Device and method for detecting and eliminating dead pixels

Abstract

This invention provides a defective pixel detection and removal apparatus and a defective pixel detection and removal method. The defective pixel detection and removal apparatus includes an removal unit, an image acquisition unit, and a judgment unit. The removal unit is used to remove at least one defective micro-element on a substrate. The image acquisition unit is used to acquire a detection image corresponding to the at least one defective micro-element on the substrate. The judgment unit is coupled to the image acquisition unit and the removal unit. Before the removal unit removes the defective micro-element, the image acquisition unit acquires a first detection image, and after the removal unit removes the defective micro-element, it acquires a second detection image. The judgment unit determines whether the defective micro-element has been removed based on the first and second detection images acquired from the image acquisition unit.

Description

Technical Field

[0001] This invention relates to a detection device and method, and more particularly to a defect detection and elimination device and method. Background Technology

[0002] With advancements in semiconductor technology, electronic components can be made smaller and smaller, resulting in the manufacture of microelectronic components, such as micro light-emitting diodes (LEDs). Taking the process of manufacturing a micro LED display as an example, micro LEDs can be grown on a growth substrate, then transferred from the growth substrate to a temporary substrate, and finally transferred from the temporary substrate to a display backplane (i.e., the target substrate). Multiple micro LEDs are arranged in an array on the display backplane to form the pixel array of the display.

[0003] Before transferring microelectronic components from a temporary substrate to a target substrate, it is typically necessary to inspect the temporary substrate for damaged or defective components and remove any damaged or defective ones. In existing technology, the machine for inspecting the temporary substrate and the machine for removing the microelectronic components are two different machines. Therefore, after removing the microelectronic components, the temporary substrate must be moved to the inspection machine to verify that the microelectronic components have been successfully removed. If the inspection result indicates unsuccessful removal, the temporary substrate must be moved back to the removal machine to remove the microelectronic components, and then moved back to the inspection machine for another inspection, repeating this process until the inspection machine confirms that the microelectronic components have been successfully removed. However, the process of moving the temporary substrate between machines is time-consuming and detrimental to the mass production of electronic devices with microelectronic components (such as miniature LED displays). Summary of the Invention

[0004] This invention relates to a defect detection and elimination device, which can effectively shorten working time.

[0005] This invention relates to a method for detecting and eliminating defective pixels, which can effectively shorten working time.

[0006] An embodiment of the present invention provides a defective pixel detection and removal device, including a removal unit, an image acquisition unit, and a judgment unit. The removal unit is used to remove at least one defective micro-element on a substrate. The image acquisition unit is used to acquire a detection image corresponding to the at least one defective micro-element on the substrate. The judgment unit is coupled to the image acquisition unit and the removal unit. Before the removal unit removes the defective micro-element, the image acquisition unit acquires a first detection image, and after the removal unit removes the defective micro-element, it acquires a second detection image. The judgment unit determines whether the defective micro-element has been removed based on the first and second detection images acquired from the image acquisition unit.

[0007] An embodiment of the present invention provides a defective pixel detection and removal method, comprising: Step 1: providing a substrate having at least one defective micro-element, and performing steps 2 to 5 according to the defective pixel location of the micro-element on the substrate in a defective pixel database; Step 2: acquiring a first detection image before removing the defective micro-element using an image acquisition unit; Step 3: removing the defective micro-element according to the defective pixel location of the micro-element on the substrate in the defective pixel database using an removal unit; Step 4: acquiring a second detection image after removing the defective micro-element using an image acquisition unit; and Step 5: comparing the first detection image before removing the defective micro-element with the second detection image after removing the defective micro-element using a judgment unit, and determining whether the defective micro-element has been successfully removed based on the comparison result.

