Power module and transformer power supply device

Abstract

The application provides a power module and a variable voltage power supply device. The power module comprises a power sub-module, a plurality of pins and a second winding unit. The power sub-module comprises a switch, a magnetic core assembly and a first winding unit. The first winding unit comprises a first winding part and a second winding part. The plurality of pins are arranged on the lower surface of the power sub-module. The second winding unit is arranged on a system board, and the second winding unit comprises a third winding part and a fourth winding part. The third winding part is connected with the first winding part through at least part of the plurality of pins to form a first winding. The fourth winding part is connected with the second winding part through at least part of the plurality of pins to form a second winding. The magnetic core assembly, the first winding and the second winding form a magnetic element. The switch is arranged on the magnetic element and is electrically connected with the magnetic element. At least one of the plurality of pins is an output terminal of the power module, and the power module supplies power to an intelligent IC load arranged on the system board through the output terminal.

Description

Technical Field

[0001] This invention relates to a power supply module, and more particularly to a power supply module and a transformer power supply device. Background Technology

[0002] With the development of industries such as the Internet, the Internet of Things, artificial intelligence, big data, and data centers, smart ICs, such as CPUs, GPUs, TPUs, and other ASIC chips used for AI data processing, are rapidly evolving. As smart ICs become increasingly feature-rich and power-hungry, the number of components on motherboards is also increasing, requiring power modules with higher power density or greater current output capacity per module. However, as the power of smart accelerator cards and servers increases, the space available for the power supply system on the system board is compressed, leading to increasingly stringent requirements for power module height.

[0003] Existing transformer-based DC-DC power modules typically use planar transformers. Planar transformers utilize PCB (printed circuit board) traces to form complete windings. After transformation and rectification, the output connection path is generally connected to the customer's system board via terminals formed by copper blocks. This results in long output connection paths, high impedance, impacting efficiency and dynamic performance, and also leads to low space utilization and insufficient power density. Furthermore, planar transformer windings are vertically wound, with magnetic posts inserted into the inner holes of the windings through assembly, and the posts fixed to the cover plate with adhesive. The current in vertically wound modules is uneven, resulting in high losses.

[0004] Therefore, the current problem to be solved is how to provide a power module that has both low height and high power density. Summary of the Invention

[0005] To address the aforementioned problems, one embodiment of the present invention provides a power supply module for supplying power to a smart IC, wherein the smart IC is mounted on a system board.

[0006] The power module includes:

[0007] A power supply submodule; including:

[0008] One switch;

[0009] A magnetic core assembly; including:

[0010] A first magnetic column; and

[0011] A second magnetic column;

[0012] A first winding unit includes:

[0013] A first winding portion is wound on the first magnetic post; and a second winding portion is wound on the second magnetic post;

[0014] Multiple pins are disposed on the lower surface of the power supply submodule; and

[0015] A second winding unit is disposed on the system board, the second winding unit comprising:

[0016] A third winding section is wound around the first magnetic post and connected to the first winding section through at least a portion of the pins of the plurality of pins to form a first winding;

[0017] A fourth winding section is wound around the second magnetic post and connected to the second winding section through at least a portion of the pins of the plurality of pins to form a second winding;

[0018] In this magnetic core assembly, at least the first winding and the second winding form a magnetic element, and the switch is disposed on the magnetic element and electrically connected to the magnetic element.

[0019] In some embodiments, at least one of the plurality of pins is an output terminal of the power module, through which the power module supplies power to the smart IC.

[0020] In some embodiments, the first winding portion includes:

[0021] A first horizontal winding is disposed above the first magnetic post; and

[0022] A first vertical winding and a second vertical winding are respectively disposed on both sides of the first magnetic post and connected to the first horizontal winding.

[0023] The second winding section includes:

[0024] A second horizontal winding is disposed above the second magnetic post; and

[0025] A third vertical winding and a fourth vertical winding are respectively disposed on both sides of the second magnetic post and connected to the second horizontal winding.

[0026] In some embodiments, the circuit further includes a first circuit board, a second circuit board, a third circuit board, and a horizontal winding circuit board. The first circuit board is located outside the first magnetic post, the second circuit board is located outside the second magnetic post, the third circuit board is located between the first magnetic post and the second magnetic post, the horizontal winding circuit board is located on the upper surface of the first magnetic post and the second magnetic post, the first vertical winding and the second vertical winding are respectively disposed on the first and third circuit boards, the third vertical winding and the fourth vertical winding are respectively disposed on the second and third circuit boards, and the first horizontal winding and the second horizontal winding are both disposed on the horizontal winding circuit board.

[0027] In some embodiments, the second vertical winding and the fourth vertical winding on the third circuit board share a section of metal conductor.

[0028] In some embodiments, the first circuit board, the third circuit board, and the horizontal winding circuit board form a first accommodating space for accommodating the first magnetic post, and the second circuit board, the third circuit board, and the horizontal winding circuit board form a second accommodating space for accommodating the second magnetic post. The first circuit board and the third circuit board are the sides of the first accommodating space, the second circuit board and the third circuit board are the sides of the second accommodating space, and the horizontal winding circuit board is the bottom surface of the first accommodating space and the second accommodating space.

[0029] In some embodiments, the first circuit board, the first magnetic post, the third circuit board, the second magnetic post, and the second circuit board form a pre-assembled assembly.

[0030] In some embodiments, a bonding layer and a plurality of conductive vias are also included. The bonding layer is attached to the top of the pre-assembled body, and the horizontal winding circuit board is disposed above the bonding layer and electrically connected to the first vertical winding, the second vertical winding, the third vertical winding and the fourth vertical winding through the plurality of conductive vias.

[0031] In some embodiments, an electronic component is also included, which is disposed on the surface of the first circuit board away from the first magnetic post, or on the surface of the second circuit board away from the second magnetic post, or on the upper surface of the horizontal winding circuit board, or the horizontal winding circuit board extends horizontally to the outside of the first magnetic post and / or the second magnetic post, and the electronic component is disposed at the extension of the lower surface of the horizontal winding circuit board.

[0032] In some embodiments, an electronic component is also included, which is embedded in the horizontal winding circuit board.

[0033] In some embodiments, a slotted circuit board is further included. The lower surface of the slotted circuit board has a first groove and a second groove. The first groove accommodates the first magnetic post, and the second groove accommodates the second magnetic post. The bottom surface of the first groove is provided with the first horizontal winding. The two sides of the first groove are respectively provided with the first vertical winding and the second vertical winding, such that the first horizontal winding, the first vertical winding, and the second vertical winding cover three sides of the first magnetic post. The bottom surface of the second groove is provided with the second horizontal winding. The two sides of the second groove are respectively provided with the third vertical winding and the fourth vertical winding, such that the second horizontal winding, the third vertical winding, and the fourth vertical winding cover three sides of the second magnetic post.

[0034] In some embodiments, the plurality of pins are disposed on the lower surface of the slotted circuit board, and the plurality of pins are electrically connected to the first vertical winding, the second vertical winding, the third vertical winding and the fourth vertical winding respectively, and the plurality of pins are electrically connected to the system board.

[0035] In some embodiments, pads are provided on the upper surface of the slotted circuit board for connecting electronic components.

[0036] In some embodiments, a first rectifier bridge and a second rectifier bridge are further included. The input of the first rectifier bridge is electrically connected to the first winding, and the input of the second rectifier bridge is electrically connected to the second winding. The outputs of the first rectifier bridge and the outputs of the second rectifier bridge are connected in parallel to a portion of the plurality of pins, and the portion of pins is connected to the load through the system board.

[0037] In some embodiments, the first winding portion includes:

[0038] A first horizontal winding is disposed above the first magnetic post; and

[0039] A second vertical winding is disposed between the first magnetic post and the second magnetic post.

[0040] The second winding section includes:

[0041] A second horizontal winding is disposed above the second magnetic post; and

[0042] A fourth vertical winding is disposed between the first magnetic post and the second magnetic post.

[0043] The third winding section includes:

[0044] A third horizontal winding is disposed below the first magnetic post; and

[0045] A first vertical winding is located to the left of the first magnetic post.

