Planarization process, planarization system, and method of manufacturing an article

Abstract

Methods of planarizing a substrate include dispensing a formable material onto a substrate; contacting a superstrate held by a superstrate chuck with the formable material on the substrate to form a multi-layer structure including the superstrate, a film of the formable material, and the substrate; releasing the multi-layer structure from the superstrate chuck; providing a space between the superstrate chuck and the multi-layer structure after the releasing; positioning a light source in the space provided between the superstrate chuck and the multi-layer structure; and curing the film of the multi-layer structure by exposing the film to light emitted from the light source.

Description

Technical Field

[0001] This disclosure relates to substrate processing, and more specifically to surface planarization in semiconductor manufacturing. Background Technology

[0002] Planarization techniques are used in the fabrication of semiconductor devices. For example, processes for creating semiconductor devices involve repeatedly adding and removing material from a substrate. This process can produce layered substrates with irregular height variations (i.e., morphology), and these height variations increase with the addition of more layers. Height variations negatively impact the ability to add more layers to a layered substrate. Furthermore, semiconductor substrates (e.g., silicon wafers) are not always perfectly flat and may include initial surface height variations (i.e., morphology). One approach to address this is to planarize the substrate between layering steps. Various photolithographic patterning methods benefit from patterning on flat surfaces. In ArFi laser-based lithography, planarization improves depth of focus (DOF), critical dimension (CD), and critical dimension uniformity. In extreme ultraviolet (EUV) lithography, planarization improves feature placement and DOF. In nanoimprint lithography (NIL), planarization improves feature fill and CD control after pattern transfer.

[0003] Planarization techniques, sometimes referred to as inkjet-based adaptive planarization (IAP), involve distributing a variable droplet pattern of polymerizable material between a substrate and a superstrate, where the droplet pattern varies according to the substrate morphology. The superstrate is then brought into contact with the polymerizable material, which subsequently polymerizes on the substrate, and the superstrate is removed. Improvements to planarization techniques, including IAP, are desired for advancements in areas such as overall wafer handling and semiconductor device fabrication.

[0004] In some known planarization systems and methods, the curing step is performed by passing UV light radiation through a transparent cladding chuck. Due to the structure of the cladding chuck, curing through it results in uneven transmission of UV light radiation to the formable material located at the edge of the substrate. In particular, the transparent cladding chuck includes geometric features such as grooves, ridges, and channels that contribute to the uneven transmission of transmitted UV light. Furthermore, high intensity peaks may appear at the sharp edges of the cladding chuck due to Fresnel diffraction at the edges of these geometric features, affecting uniformity. Uneven transmission leads to unsatisfactory curing performance. Therefore, there is a need in the art for planarization systems and methods that prevent these drawbacks. Summary of the Invention

[0005] A method for planarizing a substrate includes: dispensing a formable material onto the substrate; contacting a cover plate held by a cover plate chuck with the formable material on the substrate to form a multilayer structure comprising the cover plate, a film of the formable material, and the substrate; releasing the multilayer structure from the cover plate chuck; providing a space between the cover plate chuck and the multilayer structure after the release; positioning a light source in the space provided between the cover plate chuck and the multilayer structure; and curing the film by exposing the film of the multilayer structure to light emitted from the light source.

[0006] A planarization system includes: a substrate chuck configured to hold a substrate; a cover plate chuck configured to hold a cover plate; a first positioning system configured to: contact the cover plate with a formable material dispensed on the substrate to form a multilayer structure, the multilayer structure including the cover plate, a film of the formable material, and the substrate; and provide space between the cover plate chuck and the multilayer structure after releasing the multilayer structure from the cover plate chuck; a light source; and a second positioning system configured to move the light source into the space provided between the cover plate chuck and the multilayer structure.

[0007] A method of manufacturing an article includes: dispensing a formable material onto a substrate; contacting a cover plate held by a cover plate chuck with the formable material on the substrate to form a multilayer structure comprising the cover plate, a film of the formable material, and the substrate; releasing the multilayer structure from the cover plate chuck; providing a space between the cover plate chuck and the multilayer structure after the release; positioning a light source in the space provided between the cover plate chuck and the multilayer structure; curing the film by exposing the film of the multilayer structure to light emitted from the light source; and processing the cured film to form the article.

[0008] These and other objects, features, and advantages of this disclosure will become clear when read in conjunction with the accompanying drawings and the provided claims, along with the following detailed description of exemplary embodiments of this disclosure. Attached Figure Description

[0009] To gain a detailed understanding of the features and advantages of this disclosure, embodiments of the disclosure can be described in more detail with reference to the accompanying drawings. However, it should be noted that the drawings illustrate only typical embodiments of the disclosure and should not be considered as limiting its scope, as this disclosure acknowledges other equally effective embodiments.

[0010] Figure 1 This is a schematic cross-section of an example flattening system according to one aspect of this disclosure.

[0011] Figure 2 This is a schematic plan view of an example radiation source including an array of light-emitting diodes according to one aspect of this disclosure.

[0012] Figure 3 This is a flowchart of a flattening method according to one aspect of this disclosure.

