Apparatus for processing a substrate

Abstract

The present invention relates to an apparatus for processing a substrate. In particular, a substrate processing apparatus is provided. The substrate processing apparatus comprises a process container having a process space, a support unit configured to support and rotate a substrate in the process space, an exhaust pipe coupled to the process container and configured to exhaust a gas flow within the process space, a support frame provided independently of a rotation of the support unit and positioned between the process container and the support unit, and a vane protruding to an outside of the support frame and configured to guide the gas flow within the process space in a downward direction.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2021-0067346, filed with the Korean Intellectual Property Office on May 26, 2021, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The embodiments of the inventive concept described herein relate to substrate processing equipment, and more particularly, to substrate processing equipment for processing a substrate by rotating the substrate and supplying liquid onto the substrate. Background Technology

[0004] Various processes, such as optical lithography, thin film deposition, ashing, etching, and ion implantation, are performed to manufacture semiconductor devices. Furthermore, cleaning processes are performed before and after each of these processes to remove residual particles from the substrate. Various liquids are used in the substrate cleaning process to perform the substrate treatment.

[0005] The cleaning process includes a process of supplying chemicals to a substrate supported and rotated by a rotating head, a process of removing chemicals from the substrate by supplying a cleaning solution such as deionized water (DIW) to the substrate, a process of subsequently replacing the cleaning solution on the substrate with an organic solvent by supplying an organic solvent such as an isopropanol (IPA) solution with a lower surface tension than the cleaning solution, and a process of removing the replacement organic solvent from the substrate.

[0006] Figure 1 A known substrate processing apparatus is shown. (Reference) Figure 1 The substrate processing apparatus 1000 places a substrate W on a support unit 1200 within a processing container 1300 having a processing space, and processes the substrate W while supplying liquid to the rotating substrate W. During substrate W processing, a fan filter unit provided on the top side of the housing 1100 supplies downward airflow into the interior of the processing space. Byproducts such as gases generated during substrate processing are discharged to the outside along with the downward airflow via an exhaust pipe 1400 provided on the bottom side of the processing container 1300. Smooth venting is performed via the exhaust pipe 1400 when the internal pressure of the processing space is maintained at a set pressure.

[0007] In the cleaning process, the substrate is processed while liquid is supplied to it, which is rotated by the support unit 1200. As the support unit 1200 rotates, a rotating airflow is generated within the processing space. Figure 2As shown, when a rotating airflow is formed, the downward airflow supplied to the processing space by the fan filter unit does not reach the exhaust pipe 1400, and airflow stagnation occurs at the side of the support unit 1200. Therefore, it is difficult to maintain the pressure within the processing space at the set pressure. In particular, when the support unit 1200 rotates at high speed and liquid processing is performed on the substrate W, the rotating airflow formed within the processing space becomes stronger. Since the internal pressure of the processing space is converted into a pressure higher than the set pressure, it is difficult to discharge the processing space through the exhaust pipe 1400. Therefore, the liquid supplied to the substrate W in the processing space returns to the substrate W or flows backward. Furthermore, since no exhaust is performed, particles, fumes, and similar substances generated during the processing are dispersed in the processing space. Summary of the Invention

[0008] An embodiment of the present invention provides a substrate processing apparatus that, when processing a substrate while rotating it in a processing space, can alleviate airflow stagnation in the processing space caused by the rotating airflow generated by the rotation of the support unit.

[0009] An embodiment of the present invention provides a substrate processing apparatus that can maintain the internal pressure of the processing space at a set pressure while processing the substrate by rotating it in the processing space.

[0010] An embodiment of the present invention provides a substrate processing apparatus that can stably perform venting inside the processing space while processing the substrate by rotating it in the processing space.

[0011] An embodiment of the present invention provides a substrate processing apparatus that can prevent particles from forming on the substrate while processing the substrate by rotating it in a processing space.

[0012] The technical objectives of this invention are not limited to those described above. Other unmentioned technical objectives will become apparent to those skilled in the art from the following description.

[0013] The present invention provides a substrate processing apparatus. The substrate processing apparatus includes: a processing container having a processing space; a support unit configured to support and rotate a substrate in the processing space; an exhaust pipe connected to the processing container to discharge airflow in the processing space; a support frame configured to be independent of the rotation of the support unit and positioned between the processing container and the support unit; and guide vanes protruding from the outside of the support frame and configured to guide the airflow in the processing space in a downward direction.

[0014] In one embodiment, the support unit includes: a rotating chuck supporting a substrate; a rotating shaft coupled to the bottom surface of the rotating chuck and configured to rotate the rotating chuck; and a first driver configured to supply rotational force to the rotating shaft, wherein the support frame has an annular shape to surround the outer circumferential surface of the rotating shaft.

[0015] In one implementation, the guide vane includes a longitudinally extending portion that defines an angle of approximately 90 degrees with the top surface of the rotating chuck.

[0016] In one implementation, the guide vane includes a longitudinally extending portion that defines an obtuse angle with the top surface of the rotating chuck.

[0017] In one embodiment, guide vanes are provided in multiples along the outer circumferential surface of the support frame, and each of the multiple guide vanes includes a longitudinally extending portion, with at least two of the multiple guide vanes having different included angles with each other to the top surface of the rotating chuck.

[0018] In one embodiment, the guide vane further includes a transverse extension extending from the longitudinal extension along the top surface of the support frame, the transverse extension having a top surface lower than the bottom surface of the rotating chuck.

[0019] In one embodiment, the guide vane further includes a transverse extension extending from the longitudinal extension along the top surface of the support frame, the transverse extension having a top surface lower than the top surface of the rotary chuck and higher than the bottom surface of the rotary chuck.

[0020] In the implementation plan, the support frame remains stationary inside the processing container.

[0021] In one embodiment, the support frame further includes a second driver configured to rotate the support frame independently of the rotation of the support unit, wherein the second driver rotates the support frame in the same direction as the support unit and at a lower rotational speed than the support unit.

[0022] In one embodiment, the support frame further includes a second driver configured to rotate the support frame independently of the rotation of the support unit, wherein the second driver rotates the support frame in the opposite direction to the rotation of the support unit.

[0023] In one embodiment, the support frame further includes an annual ring body adjacent to the bottom of the rotating chuck and having a substantially flat top surface and bottom surface, wherein the guide vane includes a first portion extending laterally along the top surface of the annual ring body and a second portion extending longitudinally from the first portion at least along the outer sidewall of the annual ring body.