[0046] The fourth winding section includes:

[0047] A fourth horizontal winding is disposed below the second magnetic post; and

[0048] A third vertical winding is located to the right of the second magnetic post.

[0049] The system board is provided with a third groove for accommodating the first magnetic post and the second magnetic post.

[0050] In some embodiments, the first horizontal winding and the second horizontal winding are disposed on a horizontal winding circuit board, and the first vertical winding, the second vertical winding, the third vertical winding and the fourth vertical winding are all disposed on a third circuit board.

[0051] In some embodiments, the first winding portion includes:

[0052] A first horizontal winding is disposed above the first magnetic post.

[0053] The second winding section includes:

[0054] A second horizontal winding is disposed above the second magnetic post.

[0055] The third winding section includes:

[0056] A third horizontal winding is disposed below the first magnetic post; and

[0057] A first vertical winding and a second vertical winding are respectively disposed on both sides of the first magnetic post and connected to the third horizontal winding.

[0058] The fourth winding section includes:

[0059] A fourth horizontal winding is disposed below the second magnetic post; and

[0060] The third and fourth vertical windings are respectively disposed on both sides of the second magnetic post and connected to the fourth horizontal winding.

[0061] The system board is provided with a fourth groove and a fifth groove, which are used to accommodate the first magnetic post and the second magnetic post, respectively.

[0062] In some embodiments, the first horizontal winding and the second horizontal winding are disposed on a horizontal winding circuit board.

[0063] In some embodiments, a first magnetic cover plate and a second magnetic cover plate are disposed above the first magnetic post and the second magnetic post, the first magnetic cover plate and the second magnetic cover plate spanning between the first magnetic post and the second magnetic post, and the first magnetic cover plate and the second magnetic cover plate being parallel to each other.

[0064] The present invention also provides a power supply module for supplying power to a smart IC, the smart IC being mounted on a system board, the power supply module comprising:

[0065] A third power supply submodule is disposed on the upper surface of the system board, the third power supply submodule comprising:

[0066] The first switch;

[0067] A first magnetic column; and

[0068] A first winding section is wound around the first magnetic post;

[0069] A fourth power supply submodule is disposed on the lower surface of the system board and opposite to the first power supply submodule. The fourth power supply submodule includes:

[0070] A second switch;

[0071] A second magnetic column; and

[0072] A second winding section is wound around the second magnetic post;

[0073] Multiple first pins are located on the lower surface of the third power supply submodule;

[0074] Multiple second pins are located on the upper surface of the fourth power supply submodule; and

[0075] A second winding unit is disposed on the system board, the second winding unit comprising:

[0076] A third winding section; located below the first magnetic post, and connected to the first winding section through at least a portion of the plurality of first pins to form a first winding;

[0077] A fourth winding section is located above the second magnetic post and is connected to the second winding section through at least a portion of the pins of the plurality of second pins to form a second winding;

[0078] The first magnetic post, the second magnetic post, at least the first winding and the second winding form a magnetic element, and the first switch and the second switch are disposed on the magnetic element and electrically connected to the magnetic element.

[0079] In some embodiments, at least one of the plurality of first pins and the plurality of second pins is an output terminal of the power module, through which the power module supplies power to the smart IC.

[0080] In some embodiments, the first winding portion includes:

[0081] A first horizontal winding is disposed above the first magnetic post; and

[0082] A first vertical winding and a second vertical winding are respectively disposed on both sides of the first magnetic post and connected to the first horizontal winding.

[0083] The second winding section includes:

[0084] A second horizontal winding is disposed below the second magnetic post; and

[0085] A third vertical winding and a fourth vertical winding are respectively disposed on both sides of the second magnetic post and connected to the second horizontal winding.

[0086] The present invention also provides a voltage conversion device, comprising:

[0087] One power module;

[0088] A buck circuit power module, electrically connected to the power module, is used to convert the voltage provided by the power module and output it to the smart IC.

[0089] In some embodiments, the buck circuit power module and the power submodule are located on opposite sides of the system board, and the projections of the buck circuit power module and the power submodule on the system board at least partially overlap.

[0090] In some embodiments, a primary-side bridge circuit module is also included, wherein the primary-side bridge circuit module and the power supply submodule are located on opposite sides of the system board, and the projections of the primary-side bridge circuit module and the power supply submodule on the system board at least partially overlap.

[0091] In some embodiments, the power submodule and the smart IC are located on opposite sides of the system board and their projections on the system board at least partially overlap.

[0092] The beneficial effects of this invention are as follows: by integrating some windings into the system board, the height of the power module can be reduced, and the power density can be increased; the power module reduces some windings and corresponding circuit boards, and simplifies the output pins or soldering. For example, it is not necessary to use copper blocks to lead out the output pins, reducing the number of components, which can greatly simplify the structure and reduce costs; the output terminals of the power module can be directly led out from the windings in the customer's motherboard, such as the output positive Vo and output negative GND, which are electrically connected to the power input terminal of the load IC. This can reduce the impedance of the output part of the power module (such as LLC module), reduce transmission loss, and help improve system efficiency. Attached Figure Description

[0093] Figure 1 This is a schematic diagram of the power supply system according to the first embodiment of the present invention.

[0094] Figure 2 This is a schematic diagram of the bottom pads of the power supply submodule in the first embodiment.

[0095] Figure 3 This is a three-dimensional structural diagram of the power supply submodule according to the second embodiment of the present invention.

[0096] Figure 4 This is a schematic diagram showing the arrangement of components on the surface of a horizontal winding circuit board.

[0097] Figure 5 This is a schematic diagram of a power supply system according to the third embodiment of the present invention.

[0098] Figure 6 This is a schematic diagram of the bottom pads of the power module according to the third embodiment of the present invention.

[0099] Figure 7 This is a schematic diagram of the power supply system according to the fourth embodiment of the present invention.

[0100] Figure 8 A three-dimensional structural diagram of the power supply submodule in the power supply system of the fourth embodiment.

[0101] Figure 9 This is a side view of the power supply submodule in the power supply system of the fourth embodiment.

[0102] Figure 10 This is a schematic diagram of the power supply system according to the fifth embodiment of the present invention.

[0103] Figure 11 For use Figure 10 Diagram of the slotted circuit board structure of the power supply system.

[0104] Figure 12 This is a schematic diagram of the power supply system according to the sixth embodiment of the present invention.

[0105] Figure 13This is a schematic diagram of the power supply system assembly according to the seventh embodiment of the present invention.

[0106] Figure 14 This is a schematic diagram of the power supply system structure according to the seventh embodiment of the present invention.

[0107] Figure 15 This is a schematic diagram of the power supply system assembly according to the eighth embodiment of the present invention.

[0108] Figure 16 This is a schematic diagram of the power supply system structure according to the eighth embodiment of the present invention.

[0109] Figure 17 This is a schematic diagram of the power supply system assembly according to the ninth embodiment of the present invention.

[0110] Figure 18 This is a schematic diagram of the power supply system according to the ninth embodiment of the present invention.

[0111] Figure 19 for Figures 15-18 The diagram shows a three-dimensional structure of the power supply system.

[0112] Figure 20 This is a schematic diagram of the power supply system according to the tenth embodiment of the present invention.

[0113] Figure 21 This is a schematic diagram of the power supply submodule according to the eleventh embodiment of the present invention.

[0114] Figure 22 This is a schematic diagram of the power supply submodule circuit structure according to the eleventh embodiment of the present invention.

[0115] Figure 23 This is a schematic diagram of the power supply system according to the twelfth embodiment of the present invention.

[0116] Figure 24 for Figure 23 A top view of the voltage conversion device.

[0117] Figure 25 This is a schematic diagram of the power supply system according to the twelfth embodiment of the present invention.

[0118] Figure 26 This is a schematic diagram of the power supply system according to the thirteenth embodiment of the present invention.

[0119] Figure 27 This is a schematic diagram of the power supply system according to the fourteenth embodiment of the present invention.

[0120] Figure 28a This diagram illustrates a half-bridge DC-DC converter circuit.

[0121] Figure 28b This diagram illustrates a half-bridge LLC circuit.