[0013] Figures 4A to 4J It shows that in the process Figure 3 The method is a schematic cross-section of the operation of the flattening system.

[0014] Figure 5 These are a series of schematic cross-sections of a first exemplary embodiment for inserting a radiation source according to one aspect of this disclosure.

[0015] Figure 6 These are a series of schematic cross-sections of a second exemplary embodiment for inserting a radiation source according to one aspect of this disclosure.

[0016] Figure 7 These are a series of schematic cross-sections of a third exemplary embodiment for inserting a radiation source according to one aspect of this disclosure.

[0017] Figure 8A This is a schematic cross-section of a fourth exemplary embodiment of an insertion of a radiation source according to one aspect of the present disclosure, wherein the radiation source is in a non-insertion position.

[0018] Figure 8B This is a schematic plan view of a fourth exemplary embodiment of an insertion of a radiation source according to one aspect of the present disclosure, wherein the radiation source is in a non-insertion position.

[0019] Figure 9A This is a schematic cross-section of a fourth exemplary embodiment of a radiation source for insertion according to one aspect of the present disclosure, wherein the radiation source is in the insertion position.

[0020] Figure 9B This is a schematic plan view of a fourth exemplary embodiment of an insertion of a radiation source according to one aspect of the present disclosure, wherein the radiation source is in the insertion position.

[0021] While this disclosure will now be described in detail with reference to the accompanying drawings, it will be described in conjunction with illustrative exemplary embodiments. It is intended that changes and modifications be made to the described exemplary embodiments without departing from the true scope and spirit of this disclosure as defined by the appended claims. Detailed Implementation

[0022] Flattening system Figure 1An example planarization system 100 according to one aspect of the present disclosure is shown. The planarization system 100 is used to planarize a film on a substrate 102. The substrate 102 may be coupled to a substrate chuck 104. The substrate chuck 104 may be, but is not limited to, a vacuum chuck, a pin chuck, a slot chuck, an electrostatic chuck, an electromagnetic chuck, and / or the like.

[0023] The substrate 102 and substrate chuck 104 can also be supported by a substrate positioning stage 106. The substrate positioning stage 106 can provide translational and / or rotational movement along one or more of the Cartesian x-axis, y-axis, z-axis, and three tilt axes. The substrate positioning stage 106, substrate 102, and substrate chuck 104 can also be positioned on a base (not shown). The movement of the stage 106 can be controlled by a controller 140 described below. The combination of the feature providing relative movement and the controller for controlling the movement of the substrate is referred to herein as a first positioning system.

[0024] The planarization system 100 may include a fluid dispenser 122. The fluid dispenser 122 may be used to deposit droplets of a liquid formable material 124 (e.g., a photocurable polymerizable material) onto a substrate 102, the volume of the deposited material varying over a region of the substrate 102 at least in part based on its topographic profile. Different fluid dispensers 122 may use different techniques to dispense the formable material 124. When the formable material 124 is jettable, an inkjet dispenser may be used to dispense the formable material. For example, thermal inkjet, microelectromechanical system (MEMS) based inkjet, valve jetting, and piezoelectric inkjet are common techniques for dispensing jettable liquids.

[0025] like Figure 1 As shown, the planarization system 100 may include a cover plate 108 having a working surface 112 facing and spaced apart from the substrate 102. The cover plate 108 may be formed of materials including, but not limited to, fused silica, quartz, silicon, organic polymers, siloxane polymers, borosilicate glass, fluorocarbon polymers, metals, hardened sapphire, and / or the like. In embodiments, the cover plate 108 is transparent to UV light radiation. The area of ​​the surface 112 is typically the same as or slightly larger than the surface of the substrate 102.

[0026] The planarization system 100 may further include a cover plate chuck 118 and a planarization head 120. The cover plate 108 may be coupled to or held by the cover plate chuck 118. As described above, the cover plate chuck 118 may include geometric features such as grooves, ridges, and channels that cause uneven transmission of passing UV light, particularly when the grooves, ridges, and channels are close to the focal plane of UV light radiation. In embodiments, the cover plate chuck 118 does not need to be transparent to UV light because, as discussed below, UV light is not emitted through the cover plate chuck 118 as part of the curing process. That is, in embodiments, the cover plate chuck 118 may be translucent or opaque to UV light. Because UV light does not pass through the cover plate chuck 118, uneven transmission of UV light is avoided. However, in another embodiment, the cover plate chuck 118 may still be transparent to UV light.

[0027] The cover plate chuck 118 may be coupled to the planarization head 120. The planarization head 120 may be movably coupled to a bridging member (not shown). The planarization head 120 may include one or more actuators (such as voice coil motors, piezoelectric motors, linear motors, nut and screw motors, etc.) configured to move the cover plate chuck 118 relative to the substrate 102 at least in the Z-axis direction (and possibly other directions such as the x-axis, y-axis, and three tilt axes). Aspects of the planarization head that allow such movement, as controlled by the controller 140, are also components of the first positioning system. In operation, one or both of the planarization head 120, the substrate positioning stage 106, or both, change the distance between the cover plate 108 and the substrate 102 to define a desired space (a bounded physical extent in three dimensions) filled with the formable material 124. For example, the planarization head 120 may move toward the substrate and may apply force to the cover plate 108 such that the cover plate contacts and expands droplets of the formable material 124, as further detailed herein. The same effect can also be achieved by moving the substrate 102 toward the cover plate 108, or both can move together.