[0008] In the defective pixel detection and removal apparatus of the present invention, both an removal unit and an image acquisition unit are incorporated, and a determination unit confirms whether a defective micro-element has been removed based on the first and second detection images acquired from the image acquisition unit. Therefore, after a defective micro-element is removed, it can be detected and confirmed in the same apparatus to determine whether it has been successfully removed, without needing to move the substrate to another machine for confirmation. Thus, the defective pixel detection and removal apparatus of the present invention can effectively shorten the processing time. In the defective pixel detection and removal method of the present invention, the functions of the removal unit and the image acquisition unit are combined, and a determination unit compares the first detection image before removing the defective micro-element with the second detection image after removing the defective micro-element, and determines whether the defective micro-element has been successfully removed based on the comparison result. Therefore, the defective pixel detection and removal method of the present invention can effectively shorten the processing time. Attached Figure Description

[0009] Figure 1 This is a schematic diagram of the structure of a defect detection and elimination device according to an embodiment of the present invention;

[0010] Figure 2A for Figure 1 A schematic diagram of the first detected image acquired by the image acquisition unit before the exclusion unit excludes the micro-components with bad pixels;

[0011] Figure 2B for Figure 1 A schematic diagram of the second detection image acquired by the image acquisition unit after the exclusion unit performs the exclusion of defective micro-components;

[0012] Figure 3 This is a schematic diagram of the structure of a defect detection and elimination device according to another embodiment of the present invention;

[0013] Figure 4 This is a flowchart of a defect detection and elimination method according to an embodiment of the present invention;

[0014] Figure 5 for Figure 4 The diagram illustrates the automatic optical inspection performed by the detection unit in the defect detection and elimination method of the embodiment. Detailed Implementation

[0015] Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same element references are used in the drawings and description to denote the same or similar parts.

[0016] Figure 1 This is a schematic diagram of the structure of a defect detection and elimination device according to an embodiment of the present invention. Figure 2A for Figure 1 This is a schematic diagram of the first detected image acquired by the image acquisition unit before the exclusion unit excludes the micro-components with bad pixels. Figure 2B for Figure 1 This is a schematic diagram of the second detected image acquired by the image acquisition unit after the exclusion unit performs the exclusion of defective micro-components. Please refer to... Figure 1 , Figure 2A and Figure 2B The defect detection and rejection device 100 of this embodiment includes a rejection unit 110, an image acquisition unit 120, and a judgment unit 130. The rejection unit 110 is used to reject at least one defective micro-element 210 on the substrate 50. In this embodiment, in addition to the defective micro-element 210, normal micro-element 220 (such as...) is also disposed on the substrate 50. Figure 2A (As shown). The defective micro-element 210 and the normal micro-element 220 include microelectronic components, conductive lines, or combinations thereof, wherein the microelectronic components are, for example, micro-light-emitting diodes or other microelectronic components. The exclusion unit 110 is, for example, a laser device that can emit a laser beam 112 to the defective micro-element 210 to detach the defective micro-element 210 from the substrate 50. For example, the defective micro-element 210 and the normal micro-element 220 can be attached to the substrate 50 by an adhesive layer, and the laser beam 112 can irradiate the adhesive layer to de-adhere the adhesive layer, thereby detaching the defective micro-element 210 from the substrate 50. Alternatively, the defective micro-element 210 and the normal micro-element 220 can be soldered to the substrate 50, and the laser beam 112 can irradiate the solder to melt the solder, thereby detaching the defective micro-element 210 from the substrate 50. Alternatively, the defective micro-element 210 and the normal micro-element 220 can be fixed on the substrate 50 by various suitable means, and the laser beam 112 can irradiate the interface between the defective micro-element 210 and the substrate 50 to detach the defective micro-element 210 from the substrate 50.

[0017] Image acquisition unit 120 is used to acquire a detection image corresponding to at least one defective micro-element 210 on substrate 50, such as Figure 2AThe image is a magnified view. The judgment unit 130 is coupled to the image acquisition unit 120 and the exclusion unit 110. Before the exclusion unit 110 excludes the defective micro-element 210, the image acquisition unit 120 acquires a first detection image (e.g., ...). Figure 2A (The enlarged image), and after the exclusion unit 110 performs the exclusion of bad pixel micro-element 210, it performs the acquisition of the second detection image (such as the image of the magnified ...). Figure 2B (as shown in the image), the judgment unit 130 determines whether the defective micro-component 210 has been excluded based on the first and second detection images obtained from the image acquisition unit 120.

