processing device

Abstract

The present application provides a processing device which easily performs a work of bonding a dicing tape to a back surface of a wafer on which a ring-shaped reinforcing portion is formed on a back surface corresponding to a remaining area of an outer periphery to be integrated with a frame, and cutting and removing the reinforcing portion. A reinforcing portion removing mechanism included in the processing device has a laser beam irradiation unit which irradiates a laser beam toward a root portion of the reinforcing portion formed on an outer periphery of the wafer to form a cutting groove, a first lifting stage which holds and lifts a frame unit and is positioned at the laser beam irradiation unit, and a separation portion which separates the reinforcing portion from the cutting groove, the separation portion having an ultraviolet irradiation portion which irradiates an ultraviolet ray to the tape corresponding to the cutting groove to reduce an adhesive force of the tape, a second lifting stage which exposes the reinforcing portion on the outer periphery to attract and hold an inner side of the wafer, a separator which separates the reinforcing portion by applying a stopper having a wedge-shaped portion to the outer periphery of the reinforcing portion, and a disposal portion which disposes the separated reinforcing portion.

Description

Technical Field

[0001] The present invention relates to a processing apparatus for removing a convex reinforcing portion from a wafer on a back surface corresponding to the remaining peripheral region, wherein a ring-shaped reinforcing portion is formed in a convex shape. Background Technology

[0002] The wafer has a device area on the front side divided by predetermined dividing lines for multiple devices such as ICs and LSIs, and a remaining area around the device area on the outer periphery. After the wafer is ground to the desired thickness on the back side, it is divided into individual device chips by a cutting device and a laser processing device. The divided device chips are used in electronic devices such as mobile phones and personal computers.

[0003] To facilitate the handling of the ground wafer, the following technique is proposed: an annular reinforcing portion remains on the back side corresponding to the remaining peripheral area; after performing the prescribed processing, a scribe strip is attached to the back side of the wafer, and the wafer is supported by a frame to remove the annular reinforcing portion from the wafer (see, for example, Patent Document 1).

[0004] Patent Document 1: Japanese Patent Application Publication No. 2010-62375

[0005] However, the following problems exist: it is difficult to attach the dicing tape to the back of the wafer, which has a convex ring-shaped reinforcement on the back corresponding to the remaining peripheral area, so that it becomes an integral part of the frame; and it is difficult to cut the ring-shaped reinforcement and remove it from the wafer, resulting in poor productivity. Summary of the Invention

[0006] Therefore, the object of the present invention is to provide a processing apparatus that facilitates the application of a dicing tape to the back surface of a wafer on which a ring-shaped reinforcing portion is formed in a convex shape on the back surface corresponding to the remaining peripheral area, thereby making the wafer integral with a frame, and facilitates the cutting and removal of the ring-shaped reinforcing portion from the wafer.

[0007] According to one aspect of the present invention, a processing apparatus is provided for removing a raised reinforcing portion from a wafer on a back surface corresponding to the remaining peripheral region, wherein the processing apparatus comprises: a wafer cassette stage for holding a wafer cassette containing a plurality of wafers; a wafer removal mechanism for removing wafers from the wafer cassette stage; a wafer stage for supporting the front side of the wafers removed by the wafer removal mechanism; a frame receiving mechanism for receiving a plurality of annular frames having openings for receiving wafers; and a frame removal mechanism. The system includes: a frame removal mechanism; a frame platform supporting the frame removed by the frame removal mechanism; a tape attaching mechanism positioned above the frame platform to attach tape to the frame; a tape-frame transport mechanism transporting the tape-attached frame to the wafer stage and positioning the frame opening against the back of the wafer supported by the wafer stage, thus placing the tape-frame on the wafer stage; a tape pressing mechanism pressing the tape-frame onto the back of the wafer; and a frame unit removal mechanism that uses the tape pressing mechanism to press the tape-frame onto the back of the wafer to form a frame unit. The frame unit is removed from the wafer stage and temporarily placed on a temporary stage; a reinforcement removal mechanism cuts and removes the annular reinforcement from the wafer of the frame unit placed on the temporary stage; a ringless unit removal mechanism removes the ringless unit from the reinforcement removal mechanism; and a frame box stage that holds a frame box for storing the ringless units removed by the ringless unit removal mechanism. The reinforcement removal mechanism includes: a laser beam irradiation unit that irradiates a laser beam toward the base of the annular reinforcement formed on the outer periphery of the wafer to form a cutting groove; a first lifting stage; It holds and raises the frame unit temporarily placed on the temporary stage and positions it in the laser beam irradiation unit; and a separation section that separates the annular reinforcement from the cutting groove. The separation section includes: an ultraviolet irradiation section that irradiates ultraviolet light onto the strip corresponding to the cutting groove to reduce the adhesion of the strip; a second lifting stage that exposes the annular reinforcement on its outer periphery and attracts and holds the inner side of the wafer; a separator that uses a wedge-shaped block to act on the outer periphery of the annular reinforcement to separate the annular reinforcement; and a discard section that discards the separated annular reinforcement.

[0008] Preferably, the second lifting platform includes two or more platform heads with outer diameters corresponding to the inner diameter of the reinforcing portion of the wafer. These platform heads are detachably mounted on the lifting mechanism. The separation unit has a detector that checks whether the type of platform head input to the control unit matches the type of platform head actually installed. This detector also checks whether the outer diameter of the platform head obtained by contacting the stop of the separator with the outer periphery of the platform head matches the outer diameter of the platform head input to the control unit. Furthermore, the processing apparatus preferably has a frame support portion adjacent to the stop of the separation unit and supporting the frame. Additionally, the frame support portion preferably has a rotatable sphere. Furthermore, an ionizer is preferably provided adjacent to the stop of the separation unit to remove static electricity from the frame unit.

[0009] According to one aspect of the processing apparatus of the present invention, it is easy to perform the operation of attaching the dicing tape to the back side of a wafer on which an annular reinforcing portion is formed in a convex shape on the back side corresponding to the remaining area of ​​the outer periphery, thus making it integral with the frame, and it is easy to cut off the annular reinforcing portion and remove it from the wafer, resulting in good productivity. Attached Figure Description

[0010] Figure 1 It is a three-dimensional view of the processing equipment.

[0011] Figure 2 Through Figure 1 A perspective view of the wafer being processed by the processing apparatus shown.

[0012] Figure 3 yes Figure 1 A three-dimensional view of the wafer cassette, etc. shown.

[0013] Figure 4 yes Figure 1 The image shown is a three-dimensional representation of the hand.

[0014] Figure 5 yes Figure 1 A three-dimensional diagram of the frame storage mechanism, etc., is shown.

[0015] Figure 6 (a) is Figure 1 The diagram shown is a perspective view of the frame platform in its lowered position, including the adhesive mechanism and other components. Figure 6 (b) is Figure 1 The diagram shows a perspective view of the frame platform in its raised position, including the adhesive mechanism and other components.

[0016] Figure 7 yes Figure 1 The exploded perspective view of the crimping mechanism is shown.

[0017] Figure 8 This is a cross-sectional view showing the state of the belt being pressed by the pressing rollers at the beginning of the belt crimping process.

[0018] Figure 9 This is a cross-sectional view showing the state of the belt after the pressing roller has finished pressing the belt during the belt pressing process.

[0019] Figure 10 yes Figure 1 A perspective view of the reinforcement removal mechanism shown.

[0020] Figure 11 This is a schematic diagram showing the state of irradiating the base of the wafer with a laser beam during the reinforcement removal process.

[0021] Figure 12 yes Figure 1 A perspective view of the first lifting platform of the reinforcement removal mechanism shown.

[0022] Figure 13 (a) is Figure 1 The diagram shows a perspective view of the separation section of the reinforcement removal mechanism. Figure 13 (b) is Figure 13 An enlarged perspective view of the support substrate shown in (a).

[0023] Figure 14 yes Figure 1 A perspective view of the waste section of the reinforcement removal mechanism shown.

[0024] Figure 15 This shows how to make the stop block and Figure 1 The diagram shows the state of the probe contacting and detecting the outer diameter of the probe.

[0025] Figure 16 This is a schematic diagram showing the state of the wafer being held by a second lifting platform during the reinforcement removal process.

[0026] Figure 17 This is a schematic diagram showing the state in which the stop of the reinforcement removal mechanism acts on the outer periphery of the annular reinforcement during the reinforcement removal process.

[0027] Figure 18 This is a schematic diagram showing the state in which the reinforcement has been separated from the wafer during the reinforcement removal process.

[0028] Figure 19 yes Figure 1 A perspective view of the flipping mechanism of the acyclic unit removal mechanism shown.

[0029] Figure 20 yes Figure 1 A perspective view of the acyclic unit support and push-in portion of the acyclic unit transfer mechanism shown.

[0030] Figure 21 This is a three-dimensional view showing the state of the acyclic unit storage process.

[0031] Label Explanation

[0032] 2: Processing device; 4: Wafer; 4a: Front side of the wafer; 4b: Back side of the wafer; 6: Wafer cassette; 8: Wafer cassette stage; 10: Wafer removal mechanism; 12: Wafer stage; 20: Remaining peripheral area; 24: Reinforcing section; 64: Frame; 64': With frame; 66: Frame storage mechanism; 68: Frame removal mechanism; 70: Frame stage; 98: With pasting mechanism; 100: With frame conveying mechanism; 102: With crimping mechanism; 192: Frame unit removal mechanism; 194: Adding 196: Acyclic unit removal mechanism; 198: Frame box; 200: Frame box platform; 204: Temporary platform; 244: Laser beam irradiation unit; 246: First lifting platform; 248: Separation section; 256: Cutting groove; 270: Ultraviolet irradiation section; 272: Second lifting platform; 274: Separator; 276: Waste section; 287: Platform head; 400: Support base plate; 402: Stop; 404: Frame support section; 404b: Sphere; 406: Ionizer. Detailed Implementation

[0033] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0034] Reference Figure 1 As described above, the processing apparatus 2 of this embodiment includes: a wafer cassette stage 8, which holds a wafer cassette 6 containing a plurality of wafers; a wafer removal mechanism 10, which removes wafers from the wafer cassette 6 held in the wafer cassette stage 8; and a wafer stage 12, which supports the front side of the wafers removed by the wafer removal mechanism 10.

