A wafer support device and semiconductor equipment

Abstract

This invention provides a wafer support device and semiconductor equipment, relating to the field of semiconductor technology. The wafer support device includes a support assembly, which includes a support member and a fixing member. The support member includes a limiting portion, a supporting portion, and a connecting portion connected in sequence. The top surface of the supporting portion is used to support the wafer. The limiting portion protrudes from the top surface of the supporting portion and is used to limit the wafer position. The connecting portion is rotatably connected to the fixing member, thereby allowing the supporting portion and the limiting portion to be adjusted to appropriate orientations. This ensures that the supporting portion stably supports the wafer and that the limiting portion effectively limits the wafer position, thereby improving the stability of the support assembly in supporting the wafer and adapting to different wafers, thus enhancing the adaptability of the wafer support device.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more specifically, to a wafer support device and semiconductor equipment. Background Technology

[0002] In the semiconductor industry, wafers are typically placed in a vacuum chamber for processing. However, the existing wafer processing equipment uses complex and poorly adaptable support structures to hold the wafers, which cannot stably support them and thus affect the wafer processing. Summary of the Invention

[0003] This invention provides a wafer support device and semiconductor equipment that can stably support wafers and adapt to different wafers, thereby improving wafer process efficiency and quality.

[0004] The embodiments of the present invention can be implemented as follows:

[0005] In a first aspect, the present invention provides a wafer support device, comprising a support assembly:

[0006] The support assembly includes a support member and a fixing member. The support member includes a limiting part, a supporting part, and a connecting part connected in sequence. The connecting part is rotatably connected to the fixing member. The supporting part is used to carry the wafer. The limiting part protrudes from the supporting part and is used to limit the wafer.

[0007] In an optional embodiment, the top of the fastener is provided with a receiving groove, and the connecting part is rotatably disposed in the receiving groove.

[0008] In an optional embodiment, the wafer support device further includes a fastener, the side wall of the fastener having a through hole communicating with the receiving groove, the fastener being disposed in the through hole and abutting against the connecting part disposed in the receiving groove to fix the connecting part.

[0009] In an optional embodiment, the number of fasteners and through holes are both multiple, and the multiple through holes are equally spaced on the side peripheral wall of the fastener, with each of the multiple fasteners corresponding to one of the multiple through holes.

[0010] In an optional embodiment, the fastener includes a bolt and a nut, the through hole is a threaded hole, the bolt is threaded into the through hole, and the nut is disposed on the bolt.

[0011] In an optional embodiment, the limiting part is provided with a guide surface and a supporting surface that are connected to each other. The supporting surface is used to limit the wafer, and the guide surface is inclined.

[0012] In an optional embodiment, both the guide surface and the abutment surface are directed toward the center of the wafer.

[0013] In an optional embodiment, the support is made of quartz.

[0014] In an optional embodiment, the number of support components includes at least two, the at least two support components are arranged in a ring and are equally spaced, the at least two support components are both directed toward the center of the wafer, and together are used to support the wafer.

[0015] In a second aspect, the present invention provides a semiconductor device including a wafer support device as described in any of the foregoing embodiments.

[0016] The beneficial effects of the wafer support device and semiconductor equipment provided in this invention include: by adjusting the support portion and the limiting portion to appropriate directions, the support portion stably supports the wafer and the limiting portion effectively limits the wafer, thereby improving the stability of the support assembly in supporting the wafer and adapting to different wafers, thus improving the adaptability of the wafer support device. Therefore, the support member can stably support the wafer and prevent the wafer from moving arbitrarily in the horizontal direction, thereby ensuring the smooth progress of wafer processing and improving the efficiency and quality of semiconductor equipment processes. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the wafer support device and the wafer structure from a first-view perspective provided in an embodiment of the present invention;

[0019] Figure 2 This is a schematic diagram of the wafer support device and the wafer second-view structure provided in an embodiment of the present invention;

[0020] Figure 3 Provided for embodiments of the present invention Figure 2 Enlarged view of section A in the middle;

[0021] Figure 4 This is a schematic diagram of the support component structure provided in an embodiment of the present invention.

[0022] Icons: 10-Wafer support device; 100-Support assembly; 110-Support member; 111-Limiting part; 1111-Guide surface; 1112-Abutting surface; 112-Support part; 113-Connecting part; 120-Fixing member; 121-Accommodating groove; 122-Through hole; 130-Fastener; 131-Bolt; 132-Nut; 20-Wafer. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0024] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0025] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0026] In the description of this invention, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of this invention is usually placed, they are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0027] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0028] It should be noted that, where there is no conflict, the features in the embodiments of the present invention can be combined with each other.

[0029] This invention provides a semiconductor device applied in the semiconductor field. The semiconductor device includes a wafer support assembly and other devices, which support the wafer and perform corresponding processing operations on the wafer through other devices.