[0122] Figure 28c Full-bridge LLC circuit.

[0123] Figure 28d This diagram illustrates an LLC circuit that incorporates an autotransformer. Detailed Implementation

[0124] Some typical embodiments embodying the features and advantages of this disclosure will be described in detail in the following description. It should be understood that this disclosure can be varied in different implementations without departing from the scope of this disclosure, and the descriptions and drawings therein are for illustrative purposes only and not for limiting the scope of this disclosure.

[0125] Figure 1 This is a schematic diagram of a power supply system according to a first embodiment of the present invention. The power supply system 100 includes a system board 46 and a power submodule 72 and a smart IC load 7 disposed on the system board 46. The power submodule 72 includes a switch 3, a magnetic core assembly 1, and a first winding unit 2A. The magnetic core assembly 1 includes a first magnetic post 11 and a second magnetic post 12. The first winding unit 2A includes a first winding portion 21A and a second winding portion 22A. A power module 300 for supplying power to the smart IC load 7 includes the power submodule 72, pins 48, and a second winding unit 2B. Pins 48 are disposed on the lower surface of the power submodule 72. The second winding unit 2B is disposed on the system board 46. The second winding unit 2B includes a third winding portion 21B and a fourth winding portion 22B. The third winding portion 21B is connected to the first winding portion 21A through at least a portion of the pins 48 to form a first winding 21. The first winding 21 is wound around the first magnetic post 11. The fourth winding section 22B is connected to the second winding section 22A via at least a portion of the pins 48 to form a second winding 22. The second winding 22 is wound around the second magnetic post 12. The magnetic core assembly 1, at least the first winding 21, and the second winding 22 form a magnetic element 200. The switch 3 is disposed on the magnetic element 200 and electrically connected to it. At least one of the multiple pins 48 is an output terminal of the power module 300, through which the power module 300 supplies power to the smart IC load 7. The first winding section 21A includes a first horizontal winding 211, a first vertical winding 212a, and a second vertical winding 212b. The first horizontal winding 211 is disposed above the first magnetic post 11. The first vertical winding 212a and the second vertical winding 212b are respectively disposed on both sides of the first magnetic post 11 and connected to the first horizontal winding 211. The second winding section 22A includes a second horizontal winding 221, a third vertical winding 222a, and a fourth vertical winding 222b. The second horizontal winding 221 is disposed above the second magnetic post 12. The third vertical winding 222a and the fourth vertical winding 222b are respectively disposed on both sides of the second magnetic post 12 and connected to the second horizontal winding 221.

[0126] The power submodule 72 has a pin 48 at the bottom. The pin 48 is soldered to the corresponding pad on the system board 46 to connect the first winding part 21A and the second winding part 22A of the power submodule 72 to the third winding part 21B and the fourth winding part 22B in the system board 46 to form a complete winding.

[0127] In this application, the intelligent IC load 7 refers to processor chips used in artificial intelligence, data centers, or big data, such as CPU (Central Processing Unit), GPU (Graphics Processing Unit), TPU (Tensor Processing Unit), or other integrated circuit ASIC (Application Specific Integrated Circuit) chips used for various specialized applications of artificial intelligence data processing, or other data processing chips used in intelligent accelerator cards.

[0128] Figure 2 This is a schematic diagram of the bottom pads of the power supply submodule in the first embodiment. (See reference) Figure 2 and combined Figure 1 The ends of the first vertical winding 212a, the second vertical winding 212b, the third vertical winding 222a, and the fourth vertical winding 222b are electrically connected to pin 48. The first winding 21 may include a first secondary winding, with pad S1 corresponding to the first secondary winding. The first winding 21 may also include a second secondary winding, with pad S2 corresponding to the second secondary winding. Further, the first winding 21 may also include a first primary winding, with pad P1 corresponding to the first primary winding. The second winding 22 may include a third secondary winding, with pad S3 corresponding to the third secondary winding. The first winding 22 may also include a fourth secondary winding, with pad S4 corresponding to the fourth secondary winding. Further, the first winding 22 may also include a second primary winding, with pad P2 corresponding to the second primary winding. The number of turns in the first and second primary windings is determined according to the turns ratio. The second secondary winding, with the first primary winding and the first secondary winding arranged alternately, and the fourth secondary winding, with the second primary winding and the third secondary winding arranged alternately, improves the current uniformity of the windings and helps improve efficiency. Additionally, the bottom of the power submodule 72 can also be equipped with a Vin pad (input circuit pad), or other signal pads (such as PWM drive signals, operating status monitoring signals, or PM bus (power management bus) signals), or other pads such as GND. Correspondingly, pads with this arrangement are set on the upper surface of the system board 46 to realize winding connections, current transmission, and signal transmission.

[0129] Figure 3This is a three-dimensional structural diagram of the power supply submodule according to a second embodiment of the present invention. (Refer to...) Figure 3 and combined Figure 1 In this embodiment, the power supply submodule 72 includes a first magnetic post 11 and a second magnetic post 12, a first circuit board 41, a second circuit board 42, a third circuit board 43, and a horizontal winding circuit board 45. The first circuit board 41 is located outside the first magnetic post 11. The second circuit board 42 is located outside the second magnetic post 12. The third circuit board 43 is located between the first magnetic post 11 and the second magnetic post 12. The horizontal winding circuit board 45 is located on the upper surfaces of the first magnetic post 11 and the second magnetic post 12. A first vertical winding 212a and a second vertical winding 212b are respectively disposed on the first circuit board 41 and the third circuit board 43. A third vertical winding 222a and a fourth vertical winding 222b are respectively disposed on the second circuit board 42 and the third circuit board 43. The first horizontal winding 211 and the second horizontal winding 221 are both disposed on the horizontal winding circuit board 45. In this embodiment, the windings are formed on the circuit board.

[0130] In this embodiment, the horizontal winding circuit board 45 includes a first portion and a second portion. The first portion of the horizontal winding circuit board 45 is located on the upper surface of the first magnetic post 11, and the second portion of the horizontal winding circuit board 45 is located on the upper surface of the second magnetic post 12. The first circuit board 41, the third circuit board 43, and the first portion of the horizontal winding circuit board 45 form a first accommodating space for accommodating the first magnetic post 11. The second circuit board 42, the third circuit board 43, and the second portion of the horizontal winding circuit board 45 form a second accommodating space for accommodating the second magnetic post 12. The third circuit board 43 is shared by both accommodating spaces. The first circuit board 41 and the third circuit board 43 are the sides of the first accommodating space. The second circuit board 42 and the third circuit board 43 are the sides of the second accommodating space. The first portion of the horizontal winding circuit board 45 is the bottom surface of the first accommodating space, and the second portion of the horizontal winding circuit board 45 is the bottom surface of the second accommodating space. The openings of both the first and second accommodating spaces face the system board.

[0131] Reference Figure 3 To accommodate as many components as possible, the horizontal winding circuit board 45 can extend horizontally, thus increasing its area. More components can be placed on the horizontal winding circuit board 45, and components such as capacitor 39a can also be placed on the lower surface of the horizontal winding circuit board 45 (i.e., the surface facing the magnetic core).

[0132] Reference Figure 4 , Figure 4This is a schematic diagram of the device layout on the surface of the horizontal winding circuit board. In this embodiment, two rows of rectifier devices 31 are arranged in the middle of the upper surface of the horizontal winding circuit board 45. The horizontal winding circuit board 45 extends horizontally to the left and right with a fly-out area, which is the area where the magnetic core assembly extends from the left and right sides of the horizontal winding circuit board 45. Primary-side switches 37, driving devices 36, or controllers 38 can be arranged in these fly-out areas. In this way, the device placement space of the power submodule 72 can be increased without increasing the area occupied by the pads on the system board 46, thereby increasing the power density and reducing the occupancy of the pad area on the system board 46, which is convenient for customer applications.

