Electronic device comprising a thermal conduction connector

Abstract

An electronic device includes a first device portion, a second device portion coupled to the first device portion, and a unidirectional heat conduction connector coupled to the first device portion and the second device portion. The first device portion includes a region that includes a component configured to generate heat. The unidirectional heat conduction connector is configured to dissipate heat away from the first device portion and toward the second device portion. The unidirectional heat conduction connector includes a heat conductive material that primarily dissipates heat in a first direction of the heat conductive material.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to non-provisional application serial number 17 / 094,035 filed with the U.S. Patent and Trademark Office on November 10, 2020, and provisional application serial number 63 / 032,275 filed with the U.S. Patent and Trademark Office on May 29, 2020, the entire contents of which are incorporated herein by reference as fully set forth below for all applicable purposes. Technical Field

[0003] Various features relate to electronic devices including heat dissipation devices, but more specifically to electronic devices including heat conduction connectors. Background Technology

[0004] Figure 1 The illustration shows a computer device 100 including a main portion 102 and a screen portion 104. The main portion 102, part of the computer device 100, includes a keyboard, a printed circuit board (PCB) 105, an integrated device 107, and a heat sink 109. The PCB 105, integrated device 107, and heat sink 109 may be located inside the main portion 102. When the integrated device 107 operates, it can generate heat that is dissipated through the heat sink 109 and the PCB 105. Most of the heat generated by the integrated device 107 is dissipated within the main portion 102, which can cause one or more surfaces of the main portion 102 of the computer device 100 to become sufficiently hot, causing discomfort to the user of the computer device 100. Furthermore, Figure 1 The configuration shown must not be powerful enough to dissipate heat and prevent the integrated device 107 from overheating.

[0005] There is a continuous need to improve the heat dissipation capabilities of equipment, including components that generate heat. Summary of the Invention

[0006] Various features relate to electronic devices including heat dissipation devices, but more specifically to electronic devices including heat conduction connectors.

[0007] One example provides an electronic device including a first device portion, a second device portion coupled to the first device portion, and a unidirectional thermal conductive connector coupled to the first device portion and the second device portion. The first device portion includes a region containing components configured to generate heat.

[0008] Another example provides an electronic device including a first device portion, a second device portion coupled to the first device portion, and components coupled to the first and second device portions for unidirectional heat conduction. The first device portion includes a region containing components configured to generate heat.

[0009] Another example provides an electronic device including a first device portion, a second device portion coupled to the first device portion, and a thermally conductive connector coupled to both the first and second device portions. The thermally conductive connector includes anisotropic thermally conductive material. The first device portion includes a region comprising a portion of components configured to generate heat. Attached Figure Description

[0010] When considered in conjunction with the accompanying drawings, various features, properties and advantages will become apparent from the detailed description set forth below, in which the same reference numerals are always correspondingly used to identify them.

[0011] Figure 1 The illustration shows a view of a computer device including a heat sink.

[0012] Figure 2 The illustration shows a view of a computer device configured to include a unidirectional thermal conductive connector.

[0013] Figure 3 The illustration shows a view of a computer device configured to include a unidirectional thermal conductive connector.

[0014] Figure 4 The illustration shows a view of a computer device configured to include a unidirectional thermal conductive connector.

[0015] Figure 5 The illustration shows a view of a computer device configured to include a unidirectional thermal conductive connector.

[0016] Figure 6 The illustration shows a view of a material with multidirectional thermal conductivity.

[0017] Figure 7 The diagram illustrates a view of a material with unidirectional thermal conductivity.

[0018] Figure 8 The diagram illustrates a view of a material with unidirectional thermal conductivity.

[0019] Figure 9 An exemplary thermal diagram of a computer device without heat dissipation cables is illustrated.

[0020] Figure 10 An exemplary thermal diagram of a computer device including a unidirectional thermal conductive connector is illustrated.

[0021] Figure 11 The illustration shows an exemplary temperature distribution of a computer device without heat dissipation cables.

[0022] Figure 12 The illustration shows an exemplary temperature distribution of a computer device including a unidirectional thermal conductive connector.

[0023] Figure 13 An exemplary sequence for manufacturing a unidirectional thermally conductive connector is illustrated.

[0024] Figure 14 An exemplary flowchart of a method for providing a unidirectional thermal conductive connector to a computer device is illustrated.

[0025] Figure 15 The illustrations depict various electronic devices that can integrate dies, integrated devices, integrated passive devices (IPDs), passive components, packages, and / or device packages described herein. Detailed Implementation

[0026] In the following description, specific details are set forth to provide a thorough understanding of various aspects of this disclosure. However, those skilled in the art will understand that these aspects can be practiced without these specific details. For example, circuits may be shown in block diagrams to avoid obscuring these aspects with unnecessary detail. In other instances, well-known circuits, structures, and techniques may not be shown in detail so as not to obscure various aspects of this disclosure.

