Temperature prediction method, apparatus, and readable medium

Abstract

The application provides a temperature prediction method, comprising: obtaining the current of each line in a first group of lines at a first time in an electrical topology; determining the temperature of a first group of points at the first time in the electrical topology; wherein the first group of points comprises at least one point on the first group of lines, or at least one point in a related line in which the current can be calculated according to the first group of lines and the electrical topology; binding the temperature of the first group of points at the first time to the corresponding line to obtain a second group of lines; when the first group of lines does not contain all lines in the electrical topology, calculating the current value of the lines in the electrical topology except the first group of lines according to the current of each line in the first group of lines at the first time; and calculating the temperature of at least one line other than the second group of lines in all lines according to the current value of all lines in the electrical topology and the temperature on the second group of lines.

Description

Technical Field

[0001] The embodiments of this application mainly relate to the field of condition monitoring, and in particular to a temperature prediction method, apparatus and readable medium. Background Technology

[0002] Switchgear is an electrical device whose main function is to open, close, control, and protect electrical equipment during power generation, transmission, distribution, and energy conversion in a power system. Low-voltage switchgear refers to complete sets of electrical installations with AC and DC voltages below 1000V. It is a key component in the power industry, and its condition is crucial to the safety of the entire power plant. Temperature monitoring is a very important aspect of this. However, due to the complexity of the various components in low-voltage switchgear, the cost of deploying temperature sensors to monitor the temperature of each component would be extremely high. Currently, temperature sensors are only deployed at the most critical points or components; however, the highest temperature does not always occur at specific points. Summary of the Invention

[0003] This application provides a temperature prediction method, apparatus, and readable medium for quickly and accurately predicting the temperature of relevant lines in an electrical topology diagram. Furthermore, it significantly reduces the cost of deploying temperature sensors compared to existing technologies.

[0004] In a first aspect, a temperature prediction method is provided, comprising: obtaining the current of each line in a first group of lines in an electrical topology diagram at a first moment; determining the temperature of a first group of points in the electrical topology diagram at the first moment; wherein the first group of points includes: at least one point on the first group of lines, or at least one point in a related line whose current can be calculated based on the first group of lines and the electrical topology diagram; binding the temperature of the first group of points at the first moment to the corresponding line to obtain a second group of lines; when the first group of lines does not include all the lines in the electrical topology diagram, calculating the current value of the lines in the electrical topology diagram other than the first group of lines based on the current of each line in the first group of lines at the first moment; and calculating the temperature of at least one of the other lines in all the lines except the second group of lines based on the current values ​​of all the lines in the electrical topology diagram and the temperature on the second line.

[0005] In a second aspect, a temperature prediction device is provided, comprising at least one memory and at least one processor, wherein: the at least one memory is used to store computer-readable code; and the at least one processor is used to invoke the computer-readable code stored in the at least one memory to execute the steps of the method provided in the first aspect.

[0006] Thirdly, a computer-readable medium is provided, on which computer-readable instructions are stored, which, when executed by a processor, cause the processor to perform the steps of the method provided in the first aspect. Attached Figure Description

[0007] The following figures are intended only to illustrate and explain the embodiments of this application, and do not limit the scope of the embodiments of this application. Wherein:

[0008] Figure 1 This is a flowchart of a temperature prediction method according to an embodiment of this application;

[0009] Figure 2 This is an electrical topology diagram of a switch cabinet according to an embodiment of this application;

[0010] Figure 3 This is a thermal model of a bus according to an embodiment of this application;

[0011] Figure 4 This is a thermal model of a cable according to an embodiment of this application;

[0012] Figure 5 This is a schematic diagram of a temperature prediction device according to an embodiment of this application.

[0013] Explanation of reference numerals in the attached figures

[0014] 100: Temperature Prediction Method; 101-106: Method Steps

[0015] 50: Temperature prediction device; 51: Memory; 52: Processor Detailed Implementation

[0016] The subject matter described herein will now be discussed with reference to exemplary embodiments. It should be understood that these embodiments are discussed merely to enable those skilled in the art to better understand and implement the subject matter described herein, and are not intended to limit the scope, applicability, or examples set forth in the claims. The function and arrangement of the elements discussed may be changed without departing from the scope of the embodiments of this application. Various processes or components may be omitted, substituted, or added as needed in the various examples. For example, the described methods may be performed in a different order than described, and steps may be added, omitted, or combined. Furthermore, features described in some examples may be combined in other examples.