[0024] In one embodiment, the substrate processing apparatus further includes a rear nozzle on the top surface of the annual rings to discharge liquid into a rotary chuck.

[0025] The present invention provides a substrate processing apparatus. The substrate processing apparatus includes: a processing container having a processing space; a support unit configured to support and rotate a substrate in the processing space; an exhaust pipe connected to the processing container to discharge airflow in the processing space; and guide vanes configured to guide airflow in the processing space in a downward direction.

[0026] In the implementation scheme, the guide vane extends longitudinally and is parallel to the rotation axis of the support unit.

[0027] In the implementation scheme, the guide vane extends longitudinally and defines an acute angle with the rotation axis of the support unit.

[0028] In one embodiment, the substrate processing apparatus further includes a support frame configured to be independent of the rotation of the support unit and surrounding the support unit, wherein guide vanes are mounted on the support frame.

[0029] In the implementation scheme, guide vanes are installed on the inner wall of the processing container.

[0030] The present invention provides a substrate processing apparatus. The substrate processing apparatus includes: a housing having an internal space; a processing container disposed within the internal space and having a processing space; a support unit configured to support and rotate a substrate in the processing space; a liquid supply unit configured to supply liquid to the substrate supported by the support unit; an airflow supply unit for forming an airflow in the processing space; an exhaust pipe connected to the processing container to discharge the airflow in the processing space; a stationary support frame surrounding the support unit; and guide vanes mounted on the support frame and configured to guide the airflow in the processing space in a downward direction.

[0031] In the implementation scheme, the guide vane extends downward and is substantially parallel to the rotation axis of the support unit.

[0032] In the implementation scheme, the guide vane extends downward and defines an acute angle with the rotation axis of the support unit.

[0033] According to an embodiment of the present invention, when processing a substrate while rotating it in a processing space, airflow stagnation in the processing space can be alleviated by guiding the rotating airflow generated by the rotation of the support unit downward.

[0034] According to an embodiment of the present invention, when processing a substrate while rotating it in a processing space, the internal pressure of the processing space can be maintained at a set pressure.

[0035] According to an embodiment of the present invention, when the substrate is processed while rotating in the processing space, the venting inside the processing space can be stably maintained.

[0036] According to an embodiment of the present invention, when processing a substrate while rotating it in a processing space, the formation of particles on the substrate can be prevented.

[0037] The effects of this invention are not limited to those described above. Other effects not mentioned below will become apparent to those skilled in the art from the following description. Attached Figure Description

[0038] The above and other objects and features will become apparent from the following description with reference to the accompanying drawings, wherein, unless otherwise specified, similar reference numerals refer to similar portions in the respective drawings.

[0039] Figure 1 This is a schematic cross-sectional view of a known substrate processing apparatus.

[0040] Figure 2 Schematic illustration Figure 1 Airflow stagnation caused by rotating airflow in known substrate processing equipment.

[0041] Figure 3 An embodiment of the substrate processing apparatus of the present invention is illustrated schematically.

[0042] Figure 4 Schematic illustration Figure 3 An implementation scheme for the process chamber of a substrate processing equipment.

[0043] Figure 5 Schematic illustration Figure 4 A cross-sectional view of the substrate processing equipment.

[0044] Figure 6 Schematic illustration Figure 3 A three-dimensional view of the guide vane.

[0045] Figure 7 Schematic illustration Figure 4 The airflow in the process chamber.

[0046] Figure 8 It is shown schematically. Figure 4 A three-dimensional cross-sectional view of the airflow inside the treatment container.

[0047] Figure 9 Schematic illustration Figure 4 The internal pressure of the process chamber.

[0048] Figure 10 Schematic illustration Figure 4 Another embodiment of the process chamber of the substrate processing equipment.

[0049] Figure 11 Schematic illustration Figure 10 A three-dimensional view of the guide vane.

[0050] Figures 12 to 14 Schematic illustration Figure 4Another implementation scheme for the guide vane.

[0051] Figures 15 to 16 Schematic illustration Figure 4 Another embodiment of the process chamber of the substrate processing equipment.

[0052] Figures 17 to 18 Schematic illustration Figure 4 Another embodiment of the process chamber of the substrate processing equipment.

[0053] Figure 19 Schematic illustration Figure 4 Another embodiment of the process chamber of the substrate processing equipment.

[0054] Figure 20 It is shown schematically. Figure 19 A three-dimensional cross-sectional view of the airflow in the treatment container.

[0055] [Symbol Explanation]

[0056] 1-Substrate processing equipment; 2-First direction; 4-Second direction; 6-Third direction; 10-Index module; 20-Processing module; 120-Loading port; 140-Index frame; 142-Cable guide rail; 144-Index robot; 220-Buffer unit; 240-Transfer chamber; 242-Guide rail; 244-Transfer robot; 260-Process chamber; 1000-Substrate processing equipment; 1100-Housing; 1200-Support unit; 1300- Processing container; 1400 - Exhaust pipe; 1440 - Index hand; 1442 - Index base; 1444 - Index support unit; 2442 - Base; 2444 - Body; 2446 - Arm; 2610 - Housing; 2620 - Processing container; 2621 - Guide wall; 2623 - (First) Recollection container; 2623a - (First) Inlet; 2623b - (First) Outlet; 2623c - Recollection pipe; 2625 - (Second) Recollection container; 2625a - (Second) Inlet; 2625b - (Second) Outlet; 2625c - Recollection Tube; 2627 - (Third) Recollection Container; 2627a - (Third) Inlet; 2627b - (Third) Outlet; 2627c - Recollection Tube; 2630 - Support Unit; 2631 - Rotary Chuck; 2633 - Support Pin; 2635 - Chuck Pin; 2637 - Rotary Shaft; 2639 - First Actuator; 2640 - Liquid Supply Unit; 26 42-First liquid supply component; 2642a-Support shaft; 2642b-Support arm; 2642c-Arm actuator; 2642d-Nozzle; 2650-Exhaust pipe / exhaust unit; 2660-Airflow supply unit; 2670-Support frame; 2671-First part; 2672-Second part; 2675-Body part; 2677-Second actuator; 2680-Guide vane; 2690-Rear nozzle; a~c-Inclination angle; F-Container; W-Base plate. Detailed Implementation

[0057] The inventive concept can be modified and taken in various forms, and specific embodiments thereof will be illustrated and described in detail in the accompanying drawings. However, embodiments of the inventive concept are not intended to limit the specific forms of disclosure, and it should be understood that the inventive concept includes all variations, equivalents, and substitutions within the spirit and technical scope of the inventive concept. These embodiments are provided to more fully explain the inventive concept to those skilled in the art. Therefore, the forms of components in the drawings are exaggerated for clearer description.

