Organic light-emitting display substrate and manufacturing method thereof, and organic light-emitting display device

Abstract

An organic light-emitting display substrate (1) and a method for manufacturing the same, and an organic light-emitting display device (100). The organic light-emitting display substrate (1) comprises a substrate and (101) an organic layer (102), an anode layer (104), an organic functional layer (105) and a cathode layer (106) located on one side of the substrate (101) and arranged in sequence. In a passive matrix organic light-emitting display area (20), the organic layer (102) comprises a plurality of grooves (1020) arranged at intervals along a first direction and extending along a second direction, the anode layer (104) comprises a plurality of first anodes (1041) arranged in an array and a plurality of shielding portions (1042) arranged at intervals along the first direction and extending along the second direction, the plurality of shielding portions (1042) and the plurality of grooves (1020) being arranged at intervals along the first direction and extending along the second direction. 20) on the substrate (101) are distributed in the gaps extending along the second direction of the orthographic projections of the plurality of first anodes (1041) on the substrate (101), and each shielding portion (1042) overlaps with the orthographic projection portion of a groove (1020) on the substrate (101) to form a partition groove (103), and the cathode layer (106) includes a plurality of cathode strips (1061) extending along the second direction and alternately arranged along the first direction and a plurality of cathode material portions (1062), each cathode material portion (1062) being located in a partition groove (103) and not connected to an adjacent cathode strip (1061).

Description

[0001] This application is a divisional application of Chinese patent application No. 202080000642.5, entitled “Organic light-emitting display substrate and manufacturing method thereof, organic light-emitting display device”, filed on April 29, 2020. Chinese patent application No. 202080000642.5 is an application for PCT application PCT / CN2020 / 087912 entering the national stage. Technical Field

[0002] The present disclosure relates to the field of display technology, and in particular to an organic light-emitting display substrate and a manufacturing method thereof, and an organic light-emitting display device. Background Art

[0003] Organic light-emitting devices, as the basis of a new generation of display devices, have received increasing attention due to their excellent properties such as self-luminescence, high contrast, wide viewing angle, low power consumption, fast response speed and low manufacturing cost.

[0004] The manufacturing yield rate of organic light-emitting display substrates is a key issue that restricts the large-scale application of organic light-emitting display devices. Summary of the invention

[0005] According to one aspect of an embodiment of the present disclosure, an organic light-emitting display substrate is provided, including a passive matrix organic light-emitting display area, the organic light-emitting display substrate comprising:

[0006] substrate;

[0007] The organic layer is located on one side of the substrate and includes a plurality of grooves arranged at intervals along a first direction and extending along a second direction in a passive matrix organic light emitting display area;

[0008] an anode layer, located on a surface of the organic layer away from the substrate, comprising a plurality of first anodes arranged in an array and located in a passive matrix organic light emitting display region, and a plurality of shielding portions arranged at intervals along a first direction and extending along a second direction and located in the passive matrix organic light emitting display region, wherein the orthographic projections of the plurality of shielding portions on the substrate and the orthographic projections of the plurality of grooves on the substrate are distributed in respective gaps extending along the second direction of the orthographic projections of the plurality of first anodes on the substrate, and the orthographic projection of each shielding portion on the substrate partially overlaps with the orthographic projection of a groove on the substrate to form a partition groove;

[0009] an organic functional layer formed on a side of the anode layer away from the substrate; and

[0010] The cathode layer is formed on a side of the organic functional layer away from the substrate, and includes a plurality of cathode strips and a plurality of cathode material portions extending along a second direction and alternately arranged along a first direction in a passive matrix organic light-emitting display area, wherein each cathode strip is further away from the substrate than the anode layer, and each cathode material portion is located in a partition groove and is not connected to adjacent cathode strips.

[0011] In some embodiments, the organic functional layer includes multiple first portions and multiple second portions located in the passive matrix organic light emitting display area, wherein each first portion is farther away from the substrate than the anode layer, and each second portion is located in a partition groove and is not connected to an adjacent first portion.

[0012] In some embodiments, each shielding portion includes two shielding strips located on both sides of the groove and spaced apart from each other, and the orthographic projections of the two shielding strips on the substrate partially overlap with the orthographic projections of the groove on the substrate.

[0013] In some embodiments, the organic layer includes a first organic layer and a second organic layer, and the organic light-emitting display substrate further includes a first data metal layer, a first inorganic layer, a second data metal layer, a pixel defining layer, and a spacer layer on one side of the substrate, wherein:

[0014] A first data metal layer, a first inorganic layer, a first organic layer, a second data metal layer, a second organic layer, an anode layer, a pixel defining layer, a spacer layer, an organic functional layer and a cathode layer are sequentially arranged in a direction away from the substrate;

[0015] In the passive matrix organic light emitting display area, the second data metal layer is connected to the first data metal layer through multiple first vias, and is connected to the anode layer through multiple second vias. Any two first anodes adjacent along the first direction are connected through the first data metal layer or the second data metal layer.

[0016] In some embodiments, the trench penetrates the second organic layer and extends into the first organic layer.

[0017] In some embodiments, a width of an orthographic projection of each groove on the substrate along the first direction is 5 micrometers to 10 micrometers.

[0018] In some embodiments, the depth of each groove in the direction perpendicular to the substrate is 2 microns to 2.5 microns.

[0019] In some embodiments, the included angles between the two side walls and the bottom wall of each groove are 120 degrees to 140 degrees respectively.

[0020] In some embodiments, a width of an overlapping portion of an orthographic projection of each shielding strip on the substrate and an orthographic projection of a corresponding groove on the substrate along the first direction is 0.8 micrometers to 1 micrometer.

