An apparatus having a heat dissipation device

Abstract

The embodiment of the present application provides a device with a heat dissipation device, the parallel flow evaporator is arranged in the shell and does not contact the first heating element group and the second heating element group, the flat plate evaporator directly or indirectly contacts the second heating element group, and the condenser group is located outside the shell and is used for cooperating with the parallel flow evaporator and the flat plate evaporator to dissipate heat for the first heating element group and the second heating element group, so that the overall heat dissipation capacity of the device can be improved, and the heat dissipation demand of the device can be better met.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a device having a heat dissipation device. Background Technology

[0002] With the continuous development of science and technology, photovoltaic power generation has been increasingly widely applied. Inverters are a crucial component in the photovoltaic power generation process; they are electronic devices that convert low-voltage direct current (DC) into high-voltage alternating current (AC). Taking photovoltaic inverters as an example, a photovoltaic inverter is a power conditioning device composed of semiconductor devices, primarily used to convert DC power into AC power. Currently, the market demand for high-power products is gradually increasing. To meet these high-power requirements, the continuous increase in inverter density is an inevitable trend. However, this also brings increasingly greater challenges in heat dissipation. Insufficient heat dissipation capacity will hinder the continued improvement of inverters' market competitiveness.

[0003] In existing technologies, inverters typically employ a compartmentalized design, with the internal cavity divided into a high-protection cavity and a low-protection cavity. The high-protection cavity is a sealed cavity, while the low-protection cavity is a direct-ventilation cavity. Electronic components are placed in the high-protection cavity, while power semiconductor heat sinks and inductor heat sinks are located in the low-protection cavity. A fan is installed in the low-protection cavity, typically using either blowing or exhaust methods to dissipate heat from the inverter.

[0004] However, in the above solution, the overall heat dissipation capacity of the inverter is low and cannot meet the heat dissipation requirements. Summary of the Invention

[0005] This application provides a device with a heat dissipation device, which can improve the overall heat dissipation capacity of the device and better meet the heat dissipation requirements of the device.

[0006] This application provides a device with a heat dissipation apparatus, comprising: a housing; a first heating element group and a second heating element group, the first heating element group and the second heating element group being located within the housing; wherein the first heating element group includes at least one first heating element, and the second heating element group includes at least one second heating element; a parallel flow evaporator, located within the housing and not in contact with the first heating element group and the second heating element group; a flat plate evaporator, in direct or indirect contact with the second heating element group; and a condenser group, located outside the housing, for cooperating with the parallel flow evaporator and the flat plate evaporator to dissipate heat from the first heating element group and the second heating element group; wherein the condenser group includes one or more condensers.

[0007] The device with a heat dissipation device provided in this application embodiment has a parallel-flow evaporator disposed inside the casing and not in contact with the first and second heating element groups. A flat-plate evaporator is in direct or indirect contact with the second heating element group. A condenser group is located outside the casing and works in conjunction with the parallel-flow and flat-plate evaporators to dissipate heat from the first and second heating element groups. The condenser group, parallel-flow, and flat-plate evaporators form a heat dissipation system, effectively ensuring the heat dissipation of the first and second heating element groups, improving the overall heat dissipation capacity of the device, and better meeting the device's heat dissipation requirements. Furthermore, the direct or indirect contact between the flat-plate evaporator and the second heating element group allows for direct heat transfer from the second heating element group to the flat-plate evaporator, and then to the condenser group, enhancing the heat dissipation effect on the second heating element group. In addition, by placing the first heating element group and the second heating element group inside the housing, at least one first heating element in the first heating element group and at least one second heating element in the second heating element group can be prevented from being exposed to the air, so that the first heating element and the second heating element are less affected by the external environment, thus slowing down the aging of the equipment and extending its service life.

[0008] Furthermore, using a flat-plate evaporator facilitates the installation and fixation of the heating element on the outside of the evaporator, allowing for direct contact or even contact between the heating element and the evaporator. This ensures good heat conduction between the heating element and the evaporator, thereby guaranteeing heat dissipation from the heating element. Parallel-flow evaporators offer advantages such as high heat exchange efficiency, small temperature difference, low resistance, and mature technology. Moreover, parallel-flow evaporators are less expensive, which can reduce costs to some extent.

[0009] In one possible implementation, it further includes: a cover; the cover is disposed on the housing, and at least one cavity is formed between the cover and at least a portion of the outer wall of the housing; the condenser assembly is located within the cavity.

[0010] In one possible implementation, the condenser assembly includes a first condenser and a second condenser; one of the first condenser and the second condenser cooperates with the parallel flow evaporator to dissipate heat from the first heating element assembly, and the other of the first condenser and the second condenser cooperates with the flat plate evaporator to dissipate heat from the second heating element assembly; and the first condenser and the second condenser are located within the cavity.

[0011] The first and second condensers are located inside the cavity, allowing external cold air to enter the cavity and blow onto the first and second condensers, thus ensuring the condensation effect of the first and second condensers.

[0012] In one possible implementation, the flat-plate evaporator is located inside the cavity; or, the flat-plate evaporator is located inside the housing; or, the flat-plate evaporator is located on one of the side walls of the housing near the cavity.

[0013] In one possible implementation, the first condenser is connected to the flat-plate evaporator, and the first condenser is positioned vertically higher than the flat-plate evaporator; the second condenser is connected to the parallel-flow evaporator, and the second condenser is positioned vertically higher than the parallel-flow evaporator; or, the first condenser is connected to the parallel-flow evaporator, and the first condenser is positioned vertically higher than the parallel-flow evaporator; the second condenser is connected to the flat-plate evaporator, and the second condenser is positioned vertically higher than the flat-plate evaporator.

[0014] In this way, the medium flowing between one of the first and second condensers and the flat-plate evaporator, and between the other of the first and second condensers and the parallel-flow evaporator, can spontaneously complete the heat transfer cycle by relying on the pressure difference between evaporation and condensation and gravity, without the need to install a drive pump, thus saving costs to a certain extent.

[0015] In one possible implementation, the system further includes: a first gas pipe and a first liquid pipe; the flat-plate evaporator is connected to one of the first condenser and the second condenser via the first gas pipe and the first liquid pipe, wherein after the medium in the flat-plate evaporator evaporates, it flows through the first gas pipe to one of the first condenser and the second condenser, and after the medium in the first condenser and the second condenser condenses, it flows back to the flat-plate evaporator via the first liquid pipe; and further includes: a second gas pipe and a second liquid pipe; the parallel-flow evaporator is connected to the other of the first condenser and the second condenser via the second gas pipe and the second liquid pipe, wherein after the medium in the parallel-flow evaporator evaporates, it flows through the second gas pipe to the other of the first condenser and the second condenser, and after the medium in the other of the first condenser and the second condenser condenses, it flows back to the parallel-flow evaporator via the second liquid pipe.

[0016] In one possible implementation, the condenser assembly includes a third condenser; the third condenser cooperates with the flat-plate evaporator to dissipate heat from the second heating element assembly, and the third condenser cooperates with the parallel-flow evaporator to dissipate heat from the first heating element assembly; and the third condenser is located within a cavity. The location of the third condenser within the cavity allows external cold air to enter the cavity and be directed towards the third condenser, ensuring the condensation effect of the third condenser.

[0017] In one possible implementation, the flat-plate evaporator is located inside the cavity; or, the flat-plate evaporator is located inside the housing; or, the flat-plate evaporator is located on one of the side walls of the housing near the cavity.