[0028] The planarization system 100 may also include a camera 136 positioned to observe the expansion of the formable material 124 as the cover plate 108 contacts the formable material 124 during the planarization process. The camera 136 may include one or more of a CCD, a sensor array, a linear camera, and a photodetector, configured to collect light of a wavelength that shows a contrast between areas below the cover plate 108 and in contact with the formable material 124 and areas below the cover plate 108 but not in contact with the formable material 124. The camera 136 may be configured to provide images of the expansion of the formable material 124 below the cover plate 108 and / or the separation of the cover plate 108 from the cured formable material 124. The camera 136 may also be configured to measure interference fringes that change as the formable material 124 expands between the surface 112 and the substrate surface.

[0029] The fluid dispenser 122 may be movably coupled to the bridging member. In one embodiment, the fluid dispenser 122 and the flattening head 120 share one or more positioning elements. The positioning elements are part of a first positioning system. In an alternative embodiment, the fluid dispenser 122 and the flattening head 120 move independently of each other. The fluid dispenser 122 and the flattening head 120 are movable so that they can perform their respective functions without interfering with each other.

[0030] The planarization system 100 may include a radiation source 126 ( Figure 2 , Figures 4E to 4G and Figures 6 to 9B The radiation source 126 is along the exposure path 128 ( Figure 4F (e.g., UV radiation) guides photochemical energy. In one example embodiment, the radiation source 126 includes an array of light-emitting diodes (LEDs) 127 mounted on a support 129. Figure 2 A schematic plan view of an example radiation source 126 is shown, which includes an array of light-emitting diodes 127 on a support 129. Figure 2 As shown, LEDs 127 can be linearly arranged on the support 129. In an embodiment, the support 129 may have a circular shape and be the same size as or slightly larger than the substrate 102 (e.g., Figures 5 to 7 In another embodiment, the radiation source 126 may include two semicircles, referred herein as a first body 126a and a second body 126b, which together form a radiation source 126 having the same or slightly larger dimensions as the substrate 102 (e.g., Figures 8A to 9B ). Figure 2The light coverage area 130 of each LED 127 is also shown. The radiation source 126 may also include a diffuser (not shown). The diffuser may be positioned close to the light output of the LED to help achieve target uniformity. The wavelength of the emitted light may be from 300 nm to 400 nm. In an alternative embodiment, one or more sensors of the camera 136 may be integrated with the LEDs 127 of the radiation source 126. In another alternative embodiment, an optical combiner (not shown) may be used to guide light from the radiation source 126 through the cover plate 108 while allowing light from the substrate 102 to be collected by the camera 136.

[0031] The radiation source 126 can be inserted into the space between the cover plate chuck 118 and the cover plate 108, as will be discussed below. This arrangement reduces the total space required for the planarization system 100 (by avoiding external optical elements) and also avoids the need for light to pass through the cover plate chuck 118. Furthermore, to make the array of LEDs 127 most effective, the array of LEDs 127 should be close to the surface of the cured formable material 124. The array of LEDs 127 of the radiation source 126 can be pointed downwards (…). Figure 4F That is, in the Z direction. More specifically, the center of the beam emitted by each LED 127 travels along a vertical line parallel to the Z direction.

[0032] The planarization system 100 can be regulated, controlled, and / or directed by one or more processors 140 (controllers) that communicate with one or more components and / or subsystems, such as substrate chuck 104, substrate positioning stage 106, overlay chuck 118, fluid dispenser 122, planarization head 120, camera 136, radiation source 126, and positioning system. Processors 140 can operate based on instructions in a computer-readable program stored in non-transitory computer memory 142. Processors 140 can be or include one or more of a CPU, MPU, GPU, ASIC, FPGA, DSP, and general-purpose computer. Processor 140 can be a dedicated controller or a general-purpose computing device suitable as a controller. Examples of non-transitory computer-readable memory include, but are not limited to, RAM, ROM, CD, DVD, Blu-ray, hard disk drive, network attached storage (NAS), intranet-connected non-transitory computer-readable storage devices, and internet-connected non-transitory computer-readable storage devices. All method steps described herein can be performed by processor 140. A positioning system is characterized by providing movement and motion control for various components of a system.