[0021] In some embodiments, the organic light-emitting display substrate further includes an active matrix organic light-emitting display region, and the organic light-emitting display substrate further includes a semiconductor layer, a first insulating layer, a first gate metal layer, a second insulating layer, a second gate metal layer, and a third insulating layer, which are located between the substrate and the first data metal layer and are sequentially arranged in a direction away from the substrate, wherein:

[0022] In the active matrix organic light emitting display area, the first data metal layer is connected to the semiconductor layer through multiple third vias, connected to the second data metal layer through multiple fourth vias, and the anode layer is connected to the second data metal layer through multiple fifth vias.

[0023] In some embodiments, the active matrix organic light emitting display region surrounds a portion of the edge of the passive matrix organic light emitting display region; or, the active matrix organic light emitting display region surrounds the passive matrix organic light emitting display region.

[0024] In some embodiments, the substrate includes a first organic flexible layer, a second organic flexible layer, and a first inorganic barrier layer between the first organic flexible layer and the second organic flexible layer.

[0025] According to another aspect of the embodiments of the present disclosure, an organic light-emitting display device is provided, comprising the organic light-emitting display substrate of any one of the aforementioned embodiments.

[0026] In some embodiments, the organic light emitting display substrate further includes an active matrix organic light emitting display region; the organic light emitting display device further includes: at least one functional device whose orthographic projection on the organic light emitting display substrate is located in the passive matrix organic light emitting display region.

[0027] According to another aspect of the embodiments of the present disclosure, a method for manufacturing an organic light-emitting display substrate is provided. The organic light-emitting display substrate includes a passive matrix organic light-emitting display area. The manufacturing method includes:

[0028] forming an organic layer on one side of the substrate;

[0029] An anode layer is formed on a surface of the organic layer away from the substrate, the anode layer comprising a plurality of first anodes arranged in an array and located in a passive matrix organic light emitting display region, and a plurality of shielding portions arranged in a first direction and extending in a second direction and located in the passive matrix organic light emitting display region, wherein the orthographic projections of the plurality of shielding portions on the substrate are distributed in respective gaps extending in the second direction of the orthographic projections of the plurality of first anodes on the substrate;

[0030] forming a pixel defining layer and a spacer layer in sequence on a side of the anode layer away from the substrate;

[0031] Etching the organic layer to form a plurality of grooves extending along the second direction in the passive matrix organic light emitting display area, wherein the orthographic projections of the plurality of grooves on the substrate are distributed in the gaps extending along the second direction of the orthographic projections of the plurality of first anodes on the substrate, and the orthographic projection of each groove on the substrate partially overlaps with the orthographic projection of a shielding portion on the substrate to form a partition groove;

[0032] An organic functional layer and a cathode layer are sequentially formed on a side of the spacer layer away from the substrate, wherein the cathode layer includes a plurality of cathode strips and a plurality of cathode material portions extending along a second direction and alternately arranged along a first direction and located in a passive matrix organic light-emitting display area, wherein each cathode strip is further away from the substrate than the anode layer, and each cathode material portion is located in a partition groove and is not connected to adjacent cathode strips.

[0033] In some embodiments, etching the organic layer includes:

[0034] A hard mask is formed on a side of the spacer layer away from the substrate, and a region of the hard mask corresponding to a notch of the partition groove is a hollow region;

[0035] dry etching the organic layer through the hard mask to form a groove;

[0036] The hard mask is stripped off.

[0037] In some embodiments, forming the hard mask includes:

[0038] forming a hard mask cover layer and a photoresist cover layer in sequence on a side of the spacer layer away from the substrate;

[0039] The photoresist cover layer is sequentially exposed and developed to obtain a photoresist protection mask, wherein the region of the photoresist protection mask corresponding to the notch of the partition groove is a hollow region;

[0040] The hard mask capping layer is wet-etched through the photoresist protective mask to obtain a hard mask.

[0041] In some embodiments, the material of the hard mask includes metal oxide.

[0042] In some embodiments, the material of the hard mask includes indium gallium zinc oxide.

[0043] In some embodiments, forming the organic layer includes sequentially forming a first organic layer and a second organic layer on one side of the substrate, and the manufacturing method further includes:

[0044] Before forming the first organic layer, a first data metal layer and a first inorganic layer are sequentially formed on one side of the substrate; and

[0045] After forming the first organic layer and before forming the second organic layer, forming a second data metal layer on a side of the first organic layer away from the substrate;

[0046] In the passive matrix organic light-emitting display area, the second data metal layer is connected to the first data metal layer through multiple first vias, and is connected to the anode layer through multiple second vias. Any two first anodes adjacent along the first direction are connected through the first data metal layer or the second data metal layer.

[0047] In some embodiments, each trench penetrates the second organic layer and extends into the first organic layer.

[0048] In some embodiments, the organic light emitting display substrate further includes an active matrix organic light emitting display region, and the manufacturing method further includes:

[0049] Before forming the first data metal layer, a semiconductor layer, a first insulating layer, a first gate metal layer, a second insulating layer, a second gate metal layer and a third insulating layer are sequentially formed on one side of the substrate; in the active matrix organic light emitting display area, the first data metal layer is connected to the semiconductor layer through a plurality of third via holes, is connected to the second data metal layer through a plurality of fourth via holes, and the anode layer is connected to the second data metal layer through a plurality of fifth via holes. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] The accompanying drawings, which constitute a part of the specification, illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0051] The present disclosure may be more clearly understood from the following detailed description with reference to the accompanying drawings, in which:

[0052] Figure 1a is a front view of an organic light emitting display substrate according to an embodiment of the present disclosure;

[0053] Figure 1b The organic light emitting display substrate of one embodiment of the present disclosure is Figure 1a A magnified schematic diagram of point A;

[0054] Figure 1c The organic light emitting display substrate of one embodiment of the present disclosure is Figure 1b Schematic diagram of the cross section at BB;

[0055] Figure 1d An enlarged schematic cross-sectional view of a partition groove in one embodiment of the present disclosure;