[0027] This disclosure describes an electronic device including a first device portion, a second device portion coupled to the first device portion, and a unidirectional thermally conductive connector coupled to both the first and second device portions. The first device portion includes a region containing components configured to generate heat. The unidirectional thermally conductive connector includes a flexible portion. The unidirectional thermally conductive connector is configured to dissipate heat away from the first device portion and towards the second device portion. The unidirectional thermally conductive connector includes a thermally conductive material that dissipates heat primarily along a first direction of the thermally conductive material. The use of the unidirectional thermally conductive connector makes heat dissipation from one area to another more efficient without requiring a separate insulator around the thermally conductive connector, which can reduce the overall thickness of the connector while still providing effective heat dissipation and heat distribution.

[0028] Exemplary electronic device including a unidirectional thermal conductive connector

[0029] Figure 2 and Figure 3 The illustration shows an electronic device 200 including a thermally conductive connector. Figure 2 The illustration shows the bottom rear view of electronic device 200. Figure 3The illustration shows a top front view of an electronic device 200. The electronic device 200 includes a first device portion 202, a second device portion 204, and a connector 210. The connector 210 is a unidirectional thermally conductive connector. The unidirectional thermally conductive connector 210 is coupled to the first device portion 202 and the second device portion 204. The unidirectional thermally conductive connector 210 is configured to dissipate heat away from the first device portion 202 and towards the second device portion 204. As will be further described below, the unidirectional thermally conductive connector 210 may include anisotropic thermally conductive material.

[0030] The first device portion 202 may be the main body of the electronic device 200. The first device portion 202 may include several components, including a main body cover, a main body frame, a keyboard 302, solder pads, a battery, at least one integrated device (e.g., a processor, memory, a modem), a package (e.g., an RF front-end package), and / or a printed circuit board. The second device portion 204 may be configured to provide a display for the electronic device 200. The second device portion 204 may include a display main body cover, a display main body frame, and a display 304. However, it should be noted that the first device portion 202 and the second device portion 204 may be configured to include different components and / or other components.

[0031] The unidirectional heat conduction connector 210 includes a first conductive portion 212, a second conductive portion 214, and a third conductive portion 216. The first conductive portion 212, the second conductive portion 214, and the third conductive portion 216 may be adjacent portions. The third conductive portion 216 may be folded, compressed, and / or bent. The third conductive portion 216 may be twisted and / or braided in a rope-like manner. The third conductive portion 216 may be wrapped or surrounded by tape and / or other similar materials. The third conductive portion 216 may be configured as a flexible cable. As will be stated below at least in... Figure 7 and 8As further described herein, the unidirectional heat conduction connector 210 includes a heat-conducting material that dissipates heat primarily along a first direction (e.g., axial) of the heat-conducting material. For example, the unidirectional heat conduction connector 210 may include anisotropic heat-conducting materials. The heat-conducting material may include carbon fibers. The heat-conducting material has a thermal conductivity value in the first direction (e.g., axial), which may be in the range of about 200-1900 watts per meter Kelvin (W / (mk)). The unidirectional heat conduction connector 210 may be a component for unidirectional heat conduction. It should be noted that the heat passing through the length of the unidirectional heat conduction connector 210 can be defined as the heat passing through a path including the first conductive portion 212, the third conductive portion 216, and the second conductive portion 214. In some embodiments, as described in this disclosure, the heat-conducting material that dissipates heat (e.g., by conduction) primarily along the first direction (e.g., axial) of the heat-conducting material may be a material that dissipates heat (e.g., by conduction) at least 90% (or more) along the first direction (e.g., axial) of the heat-conducting material.

[0032] Using the unidirectional thermal conductivity connector 210 has several advantages. First, as heat passes through the unidirectional thermal conductivity connector 210, heat will not leak substantially into other areas of the first device portion 202. The nature of unidirectional thermal conductivity materials means that they have a high thermal conductivity value in one direction and a low thermal conductivity value in the other (e.g., a lower thermal conductivity value relative to a high thermal conductivity value). Therefore, for example, along the length of the unidirectional thermal conductivity connector 210, the connector 210 is a very efficient thermal conductor, while radially and / or along the width and / or height, the connector 210 is a poor thermal conductor or behaves more like an insulator. Thus, the unidirectional thermal conductivity connector 210 is a more efficient, productive, and effective thermal conductor away from the first device portion 202. Secondly, since the unidirectional heat conduction connector 210 conducts heat primarily and mainly along its length, there is no need to add a separate insulator or insulating layer around the connector 210. This means that the connector 210 can be smaller and thinner than heat conductors that require a separate insulator or insulating layer (e.g., laminated insulating layer). Therefore, the unidirectional heat conduction connector 210 can be used in smaller devices and / or devices with less space for the heat conduction connector 210. This will be discussed below at least in... Figure 7 and 8 The characteristics of the unidirectional heat conduction connector 210 are further described below.

[0033] As described above, connector 210 is coupled to the first device portion 202 and the second device portion 204. Connector 210 may be located inside and / or outside the first device portion 202 and the second device portion 204. Connector 210 may be coupled to one or more components of electronic device 200.

[0034] like Figure 2 As shown, electronic device 200 includes a printed circuit board (PCB) 250, an integrated device 270, and a heat sink 290. The integrated device 270 may be coupled to the PCB 250 (e.g., via solder interconnect). The heat sink 290 may be coupled to the integrated device 270. The integrated device 270 may include radio frequency (RF) devices, passive devices, filters, surface acoustic wave (SAW) filters, bulk acoustic wave (BAW) filters, processors, memory, and / or combinations thereof. The integrated device 270 is an example of a component configured to generate heat (e.g., configured to generate heat during operation and / or activation of the integrated device).