[0058] It should be understood that when a component or layer is referred to as "on another component or layer," "to," "attached to," or "covering" another component or layer, it may be directly on, connected to, attached to, or cover the other component or layer, or there may be intermediate components or layers. Conversely, when a component is referred to as "directly on another component or layer," "directly connected to," or "directly attached to" another component or layer, there are no intermediate components or layers. Similarity numbers refer to similar components throughout the specification. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0059] For ease of description, spatial relative terms (e.g., "below," "under," "lower," "above," "upper," and similar) are used herein to describe the relationship between one component or feature in the accompanying drawings and another component(s). It should be understood that spatial relative terms are intended to cover different orientations of the device during use or operation, other than those depicted in the drawings. For example, if the device in the drawings is flipped, it is described as "below other components or features" or "below other components or features," and then oriented "above other components or features." Thus, the term "below" can encompass both above and below orientations. The device may be otherwise oriented (rotated 90 degrees or in other orientations), and the spatial relative descriptors used herein can be interpreted similarly.

[0060] In the implementation scheme, a process for liquid treatment of a substrate by supplying a liquid, such as a cleaning solution, onto the substrate will be described as an example. However, the implementation scheme is not limited to a cleaning process, and various processes that use a treatment solution to treat the substrate can be applied, such as etching, ashing, developing, and the like.

[0061] The following will refer to Figures 3 to 18 The embodiments of the present invention are described in detail.

[0062] Figure 3 A substrate processing apparatus according to an embodiment of the present invention is illustrated schematically. (Reference) Figure 3 The substrate processing apparatus 1 includes an index module 10 and a processing module 20. According to an embodiment, the index module 10 and the processing module 20 are arranged in one direction. Hereinafter, the direction in which the index module 10 and the processing module 20 are arranged is referred to as the first direction 2, the direction perpendicular to the first direction 2 when viewed from above is referred to as the second direction 4, and the direction perpendicular to the plane including both the first direction 2 and the second direction 4 is defined as the third direction 6.

[0063] Index module 10 transfers substrate W from container F, where substrate W is stored, to processing module 20, where substrate W is processed. Index module 10 receives substrate W processed at processing module 20 and stores substrate W in container F. A longitudinal direction of index module 10 is provided in second direction 4. Index module 10 has loading port 120 and index frame 140.

[0064] The container F of the storage substrate W is mounted on the loading port 120. The loading port 120 and the processing module 20 are disposed on two opposite sides of the index frame 140. Multiple loading ports 120 may be provided, and multiple loading ports 120 may be configured in a row along the second direction 4. The number of loading ports 120 may be increased or decreased depending on the process efficiency and footprint of the processing module 20.

[0065] Multiple slots (not shown) are formed at container F to store substrate W in a horizontal configuration relative to the ground. Container F can be a sealed container, such as a front-opening unified pod (FOUP). Container F can be placed on loading port 120 by a transfer device (not shown), such as an overhead conveyor, an automated guided vehicle, or by an operator.

[0066] Cable guide rail 142 and indexing robot 144 are provided within index frame 140. Cable guide rail 142 provides its longitudinal direction within index frame 140 along a second direction 4. Indexing robot 144 can transfer substrate W. Indexing robot 144 can transfer substrate W between indexing module 10 and buffer unit 220. Indexing robot 144 may include indexing hand 1440. Substrate W can be placed on indexing hand 1440. Indexing hand 1440 may include an index base 1442 having a ring-like shape, wherein a portion of the circumference is symmetrically cut; and an index support unit 1444 for moving index base 1442. The construction of indexing hand 1440 is the same as or similar to the construction of transfer hand described later. Indexing hand 1440 can be provided to move along cable guide rail 142 along the second direction 4. Therefore, indexing hand 1440 can move forward and backward along cable guide rail 142. In addition, indexing hand 1440 can be provided to rotate about a third direction 6 and can move along the third direction 6.

[0067] Processing module 20 includes a buffer unit 220, a transfer chamber 240, and a process chamber 260. The buffer unit 220 provides a space for temporarily holding substrate W brought into and removed from processing module 20. The transfer chamber 240 provides space for transferring substrate W between and within the process chamber 260. The process chamber 260 can perform a liquid processing process on substrate W by supplying liquid to substrate W. For example, the liquid processing process can be a cleaning process using a cleaning solution to clean the substrate. Chemical treatment, rinsing treatment, and drying treatment can all be performed on the substrate within the process chamber. If necessary, the process chamber for drying the substrate can be provided separately from the process chamber for performing the liquid treatment.

[0068] A buffer unit 220 may be disposed between the index frame 140 and the transfer chamber 240. The buffer unit 220 may be located at one end of the transfer chamber 240. A slot (not shown) for placing the substrate W is provided inside the buffer unit 220. The multiple slots (not shown) are spaced apart from each other along a third direction 6. The front and back sides of the buffer unit 220 are open. The front side is the surface facing the index module 10, and the back side is the surface facing the transfer chamber 240. The index robot 144 can access the buffer unit 220 via the front side, and the transfer robot 244, described later, can access the buffer unit 220 via the back side.

[0069] The longitudinal direction of the transfer chamber 240 can be provided in the first direction 2. Each of the process chambers 260 can be disposed on both sides of the transfer chamber 240. The process chamber 260 can be disposed on one side of the transfer chamber 240. The process chambers 260 and the transfer chamber 240 can be disposed along the second direction 4. According to the embodiment, the process chambers 260 can be disposed on both sides of the transfer chamber 240, and the process chambers 260 can be provided in A×B arrays (A and B are natural numbers greater than 1 or 1) along the first direction 2 and the third direction 6, respectively. Here, A is a plurality of process chambers 260 provided in a column along the first direction 2, and B is a plurality of process chambers 260 provided in a column along the third direction 6. When four or six process chambers 260 are provided on one side of the transfer chamber 240, the process chambers 260 can be configured in a 2×2 or 3×2 array. The number of process chambers 260 can be increased or decreased. Unlike the above, the process chamber 260 may be provided only on one side of the transfer chamber 240. Alternatively, the process chamber 260 may be provided as a single layer on one and both sides of the transfer chamber 240.

[0070] The transfer chamber 240 includes a guide rail 242 and a transfer robot 244. The guide rail 242 has its longitudinal direction in a first direction 2 within the transfer chamber 240. The transfer robot 244 is configured to move linearly along the first direction 2 on the guide rail 242. The transfer robot 244 transfers the substrate W between the buffer unit 220 and the process chamber 260, and between the process chambers 260.