[0056] Figure 2 is a front view of an organic light emitting display substrate according to another embodiment of the present disclosure;

[0057] Figure 3a It is a cross-sectional schematic diagram of an organic light emitting display substrate in a passive matrix organic light emitting display area in the related art;

[0058] Figure 3bSome cross-sectional schematic diagrams of the organic light-emitting display substrate in the manufacturing process in the related art;

[0059] Figure 4a is a flow chart of a method for manufacturing an organic light-emitting display substrate according to an embodiment of the present disclosure;

[0060] Figure 4b are some cross-sectional schematic diagrams of an organic light-emitting display substrate in a manufacturing process according to an embodiment of the present disclosure;

[0061] Figure 5a is a flow chart of making a partition groove in one embodiment of the present disclosure;

[0062] Figure 5b are some cross-sectional schematic diagrams of an organic light-emitting display substrate in a manufacturing process according to an embodiment of the present disclosure;

[0063] Figure 6 FIG. 4 is a front view of an organic light emitting display device according to an embodiment of the present disclosure.

[0064] It should be understood that the size of each part shown in the accompanying drawings is not necessarily drawn according to the actual proportional relationship. In addition, the same or similar reference numerals represent the same or similar components. DETAILED DESCRIPTION

[0065] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. The description of the exemplary embodiments is merely illustrative and is in no way intended to limit the present disclosure and its application or use. The present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. These embodiments are provided to make the present disclosure thorough and complete and to fully express the scope of the present disclosure to those skilled in the art. It should be noted that unless otherwise specifically stated, the relative arrangement of the components and steps, the composition of the materials, the numerical expressions and the numerical values ​​set forth in these embodiments should be interpreted as being merely exemplary and not as limiting.

[0066] The words "first", "second" and similar words used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different parts. The words "include" or "comprises" and similar words mean that the elements before the word include the elements listed after the word, and do not exclude the possibility of including other elements. "Up", "down" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0067] In the present disclosure, when a specific component is described as being located between a first component and a second component, there may or may not be an intermediate component between the specific component and the first component or the second component. When a specific component is described as being connected to other components, the specific component may be directly connected to the other components without an intermediate component, or may not be directly connected to the other components but have an intermediate component.

[0068] All terms (including technical terms or scientific terms) used in the present disclosure have the same meanings as those understood by ordinary technicians in the field to which the present disclosure belongs, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries, such as general dictionaries, should be interpreted as having meanings consistent with their meanings in the context of the relevant technology, and should not be interpreted in an idealized or extremely formal sense, unless explicitly defined herein.

[0069] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0070] Organic light-emitting display substrates are widely used in flexible display devices due to their thinness and bendability. To improve the manufacturing yield of organic light-emitting display substrates, the embodiments of the present disclosure provide an organic light-emitting display substrate and a manufacturing method thereof, and an organic light-emitting display device.

[0071] like Figure 1a As shown, an organic light emitting display substrate 1 provided in an embodiment of the present disclosure includes a passive matrix organic light emitting display area 20 . Figure 1b The organic light emitting display substrate of one embodiment of the present disclosure is Figure 1a The enlarged schematic diagram of point A in the figure, in which the structure of the shading matrix is ​​omitted and not shown. Figure 1c The organic light emitting display substrate of one embodiment of the present disclosure is Figure 1b Schematic diagram of the cross section at BB.

[0072] like Figure 1b and Figure 1c As shown, the organic light-emitting display substrate 1 provided in the embodiment of the present disclosure includes:

[0073] Substrate 101;

[0074] The organic layer 102 is located on one side of the substrate 101 and includes a plurality of grooves 1020 arranged in a first direction and extending in a second direction in the passive matrix organic light emitting display area 20;

[0075] an anode layer 104, located on a surface of the organic layer 102 away from the substrate 101, comprising a plurality of first anodes 1041 arranged in an array and located in the passive matrix organic light emitting display area 20, and a plurality of shielding portions 1042 arranged at intervals along a first direction and extending along a second direction and located in the passive matrix organic light emitting display area 20, wherein the orthographic projections of the plurality of shielding portions 1042 on the substrate 101 and the orthographic projections of the plurality of grooves 1020 on the substrate 101 are distributed in respective gaps extending along the second direction of the orthographic projections of the plurality of first anodes 1041 on the substrate 101, and the orthographic projection of each shielding portion 1042 on the substrate 101 partially overlaps with the orthographic projection of a groove 1020 on the substrate 101 to form a partition groove 103;

[0076] An organic functional layer 105 is formed on a side of the anode layer 104 away from the substrate 101; and

[0077] The cathode layer 106 is formed on a side of the organic functional layer 105 away from the substrate 101, and includes a plurality of cathode strips 1061 and a plurality of cathode material portions 1062 extending along the second direction and alternately arranged along the first direction and located in the passive matrix organic light-emitting display area 20, wherein each cathode strip 1061 is further away from the substrate 101 than the anode layer 104, and each cathode material portion 1062 is located in a partition groove 103 and is not connected to adjacent cathode strips 1061.

[0078] In the embodiment of the present disclosure, the organic functional layer 105 is formed on the side of the anode layer 104 away from the substrate 101. It should be understood that the overall pattern layer of the organic functional layer 105 is located on the side of the overall pattern layer of the anode layer 104 away from the substrate 101, and it should not be understood as the absolute position relationship of the local structure. The position relationship between other pattern layers is similar to this, and will not be repeated here.

[0079] like Figure 1c As shown, in some embodiments of the present disclosure, the organic functional layer 105 includes a plurality of first portions 1051 and a plurality of second portions 1052 located in the passive matrix organic light-emitting display area 20, wherein each first portion 1051 is further away from the substrate 101 than the anode layer 104, and each second portion 1052 is located in a partition groove 103 and is not connected to an adjacent first portion 1051.