[0035] PCB 250, integrated device 270, and heat sink 290 may be located in the area of ​​the first device portion 202 of electronic device 200. A first conductive portion 212 of connector 210 is coupled to PCB 250. The first conductive portion 212 may be coupled to PCB 250 by adhesive. In some embodiments, at least some of the heat generated by integrated device 270 may travel through PCB 250, connector 210 (e.g., first conductive portion 212, third conductive portion 216, and second conductive portion 214), and to the second device portion 204. As will be explained below at least in Figure 4 and 5 As further described herein, connector 210 can be coupled to a component of electronic device 200.

[0036] like Figure 3 As shown, the first device portion 202 and the second device portion 204 can be coupled together via at least one hinge 306. The at least one hinge 306 is configured to allow the second device portion 204 to rotate relative to the first device portion 202. In some embodiments, multiple portions of the connector 210 may extend through and / or be coupled to the at least one hinge 306. In some embodiments, the connector 210 and the at least one hinge 306 can help dissipate heat away from the first device portion 202 and towards the second device portion 204.

[0037] As described above, the unidirectional thermal conductive connector 210 can be coupled to various components of the first device portion 202 and the second device portion 204. Figure 4 and Figure 5 Examples of different components that connector 210 can couple to are illustrated.

[0038] Figure 4The illustration shows an electronic device 200, which includes a first device portion 202, a second device portion 204, hinges 306a and 306b. The first device portion 202 is coupled to the second device portion 204 via hinges 306a-306b. The electronic device 200 also includes a unidirectional thermal conductive connector 210a, a unidirectional thermal conductive connector 210b, a PCB 405, integrated devices 407 and 408, a heat sink 409, and a display (not visible). The PCB 405, integrated devices 407, 408, and heat sink 409 are located in the first device portion 202. The display may be located in the second device portion 204 of the electronic device 200.

[0039] Connectors 210a and 210b are respectively coupled to the first device portion 202 and the second device portion 204. Connector 210a may extend through hinge 306a. Connector 210b may extend through hinge 306b. Figure 4 The diagram illustrates connector 210a coupled to a first portion (e.g., a component) of PCB 405 and second device portion 204. In some embodiments, at least some heat generated by integrated device 407 can extend through PCB 405, through connector 210, and to the second device portion 204. Connector 210b is coupled to a second portion (e.g., a component) of heat sink 409 and second device portion 204. In some embodiments, at least some heat generated by integrated device 408 can extend through heat sink 409, connector 210b, and to the second device portion 204.

[0040] Figure 5 The illustration shows an electronic device 200 comprising multiple hinges (306a, 306b, and 306c) and multiple unidirectional thermally conductive connectors 210c, 210d, and 210e. A first device portion 202 is connected to a second device portion 204 via the multiple hinges (306a, 306b, and 306c). Connectors 210c, 210d, and 210e are each coupled to the first device portion 202 and the second device portion 204. Connector 210c may extend through hinge 306a. Connector 210d may extend through hinge 306b.

[0041] Figure 5The diagram illustrates connector 210c coupled to a first portion (e.g., component) of integrated device 407 and second device portion 204. In some embodiments, at least some heat generated by integrated device 407 can extend through connector 210c and reach second device portion 204. Connector 210d is coupled to a second portion (e.g., component) of PCB 405 and second device portion 204. In some embodiments, at least some heat generated by integrated device 408 can extend through heat sink 409, and at least some heat generated by integrated device 408 can extend through PCB 405, connector 210d, and reach second device portion 204. Connector 210e is coupled to PCB 405 and hinge 306c. In some embodiments, at least some of the heat generated by integrated device 407 can extend through PCB 405, through connector 210e, through hinge 306c, and reach second device portion 204. Similarly, in some embodiments, at least some of the heat generated by the integrated device 408 may extend through the PCB 405, through the connector 210e, through the hinge 306c, and reach the second device portion 204.

[0042] Connectors (e.g., 210, 210a, 210b, 210c, 210d, 210e) can be coupled to a region comprising one or more components. Connectors (e.g., 210, 210a, 210b, 210c, 210d, 210e) can be directly coupled to one or more components, or can be coupled to one or more components via an adhesive. The adhesive can be a double-sided adhesive. The adhesive can include a thermally conductive adhesive. The adhesive may have a thermal conductivity value of about 2 W / (mk) or higher. However, the adhesive may have a thermal conductivity value lower than 2 W / (mk).

[0043] Note that the implementation of the connector is not limited to electronic devices including displays and keyboards. The connector can be implemented in any device comprising at least two regions and / or at least two parts. For example, the connector can be implemented in a mobile device including a foldable or flexible display, wherein the flexible display is located in both parts of the mobile device. Using at least one unidirectional heat-conducting connector (e.g., 210) can reduce and minimize heat dissipation into the first device part 202. Therefore, more heat is distributed and dissipated into the second device part 204. This has the effect of increasing the temperature of the second device part 204. However, because more heat is dissipated in the second device part 204, the temperature of the first device part 202 does not increase significantly, thus ensuring a more comfortable experience for the user of the electronic device 200, since the first device part 202 (which includes the keyboard) is part of the electronic device that the user is more likely to use and touch. Figures 9-12The diagram also illustrates and describes heat distribution patterns and temperature performance examples of electronic devices.