[0018] In this embodiment, the image acquisition unit 120 is, for example, a camera. For instance, the image acquisition unit 120 may simultaneously have two image acquisition subunits, namely a line-scan camera and an area-scan camera (which may include, for example, a charge-coupled device or a complementary metal-oxide-semiconductor image sensor). Of course, a line-scan camera, an area-scan camera, other types of cameras, or a combination of the above types of cameras can also be used alone. Any functional module that can acquire images for subsequent judgment can be applied to the image acquisition unit.

[0019] In one embodiment, the determination unit 130 may be, for example, a central processing unit (CPU), a graphics processing unit (GPU), a microprocessor, a digital signal processor (DSP), a programmable controller, a programmable logic device (PLD), or other similar devices or combinations thereof, and the present invention is not limited thereto. Furthermore, in one embodiment, the functions of the determination unit 130 may be implemented as multiple program codes. These program codes are stored in memory and executed by the determination unit 130. Alternatively, in one embodiment, the functions of the determination unit 130 may be implemented as one or more circuits. The present invention does not limit the implementation of the functions of the determination unit 130 in software or hardware.

[0020] In this embodiment, the judgment unit 130 is used to determine whether the defective micro-element 210 has been excluded if the variation between the first and second detection images exceeds a threshold. For example, Figure 2A The enlarged image and Figure 2BThe image shows a large difference in the middle area, causing the variation to exceed the critical value. Therefore, the judgment unit 130 can determine that the defective micro-component 210 has been eliminated here. If the variation does not exceed the critical value, it means that the defective micro-component 210 has not been successfully eliminated, and the judgment unit 130 can determine that the defective micro-component 210 has not been successfully eliminated here.

[0021] In the defective pixel detection and elimination device 100 of this embodiment, both an elimination unit 110 and an image acquisition unit 120 are included, and the determination unit 130 determines whether the defective micro-element 210 has been eliminated based on the first and second detection images acquired from the image acquisition unit 120. Therefore, after the defective micro-element 210 is eliminated, it can be detected and confirmed in the same device whether it has been successfully eliminated, without having to move the substrate 50 to another machine for confirmation. Thus, the defective pixel detection and elimination device 100 of this embodiment can effectively shorten the working time.

[0022] Alternatively, in one embodiment, the storage database 140 may store void detection images, that is, images of substrate 50 where no micro-components are disposed, for example... Figure 2B The image is of the central region. The judgment unit 130 compares the second detection image with the empty spot detection image to determine whether the bad pixel micro-element 210 has been excluded. That is, the closer the second detection image is to or the same as the empty spot detection image, the more likely the judgment unit 130 is to determine that the bad pixel micro-element 210 has been successfully excluded.

[0023] The number of defective micro-elements contained in the substrate 50 is not limited to one; it can be multiple. Figure 2A The following description uses a defective micro-element 210 (which may be referred to as the first defective micro-element) and a defective micro-element 210a (which may be referred to as the second defective micro-element) as examples. In this embodiment, after the exclusion unit 110 excludes the defective micro-element 210, the determination unit 130 confirms whether the defective micro-element 210 has been excluded. If the determination unit 130 determines that a defective micro-element 210 still exists, the determination unit 130, in response to the determination that a defective micro-element 210 still exists, instructs the exclusion unit 110 to perform the exclusion of the defective micro-element 210 again. Alternatively, in another embodiment, the determination unit 130, in response to the determination that a defective micro-element 210 still exists, records the location of the defective micro-element 210 in the storage database 140, and instructs the exclusion unit 110 to exclude the defective micro-element 210a (e.g., the first defective micro-element). Figure 2B(As shown). In other words, the location of all defective micro-components on the substrate 50 can be detected by a preliminary automatic optical inspection (AOI) system before the defective micro-components are excluded, and stored in the storage database 140. After excluding defective micro-components 210, if the judgment unit 130 determines that there are still defective micro-components 210, the judgment unit 130 can first mark the defective micro-component 210 at this location in the storage database 140 and then exclude the defective micro-component 210 at this location. However, after excluding other defective micro-components in the storage database 140, the defective micro-component 210 at this location will be excluded.