[0033] Flattening methods Figure 3 A flowchart of a flattening method 200 according to an example embodiment is shown. Figures 4A to 4JA schematic cross-section of the planarization system 100 during method 200 is shown. Planarization method 200 can begin at step S202, where formable material 124 is dispensed onto substrate 102 in droplet form. As described above, the surface of substrate 102 has several morphologies, which may be known based on previous processing operations or measured using a profilometer, AFM, SEM, or an optical surface profilometer based on optical interference effects (such as the Zygo NewView 8200). The local bulk density of the deposited formable material 124 varies depending on the substrate morphology. Step S202 can be performed using dispenser 122 at the same location as the planarization head 120 or at another location by transporting substrate 102 to the dispensing location. Figure 1 The substrate 102 is shown after the formable material has been dispensed. Figure 4A A schematic cross-section of the substrate 102 is shown just before the cover plate 108 contacts the formable material 124 (i.e., after step S202 is completed and just before step S204). That is, in Figure 4A At the moment shown, the cover plate 108 is being held by the cover plate chuck 118 and has not yet come into contact with the formable material 124. In order to reach... Figure 4A At the indicated position, a first positioning system is used to move at least one of the planarization head 120 and the stage 106 in the Z direction, such that the distance between the planarization head 120 and the substrate 102 having the formable material 124 is reduced. Preferably, only one of the planarization head 120 and the stage 106 is moved in the Z direction, while the other remains stationary. In a preferred embodiment, the planarization head 120 moves downward in the Z direction, while the stage 106 remains stationary. However, in some cases, both may move.

[0034] Then, planarization method 200 can proceed to step S204, in which planarization head 120 is used to planarize substrate 102 having formable material 124 to form multilayer structure 111. As described above, using the first positioning system, planarization head 120 can move toward substrate 102 to apply force to cover plate 108, such that cover plate 108 contacts and expands droplets of formable material 124. Figure 4BThe post-contact steps are shown after the cover plate 108 has fully contacted the formable material 124. As the cover plate 108 contacts the formable material 124, droplets coalesce to form a formable material film 144 filling the space between the cover plate 108 and the substrate 102. Preferably, to minimize unfilled defects, the filling process occurs uniformly without trapping any air or bubbles between the cover plate 108 and the substrate 102. In an embodiment, the substrate 102 and / or the cover plate 108 are supported by controlled back pressure from the substrate chuck 106 and / or the cover plate chuck 118 to allow the formable material 124 to expand without trapping voids. The expansion begins at the center of the substrate 102 and ends at the boundary of the effective area of ​​the substrate 102. Figure 4B At the indicated moment, step S204 has been completed. Furthermore, at this time, while the cover plate 108 is still in contact with the formable material 124, a multilayer structure 111 has been formed. Specifically, the multilayer structure 111 sequentially comprises the cover plate 108, the formable material film 144, and the substrate 102, or is composed of the cover plate 108, the formable material film 144, and the substrate 102. Alternatively, the multilayer structure can also be considered to sequentially comprise the cover plate 108, the formable material film 144, the substrate 102, and the substrate chuck 104, or be composed of the cover plate 108, the formable material film 144, the substrate 102, and the substrate chuck 104. In either case, as... Figure 4B As shown, in the multilayer structure 111, the lower surface 112 of the cover plate 108 is in direct contact with the upper surface of the formable material film 144, while the lower surface of the formable material film 144 is in direct contact with the upper surface of the substrate 102.

[0035] The method can then proceed to step S206, in which the cover plate 108 is released from the cover plate chuck 118 while the cover plate 108 is still in contact with the formable material film 144. Figure 4C A schematic cross-section of the planarization system 100 is shown immediately after the release of the cover plate 108. This action of releasing the cover plate 108 from the cover plate chuck 118 causes the multilayer structure 111 to disengage from the planarization head 120. The release of the cover plate 108 from the cover plate chuck 118 can also be referred to as dechucking. Therefore, as a result of releasing the cover plate 108 from the cover plate chuck 118, the multilayer structure 111 (i.e., the cover plate 108, the formable material film 144, and the substrate 102 in sequence) remains in contact only with the substrate chuck 106.

[0036] The method can then proceed to step S208, where the first positioning system is used to provide space 132 between the cover plate chuck 118 and the multilayer structure 111. Figure 4DMore specifically, space 132 is provided by creating a distance D in the Z direction between the lower surface 133 of the cover chuck 118 and the upper surface 138 of the cover 108. Distance D is chosen such that there is just enough space in space 132 to insert the radiation source 126. Distance D can be from 10 mm to 200 mm, preferably from 30 mm to 150 mm. The ratio of distance D to radiation source thickness can be from 1.6:1 to 1.4:1 or from 2:1 to 1.1:1, preferably 1.5:1.

[0037] Space 132 can be provided by moving at least one of the planarization head 120 and the stage 106 in the Z direction using a first positioning system until a distance D between the cover plate chuck 118 and the multilayer structure 111 is reached. Preferably, as described above, only one of the planarization head 120 and the stage 106 moves in the Z direction while the other remains stationary. In a preferred embodiment, the planarization head 120 moves upward in the Z direction while the stage 106 remains stationary. Thus, space 132 is provided once the distance D is reached.

[0038] The method can then proceed to step S210, in which the radiation source 126 is inserted into the provided space 132. Figure 4E The diagram shows a schematic cross-section of the planarization system 100 at the moment when the radiation source 126 has been inserted into the space 132 and the multilayer structure 111 is held at a distance D from the cover plate chuck 118. The radiation source 126 can be inserted into the space 132 by various methods.