[0017] As used herein, the term "comprising" and its variations are open terms meaning "including but not limited to". The term "based on" means "at least partially based on". The terms "one embodiment" and "an embodiment" mean "at least one embodiment". The term "another embodiment" means "at least one other embodiment". The terms "first", "second", etc., may refer to different or the same objects. Other definitions, whether explicit or implicit, may be included below. Unless explicitly indicated by the context, the definition of a term shall remain consistent throughout the specification.

[0018] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0019] Figure 1 This is a flowchart of a temperature prediction method according to an embodiment of this application, as shown below. Figure 1 As shown, the temperature prediction method 100 includes:

[0020] Step 101: Obtain the current of each line in the first group of lines at the first moment in an electrical topology diagram.

[0021] An electrical topology diagram is a further abstraction of an actual circuit diagram, consisting only of branches and nodes. It discusses the connection relationships and properties of the circuits, specifically the connection relationships between branches and nodes. Optionally, the first set of lines may include multiple lines of arbitrary selection, multiple lines specified by the user, or all lines in the electrical topology diagram.

[0022] In one embodiment, an electrical topology diagram may be as follows: Figure 2 The diagram shows an electrical topology of a switchgear, where dots represent meters and triangles represent loads. Optionally, according to... Figure 2 A digital model is built based on the topology diagram shown.

[0023] Step 102: Determine the temperature of the first set of points at a first moment in the electrical topology diagram. The first set of points includes: at least one point on the first set of lines, or at least one point in a relevant line from which the current can be calculated based on the first set of lines and the electrical topology diagram.

[0024] To further explain the statement that "the first set of lines and the related lines whose currents can be calculated from the electrical topology diagram," suppose an electrical topology diagram has only one node connecting N lines, and the current flowing through N-1 of these lines at a certain moment is known. Then, according to Kirchhoff's Current Law, the current flowing through the last line connected to this node at that moment can be calculated. More generally, if a line in the electrical topology diagram with an unknown current satisfies the solution conditions of Kirchhoff's Current Law, then the unknown current can be calculated based on the known line currents.

[0025] Step 103: Bind the temperature of the first set of points at the first moment to the corresponding line to obtain the second set of lines.

[0026] When the first set of points is at least one point on the first set of lines, the temperature of the first set of points at the first moment is bound to the corresponding line in the first set of lines. In other words, if the first set of points is a point on the first set of lines, then the temperature of the corresponding point at the first moment is bound to the line containing that temperature. Optionally, the binding can be performed by the line number.

[0027] When the first set of points is at least one point among the relevant lines whose current can be calculated based on the first set of lines and the electrical topology diagram, the temperature of the first set of points at the first moment is bound to the first line in the first set of lines in the electrical topology diagram that is closest to that temperature. Specifically, the closest first line is the line that is closest to the line with that temperature. Optionally, the temperature of the first set of points at the first moment is bound to the line with the longest average daily operating time among the K first lines in the first set of lines in the electrical topology diagram that are closest to that temperature. The specified day can be any day within the past week, a regular day, or a date specified by the user.

[0028] Step 104: When the first group of lines does not include all the lines in the electrical topology diagram, calculate the current value of the lines in the electrical topology diagram other than the first group of lines based on the current of each line in the first group at the first moment.

[0029] If the first group of lines already contains all the lines in the electrical topology diagram, then step 105 can be executed directly.

[0030] Step 105: Based on the current values ​​of all lines in the electrical topology diagram and the temperature on the second line, calculate the temperature of at least one of the other lines besides the second group of lines.