[0044] Figure 5 The illustration shows connector 210c including a conductive portion (e.g., a third conductive portion 216c), which may optionally be twisted and / or braided in a rope-like manner. Note that any connector described in this disclosure (e.g., 210a, 210b, 210d, 210e) may include a conductive portion (e.g., 216) twisted and / or braided in a rope-like manner. Different embodiments may twist or braid the conductive portion in different ways. Twisting and / or braiding the conductive portion can make the connector more compact, stronger, and more flexible.

[0045] Figure 6 The illustration depicts a heat-conducting material 600 configured to conduct heat in multiple directions. The heat-conducting material 600 can conduct heat in the axial direction and one or more radial directions. The heat-conducting material 600 can be a multidirectional heat-conducting material 600. Examples of materials that conduct heat in multiple directions include metals such as copper. To prevent radial heat conduction of the material 600, an insulator needs to be radially disposed around the material. However, adding an insulator increases the overall thickness of the conductor.

[0046] Figure 7The illustration depicts a thermally conductive material 700 configured to conduct heat primarily in one direction. In this example, material 700 is a unidirectional thermally conductive material configured to conduct heat along the axial direction (e.g., along the length of the material). Radially, along the width and / or height of material 700, material 700 conducts little or no heat. Therefore, radially, along the width and / or height of material 700, material 700 can be configured as an insulator (e.g., behaves as an insulator). This means that a separate insulator radially surrounding material 700 is not required to prevent heat dissipation radially. Material 700 may comprise an anisotropic thermally conductive material having a high thermal conductivity value in a first direction (e.g., axial, along length) and a low thermal conductivity value in at least a second direction (e.g., radial, along width, along height). In some embodiments, a material can be considered a unidirectional thermally conductive material when it includes a high thermal conductivity value in a first direction (e.g., axial direction, along length) and a low thermal conductivity value in at least a second direction (e.g., radial direction, along width, along height). In some embodiments, a material can be considered a unidirectional thermally conductive material when at least 90% of the heat is dissipated in one direction and / or one plane (e.g., the XY plane) of the material. For example, a unidirectional thermally conductive material can be a material in which at least 90% of the heat dissipated by conduction by the thermally conductive material is dissipated along a first direction and / or a first plane of the thermally conductive material. Different embodiments may use different percentages to define the meaning of a unidirectional thermally conductive material. In some embodiments, a material can be considered a unidirectional thermally conductive material when it has a thermal conductivity value in one direction (e.g., axial direction) that is at least 10 times greater than its thermal conductivity value in another direction (e.g., radial direction).

[0047] Figure 8The illustration depicts a heat-conducting material 800 configured to primarily conduct heat in one direction. Material 800 includes multiple carbon fibers aligned and / or oriented in a specific direction. Some carbon fibers may be aligned laterally (e.g., along length, along width, horizontally). Some carbon fibers may be aligned in different directions (e.g., vertically, diagonally) or combinations thereof. Most carbon fibers may be aligned in approximately the same direction. Material 800 may include pitch-based carbon fibers. Material 800 may be a composite material. For example, material 800 may include multiple carbon fibers and a resin. The heat-conducting material 800 may include anisotropic thermal conductivity values, wherein material 800 may be a heat-conducting material having a high thermal conductivity value in a first direction (e.g., axial, along length) and a low thermal conductivity value in at least a second direction (e.g., radial, along width, along height). The heat-conducting material 800 may have a thermal conductivity value in the range of approximately 200-800 watts per meter Kelvin (W / (mk)) in the first direction (e.g., axial). The thermally conductive material 800 may have a thermal conductivity value of approximately 30 W / (mk) in the second direction (e.g., radial). The resin may have a thermal conductivity value of approximately 0.2 W / (mk). The thermal conductivity value of the thermally conductive material 800 in the second direction (e.g., radial) (approximately 30 W / (mk)) may be the average of the thermal conductivity values ​​of the carbon fiber and the resin.

[0048] In some embodiments, the thermally conductive material 800 may include graphite (e.g., graphite sheets). Graphite is another example of a material that includes anisotropic thermal conductivity values. Graphite sheets may have thermal conductivity values ​​in the XY plane (X-axis / direction, Y-axis / direction) in the range of approximately 1100-1900 W / (mk) and in the Z-axis / direction in the range of approximately 15-21 W / (mk).

[0049] Figure 8 The diagram also illustrates how heat dissipation occurs for a unidirectional thermally conductive connector 210, which includes materials with anisotropic thermal conductivity values ​​and / or properties. Figure 8 The illustration shows that connector 210 has high thermal conductivity in the axial direction but low thermal conductivity in the radial direction. Connector 210 can be coupled to adhesives 806a-806b. Adhesives 806a-806b can be double-sided tapes. Adhesives 806a-806b can help connector 210 couple to different components of electronic devices.