[0133] The first circuit board 41, the second circuit board 42, the third circuit board 43, and a horizontal winding circuit board 45 have pins 48, such as pads, on their end faces. (See reference...) Figure 2 and combined Figure 1 , Figure 2 This describes the pad arrangement when the power supply submodule's pads are projected onto the system board. The first pad 48-1 is located on the end face of the first circuit board 41, the second pad 48-2 is located on the end face of the second circuit board 42, and the third pad 48-3 is located on the end face of the third circuit board 43. The first pad 48-1 has a signal terminal Vcc, a power input terminal VIN, and terminals for the first winding 21 and the second winding 22. The second pad 48-2 has a ground terminal GND and terminals for the first winding 21 and the second winding 22. The third circuit board 43 between the first magnetic post 11 and the second magnetic post 12 can be formed by two independent circuit boards 43-1 and 43-2, connected by a first adhesive layer 51, thus forming a... Figure 2 The terminal arrangement of the third circuit board 43 is shown. The second vertical winding 212b and the fourth vertical winding 222b are respectively disposed on the two independent circuit boards 43-1 and 43-2. ​​The third pad 48-3 has two rows of symmetrical pad terminals. The terminals of the first winding 21 and the second winding 22 are respectively disposed on both rows of the third pad. The system board is provided with pads corresponding to the first pad 48-1, the second pad 48-2 and the third pad 48-3.

[0134] Reference Figure 5 , Figure 5 This is a schematic diagram of a power supply system according to a third embodiment of the present invention. In this embodiment, the power module and... Figure 3 The power modules shown are similar, and the same component numbers represent the same components, structures, and functions, which will not be described again here. (Refer to...) Figure 5 and combined Figure 1 and Figure 3In this embodiment, the second vertical winding 212b and the fourth vertical winding 222b between the first magnetic post 11 and the second magnetic post 12 can be integrated and reused to form a shared winding 2122, thus reducing the types and number of pads on the system board 46. Specifically, the second vertical winding 212b and the fourth vertical winding 222b on the third circuit board 43 share a common metal conductor. Power devices such as the rectifier 31 can be placed above the first magnetic post 11 or the second magnetic post 12 for easier heat dissipation. A capacitor 39, for example, as an output capacitor Co, can also be placed below the system motherboard 46. This simplifies the winding routing within the system board and facilitates customer application. The connection impedance between the capacitor and the winding is lower, increasing power density. Because the output capacitor Co can be placed on the back of the system board, the connection with the winding is tighter.

[0135] Figure 6 This is a schematic diagram of the bottom pads of the power module according to the third embodiment of the present invention. (Refer to...) Figure 6 and combined Figure 1 and Figure 3 The second vertical winding 212b and the fourth vertical winding 222b on the third circuit board 43 are shared. The third pad 48-3 on the lower end face of the third circuit board 43 is equivalent to... Figure 2 In the pad 48-3, the left and right pads P1 and P2, S1 and S3, and S2 and S4 are merged respectively. The types of pads are compared... Figure 2 The number of different types of pads can be significantly reduced. In this embodiment, the third pad 48-3 has one row of pad terminals, which simplifies the structure and process and facilitates customer applications.

[0136] Figure 7 This is a schematic diagram of the power supply system according to the fourth embodiment of the present invention. Figure 8 This is a three-dimensional structural diagram of the power supply submodule in the power supply system of the fourth embodiment. Figure 9 This is a side view of the power supply submodule in the power supply system of the fourth embodiment. In this embodiment, multiple first rectifier devices 31 can be disposed outside the first magnetic post 11 and the second magnetic post 12, thus allowing for a more compact structure. Figure 8 As shown, a first rectifier 31 is disposed on the outer side of the first circuit board 41.

[0137] Figure 10 This is a schematic diagram of the power supply system according to the fifth embodiment of the present invention. Figure 11 For use Figure 10 A diagram of the slotted circuit board structure of the power supply system. In this embodiment, the power module and... Figures 2 to 8The power modules shown are similar, and the same component labels represent the same components, structures, and functions, which will not be described again here. In this embodiment, the power module has a slotted circuit board 56. The lower surface of the slotted circuit board 56 has a first groove 561 and a second groove 562. The first groove 561 accommodates the first magnetic post 11, and the second groove 562 accommodates the second magnetic post 12. The bottom surface of the first groove 561 is provided with the first horizontal winding 211. The two sides of the first groove 561 are respectively provided with a first vertical winding 212a and a second vertical winding 212b. The first horizontal winding 211, the first vertical winding 212a, and the second vertical winding 212b cover three sides of the first magnetic post 11. The bottom surface of the second groove 562 is provided with the second horizontal winding 221. The two sides of the second groove 562 are respectively provided with a third vertical winding 222a and a fourth vertical winding 222b. The second horizontal winding 221, the third vertical winding 222a, and the fourth vertical winding 222b cover three sides of the second magnetic post 12.

[0138] The plurality of pins 48, such as pads 48-1, 48-2, and 48-3, are provided on the lower surface of the slotted circuit board 56. The plurality of pins 48 are electrically connected to the first vertical winding 212a, the second vertical winding 212b, the third vertical winding 222a, and the fourth vertical winding 222b, respectively, and the plurality of pins 48 are electrically connected to the system board 46.

[0139] Pads 50 can also be provided on the upper surface of the cut-out circuit board 56. Pads 50 are used to connect electronic devices, such as switching devices 3 or passive components. The first magnetic post 11 and the second magnetic post 12 are set in the first groove 561 and the second groove 562 to form the power submodule 72, which helps to reduce the number of components and simplifies the process, especially when the cut-out depth on the PCB is small, it has better process stability.

[0140] Figure 12 This is a schematic diagram of a power supply system according to the sixth embodiment of the present invention. In this embodiment, the power supply module and... Figures 2 to 5 , Figure 10 The power modules shown are similar, and the same component labels represent the same components, structures, and functions, which will not be described again here. In this embodiment, the first circuit board 41, the first magnetic pillar 11, the third circuit board 43, the second magnetic pillar 12, and the second circuit board 42 form a pre-assembled body 8, as shown by the dashed box in the figure.

[0141] In this embodiment, a bonding layer 51 is adhered to the top of the pre-assembled body 8. The horizontal winding circuit board 45 is disposed above the bonding layer 51, and the horizontal windings in the horizontal winding circuit board 45 are electrically connected to the vertical windings in the first circuit board 41, the third circuit board 43, and the second circuit board 42 through the plurality of conductive vias 49. For example, the horizontal winding circuit board 45 is electrically connected to the first vertical winding 212a, the second vertical winding 212b, the third vertical winding 222a, and the fourth vertical winding 222b. In this embodiment, the bonding layer 51 may be an insulating prepreg. Terminals are provided on the upper surfaces of the first circuit board 41, the third circuit board 43, and the second circuit board 42, and the terminals are electrically connected to the vertical windings inside their respective circuit boards. The horizontal winding circuit board 45 is bonded to the upper surfaces of the first circuit board 41, the third circuit board 43, and the second circuit board 42 via an insulating bonding layer 51. Multiple conductive vias 49 pass through this bonding layer, electrically connecting the horizontal winding within the horizontal winding circuit board 45 to the vertical windings on the first, third, and second circuit boards 41 and 42, respectively, to form a pre-defined winding, such as an inverted "U"-shaped winding. Pads 48-1, 48-2, and 48-3 are provided on the lower surface of the first circuit board, the second circuit board, and the third circuit board, respectively, all for soldering connections to the system board 46, thereby forming a complete winding. Through this arrangement, the power supply components are compact, small in size, highly reliable, simple to manufacture, and low in cost.