[0039] Figure 5 A series of schematic cross-sections are shown for a first example embodiment of inserting a radiation source 126 into space 132. Figure 5 In a first example embodiment, the planarization system 100 includes an arm 134 configured to transport a radiation source 126. Figure 5 In the embodiment shown, arm 134 can move laterally in the X dimension. For example... Figure 5 As shown, the insertion process begins with arm 134 positioned in a location where radiation source 126 has not yet been inserted into space 132. Once step S208 is completed, creating distance D and thus providing space 132, controller 140 can instruct arm 134 to move along the X dimension in direction 148. Arm 134, controller 140, and all components allowing arm 134 to move along the X dimension together form a second positioning system. That is, the second positioning system is the structure and control that allows radiation source 126 to be positioned in space 132. Figure 5 As shown, arm 134 can be controlled by controller 140 to continue moving along the X dimension in direction 148 until radiation source 126 is fully positioned within space 132.

[0040] Figure 6 A series of schematic cross-sections are shown for a second example embodiment of inserting a radiation source 126 into space 132. Figure 6 In a second example embodiment, the planarization system 100 includes the same arm 134 as in the first embodiment, wherein the arm 134 similarly transports the radiation source 126. However, in Figure 6 In the second embodiment shown, arm 134 is rotatable about the Z dimension. For example... Figure 6 As shown, the insertion process begins with the arm 134 positioned in the orientation of the space 132 before the radiation source 126 is inserted. Once step S208 is completed, creating a distance D that provides space 132, the controller 140 can instruct the arm 134 to rotate about the Z-axis in direction 150. The arm 134, the controller 140, and all components that allow the arm 134 to rotate about the Z-axis together form a second positioning system. That is, the second positioning system is the structure and control that allows the radiation source 126 to be positioned into space 132 via rotation. Figure 6 As shown, arm 134 can be controlled by controller 140 to continue rotating around the Z dimension in direction 150 until radiation source 126 is completely within space 132.

[0041] Figure 7 A series of schematic cross-sections are shown for a third example embodiment of inserting a radiation source 126 into space 132. Figure 7 In a third example embodiment, the planarization system 100 uses a substrate robot loading arm 135 to insert the radiation source 126 into the space 132. For example... Figure 7 As shown, the substrate robot loading arm 135 includes a first articulated arm 137 coupled to a second articulated arm 139. The substrate robot loading arm 135 also includes a hand 141 coupled to the second articulated arm 139. The hand 141 is also referred to as an end effector. As part of the planarization process, the hand 141 is configured to transport the substrate 102 and place it in the appropriate position on the substrate stage 106 before dispensing the formable material 124. However, in a third embodiment, the hand 141 is also configured to pick up and transport the radiation source 126. Therefore, in the third embodiment, the substrate robot loading arm 135 is modified so that the hand 141 (end effector) transports the radiation source 126, whereas the existing structure is used for inserting the radiation source 126. In other words, in Figure 5 and Figure 6 In the first and second example embodiments, the substrate robot loading arm is used separately from the dedicated arm to transport the radiation source 126, but in Figure 7In the third embodiment, the existing substrate robot loading arm 135 is configured to transport the radiation source 126 in addition to the substrate 102. Once step S208 is completed to create a distance D, thereby providing space 132, the controller 140 can instruct the substrate robot loading arm 135 to pick up the radiation source 126 via the hand 141 and insert the radiation source 126 into the space 132. Figure 7 As shown, the substrate robot loading arm 135, which transports the radiation source 126, can move from a position where the radiation source 126 is not in the space 132 to a position where the radiation source 126 is inserted into the space 132. The substrate robot loading arm 135 can translate and / or rotate along one or more of the x-axis, y-axis, z-axis, and three tilt axes as needed via the first articulated arm 137 and the second articulated arm 139 to reach the insertion position. The substrate robot loading arm 135, the controller 140, and all components that allow the substrate robot loading arm 135 to pick up the radiation source 126 and position it in the space 132 together form a second positioning system. That is, the second positioning system is the structure and control that allows the positioning of the radiation source 126. In an alternative embodiment, in addition to the radiation source, the robot loading arm 135 is also used to load the cover plate 108 onto and unload the cover plate 108 from the cover plate chuck 118. In an alternative embodiment, the robotic loading arm 135 is used for: loading the cover plate 108 onto and unloading the cover plate 108 from the cover plate chuck 118; transporting the radiation source 126; and is not used for loading the substrate. In an alternative embodiment, the robotic loading arm 135 does not transport the radiation source 126 integrated into the robotic loading arm 135.

[0042] Figures 8A to 9B A fourth example embodiment for inserting radiation source 126 into space 132 is shown. Figure 8A This is a schematic cross-section of a fourth example embodiment for inserting radiation source 126, wherein radiation source 126 is in the uninserted position. Figure 8B This is a schematic plan view of a fourth example embodiment for inserting a radiation source, wherein the radiation source 126 is in the uninserted position. Figure 9A This is a schematic cross-section of a fourth example embodiment for inserting radiation source 126, wherein radiation source 126 is in the insertion position. Figure 9B This is a schematic plan view of a fourth example embodiment for inserting radiation source 126, wherein radiation source 126 is in the insertion position.