[0024] In this embodiment, the exclusion unit 110 and the image acquisition unit 120 are respectively disposed on opposite sides of the substrate 50. However, in another embodiment, as... Figure 3 As shown, the exclusion unit 110 and the image acquisition unit 120 are disposed on the same side of the substrate 50. Specifically, in Figure 3 In one embodiment, the defective pixel detection and rejection device 100b may further include a partially penetrating partial reflector 150 (e.g., a half-penetrating half-reflector), which can reflect a portion (e.g., half) of the laser beam 112 from the rejection unit 110 to the defective micro-element 210 to reject the defective micro-element 210. Furthermore, the image acquisition unit 120 can capture images of the defective micro-element 210 before and after rejection via the partially penetrating partial reflector 150. Specifically, a portion (e.g., half) of the light from the positions of the defective micro-element 210 before and after rejection will penetrate the partially penetrating partial reflector 150 and be transmitted to the image acquisition unit 120, where it will be sensed. In other embodiments, the positions of the exclusion unit 110 and the image acquisition unit 120 can also be interchanged. That is, a portion of the laser beam 112 is transmitted to the bad pixel micro-element 210 through the partially penetrating partially reflecting mirror 150, and a portion of the light from the positions of the bad pixel micro-element 210 before and after exclusion is reflected to the image acquisition unit 120 by the partially penetrating partially reflecting mirror 150.

[0025] exist Figure 1 In one embodiment, the exclusion unit 110 can move relative to the substrate 50 to align the laser beam 112 with the position to be excluded, and the image acquisition unit 120 can move relative to the substrate 50 to align with the position to be captured. In practice, the substrate 50 can be fixed, while the exclusion unit 110 and image acquisition unit 120 can be moved. However, in another embodiment, the substrate 50 can be moved using a stage, while the exclusion unit 110 and image acquisition unit 120 remain fixed. Figure 3In one embodiment, the substrate 50 is disposed on the stage 160, which is movable relative to the movable exclusion unit 110 and the image acquisition unit 120, so that the laser beam 112 is aligned with the position to be excluded and the image acquisition unit 120 is aligned with the position to be captured.

[0026] Figure 4 This is a flowchart of a defect detection and elimination method according to an embodiment of the present invention. Please refer to... Figure 1 , Figure 2A , Figure 2B and Figure 4 The defect detection and elimination method of this embodiment can be executed using the defect detection and elimination device 100 or 100b of the above embodiments, and the following will be implemented using... Figure 1 The defect detection and elimination device 100 of this embodiment will be used as an example for explanation. The defect detection and elimination method of this embodiment includes the following steps S110, S120, S130, S140 and S150. First, step S110 is performed, which involves providing a substrate 50 having at least one defective micro-element 210, and performing the following steps S120 to S150 based on the defective positions of the micro-elements of the substrate 50 in the defective database (i.e., storage database 140) (which can be obtained in advance by detecting the defective positions of the entire substrate 50 by an automatic optical inspection system).

[0027] Next, step 120 is executed, which involves acquiring an image (i.e., the first detection image described above) before the removal of the defective micro-element 210 using the image acquisition unit 120. Then, step S130 is executed, which involves removing the defective micro-element 210 based on the defect location of the micro-element on the substrate 50 in the defect database (i.e., the storage database) using the removal unit 110. Next, step S140 is executed, which involves acquiring an image after the removal of the defective micro-element 210 using the image acquisition unit 120. Then, step S150 is executed, which involves comparing the image before the removal of the defective micro-element 210 (i.e., the first detection image) with the image after the removal of the defective micro-element 210 (i.e., the second detection image) using the judgment unit 130, and determining whether the removal of the defective micro-element 210 was successful based on the comparison result. In this embodiment, the image before the removal of the defective micro-element 210 (i.e., the first detection image) and the image after the removal of the defective micro-element 210 (i.e., the second detection image) are captured by the same image acquisition unit 120, resulting in a more accurate comparison image.