[0018] In one possible implementation, the third condenser is positioned vertically higher than the flat-plate evaporator and the parallel-flow evaporator. In this way, the medium flowing between the third condenser and the flat-plate evaporator, and between the third condenser and the parallel-flow evaporator, can spontaneously complete the heat transfer cycle based on the pressure difference between evaporation and condensation, as well as gravity, eliminating the need for a drive pump and saving costs to some extent.

[0019] In one possible implementation, it further includes: a first gas pipeline and a first liquid pipeline; the flat-plate evaporator and the third condenser are connected through the first gas pipeline and the first liquid pipeline, the medium in the flat-plate evaporator evaporates and flows to the third condenser through the first gas pipeline, and the medium in the third condenser condenses and flows back to the flat-plate evaporator through the first liquid pipeline;

[0020] It also includes: a second gas pipeline and a second liquid pipeline; the parallel flow evaporator and the third condenser are connected by the second gas pipeline and the second liquid pipeline, the medium in the parallel flow evaporator evaporates and flows to the third condenser through the second gas pipeline, and the medium in the third condenser condenses and flows back to the parallel flow evaporator through the second liquid pipeline.

[0021] In one possible implementation, the cover has at least one air inlet and at least one air outlet, both of which are connected to the cavity. By providing at least one air inlet and at least one air outlet on the cover, and ensuring that both are connected to the cavity, external cold air can enter the cavity through the air inlet, while hot air from inside the cavity can flow out through the air outlet.

[0022] In one possible implementation, the cover is disposed on the top wall of the housing, forming a cavity between the cover and the top wall of the housing, and the cavity is located above the housing. The cavity's location above the housing ensures that the condenser within the cavity is positioned above the evaporator within the housing. The medium flowing between the condenser and evaporator can spontaneously complete a heat transfer cycle based on the pressure difference between evaporation and condensation, as well as gravity, eliminating the need for a drive pump and thus saving costs to some extent.

[0023] In one possible implementation, the cover is disposed on the top wall of the housing and one of the side walls of the housing; a first cavity is formed between the cover and the top wall of the housing, and a second cavity is formed between the cover and one of the side walls of the housing; the first cavity and the second cavity are connected and together constitute the cavity; the first cavity is located above the housing.

[0024] In one possible implementation, the at least one air inlet includes: a first air inlet; the first air inlet is located on one side wall of the cover, and the air outlet is located on another side wall of the cover, with the first air inlet and the air outlet being disposed opposite to each other; or, the first air inlet is located on one side wall of the cover, and the air outlet is located on the top wall of the cover.

[0025] In one possible implementation, the at least one air inlet includes: a first air inlet and a second air inlet; one of the first air inlet and the second air inlet is located on one side wall of the cover, the air outlet is located on the other side wall of the cover, and one of the first air inlet and the second air inlet is disposed opposite to the air outlet; the other of the first air inlet and the second air inlet is located on the bottom wall of the cover.

[0026] In this way, external cold air can enter the cavity through two air inlets (the first air inlet and the second air inlet), thereby increasing the volume of cold air flowing into the cavity and improving the heat dissipation effect of the cavity to a certain extent.

[0027] In one possible implementation, when the flat-plate evaporator is located within the cavity, it is positioned close to the second air inlet. Positioning the flat-plate evaporator close to the second air inlet allows more external cold air to reach it, thus reducing its temperature.

[0028] In one possible implementation, the outer wall of the flat-plate evaporator is provided with multiple spaced-apart heat dissipation fins. This allows the temperature of the flat-plate evaporator to be conducted away through the multiple heat dissipation fins, increasing the heat dissipation area of ​​the flat-plate evaporator and improving the heat dissipation capacity of the heat dissipation unit containing the flat-plate evaporator.

[0029] In one possible implementation, when the flat-plate evaporator is located within the cavity, the second heating element group is located within the housing on the side closest to the cavity. A first opening is provided on the side wall of the housing near the cavity, and the flat-plate evaporator is positioned close to this opening, with the flat-plate evaporator and the second heating element group in contact through the first opening. This ensures direct contact between the flat-plate evaporator and the second heating element group, facilitating better heat conduction of the second heating element group's temperature to the flat-plate evaporator and ensuring effective heat dissipation from the second heating element group.

[0030] In one possible implementation, when the flat-plate evaporator is located on one of the side walls of the housing near the cavity, the second heating element group is disposed near the one of the side walls; a second opening is provided on the one of the side walls, and the flat-plate evaporator is located in the second opening so that the flat-plate evaporator is in contact with the second heating element group.

[0031] In one possible implementation, a heat-conducting element is further provided between the flat-plate evaporator and the second heating element group. Since the second heating element group is in contact with the flat-plate evaporator, by providing a heat-conducting element between the flat-plate evaporator and the second heating element group, the temperature of the second heating element group can be conducted to the flat-plate evaporator more quickly, thereby improving the heat transfer efficiency between the second heating element group and the flat-plate evaporator.

[0032] In one possible implementation, a third opening is provided on the side wall of the housing near the second cavity, the third opening being used to insert the parallel flow evaporator.

[0033] In one possible implementation, one or more air supply devices are provided inside the housing to blow gas flow within the housing to direct heat from the first heating element group toward the parallel flow evaporator.

[0034] In one possible implementation, one or more air supply devices are provided within the cavity to agitate the gas flow within the cavity, thereby directing external cold air toward the condenser assembly. After the liquid medium in the parallel flow evaporator or flat-plate evaporator evaporates into a gaseous medium and flows to the condenser assembly, the agitation of the condenser assembly by the air supply devices helps the gaseous medium in the condenser assembly condense back into a liquid medium.

[0035] In one possible implementation, the first condenser is a parallel flow condenser; or, the second condenser is a parallel flow condenser; or, both the first condenser and the second condenser are parallel flow condensers.

[0036] In one possible implementation, the third condenser is a parallel flow condenser.

[0037] In one possible implementation, the second heating element group includes at least a power device; wherein the power device is located within the housing. The power device generates the most heat, and the flat-plate evaporator, in contact with the power device, can quickly cool it down, preventing damage or other safety hazards to the power device due to excessive temperature.

[0038] In one possible implementation, the first heating element group includes at least an inductor; wherein the inductor is located within the housing.

[0039] In one possible implementation, the housing is a sealed housing. By setting the housing as a sealed housing, the performance of the first heating element group and the second heating element group located inside the housing can be ensured, and external air or water can be prevented from entering the housing, which could lead to corrosion or oxidation of the first heating element group and the second heating element group.

[0040] In one possible implementation, the device with a heat dissipation device is any one of an inverter, a combiner box, or a photovoltaic storage device. Attached Figure Description

[0041] Figure 1 This is a schematic diagram of the structure of a device with a heat dissipation device provided in an embodiment of this application;

[0042] Figure 2 This is a schematic diagram of the structure of a device with a heat dissipation device provided in an embodiment of this application;

[0043] Figure 3 This is a schematic diagram of the structure of a device with a heat dissipation device provided in an embodiment of this application;

[0044] Figure 4 This is a schematic diagram of the structure of a device with a heat dissipation device provided in an embodiment of this application;

[0045] Figure 5 This is a schematic diagram of the structure of a device with a heat dissipation device provided in an embodiment of this application;

[0046] Figure 6 This is a schematic diagram of the structure of a device with a heat dissipation device provided in an embodiment of this application;

[0047] Figure 7 This is a schematic diagram of a device with a heat dissipation device provided in an embodiment of this application.