[0142] Figure 13 This is a schematic diagram of the power supply system assembly according to the seventh embodiment of the present invention. Figure 14 This is a schematic diagram of the power supply system structure according to the seventh embodiment of the present invention. In this embodiment, the power supply module and... Figures 2 to 8The power modules shown are similar, and the same component labels represent the same components, structures, and functions, which will not be described again here. In this embodiment, the power system 100A includes a system board 46A and a power submodule 72A and a smart IC load 7 disposed on the system board 46A. The power submodule 72A includes a switch 3, a first magnetic post 11, a second magnetic post 12, and a first winding unit 2A1. The first winding unit 2A1 includes a first horizontal winding 211, a second horizontal winding 221, a second vertical winding 212b, and a fourth vertical winding 222b. The power module 300A includes the power submodule 72A, pins 48, and a second winding unit 2B1. The second winding unit 2B1 includes a third vertical winding 212a, a fourth vertical winding 222a, a third horizontal winding 251, and a fourth horizontal winding 252. Here, the third horizontal winding 251 and the fourth horizontal winding 252 are horizontal windings located within the system board. The third vertical winding 212a and the fourth vertical winding 222a can be fabricated using conductive vias. The third horizontal winding 251 and the fourth horizontal winding 252 can be implemented using conductive copper layers. The system board 46A is provided with a third groove 46A1. This third groove 46A1 accommodates the first magnetic post 11 and the second magnetic post 12. The third horizontal winding 251 and the fourth horizontal winding 252 are located below the third groove 46A1. The third horizontal winding 251 is located below the first magnetic post 11. The fourth horizontal winding 252 is located below the second magnetic post 12. In this embodiment, the first magnetic post 11 and the second magnetic post 12 are arranged parallel to each other on the same plane, and the first magnetic post 11 and the second magnetic post 12 are placed parallel to each other within the third groove 46A1.

[0143] Reference Figure 13 The first vertical winding 212a and the third vertical winding 222a are located on the left and right sides of the third groove 46A1. The second vertical winding 212b and the fourth vertical winding 222b are disposed on the third circuit board 43. The first horizontal winding 211 and the second horizontal winding 221 are disposed on the horizontal winding circuit board 45A.

[0144] A horizontal winding circuit board 45A has multiple pins 48 on the side facing the system board 46A. These pins 48 correspond to the second vertical winding 212b, the fourth vertical winding 222b, the first vertical winding 212a, and the third vertical winding 222a. A power submodule 72A is positioned above the system board 46A. The windings within the power submodule 72A are soldered to the windings of the system board 46A via corresponding pins 48 to form complete windings. For example, the first horizontal winding 211 is connected to the first vertical winding 212a, the third horizontal winding 251, and the second vertical winding 212b via pins 48 to form a complete first winding 21. Embedding the power submodule 72A within the system board 46A further reduces the height of the power module.

[0145] Figure 15This is a schematic diagram of the power supply system assembly according to the eighth embodiment of the present invention. Figure 16 This is a schematic diagram of the power system structure according to the eighth embodiment of the present invention. In this embodiment, the power module and... Figures 2 to 8 The power modules shown are similar, and the same component labels represent the same components, structures, and functions, which will not be described again here. In this embodiment, refer to... Figure 15 The system board 46B has a fourth groove 46B1 and a fifth groove 46B2. The fourth groove 46B1 accommodates the first magnetic post 11, and the fifth groove 46B2 accommodates the second magnetic post 12. The power system 100B includes a power submodule 72B, which is embedded in the system board 46B. The power submodule 72B includes a switch 3, a magnetic core assembly 1, and a first winding unit 2A2. The first winding unit 2A2 includes a first horizontal winding 211 and a second horizontal winding 221. The power module 300B includes the power submodule 72B, pins 48, and a second winding unit 2B2. The second winding unit 2B2 includes a first vertical winding 212a, a second vertical winding 212b, a third vertical winding 222a, a fourth vertical winding 222b, a third horizontal winding 251, and a fourth horizontal winding 252.

[0146] The first vertical winding 212a, the second vertical winding 212b, the third vertical winding 222a, the fourth vertical winding 222b, the third horizontal winding 251, and the fourth horizontal winding 252 are located within the system board 46B. The first horizontal winding 211 and the second horizontal winding 221 are located on the horizontal winding circuit board 45B. The second vertical winding 212b and the fourth vertical winding 222b are located between the fourth recess 46B1 and the fifth recess 46B2. The third horizontal winding 251 and the fourth horizontal winding 252 are located below the first magnetic post 11 and the second magnetic post 12, respectively. The second vertical winding 212b and the fourth vertical winding 222b are located between the first magnetic post 11 and the second magnetic post 12. The second vertical winding 212b is located to the right of the first magnetic post 11. The fourth vertical winding 222b is located to the left of the second magnetic post 12.

[0147] Multiple pins 48 are arranged on the side of the horizontal winding circuit board 45B facing the system board 46B. Pins 48 correspond to the first vertical winding 212a, the second vertical winding 212b, the third vertical winding 222a, and the fourth vertical winding 222b. All pins 48 are located on the surface of the horizontal winding circuit board 45B. This structure allows all pins 48 of the power supply submodule 72B to be coplanar, i.e., all located on the horizontal winding circuit board 45B. The corresponding pads on the system board 46B can also be coplanar with the pads of other components on the system board, such as the smart load IC 7, making soldering more convenient.

[0148] The first magnetic post 11 and the second magnetic post 12 are respectively embedded in the first groove 561 and the second groove 562. The power submodule 72B is set on the system board 46B. The winding in the power submodule 72B is welded to the winding of the system board 46B through the corresponding pin 48 to form a complete winding.

[0149] Figure 17 This is a schematic diagram of the power supply system assembly according to the ninth embodiment of the present invention. Figure 18 This is a schematic diagram of the power supply system according to the ninth embodiment of the present invention. In this embodiment, the power module and... Figures 2 to 8 The power modules shown are similar, and the same component numbers represent the same components, structures, and functions, which will not be described again here. In this embodiment, as... Figure 17 As shown, the system board 46C of the power system 100C is provided with a first through-hole slot 46C1 and a second through-hole slot 46C2, which penetrate the system board 46C. The first through-hole slot 46C1 accommodates the first magnetic post 11, and the second through-hole slot 46C2 accommodates the second magnetic post 12. The power module 300C includes a first power submodule 72B, a second power submodule 73A, pins 48, and a second winding unit 2B2. The first power submodule 72B includes a switch 3, a magnetic core assembly 1, a first horizontal winding 211, and a second horizontal winding 221. The second winding unit 2B2 includes a first vertical winding 212a, a second vertical winding 212b, a third vertical winding 222a, and a fourth vertical winding 222b. The second power submodule 73A includes a switch 3A, pins 48A, a third horizontal winding 251, and a fourth horizontal winding 252. The first vertical winding 212a, the second vertical winding 212b, the third vertical winding 222a, and the fourth vertical winding 222b are disposed within the system board 46B. The first horizontal winding 211 and the second horizontal winding 221 are disposed on the horizontal winding circuit board 45C. The third horizontal winding 251 and the fourth horizontal winding 252 are disposed on a fourth circuit board 25. The first power submodule 72B is located above the system board 46B, and the second power submodule 73A is located below the system board 46B, with the first power submodule 72B and the second power submodule 73A corresponding vertically. The fourth circuit board 25 has multiple pins 48A on the side facing the system board 46. The first power submodule 72B is soldered to the upper surface of the system board 46C through the pins 48, and the second power submodule 73A is soldered to the lower surface of the system board 46C through the pins 48A, so that the windings in the first power submodule 72B and the second power submodule 73A are electrically connected to the windings in the system board.

[0150] The first magnetic post 11 and the second magnetic post 12 of the first power submodule 72B are respectively embedded in the first through-hole slot 46C1 and the second through-hole slot 46C2. The second power submodule 73A is installed below the first magnetic post 11 and the second magnetic post 12, as shown below. Figure 18 As shown. This structure can further reduce the height of the power module protruding on one side of the system board 46C and simplify the structure of the windings inside the system board 46C. For example, only the vertical windings need to be fabricated. In addition, switching devices can be placed on the upper and lower sides of the first magnetic pillars 11 and 12, allowing for more flexible arrangement of the switching devices and facilitating the distributed arrangement of devices and windings. This also helps reduce connection losses and facilitates heat dissipation for switches 3 and 3A.

[0151] Figure 19 for Figures 15-18 The diagram shows a three-dimensional structure of the power supply system. A first magnetic cover plate 18 and a second magnetic cover plate 19 are disposed above the first magnetic post 11 and the second magnetic post 12. The first magnetic cover plate 18 and the second magnetic cover plate 19 span between the first magnetic post 11 and the second magnetic post 12, and are parallel to each other. The first magnetic cover plate 18 and the second magnetic cover plate 19 connect with the first magnetic post 11 and the second magnetic post 12 above them to form a magnetic circuit. This allows the first magnetic cover plate 18 and the second magnetic cover plate 19 to be removed from the system board 46C, reducing the slot area of ​​the system board 46C, increasing the strength of the system board 46C, or facilitating customer applications.