[0030] It should be noted that semiconductor equipment can be, but is not limited to, resist stripping equipment, etching equipment, CVD equipment, and coating equipment, etc., and no specific limitations are made here.

[0031] Please see Figures 1 to 4 The wafer support device 10 provided by the present invention includes a support component 100, which can stably support the wafer 20, thereby ensuring the smooth progress of the wafer 20 process.

[0032] Furthermore, the support assembly 100 includes a support member 110 and a fixing member 120. The support member 110 includes a limiting part 111, a supporting part 112 and a connecting part 113 connected in sequence. The connecting part 113 is rotatably connected to the fixing member 120. The top surface of the supporting part 112 is used to support the wafer 20. The limiting part 111 protrudes from the top surface of the supporting part 112 and is used to limit the wafer 20.

[0033] In this embodiment, the connecting part 113 can rotate relative to the fixing part 120 around its own axis. Therefore, under the drive of the external driving force, the support part 110 can drive the support part 112 and the limiting part 111 to rotate in any horizontal direction. That is to say, the direction of the support part 110 can be adjusted arbitrarily. By adjusting the support part 112 and the limiting part 111 to the appropriate direction, the support part 112 can stably support the wafer 20 and the limiting part 111 can effectively limit the wafer 20, thereby improving the stability of the support assembly 100 in supporting the wafer 20 and adapting to different wafers 20, thus improving the adaptability of the wafer support device 10.

[0034] Therefore, the support member 110 can stably support the wafer 20 and prevent the wafer 20 from moving arbitrarily in the horizontal direction, thereby ensuring that the wafer 20 process can proceed smoothly and improving the efficiency and quality of the semiconductor equipment process.

[0035] It should be noted that the external driving force can be manual or driven by a drive device; no specific limitation is made here.

[0036] Specifically, the support 110 is made of quartz.

[0037] In this embodiment, the support member 110 is made of high-purity quartz material, which avoids direct contact between the support member and the wafer 20 using traditional metal components. This prevents the metal components from precipitating impurities at high temperatures, contaminating the wafer 20, and thus affecting the wafer 20's processing and reducing its quality. The support member 110, made of quartz material, does not precipitate impurities at high temperatures and does not contaminate the wafer 20, thus effectively improving the quality of the wafer 20's processing.

[0038] Furthermore, the limiting part 111 is provided with a guide surface 1111 and a supporting surface 1112 that are connected to each other. The supporting surface 1112 is used to limit the wafer 20, and the guide surface 1111 is inclined.

[0039] In this embodiment, the abutment surface 1112 is vertically oriented, and the guide surface 1111 is inclined upwards away from the support portion 112. This guide surface 1112 guides the wafer 20 when it is placed on the support portion 112, facilitating its smooth placement. The abutment surface 1112 abuts against the edge of the wafer 20 when it has a tendency to shift, thereby limiting its position and preventing it from shifting in the horizontal plane, thus improving the processing quality of the wafer 20.

[0040] Furthermore, both the guide surface 1111 and the abutment surface 1112 are used to face the center of the wafer 20.

[0041] In this embodiment, by aligning the guide surface 1111 and the abutment surface 1112 with the center of the wafer 20, the guiding effect of the guide surface 1111 on the wafer 20 and the limiting effect of the abutment surface 1112 on the wafer 20 can be significantly improved. At the same time, it can ensure that the support portion 112 and the wafer 20 have a large contact area, so that the wafer 20 is stably supported on the support portion 112.

[0042] Furthermore, the top of the fastener 120 is provided with a receiving groove 121, and the connecting part 113 is rotatably disposed in the receiving groove 121.

[0043] In this embodiment, the axis of the fixing member 120 and the axis of the connecting part 113 are on the same straight line. By partially setting the connecting part 113 in the receiving groove 121, and making the diameter of the receiving groove 121 slightly larger than the diameter of the connecting part 113, it is ensured that the connecting part 113 can rotate in the receiving groove 121, thereby realizing the adjustment of the direction of the supporting part 112 and the limiting part 111.

[0044] It is understandable that the connecting part 113 is cylindrical, and the receiving groove 121 is a cylindrical groove that matches the shape of the connecting part 113.

[0045] Furthermore, the wafer support device 10 also includes a fastener 130. The side wall of the fixing member 120 is provided with a through hole 122, which communicates with the receiving groove 121. The fastener 130 is disposed in the through hole 122 and abuts against the connecting part 113 disposed in the receiving groove 121 to fix the connecting part 113.

[0046] In this embodiment, after the orientation of the support member 110 is adjusted to an appropriate direction, the fastener 130, which passes through the through hole 122 and extends into the receiving groove 121, abuts against the connecting part 113 provided in the receiving groove 121 to firmly fix the fixing part and prevent the support member 110 from rotating, thereby ensuring that the support member 110 stably supports the wafer 20.