[0048] Explanation of reference numerals in the attached figures:

[0049] 100 - Inverter; 10 - Housing; 102 - Top wall of the housing;

[0050] 103 - Third sidewall; 11 - Cover; 111 - Cavity;

[0051] 1111 - First cavity; 1112 - Second cavity; 112 - First air inlet;

[0052] 113 - Second air inlet; 114 - Air outlet; 115 - First side wall;

[0053] 116 - Second side wall; 117 - Bottom wall of the enclosure; 118 - Top wall of the enclosure;

[0054] 201 - First condenser; 202 - Second condenser; 203 - Third condenser;

[0055] 204- Flat plate evaporator; 2041- First gas pipeline; 2042- First liquid pipeline;

[0056] 205 - Parallel flow evaporator; 2051 - Second gas pipeline; 2052 - Second liquid pipeline;

[0057] 301 - First heating element group; 3011 - Inductive device; 3012 - Other devices;

[0058] 302 - Second heating element group; 3021 - Power device; 40 - Circuit board;

[0059] 50 - Heat dissipation fins; 60 - Air supply device. Detailed Implementation

[0060] The terminology used in the implementation section of this application is only for explaining specific embodiments of this application and is not intended to limit this application. The implementation of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0061] Currently, photovoltaic (PV) inverters are mainly divided into three types: centralized inverters, string inverters, and distributed inverters. Centralized inverters convert the direct current (DC) generated by PV modules into alternating current (AC) before stepping up the voltage and connecting it to the grid. Therefore, centralized inverters typically have relatively high power outputs and employ a rack-mount design. For example, PV power plants generally use centralized inverters of 500kW or higher. String inverters directly convert the DC power generated by PV modules into AC power before stepping up the voltage and connecting it to the grid. Therefore, their power output is relatively smaller than that of centralized inverters, and they often employ an outdoor modular design.

[0062] Distributed inverters are a relatively new type of inverter proposed in the last two years. Their main feature is the integration of centralized inversion and distributed MPPT (maximum power point tracking) into one unit. Distributed inverters separate DC (direct current) boosting and inversion. The DC boost is distributed to the front-end combiner box, employing an outdoor modular design. The inverter is centralized near the transformer substation side, often using an outdoor cabinet design or outdoor modular integration. Distributed inverters combine the advantages of both centralized and string inverters, achieving the "low cost of centralized inverters and the high power generation of string inverters."

[0063] Whether it's a centralized inverter, string inverter, or distributed inverter, with the continuous increase in photovoltaic panel power and the ongoing cost pressure of photovoltaic grid parity, the continuous increase in the power density of combiner boxes and inverters is an inevitable trend, bringing increasingly greater challenges to heat dissipation. In existing technologies, inverters typically employ a compartmentalized design, with the internal cavity divided into a high-protection cavity and a low-protection cavity. The high-protection cavity is the first cavity, while the low-protection cavity is a direct-ventilation cavity. Electronic components are placed in the high-protection cavity, while power semiconductor heat sinks and inductor heat sinks are located in the low-protection cavity. A fan is installed in the low-protection cavity, typically using either blowing or exhaust methods to dissipate heat from the inverter.

[0064] However, the overall heat dissipation capacity of the aforementioned inverters is low and cannot meet the heat dissipation requirements. Moreover, as the power density of inverters increases, the heat dissipation of power devices increases dramatically. Under the existing heat dissipation architecture, it is necessary to continuously increase the volume or size of the heat sinks for power devices to solve the heat dissipation problem. This makes the inverters heavier and the heat dissipation cost continuously increases, preventing the market competitiveness of inverter products from being further improved.

[0065] Based on this, the present application provides a device with a heat dissipation device. By placing a parallel flow evaporator inside the casing and not contacting the first heating element group and the second heating element group, and a flat plate evaporator in direct or indirect contact with the second heating element group, and a condenser group located outside the casing and used to cooperate with the parallel flow evaporator and the flat plate evaporator to dissipate heat from the first heating element group and the second heating element group, the condenser group, the parallel flow evaporator, and the flat plate evaporator form a heat dissipation system, which provides an effective guarantee for the heat dissipation of the first heating element group and the second heating element group, can improve the overall heat dissipation capacity of the device, better meet the heat dissipation requirements of the device, and thus enhance the market competitiveness of the device.

[0066] The following describes the specific structure of the device with a heat dissipation device using different embodiments as examples and in conjunction with the accompanying drawings.

[0067] Example 1

[0068] Reference Figure 1 As shown, this application embodiment provides a device with a heat dissipation device, which may include: a housing 10, a first heating element group 301, and a second heating element group 302, wherein the first heating element group 301 and the second heating element group 302 are located within the housing 10, and the first heating element group 301 includes at least one first heating element (e.g., Figure 1 The first heating element group 301 and the second heating element group 302 include at least one second heating element (e.g., power device 3021). The first heating element group 301 and the second heating element group 302 are located within the housing 10, which prevents them from being exposed to air, thus minimizing their susceptibility to external environmental influences, slowing down equipment aging, and extending the equipment's service life.

[0069] In this embodiment, the device with a heat dissipation apparatus may further include: a parallel flow evaporator 205, a flat plate evaporator 204, and a condenser assembly (e.g., Figure 1 The first condenser 201 and the second condenser 202 in the middle, Figure 3 The third condenser 203 is located inside the housing 10 and does not contact the first heating element group 301 and the second heating element group 302. The plate evaporator 204 is in direct or indirect contact with the second heating element group 302. The condenser group is located outside the housing 10 and is used to cooperate with the parallel flow evaporator 205 and the plate evaporator 204 to dissipate heat from the first heating element group 301 and the second heating element group 302.

[0070] By having the flat-plate evaporator 204 in direct or indirect contact with the second heating element group 302, the temperature of the second heating element group 302 can be directly conducted to the flat-plate evaporator 204, and then transferred to the condenser group through the flat-plate evaporator 204, thereby enhancing the heat dissipation effect on the second heating element group 302.

[0071] like Figure 1 As shown, the device with a heat dissipation device may further include: a cover 11, specifically, the cover 11 is disposed on the housing 10, and at least one cavity 111 may be formed between the cover 11 and at least a portion of the outer wall of the housing 10, and a condenser assembly is located in the cavity 111.

[0072] It is understood that the cover 11 can be detachably mounted on the housing 10, for example, by means of threaded connection, pin connection, snap-fit ​​connection, or adhesive bonding. This embodiment does not limit the specific structure of the detachable connection. Furthermore, the cover 11 and the housing 10 can also be connected in a non-detachable manner. For example, if the connecting ends of the cover 11 and the housing 10 are both made of metal, they can be connected by welding.

[0073] It should be noted that a condenser group may include one or more condensers.

[0074] Specifically, in this embodiment, the condenser assembly may include a first condenser 201 and a second condenser 202. One of the first condenser 201 and the second condenser 202 cooperates with a parallel-flow evaporator 205 to dissipate heat from the first heating element assembly 301, and the other of the first condenser 201 and the second condenser 202 cooperates with a flat-plate evaporator 204 to dissipate heat from the second heating element assembly 302. Furthermore, the first condenser 201 and the second condenser 202 are located within the cavity 111.

[0075] like Figure 1 or Figure 2 As shown, the first condenser 201 cooperates with the flat plate evaporator 204 to dissipate heat from the second heating element group 302, and the second condenser 202 cooperates with the parallel flow evaporator 205 to dissipate heat from the first heating element group 301.