[0028] In this embodiment, the defect detection and elimination method further includes, before step S110, using the detection unit 175 to perform automatic optical inspection on the micro-components (including normal micro-components 220 and defective micro-components 210) on which the substrate 50 is disposed, such as... Figure 5As shown, the location of at least one defective micro-element 210 on the substrate 50 is obtained and stored in a defective pixel database (i.e., storage database 140). The defective pixel locations in the database are based on the comparison results of images obtained from automatic optical inspection. Specifically, the detection unit 175 may include an image acquisition unit 170 and a judgment unit 180. The image acquisition unit 170 is, for example, a camera, which has a large field of view relative to the image acquisition unit 120 and can capture a large area on the substrate 50, such as capturing the entire area of ​​the substrate 50 at once, but the present invention is not limited thereto. Next, the image acquisition unit 170 transmits the captured image to the judgment unit 180, and the judgment unit 180 can determine the location of the defective pixel based on the image. This defective pixel database can be used by steps S110 to S150. Furthermore, the judgment unit 180 can determine whether the micro-element detected by the image acquisition unit 170 is a normal micro-element or a defective micro-element based on the standard sample (golden sample) stored in the storage database 140. The standard sample may include images of normal micro-elements, images of various defective micro-elements, images of empty spots without micro-elements, or combinations thereof.

[0029] In one embodiment, the determination unit 180 may be, for example, a central processing unit (CPU), a microprocessor, a digital signal processor (DSP), a programmable controller, a programmable logic device (PLD), or other similar devices or combinations thereof, and the present invention is not limited thereto. Furthermore, in one embodiment, the functions of the determination unit 180 may be implemented as multiple program codes. These program codes are stored in memory and executed by the determination unit 180. Alternatively, in one embodiment, the functions of the determination unit 180 may be implemented as one or more circuits. The present invention does not limit the implementation of the functions of the determination unit 180 in software or hardware.

[0030] In the defective pixel detection and removal method of this embodiment, the functions of the removal unit 110 and the image acquisition unit 120 are used. The judgment unit 130 compares the image before and after removing the defective micro-element 210, and determines whether the defective micro-element 210 has been successfully removed based on the comparison result. Therefore, the defective pixel detection and removal method of this embodiment can effectively shorten the working time.

[0031] In this embodiment, step S150 includes comparing the image before the defective micro-element 210 is removed (i.e., the first detection image) with the image after the defective micro-element 210 is removed (i.e., the second detection image). If the variation of the comparison result exceeds a threshold value, the judgment unit 130 determines that the defective micro-element 210 has been successfully removed. Conversely, if the variation of the comparison result does not exceed the threshold value, it is determined that the defective micro-element 210 has not been successfully removed.

[0032] In another embodiment, the defective pixel detection and removal method further includes, after step S150, comparing the image after removing the defective micro-element 210 (i.e., the second detection image) with the empty pixel image (i.e., the aforementioned empty pixel detection image) to determine whether the defective micro-element 210 has indeed been successfully removed. The comparison with the empty pixel image has been described in detail above in the section on empty pixel detection images and will not be repeated here. In one embodiment, the defective pixel detection and removal method further includes storing the image obtained in step S140 after removing the defective micro-element 210 (i.e., the second detection image) as an empty pixel image in an empty pixel database, as determined by the judgment unit 130 to have successfully removed the defective micro-element 210, in the empty pixel database for reference in subsequent transfer or repair of micro-elements. The empty pixel database and the storage database 140 can be implemented using a memory, such as non-volatile memory, hard disk drive (HDD), solid state drive (SSD), optical storage media, flash memory, random access memory, disk, optical disc, or other storage-functional components.