[0047] Optionally, in some embodiments, the number of through holes 122 and fasteners 130 may both be one.

[0048] Specifically, the fastener 130 includes a bolt 131 and a nut 132, and the through hole 122 is a threaded hole.

[0049] In this embodiment, bolt 131 is threaded into through hole 122, and nut 132 is disposed on bolt 131 and connected to the side wall of fastener 120, thereby improving the anti-loosening performance of bolt 131. The support 110 can be firmly fixed by bolt 131 and nut 132.

[0050] Furthermore, there are multiple fasteners 130 and multiple through holes 122. Multiple through holes 122 are equally spaced on the side wall of the fastener 120, and multiple fasteners 130 are correspondingly arranged in the multiple through holes 122.

[0051] In this embodiment, by setting multiple fasteners 130 to evenly abut against the connecting portion 113 of the support member 110, the connecting portion 113 can be subjected to uniform force, thereby ensuring that the fasteners 130 fix the support member 110 more stably.

[0052] Optionally, in some embodiments, the number of through holes 122 and the number of fasteners 130 are both three. The three through holes 122 are equally spaced around the fixing member 120, and the three fasteners 130 are correspondingly disposed in the three through holes 122 and extend into the receiving groove 121 to abut against the connecting portion 113 of the support member 110, thereby locking the connecting portion 113 and stably fixing the support member 110 on the fixing member 120.

[0053] Of course, the number of through holes 122 and fasteners 130 can be other settings, as long as the support 110 can be fixed, and no specific limitation is made here.

[0054] Furthermore, the number of support components 100 includes at least two, and the at least two support components 100 are arranged in a ring and are equally spaced, and together are used to support the wafer 20.

[0055] In this embodiment, at least two support components 100 are directed toward the center of the wafer 20. In other words, the support members 110 of at least two support components 100 are directed toward the center of the wafer 20, so that the wafer 20 is supported by the support portions 112 on the at least two support members 110, and the wafer 20 is limited by the limiting portions 111 on the at least two support members 110, thereby achieving stable support of the wafer 20.

[0056] Optionally, as shown in the figure, the number of support components 100 may include six, and the six support components 100 together support a wafer 20.

[0057] In summary, the embodiments of the present invention provide a wafer support device 10 and a semiconductor device. By adjusting the support portion 112 and the limiting portion 111 to appropriate directions, the support portion 112 stably supports the wafer 20, and the limiting portion 111 effectively limits the wafer 20, thereby improving the stability of the support assembly 100 in supporting the wafer 20 and adapting to different wafers 20, thus improving the adaptability of the wafer support device 10. Therefore, the support member 110 can stably support the wafer 20 and prevent the wafer 20 from moving arbitrarily in the horizontal direction, thereby ensuring that the wafer 20 process can proceed smoothly and improving the efficiency and quality of the semiconductor device's process.

[0058] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A wafer support apparatus, characterized by, The application relates to a wafer supporting device. The supporting assembly comprises a supporting piece and a fixing piece, the supporting piece comprises a limiting part, a supporting part and a connecting part which are connected in sequence, the connecting part is rotatably connected with the fixing piece, the supporting part is used for bearing a wafer, and the limiting part is protruded on the supporting part and used for limiting the wafer. A containing groove is arranged on the top of the fixing piece, and the connecting part is rotatably arranged in the containing groove. The wafer supporting device further comprises fasteners, a through hole is arranged on the side wall of the fixing piece and communicates with the containing groove, the fasteners are arranged in the through hole and abut against the connecting part arranged in the containing groove so as to fix the connecting part.

2. The wafer support apparatus of claim 1, wherein The number of the fasteners and the through holes is multiple, the multiple through holes are equidistantly arranged on the side wall of the fixing piece, and the multiple fasteners are arranged in the multiple through holes one by one.

3. The wafer support apparatus according to claim 1 or 2, characterized by, The fasteners comprise bolts and nuts, the through holes are threaded holes, the bolts are screwed with the threaded holes, and the nuts are arranged on the bolts.

4. The wafer support apparatus of claim 1, wherein The limiting part is provided with a guiding surface and an abutting surface which are connected with each other, the abutting surface is used for limiting the wafer, and the guiding surface is arranged in an inclined mode.

5. The wafer support apparatus of claim 4, wherein The guiding surface and the abutting surface are both used for being directed to the center of the wafer.

6. The wafer support apparatus of claim 1, wherein The supporting piece is made of quartz.

7. The wafer support apparatus of claim 1, wherein The number of the supporting assemblies is at least two, the at least two supporting assemblies are arranged in a ring mode and equidistantly, the at least two supporting assemblies are both used for being directed to the center of the wafer and are used for bearing the wafer together.

8. A semiconductor device, characterized by comprising: The wafer supporting device comprises the supporting assemblies as claimed in any one of claims 1-7.

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