[0071] The transfer robot 244 includes a base 2442, a body 2444, and arms 2446. The base 2442 is mounted to be movable along a guide rail 242 in a first direction 2. The body 2444 is coupled to the base 2442. The body 2444 is provided to be movable on the base 2442 along a third direction 6. Furthermore, the body 2444 is provided to be rotatable on the base 2442. The arms 2446 are coupled to the body 2444 and are provided to be movable forward and backward relative to the body 2444. Multiple arms 2446 are provided, each individually driven. The arms 2446 are arranged stacked on top of each other and spaced apart along the third direction 6.

[0072] Process chamber 260 performs liquid processing processes on substrate W. For example, process chamber 260 can be a chamber that performs a cleaning process by supplying cleaning fluid to substrate W. Conversely, process chamber 260 can be a chamber that performs a wet etching process by supplying liquid plasma to remove a thin film from the substrate. Process chambers 260 can have different structures depending on the type of process used to process substrate W. Alternatively, each of process chambers 260 can have the same structure. Optionally, process chambers 260 can be divided into multiple groups, with one process chamber 260 belonging to one group being a process chamber 260 that performs either a cleaning process or a wet etching process, and another process chamber 260 belonging to the same group being a process chamber 260 that performs either a cleaning process or a wet etching process.

[0073] In the following embodiments of the present invention, a liquid processing process for processing substrate W by supplying liquid from process chamber 260 to substrate W will be described as an example.

[0074] Figure 4 An embodiment of the process chamber is schematically illustrated. (Reference) Figure 4 The process chamber 260 includes a shell 2610, a processing container 2620, a support unit 2630, a liquid supply unit 2640, an exhaust pipe 2650, an airflow supply unit 2660, a support frame 2670, and a guide vane 2680.

[0075] The housing 2610 has a space within it. The housing 2610 is generally in the form of a rectangular parallelepiped. The processing container 2620, the support unit 2630, and the liquid supply unit 2640 are disposed within the housing 2610.

[0076] The processing container 2620 has a processing space with an open top. The substrate W is processed with liquid within the processing space. A support unit 2630 supports and rotates the substrate W within the processing space. A liquid supply unit 2640 supplies liquid to the substrate W supported by the support unit 2630. Various types of liquid can be provided, and they can be supplied sequentially to the substrate W.

[0077] According to the implementation scheme, the processing container 2620 has a guide wall 2621 and a plurality of recollection containers 2623, 2625, and 2627. Each of the recollection containers 2623, 2625, and 2627 separates from and recollects different liquids used for substrate processing. Each of the recollection containers 2623, 2625, and 2627 has a recollection space for recollecting liquids used for substrate processing. The guide wall 2621 and each of the recollection containers 2623, 2625, and 2627 are provided in a ring-like manner around the support unit 2630. When the liquid processing process is performed, the liquid dispersed by the rotation of the substrate W is introduced into the recollection space through the inlet 2623a of the recollection container 2623, the inlet 2625a of the recollection container 2625, and the inlet 2627a of the recollection container 2627 (described later). Different types of processing liquids can flow into each of the recollection containers.

[0078] According to the implementation scheme, the processing container 2620 has a guide wall 2621, a first recollection container 2623, a second recollection container 2625, and a third recollection container 2627. The guide wall 2621 is provided in a ring-like manner around the support unit 2630, and the first recollection container 2623 is provided in a ring-like manner around the guide wall 2621. The second recollection container 2625 is provided in a ring-like manner around the first recollection container 2623, and the third recollection container 2627 is provided in a ring-like manner around the second recollection container 2625. The space between the first recollection container 2623 and the guide wall 2621 serves as a first inlet 2623a through which liquid is introduced. The space between the first recollection container 2623 and the second recollection container 2625 serves as a second inlet 2625a through which liquid is introduced. The space between the second recollection container 2625 and the third recollection container 2627 serves as a third inlet 2627a through which liquid is introduced. The second entrance 2625a is positioned above the first entrance 2623a, and the third entrance 2627a can be positioned above the second entrance 2625a.

[0079] The space between the lower end of the guide wall 2621 and the first recollection container 2623 serves as a first outlet 2623b, through which fumes and airflow generated from the liquid are discharged. The space between the lower ends of the first recollection container 2623 and the second recollection container 2625 serves as a second outlet 2625b, through which fumes and airflow generated from the liquid are discharged. The space between the lower ends of the second recollection container 2625 and the third recollection container 2627 serves as a third outlet 2627b, through which fumes and airflow generated from the liquid are discharged. The fumes and airflow discharged from the first outlet 2623b, the second outlet 2625b, and the third outlet 2627b are discharged via an exhaust unit 2650, described later.

[0080] Vertically extending collection pipes 2623c, 2625c, and 2627c on the bottom surface are connected to respective collection containers 2623, 2625, and 2627. Each of the collection pipes 2623c, 2625c, and 2627c discharges treated liquid introduced through each of the collection containers 2623, 2625, and 2627. The discharged treated liquid can be reused via an external treated liquid regeneration system (not shown).

[0081] The support unit 2630 includes a rotary chuck 2631, a support pin 2633, a chuck pin 2635, a rotating shaft 2637, and a first driver 2639. The rotary chuck 2631 has a top surface, which is generally circular when viewed from above. The top surface of the rotary chuck 2631 may have a diameter larger than the diameter of the substrate W.

[0082] Multiple support pins 2633 may be provided. Support pins 2633 are disposed at the edge portion of the top surface of the rotary chuck 2631, spaced apart from each other at predetermined intervals, defining growth rings therein, and projecting upward from the rotary chuck 2631. Support pins 2633 support the edge of the back surface of the substrate W, such that the substrate W is spaced apart from the top surface of the rotary chuck 2631 by a predetermined distance.

[0083] Multiple chuck pins 2635 may be provided. The chuck pins 2635 are positioned further away from the center of the rotary chuck 2631 than the support pins 2633. The chuck pins 2635 protrude from the top surface of the rotary chuck 2631. The chuck pins 2635 support the side portion of the substrate W such that the substrate W does not move laterally or wobble when rotated. The chuck pins 2635 can move radially between a standby position and a support position along the rotary chuck 2631. The standby position is a position further away from the center of the rotary chuck 2631 than the support position. When the substrate W is loaded or unloaded on the support unit 2630, the chuck pins 2635 are positioned in the standby position, and when processing is performed on the substrate W, the chuck pins 2635 are positioned in the support position to support the substrate W and prevent lateral movement or wobble of the substrate W. In the support position, the chuck pins 2635 are in contact with the side of the substrate W.