[0035] exist Figure 2 The image shows a wafer 4 being processed by the processing apparatus 2. The front side 4a of the wafer 4 has a device region 18 divided by grid-like predetermined dividing lines 16, which divide multiple devices 14 such as ICs and LSIs, and a remaining peripheral region 20 surrounding the device region 18. Figure 2 For ease of explanation, the boundary 22 between the device region 18 and the peripheral remaining region 20 is shown with a double-dotted line, but in reality, the line showing the boundary 22 does not exist. On the back side 4b of the wafer 4, a convex annular reinforcement 24 is formed in the peripheral remaining region 20, and the thickness of the peripheral remaining region 20 is greater than the thickness of the device region 18. In addition, a notch 26 indicating the crystal orientation is formed at the periphery of the wafer 4.

[0036] like Figure 3As shown, multiple wafers 4 are stored in the wafer cassette 6 with their front faces 4a facing upwards and spaced apart in the vertical direction. The wafer cassette stage 8 of the illustrated embodiment has a top plate 28 for mounting the wafer cassette 6 and a support plate 30 for supporting the top plate 28. Furthermore, the top plate 28 can be raised and lowered freely, and a lifting mechanism can be provided to raise and lower the top plate 28 to any desired height.

[0037] Reference Figure 3 Continuing the explanation, the chip removal mechanism 10 has the capability to... Figure 3 The Y-axis movable member 32, indicated by the middle arrow Y, is freely movable in the Y-axis direction, and a Y-axis feed mechanism 34 moves the Y-axis movable member 32 in the Y-axis direction. The Y-axis feed mechanism 34 includes: a ball screw 36 connected to the lower end of the Y-axis movable member 32 and extending along the Y-axis direction; and a motor 38 that rotates the ball screw 36. The Y-axis feed mechanism 34 converts the rotational motion of the motor 38 into linear motion via the ball screw 36 and transmits it to the Y-axis movable member 32, causing the Y-axis movable member 32 to move along a pair of guide rails 40 extending along the Y-axis direction. Furthermore, Figure 3 The X-axis direction indicated by the middle arrow X is perpendicular to the Y-axis direction. Figure 3 The Z-axis, indicated by the middle arrow Z, is a vertical direction perpendicular to both the X-axis and Y-axis. The XY plane defined by the X-axis and Y-axis is essentially horizontal.

[0038] like Figure 3 As shown, the wafer unloading mechanism 10 of the illustrated embodiment includes: a conveying arm 42; and a hand 44 disposed at the front end of the conveying arm 42, which supports the back side 4b of the wafer 4 housed in the wafer cassette 6, causing the front and back sides of the wafer 4 to flip. The conveying arm 42 is disposed on the upper surface of the Y-axis movable member 32 and is driven by a suitable drive source (not shown) such as an air drive source or an electric drive source. This drive source drives the conveying arm 42 to position the hand 44 at arbitrary positions in each of the X-axis, Y-axis, and Z-axis directions, and causes the hand 44 to flip up and down.

[0039] Reference Figure 4 To illustrate, the hand 44 preferably supports the Bernoulli pad of the wafer 4 in a non-contact manner by generating negative pressure through air ejection. In the illustrated embodiment, the hand 44 is generally C-shaped, with multiple air outlets 46 formed on one surface of the hand 44, connected to a compressed air supply source (not shown). Multiple guide pins 48 are circumferentially spaced along the outer periphery of the hand 44. Each guide pin 48 is configured to move freely in the radial direction of the hand 44.

[0040] like Figure 3 and Figure 4As shown, after positioning the hand part 44 on the back side 4b (lower side) of the wafer 4 placed in the wafer cassette 6 of the wafer stage 8, the wafer removal mechanism 10 ejects compressed air from the air outlet 46 of the hand part 44, generating negative pressure on one side of the hand part 44 through the Bernoulli effect, thereby attracting and holding the wafer 4 from the back side 4b side by the hand part 44 in a non-contact manner. The horizontal movement of the wafer 4 held by the hand part 44 is restricted by the guide pins 48. Furthermore, the wafer removal mechanism 10 moves the Y-axis movable member 32 and the conveying arm 42, thereby removing the wafer 4 held by the hand part 44 from the wafer cassette 6.

[0041] like Figure 4 As shown, the wafer removal mechanism 10 of the illustrated embodiment has a notch detector 50 for detecting the position of the notch 26 of the wafer 4. The notch detector 50 may, for example, be configured to include: a light-emitting element 52 and a light-receiving element 54, which are arranged spaced apart from each other in the vertical direction; and a drive source (not shown) that causes at least one of the guide pins 48 of the hand 44 to rotate.

[0042] The light-emitting element 52 and the light-receiving element 54 can be attached to the Y-axis movable member 32 or the transport path by means of a suitable bracket (not shown). Furthermore, when the guide pin 48 is rotated by the aforementioned drive source, the wafer 4 supported by the hand 44 rotates due to the rotation of the guide pin 48. To reliably transmit rotation from the guide pin 48 to the wafer 4, it is preferable that the outer peripheral surface of the guide pin 48, which is rotated by the drive source, is formed of a suitable synthetic rubber.

[0043] With the wafer 4 held in place by the hand 44 and its outer periphery positioned between the light-emitting element 52 and the light-receiving element 54, the notch detector 50 uses a drive source to rotate the wafer 4 via the guide pin 48, thereby detecting the position of the notch 26. This allows the orientation of the wafer 4 to be adjusted to any desired orientation.

[0044] like Figure 3 As shown, the wafer stage 12 is arranged adjacent to the wafer unloading mechanism 10. The wafer stage 12 of the illustrated embodiment includes: an annular support portion 56 that supports the remaining outer periphery region 20 of the wafer 4 and does not contact the portion further inward than the remaining outer periphery region 20; and a frame support portion 58 disposed around the annular support portion 56, supporting the frame 64 (described later) Figure 5 The annular support portion 56 is supported by a plurality of suction holes 60 arranged at circumferential intervals on its upper surface, each suction hole 60 being connected to a suction source (not shown). The portion of the wafer stage 12 that is radially inward from the annular support portion 56 is a downwardly recessed circular recess 62.

[0045] When the hand 44 is rotated 180° to flip the front and back sides of the wafer 4, placing the wafer 4 on the wafer stage 12 with the front side 4a facing down, the remaining peripheral region 20 of the wafer 4 is supported by the annular support portion 56, and the device region 18 of the wafer 4 is located in the recess 62. Therefore, even when the wafer 4 is placed on the wafer stage 12 with the front side 4a of the device 14 facing down, the device 14 and the wafer stage 12 will not come into contact, thus preventing damage to the device 14. In addition, after the wafer stage 12 supports the remaining peripheral region 20 by the annular support portion 56, the suction source is activated to generate suction in each suction hole 60, attracting and holding the remaining peripheral region 20, thereby preventing the wafer 4 from shifting position.

[0046] according to Figure 5 To explain, the processing apparatus 2 also includes: a frame storage mechanism 66 that stores a plurality of annular frames 64 having openings 64a for storing wafers 4; a frame removal mechanism 68 that removes the frames 64 from the frame storage mechanism 66; and a frame stage 70 that supports the frames 64 removed by the frame removal mechanism 68.

[0047] like Figure 5 As shown, the frame storage mechanism 66 of the illustrated embodiment includes: a housing 72; a lifting plate 74 flexibly disposed within the housing 72; and a lifting mechanism (not shown) for raising and lowering the lifting plate 74. Figure 5 In the housing 72, a Z-axis guide member 78 extending along the Z-axis direction is disposed on the inner side in the X-axis direction. The lifting plate 74 is flexibly supported on the Z-axis guide member 78, and a lifting mechanism for raising and lowering the lifting plate 74 is disposed inside the Z-axis guide member 78. The lifting mechanism may, for example, include: a ball screw connected to the lifting plate 74 and extending along the Z-axis direction; and a motor that rotates the ball screw. Figure 5 In the housing 72, a door 76 with a handle 76a is provided on the side near the front in the X-axis direction. The door 76 is opened by holding the handle 76a in the frame storage mechanism 66, thereby allowing the frame 64 to be stored inside the housing 72. In addition, an opening 80 is provided at the upper end of the housing 72.

[0048] like Figure 5 As shown, the frame 64 is stacked inside the housing 72 on the upper surface of the lifting plate 74 and stored therein. The frame removal mechanism 68 removes the uppermost frame 64 from the opening 80 of the housing 72. Furthermore, when the frame 64 is removed from the opening 80, the frame storage mechanism 66 uses a lifting mechanism to appropriately raise the lifting plate 74, positioning the uppermost frame 64 in a position where it can be removed by the frame removal mechanism 68.

[0049] Reference Figure 5 Continuing the description, the frame removal mechanism 68 includes: an X-axis guide member 82, fixed to a suitable bracket (not shown), extending along the X-axis direction; an X-axis movable member 84, movably supported on the X-axis guide member 82 in the X-axis direction; an X-axis feed mechanism (not shown) that moves the X-axis movable member 84 in the X-axis direction; a Z-axis movable member 86, movably supported on the X-axis movable member 84 in the Z-axis direction; and a Z-axis feed mechanism (not shown) that moves the Z-axis movable member 86 in the Z-axis direction. The X-axis feed mechanism of the frame removal mechanism 68 can be configured to include: a ball screw connected to the X-axis movable member 84, extending along the X-axis direction; and an electric motor that rotates the ball screw. The Z-axis feed mechanism can be configured to include: a ball screw connected to the Z-axis movable member 86, extending along the Z-axis direction; and an electric motor that rotates the ball screw.

[0050] The Z-axis movable member 86 of the frame removal mechanism 68 has a holding portion 88 for holding the frame 64. The holding portion 88 of the illustrated embodiment has a rectangular base plate 90 and a plurality of suction pads 92 provided on the lower surface of the base plate 90, each suction pad 92 being connected to a suction source (not shown).

[0051] After the frame removal mechanism 68 uses the attraction pad 92 of the holding part 88 to attract and hold the uppermost frame 64 stored in the frame storage mechanism 66, the X-axis movable part 84 and the Z-axis movable part 86 are moved, thereby removing the attracted and held uppermost frame 64 from the frame storage mechanism 66.

[0052] like Figure 5 As shown, the frame platform 70 is supported by the Z-axis guide member 94, moving freely between the lowered position (shown by the solid line) and the raised position (shown by the double-dotted line). A suitable drive source (e.g., an air-driven or electric drive source) is attached to the Z-axis guide member 94 to move the frame platform 70 between the lowered and raised positions. In the lowered position, the frame 64 is received by the frame removal mechanism 68.