[0050] Figure 9 and Figure 10 The illustration shows thermal diagrams of an electronic device without a thermally conductive connector and an electronic device with a unidirectional thermally conductive connector. (See diagram for reference.) Figure 9As shown, electronic devices without thermal conductive connectors reach high temperatures (e.g., hot areas) in certain parts of the keyboard section and on the back of the keyboard section. The keyboard section is the area touched by the user during operation of the electronic device, and the back of the keyboard section may be the part located on top of the user (e.g., the user's legs). Figure 9 The diagram illustrates the hottest area of ​​an electronic device, which is also the area most likely to be touched by a user.

[0051] Figure 10 The illustration shows that an electronic device with a unidirectional heat conduction connector results in a lower temperature in the keyboard section because more heat is dissipated to the display section of the device. Although the display section is warmer, the user of the electronic device is unlikely to touch it as much as the keyboard section. Figure 10 The illustration shows that electronic devices with unidirectional thermal conductivity connectors provide greater comfort (in terms of temperature) than those without such connectors.

[0052] Figure 11 and 12 The figures illustrate heat dissipation and temperature performance of devices without thermally conductive connectors and devices using unidirectional thermally conductive connectors. Figure 1100 illustrates the temperature distribution of the integrated device (e.g., junction temperature distribution) and the temperature distribution of the top surface of the device (e.g., keyboard surface temperature distribution) when the thermally conductive connector is not implemented in the device. Figure 1200 illustrates the temperature distribution of the integrated device (e.g., integrated devices 270, 407, 408) (e.g., junction temperature distribution) and the temperature distribution of the top surface of the device (e.g., keyboard surface temperature distribution) when the unidirectional thermally conductive connector (e.g., 210) is implemented in the device (e.g., 200).

[0053] Graph 1100 illustrates that the junction temperature of the integrated device has risen to approximately 80 degrees Celsius within approximately 500 seconds. Conversely, as shown in Graph 1200, when a unidirectional thermally conductive connector is implemented, the junction temperature of the integrated device rises to less than 75 degrees Celsius. Graph 1100 illustrates that the top surface temperature (e.g., keyboard surface temperature) has reached 42 degrees Celsius (normal human skin temperature) within approximately 280 seconds. Conversely, as shown in Graph 1200, when a unidirectional thermally conductive connector is implemented, the top surface temperature (e.g., keyboard surface temperature) does not reach 42 degrees Celsius until at least approximately 440 seconds. With a unidirectional thermally conductive connector, the integrated device can operate without throttling until 440 seconds. At approximately 1200 seconds, the temperature of the integrated device in a device without a thermally conductive connector reaches approximately 88 degrees Celsius. Conversely, at approximately 1200 seconds, the temperature of the integrated device including a unidirectional thermally conductive connector reaches approximately 79 degrees Celsius, an improvement of 9 degrees Celsius. Furthermore, integrated devices can operate at "full speed" for longer periods before it becomes necessary to throttle them. For example, if an integrated device is configured to perform signal processing (e.g., signal processing at 5G speeds), then when implementing a unidirectional thermal conductive connector in an electronic device, the integrated device can operate for longer periods before it must be slowed down (e.g., it can process signals at 5G speeds for longer periods, which means more data transmission (throughput) capability).

[0054] Figure 12 The illustration shows that the use of a unidirectional thermal conductivity connector (e.g., 210) provides better heat dissipation for the integrated device (e.g., 202) while also reducing the rate of surface temperature rise of the device, thereby making the device more comfortable for the user.

[0055] Notice, Figures 9-12 The illustrations are merely illustrative. Different implementations can provide different results and performance in heatmaps and temperature distributions.

[0056] Exemplary sequence for manufacturing packaged unidirectional thermally conductive connectors

[0057] Figure 13 The illustration depicts an exemplary sequence for providing or manufacturing unidirectional thermally conductive connectors. In some embodiments, Figure 13 The sequence can be used to provide or manufacture the unidirectional thermal conductive connector 210 described in this disclosure.

[0058] It should be noted that Figure 13 The sequence can combine one or more stages to simplify and / or clarify the sequence used to provide or manufacture the connector. In some embodiments, the order of the processes can be changed or modified. In some embodiments, one or more processes can be replaced or substituted without departing from the spirit of this disclosure.

[0059] like Figure 13 As shown, Stage 1 illustrates the state after providing a unidirectional thermally conductive material 800. The thermally conductive material 800 can be configured to conduct heat primarily in one direction. Material 800 can be a composite material. Material 800 includes a plurality of carbon fibers aligned and / or oriented in a specific direction. Material 800 may include pitch-based carbon fibers. Material 800 can be a thermally conductive material having a high thermal conductivity value in a first direction (e.g., axial, along length) and a low thermal conductivity value in at least a second direction (e.g., radial, along width, along height). The thermally conductive material 800 may have a thermal conductivity value in the range of approximately 200-1900 watts / meter Kelvin (W / (mk)) in the first direction (e.g., axial). Material 800 can be cut into specific shapes and / or sizes as needed.