[0076] In one possible implementation, the flat-plate evaporator 204, the first condenser 201, the parallel-flow evaporator 205, and the second condenser 202 can be detachably fixed to the housing 10, for example, by threaded connection, pin connection, snap-fit ​​connection, or adhesive bonding. This embodiment does not limit the specific structure of the detachable connection. Furthermore, the flat-plate evaporator 204, the first condenser 201, the parallel-flow evaporator 205, and the second condenser 202 can also be non-detachably connected to the housing 10. For example, if the connection ends of the flat-plate evaporator 204, the first condenser 201, the parallel-flow evaporator 205, and the second condenser 202 to the housing 10 are all made of metal, then they can be connected by welding.

[0077] It should be noted that the installation position of the flat-plate evaporator 204 within the housing 10 includes, but is not limited to, the following two possible implementation methods:

[0078] One possible implementation is as follows: Figure 1 or Figure 2 As shown, the flat-plate evaporator 204 is located inside the cavity 111. This arrangement allows the external cold air entering the cavity 111 to provide some degree of heat dissipation for the flat-plate evaporator 204, thus improving the heat dissipation effect when the flat-plate evaporator 204, in conjunction with the first condenser 201, dissipates heat from the second heating element group 302.

[0079] Another possible implementation is: Figure 3 As shown, the flat-plate evaporator 204 is located inside the housing 10. At this time, the flat-plate evaporator 204 is located inside the housing, and while dissipating heat from the second heating element group 302, it can also dissipate heat from the first heating element group 301 (e.g., inductor 3011 and other devices 3012) inside the housing 10, thereby improving the overall heat dissipation capacity inside the housing 10.

[0080] Another possible implementation is: (not shown in the figure) the flat plate evaporator 20 can be located on one of the side walls of the housing 10 near the cavity 111.

[0081] Furthermore, in this embodiment, when the first condenser 201 is connected to the flat-plate evaporator 204, the vertical position of the first condenser 201 can be higher than that of the flat-plate evaporator 204. In this way, the medium flowing between the first condenser 201 and the flat-plate evaporator 204 (e.g., refrigerant or ethylene glycol aqueous solution) can spontaneously complete the heat transfer cycle based on the pressure difference between evaporation and condensation and gravity, eliminating the need for a drive pump and saving costs to some extent.

[0082] Similarly, when the second condenser 202 is connected to the parallel flow evaporator 205, the vertical position of the second condenser 202 can be higher than that of the parallel flow evaporator 205. In this way, the medium flowing between the second condenser 202 and the parallel flow evaporator 205 can spontaneously complete the heat transfer cycle by relying on the pressure difference between evaporation and condensation and gravity, without the need to install a drive pump, thus saving costs to a certain extent.

[0083] Alternatively, when the first condenser 201 is connected to the parallel flow evaporator 205, the vertical position of the first condenser 201 can be higher than that of the parallel flow evaporator 205. In this way, the medium flowing between the first condenser 201 and the parallel flow evaporator 205 (such as refrigerant or ethylene glycol aqueous solution) can spontaneously complete the heat transfer cycle by relying on the pressure difference between evaporation and condensation and gravity, without the need to install a drive pump, which saves costs to a certain extent.

[0084] When the second condenser 202 is connected to the flat-plate evaporator 204, the vertical position of the second condenser 202 is higher than that of the flat-plate evaporator 204. In this way, the medium flowing between the second condenser 202 and the flat-plate evaporator 204 can spontaneously complete the heat transfer cycle by relying on the pressure difference between evaporation and condensation and gravity, without the need to install a drive pump, thus saving costs to a certain extent.

[0085] Of course, in some other embodiments, taking the first condenser 201 connected to the flat plate evaporator 204 and the second condenser 202 connected to the parallel flow evaporator 205 as an example, a pump body (not shown in the figure) can also be provided between the first condenser 201 and the flat plate evaporator 204 and between the second condenser 202 and the parallel flow evaporator 205, with the pump body as the driving force to complete the heat transfer cycle of the medium. In this case, there is no specific limitation on the arrangement position of the first condenser 201 and the flat plate evaporator 204 and the second condenser 202 and the parallel flow evaporator 205 in the housing 10.

[0086] It is understood that the device with a heat dissipation device provided in the embodiments of this application may further include: a first gas pipe 2041 and a first liquid pipe 2042 (see Figure 1As shown in the diagram, the flat-plate evaporator 204 is connected to one of the first condenser 201 and the second condenser 202 via a first gas pipe 2041 and a first liquid pipe 2042. In operation, some of the heat from the heating element passes through the flat-plate evaporator 204, causing the internal medium to vaporize and absorb heat. After evaporation, the evaporated medium in the flat-plate evaporator 204 flows through the first gas pipe 2041 to one of the first condenser 201 and the second condenser 202 within the cavity 111 for condensation and heat release. Then, the condensed medium in one of the first condenser 201 and the second condenser 202 flows back to the flat-plate evaporator 204 via the first liquid pipe 2042, thus achieving a cooling and recirculation heat dissipation process.

[0087] Similarly, the device with a heat dissipation device provided in the embodiments of this application may further include: a second gas pipe 2051 and a second liquid pipe 2052 (see Figure 1 As shown in the diagram, the parallel flow evaporator 205 is connected to the other of the first condenser 201 and the second condenser 202 via a second gas pipe 2051 and a second liquid pipe 2052. In operation, some of the heat from the heating element passes through the flat-plate evaporator 204, causing the medium inside to vaporize and absorb heat. The evaporated medium in the parallel flow evaporator 205 flows through the second gas pipe 2051 to the other of the first condenser 201 and the second condenser 202 within the cavity 111 for condensation and heat release. The condensed medium in the other of the first condenser 201 and the second condenser 202 flows back to the parallel flow evaporator 205 via the second liquid pipe 2052, thus achieving a cooling and recirculation heat dissipation process.

[0088] For example, Figure 1 In the process, the flat plate evaporator 204 and the first condenser 201 are connected by the first gas pipe 2041 and the first liquid pipe 2042. When in operation, the heat from some of the heating elements passes through the flat plate evaporator 204, causing the medium inside to vaporize and absorb heat. After the medium in the flat plate evaporator 204 evaporates, it can flow through the first gas pipe 2041 to the first condenser 201 in the cavity 111 for condensation and heat release. Then, after the medium in the first condenser 201 condenses, it can flow back to the flat plate evaporator 204 through the first liquid pipe 2042, thereby realizing a cooling and recirculation heat dissipation process.

[0089] The parallel flow evaporator 205 and the second condenser 202 can be connected by the second gas pipe 2051 and the second liquid pipe 2052. In operation, the heat from some of the heating elements passes through the flat plate evaporator 204, causing the medium inside to vaporize and absorb heat. After evaporation, the medium in the parallel flow evaporator 205 can flow through the second gas pipe 2051 to the second condenser 202 in the cavity 111 for condensation and heat release. After condensation, the medium in the second condenser 202 can flow back to the parallel flow evaporator 205 through the second liquid pipe 2052, thereby realizing a cooling and recirculation heat dissipation process.

[0090] In this embodiment of the application, the device with a heat dissipation device can be an inverter 100. Taking the inverter 100 as an example, the following is a reference... Figure 1 As shown, the housing 10 has a first heating element group 301 and a second heating element group 302. The second heating element group 302 may include a power device 3021, which may specifically be an insulated gate bipolar transistor (IGBT).