[0053] like Figure 1 and Figure 5 As shown, the processing device 2 includes: a pasting mechanism 98 (see reference). Figure 1 It is mounted above the frame platform 70, and the strap 96 is attached to the frame 64; there is a frame conveying mechanism 100 (see reference). Figure 5 The frame 64 with the tape 96 attached (hereinafter sometimes referred to as "the frame with tape 64") is transported to the wafer stage 12, and the opening 64a of the frame 64 is positioned on the back side 4b of the wafer 4 supported by the wafer stage 12, thereby placing the frame with tape 64' on the wafer stage 12; and the tape crimping mechanism 102 (see reference) Figure 1The strip 96 with frame 64' is pressed onto the back side 4b of the chip 4.

[0054] Reference Figure 6 (a) and Figure 6 (b) will be described. The tape bonding mechanism 98 of the illustrated embodiment includes: a tape support portion 104 that supports a tape 96R wound with a tape 96 before use; a tape winding portion 106 that winds the used tape 96; a tape pull-out portion 108 that pulls the tape 96 out of the tape 96R; a crimping portion 110 that crimps the pulled-out tape 96 onto a frame 64; and a cutting portion 112 that cuts the tape 96 protruding to the outer periphery of the frame 64 along the frame 64.

[0055] like Figure 6 (a) and Figure 6 As shown in (b), the tape support 104 includes a support roller 114 that is rotatably supported on a suitable bracket (not shown) about an axis extending in the X-axis direction. A tape 96R is supported on the support roller 114. The tape 96R is formed by winding a release paper 116 for protecting the adhesive surface of the tape 96 onto the adhesive surface of the tape 96 and forming it into a cylindrical shape.

[0056] The winding section 106 includes: a winding roller 118, which is rotatably supported on a suitable bracket (not shown) about an axis extending in the X-axis direction; and a motor (not shown) that rotates the winding roller 118. Figure 6 (a) and Figure 6 As shown in (b), the winding section 106 rotates the winding roller 118 by a motor, thereby winding the used belt 96, and forming a circular opening 120 on the used belt 96, which corresponds to the portion that is pasted on the frame 64.

[0057] Reference Figure 6 (a) and Figure 6 Continuing with the description in (b), the tape pull-out section 108 includes: a pull-out roller 122 disposed below the support roller 114 of the tape support section 104; an electric motor (not shown) that rotates the pull-out roller 122; and a driven roller 124 that rotates in conjunction with the rotation of the pull-out roller 122. The tape pull-out section 108 rotates the driven roller 124 together with the pull-out roller 122 via the electric motor, thereby pulling the tape 96 held by the pull-out roller 122 and the driven roller 124 out of the tape 96R.

[0058] The release paper 116 is peeled off from the belt 96 that has passed between the pull-out roller 122 and the driven roller 124, and then wound around the peeled release paper 116 by the release paper winding section 126. The release paper winding section 126 of the illustrated embodiment includes: a release paper winding roller 128 disposed above the driven roller 124; and an electric motor (not shown) that rotates the release paper winding roller 128. Furthermore, the belt 96 with the release paper 116 peeled off is guided to the winding roller 118 by a guide roller 130 disposed at a distance from the pull-out roller 122 in the Y-axis direction.

[0059] The crimping section 110 includes: a pressing roller 132 configured to move freely in the Y-axis direction; and a Y-axis feed mechanism (not shown) that moves the pressing roller 132 in the Y-axis direction. The Y-axis feed mechanism of the crimping section 110 can be configured by a suitable drive source (e.g., an air drive source or an electric drive source).

[0060] like Figure 6 (a) and Figure 6 As shown in (b), the cutting section 112 includes: a Z-axis guide member 134 fixed to a suitable bracket (not shown) and extending along the Z-axis direction; a Z-axis movable member 136 movably supported on the Z-axis guide member 134 in the Z-axis direction; and a Z-axis feed mechanism (not shown) that moves the Z-axis movable member 136 in the Z-axis direction. The Z-axis feed mechanism of the cutting section 112 may be configured to include: a ball screw connected to the Z-axis movable member 136 and extending along the Z-axis direction; and an electric motor that rotates the ball screw.

[0061] Additionally, the cutting section 112 includes: a motor 138 fixed to the lower surface of the front end of the Z-axis movable member 136; and an arm 140 that rotates about an axis extending along the Z-axis direction via the motor 138. First and second hanging plates 142a and 142b are spaced apart from each other on the lower surface of the arm 140. A circular cutter 144 is supported on the first hanging plate 142a in a manner rotatable about an axis perpendicular to the Z-axis direction, and a pressing roller 146 is supported on the second hanging plate 142b in a manner rotatable about an axis perpendicular to the Z-axis direction.

[0062] The frame platform 70, which received the frame 64 from the frame removal mechanism 68, descended from its lowered position. Figure 6 The position shown in (a) is located in the rising position. Figure 6Before the position shown in (b), the tape bonding mechanism 98 pulls out the unused tape 96 via the pull-out roller 122 and the driven roller 124. Then, the frame platform 70 is positioned in the raised position so that the tape 96 can be pressed onto the frame 64 by the pressing roller 132 of the pressing section 110, with the frame 64 in contact with the pressing roller 132 through the tape 96. Furthermore, while pressing the bonding surface of the tape 96 onto the frame 64 using the pressing roller 132, the pressing roller 132 is rotated in the Y-axis direction. Thus, the tape 96 pulled from the reel 96R by the tape pull-out section 108 can be pressed onto the frame 64.

[0063] After the tape 96 is pressed onto the frame 64, the tape bonding mechanism 98 lowers the Z-axis movable member 136 of the cutting section 112 via the Z-axis feed mechanism, pressing the cutter 144 onto the tape 96 on the frame 64, and pressing the frame 64 from the tape 96 using the pressing roller 146. Next, the arm 140 is rotated by the motor 138, causing the cutter 144 and the pressing roller 146 to move along the frame 64 in a circular motion. This allows the tape 96, which protrudes from the outer periphery of the frame 64, to be cut along the frame 64. Furthermore, by pressing the frame 64 from above the tape 96 using the pressing roller 146, displacement of the frame 64 or the tape 96 is prevented when cutting the tape 96. After the frame table 70 is lowered, the used tape 96, which has a circular opening 120 corresponding to the portion bonded to the frame 64, is wound around by the tape winding section 106.

[0064] like Figure 5 As shown, the frame-mounted conveying mechanism 100 includes: a Y-axis guide member 148 fixed to a suitable bracket (not shown) and extending along the Y-axis direction; a Y-axis movable member 150 movably supported on the Y-axis guide member 148 in the Y-axis direction; a Y-axis feed mechanism (not shown) that moves the Y-axis movable member 150 in the Y-axis direction; a Z-axis movable member 152 movably supported on the Y-axis movable member 150 in the Z-axis direction; and a Z-axis feed mechanism (not shown) that moves the Z-axis movable member 152 in the Z-axis direction. The Y-axis feed mechanism with frame conveying mechanism 100 can be configured to include: a ball screw connected to a Y-axis movable member 150 and extending along the Y-axis direction; and an electric motor that rotates the ball screw. The Z-axis feed mechanism can be configured to include: a ball screw connected to a Z-axis movable member 152 and extending along the Z-axis direction; and an electric motor that rotates the ball screw.

[0065] The Z-axis movable member 152 of the frame conveying mechanism 100 has a holding portion 154 for holding the frame 64'. The holding portion 154 of this embodiment shown in the figure has a rectangular substrate 156 and a plurality of suction pads 158 provided on the lower surface of the substrate 156, each suction pad 158 being connected to a suction source (not shown).

[0066] The frame conveying mechanism 100 uses the suction pads 158 of the holding part 154 to attract and hold the upper surface of the frame 64' supported on the frame stage 70 with the adhesive surface of the strap 96 facing down. This causes the Y-axis movable part 150 and the Z-axis movable part 152 to move, thereby transporting the frame 64' attracted and held by the holding part 154 from the frame stage 70 to the wafer stage 12. The opening 64a of the frame 64 is positioned on the back side 4b of the wafer 4 supported by the wafer stage 12, and the frame 64' is placed on the wafer stage 12.

[0067] Reference Figures 7 to 9 The crimping mechanism 102 will be described below. Figure 7 As shown, the crimping mechanism 102 includes: an upper chamber 160 disposed above the wafer stage 12; a lower chamber 162 for housing the wafer stage 12; a lifting mechanism 164 for raising and lowering the upper chamber 160 to create a closed state where the upper chamber 160 is in contact with the lower chamber 162 and an open state where the upper chamber 160 is separated from the lower chamber 162; a vacuum section 166 for creating a vacuum in the closed state between the upper chamber 160 and the lower chamber 162; and an atmospheric opening section 168 for opening the upper chamber 160 and the lower chamber 162 to the atmosphere.

[0068] like Figure 7 As shown, the upper chamber 160 of the illustrated embodiment includes a circular top plate 170 and cylindrical sidewalls 172 hanging from the periphery of the top plate 170. A lifting mechanism 164, which can be configured by a suitable actuator such as a cylinder, is mounted on the upper surface of the top plate 170. In the storage space defined by the lower surface of the top plate 170 and the inner peripheral surface of the sidewalls 172, are arranged: a pressing roller 174 for pressing a strip 96 with a frame 64' onto the back surface 4b of the wafer 4 supported by the wafer stage 12; a support plate 176 for supporting the pressing roller 174 to be rotatable; and a Y-axis feed mechanism 178 for moving the support plate 176 in the Y-axis direction.

[0069] The Y-axis feed mechanism 178 includes: a ball screw 180 connected to a support plate 176 and extending along the Y-axis direction; and a motor 182 that rotates the ball screw 180. Furthermore, the Y-axis feed mechanism 178 converts the rotational motion of the motor 182 into linear motion via the ball screw 180 and transmits it to the support plate 176, causing the support plate 176 to move along a pair of guide rails 184 extending along the Y-axis direction.

[0070] like Figure 7 As shown, the lower chamber 162 has a cylindrical sidewall 186, with the upper part of the sidewall 186 open and the lower part closed. A connection opening 188 is formed on the sidewall 186. A vacuum section 166, which can be constructed by a suitable vacuum pump, is connected to the connection opening 188 via a flow path 190. An atmospheric opening section 168, which can be constructed by a suitable valve that can open the flow path 190 to the atmosphere, is provided on the flow path 190.

[0071] With the pressing mechanism 102 positioned on the back side 4b of the wafer 4 supported by the wafer stage 12, the upper chamber 160 is lowered by the lifting mechanism 164, so that the lower end of the side wall 172 of the upper chamber 160 contacts the upper end of the side wall 186 of the lower chamber 162, so that the upper chamber 160 and the lower chamber 162 are closed, and the pressing roller 174 contacts the frame 64'.