[0084] A rotating shaft 2637 is coupled to a rotating chuck 2631. The rotating shaft 2637 can be coupled to the bottom surface of the rotating chuck 2631. The rotating shaft 2637 is provided to be rotatable by receiving power from a first driver 2639. The first driver 2639 rotates the rotating shaft 2637, thereby rotating the rotating chuck 2631. The first driver 2639 can change the rotational speed of the rotating shaft 2637. The first driver 2639 can be a motor providing driving force. However, the inventive concept is not limited thereto, and various modifications can be made to known devices that provide driving force.

[0085] Liquid supply unit 2640 supplies liquid to substrate W supported by support unit 2630. Multiple liquid supply units 2640 are provided, each supplying a different type of liquid. According to an embodiment, liquid supply unit 2640 includes a first liquid supply member 2642.

[0086] The first liquid supply component 2642 includes a support shaft 2642a, a support arm 2642b, an arm actuator 2642c, and a nozzle 2642d. The support shaft 2642a is located near the side wall of the processing container 2620. The support shaft 2642a has a vertically extending rod shape. The support shaft 2642a is provided to be rotatable by the arm actuator 2642c. The support arm 2642b is coupled to the top end of the support shaft 2642a. The support arm 2642b extends horizontally from the support shaft 2642a. The nozzle 2642d is fixedly coupled to one end of the support arm 2642b. When the support shaft 2642a rotates, the nozzle 2642d can swing together with the support arm 2642b. The nozzle 2642d can swing to a processing position and a standby position. Here, the processing position is the position where the nozzle 2642d faces the substrate W supported by the support unit 2630, and the standby position is the position where the nozzle 2642d leaves the processing position.

[0087] In some embodiments, the support arm 2642b may be provided to move forward and backward in its longitudinal direction. When viewed from above, the nozzle 2642d may swing to coincide with the central axis of the substrate W.

[0088] The first and second treatment solutions can be any of chemicals, rinsing solutions, or organic solvents. For example, chemicals may include diluted sulfuric acid peroxide (H₂SO₄), phosphoric acid (P₂O₅), hydrofluoric acid (HF), and ammonium hydroxide (NH₄OH). For example, rinsing solutions may include water or deionized water (DIW). For example, organic solvents may include alcohols, such as isopropanol (IPA).

[0089] Exhaust pipe 2650 discharges fumes and gases generated in the processing space. Exhaust pipe 2650 discharges fumes and gases generated when the substrate W is liquid-processed. Exhaust pipe 2650 can be connected to the bottom surface of processing container 2620. In an embodiment, exhaust pipe 2650 can be positioned between the rotation axis 2637 of support unit 2630 and the inner wall of processing container 2620. A pressure reducing unit (not shown) is provided at exhaust pipe 2650. Fumes and gases generated during liquid processing of substrate W through the pressure reducing unit are discharged from the processing space to the outside of the processing space.

[0090] Airflow supply unit 2660 supplies airflow to the interior space of housing 2610. Airflow supply unit 2660 can supply downward airflow to the interior space. Airflow supply unit 2660 can be installed at housing 2610. Airflow supply unit 2660 can be installed above processing container 2620 and support unit 2630. The gas supplied to the interior space of housing 2610 via airflow supply unit 2660 forms a downward airflow within the interior space. Gas byproducts generated by the processing within the processing space are discharged to the outside of housing 2610 via exhaust pipe 2650 through the downward airflow. Airflow supply unit 2660 can be provided as a fan filter unit.

[0091] Figure 5 Schematic illustration Figure 4 A cross-section of the substrate processing equipment. Figure 6 Schematic illustration Figure 4 A three-dimensional view of the guide vane. The following text will refer to... Figures 4 to 6 The support frame and guide vanes according to an embodiment of the present invention are described.

[0092] refer to Figure 4 and Figure 5A support frame 2670 is positioned between the processing container 2620 and the support unit 2630. The support frame 2670 may be supplied as an outer circumferential surface surrounding a rotation axis 2637 of the support unit 2630. The support frame 2670 may have an annular shape surrounding the outer circumferential surface of the rotation axis 2637. The support frame 2670 is configured to be independent of the rotation of the support unit 2630. For example, a bearing may be provided between the inner sidewall (e.g., the inner circumferential surface) of the support frame 2670 and the outer circumferential surface of the rotation axis 2637. Therefore, the support frame 2670 can remain stationary during the rotation of the support unit 2630. During the processing, the support frame 2670 can support the bottom of the rotating support unit 2630 without rotating the support frame. Guide vanes 2680 may be mounted on the support frame 2670, for example, at least on the outer sidewall of the support frame 2670 near the support unit 2630.

[0093] The support frame 2670 may include a body portion 2675 having a ring-like shape to surround an outer wall (e.g., an outer circumferential surface) of the support frame 2670. The body portion 2675 may be provided at a location adjacent to the bottom end of the support unit 2630. The body portion 2675 may be provided fixedly.

[0094] Guide vane 2680 is mounted on body portion 2675. Guide vane 2680 is indirectly mounted on support frame 2670 through body portion 2675. Since support frame 2670 is provided as stationary, body portion 2675 is stationary, and guide vane 2680 is also provided as stationary. Guide vane 2680 may protrude to the outside of body portion 2675 and extend downward. In embodiments, guide vane 2680 is mounted on top surface of body portion 2675 and extends downward along outer sidewall (outer circumferential surface) of body portion 2675. For example, in some embodiments, guide vane 2680 may have a first portion on top surface of body portion 2675 and at least a downwardly extending second portion on sidewall of body portion 2675, thereby guide vane 2680 having Shape (see) Figure 12 and Figure 13 In some implementations, the first part may be omitted (see...). Figure 14 The second portion extending downward may be mounted on the sidewall of the body portion 2675 in various orientations, resulting in various angles with the axis of rotation of the support unit 2630 (e.g., 0 ≤ angle (degrees) < 90) or various angles with the top surface of the support unit 2630 (e.g., 90 ≤ angle (degrees) < 180).

[0095] Guide vanes 2680 may be provided in multiples along the circumferential direction of the outer circumferential surface of the support frame 2670. Multiple guide vanes 2680 may be provided so that they are spaced apart from each other at predetermined intervals. Alternatively, multiple guide vanes 2680 may be provided spaced apart from each other at different intervals. The top end of the guide vane 2680 (for example, the first portion) may be provided at a position below the bottom surface of the rotary chuck 2631. The bottom end of the guide vane 2680 (for example, the bottom end of the second portion) may be below the bottom surface of the body portion 2675.

