用于半导体晶圆的集成分解和扫描的系统
By combining a single-chamber system with a nozzle and scanning arm design, the problem of large footprint and long processing time in traditional semiconductor wafer processing multi-chamber equipment is solved, achieving efficient and safe wafer decomposition and scanning.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ELEMENTAL SCI
- Filing Date
- 2021-04-12
- Publication Date
- 2026-07-17
AI Technical Summary
Traditional semiconductor wafer processing technology requires multiple chambers and equipment, resulting in long processing times, large equipment footprint, and risks of chemical exposure and contamination, making it difficult to perform efficient impurity analysis.
Employing a single-chamber system, combined with a nozzle and scanning arm, the fluid is guided along the wafer surface through a channel defined by a nozzle shroud. Combined with an atomizer and motor system, this enables wafer decomposition and scanning, reducing the risk of chemical exposure and contamination.
It enables efficient decomposition and scanning of semiconductor wafers, reduces processing time and equipment footprint, lowers the risk of chemical exposure, and improves processing efficiency and safety.
Smart Images
Figure CN115398615B_ABST