[0072] Next, with the pressure-fitting mechanism 102 in a closed state, the vacuum pump constituting the vacuum section 166 is activated, creating a vacuum inside the upper chamber 160 and the lower chamber 162. Figure 8 and Figure 9 As shown, the pressing roller 174 is rolled in the Y-axis direction by the Y-axis feed mechanism 178, thereby pressing the belt 96 onto the back surface 4b of the wafer 4 to form the frame unit U.

[0073] When the tape 96 is pressed onto the back surface 4b of the wafer 4 by the pressing roller 174, a slight gap is formed between the wafer 4 and the tape 96 at the base of the annular reinforcing portion 24. However, since the wafer 4 and the tape 96 are pressed together while the upper chamber 160 and the lower chamber 162 are in a vacuum state, the pressure of the slight gap between the wafer 4 and the tape 96 is lower than atmospheric pressure. After the tape 96 is pressed together, when the atmospheric opening portion 168 is opened, the tape 96 is pressed onto the wafer 4 by atmospheric pressure. As a result, the gap between the wafer 4 and the tape 96 at the base of the reinforcing portion 24 disappears, and the tape 96 adheres tightly to the back surface 4b of the wafer 4 along the base of the reinforcing portion 24.

[0074] like Figure 1 and Figure 10 As shown, the processing apparatus 2 further includes: a frame unit removal mechanism 192, which removes the frame unit U, obtained by pressing the strip 96 with frame 64' and the back surface 4b of the wafer 4, from the wafer stage 12 via the pressing mechanism 102, and temporarily places it on the temporary stage 204; a reinforcement removal mechanism 194, which removes the annular reinforcement 24 from the wafer 4 of the frame unit U placed on the temporary stage 204 by cutting off the annular reinforcement 24; and a ringless unit removal mechanism 196 (see reference). Figure 1The ringless unit, from which the annular reinforcement 24 has been removed, is moved out of the reinforcement removal mechanism 194; and the frame box platform 200 (see reference) Figure 1 The frame box 198 that houses the acyclic units moved out by the acyclic unit moving mechanism 196.

[0075] like Figure 10 As shown, the frame unit removal mechanism 192 of the illustrated embodiment includes: a frame unit holding part 202, which includes a wafer holding part 202a for holding the wafer 4 and a frame support part 202b for holding the frame 64; and a conveying part 206, which conveys the frame unit holding part 202 to the temporary stage 204.

[0076] The wafer holding portion 202a of the frame unit holding portion 202 includes a circular substrate 208 and a circular suction plate 210 mounted on the lower surface of the substrate 208. A plurality of suction holes (not shown) are formed on the lower surface of the suction plate 210, each suction hole being connected to a suction source (not shown). The frame support portion 202b includes: a plurality of (four in the illustrated embodiment) protruding pieces 212, which protrude radially outward from the periphery of the substrate 208 of the wafer holding portion 202a at circumferential intervals; and suction pads 214 attached to the lower surface of the protruding pieces 212, each suction pad 214 being connected to a suction source (not shown).

[0077] The conveying unit 206 includes: an X-axis guide member 216 fixed to a suitable bracket (not shown) and extending along the X-axis direction; an X-axis movable member 218 movably supported on the X-axis guide member 216 in the X-axis direction; an X-axis feed mechanism (not shown) that moves the X-axis movable member 218 in the X-axis direction; a Z-axis movable member 220 movably supported on the X-axis movable member 218 in the Z-axis direction; a Z-axis feed mechanism (not shown) that moves the Z-axis movable member 220 in the Z-axis direction; a Y-axis movable member 222 movably supported on the Z-axis movable member 220 in the Y-axis direction; and a Y-axis feed mechanism (not shown) that moves the Y-axis movable member 222 in the Y-axis direction. A substrate 208 of the wafer holding section 202a is connected to the front end of the Y-axis movable member 222. The X-axis feed mechanism, Y-axis feed mechanism, and Z-axis feed mechanism of the conveying unit 206 can be configured as having a ball screw and an electric motor that rotates the ball screw, respectively.

[0078] The frame unit removal mechanism 192 preferably includes: a two-dimensional movement mechanism that moves the frame unit holding part 202 two-dimensionally in the horizontal direction; and an imaging part 224 that images the outer periphery of the wafer 4 of the frame unit U held by the frame unit holding part 202. In the illustrated embodiment, the frame unit holding part 202 is moved two-dimensionally in the horizontal direction in the XY plane by the X-axis feed mechanism and the Y-axis feed mechanism of the transport part 206, and the transport part 206 constitutes the two-dimensional movement mechanism. In addition, the imaging part 224 of the illustrated embodiment is disposed between the wafer stage 12 and the temporary stage 204, and images the outer periphery of the wafer 4 of the frame unit U held by the frame unit holding part 202 from below the wafer 4.

[0079] The frame unit removal mechanism 192 uses the suction plate 210 of the wafer holding part 202a to attract and hold the wafer 4 from the back side 4b side (band 96 side), and the conveying part 206 is operated while the frame 64 is attracted and held by the suction pad 214 of the frame support part 202b, thereby removing the frame unit U held by the frame unit holding part 202 from the wafer stage 12.

[0080] Furthermore, in the illustrated embodiment, the frame unit removal mechanism 192 activates the conveying section 206, which constitutes the two-dimensional moving mechanism, and uses the imaging section 224 to capture images of at least three points on the outer periphery of the wafer 4 of the frame unit U held by the frame unit holding section 202. The coordinates of these at least three points on the outer periphery of the wafer 4 are measured, and the center coordinates of the wafer 4 are determined based on the measured coordinates. The frame unit removal mechanism 192 aligns the center of the wafer 4 with the center of the temporary stage 204, and temporarily places the frame unit U on the temporary stage 204.

[0081] like Figure 10 As shown, the temporary stage 204 and the wafer stage 12 are spaced apart in the X-axis direction. The temporary stage 204 of the illustrated embodiment has: an annular support portion 226, which supports the outer peripheral remaining region 20 of the wafer 4 of the frame unit U and does not contact the portion inside the outer peripheral remaining region 20; and a frame support portion 228, which is disposed on the outer periphery of the annular support portion 226 and supports the frame 64.

[0082] The portion radially inward of the annular support portion 226 becomes a downwardly recessed circular recess 230. Preferably, the frame support portion 228 of the temporary platform 204 has a heater (not shown) to heat the belt 96 of the frame unit U temporarily placed on the temporary platform 204, thereby softening the belt 96 and using atmospheric pressure to make the belt 96 further adhere tightly to the base of the annular reinforcement portion 24.

[0083] The processing apparatus 2 of the illustrated embodiment includes a temporary stage conveying section 232 for conveying a temporary stage 204 in the Y-axis direction. The temporary stage conveying section 232 includes: a Y-axis guide member 234 extending along the Y-axis direction; a Y-axis movable member 236 movably supported on the Y-axis guide member 234 in the Y-axis direction; and a Y-axis feed mechanism 238 that moves the Y-axis movable member 236 in the Y-axis direction. The temporary stage 204 is fixed to the upper part of the Y-axis movable member 236. The Y-axis feed mechanism 238 includes: a ball screw 240 connected to the Y-axis movable member 236 and extending along the Y-axis direction; and a motor 242 that rotates the ball screw 240. Furthermore, the temporary platform conveying unit 232 converts the rotational motion of the motor 242 into linear motion through the ball screw 240 and transmits it to the Y-axis movable component 236, thus conveying the temporary platform 204 together with the Y-axis movable component 236 in the Y-axis direction.

[0084] like Figure 1 and Figure 10 As shown, the reinforcement removal mechanism 194 includes: a laser beam irradiation unit 244, which irradiates a laser beam toward the base of the annular reinforcement 24 formed on the outer periphery of the wafer 4 to form a cutting groove; a first lifting platform 246 (see reference) Figure 1 The frame unit U, which is temporarily placed on the temporary stage 204, is held and raised, and moves in the X-axis direction to be positioned on the laser beam irradiation unit 244; and the separation part 248 separates the annular reinforcing part 24 from the cutting groove.

[0085] like Figure 10 As shown, the laser beam irradiation unit 244 includes: a housing 250 disposed adjacent to the temporary stage 204 in the X-axis direction; a laser oscillator (not shown) housed in the housing 250, which generates a laser beam by laser oscillation; a concentrator 252 that focuses the laser beam generated by the laser oscillator to irradiate the base of the annular reinforcement 24 formed on the outer periphery of the wafer 4; a suction nozzle 254 that attracts debris generated when the laser beam is irradiated onto the wafer 4; and a suction source (not shown) connected to the suction nozzle 254.

[0086] The concentrator 252 extends upward from the upper surface of the housing 250 toward the suction nozzle 254, thereby suppressing debris generated during laser beam irradiation from falling onto the concentrator 252. Additionally, the suction nozzle 254 extends upward from the upper surface of the housing 250 toward the concentrator 252.

[0087] like Figure 11As shown, the laser beam irradiation unit 244 irradiates the base of the annular reinforcement 24 formed on the outer periphery of the wafer 4 with a laser beam LB while rotating the frame unit U held by the first lifting platform 246. Through ablation, an annular cutting groove 256 is formed along the base of the reinforcement 24. In addition, the laser beam irradiation unit 244 attracts the debris generated by the ablation process through the suction nozzle 254.

[0088] like Figure 1 As shown, the first lifting platform 246 is configured to move freely along the X-axis and the Z-axis above the temporary platform 204. (Refer to...) Figure 12 As described, the first lifting platform 246 includes: an X-axis guide member 258 fixed to a suitable bracket (not shown) and extending along the X-axis direction; an X-axis movable member 260 movably supported on the X-axis guide member 258 in the X-axis direction; an X-axis feed mechanism (not shown) that moves the X-axis movable member 260 in the X-axis direction; a Z-axis movable member 262 movably supported on the X-axis movable member 260 in the Z-axis direction; and a Z-axis feed mechanism (not shown) that moves the Z-axis movable member 262 in the Z-axis direction. The X-axis feed mechanism and the Z-axis feed mechanism of the first lifting platform 246 can be configured as having a ball screw and an electric motor that rotates the ball screw, respectively.