[0152] Figure 20 This is a schematic diagram of a power supply system according to the tenth embodiment of the present invention. In this embodiment, the power supply module and... Figures 2 to 8The power modules shown are similar, and the same component labels represent the same components, structures, and functions, which will not be described again here. In this embodiment, the intelligent IC load 7 is disposed on a system board 46D. The power module includes a third power submodule 72C, a fourth power submodule 72D, multiple first pins 48B, multiple second pins 48C, and a second winding unit 2B3. The third power submodule 72C is disposed on the upper surface of the system board 46D. The fourth power submodule 72D is disposed on the lower surface of the system board 46D and is disposed opposite to the third power submodule 72C. The third power submodule 72C includes a first switch 3B, a first magnetic post 11, and a first winding portion 21A2. The first winding portion 21A2 is wound around the first magnetic post 11. Multiple first pins 48B are disposed on the lower surface of the third power submodule 72C. The fourth power submodule 72D includes a second switch 3C, a second magnetic post 12, and a second winding portion 22A1. The second winding portion 22A1 is wound around the second magnetic post 12. Multiple second pins 48C are located on the upper surface of the fourth power submodule 72D. A second winding unit 2B3 is disposed on the system board 46D. The second winding unit 2B3 includes a third winding portion 251 and a fourth winding portion 252. The third winding portion 251 is located below the first magnetic post 11 and is connected to the first winding portion 21A2 via at least a portion of the multiple first pins 48B to form a first winding 21. The fourth winding portion 252 is located above the second magnetic post and is connected to the second winding portion 22A1 via at least a portion of the multiple second pins 48 to form a second winding 22. The first magnetic post 11, the second magnetic post 12, and at least the first winding 21 and the second winding 22 form a magnetic element. The first switch 3B and the second switch 3C are disposed on and electrically connected to the magnetic element 200A. The first winding portion 21A2 includes a first vertical winding 212a, a second vertical winding 212b, and a first horizontal winding 211. The second winding section 22A1 includes a third vertical winding 222a, a fourth vertical winding 222b, and a second horizontal winding 221.

[0153] The third power supply submodule 72C and the fourth power supply submodule 72D can adopt the same structure, reducing the types of power supply submodules and simplifying their structure. The output of the power supply module that supplies power to the intelligent IC load 7 can be set on the system board 46D, which is located between the third power supply submodule 72C and the fourth power supply submodule 72D, making the output more symmetrical and improving output efficiency.

[0154] Figure 21 This is a schematic diagram of the power supply submodule according to the eleventh embodiment of the present invention. Figure 22This is a schematic diagram of the power supply submodule circuit structure according to the eleventh embodiment of the present invention. The power module in this embodiment includes two identical power supply submodules, namely a first power supply submodule 72-1 and a second power supply submodule 72-2. The structures of the first power supply submodule 72-1 and the second power supply submodule 72-2 are completely identical to those of the power supply submodule 72 in the first embodiment. Of course, the power supply submodules can be those from the seventh to tenth embodiments. The number of power supply submodules is not limited to two. See also... Figure 21 Multiple vertical winding circuit boards are connected to the same horizontal winding circuit board 45, enabling the integration of multiple power supply sub-modules, such as the first power supply sub-module 72-1 and the second power supply sub-module 72-2. Multiple power supply modules operate in parallel, increasing power output while maintaining a compact structure and reducing the space occupied by the system board 46. This further reduces module height and volume, facilitates power expansion, and allows for flexible application.

[0155] Reference Figure 22Multiple power supply submodules are mounted on the system board 46E, such as the first power supply submodule 72-1 and the first power supply submodule 72-2. The first power supply submodules 72-1 and 72-2 are soldered onto the system board 46E. Each power supply submodule has a primary winding and a secondary winding. Taking the first power supply submodule 72-1 and the second power supply submodule 72-2 as examples: The first power supply submodule 72-1 includes a first magnetic post 11-1 and a second magnetic post 12-1. The primary winding 23-A1 is wound on the first magnetic post 11-1, and the primary winding 23-B1 is wound on the second magnetic post 12-1. The first power supply submodule 72-2 has a first magnetic post 11-2 and a second magnetic post 12-2. The primary winding 23-A2 is wound on the first magnetic post 11-2, and the primary winding 23-B2 is wound on the second magnetic post 12-2. The lower ends of primary windings 23-A1, 23-B1, 23-A2, and 23-B2 are all equipped with terminals for electrical connection to system board 46E. The lower end of primary winding 23-A1 has primary terminals 48a1 and 48b1. The lower end of primary winding 23-B1 has primary terminals 48c1 and 48d1. The lower end of primary winding 23-A2 has primary terminals 48a2 and 48b2. The lower end of primary winding 23-B2 has primary terminals 48c2 and 48d2. These primary terminals of the primary windings are used for electrical connection to system board 46E. The first power submodule 72-1 also includes a secondary winding 24-1. The second power submodule 72-2 also includes a secondary winding 24-2. When the secondary winding uses half-bridge full-wave rectification, corresponding switching devices are installed on the secondary winding as shown in the figure. Secondary winding 24-1 is wound around the first magnetic post 11-1 and the second magnetic post 12-1. Secondary winding 24-2 is wound around the first magnetic post 11-2 and the second magnetic post 12-2. Secondary terminals Vo1 and GND1 are located below secondary winding 24-1. Secondary terminals Vo2 and GND2 are located below secondary winding 24-2. The primary terminals 48b1 and 48d1 of the first power submodule 72-1 are electrically connected via system board 46E. The primary terminal 48c1 of the first power submodule 72-1 is electrically connected to the primary terminal 48b2 of the second power submodule 72-2. The primary terminals 48a2 and 48d2 of the first power submodule 72-2 are electrically connected. The primary terminals 48a1 of the first power submodule 72-1 and 48d2 of the second power submodule 72-2 are connected to the primary bridge circuit via terminals V1 and V2 in system board 46E. Terminals V1 and V2 represent the electrical connection points between two lines in the primary AC circuit and the primary bridge circuit. The primary windings in the first power supply submodule 72-1 and the second power supply submodule 72-2 are connected in series through conductive lines in the system board 46E. In this embodiment, the primary windings 23-A1 and 23-B1 in the first power supply submodule 72-1 are connected in series through the connection of the system board 46E.Similarly, the primary windings 23-A2 and 23-B2 in the second power submodule 72-2 are connected in series via the system board 46E. The primary windings of the two power submodules are connected in series via the system board 46E to form a 4-turn primary winding. The secondary windings of the two power submodules can be connected in parallel for output. For example, the secondary windings in each power submodule can form a complete winding in the power submodule and form secondary terminals Vo1, Vo2, GND1, and GND2. Of course, in other embodiments, the secondary windings can also form a complete winding through the conductive lines in the system board 46E. For example, the secondary terminal Vo1 of the first power submodule 72-1 and the secondary terminal Vo2 of the second power submodule 72-2 are connected in parallel via the system board 46E. The secondary terminal GND1 of the first power submodule 72-1 and the secondary terminal GND2 of the second power submodule 72-2 are connected in parallel via the system board 46E, and then the intelligent IC load 7 (not shown in the figure) is powered through the system board 46E. This method allows for different transformation ratios to be achieved by connecting the primary windings of multiple power supply submodules in series on the system board 46E, enabling flexible adjustments to meet various transformation requirements. For example, to transform from 48V to 12V, two power supply submodules can be connected in series on their primary windings, as shown in the diagram. Each primary winding submodule contains two primary windings, forming a 4:1 transformation ratio. To transform from 48V to 6V, three such power supply submodules can be connected in series on their primary windings via the system board 46E to form an 8:1 transformation ratio. In other words, using a single standard module, multiple different transformation ratios can be achieved, flexibly meeting various needs, and reducing the number of winding turns in each power supply submodule, simplifying the structure.