[0043] exist Figures 8A to 9B In the fourth example embodiment, the radiation source 126 comprises two separate components, which, when positioned together, are identical to the radiation sources in other embodiments. More specifically, the radiation source 126 includes a first body 126a supporting a portion of the LEDs and a second body 126b supporting another portion of the LEDs. Figure 8BAs best shown, the first body 126a and the second body 126b can each be semi-circular and can have the same size. Figure 9B As best shown, when the straight edges of each of the first body 126a and the second body 126b abut against each other, they form a complete circle. This complete circle is... Figure 2 The single radiation sources shown have the same size and shape. In an alternative embodiment, radiation source 126 includes more than two components, which are sub-sections of a circle formed by one or more arms coming together to form a complete circle. For example, the number of components can be two to six.

[0044] Figures 8A to 9B The planarization system 100 of the embodiment further includes a first pivot arm 143 coupled to a first body 126a and a second pivot arm 145 coupled to a second body 126b. A first end of the first pivot arm 143 is coupled to the first body 126a, while the opposite second end of the first pivot arm 143 is coupled to a pivot point 147. Similarly, a first end of the second pivot arm 145 is coupled to the second body 126b, while the opposite second end of the second pivot arm 145 is coupled to the pivot point 147. By rotating each of the first pivot arm 143 and the second pivot arm 145 about the pivot point 147, the first pivot arm 143 can move the first body 126a along an arcuate path 151, and the second pivot arm 145 can move the second body 126b along the arcuate path 151. Figure 8B The first pivot arm 143 and the second pivot arm 145 can rotate about the pivot point 147 via one or more motors. Preferably, each pivot arm has a separate motor.

[0045] As mentioned above, Figure 8A and Figure 8B The orientation of the fourth example embodiment is shown, wherein the first body 126a and the second body 126b of the radiation source 126 are outside the space 132. Figure 9A and Figure 9B The orientation of the fourth example embodiment is shown, wherein the first body 126a and the second body 126b of the radiation source 126 are inserted into the space 132. Figure 8A and Figure 8BAs shown, the insertion process begins with the first body 126a and the second body 126b positioned at a location where the radiation source 126 has not yet been inserted into the space 132. Once step S208 is completed, creating a distance D to provide space 132, the controller 140 can instruct the first pivot arm 143 and the second pivot arm 145 to rotate about the pivot point 147, causing the first body 126a and the second body 126b to move towards each other along the arcuate path 151. The first pivot arm 143, the second pivot arm 145, the motor, the controller 140, and all components that allow the first body 126a and the second body 126b to move along the arcuate path 151 form the second positioning system. That is, the second positioning system is the structure and control that allows the radiation source 126 to be positioned in space 132. The first pivot arm 143 and the second pivot arm 145 can be controlled by the controller 140 to continue moving the first body 126a and the second body 126b toward each other along the arc path 151 until the first body 126a and the second body 126b (together forming the radiation source 126) are completely positioned in space 132.

[0046] As mentioned above, Figure 9A and Figure 9B The orientation of the fourth example embodiment is shown, wherein the first body 126a and the second body 126b of the radiation source 126 are completely located within space 132. Figure 9A As shown in the cross-sectional view, each of the first body 126a and the second body 126b has been fully rotated around the arcuate path 151 until the flat edges abut against each other. The first body 126a and the second body 126b thus together form a complete radiation source 126 covering the entire surface area of ​​the multilayer structure 111. Figure 9B As shown in the plan view, once the first body 126a and the second body 126b forming the radiation source 126 are fully inserted into the space 312, they are completely located below the planarized head 120.

[0047] After completing step S210 and inserting the radiation source 126 into the space 132, the method can then proceed to step S212, in which the formed film 144 is solidified while maintaining the distance D between the multilayer structure 111 and the cover plate chuck 118. Figure 4F A schematic cross-section of the planarization system 100 is shown at the moment the curing process begins while maintaining a distance D. The polymerization or curing of the formable material 124 can be initiated by photochemical radiation (e.g., UV radiation). For example, radiation source 126 provides photochemical radiation to cure, solidify, and / or crosslink the formable material film 144, thereby defining a cured layer 146 on the substrate 102. As described above, the radiation source 126 is guided such that the center of the beam points downwards, i.e., parallel to the Z-direction. Figure 4FAs shown, because the radiation source 126 is located between the cladding chuck 118 and the multilayer structure 111, UV light does not need to pass through the cladding chuck 118. By preventing UV light from passing through the cladding chuck 118, the non-uniformity problem discussed above is avoided. Furthermore, because UV light does not pass through the cladding chuck 118, the cladding chuck 118 can be made of a material that is translucent or opaque relative to UV light.

[0048] like Figure 4F As further shown, because the cover plate 108 is configured to be transparent to UV light radiation emitted from the LED 127 array of the radiation source 126, the UV light radiation passes through the cover plate 108 and acts on the formable material film 144 to cure the formable material film 144, thereby producing a cured layer 146.