[0089] A downwardly extending support shaft 264 is rotatably supported on the lower front surface of the Z-axis movable component 262. A motor 266 is mounted on the upper front surface of the Z-axis movable component 262, which rotates the support shaft 264 about an axis extending along the Z-axis direction. A circular suction plate 268 is fixed to the lower end of the support shaft 264. Multiple suction holes (not shown) are formed circumferentially on the lower surface of the suction plate 268, corresponding to the size of the frame 64, and each suction hole is connected to a suction source.

[0090] After the first lifting platform 246 uses the adsorption plate 268 to attract and hold the frame 64 portion of the frame unit U obtained by heating the belt 96 through the heater of the frame support 228 of the temporary stage 204 and making the belt 96 tightly adhere to the base of the annular reinforcement 24, the Z-axis movable member 262 and the X-axis movable member 260 are moved, causing the frame unit U attracted and held by the adsorption plate 268 to rise and move in the X-axis direction to be positioned in the laser beam irradiation unit 244. In addition, if the frame 64 is made of a magnetic material, an electromagnet (not shown) can be attached to the lower surface of the adsorption plate 268, and the adsorption plate 268 attracts the frame 64 by magnetic force.

[0091] Furthermore, when the first lifting platform 246 irradiates the wafer 4 with a laser beam LB through the laser beam irradiation unit 244, it activates the motor 266, causing the frame unit U, which is attracted and held by the adsorption plate 268, to rotate. Additionally, the first lifting platform 246 moves the frame unit U, which has a cutting groove 256 formed at the base of the reinforcing part 24, in the X-axis and Z-axis directions and temporarily places it on the temporary placement stage 204.

[0092] like Figure 1 As shown, the separation section 248 is arranged at a distance from the first lifting platform 246 in the Y-axis direction within the movable range of the temporary platform 204. (Refer to...) Figure 13 of (a), Figure 13 (b) and Figure 14 As explained, the separation section 248 includes: an ultraviolet irradiation section 270 (see reference). Figure 13 (a) , which irradiates the strip 96 corresponding to the cutting groove 256 with ultraviolet light to reduce the adhesion of the strip 96; the second lifting platform 272 (refer to Figure 13 (a)), which exposes the annular reinforcement 24 on the outer periphery to attract and retain the inner side of the wafer 4; separator 274 (see reference) Figure 13 (a)), which causes the wedge-shaped stop 402 to act on the outer periphery of the annular reinforcement 24 to separate the annular reinforcement 24; and the discarded part 276 (see reference) Figure 14 The separated annular reinforcing part 24 is discarded.

[0093] like Figure 13 As shown in (a), the separation portion 248 of the illustrated embodiment includes: a Z-axis guide member 278 fixed to a suitable bracket (not shown) and extending along the Z-axis direction; a Z-axis movable member 280 movably supported on the Z-axis guide member 278 in the Z-axis direction; and a lifting mechanism (not shown) that moves the Z-axis movable member 280 in the Z-axis direction. The lifting mechanism may be configured to include: a ball screw connected to the Z-axis movable member 280 and extending along the Z-axis direction; and an electric motor that rotates the ball screw.

[0094] A support plate 282 is supported on the lower front surface of the Z-axis movable member 280, and a second lifting platform 272 is rotatably supported thereon. A motor 284 for rotating the second lifting platform 272 is mounted on the upper front surface of the Z-axis movable member 280. In the illustrated embodiment, a pair of ultraviolet irradiation sections 270 are provided on the support plate 282 at intervals along the Y-axis direction.

[0095] The second lifting platform 272 includes: a support shaft 286 extending downward from the lower surface of the front end of the Z-axis movable member 280; and a circular platform head 287 detachably mounted on the lower end of the support shaft 286. A plurality of suction holes (not shown) are formed on the lower surface of the platform head 287, each suction hole being connected to a suction source.

[0096] The stage head 287 has an outer diameter corresponding to the inner diameter of the reinforcing portion 24 of the wafer 4. Specifically, the diameter of the stage head 287 is slightly smaller than the diameter of the device region 18 of the wafer 4. Furthermore, the stage head 287 is detachably mounted on the support shaft 286 and can be replaced according to the diameter of the wafer 4. The support shaft 286 on which the stage head 287 is mounted is connected to the lifting mechanism of the separation section 248 via a Z-axis movable member 280. Thus, the second lifting stage 272 includes two or more stages 287 having an outer diameter corresponding to the inner diameter of the reinforcing portion 24 of the wafer 4, and the stage heads 287 are detachably mounted on the lifting mechanism of the separation section 248.

[0097] Additionally, the aforementioned separator 274 is mounted on the support plate 282. The separator 274 includes: a pair of movable plates 288 spaced apart on the lower surface of the support plate 282 and movably disposed along the length of the support plate 282; a pair of feed mechanisms 290 that move the pair of movable plates 288; a pair of support base plates 400 that are movably supported on each of the movable plates 288; and a pair of Z-axis feed mechanisms 294 that move the pair of support base plates 400 up and down in the Z-axis direction. The pair of feed mechanisms 290 and the Z-axis feed mechanism 294 can each be constructed from suitable actuators such as air cylinders or electric cylinders.

[0098] Reference Figure 13 (a) and Figure 13 (b) continues the description, and on the upper surface of each support base plate 400 are mounted: a stop block 402 having a wedge-shaped portion; a frame support portion 404 supporting the frame 64; and an ionizer 406 for removing static electricity from the frame unit U.

[0099] The stop block 402 has an inverted frustum shape with a diameter that gradually decreases from top to bottom, and a wedge-shaped portion is formed by the upper surface 402a and the side surface 402b of the stop block 402. A pair of stop blocks 402 are arranged at intervals on the upper surface of each support base plate 400 and are supported on the support base plate 400 in a manner that allows them to rotate about an axis extending in the Z-axis direction.

[0100] The frame support portion 404 is adjacent to the stop block 402 and is arranged in pairs on the upper surface of each support base plate 400. The frame support portion 404 has: a housing 404a fixed to the support base plate 400; and a ball 404b rotatably supported on the housing 404a. The frame 64 is supported by each ball 404b in the frame support portion 404.

[0101] Ionizer 406 is disposed adjacent to stop 402. Ionized air is blown toward frame unit U in ionizer 406 to remove static electricity from frame unit U.

[0102] The separation unit 248 of the illustrated embodiment has a detector (not shown) that detects whether the type of the table 287 input to the control unit (not shown) that controls the operation of the processing device 2 is consistent with the type of the table 287 actually installed on the processing device 2.

[0103] The control unit is composed of a computer and includes: a central processing unit (CPU) that performs calculations according to the control program; a read-only memory (ROM) that stores the control program; and a read-write random access memory (RAM) that stores the calculation results. The operator inputs processing conditions such as the diameter of the wafer 4, the width of the reinforcing part 24, and the outer diameter of the stage 287 into the control unit.

[0104] The detector of the illustrated embodiment includes: a stop 402 of a separator 274; and a feed mechanism 290 that moves the stop 402 closer to and further away from the stage head 287 by actuating a movable piece 288. Furthermore, in the detector, before the processing of the wafer 4 begins, the movable piece 288 is actuated by the feed mechanism 290, such as... Figure 15 As shown, the detector checks whether the outer diameter of the stage 287 obtained by contacting the stop 402 of the separator 274 with the outer periphery of the stage 287 matches the outer diameter of the stage 287 input to the control unit. If the detector detects a discrepancy, an error is reported (e.g., a message indicating a discrepancy is displayed on the control panel (not shown)).

[0105] Even if multiple wafers 4 have the same diameter, such as 200mm, the width of the annular reinforcement 24 may vary, such as 3mm or 5mm. Therefore, in the processing apparatus 2, a stage 287 corresponding to the device area 18 of the wafer 4 needs to be installed. If the type of stage 287 input to the control unit is inconsistent with the type of stage 287 actually installed, the annular reinforcement 24 cannot be properly removed from the wafer 4.

[0106] In this regard, the processing apparatus 2 of the illustrated embodiment has a detector that detects whether the type of the stage 287 input to the control unit is consistent with the type of the stage 287 actually installed on the processing apparatus 2. Therefore, before the processing of the wafer 4 begins, it can be confirmed whether an appropriate stage 287 corresponding to the wafer 4 is installed. During the processing of the wafer 4, the annular reinforcing portion 24 can be appropriately removed from the wafer 4.

[0107] Reference Figure 14 As described, the waste section 276 includes: a belt conveyor 300 for conveying the separated annular reinforcing sections 24; and a dust collection box 302 for receiving the annular reinforcing sections 24 conveyed by the belt conveyor 300. The belt conveyor 300 is positioned at a substantially horizontally extending recycling location by means of a suitable actuator (not shown). Figure 14 The position shown by the solid line) and the standby position that extends substantially vertically ( Figure 14 (The position indicated by the double-dotted line).

[0108] exist Figure 14 In the dust collection box 302, a door 304 with a handle 304a is provided on the side near the front in the X-axis direction. Inside the dust collection box 302, a crusher (not shown) is installed to crush the collected annular reinforcing part 24. By holding the handle 304a in the dust collection box 302, the door 304 can be opened, thereby allowing the debris collected in the annular reinforcing part 24 to be removed.

[0109] When the temporary placement table 204, on which the frame unit U, in which the cutting groove 256 is formed at the base of the reinforcing section 24, is positioned below the separating section 248 by the temporary placement table conveying section 232, as Figure 16 As shown, the separation section 248 exposes the annular reinforcing section 24 on its outer periphery via the second lifting platform 272, thereby attracting and holding the inner side of the wafer 4. Next, the movable piece 288 is moved by the feed mechanism 290, and the support substrate 400 is moved by the Z-axis feed mechanism 294, as... Figure 17 As shown, the wedge-shaped stop 402 acts on the outer periphery of the annular reinforcement 24. Specifically, the wedge-shaped portion of the stop 402 is positioned between the belt 96 and the reinforcement 24. In addition, the lower surface of the frame 64 is brought into contact with the ball 404b of the frame support 404, and the frame 64 is supported by the ball 404b.

[0110] Next, ultraviolet light is irradiated from a pair of ultraviolet irradiation sections 270, reducing the adhesive force of the strip 96 adhered to the annular reinforcement 24. The frame unit U and the second lifting platform 272 are then rotated relative to the separator 274 by the motor 284. As a result, the strip 96 and the reinforcement 24, with reduced adhesive force, separate through the wedge-shaped portion of the stop 24, thus... Figure 18 As shown, the annular reinforcing section 24 can be separated from the frame unit U. The separated reinforcing section 24 is transported to the dust collection box 302 by the belt conveyor 300 for recycling. In addition, the separator 274 can be rotated relative to the frame unit U when separating the reinforcing section 24.