[0096] Figure 7 Schematic illustration Figure 4 The airflow within the process chamber. Figure 8 It is shown schematically. Figure 4 A three-dimensional cross-sectional view of the airflow inside the treatment container. Figure 9 Schematic illustration Figure 4 The pressure within the process chamber.

[0097] refer to Figures 7 to 9 An airflow supply unit 2650, provided from the top wall of housing 2610, supplies downward airflow to the interior space of housing 2610. When processing a substrate, a rotary chuck 2631 rotates, thereby generating a rotating airflow around a rotation axis 2637 in the processing space. A guide vane 2680 is formed perpendicular to the ground (i.e., perpendicular to the top surface of the support unit 2630 (the top surface of the rotary chuck), and parallel to the rotation axis 2637) to guide the rotating airflow in a direction perpendicular to the direction of the rotating airflow. The top end of the guide vane 2680 is provided below the top surface of the rotary chuck 2631, where the rotating airflow is primarily formed and extends downwards, thereby guiding the airflow generated by the rotation of the rotary chuck 2631 downwards. The airflow guided downwards by the guide vane 2680 can be discharged through an exhaust pipe 2650 connected to the bottom of the processing container.

[0098] Therefore, it is possible to mitigate eddies generated within the processing space due to the rotating airflow. Furthermore, it is possible to smoothly discharge the rotating airflow downwards from the interior of the processing space. Thus, it is possible to prevent the pressure within the processing space from exceeding a set pressure due to the rotating airflow. Even when the rotary chuck 2631 rotates at high speed and processes the substrate, it is possible to prevent the internal pressure of the processing space from exceeding the set pressure. By maintaining the pressure within the processing space at the set pressure, the risk of liquid supplied to the substrate returning to the substrate and flowing backwards can be minimized.

[0099] Figure 10 Schematic illustration Figure 4 Another embodiment of the process chamber of the substrate processing equipment. Figure 11 Schematic illustration Figure 10 A three-dimensional view of the guide vane.

[0100] refer to Figures 10 to 11 The substrate processing apparatus 1 may further include a rear nozzle 2690 for discharging liquid toward the rotary chuck 2631. The rear nozzle 2690 can spray liquid toward the bottom surface of the support unit 2630. The rear nozzle 2690 may be provided on the top surface of the body portion 2675. The rear nozzle 2690 may be positioned between (i.e., between their first portions) a plurality of guide vanes 2680 mounted on the top surface of the body portion 2675. The guide vanes 2680 and the rear nozzle 2690 are mounted through the body portion 2675 to eliminate structural complexity of the substrate processing apparatus. Cleaning processing can be provided for the rotary chuck 2631 and the processing container 2620, and at the same time, the generation of eddies due to the rotating airflow within the processing space can be reduced.

[0101] Figures 12 to 14 Schematic illustration Figure 4 Another implementation scheme for the guide vane. (See reference) Figures 12 to 13 At least some of the guide vanes 2680 may be provided such that their longitudinal direction is inclined relative to the ground. For example, some of the guide vanes (i.e., their downwardly extending second portions) may have an obtuse angle with the top surface of the body portion 2675, which is substantially parallel to the top surface of the rotary chuck 2631. For instance, the top end of the guide vane 2680 (e.g., the top end of its first portion) may be positioned upstream relative to the direction of rotation of the rotary chuck 2631, and the bottom end of the guide vane 2680 (e.g., the bottom of its second portion) may be positioned downstream relative to the direction of rotation of the rotary chuck 2631. The angle of inclination of the guide vane 2680 relative to the ground (…) Figure 13 The “a”, “b”, and “c” in the text can be provided in the range of 90 to 150 degrees.

[0102] Guide vane 2680 (its downwardly extending second portion) can provide the same tilt angle (inclination angle) α relative to the ground (relative to the top surface of body portion 2675 or relative to the top surface of rotating chuck 2631). Alternatively, guide vane 2680 can provide different tilt angles α, β, and β. For example, in Figure 13 Of the five guide vanes shown, the second guide vane 2680, which can provide an angle of inclination 'a' relative to the ground (relative to the top surface of the body portion 2675) smaller than the angle of inclination 'b' of the third guide vane 2680 relative to the ground (relative to the top surface of the body portion 2675), can provide an angle of inclination (tilt angle) 'c' greater than the angle of inclination 'b' of the third guide vane. The angles of inclination (tilt angles) of the first and fifth guide vanes relative to the ground (top surface of the body portion 2675) are substantially 90 degrees, that is, the downwardly extending second portions of the first and fifth guide vanes are parallel to the rotation axis 2637.

[0103] Because the guide vane 2680 has a downward (and, if necessary, offset along the rotation direction of the rotary chuck 2631) extension, the direction of the rotating airflow caused by the rotation of the rotary chuck 2631 can be guided downward to the exhaust pipe 2650 to be exhausted. It is possible to minimize the upward branching airflow generated when the rotating airflow contacts the guide vane 2680. Therefore, it is possible to eliminate airflow stagnation within the processing space.

[0104] refer to Figure 14 The guide vane 2680 may project outward from the body portion 2675 to be formed in a downward direction, for example, extending beyond the bottom end of the body portion 2675, and may be provided in a form where its width narrows in the downward direction. The top surface of the guide vane 2680 may be flush with the top surface of the body portion 2675. In some embodiments, the guide vane 2680 may extend beyond the top surface of the body portion 2675 such that the top surface of the guide vane 2680 is higher than the top surface of the body portion 2675.

[0105] The invention is not limited to this; the shape of the guide vane 2680 can be modified so that the ratio of the maximum width (width at the top end) to the length is 0.5 or greater. The invention is not limited to this; the guide vane 2680 can be modified so that the ratio of the edge thickness to the circle value is 0.1 or greater.

[0106] Figures 15 to 16 Schematic illustration Figure 4 Another embodiment of the process chamber of the substrate processing apparatus. In the above exemplary embodiment, the support frame 2670 is provided to remain stationary relative to the rotation of the support unit 2630. However, the inventive concept is not limited thereto, and the support frame 2670 can be provided to be rotatable. In the following embodiments, the housing 2610, processing container 2620, support unit 2630, liquid supply unit 2640, exhaust pipe 2650, and airflow supply unit 2660 of the process chamber 260 are arranged in a manner similar to Figure 4 The implementation plan is provided. Furthermore, the guide vane 2680 is similar to... Figures 4 to 14 The implementation plan is provided.