[0033] In this embodiment, the defect detection and elimination method further includes, after step S150, the determination unit 130 determines that the defective micro-element 210 has been successfully eliminated, and then moves the elimination unit 110 to the next defective micro-element (such as...). Figure 2A The position of the defective micro-component 210a) is determined, and steps S120 to S150 are performed. After removing the defective micro-component 210a, the removal unit 110 is moved to the position of the next defective micro-component, and steps S120 to S150 are performed. This process of moving to the position of the next defective micro-component and performing steps S120 to S150 is repeated until all defective micro-components in the defect database have been removed.

[0034] In this embodiment, the defect detection and elimination method further includes: in response to the judgment unit 130 in step 5 determining that the defective micro-element 210 has not been successfully eliminated, the location of the defective micro-element 210 that has not been successfully eliminated is stored in the storage database 140 for elimination again later.

[0035] In this embodiment, the defect detection and elimination method further includes: after storing the location of the defective micro-component 210 that was not successfully eliminated in the storage database, moving the elimination unit 110 to the location of the next defective micro-component and performing steps S120 to S150 until steps S120 to S150 have been performed on each defective micro-component, and then performing steps S120 to S150 again on the defective micro-component 210 that was not successfully eliminated according to the storage database 140.

[0036] In this embodiment, the defect detection and elimination method further includes: repeatedly performing steps S120 to S150 on the micro-components that have not been successfully eliminated according to the storage database until the judgment unit 130 determines that the micro-components have been successfully eliminated. However, if the number of times steps S120 to S150 are repeated is greater than a preset number, the repeated performance of steps S120 to S150 on the micro-components that have not been successfully eliminated is stopped, and the location of the micro-components that have not been successfully eliminated is marked.

[0037] In the above embodiments, when a defective micro-component is not successfully eliminated the first time, the process jumps to the next defective micro-component and eliminates it. After eliminating all defective micro-components, the process returns to eliminate the defective micro-components that were not successfully eliminated. However, in another embodiment, after the determination unit 130 determines that a defective micro-component has not been successfully eliminated and stores the location of the unsuccessfully eliminated defective micro-component in the storage database 140, steps S120 to S150 are immediately performed again on the unsuccessfully eliminated defective micro-components according to the storage database 140 to eliminate them. If the judgment unit 130 still fails to eliminate the defective micro-component, then the storage database 140 is used to repeat steps S120 to S150 for the defective micro-component that has not been successfully eliminated until the judgment unit 130 determines that the defective micro-component has been successfully eliminated. However, if the number of times steps S120 to S150 are repeated exceeds the preset number, then the repeated steps S120 to S150 for the defective micro-component that has not been successfully eliminated are stopped, the position of the defective micro-component that has not been successfully eliminated is marked, and the elimination unit 110 is moved to the position of the next defective micro-component and steps S120 to S150 are performed.

[0038] In summary, the defective pixel detection and removal device of the present invention integrates both a removal unit and an image acquisition unit, and the determination unit confirms whether the defective micro-element has been removed based on the first and second detection images acquired from the image acquisition unit. Therefore, after a defective micro-element is removed, it can be detected and confirmed in the same device to determine whether it has been successfully removed, without needing to move the substrate to another machine for confirmation. Thus, the defective pixel detection and removal device of the present invention can effectively shorten the working time. In the defective pixel detection and removal method of the present invention, the functions of the removal unit and the image acquisition unit are combined, and the determination unit compares the first detection image before removing the defective micro-element with the second detection image after removing the defective micro-element, and determines whether the defective micro-element has been successfully removed based on the comparison result. Therefore, the defective pixel detection and removal method of the present invention can effectively shorten the working time.