[0111] Furthermore, when separating the reinforcing section 24, ionized air is blown from the ionizer 406 toward the frame unit U. Therefore, even if static electricity is generated due to contact between the stop 402 and the belt 96 and the reinforcing section 24, it can be removed by the ionized air blown from the ionizer 406. Thus, the belt 96 and the reinforcing section 24 will not be pulled closer together due to static electricity, and the reinforcing section 24 can be reliably separated from the frame unit U.

[0112] Furthermore, when the reinforcing part 24 is separated, the block 402 acting on the frame unit U rotates along with the relative rotation of the frame unit U and the separator 274, and the ball 404b in contact with the lower surface of the frame 64 rotates, so the relative rotation of the frame unit U and the separator 274 proceeds smoothly.

[0113] like Figure 1 As shown, the acyclic unit removal mechanism 196 and the reinforcement removal mechanism 194 are arranged adjacent to each other. (Refer to...) Figure 19 and Figure 20 As explained, the acyclic unit transfer mechanism 196 of the illustrated embodiment includes: a flipping mechanism 308 (see reference). Figure 19 ), which has a frame support portion 306 that faces the ringless unit supported by the second lifting platform 272 and holds the frame 64, moves toward the frame box platform 200 and causes the frame support portion 306 to flip; ringless unit support portion 310 (see Figure 20 ), which supports the ringless unit with the front side 4a of the wafer 4 facing upward, which is flipped by the flipping mechanism 308; and the push-in part 312 (see reference) Figure 20 The acyclic unit supported by the acyclic unit support 310 is pushed into the frame box 198 placed on the frame box platform 200 for storage.

[0114] like Figure 19 As shown, the tilting mechanism 308 includes: a Y-axis guide member 314 extending along the Y-axis direction; a Y-axis movable member 316 movably supported on the Y-axis guide member 314 in the Y-axis direction; a Y-axis feed mechanism (not shown) that moves the Y-axis movable member 316 in the Y-axis direction; an arm 318 movably supported on the Y-axis movable member 316 in the Z-axis direction; and a Z-axis feed mechanism (not shown) that moves the arm 318 in the Z-axis direction. The Y-axis feed mechanism and the Z-axis feed mechanism of the tilting mechanism 308 can be configured as having a ball screw and an electric motor that rotates the ball screw, respectively.

[0115] The frame support portion 306 is rotatably supported on the arm 318, and a motor 320 is installed to rotate the frame support portion 306. The frame support portion 306 in the illustrated embodiment includes: a base plate 324, which is rotatably supported on the arm 318 by means of a pair of rotating shafts 322; and a plurality of suction pads 326 attached to one surface of the base plate 324, each suction pad 326 being connected to a suction source (not shown). Additionally, one of the rotating shafts 322 is connected to the motor 320.

[0116] The flipping mechanism 308, with the suction pad 326 facing upwards, uses the suction pad 326 to attract and hold the lower surface of the frame 64 of the acyclic unit U' supported by the second lifting platform 272, and receives the acyclic unit U' from the second lifting platform 272. Furthermore, after the frame support portion 306 is flipped by the motor 320 so that the front surface 4a of the wafer 4 faces upwards, the flipping mechanism 308 moves the Y-axis movable member 316, thereby moving the acyclic unit U' held by the frame support portion 306 toward the frame cassette stage 200.

[0117] like Figure 20 As shown, the acyclic unit support 310 of the illustrated embodiment includes: a pair of support plates 328 supported by suitable brackets (not shown) for free movement in the X-axis direction; and a spacing adjustment mechanism (not shown) for adjusting the spacing of the pair of support plates 328 in the X-axis direction. The spacing adjustment mechanism can be constructed by a suitable actuator such as an air cylinder or an electric cylinder.

[0118] Heaters (not shown) are mounted on a pair of support plates 328 that support the acyclic unit U'. With the gap between the pair of support plates 328 narrowed, the pair of support plates 328 heat the belt 96 of the acyclic unit U' through the heaters, thereby causing the slack and wrinkles in the belt 96 caused by the removal of the reinforcing part 24 to stretch.

[0119] Reference Figure 20 Continuing the description, the push-in portion 312 of the illustrated embodiment includes: a Y-axis guide member 330 extending along the Y-axis direction; a Y-axis movable member 332 movably supported on the Y-axis guide member 330 along the Y-axis direction; and a Y-axis feed mechanism (not shown) that moves the Y-axis movable member 332 in the Y-axis direction. The Y-axis movable member 332 has: a base 334 supported on the Y-axis guide member 330; a support column 336 extending upward from the upper surface of the base 334; and a pressing piece 338 attached to the upper end of the support column 336. The Y-axis feed mechanism of the push-in portion 312 can be configured to include: a ball screw connected to the Y-axis movable member 332 and extending along the Y-axis direction; and a motor that rotates the ball screw.

[0120] like Figure 21 As shown, before receiving the acyclic unit U', the acyclic unit support 310 expands the gap between a pair of support plates 328 via a gap adjustment mechanism, and then receives the acyclic unit U' held by the suction pad 326. Furthermore, when the acyclic unit support 310 receives the acyclic unit U', the push-in part 312 moves the Y-axis movable member 332 in the Y-axis direction via a Y-axis feed mechanism, thereby causing the acyclic unit U' supported by the acyclic unit support 310 to enter into the frame box 198 placed on the frame box platform 200 for storage via the pressing piece 338.

[0121] exist Figure 1 and Figure 21 The frame box 198 shown contains multiple acyclic cells U' spaced vertically with the front side 4a of the wafer 4 facing upwards. For example... Figure 20 and Figure 21 As shown, the frame box platform 200 includes: a mounting section 340 that mounts the frame box 198; and a lifting section 342 that raises and lowers the mounting section 340 to a position at any height. The lifting section 342 may be configured to include: a ball screw connected to the mounting section 340 and extending along the Z-axis; and a motor that rotates the ball screw.

[0122] Next, a processing method will be described in which the dicing tape 96 is attached to the back surface 4b of the wafer 4, which has a convex annular reinforcing portion 24 formed on the back surface 4b corresponding to the outer peripheral remaining area 20, and thus becomes integral with the frame 64, and the annular reinforcing portion 24 is cut off and removed from the wafer 4.

[0123] In the illustrated implementation, firstly as follows: Figure 1 and Figure 3 As shown, a wafer cassette 6 containing multiple wafers 4 is placed on a wafer cassette stage 8. Multiple wafers 4 are stored in the wafer cassette 6 with their front faces 4a facing upwards and spaced apart in the vertical direction.

[0124] In addition, such as Figure 1 and Figure 5 As shown, a frame storage process is performed in the frame storage mechanism 66 to store multiple annular frames 64 having openings 64a for storing wafers 4. The frame storage process can be performed before or after the wafer cassette loading process.

[0125] In the frame storage process, after the lifting plate 74 of the frame storage mechanism 66 is lowered to any position, the handle 76a is grasped to open the door 76, and multiple frames 64 are stacked on the upper surface of the lifting plate 74 for storage. In addition, the height of the lifting plate 74 is adjusted appropriately to position the top frame 64 so that it can be moved out by the frame removal mechanism 68.

[0126] After the wafer cassette placement process and the frame storage process are performed, the wafer removal process is performed to remove the wafer 4 from the wafer cassette 6 placed on the wafer cassette stage 8.

[0127] Reference Figure 3 To explain, in the wafer unloading process, firstly, the Y-axis feed mechanism 34 of the wafer unloading mechanism 10 is activated to position the Y-axis movable part 32 near the wafer cassette stage 8. Next, the transfer arm 42 is driven to position the hand 44 with the air nozzle 46 facing upwards on the back side 4b (lower side) of the wafer 4 inside the wafer cassette 6. When the hand 44 is positioned on the back side 4b of the wafer 4, a gap is provided between the back side 4b of the wafer 4 and the hand 44, and each guide pin 48 is pre-positioned radially outward.

[0128] Next, compressed air is ejected from the air outlet 46 of the hand 44, generating negative pressure on one side of the hand 44 through the Bernoulli effect, and the hand 44 attracts and supports the wafer 4 from the back side 4b in a non-contact manner. Then, each guide pin 48 is moved radially inward, restricting the horizontal movement of the wafer 4 attracted and supported by the hand 44. Furthermore, the Y-axis movable member 32 and the conveying arm 42 of the wafer removal mechanism 10 are moved to remove the wafer 4 attracted and supported by the hand 44 from the wafer cassette 6.

[0129] After the wafer removal process, a notch inspection process is preferably performed to detect the position of the notch 26 on the wafer 4. In the notch inspection process, such as... Figure 4 As shown, the outer periphery of the wafer 4, which is attracted and supported by the hand 44, is positioned between the light-emitting element 52 and the light-receiving element 54 of the notch detector 50. Next, the wafer 4 is rotated using a drive source via the guide pin 48, thereby detecting the position of the notch 26 on the wafer 4. This allows the orientation of the wafer 4 to be adjusted to any desired orientation.

[0130] After the notch inspection process is performed, a wafer support process is performed in which the front side 4a of the wafer 4 moved out by the wafer removal mechanism 10 is supported by the wafer stage 12.

[0131] Reference Figure 3To explain, in the wafer support process, the hand 44 of the wafer removal mechanism 10 is first rotated vertically so that the front surface 4a of the wafer 4 faces downwards. Next, the Y-axis movable component 32 and the conveying arm 42 of the wafer removal mechanism 10 are moved, causing the remaining peripheral area 20 of the front surface 4a of the wafer 4, which is attracted and supported by the hand 44, to contact the annular support portion 56 of the wafer stage 12. At this time, the device area 18 of the front surface 4a of the wafer 4 is located in the recess 62 of the wafer stage 12, therefore the device 14 and the wafer stage 12 will not contact each other, preventing damage to the device 14.

[0132] Next, the suction source of the wafer stage 12 is activated, generating suction at each suction hole 60, thereby attracting and holding the remaining peripheral area 20 of the front surface 4a of the wafer 4. Then, the suction support of the hand 44 on the wafer 4 is released, and the hand 44 is removed from the wafer stage 12. In this way, the wafer 4 is transferred from the wafer unloading mechanism 10 to the wafer stage 12. The wafer 4 transferred to the wafer stage 12 is attracted and held by each suction hole 60, so the position of the wafer 4 will not shift.