[0060] Phase 2 illustrates the state after a portion of material 800 is at least partially surrounded and / or wrapped to form a third conductive portion 216. The third conductive portion 216 can be folded, compressed, and / or bent. The third conductive portion 216 can be twisted and / or braided in a rope-like manner. A strip 1301 can be used to surround and / or wrap a portion of material 800. However, different embodiments may use different materials to surround and / or wrap the third conductive portion 216. The third conductive portion 216 may be a flexible cable (e.g., a flexible cable portion). Surrounding, wrapping, twisting, and / or braiding the third conductive portion 216 may define a first conductive portion 212 and a second conductive portion 214. The first conductive portion 212, the third conductive portion 216, and the second conductive portion 214 may be adjacent portions of a unidirectional thermal conductive connector 210.

[0061] Phase 3 illustrates the state after several components and / or materials are coupled to connector 210. Adhesive 1302a is coupled to the first conductive portion 212. Base 1304a is coupled to adhesive 1302a. Base 1304a may include rigid plastic and / or metal. Adhesive 1306a is coupled to base 1304a. Adhesive 1302b is coupled to the second conductive portion 214. Base 1304b is coupled to adhesive 1302b. Base 1304b may include rigid plastic and / or metal. Adhesive 1306b is coupled to base 1304b. The above components can be considered as part of connector 210. Bases 1304a-1304b and adhesives 1306a-1306b may be optional. In some embodiments, connector 210 may be coupled to components of an electronic device via adhesives 1302a-1302b and / or adhesives 1306a-1306b.

[0062] An exemplary flowchart of a method for coupling a unidirectional thermally conductive connector to an electronic device.

[0063] In some embodiments, manufacturing a package having an encapsulation layer with controlled undercut includes several processes. Figure 14 An exemplary flowchart of a method 1400 for coupling a unidirectional thermally conductive connector to an electronic device is illustrated. In some embodiments, Figure 14 Method 1400 can be used to couple connector 210 to electronic device 200. However, method 1400 can be used to couple connector to any device described in this disclosure.

[0064] It should be noted that Figure 14 The sequence of processes can be combined to simplify and / or clarify the method used to couple the connector to any device. In some implementations, the order of processes can be changed or modified.

[0065] This method provides (at 1405) a unidirectional thermal conductive connector (e.g., 210). Figure 13 An example of manufacturing a unidirectional thermally conductive connector is illustrated. The unidirectional thermally conductive connector may include a thermally conductive material (e.g., 800) that can be configured to conduct heat primarily in one direction. Material 800 may be a composite material. Material 800 includes a plurality of carbon fibers aligned and / or oriented in a particular direction. Material 800 may include pitch-based carbon fibers. Material 800 may be a thermally conductive material having a high thermal conductivity value in a first direction (e.g., axial, along length) and a low thermal conductivity value in at least a second direction (e.g., radial, along width, along height). The thermally conductive material 800 may have a thermal conductivity value in the range of approximately 200-1900 watts / meter Kelvin (W / (mk)) in the first direction. The connector may include a first conductive portion (e.g., 212), a second conductive portion (e.g., 214), and a third conductive portion (e.g., 216).

[0066] This method couples (at 1410) a first conductive portion (e.g., 212) of a unidirectional thermally conductive connector to a region including at least one component configured to generate heat (e.g., a heat-generating component). For example, the method may couple the first conductive portion to a region of a first device portion (e.g., 202) of an electronic device 200. Components may include integrated devices, radio frequency (RF) devices, passive devices, filters, surface acoustic wave (SAW) filters, bulk acoustic wave (BAW) filters, processors, memories, and / or combinations thereof. Adhesives may be used to couple the first conductive portion to the region and / or component. The first conductive portion may be coupled to a component of the first device portion 202 of the electronic device 200. Figure 4 and Figure 5 The illustration shows an example of where the first conductive part can be coupled.

[0067] This method couples (at 1415) a second conductive portion (e.g., 214) of a unidirectional thermally conductive connector to another region of the electronic device. For example, the method can couple the second conductive portion to a region of a second device portion (e.g., 204) of the electronic device 200. In another example, the method can couple the second conductive portion to another region of a first device portion (e.g., 202) of the electronic device 200. Adhesives can be used to couple the second conductive portion to the region and / or component. The second conductive portion can be coupled to a component of the first device portion 202 or the second device portion 204. Figure 4 and Figure 5 The illustration shows an example of where the second conductive part can be coupled.

[0068] Exemplary electronic devices

[0069] Figure 15 The illustrations depict various electronic devices that can be integrated with any of the aforementioned devices, integrated devices, integrated circuit (IC) packages, integrated circuit (IC) devices, semiconductor devices, integrated circuits, dies, interposers, packages, packages on packages (PoP), system-in-package (SiP), or systems on chips (SoC). For example, mobile phone device 1502, laptop computer device 1504, fixed-location terminal device 1506, wearable device 1508, or motor vehicle 1510 may include device 1500 as described herein. Device 1500 can be any device and / or integrated circuit (IC) package as described herein. Figure 15 The devices 1502, 1504, 1506, and 1508 shown, as well as vehicle 1510, are merely exemplary. Other electronic devices may also feature device 1500, including, but not limited to, a group of devices (e.g., electronic devices) including mobile devices, handheld personal communication system (PCS) units, portable data units such as personal digital assistants, GPS-enabled devices, navigation devices, set-top boxes, music players, video players, entertainment units, fixed location data units such as meter reading devices, communication devices, smartphones, tablet computers, computers, wearable devices (e.g., watches, glasses), Internet of Things (IoT) devices, servers, routers, electronic devices implemented in motor vehicles (e.g., autonomous vehicles), or any other device that stores or retrieves data or computer instructions, or any combination thereof.