[0031] Optionally, based on the current values ​​of all lines in the electrical topology diagram and the temperature on the second line, calculate the temperature of all lines except the second group of lines. Optionally, based on the data groups (→,i1,T1), (→,i2,T2), ... (→,i...) formed by the current values ​​of all lines in the electrical topology diagram and the temperatures on the second line... k ,T k Calculate the temperature of all lines except the second group of lines. Output the data sets (→, i) corresponding to each line. n ,T n ), where →,i n T represents the current in the nth line. nThis represents the temperature of the nth line. The output format using data sets not only makes the results clearer but also facilitates data verification for users.

[0032] Figure 3 This is a thermal model of a bus according to an embodiment of this application, such as Figure 3 As shown, when at least one of the other lines is a busbar or a part of the busbar, the surface temperature T of the corresponding line can be calculated using the following formula. S :

[0033]

[0034] W B =I 2 R (2)

[0035] Where I is the current in the relevant busbar or a portion of the busbar, and R is the resistance; W B For line loss; Q B For the equivalent conductor heat capacity, T em For ambient temperature, TR A For air thermal resistance.

[0036] Figure 4 This is a thermal model of a cable according to an embodiment of this application, such as... Figure 4 As shown, when at least one of the other lines is a branch line, the surface temperature T of the corresponding line can be calculated using the following formula. S :

[0037]

[0038] W C =I 2 R (4)

[0039] Where I is the current in the relevant branch circuit, and R is the resistance; W c For line loss; Q A Q is the equivalent heat capacity within this branch circuit. B Q is the equivalent heat capacity outside this branch line. W For adiabatic heat capacity, TR i TR is the equivalent thermal resistance within this branch line. o TR is the external equivalent thermal resistance of this branch line. A For air thermal resistance, T c For the conductor temperature, T i T is the temperature of the insulation layer. em The ambient temperature.

[0040] Alternatively, the temperature of at least one of the other lines besides the second group of lines can be calculated using the finite element analysis method of multiphysics.

[0041] Optionally, in the embodiments of this application, the busbar is a busbar or a busbar, while the branch line is an insulated cable.

[0042] In this embodiment, by combining the temperature of at least one point in the electrical topology diagram with the current values ​​of all lines in the diagram, the temperature of all lines in the electrical topology diagram can be obtained. This embodiment not only eliminates the need for additional costs to expand the coverage of temperature monitoring, but also improves the reliability of the monitoring system by fusing temperature and current data. Furthermore, the computational components involved in this embodiment are efficient and accurate, do not require significant IT resources, are easily applied to edge computing, and are particularly suitable for comprehensive temperature prediction of low-voltage distribution cabinets.

[0043] This application also proposes a temperature prediction device 50. Figure 5 This is a schematic diagram of a temperature prediction device 50 according to an embodiment of this application. Figure 5 As shown, the temperature prediction device 50 includes a processor 52 and a memory 51. The memory 51 stores instructions, which, when executed by the processor 52, implement the method 100 described above.

[0044] At least one processor 52 may include a microprocessor, an application-specific integrated circuit (ASIC), a digital signal processor (DSP), a central processing unit (CPU), a graphics processing unit (GPU), a state machine, etc. Embodiments of computer-readable media include, but are not limited to, floppy disks, CD-ROMs, magnetic disks, memory chips, ROMs, RAMs, ASICs, configured processors, all-optical media, all magnetic tapes or other magnetic media, or any other media from which a computer processor can read instructions. Furthermore, various other forms of computer-readable media can send or carry instructions to a computer, including routers, private or public networks, or other wired and wireless transmission devices or channels. Instructions may include code in any computer programming language, including C, C++, C++, Visual Basic, Java, and JavaScript.

[0045] Furthermore, embodiments of this application also provide a computer-readable medium storing computer-readable instructions, which, when executed by a processor, cause the processor to perform the method 100 described above. Embodiments of the computer-readable medium include floppy disks, hard disks, magneto-optical disks, optical disks (such as CD-ROM, CD-R, CD-RW, DVD-ROM, DVD-RAM, DVD-RW, DVD+RW), magnetic tapes, non-volatile memory cards, and ROMs. Optionally, the computer-readable instructions can be downloaded from a server computer or the cloud via a communication network.