[0049] Figure 4G A schematic cross-section of the planarization system 100 is shown at the moment the curing process is complete. (See diagram.) Figure 4G As shown, when the curing process is complete, the formable material film 144 becomes the cured layer 146. Similarly, the multilayer structure 111 becomes the cured multilayer structure 113. The difference between the cured multilayer structure 113 and the multilayer structure 111 is that the multilayer structure 111 includes the formable material film 144 between the cover plate 108 and the substrate 102, while the cured multilayer structure 113 includes the cured layer 146 between the cover plate 108 and the substrate 102. In other words, the cured multilayer structure 113 sequentially includes the cover plate 108, the cured layer 146, and the substrate 102, or is composed of the cover plate 108, the cured layer 146, and the substrate 102. On the other hand, the cured multilayer structure 113 can also be considered to sequentially include the cover plate 108, the cured layer 146, the substrate 102, and the substrate chuck 104, or is composed of the cover plate 108, the cured layer 146, the substrate 102, and the substrate chuck 104.

[0050] After curing is completed in step S212, the method can proceed to step S214, in which the radiation source 126 is removed from the space 132. Figure 4H The schematic cross-section of the flattened system 100 is shown at the moment when the radiation source 126 has been removed from space 132 while the distance D still exists. The removal of the radiation source 126 from space 132 can be performed by reversing the insertion step S210. That is, reversing the above regarding... Figures 5 to 9B The steps discussed in the various embodiments shown are for removing radiation source 126.

[0051] like Figure 5 As shown, the removal step in the first example embodiment requires using a second positioning system to move arm 134 in a direction 160 opposite to direction 148. Figure 6As shown, the removal step in the second example embodiment requires rotating arm 134 in a direction 162 opposite to direction 150 using a second positioning system. Figure 7 As shown, the removal step in the third example embodiment requires using a second positioning system to move the substrate robot loading arm 135 out of the insertion position and back to the starting position via the first articulated arm 137 and the second articulated arm 139. The removal step in the fourth example embodiment requires using the second positioning system to rotate the first pivot arm 143 and the second pivot arm 145 about the pivot point 147 in a manner opposite to the insertion rotation, such that the first body 126a travels along the arcuate path 151 in a manner opposite to the direction of the insertion step, and the second body 126b travels along the arcuate path 151 in a manner opposite to the direction of the insertion step (i.e., moving away from each other), until the first body 126a and the second body 126b return to the starting position. Figure 8A and Figure 8B The orientation shown.

[0052] After the radiation source has been removed from space 132, planarization method 200 can then proceed to step S216, in which the cover plate 108 is separated from the cured layer 146. In order to remove the cover plate 108 from the cured layer 146, the cover plate chuck 118 can be recoupled to the cover plate 108 via the operation of the planarization head 120 while the cover plate 108 is still in contact with the cured layer 146 (i.e., the cover plate 108 is re-clamped). Figure 4I A schematic cross-section of the planarization system 100 is shown at the moment when the cover plate chuck 118 is recoupled to the cover plate 108. To couple the cover plate chuck 118 to the cover plate 108, at least one of the planarization head 120 and the stage 106 is moved in the Z-direction using a positioning system until the cover plate chuck 118 contacts the cover plate 108. Preferably, only one of the planarization head 120 and the stage 106 is moved in the Z-direction using the positioning system, while the other remains stationary. In a preferred embodiment, the planarization head 120 moves downward in the Z-direction, while the stage 106 remains stationary. However, in some cases, both may move.

[0053] Once the cover plate 108 is coupled to the cover plate chuck 118 ( Figure 4I The cover plate chuck 118 can be lifted upwards away from the substrate 102 by moving the planarizing head 120 upwards in the Z direction using the positioning system or by moving the stage 106 downwards in the Z direction using the positioning system. As mentioned above, both can be moved. Because the cover plate 108 is coupled to the cover plate chuck 118, the lifting force (or lowering force) will cause the cover plate 108 to separate from the cured layer 146.

[0054] Figure 4J A schematic cross-section of the planarization system 100 is shown after the cover plate 108 has separated from the cured layer 146. Figure 4J As shown, at this time, the cover plate 108 is once again in a state of... Figure 1 The substrate 102 is positioned as shown in the diagram, with the cured layer 146 exposed on it. The substrate 102 and the cured layer 146 can then be subjected to additional known steps and processes for device (article) manufacturing, including, for example, patterning, curing, oxidation, layer formation, deposition, doping, planarization, etching, formable material removal, dicing, bonding, and encapsulation. The substrate 102 can be processed to produce multiple articles (devices). These additional steps can be performed by removing the substrate 102 with the exposed cured layer 146 from the housing 114 to different locations. Once the substrate 102 with the exposed cured layer 146 is removed, the planarization system 100 is ready to receive a new substrate with formable material and repeat the above processing.