[0080] In the embodiments of the present disclosure, the first direction and the second direction are not specifically limited. For example, in some embodiments, the first direction is the row direction and the second direction is the column direction. In other embodiments, the first direction is the column direction and the second direction is the row direction.

[0081] The passive matrix organic light-emitting display area 20 of the organic light-emitting display substrate 1 includes a plurality of passive matrix organic light-emitting diodes 5a (PMOLED) arranged in an array. These organic light-emitting diodes 5a are lit by scanning, and each organic light-emitting diode 5a emits light instantly under a short pulse. Figure 1a In the embodiment shown, the organic light emitting display substrate 1 further includes an active matrix organic light emitting display area 50. Figure 1c As shown, the active matrix organic light-emitting display area 50 includes a plurality of active matrix organic light-emitting devices 5b (AMOLED) arranged in an array, wherein each organic light-emitting device 5b is controlled by a thin film transistor device 3, thereby achieving independent and continuous light emission.

[0082] The shape of the passive matrix organic light-emitting display area 20 is not limited, for example, it may be circular, elliptical, rectangular or polygonal, etc. Since the passive matrix organic light-emitting display area 20 does not need to be provided with a thin-film transistor device, the transmittance is relatively high. In the organic light-emitting display device, functional devices such as cameras and distance sensors can be arranged on the back side of the organic light-emitting display substrate 1 and opposite to the passive matrix organic light-emitting display area 20, so that light can pass through the passive matrix organic light-emitting display area 20 and enter the functional device. Such a design is conducive to improving the screen-to-body ratio of the organic light-emitting display device and is more suitable for narrow bezel and ultra-narrow bezel designs. Figure 1a In the illustrated embodiment, the active matrix organic light emitting display area 50 is disposed around a portion of the edge of the passive matrix organic light emitting display area 20. Figure 2 In the illustrated embodiment, the active matrix organic light emitting display area 50 may also surround the passive matrix organic light emitting display area 20 .

[0083] In some embodiments of the present disclosure, the organic light emitting display substrate may also be a passive matrix organic light emitting display substrate, and the display area thereof only includes a passive matrix organic light emitting display area.

[0084] like Figure 1cAs shown, in this embodiment, the organic layer 102 includes a first organic layer 1021 and a second organic layer 1022 used as planar layers, respectively, and the groove 1020 penetrates the second organic layer 1022 and extends into the first organic layer 1021. The structure of the organic light-emitting display substrate 1 also includes: a second inorganic barrier layer 131, a buffer layer 132, a semiconductor layer 109, a first insulating layer 110, a first gate metal layer 111, a second insulating layer 112, a second gate metal layer 113 and a third insulating layer 114, a first data metal layer 115, a first inorganic layer 116, a second data metal layer 117, a pixel defining layer 107 and a spacer layer 108 are sequentially arranged on one side of the substrate 101 and in a direction away from the substrate 101. The first organic layer 1021 is located between the first inorganic layer 116 and the second data metal layer 117, and the second organic layer 1022 is located between the second data metal layer 117 and the anode layer 104. The organic functional layer 105 is located on the side of the spacer layer 108 away from the substrate 101. In the passive matrix organic light emitting display area 20, the second data metal layer 117 is connected to the first data metal layer 115 through a plurality of first vias 6a and connected to the anode layer 104 through a plurality of second vias 6b.

[0085] In the passive matrix organic light emitting display area 20, any two first anodes 1041 adjacent to each other along the first direction are connected through the first data metal layer 115, that is, the plurality of first anodes 1041 arranged along the first direction are electrically connected through the first data metal layer 115, so that the organic light emitting devices 5a arranged in a matrix can be lit by scanning. In another embodiment of the present disclosure, any two first anodes adjacent to each other along the first direction can also be connected through the second data metal layer.

[0086] In the active matrix organic light emitting display area 50, the first data metal layer 115 is connected to the semiconductor layer 109 through a plurality of third vias 6c, and is connected to the second data metal layer 117 through a plurality of fourth vias 6d. In addition, in order to realize the encapsulation protection of the internal structure of the substrate, the organic light emitting display substrate 1 further includes a thin film encapsulation layer 7.

[0087] The semiconductor layer 109 includes an active layer of the thin film transistor device 3, the first gate metal layer 111 includes a gate of the thin film transistor device 3 and a first electrode of the capacitor device 4, the second gate metal layer 113 includes a second electrode of the capacitor device 4, the first data metal layer 115 includes a first layer of wiring and a source and a drain of the thin film transistor device 3, and the second data metal layer 117 includes a second layer of wiring. The double-layer wiring design is equivalent to connecting resistors in parallel, which can reduce the wiring resistance and thus reduce the power consumption of the substrate.

[0088] In the active matrix organic light emitting display area 50, the anode layer 104 includes a plurality of second anodes 1043 arranged in an array, and the second anodes 1043 are connected to the second data metal layer 117 through a plurality of fifth vias 6e. In the passive matrix organic light emitting display area 20, the first anode 1041, the portion of the organic light emitting layer 105 facing the first anode 1041, and the portion of the cathode strip 1061 facing the first anode 1041 constitute an organic light emitting device 5a. In the active matrix organic light emitting display area 50, the second anode 1043, the portion of the organic light emitting layer 105 facing the second anode 1043, and the portion of the cathode layer 106 facing the second anode 1043 constitute an organic light emitting device 5b.