[0133] In addition, after the wafer cassette placement process and the frame storage process are performed, a frame removal process is performed in parallel with the wafer removal process or the wafer support process to remove the frame 64 from the frame storage mechanism 66.

[0134] Reference Figure 5 To explain, in the frame removal process, firstly, the X-axis movable member 84 and the Z-axis movable member 86 of the frame removal mechanism 68 are moved, causing the suction pad 92 of the holding part 88 to contact the upper surface of the uppermost frame 64 stored in the frame storage mechanism 66. Next, the suction source of the frame removal mechanism 68 is activated, generating a suction force on the suction pad 92, thereby using the suction pad 92 to hold the uppermost frame 64. Then, the X-axis movable member 84 and the Z-axis movable member 86 of the frame removal mechanism 68 are moved, removing the uppermost frame 64 held by the suction pad 92 of the holding part 88 from the frame storage mechanism 66.

[0135] After the frame removal process is carried out, a frame support process is carried out by using the frame platform 70 to support the frame 64 that has been moved out by the frame removal mechanism 68.

[0136] Reference Figure 5 Continuing the explanation, in the frame support process, firstly, the X-axis movable part 84 and the Z-axis movable part 86 of the frame removal mechanism 68 are moved, causing the frame 64 held by the suction pad 92 to contact the upper surface of the frame table 70. At this time, the frame table 70 is pre-positioned in the lowered position (…). Figure 5(The position is shown by the solid line in the middle). Next, the attraction of the suction pad 92 of the frame removal mechanism 68 is released, and the frame 64 is placed on the frame table 70. Then, the X-axis movable part 84 and the Z-axis movable part 86 of the frame removal mechanism 68 are moved so that the holding part 88 moves away from above the frame table 70.

[0137] After the frame support process is performed, the tape 96 is glued to the frame 64.

[0138] Reference Figure 6 (a) and Figure 6 (b) will be explained in the process of pasting, firstly, the frame table 70 is lowered from the lower position ( Figure 6 The position shown in (a) is moved to the rising position where the tape 96 can be pasted onto the frame 64. Figure 6 Before the position shown in (b), the tape 96 is pulled out from the roll tape 96R and positioned above the frame table 70 with the release paper 116 peeled off. In addition, the adhesive side of the tape 96 positioned above the frame table 70 faces down.

[0139] Next, the frame platform 70 is raised to the extent that the pressing roller 132 of the pressing part 110 with the adhesive mechanism 98 can press the tape 96 onto the frame 64 from above. Furthermore, while pressing the adhesive surface of the tape 96 onto the frame 64 using the pressing roller 132, the pressing roller 132 is rolled in the Y-axis direction. Thus, the tape 96 pulled from the winding tape 96R by the tape pull-out part 108 can be pressed onto the frame 64.

[0140] Next, the cutter 144 and pressing roller 146 of the cutting section 112 of the adhesive mechanism 98 are lowered, pressing the cutter 144 onto the tape 96 on the frame 64, and the pressing roller 146 presses the frame 64 from the tape 96. Then, the arm 140 is rotated by the motor 138, causing the cutter 144 and pressing roller 146 to move along the frame 64 in a circular motion. This allows the tape 96, which protrudes from the outer periphery of the frame 64, to be cut along the frame 64. Furthermore, by pressing the frame 64 from above the tape 96 using the pressing roller 146, displacement of the frame 64 or tape 96 is prevented when cutting the tape 96. Finally, the used tape 96, which has a circular opening 120, is wound up by the tape winding section 106.

[0141] After the tape bonding process is performed, the tape frame transfer process is performed: the frame 64 with the tape 96 bonded is transferred to the wafer stage 12, the opening 64a of the frame 64 is positioned on the back side 4b of the wafer 4 supported by the wafer stage 12, and the tape frame 64' is placed on the wafer stage 12.

[0142] In the conveying process with a frame, the frame table 70 is first moved from the rising position to the falling position. Then, the conveying mechanism 100 with the frame (see reference...) Figure 5 The Y-axis movable part 150 and Z-axis movable part 152 of the conveyor 100 move, so that the suction pads 158 of the holding part 154 of the conveyor 100 with the frame 96 facing down, and the frame 64' supported by the frame table 70 (see reference) Figure 7 The upper surface of the ) is in contact.

[0143] Next, the suction source of the frame conveying mechanism 100 is activated to generate a suction force on the suction pad 158, thereby attracting and holding the upper surface of the frame 64' using the suction pad 158. Then, the Y-axis movable part 150 and the Z-axis movable part 152 of the frame conveying mechanism 100 are moved to remove the frame 64' attracted and held by the suction pad 158 from the frame table 70.

[0144] Next, the frame 64' held by the suction pad 158 of the frame conveying mechanism 100 is conveyed to the wafer stage 12, as follows. Figure 7 As shown, the opening 64a of the frame 64 is positioned on the back surface 4b of the wafer 4 supported by the wafer stage 12, so that the frame 64' with the strap is in contact with the frame support portion 58 of the wafer stage 12. At this time, the adhesive surface of the strap 96 of the frame 64' is facing down, and the back surface 4b of the wafer 4 is facing up and is facing the adhesive surface of the strap 96.

[0145] Next, the attraction of the suction pad 158 of the frame conveying mechanism 100 is released, and the frame 64' is placed on the frame support 58 of the wafer stage 12. Then, the Y-axis movable member 150 and the Z-axis movable member 152 of the frame conveying mechanism 100 are moved, so that the holding part 154 moves away from above the wafer stage 12.

[0146] After the conveying process with the tape frame is performed, a tape pressing process is performed to press the tape 96 of the tape frame 64' onto the back side 4b of the wafer 4.

[0147] Reference Figures 7 to 9 To explain, in the belt pressing process, the upper chamber 160 is first lowered by the lifting mechanism 164 of the belt pressing mechanism 102, causing the lower end of the side wall 172 of the upper chamber 160 to contact the upper end of the side wall 186 of the lower chamber 162. This closes the upper and lower chambers 160, and brings the pressing roller 174 into contact with the belt frame 64'. Thus, as... Figure 8 As shown, the upper end of the annular reinforcing part 24 of the chip 4 is attached to the adhesive surface of the band 96 with the frame 64'.

[0148] Next, with the atmospheric opening 168 of the pressing mechanism 102 closed, the vacuum section 166 is activated, creating a vacuum inside the upper chamber 160 and the lower chamber 162. Then, as... Figure 8 and Figure 9 As shown, the pressing roller 174 with the pressing mechanism 102 is rolled in the Y-axis direction, thereby pressing the strip 96 onto the back surface 4b of the wafer 4. This allows the formation of a frame unit U by pressing the back surface 4b of the wafer 4 and the strip 96 together. Next, the atmospheric opening 168 is opened, and atmospheric pressure is used to press the strip 96 tightly against the back surface 4b of the wafer 4 along the base of the annular reinforcing section 24. Furthermore, the upper chamber 160 is raised by the lifting mechanism 164.

[0149] In addition, the interiors of the upper chamber 160 and the lower chamber 162 are made into a vacuum, thereby eliminating the attraction of the wafer stage 12 on the wafer 4. However, when the upper chamber 160 and the lower chamber 162 are in a closed state, the upper end of the annular reinforcing part 24 of the wafer 4 is attached to the bonding surface of the tape 96 with the frame 64'. Therefore, the position of the wafer 4 will not shift during the tape bonding process.

[0150] After the pressing process is performed, a frame unit removal process is performed to remove the frame unit U obtained by pressing the tape 96 with the frame 64' and the back side 4b of the wafer 4 from the wafer stage 12.

[0151] Reference Figure 5 To explain, in the frame unit removal process, the conveying part 206 of the frame unit removal mechanism 192 is first activated, so that the lower surface of the adsorption sheet 210 of the wafer holding part 202a of the frame unit holding part 202 contacts the strip 96 on the back side 4b of the wafer 4, and the suction pad 214 of the frame support part 202b contacts the frame 64.

[0152] Next, the suction plate 210 of the wafer holding section 202a and the suction pad 214 of the frame support section 202b generate an attraction force. The wafer 4 is attracted and held from the back side 4b side (band 96 side) by the suction plate 210 of the wafer holding section 202a, and the frame 64 is attracted and held by the suction pad 214 of the frame support section 202b. Then, the wafer stage 12 releases its attraction and holding of the wafer 4. Then, the transfer section 206 is activated to remove the frame unit U held by the frame unit holding section 202 from the wafer stage 12.

[0153] After the frame unit removal process is performed, a temporary placement process is performed to align the center of the wafer 4 with the center of the temporary placement stage 204 and temporarily place the frame unit U on the temporary placement stage 204.

[0154] Reference Figure 10To explain, in the temporary placement process, the frame unit U held by the frame unit holding section 202 is first positioned above the imaging section 224. Next, the transport section 206 of the two-dimensional moving mechanism constituting the frame unit transfer mechanism 192 is activated, and the imaging section 224 captures images of at least three points on the outer periphery of the wafer 4 of the frame unit U held by the frame unit holding section 202. The coordinates of at least three points on the outer periphery of the wafer 4 are then measured. Next, the center coordinates of the wafer 4 are determined based on the measured coordinates of the three points.

[0155] Next, the transport unit 206 is activated to position the center of the wafer 4 at the center of the annular support portion 226 of the temporary stage 204, so that the remaining peripheral area 20 of the front surface 4a of the wafer 4 contacts the upper surface of the annular support portion 226 of the temporary stage 204, and the lower surface of the frame 64 contacts the upper surface of the frame support portion 228 of the temporary stage 204. At this time, the front surface 4a of the wafer 4 faces downward, but the device region 18 is located in the recess 230 of the temporary stage 204, so the device 14 and the temporary stage 204 will not contact each other, thus preventing damage to the device 14.

[0156] Next, the wafer holding part 202a releases its attraction and holding of the wafer 4, and the frame support part 202b releases its attraction and holding of the frame 64, transferring the frame unit U from the frame unit removal mechanism 192 to the temporary stage 204. Then, the heater of the frame support part 228 is activated, heating the strip 96 of the frame unit U temporarily placed on the temporary stage 204. This softens the strip 96, causing it to adhere tightly to the base of the annular reinforcement part 24 of the wafer 4.

[0157] After the temporary placement process is performed, a reinforcement removal process is performed to remove the annular reinforcement 24 from the wafer 4 of the frame unit U that has been moved out by the frame unit removal mechanism 192.

