leave space for pressing.

2. The side fingerprint structure according to claim 1, wherein, The sidewall has a groove, and the portion of the flexible connector near the first end is accommodated in the groove.

3. The side fingerprint structure according to claim 2, wherein, When the first end of the flexible connector is bent at the groove, its outer contour does not extend beyond the outer edge of the substrate.

4. The side fingerprint structure according to claim 1, wherein, The connecting part is provided with a snap-fit ​​groove, which is used to snap into the corresponding position of the electronic device.

5. The side fingerprint structure according to claim 4, wherein, The connecting portion is bent along the plane of the supporting portion to form the snap-fit ​​groove.

6. The side fingerprint structure according to claim 5, wherein, Each of the connecting parts is bent to form two snap-fit ​​grooves, and the opening directions of the two snap-fit ​​grooves on each of the connecting parts are opposite.

7. The side fingerprint structure according to claim 1, wherein, The support portion has an avoidance area, and the switch assembly is located within the avoidance area.

8. An electronic device, wherein, include: The housing includes a side frame, the side frame being provided with switch holes; The processor is housed within the casing; The side fingerprint structure according to any one of claims 1 to 7 is disposed in the switch hole of the side frame, and the processor is used to control at least the power-on and / or power-off operations of the electronic device through the side fingerprint structure.

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