[0039] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A bad pixel detection exclusion apparatus, characterized by, include: The exclusion unit is used to exclude multiple defective micro-components on the substrate; An image acquisition unit is used to acquire detection images corresponding to the plurality of defective micro-elements on the substrate; A judgment unit is coupled to the image acquisition unit and the exclusion unit. The image acquisition unit acquires a first detection image before the exclusion unit excludes the defective micro-element, and acquires a second detection image after the exclusion unit excludes the defective micro-element. The judgment unit determines whether the defective micro-element has been excluded based on the first and second detection images acquired from the image acquisition unit. The substrate includes the plurality of defective micro-elements. After the exclusion unit excludes the defective micro-element, the judgment unit is used to determine whether the defective micro-element has been excluded. The judgment unit is used to determine that the defective micro-element has been excluded if the variation between the first and second detection images exceeds a threshold value. as well as A database is stored to record the locations of the defective micro-components that the elimination unit failed to eliminate according to the judgment unit's determination. Wherein, after the exclusion unit excludes each of the defective micro-components on the substrate, the judgment unit instructs the exclusion unit to exclude again the defective micro-components that were recorded in the storage database as having failed to be excluded.

2. The bad pixel detection rejection apparatus according to claim 1, wherein The judgment unit is used to compare the second detection image with the empty spot detection image to determine whether the bad spot micro-element has been excluded.

3. The bad pixel detection rejection apparatus of claim 1, wherein The exclusion unit is a laser device, and the exclusion unit and the image acquisition unit are disposed on the same side of the substrate.

4. A method for detecting and eliminating defective pixels, characterized in that, include: Step 1: Provide a substrate with at least one defective micro-element, and perform steps 2 to 5 according to the defective locations of the micro-element on the substrate in the defective database; Step 2: Use the image acquisition unit to acquire the first detection image before excluding the micro-components with defective pixels; Step 3: Using the exclusion unit, exclude the defective micro-components based on the defective location of the micro-components in the substrate in the defective database; Step 4: Use the image acquisition unit to acquire a second detection image after excluding the micro-components with bad pixels; Step 5: Use the judgment unit to compare the first detection image before the defective micro-element is excluded with the second detection image after the defective micro-element is excluded, and determine whether the defective micro-element has been successfully excluded based on the comparison result. The judgment unit is used to react when the variation of the first and second detection images exceeds the threshold value, and to determine that the defective micro-element has been excluded. Step 6: Based on the comparison result determined by the judgment unit in step 5, the location of the defective micro-component that was not successfully eliminated is stored in the storage database for further elimination. Step 7: Move the exclusion unit to the location of the next defective micro-component and perform steps 2 to 6 until steps 2 to 6 have been performed for each defective micro-component; and Step 8: Then, according to the storage database, perform steps 2 to 5 again on the micro-components that were not successfully eliminated, until the micro-components with bad pixels are successfully eliminated or the number of times steps 2 to 5 are repeated is greater than the preset number.

5. The defective pixel detection and elimination method according to claim 4, characterized in that, Also includes: Before step 1, an automatic optical inspection is performed on the micro-components on which the substrate is disposed using a detection unit to obtain the position of the at least one defective micro-component on the substrate and store it in the defective pixel database. The defective pixel positions in the defective pixel database are based on the comparison results of the images from the automatic optical inspection.

6. The defective pixel detection and elimination method according to claim 4, characterized in that, The first detection image before the defective micro-element is excluded and the second detection image after the defective micro-element is excluded are both captured by the same image acquisition unit.

7. The defective pixel detection and elimination method according to claim 4, characterized in that, Also includes: After step 5, the second detection image after excluding the defective micro-element is compared with the empty image to determine whether the defective micro-element has indeed been successfully excluded.

8. The defective pixel detection and elimination method according to claim 4, characterized in that, Also includes: After step 5, in response to the judgment unit's successful determination of the defective micro-component, the removal unit is moved to the position of the next defective micro-component, and steps 2 to 5 are performed.

9. The defective pixel detection and elimination method according to claim 4, characterized in that, Also includes: If the number of times steps 2 to 5 are repeated exceeds the preset number, then the repetition of steps 2 to 5 for the micro-components that have not been successfully eliminated will be stopped, and the location of the micro-components that have not been successfully eliminated will be marked.

10. The defective pixel detection and elimination method according to claim 4, characterized in that, Also includes: The location of the defective micro-component determined by the judgment unit to be excluded is stored as a void image in the void image database in the second detection image obtained in step 4 after the defective micro-component has been excluded, for reference in subsequent transfer or repair of micro-components.

Images