[0089] The organic functional layer 105 and cathode layer 106 of the organic light-emitting display substrate 1 are usually formed by evaporation process. During the evaporation process, the evaporation material gas is basically formed along the normal direction of the substrate 101. Therefore, the undercut structure of the partition groove 103 can block the evaporation material gas from forming a film on the side wall of the groove 1020, so that the part of the film layer located in the partition groove 103 and the part located outside the partition groove 103 are not connected, that is, the film layer cannot be continuous on both sides of the partition groove 103. In the embodiment of the present disclosure, in the passive matrix organic light-emitting display area 20, due to the partitioning effect of the partition groove 103, the multiple cathode strips 1061 of the cathode layer 106 extend along the second direction and are arranged at intervals along the first direction. In the active matrix organic light-emitting display area 50, the cathode layer 106 can extend continuously. The organic functional layer 105 can be evaporated on a large area, or patterned evaporation can be performed using a mask.

[0090] In some embodiments of the present disclosure, Figure 1b and Figure 1c As shown, the shielding portion 1042 includes two shielding strips 1042a and 1042b located on both sides of the groove 1020 and spaced apart, and the orthographic projections of the two shielding strips 1042a and 1042b on the substrate 101 overlap with the orthographic projections of the groove 1020 on the substrate 101. In this way, the two shielding strips 1042a and 1042b can both prevent the cathode material from forming a film on the two side walls of the groove 1020, thereby further ensuring that the adjacent cathode strips 1061 are separated by the separation groove 103.

[0091] The specific material of the anode layer 104 is not limited. In some embodiments, the anode layer 104 includes a first indium tin oxide layer, a second indium tin oxide layer, and a silver layer sandwiched between the first indium tin oxide layer and the second indium tin oxide layer, wherein the thickness of the first indium tin oxide layer and the second indium tin oxide layer is 60-80 angstroms, for example, 70 angstroms, and the thickness of the silver layer is 800-1200 angstroms, for example, 1000 angstroms. When the anode layer 104 is manufactured, a sputtering process is first used to form a film, and then a mask composition process is used to form a pattern by wet etching.

[0092] The pattern of the organic layer 102 is generally formed by dry etching using a mask patterning process. Since the anode layer 104 is an inorganic material and is quite different from the material of the organic layer 102, by selecting a suitable selection ratio to dry-etch the organic layer 102, an undercut structure can be formed on the side of the two shielding strips 1042a and 1042b close to the substrate 101, that is, the orthographic projections of the two shielding strips 1042a and 1042b on the substrate 101 overlap with the orthographic projections of the grooves 1020 on the substrate 101. Figure 1c As shown, there is no spacing between the orthographic projections of the two shielding strips 1042a and 1042b on the substrate 101 and the orthographic projection of the pixel defining layer 107 on the substrate 101. In other embodiments of the present disclosure, the orthographic projections of the two shielding strips on the substrate and the orthographic projections of the pixel defining layer on the substrate may also be spaced a certain distance apart or partially overlapped.

[0093] like Figure 1d As shown, in some embodiments of the present disclosure, the width c of the orthographic projection of the groove 1020 on the substrate 101 along the first direction is 5 microns to 10 microns. The depth d of the groove 1020 in the direction perpendicular to the substrate 101 is 2 microns to 2.5 microns. The angles α between the two side walls 1020a of the groove 1020 and the bottom wall 1020b are 120 degrees to 140 degrees respectively. The width s of the overlapping part of the orthographic projection of the shielding strips 1042a, 1042b on the substrate 101 and the corresponding orthographic projection of the groove 1020 on the substrate 101 along the first direction is 0.8 microns to 1 micron. Due to the existence of the overlapping width S, the partition groove 103 has an undercut structure.

[0094] In a related technology, Figure 3a As shown, the structure of the organic light-emitting display substrate in the passive matrix organic light-emitting display area includes: a data metal layer 001, an organic layer 002, an inorganic layer 003, an anode layer 004, a pixel defining layer 005, a spacer layer 006, an organic functional layer 007 and a cathode layer 008 arranged in sequence in a direction away from the substrate, wherein the anode layer 004 is connected to the data metal layer 001 through a via, and a structure of a plurality of partition grooves 009 is formed by the organic layer 002 and the inorganic layer 003, and the plurality of partition grooves 009 are used to partition the cathode layer 008, thereby obtaining a plurality of cathode strips arranged in a row direction and extending in a column direction. When manufacturing the organic light-emitting display substrate, the partition grooves 009 are first formed, and then the anode layer 004 is formed, and then the pixel defining layer 005, the spacer layer 006, the organic functional layer 007 and the cathode layer 008 are formed in sequence. The related art has the following technical defects:

[0095] 1. The organic layer 002 releases gas in a high-temperature process environment. The inorganic layer 003 covers the organic layer 002 over a large area, which may cause bubbles to form between the organic layer 002 and the inorganic layer 003.

[0096] 2. The inorganic layer 003 is formed on the surface of the organic layer 002 . When the inorganic layer 003 is etched, the organic layer 002 is easily damaged.

[0097] 3. The organic layer 002 is usually used as a flat layer. The inorganic layer 003 is made on the surface of the organic layer 002 and serves as a base surface for making the anode layer 004. Its surface flatness is poor.

[0098] 4. Figure 3b As shown, the manufacturing process of the pixel defining layer 005 and the spacer layer 006 is carried out after the manufacturing process of the partition groove 009 is completed, which may easily lead to residual pixel defining layer and / or spacer layer manufacturing material 010 in the partition groove 009, thereby causing the partition function of the partition groove 009 to fail, thereby failing to effectively isolate the cathode strips.

[0099] 5. The manufacturing process of the anode layer 004 is performed after the manufacturing process of the partition groove 009. In the process of forming the anode layer 004 by using the mask composition process, bubbles may be generated between the photoresist layer and the inner wall of the partition groove 009. The bursting of the bubbles will cause defects in subsequent processes.

[0100] The above technical defects seriously affect the manufacturing yield of organic light-emitting display substrates.