[0107] refer to Figure 15A support frame 2670 is configured to surround a support unit 2630. The support frame 2670 may be provided as an outer circumferential surface surrounding a rotation axis 2637. The support frame 2670 may be provided in an annular shape around the outer circumferential surface of the rotation axis. The support frame 2670 is configured to rotate independently of the support unit 2630. The support frame 2670 may rotate in the same direction as the rotation direction of the support unit 2630. The support frame 2670 may include a second actuator 2677 that provides a rotational force in the same direction as the rotation direction of the support unit 2630. The second actuator 2677 may be provided below the support frame 2670. The second actuator 2677 may vary the rotational speed. The rotational speed of the support frame 2670 may be provided at a speed lower than the rotational speed of the support unit 2630. The second actuator 2677 may be a motor providing the driving force. However, the inventive concept is not limited thereto, and various modifications can be made to known devices that provide driving force. As another embodiment, a gear (not shown) can be coupled between the inner circumferential surface of the support frame 2670 and the outer circumferential surface of the support unit 2630. The gear (not shown) provided on the inner circumferential surface of the support frame 2670 can have a larger diameter than the gear provided on the outer circumferential surface of the support unit 2630. Therefore, the support frame 2670 can rotate in the same direction as the rotation direction of the support unit 2630 and at a speed lower than the rotational speed of the support unit 2630. The inventive concept is not limited thereto, such as… Figure 16 As shown, the support frame 2670 and the support unit 2630 can rotate in opposite directions.

[0108] Reference Figures 4 to 16 In the described embodiment, the guide vane 2680 is connected to the support frame 2670 or its body portion 2675. In other words, the guide vane 2680 can be indirectly mounted on the support unit 2630 through the body portion 2675. However, the invention is not limited to this; the guide vane 2680 can be directly mounted on the support unit 2630.

[0109] Figures 17 to 18 Schematic illustration Figure 4 Another embodiment of the process chamber of the substrate processing equipment. In the following embodiment, the housing 2610, processing container 2620, support unit 2630, liquid supply unit 2640, exhaust pipe 2650, and airflow supply unit 2660 of the process chamber 260 are arranged in a manner similar to Figure 4 The implementation plan is provided.

[0110] refer to Figure 17A support frame 2670 is configured to surround a support unit 2630. The support frame 2670 may be provided as an outer circumferential surface surrounding a rotation axis 2637. The support frame 2670 may be provided in an annular shape around the outer circumferential surface of the rotation axis. The support frame 2670 is configured to be independent of rotation of the support unit 2630. In an embodiment, a bearing may be provided between the inner circumferential surface of the support frame 2670 and the outer circumferential surface of the rotation axis 2637. Therefore, the support frame 2670 may be provided as stationary relative to rotation of the support unit 2630. The invention is not limited thereto, and as such... Figures 15 to 16 As described above, the support frame 2670 can rotate independently of the rotation of the support unit 2630.

[0111] Guide vane 2680 is mounted on support frame 2670. Guide vane 2680 can be directly mounted on support frame 2670. In an embodiment, guide vane 2680 may protrude from the outer circumferential surface of support frame 2670 and may be provided such that it extends downward in its longitudinal direction. The longitudinal direction of guide vane 2680 may be perpendicular to the ground. Guide vane 2680 may be provided in multiples along the circumferential direction of the outer circumferential surface of support frame 2670. Multiple guide vanes 2680 may be provided so that they are spaced apart from each other at a predetermined interval. Alternatively, multiple guide vanes 2680 may be provided spaced apart from each other at different intervals. The top end of guide vane 2680 may be provided at a position below the bottom surface of rotary chuck 2631. The form and angle of guide vane 2680 may be as follows: Figures 11 to 14 The modifications shown are provided.

[0112] refer to Figure 18 The support frame 2670 is configured to rotate independently of the support unit 2630. In an embodiment, a bearing may be provided between the inner circumferential surface of the support frame 2670 and the outer circumferential surface of the rotating shaft 2637. Therefore, the support frame 2670 can be provided to stop rotating relative to the support unit 2630. The inventive concept is not limited thereto, such as... Figures 15 to 16 As described above, the support frame 2670 can rotate independently of the rotation of the support unit 2630.

[0113] A support frame 2670 is configured to surround a support unit 2630. The support frame 2670 may include a first portion 2671 and a second portion 2672. The first portion 2671 may be provided as an outer circumferential surface surrounding a rotation axis 2637. In an embodiment, the first portion 2671 may be provided in an annular shape to surround the outer circumferential surface of the rotation axis 2637. The second portion 2672 extends upward from the first portion 2671. The second portion 2672 may be provided to surround the outer circumferential surface of the rotating chuck 2631. The second portion 2672 may be provided to extend upward and outward from the first portion 2671.

[0114] Guide vane 2680 is mounted on the top end of second portion 2672. Guide vane 2680 can be coupled to the top surface of second portion 2672 and extend downward along the top side of second portion 2672. Guide vane 2680 can be provided with its longitudinal direction perpendicular to the ground. Alternatively, guide vane 2680 can be provided such that its longitudinal direction is inclined relative to the ground. Multiple guide vanes 2680 can be provided in the circumferential direction of second portion 2672. Multiple guide vanes 2680 can be provided so as to be spaced apart from each other at a predetermined interval. Alternatively, multiple guide vanes 2680 can be provided to be spaced apart from each other at different intervals. The top end of guide vane 2680 can be provided at a position higher than the bottom surface of rotary chuck 2631 and lower than the top surface of rotary chuck 2631. The inventive concept is not limited thereto, and the top end of guide vane 2680 can be provided at a position lower than the bottom surface of rotary chuck 2681. Guide vanes 2680 are formed at a second portion 2672 of the outer circumferential surface of the rotating chuck 2631 to guide the rotating airflow formed on the side surface of the rotating chuck 2631 in a downward direction.

[0115] In the implementation, guide vane 2680 is described as being directly mounted on the top surface of the second portion 2672. However, guide vane 2680 is not limited to this and can be indirectly mounted on the second portion 2672 through the body portion 2675, such as... Figures 9 to 15 As shown in the implementation scheme. Furthermore, the shape and angle of the guide vane 2680 can be as follows: Figures 11 to 14 The modifications shown are provided below.