[0091] The first heating element group 301 may include an inductor 3011 and other devices 3012. A circuit board 40 may be provided inside the housing 10, and the other devices 3022 may be located on the circuit board 40. The inductor 3011 may be directly fixedly installed inside the housing 10. For example, a mounting slot (not shown in the figure) may be provided inside the housing 1, and the inductor 3011 may be placed in the mounting slot.

[0092] Compared to existing technologies that use potting technology to encapsulate the inductor within the heat sink housing, as power increases, inductor heat dissipation also increases. Due to the low thermal conductivity of the potting compound, the inductor's thermal resistance is high. To reduce this thermal resistance, the device's size often needs to be increased, resulting in heavier and more expensive equipment. Therefore, this embodiment directly fixes the inductor 3011 at any position within the housing 10, eliminating the need for potting technology and thus enhancing the overall heat dissipation capacity of the device.

[0093] Power device 3021 is the component with the highest heat output within inverter 100. Due to the limited heat dissipation area and capacity of the inner wall of housing 10, the heat loss within the cavity increases with increasing power. The limited natural heat dissipation capacity of housing 10 leads to increasingly higher internal temperatures, resulting in shorter lifespans and higher reliability risks for the internal components. This embodiment of the application, by placing power device 3021 in contact with a flat-plate evaporator 204, directly conducts the heat from power device 3021 to the flat-plate evaporator 204, and then through the flat-plate evaporator 204 to the condenser assembly. This reduces the temperature within housing 10, enhances heat dissipation for power device 3021, and to some extent extends the lifespan and improves the reliability of the internal components.

[0094] Of course, in other embodiments, the device with heat dissipation device in the embodiments of this application may also be a combiner box or a photovoltaic storage device, etc. The embodiments of this application do not limit the specific type of device with heat dissipation device, nor are they limited to the above examples.

[0095] It should be noted that combiner boxes, also known as solar combiner boxes, are frequently used in solar photovoltaic power generation systems. Solar combiner boxes can be divided into: solar photovoltaic combiner boxes, photovoltaic array lightning protection combiner boxes, solar power generation combiner boxes, photovoltaic power generation combiner boxes, and photovoltaic lightning protection combiner boxes, etc.

[0096] In solar photovoltaic (PV) power generation systems, combiner boxes are used to reduce the wiring between solar PV arrays and inverters. Users can connect a certain number of identical PV cells in series to form PV arrays, and then connect several PV arrays in parallel to a PV combiner box. After current is collected in the PV combiner box, it is connected to a controller, DC distribution cabinet, PV inverter, and AC distribution cabinet to form a complete PV power generation system that can be connected to the grid. Furthermore, to improve system reliability and practicality, the PV combiner box can be equipped with dedicated DC surge protection modules, DC fuses, and circuit breakers, allowing users to accurately monitor the operating status of the PV cells and ensure the PV power generation system operates at its maximum efficiency.

[0097] Photovoltaic energy storage equipment is used to store photovoltaic energy. Generally, a combiner box is connected to the photovoltaic energy storage equipment. This ensures that the photovoltaic energy is transferred through the combiner box to the photovoltaic energy storage equipment for storage and backup, which helps to make the output of photovoltaic power generation smooth and stable.

[0098] In the embodiments of this application, such as Figure 1 or Figure 2 As shown, at least one air inlet (e.g., air vent) can be provided on the cover 11. Figure 2The cavity 111 has a first air inlet 112 or a second air inlet 113 and at least one air outlet 114, and both the air inlet and the air outlet 114 are connected to the cavity 111. In this way, cold air from outside can enter the cavity 111 through the air inlet, and hot air inside the cavity 111 can flow out of the cavity 111 through the air outlet 114, so as to achieve the effect of connecting the cavity 111 with the outside.

[0099] In addition, in this embodiment, the way the cover 11 is disposed on the housing 10 includes, but is not limited to, the following two possible implementations:

[0100] One possible implementation is as follows: a cover 11 is mounted on the top wall 102 of the housing, forming a cavity 111 between the cover 11 and the top wall 102 of the housing, with the cavity 111 located above the housing 10. The cavity 111's location above the housing 10 ensures that the condenser within the cavity 111 is positioned above the evaporator within the housing 10. The medium flowing between the condenser and evaporator can spontaneously complete a heat transfer cycle based on the pressure difference between evaporation and condensation, as well as gravity, eliminating the need for a drive pump and thus saving costs to some extent.

[0101] Another possible implementation is as follows: the cover 11 is provided on the top wall 102 of the shell and one of the side walls of the shell 10. A first cavity 1111 is formed between the cover 11 and the top wall 102 of the shell, and a second cavity 1112 is formed between the cover 11 and one of the side walls of the shell 10. The first cavity 1111 and the second cavity 1112 are connected, and the first cavity 1111 and the second cavity 1112 together form cavity 111. The first cavity 1111 is located above the shell 10.

[0102] For example, Figure 2 In the case, the cover 11 is provided on the top wall 102 of the shell and the third side wall 103 of the shell 10. The cover 11 and the top wall 102 of the shell form a first cavity 1111, and the cover 11 and the third side wall 103 form a second cavity 1112. The first cavity 1111 and the second cavity 1112 are connected and together form cavity 111. The first cavity 1111 is located above the shell 10, and the first condenser 201 and the second condenser 202 are located inside the first cavity 1111.

[0103] Furthermore, the arrangement and number of air inlets on the cover 11 include, but are not limited to, the following possible implementation methods:

[0104] One possible implementation is as follows: at least one air inlet includes: a first air inlet 112, located on one side wall of the enclosure 11, and an air outlet 114 located on the other side wall of the enclosure 11, with the first air inlet 112 and the air outlet 114 arranged opposite to each other. For example, as... Figure 1 or Figure 3 As shown, the first air inlet 112 is located on the first side wall 115 of the cover 11, and the air outlet 114 is located on the second side wall 116 of the cover 11. The first air inlet 112 and the air outlet 114 are arranged opposite to each other.

[0105] Another possible implementation is that the first air inlet 112 is located on one of the side walls of the cover 11, and the air outlet 114 is located on the top wall 118 of the cover (not shown in the figure).

[0106] Another possible implementation is as follows: at least one air inlet includes a first air inlet 112 and a second air inlet 113, wherein one of the first air inlet 112 and the second air inlet 113 is located on one side wall of the cover 11, and the air outlet 114 is located on the other side wall of the cover 11. One of the first air inlet 112 and the second air inlet 113 is arranged opposite to the air outlet 114, and the other of the first air inlet 112 and the second air inlet 113 is located on the bottom wall 117 of the cover.

[0107] For example, Figure 2 In this enclosure, the first air inlet 112 is located on the first side wall 115 of the enclosure 11, the air outlet 114 is located on the second side wall 116 of the enclosure 11, the first air inlet 112 and the air outlet 114 are arranged opposite to each other, and the second air inlet 113 is located on the bottom wall 117 of the enclosure. In this way, external cold air can enter the cavity 111 through the two air inlets (the first air inlet 112 and the second air inlet 113), thereby increasing the volume of cold air flowing into the cavity 111 and improving the heat dissipation effect inside the cavity 111 to a certain extent.

[0108] In one possible implementation, when the flat-plate evaporator 204 is located within the cavity 111, the flat-plate evaporator 204 is positioned close to the second air inlet 113 (see [reference]). Figure 2 (As shown). The flat plate evaporator 204 is positioned close to the second air inlet 113, which allows more external cold air to be blown onto the flat plate evaporator 204, thereby further reducing the temperature of the flat plate evaporator 204.