[0070] Figures 2-8 and / or Figures 13-15One or more components, processes, features, and / or functions shown can be rearranged and / or combined into a single component, process, feature, or function, or implemented as several components, processes, or functions. Additional elements, components, processes, and / or functions may be added without departing from this disclosure. It should also be noted that... Figures 2-8 and / or Figures 13-15 The corresponding descriptions herein are not limited to dies and / or ICs. In some embodiments, Figures 2-8 and / or Figures 13-15 The descriptions and their corresponding information can be used to manufacture, create, provide, and / or produce devices and / or integrated devices. In some embodiments, a device may include a die, an integrated device, an integrated passive device (IPD), a die package, an integrated circuit (IC) device, a device package, an integrated circuit (IC) package, a wafer, a semiconductor device, a package-on-package (PoP) device, a heat dissipation device, and / or an interposer.

[0071] Note that the accompanying drawings in this invention may represent actual and / or conceptual representations of various parts, components, objects, devices, packages, integrated devices, integrated circuits, and / or transistors. In some cases, the drawings may not be drawn to scale. In some cases, not all parts and / or portions are shown for clarity. In some cases, the location, size, and / or shape of various parts and / or components in the drawings may be exemplary. In some embodiments, various parts and / or portions in the drawings may be optional.

[0072] The term “exemplary” is used herein to mean “serving as an example, instance, or illustration.” Any implementation or aspect described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other aspects of this disclosure. Similarly, the term “aspect” does not require that all aspects of this disclosure include the features, advantages, or modes of operation discussed. The term “coupling” as used herein refers to direct or indirect coupling between two objects (e.g., mechanical coupling). For example, if object A is physically in contact with object B, and object B is in contact with object C, then objects A and C can still be considered coupled to each other—even if they are not directly physically in contact. The term “electrical coupling” can mean that two objects are directly or indirectly coupled together such that current (e.g., signal, power, ground) can travel between the two objects. The two electrically coupled objects may or may not have current traveling between them. Electromagnetic coupling can mean that a signal from one circuit and / or component affects a signal from another circuit and / or component. Electromagnetic coupling can cause crosstalk. Electromagnetic coupling can be in the form of signal coupling. The use of the terms “first,” “second,” “third,” and “fourth” (and / or anything beyond the fourth) is arbitrary. Any component described can be a first component, a second component, a third component, or a fourth component. For example, a component referred to as the second component can be a first component, a second component, a third component, or a fourth component. The terms "top" and "bottom" are arbitrary. A component located at the top can be located above a component located at the bottom. A top component can be considered a bottom component, and vice versa. As described in this disclosure, a first component located "above" a second component can mean that the first component is located above or below the second component, depending on how bottom or top is arbitrarily defined. In another example, a first component can be located above (e.g., above) a first surface of a second component, and a third component can be located above (e.g., below) a second surface of a second component, where the second surface is opposite the first surface. It should also be noted that the term "above" as used in this application in the context of one component being above another component can be used to mean a component on and / or in another component (e.g., on the surface of a component or embedded in a component). Therefore, for example, a first component on a second component can mean (1) the first component is on the second component but does not directly contact the second component, (2) the first component is on the second component (e.g., on the surface of the second component), and / or (3) the first component is in the second component (e.g., embedded in the second component). The term “enclose” means that an object may partially or completely enclose another object. The term “around” means that (multiple) objects may partially or completely surround another object. The term “extend through” means that an object may partially or completely extend through another object.It should also be noted that the term “above” as used in this application in the context of one component being above another component can be used to mean a component that is on and / or in another component (e.g., on the surface of the component or embedded in the component). Thus, for example, a first component on a second component can mean (1) the first component is above the second component but does not directly contact the second component, (2) the first component is on the second component (e.g., on the surface of the second component), and / or (3) the first component is in the second component (e.g., embedded in the second component). A first component located “in” a second component can be partially or completely located in the second component. The terms “about 'value X'” or “approximately value X” as used in this disclosure mean within 10% of 'value X'. For example, a value of about 1 or approximately 1 would mean a value in the range of 0.9-1.1.

[0073] In some embodiments, an interconnect is an element or component of a device or package that allows or facilitates an electrical connection between two points, elements, and / or parts. In some embodiments, an interconnect may include traces, vias, pads, pillars, redistributed metal layers, and / or under-bump metallization (UBM) layers. An interconnect may include one or more metal components (e.g., a seed layer + metal layer). In some embodiments, an interconnect may include a conductive material configured to provide an electrical path for signals (e.g., data signals), ground, and / or power. An interconnect may be part of a circuit. An interconnect may include more than one element or component. An interconnect may be defined by one or more interconnects. Different embodiments may use different processes and / or sequences to form interconnects. In some embodiments, chemical vapor deposition (CVD), physical vapor deposition (PVD), sputtering, spraying, and / or electroplating processes may be used to form interconnects.