[0101] In the embodiments of the present disclosure, Figure 1c As shown, on the one hand, since the anode layer 104 is formed on the surface of the organic layer 102 away from the substrate 101, the structure of the partition groove 103 is formed by the anode layer 104 and the organic layer 102, and no inorganic layer is set between the anode layer 104 and the organic layer 102. Therefore, compared with the aforementioned related art, the embodiment of the present disclosure can overcome a series of adverse problems caused by the inorganic layer in the related art. On the other hand, the embodiment of the present disclosure can form the structure of the partition groove 103 after forming the anode layer 104, the pixel defining layer 107 and the spacer layer 108. In this way, the failure of the partition groove caused by the manufacturing materials of the pixel defining layer and / or the spacer layer remaining in the partition groove, and the occurrence of subsequent process defects caused by residual bubbles can be avoided. Therefore, the structural design of the organic light-emitting display substrate in the embodiment of the present disclosure is conducive to improving the manufacturing yield.

[0102] like Figure 1cAs shown, in this embodiment, the substrate 101 is a flexible substrate, including a first organic flexible layer 101a, a second organic flexible layer 101c, and a first inorganic barrier layer 101b located between the first organic flexible layer 101a and the second organic flexible layer 101c, wherein the material of the first organic flexible layer 101a and the second organic flexible layer 101c includes polyimide, and the material of the first inorganic barrier layer 101b includes silicon nitride. This design can not only improve the toughness of the substrate, but also help improve the packaging performance of the organic light-emitting display substrate. In other embodiments of the present disclosure, the substrate can also be a hard substrate.

[0103] The present disclosure also provides a method for manufacturing an organic light-emitting display substrate, which can be used to manufacture the organic light-emitting display substrate 1 including the passive matrix organic light-emitting display area 20. Figure 4a and Figure 4b As shown, the manufacturing method includes the following steps S101 to S105.

[0104] In step S1 , an organic layer 102 is formed on one side of a substrate 101 .

[0105] In step S2, an anode layer 104 is formed on the surface of the organic layer 102 away from the substrate 101, and the anode layer 104 includes a plurality of first anodes 1041 arranged in an array and located in the passive matrix organic light-emitting display area 20, and a plurality of shielding portions 1042 located in the passive matrix organic light-emitting display area 20 and arranged at intervals along a first direction and extending along a second direction, wherein the orthographic projections of the plurality of shielding portions 1042 on the substrate 101 are distributed in each gap extending along the second direction of the orthographic projections of the plurality of first anodes 1041 on the substrate 101.

[0106] In step S3 , a pixel defining layer 107 and a spacer layer 108 are sequentially formed on a side of the anode layer 104 away from the substrate 101 .

[0107] In step S4, the organic layer 102 is etched to form a plurality of grooves 1020 extending along the second direction located in the passive matrix organic light-emitting display area 20, and the orthographic projections of the plurality of grooves 1020 on the substrate 101 are distributed in the gaps extending along the second direction of the orthographic projections of the plurality of first anodes 1041 on the substrate 101, and the orthographic projection of each groove 1020 on the substrate 101 partially overlaps with the orthographic projection of a blocking portion 1042 on the substrate 101 to form a partition groove 103.

[0108] In step S5, an organic functional layer 105 and a cathode layer 106 are sequentially formed on a side of the spacer layer 108 away from the substrate 101, wherein the cathode layer 106 includes a plurality of cathode strips 1061 and a plurality of cathode material portions 1062 extending along the second direction and alternately arranged along the first direction and located in the passive matrix organic light-emitting display area 20, wherein each cathode strip 1061 is further away from the substrate 101 than the anode layer 104, and each cathode material portion 1062 is located in a partition groove 103 and is not connected to adjacent cathode strips 1061.

[0109] In some embodiments of the present disclosure, after the organic functional layer 105 is formed in step S5, the organic functional layer 105 is also separated by the separation groove and is discontinuous. Figure 4b As shown, the organic functional layer 105 includes a plurality of first portions 1051 and a plurality of second portions 1052 located in the passive matrix organic light-emitting display area 20 , wherein each first portion 1051 is further away from the substrate 101 than the anode layer 104 , and each second portion 1052 is located in a partition groove 103 and is not connected to an adjacent first portion 1051 .

[0110] In one embodiment of the present disclosure, the substrate 101 is a flexible substrate and is pre-formed on a glass substrate (not shown in the figure). For example, a first organic flexible layer, a first inorganic barrier layer, and a second organic flexible layer are sequentially formed on one side of the glass substrate, and the first organic flexible layer, the first inorganic barrier layer, and the second organic flexible layer as a whole serve as a substrate of an organic light-emitting display substrate. The glass substrate plays a supporting role in the manufacturing process of the organic light-emitting display substrate. After the structure of the organic light-emitting display substrate is manufactured, the glass substrate needs to be peeled off from the substrate to support the flexible characteristics of the organic light-emitting display substrate.

[0111] like Figure 4b As shown, the above-mentioned formation of the organic layer 102 includes sequentially forming a first organic layer 1021 and a second organic layer 1022 on one side of the substrate 101. In some embodiments, the groove 1020 penetrates the second organic layer 1022 and extends into the first organic layer 1021. In other embodiments, the groove 1020 may not penetrate the second organic layer 1022, that is, it ends in the second organic layer 1022. On this basis, the method for manufacturing the organic light-emitting display substrate further includes:

[0112] Before forming the first organic layer 1021 , a first data metal layer 115 and a first inorganic layer 116 are sequentially formed on one side of the substrate 101 ;

[0113] After forming the first organic layer 1021 and before forming the second organic layer 1022, a second data metal layer 117 is formed on a side of the first organic layer 1021 away from the substrate 101. In the passive matrix organic light emitting display area 20, the second data metal layer 117 is connected to the first data metal layer 115 through a plurality of first via holes 6a, and is connected to the anode layer 104 through a plurality of second via holes 6b. Any two adjacent first anodes 1041 along the first direction are connected through the first data metal layer 115 or the second data metal layer 117.