[0156] Figure 23 This is a schematic diagram of the power supply system according to the twelfth embodiment of the present invention. Figure 23 The power system shown also includes a buck circuit power module 75, which is electrically connected to the power module to form a voltage conversion device. The buck circuit power module 75 is used to convert the voltage provided by the power module and output it to the smart IC load 7. The buck circuit power module 75 and the power sub-module 72 are located on opposite sides of the system board 46. The projections of the buck circuit power module and the power sub-module 72 on the system board 46 at least partially overlap. This allows the output current of the power sub-module 72 to be directly transmitted to the buck circuit power module 75 through the conductive vias of the system board 46, and then the buck circuit power module 75 converts the voltage and transmits it to the smart IC load 7 through the system board 46. When the output voltage of the buck circuit power module 75 is low, the transmission impedance from the power sub-module 72 to the buck circuit power module 75 can be significantly reduced, improving system efficiency, and the structure is compact, occupying little space on the system board 46.

[0157] Reference Figure 24 , Figure 24 for Figure 23 A top view of the voltage conversion device. Figure 24 In this configuration, one power submodule 72 can drive three buck circuit power modules 75, with the specific number determined based on the power matching requirements.

[0158] Reference Figure 25 , Figure 25 This is a schematic diagram of the power supply system according to the thirteenth embodiment of the present invention. Figure 25 The power module also includes a first rectifier bridge 52 and a second rectifier bridge 53. The input of the first rectifier bridge 52 is electrically connected to the first winding, and the input of the second rectifier bridge 53 is electrically connected to the second winding. The outputs of the first rectifier bridge 52 and the second rectifier bridge 53 are connected in parallel to a portion of the plurality of pins 48, which are connected to the load 7 via the system board 46. If the rectifier device 31 is positioned above the first magnetic post 11, the two output pins Vo and GND of the first rectifier bridge 52 and the second rectifier bridge 53 are respectively led to pins 48 on the lower surface of the power submodule 72 via separate lines and electrically connected to the system board 46 by soldering. The current transmitted by the power submodule 72 is processed by the buck circuit power module 75 and then transmitted to the smart IC load 7 via the system board 46.

[0159] Reference Figure 26 , Figure 26 This is a schematic diagram of the power supply system according to the fourteenth embodiment of the present invention. Figure 26 The power supply system shown also includes a primary-side bridge circuit 76. The power submodule 72 and the smart IC load 7 are located on the same side of the system board 46. The primary-side bridge circuit 76 and the power submodule 72 are located on opposite sides of the system board 46, and their projections on the system board 46 at least partially overlap. This allows for a more compact power submodule 72 and a shorter AC connection path between the primary-side bridge circuit 76 and the power submodule 72, for example, through a via-type connection bus 85 in the system board 46. This reduces connection impedance and minimizes interference from the AC connection line to the smart IC load 7 or other signal lines on the system board 46. The primary-side bridge circuit 76 can be referenced... Figures 28a to 28d Specifically, this may include a transformer primary-side half-bridge or full-bridge circuit such as an LLC circuit. For example, it could be formed by discrete GaN modules mounted on system board 46, or it could include components such as switch driver chips and resonant capacitors in the primary-side bridge circuit. The primary-side bridge circuit 76 can also form a primary-side bridge circuit module, reducing size or facilitating application.

[0160] Reference Figure 27 , Figure 27This is a schematic diagram of the power supply system according to the fourteenth embodiment of the present invention. Figure 27 The power system shown and Figure 26 The difference in the power supply system shown is that the power supply submodule 72 and the smart IC load 7 are located on opposite sides of the system board 46, and their projections on the system board 46 at least partially overlap, enabling the power supply submodule 72 to vertically supply power to the smart IC load 7. The primary-side bridge circuit module 76 can be located on the same side of the system board 46 as the smart IC load 7. The second winding unit 2B (such as...) can be used... Figure 27 The area enclosed by the double-dotted square shown in the diagram is directly electrically connected to the input terminal of the intelligent IC load 7, resulting in low connection impedance and high transmission efficiency. A buck-boost circuit can be integrated within the original side bridge circuit module 76 to form a voltage regulation and AC generation circuit module, which is electrically connected to the power supply submodule 72 via the AC connection bus 85.

[0161] Figures 28a to 28d Some typical application circuits are illustrated, but not limited to these circuits. Figure 28a This diagram illustrates a half-bridge LLC circuit. Figure 28b This illustrates another type of half-bridge LLC circuit. Figure 28c This diagram illustrates a full-bridge LLC circuit. Figure 28d This diagram illustrates an LLC circuit incorporating an autotransformer. In the figure, 31-32 represent rectifier components, Q1 to Q4 represent primary-side bridge circuit switching devices, TR represents the transformer (magnetic component), Co represents the output capacitor, Cin represents the input capacitor, Lr represents the resonant inductor, and Cr represents the resonant capacitor. Furthermore, the structure of this invention can also be applied to Cuk circuits or flyback circuits, etc.

[0162] Figure 28a The diagram illustrates that the primary bridge circuit 76 includes a half-bridge circuit formed by Q1 and Q2, and may also include an input capacitor, or the part to the left of the transformer TR may also be the primary bridge circuit 76.

[0163] In summary, the power module according to the present invention, by integrating part of the windings into the system board, can reduce the height of the power module and increase power density. The direct formation of some windings on the system board not only simplifies the winding structure of the power submodule 72 but also simplifies the connection method of the output pins or to the system board; for example, it eliminates the need for copper blocks to lead out the output pins. Reducing the number of components significantly simplifies the structure. Output pins can be directly led out from the windings within the system board and electrically connected to the power input terminal of the intelligent IC load, thus reducing output impedance, decreasing transmission loss, and improving system efficiency. The power module according to the present invention further simplifies system design, thereby further reducing the size and cost of the system or device.

[0164] The foregoing description of numerous embodiments enables those skilled in the art to clearly understand the form of this specification. Those skilled in the art will understand that they can utilize the disclosure of this invention to design or modify other processes and structures to achieve the same objectives and / or advantages as the above embodiments. Those skilled in the art will also understand that equivalent constructions without departing from the spirit and scope of this invention can be arbitrarily modified, substituted, and refined without departing from the spirit and scope of this invention.

Claims

1. A power supply module for supplying power to a smart IC, the smart IC being mounted on a system board. The power module includes: One power supply submodule; include: One switch; A magnetic core assembly; including: A first magnetic column; and A second magnetic column; A first winding unit includes: A first winding section, wound on the first magnetic post; and A second winding section; wound on the second magnetic post; Multiple pins are located on the lower surface of the power supply submodule; and A second winding unit is disposed on the system board, the second winding unit comprising: A third winding section is wound around the first magnetic post and connected to the first winding section through at least a portion of the pins of the plurality of pins to form a first winding; A fourth winding section is wound around the second magnetic post and connected to the second winding section through at least a portion of the pins of the plurality of pins to form a second winding; In this magnetic core assembly, at least the first winding and the second winding form a magnetic element, and the switch is disposed on the magnetic element and electrically connected to the magnetic element.

2. The power module of claim 1, wherein, At least one of the plurality of pins is an output terminal of the power module, through which the power module supplies power to the smart IC.

3. The power module as described in claim 1, characterized in that, The first winding section includes: A first horizontal winding is disposed above the first magnetic post; and A first vertical winding and a second vertical winding are respectively disposed on both sides of the first magnetic post and connected to the first horizontal winding. The second winding section includes: A second horizontal winding is disposed above the second magnetic post; and A third vertical winding and a fourth vertical winding are respectively disposed on both sides of the second magnetic post and connected to the second horizontal winding.

4. The power module of claim 3, wherein, It also includes a first circuit board, a second circuit board, a third circuit board, and a horizontal winding circuit board. The first circuit board is located outside the first magnetic post, the second circuit board is located outside the second magnetic post, the third circuit board is located between the first magnetic post and the second magnetic post, the horizontal winding circuit board is located on the upper surface of the first magnetic post and the second magnetic post, the first vertical winding and the second vertical winding are respectively disposed on the first and third circuit boards, the third vertical winding and the fourth vertical winding are respectively disposed on the second and third circuit boards, and the first horizontal winding and the second horizontal winding are both disposed on the horizontal winding circuit board.