[0116] Figure 19 Schematic illustration Figure 4 Another embodiment of the process chamber of the substrate processing equipment. Figure 20 It is shown schematically. Figure 19 A three-dimensional cross-sectional view of the airflow in the treatment container.

[0117] In the following embodiments, the housing 2610, support unit 2630, liquid supply unit 2640, exhaust pipe 2650, airflow supply unit 2660, and guide vane 2680 of the process chamber 260 are similar to Figure 4 The implementation plan is provided.

[0118] refer to Figure 19 and Figure 20 The processing container 2620 has a processing space with an open top. The substrate W is processed with liquid within the processing space. According to an embodiment, the processing container 2620 re-collects the liquid used for processing the substrate. The processing container 2620 is provided in a ring-like shape around the support unit 2630.

[0119] The guide vane 2680 can be directly mounted on the inner wall of the processing container 2620. Alternatively, the guide vane 2680 can be indirectly mounted on the inner wall of the processing container 2620 through a body portion 2675 formed in the shape of annual rings. Since the detailed shape of the guide vane 2680 and the like is provided in a manner similar to the other embodiments described above, its description will be omitted below.

[0120] The rotating airflow generated by the rotation of the support unit 2630 can be guided downwards by guide vanes 2680 directly or indirectly installed on the inner wall of the recollection container 2623. The downwardly guided airflow is discharged to the exhaust pipe 2650. Therefore, airflow exhaust can be smoothly provided within the processing space.

[0121] The effects of this invention are not limited to those described above. Those skilled in the art will clearly understand any effects not mentioned from this specification and its accompanying drawings.

[0122] Although preferred embodiments of the inventive concept have been described and illustrated to date, the inventive concept is not limited to the specific embodiments described above, and it should be noted that those skilled in the art can implement the inventive concept in various ways without departing from the essence of the inventive concept claimed in the claims, and these modifications should not be interpreted separately from the technical spirit or prospects of the inventive concept.

Claims

1. A substrate processing apparatus, the substrate processing apparatus comprising: A processing container having a processing space; A support unit configured to support and rotate a substrate in the processing space; An exhaust pipe is connected to the processing container to discharge airflow from the processing space; A support frame, configured to be independent of the rotation of the support unit and positioned between the processing container and the support unit; and Guide vanes, which protrude to the outside of the support frame and are configured to guide the airflow within the processing space in a downward direction; in, The support unit includes: A rotary chuck that supports the substrate; A rotating shaft is connected to the bottom surface of the rotating chuck and configured to rotate the rotating chuck; and A first driver, configured to provide rotational force to the rotating shaft, and The support frame has annual rings surrounding the outer circumferential surface of the rotation axis. These annual rings are adjacent to the bottom of the rotating chuck and have substantially flat top and bottom surfaces. The guide vane includes a first portion extending laterally along the top surface of the annual ring body, and a second portion extending longitudinally from the first portion at least along the outer sidewall of the annual ring body. The substrate processing equipment further includes a rear nozzle on the top surface of the annual ring body to discharge liquid to the rotary chuck.

2. The substrate processing apparatus according to claim 1, wherein, The second portion of the guide vane defines an angle of approximately 90 degrees with the top surface of the rotary chuck.

3. The substrate processing apparatus according to claim 1, wherein, The second portion of the guide vane defines an obtuse angle with the top surface of the rotating chuck.

4. The substrate processing apparatus according to claim 1, wherein, The guide vanes are arranged in a plurality along the outer circumferential surface of the support frame, and each of the plurality of guide vanes includes the second portion, and at least two of the plurality of guide vanes have different included angles with the top surface of the rotating chuck.

5. The substrate processing apparatus according to any one of claims 1 to 4, wherein, The first portion of the guide vane has a top surface that is lower than the bottom surface of the rotating chuck.

6. The substrate processing apparatus according to any one of claims 1 to 4, wherein, The first portion of the guide vane has a top surface that is lower than the top surface of the rotating chuck and higher than the bottom surface of the rotating chuck.

7. The substrate processing apparatus according to any one of claims 1 to 4, wherein, The support frame remains stationary inside the processing container.

8. The substrate processing apparatus according to any one of claims 1 to 4, wherein, The support frame further includes a second actuator configured to rotate the support frame independently of the rotation of the support unit. The second driver rotates the support frame in the same direction as the support unit but at a lower speed than the support unit.

9. The substrate processing apparatus according to any one of claims 1 to 4, wherein, The support frame further includes a second actuator configured to rotate the support frame independently of the rotation of the support unit. The second driver rotates the support frame in the opposite direction to the support unit.

10. A substrate processing apparatus, the substrate processing apparatus comprising: A processing container having a processing space; A support unit configured to support and rotate a substrate in the processing space; An exhaust pipe is connected to the processing container to discharge airflow from the processing space; Guide vanes, the guide vanes being configured to guide airflow within the processing space in a downward direction; A support frame, configured to rotate independently of the support unit and surrounding the support unit, and The guide vane is mounted on the support frame. The support frame includes a body portion, which is located near the bottom end of the support unit, and the guide vanes are mounted on the body portion. The substrate processing equipment further includes a rear nozzle on the top surface of the body portion to discharge liquid to the rotary chuck.

11. The substrate processing apparatus according to claim 10, wherein, The guide vane extends longitudinally and is parallel to the rotation axis of the support unit.

12. The substrate processing apparatus according to claim 10, wherein, The guide vane extends longitudinally and forms an acute angle with the rotation axis of the support unit.

13. A substrate processing apparatus, the substrate processing apparatus comprising: A housing having an internal space; A processing container, wherein the processing container is disposed within the internal space and has a processing space; A support unit configured to support and rotate a substrate in the processing space; A liquid supply unit configured to supply liquid to the substrate supported by the support unit; An airflow supply unit that generates airflow in the processing space; An exhaust pipe is connected to the processing container to discharge the airflow within the processing space; A stationary support frame, wherein the stationary support frame is configured to be independent of the rotation of the support unit and is positioned between the processing container and the support unit; Guide vanes, mounted on the support frame and configured to guide the airflow within the processing space in a downward direction, and The stationary support frame includes a body portion, which is located near the bottom end of the support unit. The guide vanes are mounted on the body portion. The substrate processing equipment further includes a rear nozzle on the top surface of the body portion to discharge liquid to the rotary chuck.

14. The substrate processing apparatus according to claim 13, wherein, The guide vane extends downward and is substantially parallel to the rotation axis of the support unit.

15. The substrate processing apparatus according to claim 13, wherein, The guide vane extends downward and forms an acute angle with the rotation axis of the support unit.

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