[0114] like Figure 4b As shown, the manufactured organic light emitting display substrate includes an active matrix organic light emitting display area 50 in addition to the passive matrix organic light emitting display area 20. The manufacturing method of the organic light emitting display substrate further includes:

[0115] Before forming the first data metal layer 115, a semiconductor layer 109, a first insulating layer 110, a first gate metal layer 111, a second insulating layer 112, a second gate metal layer 113 and a third insulating layer 114 are sequentially formed on one side of the substrate 101. In the active matrix organic light emitting display area 50, the first data metal layer 115 is connected to the semiconductor layer 109 through a plurality of third via holes 6c, the second data metal layer 117 is connected to the first data metal layer 115 through a plurality of fourth via holes 6d, and the anode layer 104 is connected to the second data metal layer 117 through a plurality of fifth via holes 6e.

[0116] like Figure 5a and Figure 5b As shown, in some embodiments of the present disclosure, etching the organic layer includes the following steps S41 to S43.

[0117] In step S41, a hard mask is formed on the side of the spacer layer away from the substrate, and the area of ​​the hard mask corresponding to the notch of the partition groove is a hollow area. The material type of the hard mask is not limited. In some embodiments, the material of the hard mask includes metal oxides such as indium gallium zinc oxide.

[0118] like Figure 5b As shown, in one embodiment, step S41 specifically includes:

[0119] Sub-step 1: forming a hard mask cover layer 3010 and a photoresist cover layer 302 in sequence on a side of the spacer layer 108 away from the substrate 101;

[0120] Sub-step 2, sequentially exposing and developing the photoresist cover layer 302 to obtain a photoresist protection mask, wherein the region of the photoresist protection mask corresponding to the notch of the partition groove is a hollow region;

[0121] Sub-step three: wet-etching the hard mask cover layer 3010 through the photoresist protection mask to obtain a hard mask.

[0122] In step S42 , the organic layer 102 is dry-etched through a hard mask to form a groove 1020 ;

[0123] In step S43, the hard mask is stripped off.

[0124] As mentioned above, since the anode layer is formed on the surface of the organic layer away from the substrate, the structure of the partition groove is formed by the anode layer and the organic layer, and no inorganic layer is set between the anode layer and the organic layer. Therefore, compared with the aforementioned related technologies, the manufacturing method of the organic light-emitting display substrate of the embodiment of the present disclosure can overcome a series of poor manufacturing problems caused by the inorganic layer in the related technology. In addition, the etching process for forming the partition groove is carried out after the anode layer, the pixel defining layer and the spacer layer are formed. Compared with the aforementioned related technologies, the failure of the partition groove caused by the manufacturing materials of the pixel defining layer and / or the spacer layer remaining in the partition groove, as well as the occurrence of subsequent process defects caused by residual bubbles, can be avoided. Therefore, the manufacturing method of the organic light-emitting display substrate of the embodiment of the present disclosure is conducive to improving the manufacturing yield rate.

[0125] like Figure 6 As shown, the embodiment of the present disclosure further provides an organic light-emitting display device 100, comprising the organic light-emitting display substrate 1 of any of the aforementioned embodiments.

[0126] In some embodiments, the organic light emitting display substrate 1 includes a passive matrix organic light emitting display area 20 and an active matrix organic light emitting display area 50, and the organic light emitting display device 100 further includes at least one functional device 30, and the orthographic projection of the at least one functional device 30 on the organic light emitting display substrate 1 is located in the passive matrix organic light emitting display area 20. The specific type of the functional device 30 is not limited, for example, a camera or a distance sensor.

[0127] Specific product types of the above-mentioned organic light-emitting display device include but are not limited to mobile phones, tablet computers, laptop computers, wearable devices, electronic paper or display screens, etc.

[0128] Since the organic light emitting display substrate has the above-mentioned beneficial effects, the organic light emitting display device also has the above-mentioned beneficial effects, and its manufacturing yield is relatively high.

[0129] So far, various embodiments of the present disclosure have been described in detail. In order to avoid obscuring the concept of the present disclosure, some details known in the art are not described. Based on the above description, those skilled in the art can fully understand how to implement the technical solution disclosed here.

[0130] Although some specific embodiments of the present disclosure have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present disclosure. It should be understood by those skilled in the art that the above embodiments may be modified or some technical features may be replaced by equivalents without departing from the scope and spirit of the present disclosure. The scope of the present disclosure is defined by the appended claims.

Claims

1. An organic light-emitting display substrate, comprising a first organic light-emitting display area, the organic light-emitting display substrate comprising: substrate; An organic layer, located on one side of the substrate, comprising a plurality of grooves located in the first organic light emitting display area and arranged at intervals along a first direction and extending along a second direction, wherein the organic layer comprises a first organic layer and a second organic layer; an anode layer, located on a surface of the organic layer away from the substrate, comprising a plurality of first anodes arranged in an array and located in the first organic light-emitting display area, and a plurality of shielding portions, wherein the plurality of shielding portions are located in the first organic light-emitting display area, the shielding portions are arranged at intervals along a first direction and extend along a second direction, a gap extending along the second direction is provided between orthographic projections of at least some adjacent two first anodes on the substrate, orthographic projections of the plurality of shielding portions on the substrate and orthographic projections of the plurality of grooves on the substrate are distributed in the gap, and the orthographic projection of each shielding portion on the substrate partially overlaps with the orthographic projection of a groove on the substrate to form a partition groove; an organic functional layer formed on a side of the anode layer away from the substrate; and A cathode layer, formed on a side of the organic functional layer away from the substrate, comprising a plurality of cathode strips and a plurality of cathode material portions extending along the second direction and alternately arranged along the first direction in the first organic light emitting display region, wherein each cathode material portion is located in a partition groove and is not connected to an adjacent cathode strip; The organic light-emitting display substrate further includes a first data metal layer, a first insulating layer, a second data metal layer, a pixel defining layer and a spacer layer on one side of the substrate, wherein the first data metal layer, the first insulating layer, the first organic layer, the second data metal layer, the second organic layer, the anode layer, the pixel defining layer, the spacer layer, the organic functional layer and the cathode layer are sequentially arranged in a direction away from the substrate.