[0109] Of course, in other embodiments, the housing 10 may also have more air inlets or outlets 114 to achieve ventilation and heat dissipation. For example, a third air inlet (not shown in the figure) may also be provided on the top wall 118 of the cover, and this application embodiment does not limit this.

[0110] As an optional implementation, when the flat plate evaporator 204 is located inside the cavity 111, the second heating element group 302 is located inside the housing 10 on the side close to the cavity 111. A first opening (not shown in the figure) may be provided on the side wall of the housing 10 close to the cavity 111. The flat plate evaporator 204 is located close to the opening, and the flat plate evaporator 204 and the second heating element group 302 can be in contact through the first opening.

[0111] For example, when the flat-plate evaporator 204 is located inside the cavity 111 near the third side wall 103 of the shell 10, a first opening can be provided on the third side wall 103 to achieve contact between the flat-plate evaporator 204 and the second heating element group 302. When the flat-plate evaporator 204 is located inside the cavity 111 near the top wall 102 of the shell, a first opening can be provided on the top wall 102 of the shell to achieve contact between the flat-plate evaporator 204 and the second heating element group 302. This ensures direct contact between the flat-plate evaporator 204 and the second heating element group 302, allowing for better heat conduction of the second heating element group 302 to the flat-plate evaporator 204 and ensuring effective heat dissipation from the second heating element group 302.

[0112] Additionally, it is understood that when the flat-plate evaporator 204 is located on one of the side walls of the housing 10 near the cavity 111, the second heating element group 302 is disposed close to that side wall. Moreover, a second opening (not shown in the figure) may be provided on that side wall, and the flat-plate evaporator 204 may be located in the second opening so that the flat-plate evaporator 204 is in contact with the second heating element group 302.

[0113] As an optional implementation, a heat-conducting element (not shown) may be provided between the flat-plate evaporator 204 and the second heating element group 302. The heat-conducting element can be a thermally conductive coating or a thermally conductive pad; exemplarily, it can be a thermally conductive coating formed from thermally conductive silicone grease. Alternatively, the second heating element group 302 and the flat-plate evaporator 204 can be directly welded together. Since the second heating element group 302 is in contact with the flat-plate evaporator 204, by providing a heat-conducting element between them, the temperature of the second heating element group 302 can be conducted to the flat-plate evaporator 204 more quickly, improving the thermal conductivity between them.

[0114] In one possible implementation, a third opening (not shown in the figure) may also be provided on the side wall of the housing 10 near the second cavity 1112, the third opening being used to insert the parallel flow evaporator 205.

[0115] In the embodiments of this application, reference continues to be made to Figure 3 As shown, at least one air supply device 60 is also provided inside the cavity 111. The air supply device 60 is used to blow the gas flow inside the cavity 111 to blow external cold air towards the condenser assembly. After the liquid medium in the parallel flow evaporator 205 or the flat plate evaporator 204 evaporates into a gaseous medium and flows to the condenser assembly, the air supply device 60 blows the gaseous medium into the condenser assembly, which helps the gaseous medium in the condenser assembly to condense into a liquid medium, thereby enhancing the condensation effect of the condenser assembly located in the cavity 111. Moreover, the air supply device 60 blowing the gas flow inside the cavity 111 can also enhance the heat dissipation effect inside the cavity 111.

[0116] Furthermore, the airflow direction within the cavity 111 can be set using methods such as blowing or exhaust. Alternatively, an independent air duct can be provided within the cavity 111, with one end connected to the air supply device 60 and the other end connected to the first condenser 201 or the second condenser 202, thereby achieving optimal heat dissipation for the first condenser 201 or the second condenser 202. As an optional implementation, the first condenser 201 or the second condenser 202 can be positioned at a certain tilt angle within the housing 10 to form an air duct. It should be noted that in this embodiment, the air duct can be a front-in, rear-out air duct, a front-in, upper-out air duct, a front-in, side-out air duct, a bottom-in, upper-out air duct, a bottom-in, front-out air duct, a bottom-in, rear-out air duct, etc., and this embodiment does not limit the specific type of air duct.

[0117] Furthermore, in this embodiment, the positions of the first condenser 201 and the second condenser 202 can be adjusted or interchanged according to the needs of the actual application scenario. For example, if the heat of the first heating element group 301 is high, the first condenser 201 in its corresponding first heat dissipation unit is positioned close to the air inlet and the air supply device 60 to ensure that external cold air entering the cavity 111 preferentially flows through the first condenser 201 to cool and dissipate heat. If the heat of the second heating element group 302 is high, the second condenser 202 in its corresponding second heat dissipation unit is positioned close to the air inlet and the air supply device 60 to ensure that external cold air entering the cavity 111 preferentially flows through the second condenser 202 to cool and dissipate heat.

[0118] It should be noted that, in the embodiments of this application, the first condenser 201 can be a parallel flow condenser, or the second condenser 202 can be a parallel flow condenser, or both the first condenser 201 and the second condenser 202 can be parallel flow condensers.

[0119] At least one air supply device 60 is provided inside the housing 10. The air supply device 60 is used to blow the gas flow inside the housing 10 to blow the heat from the first heating element group 301 toward the parallel flow evaporator 205. Therefore, the air supply device 60 blowing the gas flow inside the cavity 111 can enhance the heat dissipation effect inside the housing 10, so as to achieve better heat dissipation for the first heating element group 301 and the second heating element group 302 inside the housing 10.

[0120] As an optional implementation, the air supply device 60 can be a fan.

[0121] In this embodiment, the housing 10 can be a sealed housing. By setting the housing 10 as a sealed housing, the performance of the first heating element group 301 and the second heating element group 302 located inside the housing 10 can be ensured, and external air or water can be prevented from entering the housing, which could lead to corrosion or oxidation of the first heating element group 301 and the second heating element group 302.

[0122] Furthermore, it should be noted that by setting up a flat-plate evaporator 204, the second heating element group 302 can be easily installed and fixed outside the flat-plate evaporator 204, allowing the second heating element group 302 to directly contact or even adhere to the flat-plate evaporator 204. This ensures good heat conduction between the second heating element group 302 and the flat-plate evaporator 204, thereby ensuring heat dissipation from the second heating element group 302. Moreover, the parallel flow evaporator 205 has advantages such as high heat exchange efficiency, small temperature difference, low resistance, and mature technology. Additionally, the parallel flow evaporator 205 is relatively inexpensive, which can reduce costs to some extent.

[0123] With the above settings, the device with heat dissipation device provided in this application embodiment has a 50% increase in total heat dissipation capacity, a 30% increase in supporting power, a 28.9% increase in heat dissipation capacity per unit weight, and the unit heat dissipation cost is basically the same as the previous generation 196KW heat pipe radiator.

[0124] Example 2

[0125] Unlike Embodiment 1 described above, referring to Figure 4 or Figure 5 As shown in the embodiment of this application, the condenser group may include: a third condenser 203, which cooperates with the parallel flow evaporator 205 to dissipate heat from the first heating element group 301, and the third condenser 203 cooperates with the flat plate evaporator 204 to dissipate heat from the second heating element group 302. Moreover, the third condenser 203 is located inside the cavity 111.