[0046] It should be noted that not all steps and modules in the above processes and system structure diagrams are mandatory; some steps or modules can be omitted as needed. The execution order of each step is not fixed and can be adjusted as required. The system structure described in the above embodiments can be a physical structure or a logical structure. That is, some modules may be implemented by the same physical entity, or some modules may be implemented by multiple physical entities, or they may be jointly implemented by certain components in multiple independent devices.

Claims

1. A temperature prediction method, comprising: Obtain the current of each line in the first group of lines (101) at the first moment in an electrical topology diagram; In the electrical topology diagram, the temperature of the first set of points at a first moment is determined (102); wherein the first set of points includes: at least one point on the first set of lines, or at least one point in a relevant line from which the current can be calculated based on the first set of lines and the electrical topology diagram; The temperature of the first set of points at the first moment is bound (103) to the corresponding line to obtain the second set of lines; When the first group of lines does not include all the lines in the electrical topology diagram, according to Kirchhoff's current law, the current value of the lines other than the first group of lines in the electrical topology diagram is calculated (104) based on the current of each line in the first group of lines at the first moment. Based on the current values ​​of all lines in the electrical topology diagram and the temperature on the second group of lines, calculate (105) the temperature of at least one of the other lines besides the second group of lines; The step of binding the temperature of the first group of points at the first moment (103) to the corresponding line includes: When the first set of points is at least one point on the first set of lines, the temperature of the first set of points at the first moment is bound to the corresponding line in the first set of lines; or, When the first group of points is at least one of the relevant lines whose current can be calculated based on the first group of lines and the electrical topology diagram, the temperature of the first group of points at the first moment is bound to the first line in the first group of lines in the electrical topology diagram that is closest to that temperature. The step of calculating the temperature of at least one of the other lines besides the second group of lines (105) based on the current values ​​of all lines in the electrical topology diagram and the temperature on the second group of lines includes: The data group is composed of the current values ​​of all lines in the electrical topology diagram and the temperature on the second group of lines. (, T1), , T2)...( , T k ), Calculate the temperature of all lines except the second group of lines; Output the data sets corresponding to each of the lines ( , T n ),in T represents the current in the nth line. n This represents the temperature of the nth line.

2. The method according to claim 1, characterized in that, Binding the temperature of the first group of points at a first moment to the first line in the first group of lines in the electrical topology diagram that is closest to that temperature includes: The temperature of the first group of points at the first moment is bound to the K first lines in the first group of lines in the electrical topology diagram that are closest to that temperature and have the longest average daily operating time.

3. The method according to claim 1, characterized in that, Calculate the temperature of at least one of the lines other than the second group of lines in (105), including: When at least one of the other lines is a busbar or a part of the busbar, the surface temperature of the corresponding line can be calculated using the following formula. : （2） in, For the equivalent conductor heat capacity, For ambient temperature, For air thermal resistance, For line loss, is the surface temperature.

4. The method according to claim 1, characterized in that, Calculate the temperature of at least one of the lines other than the second group of lines in (105), including: When at least one of the other lines is a branch line, the surface temperature of the corresponding line can be calculated using the following formula. : （4） in, For line loss; The equivalent heat capacity within the branch circuit is given. The equivalent heat capacity outside the branch line is... For adiabatic heat capacity, For air thermal resistance, For conductor temperature, Temperature of the insulation layer For ambient temperature, is the surface temperature.

5. The method according to claim 3, characterized in that, The busbar is a busbar or a busbar.

6. The method according to claim 4, characterized in that, The branch line is an insulated cable.

7. The method according to claim 1, characterized in that, Calculate the temperature of at least one of the lines other than the second group of lines in (105), including: The temperature of at least one of the lines other than the second group of lines is calculated using the finite element method of multiphysics.

8. A temperature prediction device, characterized in that, include: At least one memory (51) is configured to store computer-readable code; At least one processor (52) is configured to invoke the computer-readable code to perform the steps of the method as described in any one of claims 1 to 7.

9. A computer-readable storage medium having a computer program stored thereon; characterized in that, The computer program can be executed by a processor to implement the temperature prediction method as described in any one of claims 1 to 7.

Images