2. The organic light emitting display substrate according to claim 1, wherein: The organic functional layer includes a plurality of first parts and a plurality of second parts located in the first organic light emitting display area, wherein the first part is farther away from the substrate than the anode layer, and the second part is located in a partition groove and is not connected to the adjacent first part.

3. The organic light emitting display substrate according to claim 1, wherein: Each shielding portion includes two shielding strips located on both sides of the groove in the first direction and arranged at intervals, and the orthographic projections of the two shielding strips on the substrate overlap with the orthographic projections of the groove on the substrate respectively.

4. The organic light emitting display substrate according to claim 3, wherein: In the first direction, the interval between the two shielding strips is smaller than the size of the opening of the slot.

5. The organic light emitting display substrate according to claim 3, wherein: The opening size of the groove at a side away from the base substrate is larger than the size of the groove bottom.

6. The organic light emitting display substrate according to claim 1, wherein: The depth of the groove is smaller than the thickness of the organic layer.

7. The organic light emitting display substrate according to claim 1, wherein: Each trench penetrates the second organic layer and extends into the first organic layer.

8. The organic light emitting display substrate according to claim 1, wherein: The width of each groove along the first direction of the orthographic projection on the substrate is 5 micrometers to 10 micrometers.

9. The organic light emitting display substrate according to claim 1, wherein: The depth of each groove in the direction perpendicular to the substrate is 2 micrometers to 2.5 micrometers.

10. The organic light emitting display substrate according to claim 1, wherein: The included angles between the two side walls and the bottom wall of each groove are 120 degrees to 140 degrees respectively.

11. The organic light emitting display substrate according to claim 1, wherein: The width of an overlapping portion of an orthographic projection of each shielding strip on the substrate and an orthographic projection of a corresponding groove on the substrate along the first direction is 0.8 micrometers to 1 micrometer.

12. The organic light emitting display substrate according to claim 1, further comprising a second organic light emitting display area, the organic light emitting display substrate further comprising a semiconductor layer, a first insulating layer, a first gate metal layer, a second insulating layer, a second gate metal layer and a third insulating layer, which are located between the substrate and the first data metal layer and are sequentially arranged in a direction away from the substrate, wherein: In the second organic light emitting display area, the first data metal layer is connected to the semiconductor layer through a plurality of third via holes, is connected to the second data metal layer through a plurality of fourth via holes, and the anode layer is connected to the second data metal layer through a plurality of fifth via holes.

13. The organic light emitting display substrate according to claim 12, wherein: The second organic light emitting display area surrounds a portion of the edge of the first organic light emitting display area; or, the second organic light emitting display area surrounds the first organic light emitting display area.

14. The organic light emitting display substrate according to any one of claims 1 to 13, wherein: The substrate includes a first organic flexible layer, a second organic flexible layer, and a first inorganic barrier layer between the first organic flexible layer and the second organic flexible layer.

15. An organic light emitting display substrate, comprising a first organic light emitting display area and a second organic light emitting display area, wherein the second organic light emitting display area surrounds at least a portion of an edge of the first organic light emitting display area, and the transmittance of the first organic light emitting display area is higher than the transmittance of the second organic light emitting display area, the organic light emitting display substrate comprising: substrate; A thin film transistor, disposed in the second organic light emitting display area; An organic layer, located on one side of the substrate, comprising a plurality of grooves located in the first organic light emitting display area and arranged at intervals along a first direction and extending along a second direction, wherein the organic layer comprises a first organic layer and a second organic layer; an anode layer, located on a surface of the organic layer away from the substrate, comprising a plurality of first anodes arranged in an array and located in the first organic light-emitting display area, a plurality of second anodes arranged in an array and located in the second organic light-emitting display area, and a plurality of shielding parts, wherein the plurality of shielding parts are located in the first organic light-emitting display area, the shielding parts are arranged at intervals along a first direction and extend along a second direction, a gap extending along the second direction is provided between orthographic projections of at least part of two adjacent first anodes on the substrate, orthographic projections of the plurality of shielding parts on the substrate and orthographic projections of the plurality of grooves on the substrate are distributed in the gap, and the orthographic projection of each shielding part on the substrate partially overlaps with the orthographic projection of a groove on the substrate to form a partition groove; an organic functional layer formed on a side of the anode layer away from the substrate; and A cathode layer, formed on a side of the organic functional layer away from the substrate, comprising a plurality of cathode strips and a plurality of cathode material portions extending along the second direction and alternately arranged along the first direction in the first organic light emitting display region, wherein each cathode material portion is located in a partition groove and is not connected to an adjacent cathode strip; The organic light-emitting display substrate further includes a first data metal layer, a first insulating layer, a second data metal layer, a pixel defining layer and a spacer layer on one side of the substrate, wherein the first data metal layer, the first insulating layer, the first organic layer, the second data metal layer, the second organic layer, the anode layer, the pixel defining layer, the spacer layer, the organic functional layer and the cathode layer are sequentially arranged in a direction away from the substrate.

16. An organic light emitting display device, comprising the organic light emitting display substrate according to any one of claims 1 to 15.

17. The organic light emitting display device according to claim 16, wherein: The organic light emitting display substrate further includes a second organic light emitting display area; The organic light emitting display device further includes: at least one functional device whose orthographic projection on the organic light emitting display substrate is located in the first organic light emitting display area.

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