5. The power module of claim 4, wherein, The second and fourth vertical windings on the third circuit board share a section of metal conductor.

6. The power module as described in claim 4, characterized in that, The first circuit board, the third circuit board, and the horizontal winding circuit board form a first accommodating space for accommodating the first magnetic post, and the second circuit board, the third circuit board, and the horizontal winding circuit board form a second accommodating space for accommodating the second magnetic post. The first circuit board and the third circuit board are the sides of the first accommodating space, the second circuit board and the third circuit board are the sides of the second accommodating space, and the horizontal winding circuit board is the bottom surface of the first accommodating space and the second accommodating space.

7. The power module as described in claim 4, characterized in that, The first circuit board, the first magnetic post, the third circuit board, the second magnetic post, and the second circuit board form a pre-assembled body.

8. The power module as described in claim 7, characterized in that, It also includes a bonding layer and multiple conductive vias. The bonding layer is attached to the top of the pre-assembled body. The horizontal winding circuit board is disposed above the bonding layer and is electrically connected to the first vertical winding, the second vertical winding, the third vertical winding and the fourth vertical winding through the multiple conductive vias.

9. The power module as described in claim 4, characterized in that, It also includes an electronic component disposed on the surface of the first circuit board away from the first magnetic post, or on the surface of the second circuit board away from the second magnetic post, or on the upper surface of the horizontal winding circuit board, or the horizontal winding circuit board extending horizontally to the outside of the first magnetic post and / or the second magnetic post, with the electronic component disposed at the extension of the lower surface of the horizontal winding circuit board.

10. The power module as described in claim 4, characterized in that, It also includes an electronic component embedded in the horizontal winding circuit board.

11. The power module as described in claim 3, characterized in that, It also includes a slotted circuit board, the lower surface of which has a first groove and a second groove. The first groove accommodates the first magnetic post, and the second groove accommodates the second magnetic post. The bottom surface of the first groove is provided with the first horizontal winding, and the two sides of the first groove are respectively provided with the first vertical winding and the second vertical winding, such that the first horizontal winding, the first vertical winding, and the second vertical winding cover the three sides of the first magnetic post. The bottom surface of the second groove is provided with the second horizontal winding, and the two sides of the second groove are respectively provided with the third vertical winding and the fourth vertical winding, such that the second horizontal winding, the third vertical winding, and the fourth vertical winding cover the three sides of the second magnetic post.

12. The power module as described in claim 11, characterized in that, The plurality of pins are disposed on the lower surface of the slotted circuit board. The plurality of pins are electrically connected to the first vertical winding, the second vertical winding, the third vertical winding and the fourth vertical winding respectively, and the plurality of pins are electrically connected to the system board.

13. The power module as described in claim 11, characterized in that, A solder pad is provided on the upper surface of the slotted circuit board, and the solder pad is used to connect electronic components.

14. The power module as described in claim 1, characterized in that, It also includes a first rectifier bridge and a second rectifier bridge. The input of the first rectifier bridge is electrically connected to the first winding, and the input of the second rectifier bridge is electrically connected to the second winding. The outputs of the first rectifier bridge and the outputs of the second rectifier bridge are connected in parallel to a portion of the plurality of pins. The portion of the pins is connected to the smart IC through the system board.

15. The power module as described in claim 1, characterized in that, The first winding section includes: A first horizontal winding is disposed above the first magnetic post; and A second vertical winding is disposed between the first magnetic post and the second magnetic post. The second winding section includes: A second horizontal winding is disposed above the second magnetic post; and A fourth vertical winding is disposed between the first magnetic post and the second magnetic post. The third winding section includes: A third horizontal winding is disposed below the first magnetic post; and A first vertical winding is located to the left of the first magnetic post. The fourth winding section includes: A fourth horizontal winding is disposed below the second magnetic post; and A third vertical winding is located to the right of the second magnetic post. The system board is provided with a third groove for accommodating the first magnetic post and the second magnetic post.

16. The power module as described in claim 15, characterized in that, The first horizontal winding and the second horizontal winding are disposed on a horizontal winding circuit board, and the first vertical winding, the second vertical winding, the third vertical winding and the fourth vertical winding are all disposed on a third circuit board.

17. The power module as described in claim 1, characterized in that, The first winding section includes: A first horizontal winding is disposed above the first magnetic post. The second winding section includes: A second horizontal winding is disposed above the second magnetic post. The third winding section includes: A third horizontal winding is disposed below the first magnetic post; and A first vertical winding and a second vertical winding are respectively disposed on both sides of the first magnetic post and connected to the third horizontal winding. The fourth winding section includes: A fourth horizontal winding is disposed below the second magnetic post; and The third and fourth vertical windings are respectively disposed on both sides of the second magnetic post and connected to the fourth horizontal winding. The system board is provided with a fourth groove and a fifth groove, which are used to accommodate the first magnetic post and the second magnetic post, respectively.

18. The power module as described in claim 17, characterized in that, The first horizontal winding and the second horizontal winding are disposed on a horizontal winding circuit board.

19. The power module as described in claim 18, characterized in that, A first magnetic cover plate and a second magnetic cover plate are provided above the first magnetic column and the second magnetic column. The first magnetic cover plate and the second magnetic cover plate span between the first magnetic column and the second magnetic column, and the first magnetic cover plate and the second magnetic cover plate are parallel to each other.

20. A power supply module for supplying power to a smart IC, characterized in that, The smart IC is mounted on a system board, and the power module includes: A third power supply submodule is disposed on the upper surface of the system board, the third power supply submodule comprising: The first switch; A first magnetic column; and A first winding section is wound around the first magnetic post; A fourth power supply submodule is disposed on the lower surface of the system board and is positioned opposite to the third power supply submodule. The fourth power supply submodule includes: A second switch; A second magnetic column; and A second winding section is wound around the second magnetic post; Multiple first pins are located on the lower surface of the third power supply submodule; Multiple second pins are located on the upper surface of the fourth power supply submodule; and A second winding unit is disposed on the system board, the second winding unit comprising: A third winding section; located below the first magnetic post, and connected to the first winding section through at least a portion of the plurality of first pins to form a first winding; A fourth winding section is located above the second magnetic post and is connected to the second winding section through at least a portion of the pins of the plurality of second pins to form a second winding; The first magnetic post, the second magnetic post, at least the first winding and the second winding form a magnetic element, and the first switch and the second switch are disposed on the magnetic element and electrically connected to the magnetic element.

21. The power module as described in claim 20, characterized in that, At least one of the plurality of first pins and the plurality of second pins is an output terminal of the power module, through which the power module supplies power to the smart IC.

22. The power module as described in claim 21, characterized in that, The first winding section includes: A first horizontal winding is disposed above the first magnetic post; and A first vertical winding and a second vertical winding are respectively disposed on both sides of the first magnetic post and connected to the first horizontal winding. The second winding section includes: A second horizontal winding is disposed below the second magnetic post; and A third vertical winding and a fourth vertical winding are respectively disposed on both sides of the second magnetic post and connected to the second horizontal winding.

23. A voltage conversion device, comprising: A power module as described in claims 1-14; A buck circuit power module, electrically connected to the power module, is used to convert the voltage provided by the power module and output it to the smart IC.

24. The voltage conversion device as claimed in claim 23, characterized in that, The buck circuit power module and the power submodule are located on opposite sides of the system board, and the projections of the buck circuit power module and the power submodule on the system board at least partially overlap.

25. The voltage conversion device as claimed in claim 23, characterized in that, It also includes a primary-side bridge circuit module, which and the power supply submodule are located on opposite sides of the system board, and the projections of the primary-side bridge circuit module and the power supply submodule on the system board at least partially overlap.

26. The voltage conversion device as claimed in claim 25, characterized in that, The power submodule and the smart IC are on opposite sides of the system board and their projections on the system board at least partially overlap.

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