[0126] In one possible implementation, the flat-plate evaporator 204, the parallel-flow evaporator 205, and the third condenser 203 can be detachably fixed to the housing 10, for example, by threaded connection, pin connection, snap-fit ​​connection, or adhesive bonding. This embodiment does not limit the specific structure of the detachable connection. Furthermore, the flat-plate evaporator 204, the parallel-flow evaporator 205, and the third condenser 203 can also be non-detachably connected to the housing 10. For example, if the connection ends of the flat-plate evaporator 204, the parallel-flow evaporator 205, and the third condenser 203 to the housing 10 are all made of metal, they can be connected by welding.

[0127] It should be noted that the installation position of the flat-plate evaporator 204 within the housing 10 includes, but is not limited to, the following two possible implementation methods:

[0128] One possible implementation is as follows: Figure 4 As shown, the flat plate evaporator 204 is located inside the cavity 111. In this way, the external cold air entering the cavity 111 can provide heat dissipation for the flat plate evaporator 204 to a certain extent, thereby making the heat dissipation effect better when the flat plate evaporator 204 and the third condenser 203 work together to dissipate heat.

[0129] Another possible implementation is: Figure 5 As shown, the flat-plate evaporator 204 is located inside the housing 10. At this time, the flat-plate evaporator 204 is located inside the housing 10, and while dissipating heat from the second heating element group 302, it can also dissipate heat from the first heating element group 301 (e.g., inductor 3011 and other devices 3012) inside the housing 10, thereby improving the overall heat dissipation capacity inside the housing 10.

[0130] Another possible implementation is: (not shown in the figure) the flat plate evaporator 20 can be located on one of the side walls of the housing 10 near the cavity 111.

[0131] Furthermore, in this embodiment, the third condenser 203 can be positioned vertically higher than the flat-plate evaporator 204. In this way, the medium flowing between the third condenser 203 and the flat-plate evaporator 204 can spontaneously complete the heat transfer cycle based on the pressure difference between evaporation and condensation, as well as gravity, eliminating the need for a drive pump and saving costs to some extent.

[0132] Alternatively, a pump body (not shown in the figure) can be provided between the third condenser 203 and the flat plate evaporator 204, and the pump body can be used as the driving force to complete the heat transfer cycle of the medium. In this case, there is no specific limitation on the location of the third condenser 203 and the flat plate evaporator 204 in the shell 10.

[0133] Similarly, the third condenser 203 can be positioned higher in the vertical direction than the parallel flow evaporator 205. In this way, the medium flowing between the second condenser 202 and the third evaporator can spontaneously complete the heat transfer cycle by relying on the pressure difference between evaporation and condensation and gravity, without the need to install a drive pump, thus saving costs to a certain extent.

[0134] It is understandable that, such as Figure 4 As shown, the device with a heat dissipation device provided in this application embodiment may further include: a first gas pipe 2041 and a first liquid pipe 2042, wherein the flat plate evaporator 204 and the third condenser 203 are connected through the first gas pipe 2041 and the first liquid pipe 2042. In this way, after the medium in the flat plate evaporator 204 evaporates, it can flow to the third condenser 203 through the first gas pipe 2041. Then, after the medium in the third condenser 203 condenses, it can flow back to the flat plate evaporator 204 through the first liquid pipe 2042, thereby realizing the cyclic heat dissipation process of cooling backflow of the first heat dissipation unit.

[0135] Similarly, as Figure 5 As shown, the device with a heat dissipation device provided in this application embodiment may further include: a second gas pipe 2051 and a second liquid pipe 2052, wherein the parallel flow evaporator 205 and the third condenser 203 are connected through the second gas pipe 2051 and the second liquid pipe 2052. In this way, after the medium in the parallel flow evaporator 205 evaporates, it can flow to the third condenser 203 through the second gas pipe 2051. Then, after the medium in the third condenser 203 condenses, it can flow back to the parallel flow evaporator 205 through the second liquid pipe 2052, thereby realizing the cyclic heat dissipation process of cooling backflow of the second heat dissipation unit.

[0136] It should be noted that, in this embodiment, the third condenser 203 can be a parallel flow condenser.

[0137] In the embodiments of this application, other technical features are the same as those in Embodiment 1, and can achieve the same or corresponding technical effects, which will not be described in detail here.

[0138] It should be noted that Embodiment 1 and Embodiment 2 can be used separately, or they can be used in combination or referenced from each other. This application does not impose any restrictions on this.

[0139] Example 3

[0140] Based on the above embodiments one and two, referring to Figure 6 or Figure 7As shown in this embodiment, the outer wall of the flat-plate evaporator 204 may be provided with multiple spaced heat dissipation fins 50. In this way, the temperature of the flat-plate evaporator 204 can be conducted away through the multiple heat dissipation fins 50, increasing the heat dissipation area of ​​the flat-plate evaporator 204 and improving the heat dissipation capacity of the heat dissipation unit (i.e., the first heat dissipation unit) where the flat-plate evaporator 204 is located.

[0141] Of course, in some embodiments, multiple spaced heat dissipation fins 50 may be provided on the outer wall of the parallel flow evaporator 205. In this way, the temperature of the parallel flow evaporator 205 can be conducted away more through the multiple heat dissipation fins 50, thereby increasing the heat dissipation area of ​​the flat plate evaporator 204 and further improving the heat dissipation capacity of the heat dissipation unit (i.e., the second heat dissipation unit) where the flat plate evaporator 204 is located.

[0142] Furthermore, it should be noted that the materials of the first condenser 201, the second condenser 202, the third condenser 203, the flat plate evaporator 204, the parallel flow evaporator 205, the first gas pipe 2041, the first liquid pipe 2042, the second gas pipe 2051, the second liquid pipe 2052, and the heat dissipation fins 50 can be aluminum alloy, copper alloy, or steel alloy, etc., and this application embodiment does not limit this.

[0143] In the embodiments of this application, other technical features are the same as those in Embodiment 1 or Embodiment 2, and can achieve the same or corresponding technical effects, which will not be described in detail here.

[0144] It should be noted that Embodiment 1, Embodiment 2 and Embodiment 3 can be used individually or in combination with each other, and this application does not impose any restrictions on this.

[0145] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0146] The devices or elements referred to in the embodiments of this application or implied herein must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the embodiments of this application. In the description of the embodiments of this application, "a plurality of" means two or more, unless otherwise precisely specified.

[0147] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the present application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "may include" and "have," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0148] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them. Although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A device with a heat dissipation mechanism, characterized in that, include: case; A first heating element group and a second heating element group are located within the housing; wherein, the first heating element group includes at least one first heating element, and the second heating element group includes at least one second heating element; A parallel flow evaporator is located inside the housing and does not contact the first heating element group or the second heating element group; A flat-plate evaporator is in direct or indirect contact with the second heating element group; And a condenser assembly, located outside the housing, for use in conjunction with the parallel flow evaporator and the flat plate evaporator to dissipate heat from the first heating element assembly and the second heating element assembly; The condenser group includes one or more condensers.

2. The device with a heat dissipation device according to claim 1, characterized in that, Also includes: Cover; The cover is fitted onto the housing, and at least one cavity is formed between the cover and at least a portion of the outer wall of the housing; The condenser assembly is located within the cavity.

3. The device with a heat dissipation device according to claim 2, characterized in that, The flat-plate evaporator is located inside the cavity; Alternatively, the flat-plate evaporator may be located inside the housing; Alternatively, the flat-plate evaporator is located on one of the side walls of the housing near the cavity.

4. The device with a heat dissipation device according to claim 2 or 3, characterized in that, The condenser assembly includes a first condenser and a second condenser; one of the first condenser and the second condenser cooperates with the parallel flow evaporator to dissipate heat from the first heating element assembly, and the other of the first condenser and the second condenser cooperates with the flat plate evaporator to dissipate heat from the second heating element assembly. Furthermore, the first condenser and the second condenser are located within the cavity.