[0158] Reference Figure 1 , Figure 10 and Figure 12 To explain, in the reinforcement removal process, firstly, the X-axis movable component 260 and the Z-axis movable component 262 of the first lifting platform 246 of the reinforcement removal mechanism 194 are moved, causing the lower surface of the adsorption sheet 268 to contact the upper surface of the frame 64 of the frame unit U, which is temporarily placed on the temporary stage 204. Next, the adsorption holes of the adsorption sheet 268 on the first lifting platform 246 generate an attractive force, attracting and holding the frame 64 portion of the frame unit U.

[0159] Next, the X-axis movable component 260 and Z-axis movable component 262 of the first lifting platform 246 are moved, such as... Figure 11As shown, the frame unit U, attracted and held by the adsorption sheet 268, is positioned above the laser beam irradiation unit 244. Next, the focusing point of the laser beam LB is positioned at the base of the annular reinforcing portion 24 of the wafer 4 of the frame unit U.

[0160] Next, while rotating the suction plate 268 and the frame unit U via the motor 266 of the first lifting platform 246, a laser beam LB is irradiated onto the base of the annular reinforcing portion 24 of the wafer 4. This allows for ablation processing of the base of the annular reinforcing portion 24 of the wafer 4 to form an annular cutting groove 256. Furthermore, while the wafer 4 is irradiated with the laser beam LB, the suction source of the laser beam irradiation unit 244 is activated, generating an attractive force at the suction nozzle 254, which then attracts debris generated during the ablation process.

[0161] Next, the X-axis movable component 260 and Z-axis movable component 262 of the first lifting platform 246 are moved, so that the remaining peripheral area 20 of the front surface 4a of the wafer 4 of the frame unit U, which is attracted and held by the adsorption plate 268, comes into contact with the upper surface of the annular support portion 226 of the temporary stage 204, and the lower surface of the frame 64 comes into contact with the upper surface of the frame support portion 228 of the temporary stage 204. Then, the attraction force of the adsorption plate 268 of the first lifting platform 246 is released, and the frame unit U is transferred from the first lifting platform 246 to the temporary stage 204.

[0162] Next, the temporary platform 204, which received the frame unit U, is positioned below the separation section 248 of the reinforcement removal mechanism 194 via the temporary platform transport section 232 (see reference). Figure 10 Additionally, the belt conveyor 300 of the waste section 276 is pre-positioned in a standby position. Next, the second lifting platform 272 of the separation section 248 is lowered, bringing its lower surface into contact with the belt 96 on the back side 4b of the wafer 4. Then, an attractive force is generated on the lower surface of the second lifting platform 272, such as... Figure 16 As shown, with the annular reinforcing part 24 exposed on the outer periphery, the head 287 of the second lifting platform 272 is used to attract and hold the inner side of the wafer 4 of the frame unit U.

[0163] Next, the second lifting platform 272, which holds the wafer 4 in the frame unit U, is raised, causing the frame unit U to move away from the temporary stage 204, and the temporary stage 204 is moved below the first lifting platform 246. Then, the movable piece 288 is moved by the feed mechanism 290, and the support substrate 400 is moved by the Z-axis feed mechanism 294, as follows. Figure 17As shown, the wedge-shaped stop 402 acts on the outer periphery of the annular reinforcement 24, positioning the wedge-shaped part of the stop 402 between the belt 96 and the reinforcement 24, and the frame 64 is supported by the ball 404b of the frame support 404. Additionally, the belt conveyor 300 of the waste section 276 is positioned from the standby position to the recycling position.

[0164] Next, ultraviolet light is irradiated from a pair of ultraviolet irradiation sections 270, reducing the adhesive force of the tape 96 adhered to the annular reinforcing section 24, and the frame unit U and the second lifting platform 272 are rotated relative to the separator 274 by the motor 284. Additionally, ionized air is blown towards the frame unit U from the ionizer 406. Thus, as... Figure 18 As shown, the annular reinforcing section 24 can be separated from the frame unit U, and the static electricity generated when separating the reinforcing section 24 does not remain in the frame unit U. The reinforcing section 24 falling from the frame unit U is transported to the dust collection box 302 by the belt conveyor 300 for recycling. In addition, the separator 274 can be rotated relative to the frame unit U when separating the reinforcing section 24.

[0165] After the reinforcement removal process is performed, a process is performed to remove the acyclic unit U' from the reinforcement removal mechanism 194, which removes the ring-shaped reinforcement 24.

[0166] In the acyclic unit removal process, the belt conveyor 300 of the waste section 276 of the reinforcing section removal mechanism 194 is first positioned from the recycling position to the standby position. Next, the flipping mechanism 308 of the acyclic unit removal mechanism 196 (see reference...) Figure 19 The frame support 306 is positioned below the ringless unit U' attracted and held by the second lifting platform 272.

[0167] Next, with the suction pad 326 of the frame support 306 facing upward, the arm 318 is raised, so that the suction pad 326 of the frame support 306 contacts the lower surface side of the frame 64 of the ringless unit U' supported by the second lifting platform 272 with the front side 4a of the wafer 4 facing downward.

[0168] Next, an attractive force is generated at the attraction pad 326 of the frame support 306, and the frame 64 of the acyclic unit U' is held in place by the attraction pad 326. Then, the attraction holding of the acyclic unit U' by the second lifting platform 272 is released. As a result, the acyclic unit U' is transferred from the second lifting platform 272 of the reinforcing part removal mechanism 194 to the frame support 306 of the acyclic unit removal mechanism 196.

[0169] After the acyclic unit removal process is carried out, an acyclic unit storage process is carried out to store the acyclic unit U' that has been moved out by the acyclic unit removal mechanism 196.

[0170] In the acyclic cell storage process, the flipping mechanism 308 of the acyclic cell removal mechanism 196 is first flipped up and down, causing the acyclic cell U' held by the frame support 306 to flip up and down. As a result, the acyclic cell U' is located below the frame support 306, with the front side 4a of the wafer 4 facing upwards.

[0171] Next, the Y-axis movable part 316 and arm 318 of the flipping mechanism 308 are moved, bringing the acyclic unit U' into contact with the upper surfaces of the pair of support plates 328 of the acyclic unit support 310. At this time, the spacing between the pair of support plates 328 is narrowed by the spacing adjustment mechanism, and the pair of support plates 328 are pressed tightly against each other. Next, the attraction and holding of the acyclic unit U' by the frame support 306 is released, and the acyclic unit U' is placed on the pair of support plates 328. Next, the heaters mounted on each support plate 328 are activated to heat the belt 96 of the acyclic unit U', thereby stretching the loosening and wrinkles of the belt 96 caused by the removal of the reinforcing part 24. Then, the acyclic unit U' is again attracted and held by the frame support 306 and raised.

[0172] Next, after the spacing between the pair of support plates 328 is expanded by the spacing adjustment mechanism, the ringless unit U' is placed on the upper surface of the support plate 328. And, as... Figure 21 As shown, the ringless unit U' supported by the ringless unit support 310 is pushed by the pressing piece 338 of the pushing part 312, so that the ringless unit U' enters into the frame box 198 placed on the frame box platform 200 for storage.

[0173] As described above, in the processing apparatus 2 of the illustrated embodiment, it is easy to attach the dicing tape 96 to the back surface 4b of the wafer 4, on which a ring-shaped reinforcing portion 24 is formed in a convex shape on the back surface 4b corresponding to the outer peripheral remaining area 20, so that it becomes integral with the frame 64, and it is easy to cut off the ring-shaped reinforcing portion 24 and remove it from the wafer 4, resulting in good productivity.

Claims

1. A processing apparatus for removing a convex reinforcing portion from a wafer on a back surface corresponding to a peripheral remaining region, wherein... The processing apparatus includes: A wafer cassette platform that holds wafer cassettes containing multiple wafers; A wafer removal mechanism that removes wafers from a wafer cassette placed on the wafer cassette stage; A wafer stage that supports the front side of the wafers that are moved out by the wafer handling mechanism; A frame storage mechanism that stores multiple annular frames, each annular frame having an opening for storing a wafer. A frame removal mechanism that removes the frame from the frame storage mechanism; A frame platform that supports the frame that is moved out by the frame moving mechanism; It has an adhesive mechanism, which is installed above the frame platform to attach the tape to the frame; A frame-carrying mechanism is provided, which carries the frame with the attached strap to the wafer stage and positions the opening of the frame on the back of the wafer supported by the wafer stage, thereby placing the frame with the strap onto the wafer stage. The device includes a crimping mechanism that crimps a framed strip onto the back of the wafer. The frame unit removal mechanism removes the frame unit, which is obtained by pressing the belt with the frame to the back of the wafer using the belt pressing mechanism, from the wafer stage and temporarily places it on the temporary placement stage. The reinforcement removal mechanism cuts off and removes the annular reinforcement from the wafer of the frame unit placed on the temporary stage; A ringless unit removal mechanism removes the ringless unit from the reinforcement removal mechanism; as well as A frame box platform holds frame boxes that store acyclic units moved out by the acyclic unit handling mechanism. The reinforcement removal mechanism has the following features: A laser beam irradiation unit irradiates a laser beam toward the base of an annular reinforcement formed on the outer periphery of a wafer to form a cutting groove; The first lifting platform holds the frame unit temporarily placed on the platform and raises the frame unit, and positions it at the laser beam irradiation unit. as well as The separating section separates the annular reinforcing section from the cutting groove. The separation section has: The ultraviolet irradiation section irradiates the strip corresponding to the cutting groove with ultraviolet light, thereby reducing the adhesive force of the strip. The second lifting platform exposes the annular reinforcing part on the outer periphery to attract and hold the inner side of the wafer. A separator that separates the annular reinforcement by having a wedge-shaped stop acting on the outer periphery of the annular reinforcement; and The discarded part is the ring-shaped reinforcing part that has been separated.

2. The processing apparatus according to claim 1, wherein, The second lifting platform includes two or more platform heads with outer diameters corresponding to the inner diameter of the reinforcing portion of the wafer. These platform heads are detachably mounted on the lifting mechanism. The separation unit has a detector that checks whether the type of the test head input to the control unit matches the type of the test head actually installed. The detector checks whether the outer diameter of the platform, obtained by bringing the stop of the separator into contact with the outer periphery of the platform, matches the outer diameter of the platform input to the control unit.

3. The processing apparatus according to claim 1, wherein, The processing device has a frame support portion that supports the frame adjacent to the stop of the separation portion.

4. The processing apparatus according to claim 3, wherein, The frame support has a rotatable sphere.

5. The processing apparatus according to claim 1, wherein, An ionizer is provided adjacent to the baffle of the separation section to remove static electricity from the frame unit.

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