[0074] Furthermore, it should be noted that the various disclosures contained herein can be described as processes depicted as flowcharts, flowcharts, structure diagrams, or block diagrams. Although flowcharts can describe operations as a sequential process, many operations can be performed in parallel or simultaneously. Moreover, the order of operations can be rearranged. A process terminates when its operations are completed.

[0075] Various features of this disclosure described herein can be implemented in different systems without departing from this disclosure. It should be noted that the foregoing aspects of this disclosure are merely illustrative and should not be construed as limiting the scope of this disclosure. The description of various aspects of this disclosure is intended to be illustrative and does not limit the scope of the claims. Thus, this teaching can be readily applied to other types of devices, and many alternatives, modifications, and variations will be apparent to those skilled in the art.

Claims

1. An electronic device, comprising: A first device portion includes a region comprising a printed circuit board and components configured to generate heat, wherein the components are coupled to the printed circuit board. A second device portion, coupled to the first device portion, wherein the second device portion includes a display; and A unidirectional thermal conductive connector, (i) coupled to the component by an adhesive; (ii) Coupled to the second device portion, wherein the unidirectional thermal conductivity connector is configured to dissipate heat from the first device portion to the second device portion. The adhesive contacts the first conductive portion of the unidirectional thermal conductive connector and the component. The unidirectional heat conduction connector includes a flexible cable portion twisted and / or braided in a rope-like manner, and The unidirectional thermal conductive connector includes a thermal conductive material, which comprises a plurality of carbon fibers.

2. The electronic device of claim 1, wherein the unidirectional thermal conductive connector is configured to dissipate heat away from the first device portion and toward the second device portion.

3. The electronic device according to claim 1, wherein the heat-conducting material dissipates heat primarily along a first direction of the heat-conducting material.

4. The electronic device according to claim 3, The heat-conducting material mentioned above includes anisotropic heat-conducting materials.

5. The electronic device according to claim 4, The heat-conducting material has a high thermal conductivity value in the first direction, and The heat-conducting material has a low thermal conductivity value in at least the second direction.

6. The electronic device according to claim 5, Wherein the first direction is the axial direction of the heat-conducting material, and The second direction includes the radial direction of the heat-conducting material.

7. The electronic device of claim 4, wherein the anisotropic thermal conductive material is configured to dissipate heat primarily along a first direction of the anisotropic thermal conductive material.

8. The electronic device of claim 4, wherein the anisotropic thermal conductive material is configured to dissipate heat primarily along a first plane of the anisotropic thermal conductive material.

9. The electronic device of claim 3, wherein the thermally conductive material comprises an axial thermal conductivity value in the range of 200-1900 watts per meter Kelvin (W / (mk)).

10. The electronic device of claim 3, wherein the thermally conductive material comprises graphite.

11. The electronic device of claim 1, wherein the unidirectional thermal conductive connector is coupled to the region including the component configured to generate heat.

12. The electronic device of claim 1, wherein the first device portion and the second device portion are physically separate portions.

13. The electronic device of claim 12, wherein the first device portion and the second device portion are coupled together by at least one hinge.

14. The electronic device of claim 1, wherein the first device portion and the second device portion are consecutive portions of the electronic device.

15. The electronic device of claim 1, wherein the components include integrated devices, radio frequency (RF) devices, passive devices, filters, surface acoustic wave (SAW) filters, bulk acoustic wave (BAW) filters, processors, memories, and / or combinations thereof.

16. An apparatus for an electronic device, comprising: A first device portion includes a region comprising a printed circuit board and components configured to generate heat, wherein the components are coupled to the printed circuit board. A second device portion, coupled to the first device portion, wherein the second device portion includes a display; and Components for unidirectional heat conduction, (i) are coupled to the components by an adhesive; (ii) Coupled to the second device portion, wherein the component for unidirectional heat conduction is configured to dissipate heat from the first device portion to the second device portion. The adhesive contacts the first conductive portion of the component for unidirectional heat conduction and the component itself. The component for unidirectional heat conduction includes a flexible cable portion twisted and / or braided in a rope-like manner, and The component for unidirectional heat conduction includes a heat-conducting material comprising a plurality of carbon fibers.

17. The apparatus according to claim 16, The heat-conducting material dissipates heat through conduction along a first direction of the heat-conducting material, and At least 90% of the heat dissipated through the conduction of the heat-conducting material is dissipated along the first direction of the heat-conducting material.

18. The apparatus of claim 17, wherein the heat-conducting material comprises an axial thermal conductivity value in the range of 200-1900 watts per meter Kelvin (W / (mk)).

19. The apparatus of claim 17, wherein the apparatus is incorporated into a device selected from the group consisting of: music players, video players, entertainment units, navigation devices, communication devices, mobile devices, mobile phones, smartphones, personal digital assistants, fixed-location terminals, tablet computers, computers, wearable devices, laptop computers, servers, Internet of Things (IoT) devices, and devices in motor vehicles.

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