Electronic devices

Abstract

This disclosure provides an electronic device. The electronic device includes a support substrate, a first substrate, a semiconductor component, and an adhesive layer. The first substrate is disposed on the support substrate. The semiconductor component is disposed on the first substrate. The adhesive layer is disposed between the support substrate and the first substrate. The adhesive layer includes a plurality of trenches. The electronic device of the present disclosure can improve the appearance flatness problem caused by air bubbles between the adhesive layer and other stacked layers through the trenches of the adhesive layer.

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