5. The device with a heat dissipation device according to claim 4, characterized in that, The first condenser is connected to the flat-plate evaporator, and the first condenser is positioned higher in the vertical direction than the flat-plate evaporator; the second condenser is connected to the parallel-flow evaporator, and the second condenser is positioned higher in the vertical direction than the parallel-flow evaporator. Alternatively, the first condenser is connected to the parallel flow evaporator, and the first condenser is positioned higher in the vertical direction than the parallel flow evaporator; the second condenser is connected to the flat plate evaporator, and the second condenser is positioned higher in the vertical direction than the flat plate evaporator.

6. The device with a heat dissipation device according to claim 5, characterized in that, Also includes: A first gas pipeline and a first liquid pipeline; the flat-plate evaporator is connected to one of the first condenser and the second condenser via the first gas pipeline and the first liquid pipeline, the medium in the flat-plate evaporator evaporates and flows through the first gas pipeline to one of the first condenser and the second condenser, the medium in the first condenser and the second condenser condenses and flows back to the flat-plate evaporator via the first liquid pipeline; It also includes: a second gas pipeline and a second liquid pipeline; the parallel flow evaporator is connected to the other of the first condenser and the second condenser through the second gas pipeline and the second liquid pipeline, the medium in the parallel flow evaporator evaporates and flows through the second gas pipeline to the other of the first condenser and the second condenser, and the medium in the other of the first condenser and the second condenser condenses and flows back to the parallel flow evaporator through the second liquid pipeline.

7. The device with a heat dissipation device according to claim 2, characterized in that, The condenser assembly includes: a third condenser; the third condenser cooperates with the flat-plate evaporator to dissipate heat from the second heating element assembly, and the third condenser cooperates with the parallel-flow evaporator to dissipate heat from the first heating element assembly; The third condenser is located inside the cavity.

8. The device with a heat dissipation device according to claim 7, characterized in that, The third condenser is positioned vertically higher than the flat-plate evaporator and the parallel-flow evaporator.

9. The device with a heat dissipation device according to claim 7 or 8, characterized in that, Also includes: A first gas pipeline and a first liquid pipeline; the flat-plate evaporator and the third condenser are connected by the first gas pipeline and the first liquid pipeline, the medium in the flat-plate evaporator evaporates and flows to the third condenser through the first gas pipeline, and the medium in the third condenser condenses and flows back to the flat-plate evaporator through the first liquid pipeline; It also includes: a second gas pipeline and a second liquid pipeline; the parallel flow evaporator and the third condenser are connected by the second gas pipeline and the second liquid pipeline, the medium in the parallel flow evaporator evaporates and flows to the third condenser through the second gas pipeline, and the medium in the third condenser condenses and flows back to the parallel flow evaporator through the second liquid pipeline.

10. The device with a heat dissipation device according to any one of claims 3, 5-8, characterized in that, The cover has at least one air inlet and at least one air outlet, and both the air inlet and the air outlet are connected to the cavity.

11. The device with a heat dissipation device according to claim 10, characterized in that, The cover is disposed on the top wall of the housing, and the cavity is formed between the cover and the top wall of the housing, the cavity being located above the housing.

12. The device with a heat dissipation device according to claim 10, characterized in that, The cover is provided on the top wall of the housing and one of the side walls of the housing; A first cavity is formed between the cover and the top wall of the shell, and a second cavity is formed between the cover and one of the side walls of the shell. The first cavity and the second cavity are connected and together constitute the cavity. The first cavity is located above the housing.

13. The device with a heat dissipation device according to claim 11 or 12, characterized in that, The at least one air inlet includes: a first air inlet; the first air inlet is located on one side wall of the cover, and the air outlet is located on the other side wall of the cover, with the first air inlet and the air outlet being arranged opposite to each other; Alternatively, the first air inlet is located on one of the side walls of the cover, and the air outlet is located on the top wall of the cover.

14. The device with a heat dissipation device according to claim 12, characterized in that, The at least one air inlet includes: a first air inlet and a second air inlet; one of the first air inlet and the second air inlet is located on one side wall of the cover, the air outlet is located on the other side wall of the cover, and one of the first air inlet and the second air inlet is arranged opposite to the air outlet; The other of the first and second air inlets is located on the bottom wall of the enclosure.

15. The device with a heat dissipation device according to claim 14, characterized in that, When the flat-plate evaporator is located inside the cavity, the flat-plate evaporator is positioned close to the second air inlet.

16. The device with a heat dissipation device according to any one of claims 3, 5-8, 11-12, and 14-15, characterized in that, The outer wall of the flat-plate evaporator is provided with multiple spaced heat dissipation fins.

17. The device with a heat dissipation device according to claim 4, characterized in that, When the flat-plate evaporator is located inside the cavity, the second heating element group is located inside the housing on the side close to the cavity; The housing has a first opening on its side wall near the cavity, the flat plate evaporator is located near the opening, and the flat plate evaporator and the second heating element group are in contact through the first opening.

18. The device with a heat dissipation device according to claim 12, characterized in that, When the flat-plate evaporator is located on one of the side walls of the housing near the cavity, the second heating element group is disposed near one of the side walls. A second opening is provided on one of the side walls, and the flat plate evaporator is located in the second opening so that the flat plate evaporator is in contact with the second heating element group.

19. The device with a heat dissipation device according to claim 17 or 18, characterized in that, A heat-conducting component is also provided between the flat-plate evaporator and the second heating element group.

20. The device with a heat dissipation device according to claim 12, characterized in that, The housing is provided with a third opening on the side wall near the second cavity, and the third opening is used to insert the parallel flow evaporator.

21. The device with a heat dissipation device according to any one of claims 1-3, 5-8, 11-12, 14-15, 17-18, and 20, characterized in that, One or more air supply devices are provided inside the housing. The air supply devices are used to blow the gas flow inside the housing so as to blow the heat from the first heating element group toward the parallel flow evaporator.

22. The device with a heat dissipation device according to any one of claims 2-3, 5-8, 11-12, 14-15, 17-18, and 20, characterized in that, One or more air supply devices are provided inside the cavity, which are used to blow air into the cavity to direct external cold air toward the condenser assembly.

23. The device with a heat dissipation device according to claim 5 or 6, characterized in that, The first condenser is a parallel flow condenser; Alternatively, the second condenser is a parallel flow condenser; Alternatively, both the first condenser and the second condenser may be parallel flow condensers.

24. The device with a heat dissipation device according to claim 7 or 8, characterized in that, The third condenser is a parallel flow condenser.

25. The device with a heat dissipation device according to any one of claims 1-3, 5-8, 11-12, 14-15, 17-18, and 20, characterized in that, The second heating element group includes at least: a power device; wherein the power device is located inside the housing.

26. The device with a heat dissipation device according to any one of claims 1-3, 5-8, 11-12, 14-15, 17-18, and 20, characterized in that, The first heating element group includes at least an inductor; wherein the inductor is located inside the housing.

27. The device with a heat dissipation device according to any one of claims 1-3, 5-8, 11-12, 14-15, 17-18, and 20, characterized in that, The housing is a sealed housing.

28. The device with a heat dissipation device according to any one of claims 1-3, 5-8, 11-12, 14-15, 17-18, and 20, characterized in that, The device with a heat dissipation device can be any one of an inverter, a combiner box, or a photovoltaic storage device.

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