[0055] In view of this description, further variations and alternative embodiments of various aspects will be apparent to those skilled in the art. Therefore, this description is to be interpreted as illustrative only. It should be understood that the forms shown and described herein will be regarded as examples of embodiments. Elements and materials may be substituted for those shown and described herein, components and processes may be reversed, and certain features may be used independently, all of which will be apparent to those skilled in the art upon benefiting from this description.

Claims

1. A method for planarizing a substrate using a planarization system, the method comprising: Dispensing formable materials onto a substrate; The cover plate held by the cover plate chuck is brought into contact with the formable material on the substrate to form a multilayer structure including the cover plate, a film of the formable material and the substrate; Release the multi-layer structure from the cover plate chuck; After the release, space is provided between the cover plate chuck and the multilayer structure; The light source is inserted from outside the space provided between the cover plate chuck and the multilayer structure into the provided space; as well as The film is cured by exposing the multilayered film to light emitted from the light source. The flattening system includes: The first main body supports the first light-emitting diode array; The second main body supports the second light-emitting diode array; The pivot point is located outside the provided space; A first pivot arm, having a first end coupled to a first body and a second end coupled to a pivot point; and The second pivot arm is coupled to the second main body at its first end and to the pivot point at its opposite second end. The first body and the second body together form the light source, and Inserting the light source into the provided space includes rotating each of the first pivot arm and the second pivot arm around the pivot point from a state where the angle between the first pivot arm and the second pivot arm is a first angle where the first body and the second body are located outside the provided space, to a state where the angle between the first pivot arm and the second pivot arm is a second angle where the first body and the second body are located inside the provided space.

2. The method according to claim 1, wherein, Providing the space includes moving at least one of the cover plate chuck and the multilayer structure such that a distance is provided between the cover plate chuck and the multilayer structure.

3. The method according to claim 1, further comprising: After curing, the light source is removed from the provided space.

4. The method according to claim 3, further comprising: After the light source is removed, at least one of the cover plate chuck and the multilayer structure is moved such that the cover plate chuck contacts the cover plate.

5. The method according to claim 3, further comprising: After removing the light source, the cover plate is separated from the cured film.

6. The method according to claim 1, wherein, The light emitted from the light source has a wavelength of 300nm to 400nm.

7. The method according to claim 1, wherein, Rotating each of the first and second pivot arms around the pivot point causes the first and second bodies to travel toward each other along an arc-shaped path.

8. The method according to claim 1, wherein, The first pivot arm and the second pivot arm rotate around the pivot point via one or more motors.

9. The method according to claim 1, wherein, Each of the first and second main bodies is semi-circular in shape.

10. The method according to claim 9, wherein, The straight edges of the first body and the straight edges of the second body abut against each other in the provided space, so that the first body and the second body together form a complete radiation source.

11. A planarization system, the planarization system comprising: A substrate chuck, which is configured to hold the substrate; A cover plate chuck, configured to hold the cover plate; The first positioning system is constructed as follows: The cladding is brought into contact with a formable material dispensed on the substrate to form a multilayer structure, the multilayer structure including the cladding, a film of the formable material, and the substrate; as well as After the multilayer structure is released from the cover plate chuck, space is provided between the cover plate chuck and the multilayer structure; light source; as well as The second positioning system is configured to insert the light source from outside the space provided between the cover plate chuck and the multilayer structure into the provided space. The light source includes: A first main body, which supports a first light-emitting diode array; and The second main body supports the second light-emitting diode array. The flattening system further includes: Pivot point; A first pivot arm, having a first end coupled to a first body and a second end coupled to a pivot point; and The second pivot arm is coupled to the second main body at its first end and to the pivot point at its opposite second end. The first body and the second body together form the light source, and The second positioning system is configured to rotate each of the first and second pivot arms around the pivot point from a first angle between the first and second pivot arms where the angle between the first and second pivot arms is outside the provided space, to a second angle between the first and second pivot arms where the angle between the first and second pivot arms is inside the provided space.

12. A method of manufacturing an article, the method comprising: Dispensing formable materials onto a substrate; The cover plate held by the cover plate chuck is brought into contact with the formable material on the substrate to form a multilayer structure including the cover plate, a film of the formable material and the substrate; Release the multi-layer structure from the cover plate chuck; After the release, space is provided between the cover plate chuck and the multilayer structure; The light source is inserted from outside the space provided between the cover plate chuck and the multilayer structure into the provided space; The film is cured by exposing the multilayer structure to light emitted from the light source; as well as The cured film is processed to form the article. The light source includes: A first main body, which supports a first light-emitting diode array; and The second main body supports the second light-emitting diode array. The first body and the second body together form the light source. Inserting the light source into the provided space includes rotating each of the first and second pivot arms around a pivot point from a state where the angle between the first and second pivot arms is a first angle in which the first and second bodies are located outside the provided space, to a state where the angle between the first and second pivot arms is a second angle in which the first and second bodies are located inside the provided space. Wherein, the first pivot arm is coupled to the first body at a first end and to the pivot point at a opposite second end of the first pivot arm, and The second pivot arm is coupled to the second body at a first end and to the pivot point at a opposite second end.

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